KR101021544B1 - Substrate processing apparatus and substrate processing method thereof - Google Patents

Abstract

The present invention relates to a substrate processing apparatus and a processing method thereof for facilitating recovery of chemical liquids. In the substrate processing apparatus, the first to third pauls are arranged up and down. The substrate treating apparatus processes the last unit process so that the chemical liquid is recovered from the first Paul in order to recover the chemical liquid to be reused among the chemical liquids used in the process during the process treatment having a plurality of unit processes. For example, the last unit process is a rinse process using pure water. The rinse process is primarily rinsed in the position corresponding to the second Paul and rinsed second in the position corresponding to the first Paul. According to the present invention, the pure water used in the secondary rinse can be recovered in its entirety.

Substrate Processing Unit, Sheetfed, Multi-Stage Paul, Pure Water, Recovery, Cleaning, Rinse

Description

Substrate processing apparatus and its substrate processing method {APPARATUS AND METHOD FOR TREATING SUBSTRATE}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus having a multi-stage Paul for facilitating recovery of a chemical liquid, and a processing method thereof.

In general, semiconductor manufacturing apparatus are manufactured by repetitive performance of unit processes such as deposition, photolithography, etching, chemical mechanical polishing, cleaning, drying, and the like. Among these unit processes, a cleaning and drying process is a process of removing foreign matter or unnecessary film remaining on the surface of the semiconductor substrate during each unit process.

The apparatus for performing the cleaning and drying process is divided into a batch type cleaning apparatus for simultaneously cleaning a plurality of substrates and a sheet type cleaning apparatus for cleaning substrates in sheet units. Among them, the single wafer cleaning apparatus includes a chuck for supporting the sheet of substrate and at least one nozzle for supplying processing fluids to the substrate processing surface. When the process of the single wafer cleaning apparatus is started, the substrate is seated on the chuck and the nozzle is sequentially sprayed with the cleaning liquid, the rinse liquid and the drying gas to clean and dry the substrate.

Referring to FIG. 1, the substrate processing apparatus 2 is, for example, a single wafer type cleaning apparatus that processes a substrate cleaning and drying process, and is provided with an open cylindrical upper portion to form a space for processing therein. The chamber 10 and the spin head 4 which is provided inside the process chamber 10 and seats the substrate, moves up and down and rotates corresponding to the chemical liquid supplied for the cleaning process, and the process chamber 10 includes a plurality of process chambers. A nozzle unit 20 connected to a chemical liquid supply unit 30 supplying chemical liquids and spraying the chemical liquid to the surface of the substrate, and a plurality of Paul (12 ~ 16) rotatable in the process chamber 10 to recover a plurality of chemical liquids ) And a discharge pipe (32 to 36) for discharging the chemical liquids recovered from the Paul (12 to 16).

In addition, the substrate processing apparatus 2 is connected to the spin head 4 and the nozzle unit 20, respectively, the driving unit (6, 26) for moving up and down and / or rotation, respectively, and the control unit for controlling the driving unit (6, 26) It includes (8). The substrate processing apparatus 2 also includes a driver (not shown) for rotating the pauls 12 to 16. In addition, the substrate processing apparatus 2 is provided with an inversion unit (not shown) which inverts the substrate W and provides the spin head 2 to the upper portion of the process chamber 10.

The spin head 4 supports the substrate W during the process and moves and rotates up and down inside the process chamber 10. When the substrate W is seated, the spin head 4 is vertically moved to a process position (at least three positions, that is, P1, P2, and P3) according to the chemical liquid currently supplied by the driver 6, and rotates during the process. do. The spin head also loads and unloads the substrate W at the standby position P4.

The nozzle unit 20 is provided with, for example, a swing nozzle, and receives a plurality of different chemical liquids, for example, an etchant, a cleaning liquid, and the like from the plurality of chemical liquid supply units 30 to inject the chemical liquid onto the substrate W. The nozzles 22 are fastened to the nozzles 22 by the at least one nozzle support 24 and the driving part 26 for vertically moving and rotating the nozzles 22 according to the process position and the standby position. .

The chemical liquid supply unit 30 supplies various chemical liquids, for example, etching liquid, cleaning liquid, pure water (DIW), and dry gas, to the nozzle unit 20 through each supply line.

The driving units 6 and 26 are driven by the control unit 102 to drive the spin head 4 and the nozzle unit 20. That is, the first driver 6 drives the position of the spin head 4 up and down in response to the chemical liquid supplied from the nozzle unit 160 during the process, and rotates the spin head 4. The second driving unit (not shown) includes, for example, a plurality of motors (not shown) corresponding to the Pauls 12 to 16, and uses the respective motors to drive the respective Pauls 110. Rotate This individually rotates the pauls 12 to 16 recovering the chemical liquid at the process positions P1 to P3 of the spin head 4 in response to the chemical liquids supplied from the nozzle unit 20.

For example, the pauls 12 to 16 are provided with a plurality of pauls 12 to 16 in the process chamber 10, respectively, to recover the chemical liquids used in the process. The first to third pauls 12 to 16 are each open at the top and stacked up and down on the side of the spin head 4. Each of the first to third pauls 12 to 16 is provided with a space for accommodating the first to third chemical liquids used in the process. The first to third pauls 12 to 16 respectively collect the chemical liquids collected in the space through the discharge pipes 32 to 36.

Specifically, Paul 12 to 16 collect the chemical liquids supplied from the nozzle unit 20 so that the chemical liquids can be reused. Paul 12 to 16 are disposed inside the spin head 4, and collects different chemical liquids corresponding to the plurality of process positions (P1 ~ P3) of the spin head (4).

And the control part 8 controls the general operation | movement which processes the washing | cleaning and drying process of the substrate processing apparatus 2. That is, the controller 8 controls the first driver 6 to control the position and rotation speed of the spin head 4 during the process. In addition, the controller 8 controls the second driver (not shown) to operate the respective Pauls 12 to 16. Therefore, during the process, the controller 8 controls to collect the chemical liquid by rotating the paul corresponding to the process positions P1 to P3 of the spin head 4 simultaneously or separately from the spin head 4 in the same direction.

Referring to FIG. 2, the substrate processing apparatus 2 moves the spin head 4 to the standby position P4 in step S40 to load the substrate W. In FIG. In step S42, the spin head 4 is moved up and down to the process positions P1 to P3 corresponding to the chemical liquid supplied from the nozzle unit 20. FIG. For example, during the process, the spin head 4 sequentially moves to the first to third process positions P1 to P3 corresponding to each of the first to third chemical liquids supplied from the plurality of chemical liquid supply units 30. do. When the process is completed in the first to the third process position in step S44, the spin head 4 is moved to the first process position P1 again to process the cleaning process, that is, the rinsing and drying process. Next, in step S46, the spin head 4 is moved to the standby position P4 to unload the substrate.

As described above, the substrate processing apparatus 2 moves to the standby position P4 to load the substrate, and receives respective chemical liquids from the nozzle unit 20 at the first to third process positions P1 to P3. The chemical liquid process is processed, and when the chemical liquid process is completed, the chemical liquid process is moved to the first process position P1 again, and pure water is supplied to the substrate to process the rinse process. When the cleaning process is completed, the substrate is moved to the standby position P4 again to unload the substrate.

Therefore, the substrate processing apparatus 2 causes the chemical liquid used at the first to third process positions P1 to P3 to contaminate the pure water DIW used at the first process position P1, so that the recovery rate of the pure water DIW is increased. Degrades.

In addition, in order to improve the recovery rate of pure water, when the substrate processing apparatus 2 performs the rinsing process at a process position P2 or P3 other than the first process position P1, the process position P2 or P3 In order to supply the chemical liquids to the substrate W by vertically moving, linearly moving and rotating the nozzle unit 20, the inverting unit (not shown) and the Paul disposed on the process chamber 10 are disposed. Since the space between the 12 to 16 is narrow, the phenomenon that the nozzle portion 20 is caught or hit the upper end of the pole 12 is located outside. Therefore, the conventional substrate processing apparatus 2 has a problem that interference of the nozzle unit 20 is generated to improve the recovery rate of pure water.

It is an object of the present invention to provide a substrate processing apparatus and a processing method thereof that facilitate recovery of pure water during a washing step.

Another object of the present invention is to provide a substrate processing apparatus and a method including a multi-stage Paul for recovering the total amount of pure water used in the rinsing process.

To achieve the above objects, the substrate processing apparatus having the multi-stage Paul of the present invention is characterized by rinsing the substrate in two stages using pure water. Thus, the substrate processing apparatus can improve the recovery rate of the pure water used at the process.

A substrate processing apparatus of the present invention includes: a processing tank having first to third pauls arranged up and down; During the process, the spinhead supporting the substrate and movable to the first to third processing positions corresponding to the first to third pauls; At least one movable nozzle for supplying chemical liquids for processing the process to a substrate supported by the spin head at any one of the first to third processing positions; The chemical liquid to be reused among the chemical liquids used in the first to third process positions may be supplied from the first process position to control the process to process the process.

In one embodiment, the substrate processing apparatus; The apparatus may further include a driving unit configured to drive the nozzle to the substrate supported by the spin head to vertically move, linearly move, and rotate. Here, the driving unit drives in multiple stages when the nozzle moves up and down.

In another embodiment, the driving unit; And at least one cylinder connected to the nozzle to up-down the nozzle two steps.

In another embodiment, the control unit; After cleaning the substrate at the second process position or the third process position, the control is performed to process the rinse process at the first process position.

In another embodiment, the control unit; After cleaning the substrate using another chemical liquid at the second process position or the third process position, the first rinse process is performed at the second process position, and then the second rinse process is performed at the first process position. Process. Wherein the chemical liquid to be reused is the chemical liquid used in the secondary rinse process.

In another embodiment, the chemical to be reused is pure water.

According to another feature of the present invention, there is provided a substrate processing method of a substrate processing apparatus having first to third pauls arranged up and down. According to this method, the recovery rate of the chemical liquid to be reused among the chemical liquids treated in the washing process can be improved.

This method loads a substrate. The substrate is moved to a second process position corresponding to the second Paul or a third process position corresponding to the third Paul, and the chemical liquid is supplied to the substrate to process the chemical liquid process. The substrate subjected to the chemical liquid process is supplied with pure water to the substrate at the second process position to process a first rinse process. The substrate subjected to the first rinse process is moved to a first process position corresponding to the first Paul to supply pure water to the substrate to process a second rinse process. The substrate is then unloaded.

In one embodiment, the substrate processing method; The entire amount can be recovered to reuse the pure water used in the second rinse process.

In another embodiment, treating the chemical process; The substrate is moved to the second process position to supply a first chemical liquid to the substrate to process the first chemical liquid process. Subsequently, the substrate having been subjected to the first chemical process is moved to the third process position to supply a second chemical solution to the substrate to process the second chemical process.

In yet another embodiment, the supply of pure water; Pure water is supplied to at least one nozzle which is movable to the substrate of the first to third process positions.

As described above, the substrate processing apparatus of the present invention can recover the chemical liquid by treating the last unit process of the process in the first Paul when the chemical liquid to be reused is processed, thereby preventing the recovered chemical liquid from being contaminated by other chemical liquids. have.

In addition, the substrate processing apparatus of the present invention drives the movable nozzle up and down two stages in order to recover the chemical liquid to be reused, so that the nozzle is closed by a narrow space between the inverting unit and the pauls disposed on the upper chamber of the substrate processing apparatus. You can prevent Paul from getting caught or bumping into you.

Therefore, the substrate processing apparatus of this invention can improve the recovery | recovery amount of the pure water used at a rinse process.

The embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be interpreted as being limited by the embodiments described below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and the like of the components in the drawings are exaggerated in order to emphasize a clearer explanation.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to FIGS. 3 to 6.

3 and 4 are diagrams showing the configuration of a substrate processing apparatus according to the present invention.

Referring to FIGS. 3 and 4, the substrate treating apparatus is a sheet type cleaning apparatus that removes foreign matter and film remaining on the substrate surface using various chemical liquids, and includes a chamber 102, a treatment tank 110, and a substrate supporting member ( 120) and a plurality of chemical liquid supply members (130, 140). In addition, the substrate processing apparatus 100 includes a controller 104 that controls overall operations. The controller 104 controls the substrate W to be rinsed secondary to improve the recovery rate of pure water used in the rinsing process.

The chamber 102 provides a sealed inner space, and the treatment tank 110 is installed therein.

The treatment tank 110 has a cylindrical shape with an open upper portion, and provides a process space for treating the substrate W. FIG. The opened upper surface of the processing tank 110 serves as a carrying-out and carrying-in passage of the substrate W. As shown in FIG. The substrate support member 120 is positioned in the process space. The substrate support member 120 supports the substrate W during the process and rotates the substrate.

The treatment tank 110 provides an upper space in which the spin head 122 is located, and a lower space in which the exhaust member 150 exhausting the inside of the treatment tank is provided at a lower end of the spin head 122. In the upper space of the processing tank 110, an annular multi-stage Paul 110 for introducing and sucking chemicals and gases scattered on a rotating substrate is disposed. For example, the multi-stage Paul 110 is arranged in a multi-stage by stacking the first to third Paul (112 to 116).

The first to third pauls 112 to 116 recover the processing liquid supplied to the substrate W when the substrate W is processed. That is, the substrate processing apparatus 100 processes the substrate W using the processing liquid while rotating the substrate W by the substrate support member 120. Accordingly, the processing liquid supplied to the substrate W is scattered, and the processing liquid scattered from the substrate W is recovered through the first to third pauls 112 to 116.

Specifically, the first to third pauls 112 to 116 each have a bottom surface having an annular ring shape and a side wall extending from the bottom surface and having a cylindrical shape. The second Paul 114 surrounds the third Paul 116 and is located away from the third Paul 116. The first Paul 112 surrounds the second Paul 114 and is located away from the second Paul 114.

The first to third pauls 112 to 116 provide the first to third recovery spaces RS1, RS2, and RS3 into which the air flow containing the treatment liquid and the fume scattered from the substrate W flows. . The 1st collection space RS1 is defined by the 3rd Paul 116, and collect | recovers the 1st process liquid which processes the board | substrate W primarily. The second recovery space RS2 is defined by the separation space between the second paul 114 and the third paul 116, and recovers the second processing liquid for secondarily treating the substrate W. As shown in FIG. The third recovery space RS3 is defined by the separation space between the first paul 112 and the second paul 114, and recovers a third treatment liquid for tertiarily treating the substrate W. FIG.

Therefore, the treatment tank 110 collects the treatment liquid scattered from the substrate W into the first to third recovery spaces RS1 to RS3 along the upper surfaces of the first to third pauls 112 to 116. In addition, the first to third processing liquids introduced into the first to third recovery spaces RS1 to RS3 are discharged to the outside through the first to third recovery lines 142 to 146, respectively.

In addition, the treatment tank 110 is coupled to the lifting unit 160 for changing the vertical position of the treatment tank 110. The lifting unit 160 linearly moves the processing tank 110 in the vertical direction. As the treatment tank 110 is moved up and down, the relative height of the treatment tank 110 with respect to the spin head 122 is changed.

When the substrate W is loaded onto the spin head 122 or unloaded from the spin head 122, the spin head 122 descends so that the spin head 122 protrudes above the processing tank 1100. In addition, when the process is in progress, the height of the treatment tank 110 is adjusted to allow the treatment liquid to flow into the preset paul 112, 114, or 116 according to the type of treatment liquid supplied to the substrate W. Accordingly, the relative vertical position between the processing tank 110 and the substrate W is changed. Therefore, the treatment tank 110 may vary the treatment liquid recovered for each of the recovery spaces RS1, RS2, and RS3. The substrate processing apparatus 100 changes the relative vertical position between the processing tank 110 and the substrate supporting member 120 by vertically moving the processing tank 110. However, the substrate processing apparatus 100 may change the relative vertical position between the processing tank 110 and the substrate supporting member 120 by vertically moving the substrate supporting member 120.

The substrate support member 120 is installed inside the treatment tank 110. The substrate support member 120 includes a spin head 122 on which a substrate W is seated on a circular upper surface, and a support shaft 124 supporting the spin head 122 at a lower portion of the spin head 122. The driving unit 126 is connected to the lower end of the support shaft 124 to rotate and move the support shaft 124 up and down. The spin head 122 has a plurality of support pins 108 for supporting the substrate W on the upper surface and a plurality of chucking pins 106 for fixing the substrate W seated on the upper surface. As the support shaft 124 moves up and down by the driving unit 126, the substrate support member 120 moves and rotates the spin head 122 and the substrate W up and down. Therefore, the substrate support member 120 supports the substrate W during the process and is rotated by the driving unit 126 in which the process is performed.

The chemical liquid supply members 130 and 140 are positioned outside the processing tank 110 and are capable of moving up and down and rotatable, and the plurality of first nozzles 130: 132 and 134 and a plurality of second fixedly installed outside the processing tank. Nozzles 140. The first and second nozzles 130 and 140 may fix a processing liquid (chemical liquid, rinse liquid, cleaning liquid, etc.) or processing gas (dry gas) for cleaning or etching the substrate W to the substrate support member 120. It supplies to the board | substrate W. For example, the treatment solution may be hydrofluoric acid (HF), sulfuric acid (H3SO4), nitric acid (HNO3), phosphoric acid (H3PO4), ozone water, and SC-1 solution (ammonium hydroxide (NH ₄ OH), hydrogen peroxide (H ₂ O ₂ )). And it may be at least one selected from the group consisting of water (mixture of H ₂ O). Pure water (DIW: DeIonized Water) may be used as the rinse liquid, and isopropyl alcohol (IPA) gas may be used as the dry gas.

For example, the first nozzle 130 is provided as a swing nozzle, and is vertically moved, linearly moved, and rotated by the driving unit 136. The driving unit 136 may drive the first nozzles 130: 132 and 134 individually or simultaneously. For example, the driving unit 136 is provided with a plurality of cylinders (not shown) side by side corresponding to the first nozzles 130 in one bracket (not shown), each cylinder is a first nozzle ( 132, 134 is moved up and down in multiple stages, or a plurality of cylinders (not shown) are installed up and down so that each cylinder up and down has the structure to move the first nozzle (132, 134) up and down in multiple stages.

The controller 104 is provided with, for example, a computer device, a programmable logic controller (PLC), a controller, and the like. The controller 104 controls the vertical movement of the first nozzles 130 in multiple stages to improve the recovery of the pure water used in the rinsing process. The control unit 104 further processes the rinse step to improve the recovery rate of pure water.

For example, the controller 104 processes the chemical liquid process by moving the substrate W to the second or third process positions P2 and P3, and then rinses with pure water DIW at the first process position P1. Control to process the process. At this time, the control unit controls the driving unit to move up the first nozzles for supplying the pure water to the second stage, move the upper portion of the substrate, and down the second stage again. In this case, since the pure water used in the first process position is not contaminated by other chemical liquids, it is possible to recover the whole amount through the third recovery space RS3.

Subsequently, the processing operation of the substrate processing apparatus of the present invention will be described with reference to FIGS. 5A to 6.

That is, FIGS. 5A to 5E are views showing an operating state of the substrate processing apparatus shown in FIG. 4, and FIG. 6 is a flowchart showing a processing procedure of the substrate processing apparatus according to the present invention. Here, the descriptions of the components of FIGS. 5A to 5E are the same as those of FIGS. 3 and 4, and thus, detailed descriptions thereof will be omitted.

Referring to FIG. 6, in operation S200, the substrate processing apparatus moves the spin head 122 to a standby position (PO in FIG. 5E) to load the substrate W. In FIG. In step S202, the spin head 122 is moved to the second stage, that is, the second process position (P2 in FIG. 5A) to process the first chemical liquid process. At this time, the substrate W receives the first chemical solution from the nozzle unit 130 at the second process position P2 to process the first chemical solution process.

In step S204, the second chemical liquid process is processed at the third stage, that is, at the third process position (P3 in FIG. 5B). At this time, the substrate W receives the second chemical solution from the nozzle unit 130 at the third process position P3 to process the second chemical solution process.

In step S206, the substrate is moved to the second stage, that is, the second process position (P2 of FIG. 5C), and the pure water DIW is supplied to process the substrate W in a first rinse process. At this time, since the pure water DIW collected in the second recovery space RS2 contains the first chemical liquid used in step 202, the pure water cannot be reused.

In step S208, the substrate is moved to the first stage, that is, the first process position (P1 in FIG. 5D) to process the second rinse process. At this time, the first nozzles 130 for supplying pure water are provided in two stages in an upward direction so as to move without interference in the space between the inverting unit (not shown) and the treatment tank 110 provided above the treatment tank 110. (up), and then linearly moved (or rotated) to be positioned above the substrate W, and then down two stages in the downward direction again to the substrate W at the first process position P1 to be pure water (DIW). To supply. Therefore, the pure water DIW having processed the substrate at the first process position P1 is collected into the third recovery space RS3 without being affected by other chemical liquids, so that the entire amount can be recovered.

Subsequently, in step S210, the spin head 122 is moved back to the standby position (PO in FIG. 5E) to unload the substrate.

In the above, the configuration and operation of the substrate processing apparatus according to the present invention are shown in accordance with the detailed description and drawings, which are merely described by way of example, and various changes and modifications may be made without departing from the spirit of the present invention. It is possible.

1 is a diagram showing the configuration of a general substrate processing apparatus;

2 is a flowchart showing a processing procedure of the substrate processing apparatus shown in FIG. 1;

3 is a plan view showing the configuration of a substrate processing apparatus according to the present invention;

4 is a diagram showing the configuration of the substrate processing apparatus shown in FIG. 3;

5A to 5E are views showing an operating state of the substrate processing apparatus shown in FIG. 4; And

6 is a flowchart showing a processing procedure of the substrate processing apparatus according to the present invention.

Explanation of symbols on the main parts of the drawings

100 substrate processing apparatus 102 chamber

104: control unit 106: chucking pin

108: support pin 110: treatment tank

120: substrate support member 130 to 140: nozzle

Claims (10)

In the substrate processing apparatus, A treatment tank disposed vertically and having a first bowl and a second bowl for recovering the chemical liquid or the pure water; A spin head for supporting and rotating the substrate; A lifting unit for adjusting a relative height of the substrate between a first process position corresponding to the first bowl and a second process position corresponding to the second bowl; A nozzle for supplying a chemical liquid to the substrate; The first rinse step of treating the substrate with the chemical liquid at the second processing position, and subsequently sequentially treating the substrate with pure water at the second processing position, and the two treating the substrate with pure water at the first processing position. And a controller for performing a rinse process and controlling the pure water used in the secondary rinse process to be reused. The method of claim 1, The substrate processing apparatus; A driving unit for driving the nozzle to move vertically, linearly, and rotationally to a substrate supported by the spin head; And the driving unit drives in multiple stages when the nozzle moves up and down. The method of claim 2, The driving unit; And at least one cylinder connected to the nozzle for up-downing the nozzle by two stages. delete delete delete A substrate processing method of a substrate processing apparatus having a first bowl and a second bowl disposed up and down; Load the substrate; Processing a chemical liquid process by supplying a chemical liquid to the substrate at a second process position corresponding to the second bowl with respect to the substrate; Supplying pure water to the substrate located at the second process position with respect to the substrate subjected to the chemical liquid process to process a primary rinse process; Treating the secondary rinse process by supplying pure water to the substrate located at a first process position corresponding to the first bowl with respect to the substrate subjected to the primary rinse process; And unloading the substrate. The method of claim 7, wherein The substrate processing method; It is possible to recover the entire amount to reuse the pure water used in the second rinse step. delete delete

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