KR100697956B1 - Medical cooler using thermoelectric semiconductor - Google Patents

Abstract

The present invention relates to a medical cooler using a thermoelectric semiconductor capable of supplying dry cooling air without using a refrigerant to minimize the phenomenon of freezing water or water and having a small temperature loss and miniaturization. A medical chiller using a thermoelectric semiconductor for discharging the gas, comprising: a cooler body (102) for accommodating various components; A power supply unit 12 installed at one side of the cooler body 102 to supply power input from the outside; A DC power supply for converting the power of the power supply unit 12 into a DC power supply; An air compressor (114) for ejecting compressed air by receiving power from the power supply unit; A first chamber 110 receiving a DC power through the DC power supply unit and cooling the air injected through the compressor 114 to a predetermined temperature; A second chamber (120) for receiving the DC power through the DC power supply unit to cool the dry air cooled in the first chamber (110) secondly; A pipe 17a whose one end is in communication with one end of the air compressor 114 and whose other end is in communication with the inside of the first chamber 110; A pipe (17b) whose one end is in communication with the inside of the first chamber (110) and whose other end is in communication with the interior of the second chamber (120); One end thereof communicates with the inside of the second chamber 120 and includes a pipe 17c exposed to the outside of the cooler body 102, thereby cooling the contactlessly differently from the conventional contact skin cooler. There is an effect that can be used by discharging the dried air, and there is an effect that can be manufactured in a compact using a thermoelectric semiconductor.

Description

Medical Cooling Device using a thermoelectric semiconductor}

1 and 2 are conceptual diagrams showing the principle of thermoelectric cooling.

3 is a schematic partial side cross-sectional view of a medical cooler using a thermoelectric semiconductor according to the present invention.

Explanation of symbols on the main parts of the drawings

12: power supply

14: compressor

17a, 17b, 17c: pipe

16,18: DC power supply

110: first chamber

120: second chamber

116a, 116b, 126a, 126b: thermoelectric semiconductor

The present invention relates to a medical cooler using a thermoelectric semiconductor, and more particularly, it is possible to supply dry cooling air without using a refrigerant, thereby minimizing the phenomenon of freezing water or water, and reducing temperature loss and miniaturization. It relates to a medical chiller using a thermoelectric semiconductor.

It is developed using a thermoelectric semiconductor element as a skin cooler.

1 and 2 are conceptual diagrams showing the principle of thermoelectric cooling.

The thermoelectric module is used in the form of a substrate in which n, p type thermoelectric semiconductors are electrically connected in series and thermally in parallel. When DC current flows, a temperature difference occurs on both sides of the module due to the thermoelectric effect, and power generation occurs at the same time. In general, it refers to a solid state heat pump using a cooling effect exhibited by the Peltier phenomenon.

It is a next-generation cooling method that escapes the existing cooling method that operates the compressor to circulate the refrigerant. It can be easily cooled and heated anywhere through pole switching (+,-), and the object can be cooled at -30 ℃ to + 180 ℃ at room temperature. Can be maintained at a constant temperature through cooling and heating.

What is thermoelectric semiconductor? 1822 Germany T.J. The theory found by Seeback is that the phenomenon that electromotive force occurs when temperature difference is applied across the combined device of P type and N type is called Seebeck (or Seeback) effect. The thermoelectric generator has been developed and used as a thermoelectric thermometer. (This current Seebeck effect is applied to thermoelectric power.) This is the opposite of what was discovered by JCAPeltier, France, 12 years later, in 1834. When a DC voltage is applied across the device, it absorbs heat on one side and on the other side of the current. The phenomenon that causes fever is called the Peltier effect. The device using the Peltier effect is called a thermoelectric module (TEM) or a thermoelectric module, and it has been a long time before these results can be put into practical use. In the 1950s, it was commercialized. Later, based on the high reliability of this thermoelectric semiconductor, it was used only for military use of submarines, satellites, etc. It became commercialized in the late 1980s, and already the United States and Japan have been using optical communication modules and cooling systems for local parts of electric, electronic, telecommunication and precision machinery. Many systems have been developed and developed in Korea. After 92 years, many systems have reached world-class level after many trials and errors.

Examine the characteristics of thermoelectric semiconductors. The size of semiconductor is usually 30 ~ 40mm in width or length, and 30 ~ 80Watt is mainly used, but there are many sizes, capacities or less, and the applied voltage also varies from DC1 ~ 24V to DC12V. Although the lifetime of a thermoelectric semiconductor is semipermanent, it can be said that the lifetime is determined by the difference in temperature. The cooling (heat absorption) performance of semiconductors varies from product to product, and the performance formula is complex, but in principle it is proportional to the applied current. However, after reaching the maximum cooling capacity (Qmax), increasing the current no longer yields the capacity.

Examine the electrical phenomena of thermoelectric elements. In 1821, Seebeck, Germany, found an unusual phenomenon in which the direction of the high needle was reversed in the center of the circuit as a result of connecting Cu and Bi or both ends of Bi and Sb and heating one side of the junction. Seebeck interpreted this result as the result of magnetic polarization of the conductor by the temperature difference based on the results of Oersted and Biot and Savart. This phenomenon is caused by the voltage difference, the thermoelectromotive force, caused by the temperature difference. It is caused by the flow of electric current in the thermoelectric power generation principle, called the Seebeck effect. Later, in 1843, Peltier, France, when direct current was flowed into circuits made of two different metals of the same shape, heat absoprtoin at one junction and heat rejected at the other junction. On the contrary, it was found that the endotherms and the exotherms were reversed. Previously, it was thought that only heat is generated by Joule's law when electric current flows through the wire. However, a phenomenon that was not expected at all was found. This phenomenon is a type of heat pumping, which is the principle of electronic cooling, and is called the Peltier effect. In 1851, Thomson, England, was thermodynamically theoretically reversible between the Seebeck effect and the Peltier effect, and if current flowed into a conductor with a temperature gradient, the second law of thermodynamics could absorb or generate heat inside the conductor. This phenomenon is called the Thomson effect. Since then, it has been proved experimentally, and it is called thermoelectric phenomena through Seebeck effect, Peltier effect and Thomson effect.

Referring to FIG. 1, the Peltier effect is the amount of different metals when JEAN CHARLES ATHANASE PELTIER (1785-1845), who became a physicist after WATCH MAKER (France) of France, passed through two different metals. It is to find the phenomenon of temperature difference in the cross section and to summarize it. This is a phenomenon in which heat and cooling occur simultaneously in two different cross sections of a metal when an electrical load is applied to two different cross-section metals. In the end, the Peltier effect is the heat absoprted and heat rejected that occurs when a current flows through a junction between two different materials. If heat is generated when the current flows in one direction, the peltier effect is reversible because the current absorbs heat when the current flows in the opposite direction. When the current flows through the junction, heat generation or absorption by the peltier effect occurs in addition to the Joule thermal effect generated when the current flows through the conductor. When electrons flow from metal to semiconductor, the electrons in the Fermi level of the metal must move into the conduction band of the semiconductor. Therefore, the conduction electrons must increase the average kinetic energy when moving from metal to semiconductor. This change in kinetic energy results from the absorption of heat. That is, thermal energy is used to increase the average kinetic energy of the electrons. In addition, when the current flows in the opposite direction, the kinetic energy of the electron is reduced and heat associated with it is generated. That is, since the average kinetic energy changes when electrons pass through the junction, it can be seen that heat is absorbed or generated depending on the direction of the current. The reversible peltier effect always occurs when a current flows past the ohmic contact. In the ohmic junction formed between the metal and the p-type semiconductor, endothermic and exothermic phenomena occur depending on the direction of the current. When current flows in a circuit including a collection of different materials, heat may be transferred from the low temperature portion to the high temperature portion by the Peltier effect.

FIG. 2 is a diagram illustrating the principle of thermoelectric cooling among thermoelectric semiconductors, in which a current is n-type so that the electrodes of the bipolar branch of the series circuit pn coupled with the p-type element and the n-type element to the metal electrode are respectively. Flows into the p-type, the holes in the p-type device are attracted to the negative, and the electrons in the n-type device are attracted to the positive electrode. At this time, since both the holes and the electrons have heat from the upper p-n junction electrode A and move to the lower bifurcated electrode, the upper junction cools and absorbs heat from the surroundings, and the lower bifurcation ends emit heat. In addition, if the current direction is reversed, both the holes and the electrons transfer heat to the upper n-p junction electrode, so that heat is absorbed at the upper part and endothermic is cooled at the lower part. This phenomenon is called the Peltier effect and is not only the principle of electron cooling, but also serves as a heat-pipe.

A number of electronic cooling devices using the above principle have been developed and a skin cooler using a thermoelectric device has also been filed (Domestic Application No. 2002-63368).

However, the skin cooler using the conventional thermoelectric element as described above has a problem in that it is inconvenient to use because it must be in direct contact with the user's body.

The present invention is to solve the problems in the prior art as described above and to provide a medical cooler using a new type of thermoelectric semiconductor using the principle of the thermoelectric semiconductor device.

According to a preferred embodiment of the present invention for achieving the above object, a medical cooler using a thermoelectric semiconductor for discharging the dried cooling air, a cooler body for accommodating various parts; A power supply unit installed at one side of the cooler body to supply power input from the outside; A DC power supply unit for converting and supplying power of the power supply unit to DC power; An air compressor for blowing compressed air by receiving power from the power supply unit; A first chamber receiving a DC power through the DC power supply and cooling the air injected through the compressor to a predetermined temperature; A second chamber receiving a DC power through the DC power supply and cooling the dry air cooled in the first chamber secondly; A pipe whose one end is in communication with one end of the air compressor and whose other end is in communication with the inside of the first chamber; A pipe whose one end communicates with the interior of the first chamber and whose other end communicates with the interior of the second chamber; One end of the second chamber communicates with the inside of the second chamber is provided with a medical cooler using a thermoelectric semiconductor, characterized in that it comprises a pipe exposed to the outside.

Preferably, the water tank is installed in communication with the pipe vertically downward, the water tank is provided with a slit for free fall while hitting the moisture in the cooling air delivered through the pipe; One end is in communication with the end of the water tank, the other end is exposed to the outside and the valve is provided with; further comprises.

Also preferably, the first chamber may include a heat dissipation plate having a heat conducting semiconductor attached to the DC power supply unit, the heat sink having a heat insulating material, surrounded by a heat insulating material, and configured to form a cooling chamber space therein. It is characterized by cooling the air introduced through to 0 ℃.

Also preferably, the second chamber may include a heat dissipation plate having a heat conducting conductor attached to the DC power supply unit, the heat sink having a heat insulating material, surrounded by a heat insulating material, and configured to form a cooling chamber space therein. Cooling the drying air introduced through the chamber to -10 to -25 ℃ or less.

Hereinafter, a medical cooler using a thermoelectric semiconductor according to the present invention will be described in detail with reference to the accompanying drawings.

3 is a schematic partial side cross-sectional view of a medical cooler using a thermoelectric semiconductor according to the present invention.

3, the medical cooler using a thermoelectric semiconductor for discharging the dried cooling air according to the present invention and a cooler body 102 for accommodating various components; A power supply unit 12 installed at one side of the cooler body 102 to supply power input from the outside; A DC power supply for converting the power of the power supply unit 12 into a DC power supply; An air compressor (114) for ejecting compressed air by receiving power from the power supply unit; A first chamber 110 receiving a DC power through the DC power supply unit and cooling the air injected through the compressor 114 to a predetermined temperature; A second chamber (120) for receiving the DC power through the DC power supply unit to cool the dry air cooled in the first chamber (110) secondly; A pipe 17a whose one end is in communication with one end of the air compressor 114 and whose other end is in communication with the inside of the first chamber 110; A pipe (17b) whose one end is in communication with the inside of the first chamber (110) and whose other end is in communication with the interior of the second chamber (120); One end thereof communicates with the inside of the second chamber 120 and includes a pipe 17c exposed to the outside of the cooler body 102.

The DC power supply unit converts and outputs AC power to DC and may be configured with one or more. In the embodiment of FIG. 3, two DC power supply units are provided. That is, one structure supplies 12V DC and the other supplies 24V DC. However, the present invention is not limited thereto and only one DC 12V or 24V may be used.

The pipes 17a, 17b, 17c are wrapped with a heat insulator to maintain a constant temperature of the air flowing therein.

Reference numeral 16 denotes a water tank installed vertically in communication with the pipe 17b and provided with a slit 16a for free fall while hitting moisture in the cooling air delivered through the pipe 17b.

Further, reference numeral 19 denotes a pipe in which one end thereof communicates with an end of the water tank 16 and the other end thereof is exposed to the outside, and a valve 18 is provided.

The first chamber 110 includes heat sinks 117 and 119 having heat conducting semiconductors 116a and 116b attached thereto, which are operated by receiving DC power from the DC power supply unit, surrounded by a heat insulating material 113, and cooling inside. It is configured to form a chamber space and characterized in that the air introduced through the compressor 14 to cool to 0 ℃.

In addition, the second chamber 120 is configured by the heat sinks 127 and 129 having the heat conductive semiconductors 126a and 126b attached to the direct current power supplied from the DC power supply unit surrounded by the heat insulator 123. It is configured to form a chamber space and characterized by cooling the dry air introduced through the first chamber 110 in the range of -5 to -30 ℃.

Reference numeral 132 denotes a blowing pipe which is coupled to the exposed end of the pipe 17c and blows off the cooled air flowing out of the pipe 17c. The outside is insulated so that the user can easily hold and use it by hand. It is a hose structure made of elastic material to bend.

It looks at the operation of the medical cooler using a thermoelectric semiconductor according to the present invention configured as described above.

First, when the device is turned on according to a user's use request (not shown in the key input device), power from the outside is input through the power supply unit 12, and thus, the compressor 14 is operated so that air is supplied into the first chamber 110. Inflow. At the same time, the power introduced through the power supply unit 12 is converted into direct current through the DC power supply unit and supplied to the thermoelectric semiconductors 116a, 116b, 126a, and 126b, respectively. Thereafter, the thermoelectric semiconductors 116a and 116b operate to heat the heat sinks 117 and 119 in contact with the thermoelectric semiconductors 116a and 116b according to the characteristics of the thermoelectric semiconductors, and the other side of the thermoelectric semiconductors 116a and 116b, that is, the first chamber 110. The surface directed to the cooling chamber 114 in the c) is cooled, whereby the air supplied to the cooling chamber 114 in the first chamber 110 is cooled. The outside of the heated heat sinks 117 and 119 are provided with fans 111 and 112 to cool the heated heat sinks 117 and 119.

In the cooling chamber 114 in the first chamber 110, the temperature is lowered to room temperature and lowered to 0 ° C. The cooled air passes through the pipe 17b, passes through the slit 16a of the water tank 16, and water is removed by free fall into the water tank 16, and only the dried cooling air passes. Although the structure of the slit 16a is not shown in detail, a hole having a structure that allows air to pass therethrough may be formed in a plane shape.

Meanwhile, the cooled dry air passing through the pipe 17b flows into the cooling chamber 124 of the second chamber 120, and the second chamber 120 has the same structure as that of the first chamber 110, but It has a structure of about twice the capacity.

That is, in the second chamber 120, the heat conduction semiconductors 126a and 126b operate so that the heat sinks 127 and 129 in contact with the heat conduction semiconductors 126a and 126b are heated and the other side of the heat conduction semiconductors 126a and 126b according to the characteristics of the heat conduction semiconductors. That is, the surface directed to the cooling chamber 124 in the second chamber 120 is cooled, so that the air supplied to the cooling chamber 124 in the second chamber 120 is cooled. The outside of the heated heat sinks 127 and 129 are provided with fans 121 and 122 to cool the heated heat sinks 127 and 129.

On the other hand, the second chamber 120 cools the air introduced from the first chamber 110 to about -5 to -30 ℃. The cooled air flows out through the hose 132 via the pipe 17c.

Meanwhile, the water collected in the water tank 16 is discharged to the outside by controlling the valve 18.

In the embodiment of the present invention, it is possible to discharge dry air, usually with a flow rate of 80 liters per minute. However, the present invention is not limited thereto, and various modifications may be used.

The use time can be used by removing the cooling dry air for 20 to 30 minutes in one operation.

Meanwhile, although the present invention has been described for skin cooling, a medical cooler for releasing the cooling dry air of the present invention may be used for the function of alleviating the pain that has not been treated by the conventional heat treatment method. .

According to the medical cooler using the thermoelectric semiconductor according to the present invention as described above, there is an effect that can be used by discharging dry air cooled by contactless different from the conventional contact skin cooler.

In addition, there is an effect that can be manufactured in a compact using a thermoelectric semiconductor.

In addition, it is possible to supply dried cooling air without using a refrigerant, thereby minimizing the phenomenon of water freezing or water, and providing a medical cooler using a thermoelectric semiconductor capable of minimizing temperature loss and miniaturization.

Although the present invention has been described based on the above-described preferred embodiment, the present invention is not limited thereto, and those skilled in the art will be able to make various modifications based on the appended claims.

Claims (4)

In the medical cooler using a thermoelectric semiconductor for discharging the dried cooling air, A cooler body 102 for receiving various components; A power supply unit 12 installed at one side of the cooler body 102 to supply power input from the outside; A DC power supply for converting the power of the power supply unit 12 into a DC power supply; An air compressor (114) for ejecting compressed air by receiving power from the power supply unit; A first chamber 110 receiving a DC power through the DC power supply unit and cooling the air injected through the compressor 114 to a predetermined temperature; A second chamber (120) for receiving the DC power through the DC power supply unit to cool the dry air cooled in the first chamber (110) secondly; A pipe 17a whose one end is in communication with one end of the air compressor 114 and whose other end is in communication with the inside of the first chamber 110; A pipe (17b) whose one end is in communication with the inside of the first chamber (110) and whose other end is in communication with the interior of the second chamber (120); Medical cooler using a thermoelectric semiconductor, characterized in that it comprises a pipe (17c) one end of the communication in the interior of the second chamber (120) exposed to the outside of the cooler body (102). The method of claim 1, A water tank 16 communicating vertically with the pipe 17b and having a slit 16a for freely falling while colliding with water in the cooling air delivered through the pipe 17b; One end of the water tank (16) is in communication with the other end and the other end is exposed to the outside pipe (19) provided with a valve; medical cooler using a thermoelectric semiconductor characterized in that it further comprises. According to claim 1, wherein the first chamber 110 is composed of heat sinks 117, 119 with a thermoelectric semiconductor (116a, 116b) is operated by receiving a DC power from the DC power supply unit is surrounded by a heat insulating material (113). And a cooling chamber space formed therein and cooling the air introduced through the compressor (14) to 0 ° C. According to claim 1, wherein the second chamber 120 is composed of heat sinks (127,129) having a heat conducting semiconductor (126a, 126b) attached to the direct current from the DC power supply unit is surrounded by a heat insulating material (123) And a cooling chamber space formed therein and cooling the dry air introduced through the first chamber 110 in a range of -5 to -30 ° C.

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