JPWO2023074258A1 - - Google Patents
Info
- Publication number
- JPWO2023074258A1 JPWO2023074258A1 JP2023556236A JP2023556236A JPWO2023074258A1 JP WO2023074258 A1 JPWO2023074258 A1 JP WO2023074258A1 JP 2023556236 A JP2023556236 A JP 2023556236A JP 2023556236 A JP2023556236 A JP 2023556236A JP WO2023074258 A1 JPWO2023074258 A1 JP WO2023074258A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Epoxy Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021176512 | 2021-10-28 | ||
| PCT/JP2022/036769 WO2023074258A1 (en) | 2021-10-28 | 2022-09-30 | Active ester compound |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023074258A1 true JPWO2023074258A1 (en) | 2023-05-04 |
Family
ID=86157858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023556236A Pending JPWO2023074258A1 (en) | 2021-10-28 | 2022-09-30 |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JPWO2023074258A1 (en) |
| TW (1) | TW202323358A (en) |
| WO (1) | WO2023074258A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2025142671A1 (en) * | 2023-12-27 | 2025-07-03 | 味の素株式会社 | Aromatic oxycarbonyl compound, resin composition, resin sheet, prepreg, cured product, circuit substrate, semiconductor chip package, and semiconductor device |
| JP2025123062A (en) * | 2024-02-09 | 2025-08-22 | 味の素株式会社 | resin composition |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8288591B2 (en) * | 2008-11-20 | 2012-10-16 | Designer Molecules, Inc. | Curing agents for epoxy resins |
| WO2011059942A2 (en) * | 2009-11-13 | 2011-05-19 | Henkel Corporation | Thermal interface material with phenyl ester |
| KR102721281B1 (en) * | 2018-05-24 | 2024-10-24 | 세키스이가가쿠 고교가부시키가이샤 | Active ester compound, curable resin composition, adhesive, adhesive film, circuit board, interlayer insulating material, and multilayer printed wiring board |
| JP6984579B2 (en) * | 2018-11-29 | 2021-12-22 | 信越化学工業株式会社 | Epoxy resin compositions, and adhesive films, prepregs, multilayer printed wiring boards, and semiconductor devices manufactured using the resin compositions. |
| JP7351080B2 (en) * | 2018-12-06 | 2023-09-27 | 住友ベークライト株式会社 | Semiconductor encapsulant and semiconductor device |
| JP7176551B2 (en) * | 2020-07-28 | 2022-11-22 | 味の素株式会社 | Resin composition, adhesive film, prepreg, printed wiring board and semiconductor device |
-
2022
- 2022-09-30 JP JP2023556236A patent/JPWO2023074258A1/ja active Pending
- 2022-09-30 WO PCT/JP2022/036769 patent/WO2023074258A1/en not_active Ceased
- 2022-10-07 TW TW111138145A patent/TW202323358A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202323358A (en) | 2023-06-16 |
| WO2023074258A1 (en) | 2023-05-04 |