JPS6289150U - - Google Patents

Info

Publication number
JPS6289150U
JPS6289150U JP18254585U JP18254585U JPS6289150U JP S6289150 U JPS6289150 U JP S6289150U JP 18254585 U JP18254585 U JP 18254585U JP 18254585 U JP18254585 U JP 18254585U JP S6289150 U JPS6289150 U JP S6289150U
Authority
JP
Japan
Prior art keywords
heat sink
wiring board
printed wiring
extension
surrounds
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18254585U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP18254585U priority Critical patent/JPS6289150U/ja
Publication of JPS6289150U publication Critical patent/JPS6289150U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図はこの考案の一実施例を示す斜視図、第
2図は従来例の斜視図である。 なお図中1はIC、3は放熱板、4はねじ、6
は印刷配線基板、8はフレーム、8aは延長部で
ある。
FIG. 1 is a perspective view showing an embodiment of this invention, and FIG. 2 is a perspective view of a conventional example. In the figure, 1 is the IC, 3 is the heat sink, 4 is the screw, and 6
8 is a printed wiring board, 8 is a frame, and 8a is an extension.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 印刷配線基板の周囲を囲むその補強フレームの
終端部に、上記印刷配線基板上に位置するように
折曲げ延長部を形成し、この延長部とこれに当接
させた印刷配線基板上のICおよびその放熱板と
を、この放熱板の上記延長部への締付け用ねじに
より一体に固定するようにしたことを特徴とする
放熱板付き半導体装置の取付け構造。
A bent extension is formed at the end of the reinforcing frame that surrounds the printed wiring board so as to be located on the printed wiring board, and the IC and the IC on the printed wiring board that are in contact with this extension are formed. A mounting structure for a semiconductor device with a heat sink, characterized in that the heat sink is integrally fixed to the extension portion of the heat sink by a tightening screw.
JP18254585U 1985-11-25 1985-11-25 Pending JPS6289150U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18254585U JPS6289150U (en) 1985-11-25 1985-11-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18254585U JPS6289150U (en) 1985-11-25 1985-11-25

Publications (1)

Publication Number Publication Date
JPS6289150U true JPS6289150U (en) 1987-06-08

Family

ID=31128441

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18254585U Pending JPS6289150U (en) 1985-11-25 1985-11-25

Country Status (1)

Country Link
JP (1) JPS6289150U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7055059B2 (en) 1993-04-23 2006-05-30 Emc Corporation Remote data mirroring

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7055059B2 (en) 1993-04-23 2006-05-30 Emc Corporation Remote data mirroring
US7073090B2 (en) 1993-04-23 2006-07-04 Emc Corporation Remote data mirroring system having a remote link adapter

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