JPS6242437A - Connection structure for micorwave ic - Google Patents

Abstract

PURPOSE:To form a package in a small type and to make it possible to detach the package without damaging microwave ICs by a method wherein the microwave ICs are connected to the tabular member of the package through a coaxial throughhole and are three-dimensionally mounted on both surfaces of the tabular member. CONSTITUTION:Because microwave ICs 3B connected to a mounting metal plate 2 through a coaxial throughhole 20 with little coupling loss formed on the mounting metal plate 2 between them are three-dimensionally installed on the both surfaces of the mounting metal plate 2 of a package, the configuration of the package, in particular its occupation area can be easily miniaturized. Moreover, the coaxial through hole 20 and the strip conductor of each microwave IC can be detached without damaging the microwave ICs because the inner conductor 22 of the coaxial through hole 20 is connected to the conductor of a through hole 10 on a ceramic substrate 21 side by elastic connection or a means of fitting or the like.

Description

[Detailed Description of the Invention] [Summary] The microwave 1c is mounted so as to be sandwiched between both sides of the mounting metal plate, and each strip conductor is connected via a coaxial through hole provided in the mounting metal plate. This promotes the miniaturization of the package that houses the microwave IC and the ease of maintenance of the microwave IC.

[Industrial application field]

The present invention relates to improvements in connection structures for microwave ICs.

Microwave ICs are generally housed and mounted in a metal package to prevent noise.

At this time, as with other devices, there is a strong demand for small packages.

[Conventional technology]

FIG. 4 is a partially cutaway perspective view showing a conventional connection structure of a microwave IC.
The box-shaped package 1 has an open top surface and a bottom surface, and a bottom plate-like mounting metal plate 2 is formed in the middle part.
A cover 1a is detachably attached to the opening surface of the lower surface (for example, by screwing or the like).

3A and 3B are microwave ICs each having a desired circuit formed on the surface of a ceramic substrate 4.

A strip conductor 6 is formed so as to be drawn out at a desired end of the surface of the ceramic substrate 40, and a ground conductor 5 is formed on the back surface.

Such microwave ICs 3^, 3B are mounted on the mounting metal plate 2 so that the strip conductor 6 portion to be connected is close to the metal plate 2.
They are arranged in parallel on the top, and the back surface of each ground conductor 5 side is brought into close contact with the flat surface of the mounting metal plate 2, and is soldered and bonded.

As described above, after mounting the microwave ICs 3A and 3B in the package 1, the two microwave ICs are connected by wire bonding the ribbon wire 7 made of, for example, a gold wire to connect the strip conductors 6. Connected.

[Problem that the invention seeks to solve]

However, the connection structure of the conventional microwave IC described above is
Since the microwave IC is mounted in parallel to the mounting metal plate, there is a problem that the package becomes large.

In addition, when performing maintenance and replacement of the microwave IC, by heating the pan cage and melting the solder bonding the ceramic substrate, the microwave IC can be easily removed from the metal plate on which it is mounted without damaging it. . However, in order to separate both microwave ICs, it is necessary to peel off the wirebond-connected ribbon wire, which causes a problem that the strip conductor 6 is damaged.

[Means for solving problems]

In order to solve the above-mentioned conventional problems, the present invention, as shown in FIG. A plurality of microwave ICs 3A and 3B are mounted on both sides of the mounting metal plate 2 with respective ground conductors 5 in close contact with each other so as to sandwich the mounting metal plate 2, and a coaxial through hole formed through the mounting metal plate 2. Equipped with 20,
The conductors of each i-board side through hole 10 are connected via the inner conductor 22 of the coaxial through hole 20.

[Effect]

According to the means of the present invention, the microwave IC connected via the coaxial through hole 20 with low coupling loss formed in the mounting metal plate is three-dimensionally mounted on both sides of the mounting metal plate 2 of the package. Because of the shape of the package,
In particular, it is easy to reduce the occupied area.

Further, the coaxial through hole 20 and the strip conductor 6 of each microwave IC are connected to the coaxial through hole 20.
Since the inner conductor 22 is connected to the conductor of the substrate side through hole IO by means such as elastic contact or fitting, it is possible to attach and detach the microwave IC without damaging it.

〔Example〕

The present invention will be specifically explained below with reference to illustrated examples. Note that the same reference numerals refer to the same objects throughout the plan.

FIG. 1 is a side sectional view of one embodiment of the present invention, FIG. 2 is a side sectional view showing another embodiment, and FIG. 3 is a side sectional view of still another embodiment.

In Figure 1, microwave I C3A, microwave I
C3B is formed such that a desired circuit is formed on the surface of the ceramic substrate 4, and a strip conductor 6 is drawn out from a desired end of the surface of the ceramic substrate 40.

A substrate-side through hole 10 penetrating the ceramic substrate 4 is provided at a desired location, and the surface side end of the through-hole conductor 1) filled in the substrate-side through hole 10 is
It is connected to the strip conductor 6. In addition, the end surface on the back side is a flat surface that is flush with the back surface of the ceramic substrate 4 or slightly protrudes, and the ground conductor 5 formed on the entire back surface is
The periphery of the substrate-side through hole 10 is removed in a desired large circular shape.

A mounting metal plate 2 formed in the shape of a bottom plate in the middle part of a box-shaped package l made of metal (for example, aluminum, etc.)
A coaxial through hole 20 is provided at a desired location.

The coaxial through-hole 20 is constructed by filling and fixing an insulator 21 into a hole in the mounting metal plate 2, and fixing the axis of the insulator 21 through a rod-shaped inner conductor 22 made of, for example, a copper-based metal. .

The substrate side through hole 10 of the microwave IC 3A configured as described above is connected to the inner conductor 22 of the coaxial through hole 20.
, place the ground conductor 5 in close contact with the top surface of the mounting metal plate 2, and solder the ground conductor surface to the mounting metal plate 2.
A microwave IC 3A is mounted on the upper surface of the mounting metal plate 2.

In addition, the other microwave IC3B also has a through hole 10 on the substrate side of the microwave IC3B, similar to the microwave IC3A.
is aligned with the inner conductor 22 of the coaxial through hole 20, the ground conductor 5 is brought into close contact with the lower surface of the mounting metal plate 2, and the ground conductor surface is soldered to the mounting metal plate 2.
C3B is mounted on the lower surface of the mounting metal plate 2.

As described above, the through-hole conductors 1) of the substrate-side through-holes 10 of the microwave ICs 3A and 3B are fixed so as to sandwich the upper and lower end surfaces of the inner conductors 22 of the coaxial through-holes 20, and are in contact with each other. Connecting. Therefore, microwave IC3A and microwave IC3B are
Connection via the coaxial through hole 20 is easy.

In this way, the microwave ICs 3A and 3B are three-dimensionally mounted on both sides of the mounting metal plate 2 of the package 1, so that the package 1 can be made compact.

In addition, since the inner conductor 22 and the through-hole conductor 1) are in contact with each other, when performing maintenance and replacement of the microwave IC, the mounting metal plate 2 on the side to be replaced is heated and the ceramic substrate 4 is bonded. By melting the solder, a desired microwave RC can be easily removed from the attached metal plate 2 without being damaged.

In FIG. 2, the cylindrical conductor 23 is fixed in the axial hole of the insulator 21, and the sliding inner conductor 25 connected via the compression coil spring 24 is inserted into the upper and lower opening sides of the cylindrical conductor 23. be.

By configuring the coaxial through holes 20 in such a structure, when the microwave ICs 3A and 3B are fixed to both sides of the mounting metal plate 2, the respective through hole conductors 1
), the sliding inner conductor 25 comes into elastic contact with the elasticity of the compression coil spring 24°.

Therefore, the connection structure of such a microwave IC is as follows:
Compared to the one shown in FIG. 1, it has the advantage that contact resistance loss is small.

In Fig. 3, the substrate side on the microwave IC side is
- A through-hole hole 12 with a conductor inner wall is provided in the hole IO.

On the other hand, the upper and lower end surfaces of the inner conductor 22 of the coaxial through-hole 2° on the mounting metal plate 2 side are provided with protrusions 26 that fit closely into the through-hole holes 12 of the respective microwave ICs.

Therefore, the connection structure of such a microwave IC is as follows:
Compared to the one shown in FIG. 1, there is an advantage that alignment of the substrate side through hole 10 and the coaxial through hole 2o is easy.

Note that the present invention is not limited to the illustrated example; for example, the spring means shown in FIG. 2 and the fitting means shown in FIG. 3 may be used together.

Mapco can directly mount microwave ICs without fixing them to metal plates.
Of course, the present invention can be applied to a structure in which a microwave IC is removably attached to a mounting metal plate via a flat carrier (for example, the carrier and the mounting metal plate are fixed with screws, etc.).

〔Effect of the invention〕

As explained above, the present invention connects a microwave IC via a coaxial through hole and mounts it three-dimensionally on both sides of a plate member of a package. It has excellent practical effects, such as being able to attach and detach the IC without damaging it and making maintenance and replacement easy.

[Brief explanation of the drawing]

Fig. 1 is a side sectional view of one embodiment of the present invention, Fig. 2 is a side sectional view showing another embodiment, Fig. 3 is a side sectional view of another embodiment, and Fig. 4 is a microwave IC. FIG. 2 is a partially cutaway perspective view showing a conventional connection structure. In the figure, 1 is the package, 2 is the mounting metal plate, and 3A and 3B are the microwave ICs. 4 is a ceramic substrate, 5 is a ground conductor, 6 is a strip conductor, 7 is a ribbon wire, 10 is a through hole on the board side, 1) is a through hole conductor, 12 is a through hole hole, 20 is a coaxial through hole, 21 is an insulation body, 22 is the inner conductor, 24 is the compression coil spring, 25 is the sliding inner conductor, $3 x Leather 4 Figure

Claims (3)

[Claims] (1) A ground conductor (5) is formed on the back side of the ceramic board (4), and a strip conductor (6) connected to the through hole on the board side is formed on the front side, and the ground conductor (5) is formed on both sides of the mounting metal plate (2). A plurality of microwave ICs (5) are mounted in close contact with each other so as to sandwich the mounting metal plate (2), and a coaxial through hole (20) formed through the mounting metal plate (2), A connection structure for a microwave IC, characterized in that the conductors of each of the substrate side through holes are connected via an inner conductor (22) of the coaxial through hole (20). (2) The sliding inner conductor of the coaxial through hole (20) is configured to come into elastic contact with the conductor of the board side through hole (10). Connection structure of microwave IC. (3) The inner conductor (22) of the coaxial through hole (20)
2. The connection structure for a microwave IC according to claim 1, wherein the protruding portion is configured to fit into the hole of the substrate-side through hole.