JPS5833708Y2 - flexible printed circuit board - Google Patents
flexible printed circuit boardInfo
- Publication number
- JPS5833708Y2 JPS5833708Y2 JP13599578U JP13599578U JPS5833708Y2 JP S5833708 Y2 JPS5833708 Y2 JP S5833708Y2 JP 13599578 U JP13599578 U JP 13599578U JP 13599578 U JP13599578 U JP 13599578U JP S5833708 Y2 JPS5833708 Y2 JP S5833708Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- flexible printed
- metal foil
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Structure Of Printed Boards (AREA)
Description
【考案の詳細な説明】
本考案は薄い合成樹脂製のフレキシブル印刷基板を簡単
にして立体的形状に構成することができるようにしたフ
レキシブル印刷基板に関する。[Detailed Description of the Invention] The present invention relates to a flexible printed board made of thin synthetic resin that can be easily configured into a three-dimensional shape.
フレキシブル印刷基板はそれ自体可撓性を有するため、
変形し、折曲げ等が自在であるが、常に復元力が働いて
おり、このため例えば電子機器等に折曲げた状態で小さ
なスペースに挿入させるような場合、その電子機器の組
立て時には手や工具等で折曲げ状態を保持して組立てな
ければならないような状態が発生する。Since flexible printed circuit boards are themselves flexible,
Although it can be deformed and bent freely, a restoring force is always at work, and for this reason, for example, when an electronic device is inserted into a small space in a bent state, it is necessary to use hands or tools when assembling the electronic device. A situation may arise in which it is necessary to maintain the folded state while assembling.
しかしながら、このように折曲げ状態を保持しながら組
立てを行なうことは極めて非能率的であり、作業性が悪
いものであった。However, performing the assembly while maintaining the folded state in this manner is extremely inefficient and has poor workability.
本考案はこのような従来の欠点に鑑みてフレキシブル印
刷基板を折曲げた状態に簡単にして保持することができ
るもので、以−１でその一実施例について図面を用いて
説明しよう
１は薄い合成樹脂製のフレキシブル印刷基板であり、２
，３，４は前記フレキシブル印刷基板１の導体箔５，６
，７，８，９．１０に半田付ｊ−ｉにより接続された抵
抗やコンテ゛ンサ等の電子部品である。In view of these conventional drawbacks, the present invention is capable of easily holding a flexible printed circuit board in a folded state.One embodiment of the present invention will be explained below with reference to the drawings. It is a flexible printed circuit board made of synthetic resin, and 2
, 3 and 4 are conductor foils 5 and 6 of the flexible printed circuit board 1.
, 7, 8, 9, and 10 are electronic components such as resistors and capacitors connected by soldering ji.
前記電子部品３と４の間のフレキシブル印刷基板１の裏
面には導体箔１１が設けられ、該導体箔１１は回路構成
用であってもまた回路を構成しないもので゛あってもよ
い。A conductor foil 11 is provided on the back surface of the flexible printed circuit board 1 between the electronic components 3 and 4, and the conductor foil 11 may be used for configuring a circuit or may not be used for configuring a circuit.
一方、電子部品３と４の間のフレキシブ・し印刷基板１
の表面には少し厚手の導体箔あるいは鉛箔等の可塑性を
もつ金属箔１２が設けられている。On the other hand, the flexible printed circuit board 1 between the electronic components 3 and 4
A plastic metal foil 12 such as a slightly thick conductive foil or a lead foil is provided on the surface.
このようにフレキシブル印刷基板１の一部に可塑性をも
つ金属箔１２を設けることにより、このフレキシブル印
刷基板１をその金属箔１２部で折曲げ′ることにより第
２図に示すようにその折曲げ力を取り去ってもフレキシ
ブル印刷基板１の折曲げ状態が保持される。By providing the metal foil 12 with plasticity on a part of the flexible printed circuit board 1 in this way, the flexible printed circuit board 1 can be bent by the metal foil 12, as shown in FIG. Even when the force is removed, the bent state of the flexible printed circuit board 1 is maintained.
本考案は以上のように、フレキシブル印刷基板の折曲げ
位置に可塑性をもつ金属箔を設けることによりこの金属
箔の可塑性によってフレキシブル基板の折曲げ状態が維
持されるため、電子機器の組立時等に従来のようにいち
いち折曲げ状態を保持するような必要が全くなくなり、
作業性が著しく向上するものであり、その実用性は大で
ある。As described above, the present invention provides a flexible metal foil at the bending position of a flexible printed circuit board, so that the bending state of the flexible circuit board is maintained due to the plasticity of the metal foil, so that it can be easily used when assembling electronic devices, etc. There is no need to maintain the folded state every time as in the past.
This greatly improves workability and has great practicality.
第１図は本考案の一実施例を示す折曲げ前の側面図、第
２図は同折曲げ状態の側面図である。
１・・・・・・フレキシブル印刷基板、１２・・・・・
・金属箔。FIG. 1 is a side view of an embodiment of the present invention before it is folded, and FIG. 2 is a side view of the folded state. 1...Flexible printed circuit board, 12...
・Metal foil.
Claims (1)
け、前記フレキシブル印刷基板を金属箔部で折曲げるこ
とによりその折曲げ状態が該金属箔の可塑性によって維
持されるように構成してなるフレキシブル印刷基板。Flexible printing comprising a flexible printed circuit board with a metal foil having plasticity provided in a part thereof, and by bending the flexible printed circuit board at the metal foil portion, the bent state is maintained by the plasticity of the metal foil. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13599578U JPS5833708Y2 (en) | 1978-10-02 | 1978-10-02 | flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13599578U JPS5833708Y2 (en) | 1978-10-02 | 1978-10-02 | flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5552860U JPS5552860U (en) | 1980-04-09 |
| JPS5833708Y2 true JPS5833708Y2 (en) | 1983-07-28 |
Family
ID=29106832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13599578U Expired JPS5833708Y2 (en) | 1978-10-02 | 1978-10-02 | flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5833708Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2014192490A1 (en) * | 2013-05-28 | 2017-02-23 | タツタ電線株式会社 | Shape-retaining film and shape-retaining flexible wiring board provided with the shape-retaining film |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5848496A (en) * | 1981-09-17 | 1983-03-22 | 松下電器産業株式会社 | Small electronic circuit component structure |
| JPS5879799A (en) * | 1981-11-06 | 1983-05-13 | 松下電器産業株式会社 | Method for manufacturing hybrid integrated circuits |
| JP5354018B2 (en) | 2009-08-11 | 2013-11-27 | 株式会社村田製作所 | Multilayer board |
-
1978
- 1978-10-02 JP JP13599578U patent/JPS5833708Y2/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPWO2014192490A1 (en) * | 2013-05-28 | 2017-02-23 | タツタ電線株式会社 | Shape-retaining film and shape-retaining flexible wiring board provided with the shape-retaining film |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5552860U (en) | 1980-04-09 |
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