JPS57210638A - Hybrid integrated circuit - Google Patents

Hybrid integrated circuit

Info

Publication number
JPS57210638A
JPS57210638A JP56094964A JP9496481A JPS57210638A JP S57210638 A JPS57210638 A JP S57210638A JP 56094964 A JP56094964 A JP 56094964A JP 9496481 A JP9496481 A JP 9496481A JP S57210638 A JPS57210638 A JP S57210638A
Authority
JP
Japan
Prior art keywords
conductor
bumps
electrode
integrated circuit
hybrid integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56094964A
Other languages
Japanese (ja)
Inventor
Toshio Hida
Tetsunori Sawae
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP56094964A priority Critical patent/JPS57210638A/en
Publication of JPS57210638A publication Critical patent/JPS57210638A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/281—Auxiliary members
    • H10W72/287—Flow barriers

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent the deterioration in wettability between glass paste and an electrode conductor and in the solder wettability with the conductor by providing a suppressing member which eliminates the material of a connecting member to flow onto an electrode member when an element is connected to the connecting member. CONSTITUTION:An electrode conductor 12 is formed on an insulating substrate 11, and a polyimide resin film having preferable heat resistance is formed in the vicinity on the conductor 12 except the central part of the substance 11 and the part to be formed with solder bumps 14. Then, holes are opened at the terminal 31 of the conductor 12 and the part corresponding to the bumps 14, dams 13 are formed, and a flip chip IC15 is soldered through the bumps 14.
JP56094964A 1981-06-18 1981-06-18 Hybrid integrated circuit Pending JPS57210638A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56094964A JPS57210638A (en) 1981-06-18 1981-06-18 Hybrid integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56094964A JPS57210638A (en) 1981-06-18 1981-06-18 Hybrid integrated circuit

Publications (1)

Publication Number Publication Date
JPS57210638A true JPS57210638A (en) 1982-12-24

Family

ID=14124605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56094964A Pending JPS57210638A (en) 1981-06-18 1981-06-18 Hybrid integrated circuit

Country Status (1)

Country Link
JP (1) JPS57210638A (en)

Cited By (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5111279A (en) * 1989-08-28 1992-05-05 Lsi Logic Corp. Apparatus for isolation of flux materials in "flip-chip" manufacturing
US5249098A (en) * 1991-08-22 1993-09-28 Lsi Logic Corporation Semiconductor device package with solder bump electrical connections on an external surface of the package
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5311060A (en) * 1989-12-19 1994-05-10 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5341564A (en) * 1992-03-24 1994-08-30 Unisys Corporation Method of fabricating integrated circuit module
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5489804A (en) * 1989-08-28 1996-02-06 Lsi Logic Corporation Flexible preformed planar structures for interposing between a chip and a substrate
US5504035A (en) * 1989-08-28 1996-04-02 Lsi Logic Corporation Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures
US5834799A (en) * 1989-08-28 1998-11-10 Lsi Logic Optically transmissive preformed planar structures
US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6300678B1 (en) 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates
US6785001B2 (en) 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US6839479B2 (en) 2002-05-29 2005-01-04 Silicon Light Machines Corporation Optical switch
US6872984B1 (en) 1998-07-29 2005-03-29 Silicon Light Machines Corporation Method of sealing a hermetic lid to a semiconductor die at an angle
US6908201B2 (en) 2002-06-28 2005-06-21 Silicon Light Machines Corporation Micro-support structures
US6922273B1 (en) 2003-02-28 2005-07-26 Silicon Light Machines Corporation PDL mitigation structure for diffractive MEMS and gratings
US6922272B1 (en) 2003-02-14 2005-07-26 Silicon Light Machines Corporation Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices
US6928207B1 (en) 2002-12-12 2005-08-09 Silicon Light Machines Corporation Apparatus for selectively blocking WDM channels
US6934070B1 (en) 2002-12-18 2005-08-23 Silicon Light Machines Corporation Chirped optical MEM device
US6947613B1 (en) 2003-02-11 2005-09-20 Silicon Light Machines Corporation Wavelength selective switch and equalizer
US6956995B1 (en) 2001-11-09 2005-10-18 Silicon Light Machines Corporation Optical communication arrangement
US6987600B1 (en) 2002-12-17 2006-01-17 Silicon Light Machines Corporation Arbitrary phase profile for better equalization in dynamic gain equalizer
US7027202B1 (en) 2003-02-28 2006-04-11 Silicon Light Machines Corp Silicon substrate as a light modulator sacrificial layer
US7042611B1 (en) 2003-03-03 2006-05-09 Silicon Light Machines Corporation Pre-deflected bias ribbons
US7046420B1 (en) 2003-02-28 2006-05-16 Silicon Light Machines Corporation MEM micro-structures and methods of making the same
US7049164B2 (en) 2001-09-13 2006-05-23 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US7054515B1 (en) 2002-05-30 2006-05-30 Silicon Light Machines Corporation Diffractive light modulator-based dynamic equalizer with integrated spectral monitor
US7057819B1 (en) 2002-12-17 2006-06-06 Silicon Light Machines Corporation High contrast tilting ribbon blazed grating
US7057795B2 (en) 2002-08-20 2006-06-06 Silicon Light Machines Corporation Micro-structures with individually addressable ribbon pairs
US7177081B2 (en) 2001-03-08 2007-02-13 Silicon Light Machines Corporation High contrast grating light valve type device
US8168525B2 (en) 2007-03-01 2012-05-01 Nec Corporation Electronic part mounting board and method of mounting the same

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5504035A (en) * 1989-08-28 1996-04-02 Lsi Logic Corporation Process for solder ball interconnecting a semiconductor device to a substrate using a noble metal foil embedded interposer substrate
US5299730A (en) * 1989-08-28 1994-04-05 Lsi Logic Corporation Method and apparatus for isolation of flux materials in flip-chip manufacturing
US5347162A (en) * 1989-08-28 1994-09-13 Lsi Logic Corporation Preformed planar structures employing embedded conductors
US5111279A (en) * 1989-08-28 1992-05-05 Lsi Logic Corp. Apparatus for isolation of flux materials in "flip-chip" manufacturing
US5410805A (en) * 1989-08-28 1995-05-02 Lsi Logic Corporation Method and apparatus for isolation of flux materials in "flip-chip" manufacturing
US5834799A (en) * 1989-08-28 1998-11-10 Lsi Logic Optically transmissive preformed planar structures
US5489804A (en) * 1989-08-28 1996-02-06 Lsi Logic Corporation Flexible preformed planar structures for interposing between a chip and a substrate
US5311060A (en) * 1989-12-19 1994-05-10 Lsi Logic Corporation Heat sink for semiconductor device assembly
US5399903A (en) * 1990-08-15 1995-03-21 Lsi Logic Corporation Semiconductor device having an universal die size inner lead layout
US5249098A (en) * 1991-08-22 1993-09-28 Lsi Logic Corporation Semiconductor device package with solder bump electrical connections on an external surface of the package
US5434750A (en) * 1992-02-07 1995-07-18 Lsi Logic Corporation Partially-molded, PCB chip carrier package for certain non-square die shapes
US5341564A (en) * 1992-03-24 1994-08-30 Unisys Corporation Method of fabricating integrated circuit module
US5438477A (en) * 1993-08-12 1995-08-01 Lsi Logic Corporation Die-attach technique for flip-chip style mounting of semiconductor dies
US5388327A (en) * 1993-09-15 1995-02-14 Lsi Logic Corporation Fabrication of a dissolvable film carrier containing conductive bump contacts for placement on a semiconductor device package
US5770889A (en) * 1995-12-29 1998-06-23 Lsi Logic Corporation Systems having advanced pre-formed planar structures
US6096576A (en) * 1997-09-02 2000-08-01 Silicon Light Machines Method of producing an electrical interface to an integrated circuit device having high density I/O count
US6452260B1 (en) 1997-09-02 2002-09-17 Silicon Light Machines Electrical interface to integrated circuit device having high density I/O count
US6300678B1 (en) 1997-10-03 2001-10-09 Fujitsu Limited I/O pin having solder dam for connecting substrates
US6872984B1 (en) 1998-07-29 2005-03-29 Silicon Light Machines Corporation Method of sealing a hermetic lid to a semiconductor die at an angle
US7177081B2 (en) 2001-03-08 2007-02-13 Silicon Light Machines Corporation High contrast grating light valve type device
US6785001B2 (en) 2001-08-21 2004-08-31 Silicon Light Machines, Inc. Method and apparatus for measuring wavelength jitter of light signal
US7049164B2 (en) 2001-09-13 2006-05-23 Silicon Light Machines Corporation Microelectronic mechanical system and methods
US6956995B1 (en) 2001-11-09 2005-10-18 Silicon Light Machines Corporation Optical communication arrangement
US6839479B2 (en) 2002-05-29 2005-01-04 Silicon Light Machines Corporation Optical switch
US7054515B1 (en) 2002-05-30 2006-05-30 Silicon Light Machines Corporation Diffractive light modulator-based dynamic equalizer with integrated spectral monitor
US6908201B2 (en) 2002-06-28 2005-06-21 Silicon Light Machines Corporation Micro-support structures
US7057795B2 (en) 2002-08-20 2006-06-06 Silicon Light Machines Corporation Micro-structures with individually addressable ribbon pairs
US6928207B1 (en) 2002-12-12 2005-08-09 Silicon Light Machines Corporation Apparatus for selectively blocking WDM channels
US7057819B1 (en) 2002-12-17 2006-06-06 Silicon Light Machines Corporation High contrast tilting ribbon blazed grating
US6987600B1 (en) 2002-12-17 2006-01-17 Silicon Light Machines Corporation Arbitrary phase profile for better equalization in dynamic gain equalizer
US6934070B1 (en) 2002-12-18 2005-08-23 Silicon Light Machines Corporation Chirped optical MEM device
US6947613B1 (en) 2003-02-11 2005-09-20 Silicon Light Machines Corporation Wavelength selective switch and equalizer
US6922272B1 (en) 2003-02-14 2005-07-26 Silicon Light Machines Corporation Method and apparatus for leveling thermal stress variations in multi-layer MEMS devices
US7046420B1 (en) 2003-02-28 2006-05-16 Silicon Light Machines Corporation MEM micro-structures and methods of making the same
US7027202B1 (en) 2003-02-28 2006-04-11 Silicon Light Machines Corp Silicon substrate as a light modulator sacrificial layer
US6922273B1 (en) 2003-02-28 2005-07-26 Silicon Light Machines Corporation PDL mitigation structure for diffractive MEMS and gratings
US7042611B1 (en) 2003-03-03 2006-05-09 Silicon Light Machines Corporation Pre-deflected bias ribbons
US8168525B2 (en) 2007-03-01 2012-05-01 Nec Corporation Electronic part mounting board and method of mounting the same

Similar Documents

Publication Publication Date Title
JPS57210638A (en) Hybrid integrated circuit
GB1109806A (en) Improvements in the interconnection of electrical circuit devices
GB1171655A (en) Method of Making Electrical Wiring and Wiring Circuit Connections between Conductors and the Electrodes of an Electrical Component
JPS5779652A (en) Resin-sealed semiconductor device
JPS5618448A (en) Composite electronic part
JP2574369B2 (en) Semiconductor chip mounted body and mounting method thereof
JPS56137659A (en) Semiconductor device and its manufacture
JP2637863B2 (en) Semiconductor device
JPS5599731A (en) Method of assembling electronic device and lead frame used for assembly
JPS551153A (en) Semiconductor fitting device
JPS5618454A (en) Hybrid integrated circuit
JPS5795640A (en) Mounting structure of semiconductor
JPS57202747A (en) Electronic circuit device
JPS57139953A (en) Semiconductor device
JPS5524478A (en) Integrated circuit
JPH05343593A (en) Connecting terminal
JPS554904A (en) Semi-conductor device
JPS5831539A (en) Manufacture of hybrid integrated circuit
JPS5994493A (en) Circuit board device with electronic components
JPS5546561A (en) Method of fabricating hybrid integrated circuit
JPS5571053A (en) Circuit device
JPS54153586A (en) Semiconductor device
JPS562641A (en) Semiconductor device
JPS5745262A (en) Sealing and fitting structure of semiconductor device
JPS54121670A (en) Semiconductor device and its manufacture