JPS57102057A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57102057A
JPS57102057A JP17725780A JP17725780A JPS57102057A JP S57102057 A JPS57102057 A JP S57102057A JP 17725780 A JP17725780 A JP 17725780A JP 17725780 A JP17725780 A JP 17725780A JP S57102057 A JPS57102057 A JP S57102057A
Authority
JP
Japan
Prior art keywords
circuit element
semiconductor element
electrically
pellet
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17725780A
Other languages
Japanese (ja)
Inventor
Yasutoshi Kurihara
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP17725780A priority Critical patent/JPS57102057A/en
Publication of JPS57102057A publication Critical patent/JPS57102057A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To enable to arrange easily a circuit element for substitution in a semiconductor device by a method wherein a space is reserved on a conductor plate as to enable to provide a reserve circuit element of the same kind with a circuit element provided on the conductor plate at the electrically and thermally equivalent position with the existing circuit element. CONSTITUTION:The first conductor 1 is provided on a metal supporter 2 interposig an insulator 3 between then. Moreover the second conductors 4, 4' are provided on the first conductor 1 interposing insulators 5, 5' between then. At this time, the second conductors 4, 4' are arranged as to become equivalent electrically and thermally to both of the semiconductor element pellet 6 and another semiconductor element pellet 8 to be substituted therefor. Accordingly even when electric connection between the semiconductor element pellet 6 and the other member is failed, the other semiconductor element pellet 8 for substitution can be arranged at once at the electrically and thermally equivalent position.
JP17725780A 1980-12-17 1980-12-17 Semiconductor device Pending JPS57102057A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17725780A JPS57102057A (en) 1980-12-17 1980-12-17 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17725780A JPS57102057A (en) 1980-12-17 1980-12-17 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57102057A true JPS57102057A (en) 1982-06-24

Family

ID=16027906

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17725780A Pending JPS57102057A (en) 1980-12-17 1980-12-17 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57102057A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984458A (en) * 1982-11-04 1984-05-16 Mitsubishi Electric Corp Gate turn off thyristor assembled body
JP2019519087A (en) * 2016-03-12 2019-07-04 ニンボー サニー オプテック カンパニー，リミテッド Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984458A (en) * 1982-11-04 1984-05-16 Mitsubishi Electric Corp Gate turn off thyristor assembled body
JP2019519087A (en) * 2016-03-12 2019-07-04 ニンボー サニー オプテック カンパニー，リミテッド Array imaging module and molded photosensitive assembly, and method of manufacturing the same for electronic devices

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