JPS5661469A - Hot-bonding adhesive - Google Patents

Hot-bonding adhesive

Info

Publication number
JPS5661469A
JPS5661469A JP13738779A JP13738779A JPS5661469A JP S5661469 A JPS5661469 A JP S5661469A JP 13738779 A JP13738779 A JP 13738779A JP 13738779 A JP13738779 A JP 13738779A JP S5661469 A JPS5661469 A JP S5661469A
Authority
JP
Japan
Prior art keywords
adhesive
thermoplastic resin
adhesion
resin foam
heated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13738779A
Other languages
Japanese (ja)
Inventor
Masaki Miyazaki
Eiji Kawakita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Matsumoto Yushi Seiyaku Co Ltd
Original Assignee
Matsumoto Yushi Seiyaku Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsumoto Yushi Seiyaku Co Ltd filed Critical Matsumoto Yushi Seiyaku Co Ltd
Priority to JP13738779A priority Critical patent/JPS5661469A/en
Publication of JPS5661469A publication Critical patent/JPS5661469A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesives Or Adhesive Processes (AREA)

Abstract

PURPOSE: To obtain a hot-bonding adhesive which has no adhesion before use, is capable of restoring its adhesion when heated, and is suitable of pressure-sensitive adhesive sheet, by adding a specific amount of a thermoplastic resin foam particle to an adhesive.
CONSTITUTION: A thermoplastic resin foam particle is manufactured by expanding an expansible thermoplastic fine particle obtained by the encapsulation of a component capable of giving out a gas when heated in the shell of a thermoplastic resin, etc. Then, the thermoplastic resin foam particle is compounded in a pressure- sensitive adhesive, etc., in such an amount that the adhesion of adhesive components is lost before use but restored when heated to higher than the melting point of the thermoplastic resin foam particle when being used to obtain an objective adhesive. Preferably, 100pts.wt. adhesive component is mixed with approx. 30W 100pts.wt. thermoplastic resin foam particle, whereby forming a hot-bonding adhesive which has no adhesion at ordinary temperature but is capable of restoring its adhesion with the reduction of its volume when heated.
COPYRIGHT: (C)1981,JPO&Japio
JP13738779A 1979-10-23 1979-10-23 Hot-bonding adhesive Pending JPS5661469A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13738779A JPS5661469A (en) 1979-10-23 1979-10-23 Hot-bonding adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13738779A JPS5661469A (en) 1979-10-23 1979-10-23 Hot-bonding adhesive

Publications (1)

Publication Number Publication Date
JPS5661469A true JPS5661469A (en) 1981-05-26

Family

ID=15197490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13738779A Pending JPS5661469A (en) 1979-10-23 1979-10-23 Hot-bonding adhesive

Country Status (1)

Country Link
JP (1) JPS5661469A (en)

Cited By (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61281178A (en) * 1985-06-07 1986-12-11 Nitto Electric Ind Co Ltd Substrate-free double-coated tape
US4855170A (en) * 1986-08-21 1989-08-08 Minnesota Mining And Manufacturing Company Pressure-sensitive tape construction incorporating resilient polymeric microspheres
JP2003501544A (en) * 1999-06-02 2003-01-14 ベイン，ピーター・スチュワート Adhesive composition comprising thermally expandable microcapsules
US6872635B2 (en) 2001-04-11 2005-03-29 Sony Corporation Device transferring method, and device arraying method and image display unit fabricating method using the same
US6943047B2 (en) 2001-08-01 2005-09-13 Sony Corporation Device transferring method, device arraying method, and image display fabrication method using the same
US6972204B2 (en) 2001-09-06 2005-12-06 Sony Corporation Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system
US6998175B2 (en) 2000-05-15 2006-02-14 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet
US7163597B2 (en) 1999-11-08 2007-01-16 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet
JP2008501848A (en) * 2004-06-11 2008-01-24 エルジー・ケム・リミテッド Adhesive sheets including hollow portions and methods for producing the same
WO2008053713A1 (en) 2006-11-04 2008-05-08 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend
WO2008053840A1 (en) 2006-11-04 2008-05-08 Nitto Denko Corporation Thermally strippable double faced adhesive sheet and method of working work piece
US7635516B2 (en) 2004-03-11 2009-12-22 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
US7811647B2 (en) 2004-03-11 2010-10-12 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
WO2011049116A1 (en) 2009-10-20 2011-04-28 日東電工株式会社 Thermally removable pressure-sensitive adhesive sheet
WO2012099122A1 (en) 2011-01-19 2012-07-26 日東電工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
WO2012099121A1 (en) 2011-01-19 2012-07-26 日東電工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
US8524361B2 (en) 2009-03-04 2013-09-03 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
EP2644669A1 (en) 2012-03-27 2013-10-02 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet

Cited By (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61281178A (en) * 1985-06-07 1986-12-11 Nitto Electric Ind Co Ltd Substrate-free double-coated tape
US4855170A (en) * 1986-08-21 1989-08-08 Minnesota Mining And Manufacturing Company Pressure-sensitive tape construction incorporating resilient polymeric microspheres
JP2003501544A (en) * 1999-06-02 2003-01-14 ベイン，ピーター・スチュワート Adhesive composition comprising thermally expandable microcapsules
US7163597B2 (en) 1999-11-08 2007-01-16 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet
US6998175B2 (en) 2000-05-15 2006-02-14 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet
US6872635B2 (en) 2001-04-11 2005-03-29 Sony Corporation Device transferring method, and device arraying method and image display unit fabricating method using the same
US7195687B2 (en) 2001-04-11 2007-03-27 Sony Corporation Device transferring method, and device arraying method and image display unit fabricating method using the same
US6943047B2 (en) 2001-08-01 2005-09-13 Sony Corporation Device transferring method, device arraying method, and image display fabrication method using the same
US6972204B2 (en) 2001-09-06 2005-12-06 Sony Corporation Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system
US7015055B2 (en) 2001-09-06 2006-03-21 Sony Corporation Method of transferring devices, method of arranging devices using the same, and method of manufacturing an image display system
US7635516B2 (en) 2004-03-11 2009-12-22 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
US7811647B2 (en) 2004-03-11 2010-10-12 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method for processing adherend using the heat-peelable pressure-sensitive adhesive sheet
JP2008501848A (en) * 2004-06-11 2008-01-24 エルジー・ケム・リミテッド Adhesive sheets including hollow portions and methods for producing the same
JP4855403B2 (en) * 2004-06-11 2012-01-18 エルジー・ケム・リミテッド Adhesive sheets including hollow portions and methods for producing the same
US8067475B2 (en) 2004-06-11 2011-11-29 Lg Chem, Ltd. Adhesive sheet comprising hollow parts and method for preparing the same
WO2008053840A1 (en) 2006-11-04 2008-05-08 Nitto Denko Corporation Thermally strippable double faced adhesive sheet and method of working work piece
WO2008053713A1 (en) 2006-11-04 2008-05-08 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet and method of recovering adherend
US8524361B2 (en) 2009-03-04 2013-09-03 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet for cutting laminated ceramic sheet and method for cut-processing laminated ceramic sheet
WO2011049116A1 (en) 2009-10-20 2011-04-28 日東電工株式会社 Thermally removable pressure-sensitive adhesive sheet
US8999503B2 (en) 2009-10-20 2015-04-07 Nitto Denko Corporation Thermally removable pressure-sensitive adhesive sheet
WO2012099122A1 (en) 2011-01-19 2012-07-26 日東電工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
WO2012099121A1 (en) 2011-01-19 2012-07-26 日東電工株式会社 Double-sided adhesive tape or sheet, and adherend processing method
US9120955B2 (en) 2011-01-19 2015-09-01 Nitto Denko Corporation Double-sided adhesive tape or sheet, and adherend processing method
KR20180100273A (en) 2011-01-19 2018-09-07 닛토덴코 가부시키가이샤 Double-sided adhesive tape or sheet, and adherend processing method
KR20190133064A (en) 2011-01-19 2019-11-29 닛토덴코 가부시키가이샤 Double-sided adhesive tape or sheet, and adherend processing method
EP2644669A1 (en) 2012-03-27 2013-10-02 Nitto Denko Corporation Heat-peelable pressure-sensitive adhesive sheet
KR20130110067A (en) 2012-03-27 2013-10-08 닛토덴코 가부시키가이샤 Heat-peelable pressure-sensitive adhesive sheet

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