JPH11284297A - Hybrid module and manufacturing method thereof - Google Patents

Abstract

(57) Abstract: Provided is a hybrid module having good soldering of circuit components and excellent reliability, and a method of manufacturing the hybrid module. SOLUTION: After a predetermined number of ceramic green sheets in which an inner conductor and a surface wiring conductor 111 are formed of an Ag-based conductor material are laminated and fired, the surface wiring conductor 111 is formed.
Cu-based conductor material film 1 only on the soldered part (land 112)
By forming and firing 13, a ceramic multi-layer circuit board 11 is formed, and a circuit component is soldered and mounted on the circuit board 11 to produce a hybrid module. In this manufacturing method, since the Cu-based conductor material is fired in a neutral or reducing atmosphere after the Ag-based conductor material is fired in a neutral or oxidizing atmosphere, oxidation of the Cu-based conductor material can be prevented. Furthermore, since the inner and surface wiring conductors 111 can be fired simultaneously, the number of steps and cost can be reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid module in which a circuit is formed by mounting chip components and semiconductor components such as a multilayer capacitor and a multilayer inductor on a circuit board on which wiring conductors are formed.

[0002]

2. Description of the Related Art Conventionally, with the development of electronic equipment, a hybrid module in which a circuit having one function is formed on a small circuit board has been used. There are many types of such hybrid modules having specific functions, and modules having new functions are also produced as needed.

[0003] Such a hybrid module is treated as a small component having one function integrated therein, and is used by being soldered and mounted on a parent circuit board, and is greatly used for simplifying device assembly work and miniaturizing the device. Have contributed.

A hybrid module is composed of a single-layer or multi-layer circuit board, wiring conductors formed on the circuit board, and a plurality of circuit components mounted on the circuit board. Some circuit boards use a material such as glass epoxy. However, in recent years, ceramics have become the mainstream, and the size of the module itself has been reduced by changing from a single layer to a multilayer.

Further, a silver (Ag) -based conductor material having high adhesion strength to ceramic has been used as a wiring conductor when a ceramic circuit board is used.

For example, a hybrid module using a ceramic circuit board is manufactured by the following first or second conventional method.

[0007] (First Conventional Example) Wiring conductors of the inner layer and the surface layer are formed on a ceramic green sheet having via holes formed thereon by using an Ag-based conductor material by screen printing (including filling of conductors into respective via holes), and a predetermined number of conductors are formed. The green sheets are laminated and pressed, and after debinding in an oxidizing atmosphere, fired to form a circuit board, and a surface mount component is soldered to the surface.

(Second Conventional Example) An internal conductor for wiring is formed by screen printing using an Ag-based conductor material on a ceramic green sheet having a via hole formed therein (including filling of the via hole with a conductor) to form a predetermined green. After laminating and pressing the sheets, debindering them in an oxidizing atmosphere and then firing them, a surface wiring conductor is formed on the surface using an Ag-based conductor material to form a circuit board. Solder the mounted components.

However, when the wiring conductor is formed by using a silver (Ag) -based conductor material, the following problem occurs.

(1) When soldering a wiring conductor on the surface of a circuit board to a circuit component, lead (P) which is a component of solder is soldered.
Since b) and Ag of the wiring conductor do not form a compound, poor solder wettability is caused and a standing failure occurs in which a chip-shaped circuit component rises. (2) To improve the solder wettability, Pb is used more than Pb. If a solder containing a large amount of tin (Sn) is used, the wiring conductor is eroded by solder, and the reliability is reduced.

(3) In the case of a co-fired ceramic circuit board using an Ag-based conductor material, migration of Ag or the like of a wiring conductor formed on the surface is likely to occur, so that insulation failure or short circuit occurs.

In order to solve these problems, a circuit board in which only wiring conductors on the surface of the circuit board are formed using a copper (Cu) -based conductor material and a method of manufacturing the same are disclosed in Japanese Patent Application Laid-Open No. Sho 62-2
No. 65796 and JP-A-6-342979.

For example, in a hybrid module using a ceramic circuit board, a wiring conductor made of a Cu-based conductive material is formed on the surface by a method shown in the following third conventional example.

(Third conventional example) An internal wiring conductor is formed by screen printing using an Ag-based conductor material on a ceramic green sheet in which a via hole is formed (including filling of the via hole with a conductor), and a predetermined number of conductors are formed. A green sheet is laminated and pressed, and after debinding in an oxidizing atmosphere, the surface of the fired body is fired. A surface wiring conductor is formed on the surface of the fired body using a Cu-based conductor material by screen printing (to be applied to each via hole). This is fired in a reducing atmosphere at a temperature lower than the eutectic temperature with Ag to form a circuit board, and a surface mount component is soldered to this surface.

[0015]

However, when the surface wiring conductor is formed of a Cu-based conductor material as described above, the bonding strength between the ceramic and the ceramic when the ceramic circuit board is used is lower than that of Ag. However, since Cu is weaker, there is a problem in that the reliability is not as high as when an Ag-based conductor is used.

In view of the above problems, an object of the present invention is to provide a hybrid module which has good soldering of circuit components and is excellent in reliability, and a method of manufacturing the same.

[0017]

In order to achieve the above object, the present invention provides a circuit board, a wiring conductor formed on the circuit board, and a circuit component soldered and mounted on the circuit board. Wherein the wiring conductor is made of an Ag-based material, and the Cu-based conductor material is provided only on the soldered portion of the circuit board surface. A hybrid module having a membrane is proposed.

According to the hybrid module, since the Cu-based conductor material film is formed on the surface of the Ag-based material only on the soldered portion of the wiring conductor on the surface of the circuit board,
When soldering circuit parts, Cu-based conductor material and solder
Since a compound such as u ₃ Sn is generated, the solder wettability is improved. Further, in the soldered portion of the wiring conductor, A
The g-based conductor material and the Cu-based conductor material are firmly joined by the glass frit component contained in both conductors.

Further, when a ceramic circuit board is used as the circuit board, good bonding strength between the ceramic and the Ag-based conductor material can be obtained.

Further, by connecting the soldered portion of the wiring conductor and the circuit component with solder containing a large amount of Sn, a large amount of the compound such as Cu ₃ Sn is generated, so that the solder wettability is reduced. It will be even better.

Further, by connecting the soldered portion of the wiring conductor and the circuit component with a high-temperature solder having a melting point temperature of 190 ° C. or more, the produced hybrid module is made of eutectic solder having a melting point temperature of 183 ° C. When soldering to the parent circuit board, the high-temperature solder connecting the circuit components mounted on the module does not melt, and the circuit components do not move.

Further, by using a ceramic multilayer circuit board having one or more recesses as the circuit board and mounting bare chip electronic components in the recesses, the shape is reduced.

On the other hand, the following manufacturing method is proposed as a method for manufacturing the above hybrid module. The first manufacturing method includes a step of forming a wiring conductor on a green sheet made of a ceramic insulating material using an Ag-based conductor material, and after performing this step, stacking a predetermined green sheet to form a wiring conductor on the surface. A step of forming a laminate on which a conductor is formed; a step of firing the laminate in a neutral or oxidizing atmosphere to form a fired body; and a portion to be soldered in the wiring conductor exposed on the surface of the fired body. Forming a Cu-based conductor material film on the substrate, baking in a neutral or reducing atmosphere to form the circuit board, and soldering a circuit component to the soldering target portion on the surface of the circuit board. Have.

According to the method of manufacturing the hybrid module, the inner layer, the surface layer, or the wiring conductor only on the surface layer is made of Ag.
After laminating and firing a predetermined number of ceramic green sheets formed of a base conductor material, a single layer (both sides) is formed by forming and firing a Cu-based conductor material film only on the portion of the surface wiring conductor to be soldered. Alternatively, a hybrid module is formed by forming a multilayer ceramic circuit board and soldering and mounting circuit components on the circuit board. In this manufacturing method, the Cu-based conductor material is calcined in a neutral or reducing atmosphere after the Ag-based conductor material is calcined in a neutral or oxidizing atmosphere, so that oxidation of the Cu-based conductor material can be prevented. Further, when the circuit board has a multilayer structure, the wiring conductors in the inner layer and the surface layer can be simultaneously fired, so that the number of steps and the cost can be reduced.

A second manufacturing method includes a circuit board, a wiring conductor formed on the circuit board, and a circuit component soldered and mounted on the circuit board, and mounted on a parent circuit board. Forming a wiring conductor on a green sheet made of a ceramic insulating material using an Ag-based conductor material,
After performing this step, a step of laminating a predetermined green sheet to form a laminate having no wiring conductor formed on its surface, a step of firing the laminate in a neutral or oxidizing atmosphere, Forming a wiring conductor on the surface of the laminated body using an Ag-based conductor material after the step, and firing in a neutral or oxidizing atmosphere to form a fired body; and the wiring exposed on the surface of the fired body. Forming a Cu-based conductor material film on a portion to be soldered in the conductor for use, and baking it in a neutral or reducing atmosphere to form a multilayer circuit board; and forming a circuit on the surface of the multilayer circuit board on the portion to be soldered. Soldering the component.

According to the method of manufacturing the hybrid module, after a predetermined number of ceramic green sheets in which the wiring conductors of only the inner layer are formed of the Ag-based conductor material are laminated and fired, the surface-layer wiring conductors are replaced with the Ag-based conductor. A ceramic multi-layer circuit board is formed by forming a material and firing the same, and further forming a Cu-based conductor material film only on a portion of the surface wiring conductor to be soldered and firing the same, thereby forming circuit components on the circuit board. Is mounted by soldering to produce a hybrid module. In this manufacturing method,
Since the surface wiring conductor is formed after the green sheet laminate is fired once, the dimensional accuracy of the surface wiring conductor is increased. Furthermore, since the Cu-based conductor material is fired in a neutral or reducing atmosphere after the Ag-based conductor material is fired in a neutral or oxidizing atmosphere, oxidation of the Cu-based conductor material can be prevented.

A third manufacturing method is a method for manufacturing a hybrid module having a multilayer circuit board having a recess formed therein and a bare chip electronic component mounted in the recess, wherein an opening corresponding to the recess is provided. Forming a wiring conductor by using an Ag-based conductor material on a green sheet made of a ceramic material having no and a green sheet made of a ceramic material having no opening, and A step of forming a connection land using an Au-based conductor material corresponding to the terminal of the bare chip electronic component; and, after performing the above two steps, laminating a predetermined green sheet to form a wiring conductor on the surface. And a step of forming a laminate having the concave portion, a step of firing the laminate in a neutral or oxidizing atmosphere to form a fired body, Forming a Cu-based conductor material film on a portion of the wiring conductor exposed to the surface to be soldered, followed by firing in a neutral or reducing atmosphere to form the multilayer circuit board; and A step of soldering a circuit component to the portion to be soldered; and a step of mounting the bare chip electronic component in a concave portion of the multilayer circuit board.

According to the method of manufacturing the hybrid module, the ceramic green sheet in which the inner and surface wiring conductors are formed of an Ag-based conductor material, the ceramic green sheet in which the opening corresponding to the recess is formed, and the bottom surface of the recess After laminating and firing a predetermined number of ceramic green sheets on which connection lands are formed using Au-based conductor materials corresponding to the terminals of the bare chip electronic component at the corresponding positions, the surface wiring conductors are soldered. By forming a Cu-based conductor material film only in a portion and firing it, a ceramic multilayer circuit board having a concave portion is formed. By soldering and mounting circuit components on the circuit board, and mounting a bare chip electronic component in the concave portion. A hybrid module is created. According to this manufacturing method, the inner layer and the surface wiring conductor can be simultaneously fired, so that the number of steps and the cost can be reduced. Furthermore, since the Cu-based conductor material is fired in a neutral or reducing atmosphere after the Ag-based conductor material is fired in a neutral or oxidizing atmosphere, oxidation of the Cu-based conductor material can be prevented.

A fourth manufacturing method is a method for manufacturing a hybrid module having a multilayer circuit board having a recess formed therein, and a bare chip electronic component mounted in the recess, wherein an opening corresponding to the recess is provided. Forming a wiring conductor by using an Ag-based conductor material on a green sheet made of a ceramic material having no and a green sheet made of a ceramic material having no opening, and forming the wiring sheet at a corresponding position of the green sheet serving as the bottom surface of the recess. A step of forming a connection land using an Au-based conductor material corresponding to the terminal of the bare chip electronic component; and, after performing the above two steps, laminating a predetermined green sheet to form a wiring conductor on the surface. And a step of forming a laminate having the concave portion, a step of firing the laminate in a neutral or oxidizing atmosphere, and after the firing step, Forming a wiring conductor using an Ag-based conductor material on the surface of the layered body, firing in a neutral or oxidizing atmosphere to form a fired body, and soldering the wiring conductor exposed on the surface of the fired body. Forming a Cu-based conductor material film on a portion to be attached, firing in a neutral or reducing atmosphere to form a multilayer circuit board, and soldering circuit components to the portion to be soldered on the surface of the multilayer circuit board. And mounting the bare chip electronic component in a concave portion of the multilayer circuit board.

According to the method of manufacturing the hybrid module, the ceramic green sheet in which the wiring conductor of only the inner layer is formed of the Ag-based conductor material, the ceramic green sheet in which the opening corresponding to the recess is formed, and the bottom surface of the recess are formed. After a predetermined number of ceramic green sheets having connection lands formed thereon using an Au-based conductor material corresponding to the terminals of the bare chip electronic component are laminated and fired at corresponding positions, the surface-layer wiring conductor is replaced with an Ag-based conductor material. This is fired, and further, a Cu-based conductor material film is formed only on the portion of the surface wiring conductor to be soldered and fired to form a ceramic multilayer circuit board, and circuit components are formed on the circuit board. A hybrid module is created by soldering and mounting a bare chip electronic component in the recess. . In this manufacturing method, the dimensional accuracy of the surface wiring conductor is increased because the surface wiring conductor is formed after the green sheet laminate is fired once.
Furthermore, since the Cu-based conductor material is fired in a neutral or reducing atmosphere after the Ag-based conductor material is fired in a neutral or oxidizing atmosphere, oxidation of the Cu-based conductor material can be prevented.

In the first to fourth manufacturing methods, before the step of forming a Cu-based conductor material film on a portion of the wiring conductor to be soldered is carried out, By providing a step of forming a RuO ₂ -based resistor connected to a conductor and firing in an oxidizing atmosphere, a highly reliable resistor can be formed on the circuit board at the same time when the circuit board is formed.

Further, when soldering a circuit component to the above-mentioned soldering target portion, a high-temperature solder containing a large amount of Sn and having a high melting point is used, so that the produced hybrid module is soldered to the parent circuit board. At this time, the high-temperature solder connecting the circuit components mounted on the module does not melt, and the circuit components do not move.

[0033]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view showing a hybrid module according to a first embodiment of the present invention. In the figure, reference numeral 10 denotes a hybrid module, which is configured by mounting a plurality of chip-like circuit components 12 on a circuit board 11 on which a circuit pattern is formed by wiring conductors.

The circuit board 11 is a multilayer board made of a rectangular parallelepiped ceramic insulating material. A wiring conductor 111 is formed on the inner layer and the surface of the circuit board 11 using a silver (Ag) -based conductor material. Circuit Parts 1 in Japan
A portion 112 to be soldered (hereinafter referred to as a land) 112
Has a copper (Cu) -based conductive material film 113 formed on the surface of Ag.

The chip-like circuit component 12 is made of tin (S
n) rich Sn-rich system (for example, Sn95, S
b5) High-temperature solder 115 (having a melting point of 190 ° C. or higher) is conductively connected to the land 112. Furthermore, the portion of the surface layer of the circuit board 11 other than the portion where the circuit components are soldered is covered with the overcoat glass 13.

Next, a method of manufacturing the hybrid module having the above-described configuration will be described with reference to FIG. First,
Forming a green sheet 21 made of a ceramic insulating material such as SiO ₂ , Al ₂ O ₃ , B ₂ O ₃ , MgO, CaO,
A hole is formed in a required portion of the green sheet 21 by using a die, punching, or laser to form a via hole 22.

Thereafter, an inner conductor and a surface conductor (including conductor filling in each via hole) are formed on the green sheet 21 having the via hole 22 formed thereon by an Ag-based conductor material 23 by screen printing. This is the wiring conductor 111 described above.

Next, the green sheets 21 on which the Ag-based conductor material 23 is printed are laminated in a predetermined order and pressed, and then placed in a batch furnace at 600 to 700 ° C. in an oxidizing atmosphere.
After performing the binder removal treatment at (peak temperature), firing is performed in a belt furnace at a temperature of 850 to 930 ° C. (peak temperature) in the same oxidizing atmosphere.

Thereafter, the Cu-based conductor material 24 is applied only to the portion of the surface wiring conductor 111 to be soldered (land 112).
Is screen-printed and fired in a reducing atmosphere at 580 to 630 ° C.

After this firing, an overcoat glass 25 is formed on the component mounting surface by screen printing,
It is fired in a reducing atmosphere at ~ 600 ° C.

Next, Sn is applied to the land 112 on the component mounting surface.
A high temperature cream solder 26 of a rich type (for example, Sn95, Sb5) is screen-printed, and the chip-shaped circuit components 12 such as a resistor, an inductor, and a capacitor are mounted, and 260 ° C.
After reflow at (peak temperature), it is washed to create a hybrid module.

According to the aforementioned hybrid module,
Since the Cu-based conductor material film 113 is formed only on the land 112 of the wiring conductor 111 on the surface of the circuit board 11 on the surface of the Ag-based conductor material, solder erosion occurs when the chip-shaped circuit component 12 is soldered. In addition, since the Cu-based conductor material and the solder generate a compound such as Cu ₃ Sn, the solder wettability is improved, and the occurrence of positional displacement, standing failure, and the like of the chip-shaped circuit component 12 is prevented. Can be.

Further, at the land 112 of the wiring conductor 111, the Ag-based conductor material and the Cu-based conductor material are firmly joined by the glass frit component contained in both conductors.
Reliability can be improved.

Furthermore, since a ceramic circuit board is used as the circuit board 11, good bonding strength between the ceramic and the Ag-based conductor material can be obtained, and the reliability can be further improved.

Since the land 112 of the wiring conductor 111 and the chip-shaped circuit component 12 are connected to each other by high-temperature solder having a melting point of 190 ° C. or more, the hybrid module thus manufactured has a melting point of 183 ° C. When soldering to the parent circuit board using crystal solder, the high-temperature solder connecting the chip-shaped circuit components 12 mounted on the hybrid module 10 does not melt, so that the chip-shaped circuit components 12 do not move. .

Further, according to the above manufacturing method, after the Ag-based conductor material is fired in a neutral or oxidizing atmosphere,
u-based conductor material is fired in a neutral or reducing atmosphere,
Since the Au conductor is formed on the u land and baked in a neutral or reducing atmosphere, an antioxidant film is formed on the surface of the Cu-based conductor material, so that oxidation of the Cu-based conductor material can be prevented.

Further, since the wiring conductors 111 in the inner layer and the surface layer can be fired at the same time, the number of steps and the cost can be reduced.

Next, a second embodiment of the present invention will be described. FIG. 3 is a side sectional view showing the hybrid module according to the second embodiment. In the figure, the same components as those in the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted. The difference between the second embodiment and the first embodiment is that the thick film resistor 15 connected to the wiring conductor 111 is formed on the upper surface of the circuit board 11.

A method for manufacturing the hybrid module having the above-described structure is as shown in FIG. That is, first, SiO ₂ , A
A green sheet 21 made of a ceramic insulating material such as l ₂ O ₃ , B ₂ O ₃ , MgO, CaO or the like is formed, and a hole is formed in a required portion of the green sheet 21 by using a mold, punching or laser, and a via hole is formed. 22 is formed.

Thereafter, the inner layer conductor and the surface layer conductor (including the conductor filling into each via hole) are formed on the green sheet 21 in which the via hole 22 is formed by the Ag-based conductor material 23 by screen printing.

Next, the green sheets 21 on which the Ag-based conductor material 23 is printed are laminated in a predetermined order and pressed, and then placed in a batch furnace at 600 to 700 ° C. in an oxidizing atmosphere.
After performing the binder removal treatment at (peak temperature), firing is performed in a belt furnace at a temperature of 850 to 930 ° C. (peak temperature) in the same oxidizing atmosphere.

After this firing, a RuO ₂ -based resistor material 27 was screen-printed on the surface of the fired body,
Bake in air at 850 ° C. Thereby, the thick film resistor 15 can be formed on the surface.

Next, the Cu-based conductor material 24 is screen-printed only on the portion to be soldered (land 112) of the surface wiring conductor 111, and is fired in a reducing atmosphere at 580 to 630 ° C.

After this firing, an overcoat glass 25 is formed on the component mounting surface by screen printing,
It is fired in a reducing atmosphere at ~ 600 ° C.

Next, Sn is applied to the land 112 on the component mounting surface.
A high temperature cream solder 26 of a rich type (for example, Sn95, Sb5) is screen-printed, and the chip-shaped circuit components 12 such as a resistor, an inductor, and a capacitor are mounted, and 260 ° C.
After reflow at (peak temperature), it is washed to create a hybrid module.

According to the above-described hybrid module and its manufacturing method, the same effects as those of the first embodiment can be obtained, and the thick film resistor 15 having high reliability can be easily formed.

The wiring conductor 111 and the thick film resistor 15 may be formed by simultaneous firing.

Next, a third embodiment of the present invention will be described. FIG. 5 is a side sectional view showing a hybrid module according to the third embodiment. In the figure, the same components as those in the first embodiment described above are denoted by the same reference numerals, and description thereof will be omitted. The difference between the third embodiment and the first embodiment is that the bare chip electronic component 14 is mounted on the upper surface of the circuit board 11.

Bare chip electronic component 14 on circuit board 11
Is a land made of a gold (Au) -based conductor material.
The bare chip electronic component 1 is formed on the land 114.
4 is flip-chip mounted.

A method for manufacturing the hybrid module having the above-described structure is as shown in FIG. That is, first, SiO ₂ , A
A green sheet 21 made of a ceramic insulating material such as l ₂ O ₃ , B ₂ O ₃ , MgO, CaO or the like is formed, and a hole is formed in a required portion of the green sheet 21 by using a mold, punching or laser, and a via hole is formed. 22 is formed.

After that, the inner layer conductor and the surface layer conductor (including the conductor filling into each via hole) are formed on the green sheet 21 having the via hole 22 formed thereon by the Ag-based conductor material 23 by screen printing. This is the wiring conductor 111 described above.

Further, at the mounting position of the bare chip electronic component 14 on the green sheet 21, an Au-based conductor material 28 to be the land 114 is formed by screen printing.

Next, the green sheets 21 on which the Ag-based conductor material 23 or the Au-based conductor material 28 are printed are laminated in a predetermined order and pressed, and then placed in a batch furnace at 600 to 700 ° C. in an oxidizing atmosphere (peak temperature). Temperature), and then 850-930 in an oxidizing atmosphere.
Baking is performed in a belt furnace at a temperature of ° C. (peak temperature).

Thereafter, the Cu-based conductor material 24 is applied only to the soldering target portion (land 112 portion) of the surface wiring conductor 111.
Is screen-printed and fired in a reducing atmosphere at 580 to 630 ° C.

After this firing, an overcoat glass 25 is formed on the component mounting surface by screen printing.
It is fired in a reducing atmosphere at ~ 600 ° C.

Next, Sn is applied to the land 112 on the component mounting surface.
A high temperature cream solder 26 of a rich type (for example, Sn95, Sb5) is screen-printed, and the chip-shaped circuit components 12 such as a resistor, an inductor, and a capacitor are mounted, and 260 ° C.
After the reflow at (peak temperature), this is washed, and the bare chip electronic component 14 is mounted to produce a hybrid module.

According to the above-described hybrid module and its manufacturing method, the same effects as those of the first embodiment can be obtained, and the Au land 114 for the bare chip electronic component 14 can be obtained.
Can be formed simultaneously with the firing of the circuit board 11.

If there is a problem in firing the laminate of the green sheets 21 and the Au-based conductor material 28 at the same time, the Au-based conductor material 28 is formed by screen printing after firing the laminate of the green sheets 21. And firing. At this time, if the thick film resistor 15 is not present, A is required before forming the Cu-based conductor material 24 for reinforcing the land 112.
The pattern of the u-type conductor material 28 is formed, and the thick film resistor 15 is formed.
Is provided, a pattern of the Au-based conductor material 28 is formed before the thick film resistor 15 is formed.

Next, a fourth embodiment of the present invention will be described. FIG. 7 is a side sectional view showing the hybrid module of the fourth embodiment. In the figure, the same components as those in the third embodiment described above are denoted by the same reference numerals, and description thereof will be omitted. The fourth embodiment differs from the third embodiment in that a concave portion 11a is provided at a predetermined position of the circuit board 11, and a bare chip electronic component 14 is mounted inside the concave portion 11a.

When this hybrid module is manufactured, as shown in FIG. 8, openings 21a corresponding to the concave portions 11a are formed in a predetermined number of green sheets 21 formed in the concave portions 11a, and these green sheets 21 are formed. Green sheet 21
Should be laminated.

By providing the concave portion 11a on the circuit board 11 and mounting the bare chip electronic component 14 in the concave portion 11a, the size of the hybrid module 10 can be reduced.

Next, a fifth embodiment of the present invention will be described. The configuration of the hybrid module according to the fifth embodiment is the same as that of the above-described first embodiment, and only the manufacturing method is different.

In the fifth embodiment, the green sheet 21
After baking the laminate, a surface wiring conductor was formed.

That is, as shown in FIG. 8, first, SiO ₂ ,
A green sheet 21 made of a ceramic insulating material such as Al ₂ O ₃ , B ₂ O ₃ , MgO, CaO or the like is formed, and a hole is formed in a required portion of the green sheet 21 by using a die, punching or laser. 22 is formed.

Thereafter, an inner layer conductor (including conductor filling in each via hole) is formed on the green sheet 21 in which the via hole 22 is formed, using an Ag-based conductor material 23 by screen printing. This becomes the inner layer wiring conductor 111.

Next, the green sheets 21 on which the Ag-based conductor material 23 is printed are laminated in a predetermined order and pressed to form a laminate in which the Ag-based conductor material 23 is not formed on the surface layer.

Next, the laminate is placed in a batch furnace and subjected to a binder removal treatment in an oxidizing atmosphere at 600 to 700 ° C. (peak temperature).
The firing is performed in a belt furnace at a temperature of 930 ° C. (peak temperature).

Further, a surface layer conductor (including conductor filling in each via hole) is formed by screen printing, and then placed in a batch furnace and fired in an oxidizing atmosphere at a temperature of 850 to 930 ° C. (peak temperature). This enables the surface wiring conductor
111 is formed.

Thereafter, the Cu-based conductor material 24 is applied only to the portion of the surface wiring conductor 111 to be soldered (land 112).
Is screen-printed and fired in a reducing atmosphere at 580 to 630 ° C.

After this firing, an overcoat glass 25 is formed on the component mounting surface by screen printing,
It is fired in a reducing atmosphere at ~ 600 ° C.

Next, Sn is applied to the land 112 on the component mounting surface.
A high temperature cream solder 26 of a rich type (for example, Sn95, Sb5) is screen-printed, and the chip-shaped circuit components 12 such as a resistor, an inductor, and a capacitor are mounted, and 260 ° C.
After reflow at (peak temperature), it is washed to create a hybrid module.

According to the above-described hybrid module and the method of manufacturing the same, although the number of manufacturing steps is increased as compared with the first embodiment, the same effects as in the first embodiment can be obtained, and the surface of the circuit board 11 can be obtained. Land formed on
Since the position of 112 can be set with high accuracy, the chip-shaped circuit components 12 can be mounted at short intervals without short-circuiting.

When the hybrid modules of the second to fourth embodiments are manufactured, the wiring conductors (A
After firing the green sheet laminate on which the g-based conductor material 23) is formed, the surface wiring conductor (Ag-based conductor material 2)
If 3) is formed, the position of the land 112 formed on the surface of the circuit board 11 can be similarly set with high accuracy.

In the first to fourth embodiments described above, a hybrid module using a ceramic multilayer circuit board is formed. However, a circuit board made of a material other than ceramic may be used. It goes without saying that substantially the same effect can be obtained even with a circuit board.

[0085]

As described above, according to the hybrid module of the first aspect of the present invention, only the soldering portion of the wiring conductor on the surface of the circuit board has the C-based material on the surface of the Ag-based material.
Since the u-based conductor material film is formed, solder erosion does not occur when soldering circuit parts, and Cu
Since the system conductor material and the solder generate a compound such as Cu ₃ Sn, the solder wettability is improved, and it is possible to prevent the occurrence of positional displacement and standing failure of the circuit component. Further, since the Ag-based conductor material and the Cu-based conductor material are firmly joined at the soldered portion of the wiring conductor by the glass frit component contained in both conductors, reliability can be improved.

According to the hybrid module of the second aspect, in addition to the effect of the first aspect, by using a ceramic circuit board as the circuit board, good bonding strength between the ceramic and the Ag-based conductor material is obtained. Is obtained, and the reliability can be further improved.

According to the hybrid module of the third aspect, in addition to the effect of the first aspect, the soldered portion of the wiring conductor and the circuit component are connected by the solder containing a large amount of Sn. Therefore, a large amount of the above-mentioned compounds such as Cu ₃ Sn are generated, and the solder wettability is further improved.

According to the hybrid module of the fourth aspect, in addition to the effect of the first aspect, the soldering portion of the wiring conductor and the circuit component are connected by a high-temperature solder having a melting point temperature of 190 ° C. or more. Therefore, when the hybrid module is soldered to the parent circuit board by eutectic solder having a melting point of 183 ° C., the high-temperature solder connecting the circuit components mounted on the module does not melt.
The circuit components do not move, and the reliability when mounted on the parent circuit board can be improved.

According to the hybrid module of the fifth aspect, in addition to the effect of the first aspect, a bare chip electronic device is provided in the recess by using a ceramic multilayer circuit board having at least one recess as the circuit board. Since the components are mounted, the size of the module can be reduced.

Further, according to the method of manufacturing a hybrid module according to the sixth aspect, after the Ag-based conductor material is fired in a neutral or oxidizing atmosphere, the Cu-based conductor material is fired in a neutral or reducing atmosphere. Therefore, oxidation of the Cu-based conductor material can be prevented. Further, when the circuit board has a multilayer structure, the wiring conductors in the inner layer and the surface layer can be simultaneously fired, so that the number of steps and the cost can be reduced.
Furthermore, since the Cu-based conductor material film is formed only on the surface of the Ag-based material on the soldering target portion of the wiring conductor on the circuit board surface, solder erosion may occur when soldering circuit components. In addition, since the Cu-based conductor material and the solder generate a compound such as Cu ₃ Sn, the solder wettability is improved, and it is possible to prevent the occurrence of misalignment or standing failure of circuit components. Furthermore, since the Ag-based conductor material and the Cu-based conductor material are firmly joined at the soldering target portion of the wiring conductor by the glass frit component contained in both conductors, reliability can be improved.

According to the method for manufacturing a hybrid module according to the seventh aspect, the laminate of the green sheets is formed in one piece.
Since the surface wiring conductors are formed after repeated firing, the dimensional accuracy of the surface wiring conductors is increased, and the circuit components can be mounted at narrow intervals. Furthermore, since the Cu-based conductor material is fired in a neutral or reducing atmosphere after the Ag-based conductor material is fired in a neutral or oxidizing atmosphere, oxidation of the Cu-based conductor material can be prevented. Further, only the portion of the wiring conductor on the surface of the circuit board to be soldered has A
Since the Cu-based conductor material film is formed on the surface of the g-based material, no solder erosion occurs when soldering the circuit components, and the Cu-based conductor material and the solder are formed of a compound such as Cu ₃ Sn. Since it is generated, the solder wettability becomes good, and it is possible to prevent the occurrence of positional deviation, standing failure, and the like of the circuit component. Furthermore, since the Ag-based conductor material and the Cu-based conductor material are firmly joined at the soldering target portion of the wiring conductor by the glass frit component contained in both conductors, reliability can be improved.

Further, according to the method for manufacturing a hybrid module according to the eighth aspect, since the wiring conductors in the inner layer and the surface layer can be fired simultaneously, the number of steps and the cost can be reduced. Furthermore, since the Cu-based conductor material is fired in a neutral or reducing atmosphere after the Ag-based conductor material is fired in a neutral or oxidizing atmosphere, oxidation of the Cu-based conductor material can be prevented. Furthermore, since the Cu-based conductor material film is formed only on the surface of the Ag-based material on the soldering target portion of the wiring conductor on the circuit board surface, solder erosion may occur when soldering circuit components. In addition, since the Cu-based conductor material and the solder generate a compound such as Cu ₃ Sn, the solder wettability is improved, and it is possible to prevent the occurrence of misalignment or standing failure of circuit components. Furthermore, since the Ag-based conductor material and the Cu-based conductor material are firmly joined at the soldering target portion of the wiring conductor by the glass frit component contained in both conductors, the reliability can be improved. Furthermore, a ceramic multilayer circuit board having one or more recesses is configured as the circuit board, and bare chip electronic components are mounted in the recesses, so that the module shape can be downsized.

Further, according to the method for manufacturing a hybrid module according to the ninth aspect, the green sheet laminate is formed as one green sheet.
Since the surface wiring conductors are formed after repeated firing, the dimensional accuracy of the surface wiring conductors is increased, and the circuit components can be mounted at narrow intervals. Furthermore, since the Cu-based conductor material is fired in a neutral or reducing atmosphere after the Ag-based conductor material is fired in a neutral or oxidizing atmosphere, oxidation of the Cu-based conductor material can be prevented. Further, only the portion of the wiring conductor on the surface of the circuit board to be soldered has A
Since the Cu-based conductor material film is formed on the surface of the g-based material, no solder erosion occurs when soldering the circuit components, and the Cu-based conductor material and the solder are formed of a compound such as Cu ₃ Sn. Since it is generated, the solder wettability becomes good, and it is possible to prevent the occurrence of positional deviation, standing failure, and the like of the circuit component. Furthermore, since the Ag-based conductor material and the Cu-based conductor material are firmly joined at the soldering target portion of the wiring conductor by the glass frit component contained in both conductors, reliability can be improved. Furthermore, a ceramic multilayer circuit board having one or more recesses is configured as the circuit board, and bare chip electronic components are mounted in the recesses, so that the module shape can be downsized.

According to the method for manufacturing a hybrid module according to the tenth aspect, in addition to the effects of the above-described manufacturing method, before forming a Cu-based conductive material film on a portion of the wiring conductor to be soldered, Since the RuO ₂ -based resistor to be connected to the wiring conductor is formed and fired in an oxidizing atmosphere, a highly reliable resistor can be formed on the circuit board at the same time when the circuit board is formed.

According to the method for manufacturing a hybrid module according to the eleventh aspect, in addition to the effect of the above-described manufacturing method, when the circuit component is soldered to the portion to be soldered, the melting point containing a large amount of Sn is obtained. Since high-temperature high-temperature solder is used, when soldering the created hybrid module to the parent circuit board, the high-temperature solder connecting the circuit components mounted on the module does not melt, and the circuit components are not melted. Since there is no movement, the reliability at the time of mounting on the parent circuit board can be improved.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing a hybrid module according to a first embodiment of the present invention.

FIG. 2 is a diagram illustrating a method for manufacturing a hybrid module according to the first embodiment of the present invention.

FIG. 3 is a side sectional view showing a hybrid module according to a second embodiment of the present invention.

FIG. 4 is a diagram illustrating a method for manufacturing a hybrid module according to a second embodiment of the present invention.

FIG. 5 is a side sectional view showing a hybrid module according to a third embodiment of the present invention.

FIG. 6 is a diagram illustrating a method for manufacturing a hybrid module according to a third embodiment of the present invention.

FIG. 7 is a side sectional view showing a hybrid module according to a fourth embodiment of the present invention.

FIG. 8 is a diagram illustrating a method for forming a concave portion according to a fourth embodiment of the present invention.

FIG. 9 is a diagram illustrating a method for manufacturing a hybrid module according to a fifth embodiment of the present invention.

[Explanation of symbols]

10 hybrid module, 11 circuit board, 11
a: concave portion, 12: chip-shaped circuit component, 13: overcode glass, 14: bare chip electronic component, 15: thick film resistor, 21: green sheet, 21a: opening, 22:
Via hole, 23: Ag-based conductor material, 24: Cu-based conductor material, 25: Overcoat glass, 26: Sn-rich high-temperature cream solder, 27: Resistor material, 28: Au-based conductor material, 111: Wiring conductor, 112: land (soldering portion), 113: Cu-based conductor material film, 114: land, 115: S
n-rich high-temperature solder.

Claims (11)

[Claims] 1. A hybrid module comprising a circuit board, a wiring conductor formed on the circuit board, and a circuit component soldered and mounted on the circuit board, and mounted and used on a parent circuit board. In the above, the wiring conductor is made of a silver (Ag) -based material, and a copper (Cu) -based conductor material film is formed on the surface of the silver (Ag) -based material only at a soldered portion on the circuit board surface. A hybrid module characterized by the following. 2. The hybrid module according to claim 1, wherein said circuit board is a ceramic circuit board. 3. The hybrid module according to claim 1, wherein the circuit component is connected to a soldered portion of the wiring conductor by a solder containing a large amount of tin (Sn). 4. The hybrid module according to claim 1, wherein the circuit component is connected to a soldered portion of the wiring conductor by a high-temperature solder having a melting point temperature of 190 ° C. or higher. 5. The hybrid module according to claim 1, wherein the circuit board is a ceramic multilayer circuit board having at least one recess, and a bare chip electronic component is mounted in the recess. 6. A hybrid module comprising a circuit board, a wiring conductor formed on the circuit board, and a circuit component soldered and mounted on the circuit board, and mounted and used on a parent circuit board. Forming a wiring conductor on a green sheet made of a ceramic insulating material using a silver (Ag) -based conductor material; and after performing this step, laminating a predetermined green sheet to form a wiring on the surface. Forming a laminated body on which a conductor for forming is formed, firing the laminated body in a neutral or oxidizing atmosphere to form a fired body, and soldering the wiring conductor exposed on the surface of the fired body. After forming a copper (Cu) -based conductor material film on the part,
A method for producing a hybrid module, comprising: firing in a neutral or reducing atmosphere to form the circuit board; and soldering a circuit component to the soldering target portion on the surface of the circuit board. . 7. A hybrid module comprising a circuit board, a wiring conductor formed on the circuit board, and a circuit component soldered and mounted on the circuit board, and mounted and used on a parent circuit board. Forming a wiring conductor on a green sheet made of a ceramic insulating material using a silver (Ag) -based conductor material; and after performing this step, laminating a predetermined green sheet to form a wiring on the surface. Forming a laminate in which no conductor is formed; firing the laminate in a neutral or oxidizing atmosphere; and using a silver (Ag) -based conductor material on the surface of the laminate after the firing step. Forming a wiring conductor by heating and baking in a neutral or oxidizing atmosphere to form a fired body; and forming a copper (Cu) -based conductor material on a portion of the wiring conductor exposed on the surface of the fired body to be soldered Shape the membrane After,
Manufacturing a hybrid module, comprising: a step of firing in a neutral or reducing atmosphere to form a multilayer circuit board; and a step of soldering a circuit component to the portion to be soldered on the surface of the multilayer circuit board. Method. 8. A multilayer circuit board having at least one recess formed therein, a wiring conductor formed on the multilayer circuit board, a circuit component soldered and mounted on the multilayer circuit board, and And a bare chip electronic component mounted on the main circuit board, the hybrid module being used on a parent circuit board, wherein the green sheet made of a ceramic material having an opening corresponding to the concave portion and the opening are not provided. Forming a wiring conductor using a silver (Ag) -based conductor material on a green sheet made of a ceramic material; and forming a gold ( Forming a connection land using an Au) -based conductor material; and, after performing the above two steps, laminating a predetermined green sheet to form a wiring conductor on the surface. Forming a laminated body having a body and having the concave portion; firing the laminated body in a neutral or oxidizing atmosphere to form a fired body; and the wiring conductor exposed on the surface of the fired body. After forming a copper (Cu) -based conductive material film on the portion to be soldered in
Baking in a neutral or reducing atmosphere to form the multilayer circuit board; soldering a circuit component to the portion to be soldered on the surface of the multilayer circuit board; Mounting a bare chip electronic component. 9. A multilayer circuit board having at least one recess formed therein, a wiring conductor formed on the multilayer circuit board, a circuit component soldered and mounted on the multilayer circuit board, and And a bare chip electronic component mounted on the main circuit board, the hybrid module being used on a parent circuit board, wherein the green sheet made of a ceramic material having an opening corresponding to the concave portion and the opening are not provided. Forming a wiring conductor using a silver (Ag) -based conductor material on a green sheet made of a ceramic material; and forming a gold ( Forming a connection land using an Au) -based conductor material; and, after performing the above two steps, laminating a predetermined green sheet to form a wiring conductor on the surface. Forming a laminate in which a body is not formed and having the concave portion; baking the laminate in a neutral or oxidizing atmosphere; and, after the baking step, forming a silver (Ag) -based material on the surface of the laminate. A step of forming a wiring conductor using a conductive material, firing in a neutral or oxidizing atmosphere to form a fired body, and forming a copper (Cu) on a portion to be soldered of the wiring conductor exposed on the surface of the fired body. ) After forming the system conductor material film,
Baking in a neutral or reducing atmosphere to form a multilayer circuit board, soldering a circuit component to the soldering target portion on the surface of the multilayer circuit board, and mounting the bare chip in a concave portion of the multilayer circuit board. And a step of mounting an electronic component. 10. A step of forming a RuO ₂ -based resistor to be connected to the wiring conductor on the surface of the fired body and firing the same in an oxidizing atmosphere, and after performing this step, soldering the wiring conductor 10. The method for manufacturing a hybrid module according to claim 6, wherein a step of forming a copper (Cu) -based conductor material film on a portion to be attached is performed. 11. The step of soldering a circuit component to a portion to be soldered is performed by using a high-temperature solder containing a large amount of tin (Sn) and having a high melting point. , 7, 8 or 9.