JPH07131072A - Surface mounting type side light emitting device, light emitting device using the same, and liquid crystal display device using the light emitting device - Google Patents
Surface mounting type side light emitting device, light emitting device using the same, and liquid crystal display device using the light emitting deviceInfo
- Publication number
- JPH07131072A JPH07131072A JP5271634A JP27163493A JPH07131072A JP H07131072 A JPH07131072 A JP H07131072A JP 5271634 A JP5271634 A JP 5271634A JP 27163493 A JP27163493 A JP 27163493A JP H07131072 A JPH07131072 A JP H07131072A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- emitting device
- mounting
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Led Device Packages (AREA)
- Liquid Crystal (AREA)
Abstract
(57)【要約】
【目的】 側面発光用の発光器、およびこの発光器を利
用した発光装置、ならびに液晶表示装置を提供すること
を目的とする。
【構成】 LED素子を内蔵した正六面体形状の本体
と、この本体の一つの面に発光窓部を形成する一方、前
記発光窓部を形成する面およびこの面と対向する面を除
く面を実装面とし、当該実装面の外周辺部に一対の電極
を形成してなる面実装型側面発光器を基本構造とする。
この面実装型側面発光器を発光装置または液晶表示装置
用のバックライトとして使用する場合には、透光性の板
状体の端面に前記面実装型側面発光器を配置する。
(57) [Summary] [Object] It is an object to provide a light-emitting device for side surface light emission, a light-emitting device using the light-emitting device, and a liquid crystal display device. A regular hexahedron-shaped main body containing an LED element, and a light emitting window portion formed on one surface of the main body, and a surface excluding the surface forming the light emitting window portion and a surface facing the surface are mounted. The basic structure is a surface-mounting side surface light-emitting device which has a pair of electrodes formed on the outer peripheral portion of the mounting surface.
When the surface-mounting side light-emitting device is used as a backlight for a light-emitting device or a liquid crystal display device, the surface-mounting side-lighting device is arranged on the end face of a translucent plate.
Description
【産業上の利用分野】本発明は、面実装型側面発光器、
および、これを用いた発光装置、ならびにこの発光装置
を用いた液晶表示装置に関し、詳しくは側面発光器を液
晶表示装置などの発光装置に組み込むことに適するよう
に構成したものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type side light emitter,
The present invention also relates to a light emitting device using the same and a liquid crystal display device using the light emitting device, and more particularly, to a device configured so that a side surface light emitter is suitable for being incorporated in a light emitting device such as a liquid crystal display device.
【従来の技術】従来、側面発光専用の発光器が存在しな
かったため、側面発光させようとする場合には、(A)
実開昭61−42868号、(B)実開昭61−575
48号に開示される発光器に改良工夫をして側面側に発
光するように使用するのが一般的であった。すなわち、
前記(A)の面発光器は、図11ないし図14に示すよ
うに、LED素子を樹脂封止した本体50と、この本体
50の両側面50Aからアノ−ド電極リ−ド51とカソ
−ド電極リ−ド51を導出してなり、両電極51を基板
Kに実装し通電すると上方に向かって発光するものであ
る。このような面発光器を側面から発光させる場合に
は、図12、13に示すように実装する基板Kに収納凹
部K1を形成し、この凹部K1に前記本体50を収納し
て側面から発光するように設けられていた。また、前記
(B)の発光器のようなLEDランプ60を側面発光用
として使用する場合は、図15に示すようにL字状のリ
−ド保持用の案内通路を有するホルダ−61を用い、こ
のホルダ−61によってLEDランプ60のリ−ド60
Aを曲げた状態で固定し側面発光用に改良して使用して
いた。2. Description of the Related Art Conventionally, there has not been a light emitting device exclusively for side light emission.
No. 61-42868, (B) No. 61-575
It was general to improve the light emitting device disclosed in No. 48 and use it so as to emit light to the side surface side. That is,
As shown in FIGS. 11 to 14, the surface emitting device (A) has a main body 50 in which an LED element is resin-sealed, and both side surfaces 50A of the main body 50 are connected to an anode electrode lead 51 and a cathode. The lead electrode lead 51 is led out, and when both electrodes 51 are mounted on the substrate K and electricity is applied, light is emitted upward. When such a surface light-emitting device emits light from the side surface, as shown in FIGS. 12 and 13, a housing recess K1 is formed in the substrate K to be mounted, and the main body 50 is housed in this recess K1 to emit light from the side surface. Was provided. When the LED lamp 60 such as the light emitter of (B) is used for side surface light emission, a holder 61 having an L-shaped guide passage for holding a lead is used as shown in FIG. , The holder 60 of the LED lamp 60 lead 60
It was fixed in the bent state of A and used for improving side light emission.
【発明が解決しようとする課題】上記従来のものでは、
例えば(A)の場合であれば実装する基板Kに収納凹部
K1を形成する必要があるばかりか、基板Kには両リ−
ド51、51の2点のみで半田などで固定するものであ
るから、両リ−ド51、51が導出される方向を回転軸
とする回転方向の保持力が低く、図11のように膨出レ
ンズ52を形成し、この膨出レンズ52と前記両リ−ド
51、51との3点支持にするなどの工夫を施さなけれ
ばならない不都合があった。そして、このような側面発
光器を用いて、例えば液晶表示装置のバックライトを作
成しようとする場合、図14に示すように板状のレンズ
体53の側部に前記側面発光器が配置されるが、前記膨
出レンズ52をレンズ体53の側部に配置するだけでは
レンズ体53の内部に光を効率的に導出できない問題か
ら、レンズ体53の側部に前記膨出レンズ52を収納す
るための凹部54をわざわざ設ける必要があった。ま
た、(B)の場合では、専用のホルダ−61が必要とな
るばかりか、このホルダ−61に組み込むために別の製
造工程を必要する問題があった。また、このような組み
込み工程は組み込みが複雑なため人手で行われるのが一
般的であった。本発明は、上記問題を解決し、新規に側
面発光専用の発光器を提供することを目的とする。SUMMARY OF THE INVENTION In the above conventional one,
For example, in the case of (A), not only is it necessary to form the storage recess K1 in the board K to be mounted, but also the board K is provided with both leads.
Since it is fixed with solder or the like only at two points of the leads 51, 51, the holding force in the direction of rotation about the direction in which both the leads 51, 51 are led out is low, and as shown in FIG. There is an inconvenience that it is necessary to form a projecting lens 52 and use a device such as supporting the projecting lens 52 and the leads 51, 51 at three points. When a backlight of a liquid crystal display device is to be created using such a side light emitter, the side light emitter is arranged on the side of the plate-shaped lens body 53 as shown in FIG. However, the bulging lens 52 is housed on the side portion of the lens body 53 because the light cannot be efficiently guided to the inside of the lens body 53 only by disposing the bulging lens 52 on the side portion of the lens body 53. It was necessary to purposely provide the concave portion 54 for this. Further, in the case of (B), there is a problem that not only the dedicated holder-61 is required, but also another manufacturing process is required for incorporating the holder-61. Further, since such an assembling process is complicated, it is generally performed manually. SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and provide a novel light emitting device for side surface light emission.
【課題を解決するための手段】以上のような課題を解決
するため本願発明では、次のような技術的手段を講じて
いる。すなわち、本願の請求項1に記載した面実装型側
面発光器は、LED素子を内蔵した正六面体形状の本体
と、この本体の一つの面に発光窓部を形成する一方、前
記発光窓部を形成する面およびこの面と対向する面を除
く面を実装面とし、当該実装面の外周辺部に一対の電極
を形成してなる構成を採用してある。請求項2に記載し
た面実装型側面発光器では、請求項1に記載した両電極
を、前記発光窓部の対向面の角部から前記発光窓部に向
う前記実装面の外周辺部に沿って連続して面取箇所を形
成し、この面取箇所に前記両電極を設けてなる点に特徴
を有する。前記面取箇所(いわば切欠部)は、実装面の
外周辺部全域に設けても良いが、全域に必ずしも設ける
必要はなく前記角部から適宜長さだけ延在するように構
成しても良い。また、請求項3では、前記両電極は極性
の異なるアノ−ド電極とカソ−ド電極であって、前記発
光窓部と対向する面の外周辺部のうち、実装面と接する
辺の両角部に設けられ、前記両電極を設けた辺に対向す
る他辺の両角部にも更なる一対の電極を設けるととも
に、前記他辺の両角部に設けた電極は、その隣合う電極
が極性の異なるアノ−ドまたはカソ−ド電極となるよう
にする構成を採用してある。なお、請求項3では、全て
の電極を本体の角部に設ける構成を採用しているが、請
求項1ではこれを限定するものではなく、電極は本体の
発光窓部を形成した一側面を除く実装面と接する外周辺
部を含んで設けられれば何れの場所に設けても良いのは
いうまでもない。請求項4に記載した前記本体の実装面
には、実装用凸部を形成することに特徴づけられる。こ
の実装用凸部は実装基板に形成された凹部に嵌入して位
置決め固定するものであり、実装面の何れの場所に設け
ても良いが、請求項2のように電極を発光窓部を形成す
る一方側面と対向する側面の角部に形成する場合には、
その両電極から等間隔でかつ遠ざかる位置に設けると良
い。請求項5は、例えば液晶表示装置の発光体(バック
ライト)や単なる平板状の発光体としての発光装置に関
するものであり、請求項1ないし4のいずれかに記載の
面実装型側面発光器を、回路基板の表面に設けた透光性
板状体の端面にその発光窓部が位置するように設けてな
ることを特徴としてある。請求項6は、液晶表示装置に
関し、請求項4の発光装置を設けた同回路基板上に液晶
駆動用の半導体素子を設ける一方、前記透光性板状体の
発光側にLCDガラスを配置することを特徴としてい
る。In order to solve the above problems, the present invention takes the following technical means. That is, the surface-mounting side light-emitting device according to claim 1 of the present application has a regular hexahedron-shaped main body containing an LED element, and a light-emitting window portion formed on one surface of the main body, while the light-emitting window portion is provided. A structure is adopted in which the surface other than the surface to be formed and the surface opposite to this surface is used as a mounting surface, and a pair of electrodes is formed on the outer peripheral portion of the mounting surface. In the surface mount type side light emitter according to claim 2, the both electrodes according to claim 1 are provided along an outer peripheral portion of the mounting surface facing from the corner portion of the facing surface of the light emitting window portion to the light emitting window portion. Is characterized in that a chamfered portion is continuously formed and both electrodes are provided at this chamfered portion. The chamfered portion (so-called cutout portion) may be provided in the entire outer peripheral portion of the mounting surface, but it is not necessarily provided in the entire area and may be configured to extend from the corner portion by an appropriate length. . Further, in the present invention, the electrodes are anode electrodes and cathode electrodes having different polarities, and both corners of the side in contact with the mounting surface in the outer peripheral portion of the surface facing the light emitting window portion. A pair of electrodes is provided at both corners of the other side opposite to the side where the electrodes are provided, and the electrodes provided at the two corners of the other side have adjacent electrodes with different polarities. The structure is adopted so that it becomes an anode or cathode electrode. In addition, in Claim 3, although the structure which provides all the electrodes in the corner | angular part of a main body is employ | adopted, this is not limited to this, An electrode is one side surface which formed the light emission window part of the main body. Needless to say, it may be provided at any place as long as it is provided including the outer peripheral portion in contact with the mounting surface. The mounting surface of the main body according to claim 4 is characterized in that a mounting projection is formed. The mounting projection is fitted into a recess formed in the mounting substrate and is positioned and fixed. The mounting projection may be provided at any position on the mounting surface. When forming on the corner of the side surface facing the one side surface,
It is advisable to provide them at equal distances from the two electrodes and away from them. A fifth aspect of the present invention relates to a light emitting device (backlight) of a liquid crystal display device or a light emitting device as a mere flat plate-like light emitting device. The surface mount type side light emitting device according to any one of the first to fourth aspects is provided. It is characterized in that the light emitting window portion is provided on the end surface of the transparent plate-like body provided on the surface of the circuit board. A sixth aspect relates to a liquid crystal display device, wherein a semiconductor element for driving a liquid crystal is provided on the same circuit board provided with the light emitting device of the fourth aspect, and an LCD glass is disposed on the light emitting side of the translucent plate. It is characterized by that.
【作用】上記構成による本発明によれば、面実装型側面
発光器を実装する場合、LED素子を内蔵した正四面体
形状の本体の実装面を、実装すべき例えば回路基板の表
面に配置するとともに、この回路基板の配線パタ−ンと
実装面の外周辺部に設けた電極を接続して面実装するこ
とができる。前記発光窓部の対向面の角部から前記発光
窓部に向う前記実装面の外周辺部に沿って連続して面取
箇所を形成し、この面取箇所に前記両電極を設ければ、
面実装した際に前記回路基板と接着する接着面積を増大
するように働く。また、発光窓部を形成した一側面と対
向する側面の4角部にカソ−ド電極同士またはアノ−ド
電極同士が隣合わないように設ければ、発光窓部を形成
した一側部と連続する本体の他の面の何れの面でも実装
面として作用する。さらに、本体の実装面に実装用凸部
を形成すれば、例えば実装すべき回路基板上に実装凹部
を形成し、前記凸部を凹部に嵌入することによって面実
装型側面発光器を回路基板に位置決めすることもでき
る。そして、回路基板の表面に設けた透光性板状体の端
面に、前述した面実装型発光器の発光窓部を形成した一
側部が接するように配置することにより、前記透光性板
状体に効率的に光りを導き、透光性板状体自体を発光さ
せて発光装置として働く。また、このような発光装置
は、液晶表示装置用の発光体(バックライト)とするこ
とができる。According to the present invention having the above-described structure, when mounting a surface-mounting side light-emitting device, the mounting surface of a regular tetrahedron-shaped main body containing the LED element is arranged on the surface of a circuit board to be mounted, for example. At the same time, the wiring pattern of this circuit board can be connected to the electrodes provided on the outer peripheral portion of the mounting surface for surface mounting. If chamfered portions are continuously formed along the outer peripheral portion of the mounting surface facing the light emitting window portion from the corners of the facing surface of the light emitting window portion, and if both electrodes are provided at this chamfered portion,
It works so as to increase the adhesion area where it is adhered to the circuit board when it is surface-mounted. Further, if the cathode electrodes or the anode electrodes are provided so as not to be adjacent to each other at the four corners of the side surface facing the one side surface on which the light emitting window portion is formed, the side surface and the one side portion on which the light emitting window portion is formed are provided. Any of the other surfaces of the continuous body acts as a mounting surface. Further, if a mounting convex portion is formed on the mounting surface of the main body, for example, a mounting concave portion is formed on the circuit board to be mounted, and the convex portion is fitted into the concave portion to form the surface mounting side light emitting device on the circuit board. It can also be positioned. Then, by arranging the light-transmitting plate-shaped body provided on the surface of the circuit board so that one side portion having the light-emitting window of the above-mentioned surface-mounted light-emitting device is in contact with the end face of the light-transmitting plate, the light-transmitting plate is formed. The light efficiently guides the light to the light-transmitting plate-like body itself to emit light, thereby functioning as a light-emitting device. Further, such a light emitting device can be used as a light emitting body (backlight) for a liquid crystal display device.
【実施例】以下、本発明の好ましい実施例を、図面を参
照しつつ具体的に説明する。図1は本発明の面実装型側
面発光器を示す斜視図、図2は図1の正面図、図3は図
1の側面図、図4は図1の平面図、図5は図1の背面図
である。1は略正六面体の形状を有する面実装型側面発
光器であって、この発光器1は厚み0.8mm程度のガ
ラエポ基板5と、このガラエポ基板5に接着材で接合さ
れる厚み0.8mm程度の反射ケ−ス10とを主な構成
としている。前記ガラエポ基板5は、その4つの角部に
厚み方向に貫通する円弧状の切欠部を形成した略矩形状
(2.0mm×3.0mm)を有し、その表面にはLE
D素子2のアノ−ド側をダイボンデイングするためのア
イランド部6と、ダイボンデングしたLED素子2の表
面(カソ−ド側)とワイヤ3で接続されるボンデイング
パッド部7がそれぞれ独立して印刷焼成で設けられる一
方、前記ガラエポ基板5の切欠部にアノ−ド電極8およ
びカソ−ド電極9を設けてある。そして、アイランド部
6とアノ−ド電極8およびボンデイングパッド部7とカ
ソ−ド電極9とは、それぞれガラエポ基板5上に印刷形
成された配線パタ−ン5Aによって電気的に接続されて
いる。本実施例では8をアノ−ド電極、9をカソ−ド電
極としたが、これに限らず8をカソ−ド電極、9をアノ
−ド電極とすることも可能である。この実施例では、前
記ガラス・エポキシ材からなるガラエポ基板5を採用し
たがこれに限定されるものでなく、セラミック材などか
らなる基板も採用できるし、前述したように4つの角部
に円弧状に面取りしたものに限らず斜めに面取りしたも
のなど適宜形状を採用できる。しかしながら、4つの角
部に切欠部を設け、この切欠部の形状に沿ってアノ−ド
電極8およびカソ−ド電極9を形成し、当該両電極8、
9を半田等の導伝接着材にて回路基板KのパッドPに接
着する(図6参照)ことにより、面実装型側面発光器1
を強固に面実装することができる。すなわち、切欠部を
有するため前記面発光器1の電極8、9とパッドPとの
間に厚い半田層Hが形成できるとともに半田フィレット
も十分確保できるから、回路基板Kに対して強固に前記
面実装型側面発光器1を固定できる効果が得られるので
ある。このような切欠部は、前述のように円弧状に限ら
ず斜めに面取りしたものも採用できる。また、本実施例
では、アノ−ド電極8およびカソ−ド電極9を一対づつ
設ける構成を採用しているが、これは面実装型側面発光
器1を面実装する場合の実装可能面を2面とするためで
あり、実装可能面を1面のみとするのであれば、少なく
とも前記アノ−ド電極8とカソ−ド電極9とを実装面の
外周辺部にひとつずつ設けるだけで良い。図9および図
10に前記ガラエポ基板5の変形例を示す。図9はLE
D素子2を実装するガラエポ基板10の表面側から見た
状態を示す正面図、図10は図9の裏面側からみた背面
図である。前記ガラエポ基板5では、アノ−ド電極8と
カソ−ド電極9とが2つの実装面で同じアノ−ド電極8
同士、カソ−ド電極9同士が対向するように配置してい
るから実装面は2面しか使用できないが、この変形例の
ように電極8または9を設ける一つの角部の電極と隣合
う電極が相異なる電極となるように、前記ガラエポ基板
5の2組の対角のうち、表裏で配線パターン5Aの交差
構造(X)とすることにより(図9参照)、4面を実装
面とすることができる。つまり、図9、10で示すガラ
エポ基板5の4辺で実装することができる。前記反射ケ
−ス10は、前記ガラエポ基板と略同一外状を有し、か
つ発光窓部枠11Aを形成した遮光性材からなる枠体1
1と、前記発光窓部枠11Aを閉塞するように透光樹脂
で封止した発光窓部12とからなる。詳しくは、前記ガ
ラエポ基板5のLED素子2の実装面に、該LED素子
が枠体11の発光窓部枠11A内に位置するように、前
記枠体11と遮光性の接着材で接着し、その後、前記発
光窓部枠11Aから透光性の樹脂をポッティングなどの
手法により滴下して前記LED素子を含み樹脂封止して
なる。このようにLED素子2を樹脂で封止することに
よって、LED素子2に水分が侵入したりして素子2を
破壊するなどの虞を回避できる。そして、前記反射ケ−
ス10の発光窓部枠11Aには、外部に向かって漸次広
がる反射面11Bを形成して、LED素子2による発光
を効率良く外部に導出するようにしてある。なお、図6
に仮想線でしめすように前記枠体11と一体樹脂成形さ
れた凸部11Cを形成すれば、実装基板としての回路基
板Kに設けた凹部K3に嵌入することにより回路基板K
に安易に位置決めし、強固に固定できる。図7に示すの
は前述した面実装型側面発光器1を複数用いて発光装置
を作成したものである。前記発光装置は、回路基板Kの
表面に、前記面実装型側面発光器1と略同一厚みを有す
る投光性の板状体20の裏面21を接着材などで接着す
るとともに、同回路基板K表面であって前記板状体20
の端面22にその発光窓部12が接するように複数の面
実装型側面発光器1を設けてある。図示しないが前記発
光窓部12が接する端面22以外には、光が洩れないよ
うに反射膜を貼着または印刷により設けている。このよ
うに反射膜を設ければ反射効率はより良くなるが、設け
ない場合でも、前記板状体20の界面、すなわち板状体
20の内部と外部との界面で光のはほとんどが全反射す
るため、高効率を追求しないかぎり反射膜を設ける必要
性は少ない。前記板状体20の裏面21には、その端面
22から導入した面実装型側面発光器1の光を内側に反
射しつつ導き、効率かつ均一的に表面23から外部へ反
射するために波板形状に加工が施されてある。図8に示
すのは前記発光装置を液晶表示装置のバックライトとし
て利用した実施例を示す。このものは、前述した図7の
板状体20の表面21側にLCDガラス30を配置する
とともに、さらに外側から前記LCDガラス30および
板状体20を光が洩れないように包み込むためのLCD
カバ−31が設けられている。32は液晶画面、33は
前記LCDガラス30内の液晶を駆動するための駆動I
Cである。このように面実装型側面発光器1を設けて発
光装置とするための回路基板Kと、液晶表示装置の駆動
IC33等の電子部品を設ける回路基板Kとを同一基板
として部品点数を減少させることができるとともに、液
晶画面32に見合った寸法の透光性の板状体(導光板)
20を予め用意し、駆動IC33と同時(同工程)に前
記板状体20および面実装型側面発光器1、LCDガラ
ス30、LCDカバ−31を順次設ける手法を採れば効
率的に液晶表示装置が製造可能である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings. 1 is a perspective view showing a surface-mounted side light emitting device of the present invention, FIG. 2 is a front view of FIG. 1, FIG. 3 is a side view of FIG. 1, FIG. 4 is a plan view of FIG. 1, and FIG. It is a rear view. Reference numeral 1 denotes a surface-mounting side surface light-emitting device having a substantially regular hexahedron shape. The light-emitting device 1 is a glass epoxy substrate 5 having a thickness of about 0.8 mm and a thickness of 0.8 mm bonded to the glass epoxy substrate 5 with an adhesive material. The main structure is a reflective case 10 of a certain degree. The glass epoxy substrate 5 has a substantially rectangular shape (2.0 mm × 3.0 mm) in which arc-shaped cutouts penetrating in the thickness direction are formed at its four corners, and the surface thereof is LE.
The island portion 6 for die-bonding the anode side of the D element 2 and the bonding pad portion 7 connected to the surface (cathode side) of the die-bonded LED element 2 by the wire 3 are independently printed and fired. On the other hand, an anode electrode 8 and a cathode electrode 9 are provided in the cutout portion of the glass epoxy substrate 5. The island portion 6 and the anode electrode 8, and the bonding pad portion 7 and the cathode electrode 9 are electrically connected by a wiring pattern 5A formed by printing on the glass epoxy substrate 5, respectively. In this embodiment, 8 is an anode electrode and 9 is a cathode electrode. However, not limited to this, 8 can be a cathode electrode and 9 can be an anode electrode. In this embodiment, the glass epoxy substrate 5 made of the glass / epoxy material is adopted, but the present invention is not limited to this, and a substrate made of a ceramic material or the like can also be used. The shape is not limited to the chamfered one, and an appropriate shape such as a chamfered chamfer may be adopted. However, cutouts are provided at the four corners, and the anode electrode 8 and the cathode electrode 9 are formed along the shape of the cutouts.
9 is adhered to the pad P of the circuit board K with a conductive adhesive material such as solder (see FIG. 6), so that the surface-mounted side light-emitting device 1 can be obtained.
Can be firmly surface-mounted. That is, since the notch portion is provided, a thick solder layer H can be formed between the electrodes 8 and 9 of the surface light emitter 1 and the pad P, and a sufficient solder fillet can be secured. The effect that the mounting side light emitter 1 can be fixed is obtained. Such a notch is not limited to the arc shape as described above, but may be chamfered obliquely. In this embodiment, a pair of the anode electrode 8 and the cathode electrode 9 is provided, but this has two mountable surfaces when the surface mounting side light emitting device 1 is surface mounted. This is because it is a surface, and if the mountable surface is only one surface, at least the anode electrode 8 and the cathode electrode 9 may be provided one by one on the outer peripheral portion of the mounting surface. 9 and 10 show modified examples of the glass epoxy substrate 5. Figure 9 is LE
FIG. 10 is a front view showing a state of the glass epoxy substrate 10 on which the D element 2 is mounted, viewed from the front surface side, and FIG. 10 is a rear view seen from the back surface side of FIG. 9. In the glass epoxy substrate 5, the anode electrode 8 and the cathode electrode 9 are the same on both mounting surfaces.
Since the cathode electrodes 9 and the cathode electrodes 9 are arranged so as to face each other, only two mounting surfaces can be used. However, as in this modification, the electrode 8 or 9 is provided at one corner and the adjacent electrode. Among the two pairs of diagonals of the glass epoxy substrate 5, the wiring pattern 5A has an intersecting structure (X) on the front and back sides (see FIG. 9) so that four electrodes become mounting surfaces. be able to. That is, it can be mounted on the four sides of the glass epoxy substrate 5 shown in FIGS. The reflection case 10 has substantially the same outer shape as the glass epoxy substrate, and is a frame body 1 made of a light-shielding material in which a light emitting window frame 11A is formed.
1 and a light emitting window portion 12 sealed with a translucent resin so as to close the light emitting window portion frame 11A. Specifically, on the mounting surface of the LED element 2 of the glass epoxy substrate 5, the frame element 11 is bonded to the mounting surface of the LED element 2 with a light-shielding adhesive so that the LED element is located inside the light emitting window frame 11A of the frame body 11, After that, a translucent resin is dropped from the light emitting window frame 11A by a technique such as potting, and the LED element is included and resin-sealed. By sealing the LED element 2 with the resin in this manner, it is possible to avoid the risk of water entering the LED element 2 and destroying the element 2. Then, the reflection case
A reflective surface 11B that gradually expands toward the outside is formed on the light emission window frame 11A of the space 10 so that the light emitted by the LED element 2 can be efficiently led to the outside. Note that FIG.
If a convex portion 11C integrally molded with the frame body 11 is formed so as to be indicated by an imaginary line, the circuit board K is fitted into a concave portion K3 provided in the circuit board K as a mounting board.
It can be easily positioned and firmly fixed. FIG. 7 shows a light emitting device made by using a plurality of the surface mount side light emitting devices 1 described above. In the light emitting device, the back surface 21 of the light-projecting plate-like body 20 having substantially the same thickness as that of the surface-mounted side light-emitting device 1 is adhered to the surface of the circuit board K with an adhesive or the like, and the circuit board K is also used. The surface of the plate-like body 20
A plurality of surface-mounted side light-emitting devices 1 are provided so that the light-emitting window portions 12 are in contact with the end face 22 of the. Although not shown, a reflection film is provided by sticking or printing so as to prevent light from leaking, except for the end face 22 in contact with the light emitting window portion 12. If the reflective film is provided in this way, the reflection efficiency is improved, but even if it is not provided, most of the light is totally reflected at the interface of the plate-like body 20, that is, the interface between the inside and outside of the plate-like body 20. Therefore, it is not necessary to provide a reflective film unless high efficiency is pursued. On the back surface 21 of the plate-shaped body 20, a corrugated plate is provided for guiding the light of the surface-mounted side surface light-emitting device 1 introduced from the end surface 22 while reflecting the light inward and efficiently and uniformly reflecting the light from the surface 23 to the outside. The shape has been processed. FIG. 8 shows an embodiment in which the light emitting device is used as a backlight of a liquid crystal display device. This is an LCD for arranging the LCD glass 30 on the surface 21 side of the plate-like body 20 of FIG. 7 described above and further enclosing the LCD glass 30 and the plate-like body 20 from the outside so as not to leak light.
A cover 31 is provided. 32 is a liquid crystal screen, 33 is a drive I for driving the liquid crystal in the LCD glass 30.
It is C. In this way, the circuit board K for providing the surface-mounted side light-emitting device 1 as a light-emitting device and the circuit board K for providing electronic components such as the driving IC 33 of the liquid crystal display device are the same substrate to reduce the number of components. A transparent plate-like body (light guide plate) having a size suitable for the liquid crystal screen 32
If 20 is prepared in advance and the plate-like body 20, the surface-mounting side light-emitting device 1, the LCD glass 30, and the LCD cover 31 are sequentially provided at the same time as the driving IC 33 (in the same step), a liquid crystal display device can be efficiently used. Can be manufactured.
【発明の効果】本発明によれば、例えば回路基板の表面
に本発明の面実装型側面発光器を実装するだけで、従来
のように専用のホルダ−を利用する必要なく、側面発光
させることができる。また、発光窓部を形成した一方側
面と対向する側面の4角部にカソ−ド電極同士またはア
ノ−ド電極同士が隣合わないように設ければ、発光窓部
とこれに対向する側面以外の面全てで面実装可能にする
ことができ実装間違いが起こる虞が少なくなる。さら
に、本体の実装面に実装用凸部を形成すれば、例えば実
装すべき回路基板上に実装凹部を形成し、前記凸部を凹
部に嵌入することによって面実装型側面発光器を回路基
板に位置決めすることができる。また発光窓部を形成し
た一方側面と対向する側面の角部に電極を形成し、例え
ば回路基板Kに半田等で実装(固定)する場合、電極を
形成している側は前記半田で十分固定できるが、発光窓
部側は直接固定されていないので固定力不足する虞があ
る。しかしながら、前記凸部を発光窓部側の実装面に設
ければ、回路基板の凹部に挿入することによってより強
固な固定力が得られる。そして、回路基板の表面に設け
た透光性の板状体の端面に、前述した面実装型発光器の
発光窓部を形成した一側部が接するように配置するだけ
で平板状の発光装置や液晶表示装置のバックライトとし
て使用することができる。According to the present invention, for example, only by mounting the surface mount type side light emitting device of the present invention on the surface of a circuit board, side light emission can be achieved without using a dedicated holder as in the conventional case. You can Further, if the cathode electrodes or the anode electrodes are provided so as not to be adjacent to each other at the four corners of the side surface facing the one side surface on which the light emitting window portion is formed, except for the light emitting window portion and the side surface opposed thereto. Since it is possible to mount on all surfaces, there is less risk of mounting error. Further, if a mounting convex portion is formed on the mounting surface of the main body, for example, a mounting concave portion is formed on the circuit board to be mounted, and the convex portion is fitted into the concave portion to form the surface mounting side light emitting device on the circuit board. Can be positioned. Further, when an electrode is formed on a corner of a side surface opposite to the one side surface on which the light emitting window is formed and is mounted (fixed) on the circuit board K with solder or the like, the side where the electrode is formed is sufficiently fixed with the solder. However, since the light emitting window portion side is not directly fixed, there is a risk of insufficient fixing force. However, if the convex portion is provided on the mounting surface on the light emitting window portion side, a stronger fixing force can be obtained by inserting the convex portion into the concave portion of the circuit board. Then, the flat plate-shaped light emitting device is simply arranged by arranging so that one side portion having the light emitting window portion of the above-mentioned surface mount light emitting device is in contact with the end surface of the translucent plate-shaped body provided on the surface of the circuit board. Or as a backlight of a liquid crystal display device.
【図1】本発明の面実装型側面発光器第1実施例を示す
斜視図である。FIG. 1 is a perspective view showing a first embodiment of a surface-mounted side light emitting device of the present invention.
【図2】図1の正面図である。FIG. 2 is a front view of FIG.
【図3】図1の一部を切り欠いた右側面図である。FIG. 3 is a right side view in which a part of FIG. 1 is cut away.
【図4】図1の側面図である。FIG. 4 is a side view of FIG.
【図5】図1の背面図である。FIG. 5 is a rear view of FIG.
【図6】図1の面実装型側面発光器を回路基板に実装し
た状態を示す状態図。6 is a state diagram showing a state in which the surface-mounted side light-emitting device of FIG. 1 is mounted on a circuit board.
【図7】本発明の発光装置を示す斜視図である。FIG. 7 is a perspective view showing a light emitting device of the present invention.
【図8】本発明の液晶表示装置を示す分解斜視図であ
る。FIG. 8 is an exploded perspective view showing a liquid crystal display device of the present invention.
【図9】図1に示す面実装型側面発光器の変形例を示す
正面図である。9 is a front view showing a modified example of the surface-mount side light-emitting device shown in FIG.
【図10】図9の背面図である。FIG. 10 is a rear view of FIG.
【図11】従来の発光器を示す斜視図である。FIG. 11 is a perspective view showing a conventional light emitting device.
【図12】図11を側面発光用とした場合の斜視図本発
明の発光装置を示す斜視図である。FIG. 12 is a perspective view when FIG. 11 is used for side light emission. FIG. 12 is a perspective view showing a light emitting device of the present invention.
【図13】図12の側断面図である。FIG. 13 is a side sectional view of FIG.
【図14】図11の発光器を利用した発光装置を示す分
解斜視図である。FIG. 14 is an exploded perspective view showing a light emitting device using the light emitting device of FIG.
【図15】従来のLEDランプを側面発光用とした側断
面図である。FIG. 15 is a side sectional view of a conventional LED lamp for side surface emission.
1 面実装型側面発光器 2 LED素子 8 アノ−ド電極 9 カソ−ド電極 11C 実装用凸部 20 透光性板状体 30 LCDガラス 5、25 発光窓部 4 LEDランプ DESCRIPTION OF SYMBOLS 1 Surface-mount side light emitter 2 LED element 8 Anode electrode 9 Cascade electrode 11C Mounting convex portion 20 Translucent plate-like body 30 LCD glass 5, 25 Light emitting window portion 4 LED lamp
─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───
【手続補正書】[Procedure amendment]
【提出日】平成5年11月11日[Submission date] November 11, 1993
【手続補正1】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】発明の詳細な説明[Name of item to be amended] Detailed explanation of the invention
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【発明の詳細な説明】Detailed Description of the Invention
【0001】[0001]
【産業上の利用分野】本発明は、面実装型側面発光器、
および、これを用いた発光装置、ならびにこの発光装置
を用いた液晶表示装置に関し、詳しくは側面発光器を液
晶表示装置などの発光装置に組み込むことに適するよう
に構成したものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount type side light emitter,
The present invention also relates to a light emitting device using the same and a liquid crystal display device using the light emitting device, and more particularly, to a device configured so that a side surface light emitter is suitable for being incorporated in a light emitting device such as a liquid crystal display device.
【0002】[0002]
【従来の技術】従来、側面発光専用の発光器が存在しな
かったため、側面発光させようとする場合には、(A)
実開昭61−42868号、(B)実開昭61−575
48号に開示される発光器に改良工夫をして側面側に発
光するように使用するのが一般的であった。2. Description of the Related Art Conventionally, there has not been a light emitting device exclusively for side light emission.
No. 61-42868, (B) No. 61-575
It was general to improve the light emitting device disclosed in No. 48 and use it so as to emit light to the side surface side.
【0003】すなわち、前記(A)の面発光器は、図1
1ないし図14に示すように、LED素子を樹脂封止し
た本体50と、この本体50の両側面50Aからアノ−
ド電極リ−ド51とカソ−ド電極リ−ド51を導出して
なり、両電極51を基板Kに実装し通電すると上方に向
かって発光するものである。このような面発光器を側面
から発光させる場合には、図12、13に示すように実
装する基板Kに収納凹部K1を形成し、この凹部K1に
前記本体50を収納して側面から発光するように設けら
れていた。That is, the surface emitting device of the above (A) is shown in FIG.
As shown in FIGS. 1 to 14, a main body 50 in which an LED element is resin-sealed, and both side surfaces 50A of the main body 50 are anodized.
The lead electrode lead 51 and the cathode electrode lead 51 are led out, and when both electrodes 51 are mounted on the substrate K and energized, light is emitted upward. When such a surface light-emitting device emits light from the side surface, as shown in FIGS. 12 and 13, a housing recess K1 is formed in the substrate K to be mounted, and the main body 50 is housed in this recess K1 to emit light from the side surface. Was provided.
【0004】また、前記(B)の発光器のようなLED
ランプ60を側面発光用として使用する場合は、図15
に示すようにL字状のリ−ド保持用の案内通路を有する
ホルダ−61を用い、このホルダ−61によってLED
ランプ60のリ−ド60Aを曲げた状態で固定し側面発
光用に改良して使用していた。Further, an LED such as the light emitter of the above (B)
When the lamp 60 is used for side surface light emission, FIG.
As shown in FIG. 3, a holder 61 having an L-shaped guide passage for holding the lead is used, and the LED is used by the holder 61.
The lead 60A of the lamp 60 was fixed in a bent state and modified for side light emission.
【0005】[0005]
【発明が解決しようとする課題】上記従来のものでは、
例えば(A)の場合であれば実装する基板Kに収納凹部
K1を形成する必要があるばかりか、基板Kには両リ−
ド51、51の2点のみで半田などで固定するものであ
るから、両リ−ド51、51が導出される方向を回転軸
とする回転方向の保持力が低く、図11のように膨出レ
ンズ52を形成し、この膨出レンズ52と前記両リ−ド
51、51との3点支持にするなどの工夫を施さなけれ
ばならない不都合があった。そして、このような側面発
光器を用いて、例えば液晶表示装置のバックライトを作
成しようとする場合、図14に示すように板状のレンズ
体53の側部に前記側面発光器が配置されるが、前記膨
出レンズ52をレンズ体53の側部に配置するだけでは
レンズ体53の内部に光を効率的に導出できない問題か
ら、レンズ体53の側部に前記膨出レンズ52を収納す
るための凹部54をわざわざ設ける必要があった。SUMMARY OF THE INVENTION In the above conventional one,
For example, in the case of (A), not only is it necessary to form the storage recess K1 in the board K to be mounted, but also the board K is provided with both leads.
Since it is fixed with solder or the like only at two points of the leads 51, 51, the holding force in the direction of rotation about the direction in which both the leads 51, 51 are led out is low, and as shown in FIG. There is an inconvenience that it is necessary to form a projecting lens 52 and use a device such as supporting the projecting lens 52 and the leads 51, 51 at three points. When a backlight of a liquid crystal display device is to be created using such a side light emitter, the side light emitter is arranged on the side of the plate-shaped lens body 53 as shown in FIG. However, the bulging lens 52 is housed on the side portion of the lens body 53 because the light cannot be efficiently guided to the inside of the lens body 53 only by disposing the bulging lens 52 on the side portion of the lens body 53. It was necessary to purposely provide the concave portion 54 for this.
【0006】また、(B)の場合では、専用のホルダ−
61が必要となるばかりか、このホルダ−61に組み込
むために別の製造工程を必要する問題があった。また、
このような組み込み工程は組み込みが複雑なため人手で
行われるのが一般的であった。本発明は、上記問題を解
決し、新規に側面発光専用の発光器を提供することを目
的とする。In the case of (B), a dedicated holder-
There is a problem that not only 61 is required, but also another manufacturing process is required for assembling into the holder 61. Also,
Since such an assembling process is complicated, it is generally performed manually. SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and provide a novel light emitting device for side surface light emission.
【0007】[0007]
【課題を解決するための手段】以上のような課題を解決
するため本願発明では、次のような技術的手段を講じて
いる。すなわち、本願の請求項1に記載した面実装型側
面発光器は、LED素子を内蔵した正六面体形状の本体
と、この本体の一つの面に発光窓部を形成する一方、前
記発光窓部を形成する面およびこの面と対向する面を除
く面を実装面とし、当該実装面の外周辺部に一対の電極
を形成してなる構成を採用してある。In order to solve the above problems, the present invention takes the following technical means. That is, the surface-mounting side light-emitting device according to claim 1 of the present application has a regular hexahedron-shaped main body containing an LED element, and a light-emitting window portion formed on one surface of the main body, while the light-emitting window portion is provided. A structure is adopted in which the surface other than the surface to be formed and the surface opposite to this surface is used as a mounting surface, and a pair of electrodes is formed on the outer peripheral portion of the mounting surface.
【0008】請求項2に記載した面実装型側面発光器で
は、請求項1に記載した両電極を、前記発光窓部の対向
面の角部から前記発光窓部に向う前記実装面の外周辺部
に沿って連続して面取箇所を形成し、この面取箇所に前
記両電極を設けてなる点に特徴を有する。前記面取箇所
(いわば切欠部)は、実装面の外周辺部全域に設けても
良いが、全域に必ずしも設ける必要はなく前記角部から
適宜長さだけ延在するように構成しても良い。In a surface mount type side surface light emitter according to a second aspect of the present invention, both electrodes according to the first aspect of the present invention are configured such that the outer periphery of the mounting surface facing the light emitting window portion from the corners of the facing surface of the light emitting window portion. A feature is that chamfered portions are continuously formed along the portion, and both electrodes are provided at the chamfered portions. The chamfered portion (so-called cutout portion) may be provided in the entire outer peripheral portion of the mounting surface, but it is not necessarily provided in the entire area and may be configured to extend from the corner portion by an appropriate length. .
【0009】また、請求項3では、前記両電極は極性の
異なるアノ−ド電極とカソ−ド電極であって、前記発光
窓部と対向する面の外周辺部のうち、実装面と接する辺
の両角部に設けられ、前記両電極を設けた辺に対向する
他辺の両角部にも更なる一対の電極を設けるとともに、
前記他辺の両角部に設けた電極は、その隣合う電極が極
性の異なるアノ−ドまたはカソ−ド電極となるようにす
る構成を採用してある。According to a third aspect of the present invention, the both electrodes are anode electrodes and cathode electrodes having different polarities, and a side of the outer peripheral portion of the surface facing the light emitting window portion, which is in contact with the mounting surface. In addition to providing a pair of electrodes at the both corners of the other side opposite to the side provided with both electrodes,
The electrodes provided at both corners of the other side have a structure in which adjacent electrodes are anode or cathode electrodes having different polarities.
【0010】なお、請求項3では、全ての電極を本体の
角部に設ける構成を採用しているが、請求項1ではこれ
を限定するものではなく、電極は本体の発光窓部を形成
した一側面を除く実装面と接する外周辺部を含んで設け
られれば何れの場所に設けても良いのはいうまでもな
い。請求項4に記載した前記本体の実装面には、実装用
凸部を形成することに特徴づけられる。この実装用凸部
は実装基板に形成された凹部に嵌入して位置決め固定す
るものであり、実装面の何れの場所に設けても良いが、
請求項2のように電極を発光窓部を形成する一方側面と
対向する側面の角部に形成する場合には、その両電極か
ら等間隔でかつ遠ざかる位置に設けると良い。In the third aspect, all the electrodes are provided at the corners of the main body. However, the first aspect is not limited to this, and the electrodes form the light emitting window of the main body. It goes without saying that it may be provided at any place as long as it is provided including the outer peripheral portion in contact with the mounting surface except one side surface. The mounting surface of the main body according to claim 4 is characterized in that a mounting projection is formed. The mounting projection is to be fitted into a recess formed in the mounting board and positioned and fixed, and may be provided at any place on the mounting surface.
When the electrodes are formed at the corners of the side surface facing the one side surface forming the light emitting window as in the second aspect, it is preferable to provide the electrodes at equal intervals and away from the both electrodes.
【0011】請求項5は、例えば液晶表示装置の発光体
(バックライト)や単なる平板状の発光体としての発光
装置に関するものであり、請求項1ないし4のいずれか
に記載の面実装型側面発光器を、回路基板の表面に設け
た透光性板状体の端面にその発光窓部が位置するように
設けてなることを特徴としてある。請求項6は、液晶表
示装置に関し、請求項4の発光装置を設けた同回路基板
上に液晶駆動用の半導体素子を設ける一方、前記透光性
板状体の発光側にLCDガラスを配置することを特徴と
している。A fifth aspect of the present invention relates to a light emitting device (backlight) of a liquid crystal display device or a light emitting device as a simple plate-shaped light emitting device, and the surface mount type side surface according to any one of the first to fourth aspects. The light emitting device is characterized in that the light emitting device is provided so that the light emitting window portion thereof is located on the end face of the translucent plate member provided on the surface of the circuit board. A sixth aspect relates to a liquid crystal display device, wherein a semiconductor element for driving a liquid crystal is provided on the same circuit board provided with the light emitting device of the fourth aspect, and an LCD glass is disposed on the light emitting side of the translucent plate. It is characterized by that.
【0012】[0012]
【作用】上記構成による本発明によれば、面実装型側面
発光器を実装する場合、LED素子を内蔵した正四面体
形状の本体の実装面を、実装すべき例えば回路基板の表
面に配置するとともに、この回路基板の配線パタ−ンと
実装面の外周辺部に設けた電極を接続して面実装するこ
とができる。前記発光窓部の対向面の角部から前記発光
窓部に向う前記実装面の外周辺部に沿って連続して面取
箇所を形成し、この面取箇所に前記両電極を設ければ、
面実装した際に前記回路基板と接着する接着面積を増大
するように働く。According to the present invention having the above-described structure, when mounting a surface-mounting side light-emitting device, the mounting surface of a regular tetrahedron-shaped main body containing the LED element is arranged on the surface of a circuit board to be mounted, for example. At the same time, the wiring pattern of this circuit board can be connected to the electrodes provided on the outer peripheral portion of the mounting surface for surface mounting. If chamfered portions are continuously formed along the outer peripheral portion of the mounting surface facing the light emitting window portion from the corners of the facing surface of the light emitting window portion, and if both electrodes are provided at this chamfered portion,
It works so as to increase the adhesion area where it is adhered to the circuit board when it is surface-mounted.
【0013】また、発光窓部を形成した一側面と対向す
る側面の4角部にカソ−ド電極同士またはアノ−ド電極
同士が隣合わないように設ければ、発光窓部を形成した
一側部と連続する本体の他の面の何れの面でも実装面と
して作用する。さらに、本体の実装面に実装用凸部を形
成すれば、例えば実装すべき回路基板上に実装凹部を形
成し、前記凸部を凹部に嵌入することによって面実装型
側面発光器を回路基板に位置決めすることもできる。Further, if the cathode electrodes or the anode electrodes are provided so as not to be adjacent to each other at the four corners of the side surface facing the one side surface on which the light emitting window portion is formed, the light emitting window portion is formed. Any of the other surfaces of the body that are continuous with the sides act as mounting surfaces. Further, if a mounting convex portion is formed on the mounting surface of the main body, for example, a mounting concave portion is formed on the circuit board to be mounted, and the convex portion is fitted into the concave portion to form the surface mounting side light emitting device on the circuit board. It can also be positioned.
【0014】そして、回路基板の表面に設けた透光性板
状体の端面に、前述した面実装型発光器の発光窓部を形
成した一側部が接するように配置することにより、前記
透光性板状体に効率的に光りを導き、透光性板状体自体
を発光させて発光装置として働く。また、このような発
光装置は、液晶表示装置用の発光体(バックライト)と
することができる。Then, by arranging the light-transmitting plate-shaped body provided on the surface of the circuit board so that one side portion having the light-emitting window portion of the above-mentioned surface-mounted light-emitting device is in contact with the end surface of the light-transmitting plate-like body, Light is efficiently guided to the light-transmissive plate-like body, and the light-transmissive plate-like body itself emits light to function as a light emitting device. Further, such a light emitting device can be used as a light emitting body (backlight) for a liquid crystal display device.
【0015】[0015]
【実施例】以下、本発明の好ましい実施例を、図面を参
照しつつ具体的に説明する。図1は本発明の面実装型側
面発光器を示す斜視図、図2は図1の正面図、図3は図
1の側面図、図4は図1の平面図、図5は図1の背面図
である。1は略正六面体の形状を有する面実装型側面発
光器であって、この発光器1は厚み0.8mm程度のガ
ラエポ基板5と、このガラエポ基板5に接着材で接合さ
れる厚み0.8mm程度の反射ケ−ス10とを主な構成
としている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be specifically described below with reference to the drawings. 1 is a perspective view showing a surface-mounted side light emitting device of the present invention, FIG. 2 is a front view of FIG. 1, FIG. 3 is a side view of FIG. 1, FIG. 4 is a plan view of FIG. 1, and FIG. It is a rear view. Reference numeral 1 denotes a surface-mounting side surface light-emitting device having a substantially regular hexahedron shape. The light-emitting device 1 is a glass epoxy substrate 5 having a thickness of about 0.8 mm and a thickness of 0.8 mm bonded to the glass epoxy substrate 5 with an adhesive material. The main structure is a reflective case 10 of a certain degree.
【0016】前記ガラエポ基板5は、その4つの角部に
厚み方向に貫通する円弧状の切欠部を形成した略矩形状
(2.0mm×3.0mm)を有し、その表面にはLE
D素子2のアノ−ド側をダイボンデイングするためのア
イランド部6と、ダイボンデングしたLED素子2の表
面(カソ−ド側)とワイヤ3で接続されるボンデイング
パッド部7がそれぞれ独立して印刷焼成で設けられる一
方、前記ガラエポ基板5の切欠部にアノ−ド電極8およ
びカソ−ド電極9を設けてある。The glass-epoxy substrate 5 has a substantially rectangular shape (2.0 mm × 3.0 mm) in which four corners are formed with arcuate cutouts penetrating in the thickness direction, and the surface thereof is LE.
The island portion 6 for die-bonding the anode side of the D element 2 and the bonding pad portion 7 connected to the surface (cathode side) of the die-bonded LED element 2 by the wire 3 are independently printed and fired. On the other hand, an anode electrode 8 and a cathode electrode 9 are provided in the cutout portion of the glass epoxy substrate 5.
【0017】そして、アイランド部6とアノ−ド電極8
およびボンデイングパッド部7とカソ−ド電極9とは、
それぞれガラエポ基板5上に印刷形成された配線パタ−
ン5Aによって電気的に接続されている。本実施例では
8をアノ−ド電極、9をカソ−ド電極としたが、これに
限らず8をカソ−ド電極、9をアノ−ド電極とすること
も可能である。Then, the island portion 6 and the anode electrode 8 are provided.
And the bonding pad 7 and the cathode electrode 9 are
Wiring patterns printed and formed on the glass epoxy substrate 5, respectively.
5A electrically connected. In this embodiment, 8 is an anode electrode and 9 is a cathode electrode. However, not limited to this, 8 can be a cathode electrode and 9 can be an anode electrode.
【0018】この実施例では、前記ガラス・エポキシ材
からなるガラエポ基板5を採用したがこれに限定される
ものでなく、セラミック材などからなる基板も採用でき
るし、前述したように4つの角部に円弧状に面取りした
ものに限らず斜めに面取りしたものなど適宜形状を採用
できる。しかしながら、4つの角部に切欠部を設け、こ
の切欠部の形状に沿ってアノ−ド電極8およびカソ−ド
電極9を形成し、当該両電極8、9を半田等の導伝接着
材にて回路基板KのパッドPに接着する(図6参照)こ
とにより、面実装型側面発光器1を強固に面実装するこ
とができる。すなわち、切欠部を有するため前記面発光
器1の電極8、9とパッドPとの間に厚い半田層Hが形
成できるとともに半田フィレットも十分確保できるか
ら、回路基板Kに対して強固に前記面実装型側面発光器
1を固定できる効果が得られるのである。このような切
欠部は、前述のように円弧状に限らず斜めに面取りした
ものも採用できる。In this embodiment, the glass epoxy substrate 5 made of the glass / epoxy material is adopted, but the present invention is not limited to this, and a substrate made of a ceramic material or the like may be adopted. In addition to the chamfered chamfer, a chamfered chamfer may be used. However, notches are provided at the four corners, the anode electrode 8 and the cathode electrode 9 are formed along the shape of the notches, and both electrodes 8 and 9 are used as a conductive adhesive material such as solder. The surface mounting side light emitting device 1 can be firmly surface mounted by adhering it to the pad P of the circuit board K (see FIG. 6). That is, since the notch portion is provided, a thick solder layer H can be formed between the electrodes 8 and 9 of the surface light emitter 1 and the pad P, and a sufficient solder fillet can be secured. The effect that the mounting side light emitter 1 can be fixed is obtained. Such a notch is not limited to the arc shape as described above, but may be chamfered obliquely.
【0019】また、本実施例では、アノ−ド電極8およ
びカソ−ド電極9を一対づつ設ける構成を採用している
が、これは面実装型側面発光器1を面実装する場合の実
装可能面を2面とするためであり、実装可能面を1面の
みとするのであれば、少なくとも前記アノ−ド電極8と
カソ−ド電極9とを実装面の外周辺部にひとつずつ設け
るだけで良い。In this embodiment, the anode electrode 8 and the cathode electrode 9 are provided in pairs, but this can be mounted when the surface mounting type side light emitting device 1 is surface mounted. This is because the number of surfaces is two, and if the number of mountable surfaces is only one, then at least the anode electrode 8 and the cathode electrode 9 can be provided one by one on the outer peripheral portion of the mounting surface. good.
【0020】図9および図10に前記ガラエポ基板5の
変形例を示す。図9はLED素子2を実装するガラエポ
基板10の表面側から見た状態を示す正面図、図10は
図9の裏面側からみた背面図である。前記ガラエポ基板
5では、アノ−ド電極8とカソ−ド電極9とが2つの実
装面で同じアノ−ド電極8同士、カソ−ド電極9同士が
対向するように配置しているから実装面は2面しか使用
できないが、この変形例のように電極8または9を設け
る一つの角部の電極と隣合う電極が相異なる電極となる
ように、前記ガラエポ基板5の2組の対角のうち、表裏
で配線パターン5Aの交差構造(X)とすることにより
(図9参照)、4面を実装面とすることができる。つま
り、図9、10で示すガラエポ基板5の4辺で実装する
ことができる。9 and 10 show modified examples of the glass epoxy substrate 5. FIG. 9 is a front view showing a state of the glass epoxy substrate 10 on which the LED element 2 is mounted as seen from the front side, and FIG. 10 is a rear view as seen from the back side of FIG. In the glass epoxy substrate 5, the anode electrode 8 and the cathode electrode 9 are arranged so that the same anode electrodes 8 and the cathode electrodes 9 are opposed to each other on the two mounting surfaces. Although only two surfaces can be used, two pairs of diagonals of the glass-epoxy substrate 5 are arranged so that one corner electrode provided with the electrodes 8 or 9 and the adjacent electrode are different electrodes as in this modification. Of these, the four sides can be used as mounting surfaces by forming a cross structure (X) of the wiring patterns 5A on the front and back (see FIG. 9). That is, it can be mounted on the four sides of the glass epoxy substrate 5 shown in FIGS.
【0021】前記反射ケ−ス10は、前記ガラエポ基板
と略同一外状を有し、かつ発光窓部枠11Aを形成した
遮光性材からなる枠体11と、前記発光窓部枠11Aを
閉塞するように透光樹脂で封止した発光窓部12とから
なる。詳しくは、前記ガラエポ基板5のLED素子2の
実装面に、該LED素子が枠体11の発光窓部枠11A
内に位置するように、前記枠体11と遮光性の接着材で
接着し、その後、前記発光窓部枠11Aから透光性の樹
脂をポッティングなどの手法により滴下して前記LED
素子を含み樹脂封止してなる。このようにLED素子2
を樹脂で封止することによって、LED素子2に水分が
侵入したりして素子2を破壊するなどの虞を回避でき
る。The reflection case 10 has substantially the same outer shape as the glass epoxy substrate, and closes the light emitting window frame 11A and a frame body 11 made of a light-shielding material in which a light emitting window frame 11A is formed. The light emitting window portion 12 is sealed with a light-transmitting resin. Specifically, the LED element is mounted on the mounting surface of the glass epoxy substrate 5 on which the LED element 2 is mounted.
It is adhered to the frame 11 with a light-shielding adhesive so as to be located inside, and then a light-transmissive resin is dropped from the light emitting window frame 11A by a technique such as potting to form the LED.
It is made of resin including elements. LED element 2
By sealing the LED element with a resin, it is possible to avoid the risk of water entering the LED element 2 and destroying the element 2.
【0022】そして、前記反射ケ−ス10の発光窓部枠
11Aには、外部に向かって漸次広がる反射面11Bを
形成して、LED素子2による発光を効率良く外部に導
出するようにしてある。なお、図6に仮想線でしめすよ
うに前記枠体11と一体樹脂成形された凸部11Cを形
成すれば、実装基板としての回路基板Kに設けた凹部K
3に嵌入することにより回路基板Kに安易に位置決め
し、強固に固定できる。The light emitting window frame 11A of the reflection case 10 is provided with a reflecting surface 11B which gradually expands toward the outside so that the light emitted from the LED element 2 can be efficiently led to the outside. . If a convex portion 11C integrally molded with the frame body 11 is formed as indicated by a phantom line in FIG. 6, a concave portion K provided on the circuit board K as a mounting substrate is formed.
By fitting into 3, the circuit board K can be easily positioned and firmly fixed.
【0023】図7に示すのは前述した面実装型側面発光
器1を複数用いて発光装置を作成したものである。前記
発光装置は、回路基板Kの表面に、前記面実装型側面発
光器1と略同一厚みを有する投光性の板状体20の裏面
21を接着材などで接着するとともに、同回路基板K表
面であって前記板状体20の端面22にその発光窓部1
2が接するように複数の面実装型側面発光器1を設けて
ある。図示しないが前記発光窓部12が接する端面22
以外には、光が洩れないように反射膜を貼着または印刷
により設けている。このように反射膜を設ければ反射効
率はより良くなるが、設けない場合でも、前記板状体2
0の界面、すなわち板状体20の内部と外部との界面で
光のはほとんどが全反射するため、高効率を追求しない
かぎり反射膜を設ける必要性は少ない。FIG. 7 shows a light emitting device made by using a plurality of the surface mount type side light emitters 1 described above. In the light emitting device, the back surface 21 of the light-projecting plate-like body 20 having substantially the same thickness as that of the surface-mounted side light-emitting device 1 is adhered to the surface of the circuit board K with an adhesive or the like, and the circuit board K is also used. The light emitting window portion 1 is provided on the end face 22 of the plate-like body 20 on the surface.
A plurality of surface mount type side surface light emitters 1 are provided so that the two are in contact with each other. Although not shown, the end face 22 in contact with the light emitting window portion 12
Besides, a reflection film is attached or printed to prevent light from leaking. If the reflection film is provided in this way, the reflection efficiency is improved, but even if it is not provided, the plate-like body 2
Since most of the light is totally reflected at the interface of 0, that is, the interface between the inside and the outside of the plate-shaped body 20, it is not necessary to provide a reflective film unless high efficiency is pursued.
【0024】前記板状体20の裏面21には、その端面
22から導入した面実装型側面発光器1の光を内側に反
射しつつ導き、効率かつ均一的に表面23から外部へ反
射するために波板形状に加工が施されてある。図8に示
すのは前記発光装置を液晶表示装置のバックライトとし
て利用した実施例を示す。In order to guide the light of the surface-mounted side surface light-emitting device 1 introduced from the end face 22 to the back surface 21 of the plate-like body 20 while reflecting the light inward, and efficiently and uniformly reflecting the light from the surface 23 to the outside. Is processed into a corrugated plate shape. FIG. 8 shows an embodiment in which the light emitting device is used as a backlight of a liquid crystal display device.
【0025】このものは、前述した図7の板状体20の
表面21側にLCDガラス30を配置するとともに、さ
らに外側から前記LCDガラス30および板状体20を
光が洩れないように包み込むためのLCDカバ−31が
設けられている。32は液晶画面、33は前記LCDガ
ラス30内の液晶を駆動するための駆動ICである。In this device, the LCD glass 30 is arranged on the surface 21 side of the plate-like body 20 shown in FIG. 7, and the LCD glass 30 and the plate-like body 20 are wrapped from the outside so as not to leak light. LCD cover 31 is provided. 32 is a liquid crystal screen, 33 is a drive IC for driving the liquid crystal in the LCD glass 30.
【0026】このように面実装型側面発光器1を設けて
発光装置とするための回路基板Kと、液晶表示装置の駆
動IC33等の電子部品を設ける回路基板Kとを同一基
板として部品点数を減少させることができるとともに、
液晶画面32に見合った寸法の透光性の板状体(導光
板)20を予め用意し、駆動IC33と同時(同工程)
に前記板状体20および面実装型側面発光器1、LCD
ガラス30、LCDカバ−31を順次設ける手法を採れ
ば効率的に液晶表示装置が製造可能である。In this way, the circuit board K for providing the surface-mounting side light-emitting device 1 as a light emitting device and the circuit board K for providing electronic parts such as the driving IC 33 of the liquid crystal display device are the same board, and the number of parts is reduced. Can be reduced,
A translucent plate-like body (light guide plate) 20 having a size suitable for the liquid crystal screen 32 is prepared in advance, and is simultaneously with the drive IC 33 (the same process).
The plate-shaped body 20, the surface-mounted side light-emitting device 1, the LCD
A liquid crystal display device can be efficiently manufactured by adopting a method of sequentially providing the glass 30 and the LCD cover 31.
【0027】[0027]
【発明の効果】本発明によれば、例えば回路基板の表面
に本発明の面実装型側面発光器を実装するだけで、従来
のように専用のホルダ−を利用する必要なく、側面発光
させることができる。また、発光窓部を形成した一方側
面と対向する側面の4角部にカソ−ド電極同士またはア
ノ−ド電極同士が隣合わないように設ければ、発光窓部
とこれに対向する側面以外の面全てで面実装可能にする
ことができ実装間違いが起こる虞が少なくなる。According to the present invention, for example, only by mounting the surface mount type side light emitting device of the present invention on the surface of a circuit board, side light emission can be achieved without using a dedicated holder as in the conventional case. You can Further, if the cathode electrodes or the anode electrodes are provided so as not to be adjacent to each other at the four corners of the side surface facing the one side surface on which the light emitting window portion is formed, except for the light emitting window portion and the side surface opposed thereto. Since it is possible to mount on all surfaces, there is less risk of mounting error.
【0028】さらに、本体の実装面に実装用凸部を形成
すれば、例えば実装すべき回路基板上に実装凹部を形成
し、前記凸部を凹部に嵌入することによって面実装型側
面発光器を回路基板に位置決めすることができる。また
発光窓部を形成した一方側面と対向する側面の角部に電
極を形成し、例えば回路基板Kに半田等で実装(固定)
する場合、電極を形成している側は前記半田で十分固定
できるが、発光窓部側は直接固定されていないので固定
力不足する虞がある。しかしながら、前記凸部を発光窓
部側の実装面に設ければ、回路基板の凹部に挿入するこ
とによってより強固な固定力が得られる。Further, when the mounting convex portion is formed on the mounting surface of the main body, for example, the mounting concave portion is formed on the circuit board to be mounted, and the convex portion is fitted into the concave portion to form the surface mounting type side light emitting device. It can be positioned on the circuit board. Further, electrodes are formed on the corners of the side surface opposite to the one side surface on which the light emitting window is formed, and are mounted (fixed) on the circuit board K by soldering or the like.
In this case, the side on which the electrodes are formed can be sufficiently fixed with the solder, but the light emitting window side is not directly fixed, and thus the fixing force may be insufficient. However, if the convex portion is provided on the mounting surface on the light emitting window portion side, a stronger fixing force can be obtained by inserting the convex portion into the concave portion of the circuit board.
【0029】そして、回路基板の表面に設けた透光性の
板状体の端面に、前述した面実装型発光器の発光窓部を
形成した一側部が接するように配置するだけで平板状の
発光装置や液晶表示装置のバックライトとして使用する
ことができる。A flat plate-like structure can be obtained by simply arranging the light-transmitting plate-like member provided on the surface of the circuit board so that one end of the surface-mounted light-emitting device having the light-emitting window is in contact with the end face of the plate-like member. It can be used as a backlight of a light emitting device or a liquid crystal display device.
Claims (6)
と、この本体の一つの面に発光窓部を形成する一方、前
記発光窓部を形成する面およびこの面と対向する面を除
く面を実装面とし、当該実装面の外周辺部に一対の電極
を形成してなる面実装型側面発光器。1. A hexahedron-shaped main body containing an LED element, a light emitting window portion formed on one surface of the main body, and a surface excluding a surface forming the light emitting window portion and a surface facing the surface. A surface-mounting side light-emitting device, which is a mounting surface and has a pair of electrodes formed on the outer peripheral portion of the mounting surface.
記発光窓部に向う前記実装面の外周辺部に沿って連続し
て面取箇所を形成し、この面取箇所に前記両電極を設け
てなることを特徴とする請求項1記載の面実装型面発光
装置。2. A chamfered portion is continuously formed along an outer peripheral portion of the mounting surface facing the light emitting window portion from a corner portion of the surface facing the light emitting window portion, and the chamfered portion is formed at the chamfered portion. The surface-mounted surface-emitting device according to claim 1, further comprising electrodes.
とカソ−ド電極であって、前記発光窓部と対向する面の
外周辺部のうち、実装面と接する辺の両角部に設けら
れ、前記両電極を設けた辺に対向する他辺の両角部にも
更なる一対の電極を設けるとともに、前記他辺の両角部
に設けた電極は、その隣合う電極が極性の異なるアノ−
ドまたはカソ−ド電極となるようにアノ−ド電極とカソ
−ド電極とを配置してある請求項1記載の面実装型側面
発光器。3. The both electrodes are an anode electrode and a cathode electrode having different polarities, and are provided at both corners of a side in contact with the mounting surface in an outer peripheral portion of a surface facing the light emitting window portion. Further, a pair of electrodes is further provided at both corners of the other side opposite to the side where the electrodes are provided, and the electrodes provided at the two corners of the other side have adjacent electrodes with different polarities.
2. The surface-mounted side light-emitting device according to claim 1, wherein the anode electrode and the cathode electrode are arranged so as to form a cathode or cathode electrode.
成することを特徴とする請求項1ないし3のいずれかに
記載の面実装型側面発光器。4. The surface-mounted side light-emitting device according to claim 1, wherein a mounting projection is formed on the mounting surface of the main body.
側面発光器を、回路基板の表面に設けた透光性板状体の
端面にその発光窓部が位置するように設けてなる発光装
置。5. The surface-mounting side light-emitting device according to any one of claims 1 to 4, wherein the light-emitting window portion is located at an end face of a light-transmissive plate member provided on the surface of the circuit board. Light emitting device.
晶駆動用の半導体素子を設ける一方、前記透光性板状体
の発光側にLCDガラスを配置することを特徴とする液
晶表示装置。6. The liquid crystal display according to claim 5, wherein the circuit board of the light emitting device is provided with a semiconductor element for driving a liquid crystal, and an LCD glass is arranged on the light emitting side of the translucent plate. apparatus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5271634A JPH07131072A (en) | 1993-10-29 | 1993-10-29 | Surface mounting type side light emitting device, light emitting device using the same, and liquid crystal display device using the light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5271634A JPH07131072A (en) | 1993-10-29 | 1993-10-29 | Surface mounting type side light emitting device, light emitting device using the same, and liquid crystal display device using the light emitting device |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11007732A Division JPH11261113A (en) | 1999-01-14 | 1999-01-14 | Surface mount type light emitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH07131072A true JPH07131072A (en) | 1995-05-19 |
Family
ID=17502804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5271634A Pending JPH07131072A (en) | 1993-10-29 | 1993-10-29 | Surface mounting type side light emitting device, light emitting device using the same, and liquid crystal display device using the light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH07131072A (en) |
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| WO2001069693A1 (en) * | 2000-03-17 | 2001-09-20 | Matsushita Electric Industrial Co., Ltd. | Light-emitting semiconductor device and surface-emitting device |
| JP2003008066A (en) * | 2001-06-26 | 2003-01-10 | Rohm Co Ltd | Infrared data communication module and method of mounting this infrared data communication module |
| JP2003234507A (en) * | 2002-02-07 | 2003-08-22 | Koha Co Ltd | Side-emitting LED lamp |
| JP2005057144A (en) * | 2003-08-06 | 2005-03-03 | Toyoda Gosei Co Ltd | Light emitting device |
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| JP2008041923A (en) * | 2006-08-07 | 2008-02-21 | Matsushita Electric Ind Co Ltd | Light emitting device |
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| JP2011091344A (en) * | 2009-10-26 | 2011-05-06 | Nichia Corp | Light emitting device |
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|---|---|---|---|---|
| JPH01163352U (en) * | 1988-04-30 | 1989-11-14 | ||
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|---|---|---|---|---|
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