JPH06204604A - Semiconductor laser device - Google Patents

Abstract

(57) [Abstract] [Purpose] In consideration of the electrical structure and heat dissipation effect, we have made it thinner and made it more advantageous in terms of manufacturing cost, and have also attempted to improve manufacturing efficiency. [Structure] A recess 9 for arranging a semiconductor laser chip 1 and a light receiving element 2 is formed in a package 8, and the recess 9 forms a rear exit of the semiconductor laser chip 1 and a light receiving element 2.
The gap between and is filled with the transparent material 4, and a predetermined portion of the side wall of the recess 9 is removed. In addition, the projecting pieces 10a, 10b are mounted on the pedestal 11 for mounting the substrate 3 on which the semiconductor laser chip 1 is mounted, while projecting the mounting projecting pieces 10a, 10b from the side surface of the package 8.
And the ground lead terminal 7 are integrally connected.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor laser device which serves as a laser light source for an optical pickup for optically reproducing or recording a signal.

[0002]

2. Description of the Related Art As is well known, a semiconductor laser device, which serves as a laser light source of an optical pickup for optically reproducing or recording a signal, comprises a semiconductor laser chip for emitting a laser beam forward and backward, The laser light from the back of the semiconductor laser chip is received by the light receiving element for monitoring, and the light intensity of the laser light is monitored to control the intensity of the laser light from the front used for signal reproduction or signal recording. .

As such a semiconductor laser device,
Conventionally, as disclosed in, for example, Japanese Utility Model Laid-Open No. 3-109362, a semiconductor laser chip and a light receiving element can be packaged in a can type by filling a gap between a light emitting surface at the rear of the laser chip and a light receiving surface of the light receiving element with a transparent material. In some cases, stable laser light can be emitted without sealing. The semiconductor laser device that does not use the can type package has a simplified structure, which is advantageous in reducing manufacturing cost and promoting miniaturization.

[0004]

By the way, in the semiconductor laser device disclosed in the above-mentioned publication, the space between the semiconductor laser chip and the light receiving element is buried in terms of electrical structure and corresponding to the metal substrate used for heat dissipation. Since the package itself is formed by forming the resin over a wide area, a resin mold is applied to the front emission port of the semiconductor laser chip to prevent deterioration of laser light and dissolution of the resin layer. It is difficult to form so that it does not occur.

Further, in the semiconductor laser device of the above-mentioned publication, the resin layer in which the lead terminals are embedded for supplying power to the semiconductor laser chip and for deriving the light reception output obtained by the light receiving element is provided on the metal substrate. Since it is a two-tiered structure that can be stacked on top of one another, it is disadvantageous in promoting the reduction in thickness, and the efficiency of the manufacturing process has not been specifically designed.

In view of the above-mentioned points, the present invention provides a semiconductor laser device which is advantageous for promoting the thinning in consideration of the electric structure and the heat radiation effect and has the manufacturing efficiency improved. Is.

[0007]

According to the present invention, there is provided a package which is formed in a resin mold and has a recess formed in a portion where a semiconductor laser chip and a light receiving element are arranged.
Each of the lead terminals is embedded in the package and is for supplying power to the semiconductor laser chip and for deriving a light reception output obtained by the light receiving element, and the recess is provided with an emission port at the rear of the semiconductor laser chip. A space for molding a transparent material to fill the gap with the light receiving element is secured, and the side wall of the recess is removed in the direction in which the front emission port of the semiconductor laser chip is directed.

Further, the semiconductor laser chip and the light receiving element are mounted together with the lead terminals for supplying power to the semiconductor laser chip and for leading out the light receiving output obtained by the light receiving element, and the resin molding. A pedestal is attached, and each of the lead terminals is embedded in the package, and an attaching protrusion piece used when attaching to another component is provided so as to protrude from a side surface of the package. It is formed integrally with the ground terminal in the terminal.

[0009]

According to the present invention, a transparent material is formed in which a recess for arranging a semiconductor laser chip and a light receiving element is formed in a package in which each lead terminal is embedded, and the recess fills a gap between the light emitting element and the emission port behind the semiconductor laser chip. In addition to ensuring a space for molding, a predetermined portion of the side wall of the recess is removed to secure a passage for laser light emitted from the front of the semiconductor laser chip.

Further, according to the present invention, the mounting projection used for mounting to another component is projected from the side surface of the package, and the pedestal on which the semiconductor laser chip and the light receiving element are mounted for electrical coupling is described above. By forming the projecting piece and the ground terminal in the lead terminal integrally with each other, the projecting piece also serves as a heat radiating plate, and the projecting piece and the pedestal are arranged on the same plane with each lead terminal. It is the one.

[0011]

1 is a plan view showing an embodiment of the present invention, and FIG. 2 is a side view of FIG. Further, FIG. 3 is an enlarged partial cross-sectional view of the main part from the side. In the figure, 1
Is a semiconductor laser chip that emits laser light forward and backward, 2 is a light receiving element that receives the laser light emitted backward from the semiconductor laser chip 1, 3 is a semiconductor material, and the light receiving element 2 is formed by etching. A substrate 4 on which the semiconductor laser chip 1 is mounted is formed, and a covering portion 4 is formed by a transparent resin mold so as to fill a gap between the light emitting element 2 and the rear emission port of the semiconductor laser chip 1, 5 to 7 are lead terminals for supplying power to the semiconductor laser chip 1 and for deriving a light reception output obtained by the light receiving element 2, and 8 are embedded with the lead terminals 5 to 7, and the substrate is also provided. 3 is a resin-molded package in which a concave portion 9 is formed in a portion where 3 is arranged, and 10a and 10b are optical pickup configurations. Each optical element to be goods is mounting projection piece which is used in attaching the optical block base (not shown) incorporated is.

Further, the details of the main structure will be explained. As shown in FIG. 3, the bottom surface of the recess 9 of the package 8 is made of a conductive metal plate to form a pedestal 11, and the pedestal 11 is provided with the substrate 3 thereon. It is attached with a conductive adhesive.

On the other hand, the semiconductor laser chip 1 and the substrate 3 are joined together via a negative electrode.

The positive electrode of the semiconductor laser chip 1 is connected to the lead terminal 5 by the wire 12 by bonding, and the positive electrode of the light receiving element 2 is connected to the lead terminal 6 by the wire 13 by bonding.

Further, the pedestal portion 11 includes the projecting pieces 10a, 10
It is integrally formed with the lead terminal 7b and is also integrally formed with the lead terminal 7. Therefore, the lead terminal 7 becomes an earth terminal, and by applying a voltage between the lead terminals 5 and 7, a current can be passed through the semiconductor laser chip 1 to cause the semiconductor laser chip 1 to emit light, and at the same time, the lead terminal can be emitted. 6 and 7
The light receiving output obtained by the light receiving element 2 can be derived from the space.

Here, the light receiving element 2 receives the laser light emitted from the rear of the semiconductor laser chip 1, and the voltage applied to the semiconductor laser chip 1 is controlled according to the light intensity of the received laser light. Therefore, the light intensity of the laser light emitted from the semiconductor laser chip 1 is controlled to be constant. Since the transparent coating 4 is formed in the gap between the light emitting element 2 and the light emitting element at the rear of the semiconductor laser chip 1, the light emitting surface or the light receiving surface of the light receiving element 2 is condensed. Therefore, the light intensity of the laser light emitted by the semiconductor laser chip 1 is prevented from being adversely affected by dew condensation.

The laser light emitted from the front emission port of the semiconductor laser chip 1 is used for signal reproduction or signal recording. In this case, in the direction in which the front emission port is directed. Since the side surface of the recess 9 of the package 8 is removed, the laser light from the front of the semiconductor laser chip 1 is not blocked by the package 8.

Further, the semiconductor laser chip 1 generates heat due to oscillation, but this heat is transmitted to the projecting pieces 10a and 10b through the substrate 3 and the pedestal portion 11 to release heat, and further the projecting piece 10a. , 10b are transmitted to the fixed optical block base to radiate heat.
The arcuate notches formed in the protruding pieces 10a and 10b are used for screwing.

Next, the manufacturing process will be described.

First, a metal plate is cut by pressing,
The lead terminals 5, 6, 7 and the protruding pieces 10a, 10b and the pedestal portion 11 are integrally formed. In this case, the lead terminals 5 and 6 which are separated from other portions at the time of completion are connected to the grounding lead terminal 7 by an unnecessary portion for connection.
The unnecessary portion is formed, for example, as shown by the alternate long and short dash line in FIG.

On the other hand, the semiconductor laser chip 1 is mounted on a substrate 3, and the substrate 3 is joined by press working to a pedestal portion 11 formed integrally with other portions. Then, the wires 12 and 13 are bonded to connect the semiconductor laser chip 1 to the lead terminal 5 and the light receiving element 2 to the lead terminal 6.

Then, the package 8 is formed by resin molding.
After that, a transparent resin is molded in the gap between the light emitting element 2 and the rear emission port of the semiconductor laser chip 1 to form the covering portion 4.

Finally, the unnecessary portion connecting the lead terminals 5 and 6 and the grounding lead terminal 7 is cut and deleted to complete the process.

By the way, since the concave portion 9 is provided in the package 8 so that the resin forming the package 8 does not reach the portion where the substrate 3 is arranged, it is possible to form the covering portion 4 after forming the package 8. The area that can be formed and the covering portion 4 is formed is small. Therefore, the coating portion 4 can be easily formed only by dropping an epoxy resin (including an adhesive), and the semiconductor laser chip 1 can be formed.
It can be easily achieved that the covering portion 4 does not reach the emission port in front of the.

The pedestal portion 11 is integrally formed with the grounding lead terminal 7 and the projecting pieces 10a and 10b for heat dissipation and mounting, and the lead terminal 5 and 6 are also included in the metal plate. Since the respective parts formed by the above are arranged on the same plane, the manufacturing efficiency can be improved and the thinning can be easily achieved.

[0026]

As described above, according to the present invention, a transparent material mold is formed in the gap between the light emitting element and the rear emission port of the semiconductor laser chip so as not to reach the front emission port of the semiconductor laser chip. A semiconductor laser device that can be easily manufactured can be provided.

Further, according to the present invention, it is possible to provide a semiconductor laser device which is easy to manufacture and advantageous in thinning.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is a side view of FIG.

FIG. 3 is an enlarged partial sectional view of a main part from the side.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor laser chip 2 Light receiving element 3 Substrate 4 Cover part 5, 6, 7 Lead terminal 8 Package 9 Recesses 10a, 10b Projecting piece 11 Pedestal part

Claims (2)

[Claims] 1. A semiconductor laser chip that emits laser light forward and backward, and a light-receiving light for monitoring that receives the laser light emitted from the rear of the semiconductor laser chip and detects the light intensity of the laser light. A semiconductor laser device provided with an element, which is formed by resin molding and has a recess formed in a portion where the semiconductor laser chip and the light receiving element are arranged; and a package embedded in the package, and The semiconductor laser chip is provided with respective lead terminals for supplying power to the semiconductor laser chip and for deriving a light receiving output obtained by the light receiving element, and the concave portion fills a gap between the light emitting element and the rear emission port of the semiconductor laser chip. A space for molding the transparent material is secured, and the front emission port of the semiconductor laser chip is A semiconductor laser device having a configuration in which a side wall of the recess is removed in a direction in which the semiconductor laser device is oriented. 2. A semiconductor laser chip for emitting laser light forward and backward, and a light receiving element for receiving laser light emitted from the rear of the semiconductor laser chip, and the semiconductor laser chip for electrical coupling. And a semiconductor laser device in which the light receiving element is mounted on a conductive pedestal, for supplying power to the semiconductor laser chip, and lead terminals for deriving a light receiving output obtained by the light receiving element, The package is formed by a resin mold, and includes the pedestal and the package in which the lead terminals are embedded, and a mounting projection piece used when mounting to another component is provided so as to project from a side surface of the package, and the pedestal is mounted. It is formed by integrally connecting the projecting piece and the ground terminal in the lead terminal. Semiconductor laser device to be collected.