JPH04217456A - Lap surface plate device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lapping platen device used in a semiconductor wafer manufacturing process.

0002

2. Description of the Related Art In the lapping process of semiconductor wafers, the wafer is wrapped by holding a carrier between the lapping plates, which are composed of upper and lower disk-shaped plates, and relatively rotating the upper and lower plates. When this lapping surface plate continues lapping for a long time, it becomes deformed in the radial direction due to uneven wear, deformation, etc., and this needs to be corrected.

[0003] Generally, the shape of the lap surface plate is modified by using a modification ring, which is sandwiched between the upper and lower surface plates. As a method for surface plate correction, JP-A-55-129
As disclosed in Japanese Patent No. 764, a method is known in which the efficiency of repair work is increased by applying a local load to a lap surface plate.

0004

[Problems to be Solved by the Invention] Conventional lapping surface plates have a problem in that surface plate correction work is always required. Although the method disclosed in Japanese Unexamined Patent Publication No. 55-129764 improves the efficiency of surface plate correction work, the correction work itself is indispensable. An object of the present invention is to provide a lap platen device that solves this problem.

[0005]

[Means for Solving the Problems] In order to solve the above-mentioned problems, the present invention provides a lapping surface plate device for lapping semiconductor substrates, in which upper surfaces of the upper surface plate are provided at positions close to the outer diameter and inner diameter of the upper surface of the upper surface plate, respectively. This is a lap surface plate device characterized by disposing a plurality of pressing devices for pressing the surface plate.

[0006]

[Operation] In the present invention, the deflection of the surface plate can be corrected and a flat surface can be obtained by appropriately applying pressure to a plurality of pressing devices on the inside or outside of the support supporting the upper surface plate. The pressing force of the pressing device is adjusted by periodically measuring the flatness of the lower surface plate.

[0007]

Embodiment FIG. 1 is a side view showing an embodiment of the present invention, and FIG. 2 is a plan view thereof. The upper surface plate 1 and the lower surface plate 4 are coaxial upper and lower disks, and the upper surface plate 1 is pressed onto the lower surface plate 4 from above by a large number of supports 2. A carrier containing a wafer is placed between an upper surface plate 1 and a lower surface plate 4, and the surface of the wafer is lapped by rotating the upper surface plate 1 and the lower surface plate 4 relatively around a central axis.

In this embodiment, as shown in FIGS. 1 and 2, a large number of pressure cylinders ( Pressing device) 3a
, 3b, and when lapping the wafer, the upper surface plate 1 is
The lower surface of can always be kept flat following the lower surface plate 4. Since the wafer, which is a workpiece for lapping, is affected by the flatness of the surface plate, the flatness of the wafer was also improved in this example.

[0009]

[Effects of the Invention] The present invention provides a plurality of pressing devices on the upper surface of the upper surface plate and adjusts them to control the shape of the surface plate, making it possible to wrap wafers with a flatter surface plate. Became. As a result, the flatness of the wafer was also improved. In addition, it is no longer necessary to manage the surface plate by correcting the flatness of the surface plate.

[Brief explanation of the drawing]

FIG. 1 is a side view showing a surface plate shape control device of the present invention.

FIG. 2 is a view taken along the line A-A in FIG. 1;

[Explanation of symbols]

1 Upper surface plate 2　　　　pillar 3a, 3b Pressure cylinder 4 Lower surface plate

Claims (1)

[Claims] 1. A lapping surface plate device for lapping semiconductor substrates, characterized in that a plurality of pressing devices for pressing the upper surface plate are arranged at positions close to the outer diameter and inner diameter of the upper surface of the upper surface plate, respectively. A lap surface plate device for