JP7653320B2 - Testing apparatus and chip testing method - Google Patents

Description

The present invention relates to a technique for measuring the strength of a chip by breaking the chip and observing the cross section of the chip after breaking.

Conventionally, as disclosed in Patent Document 1, for example, there is known a test device for measuring the flexural strength of chips formed by dividing a semiconductor wafer. This type of test device measures the flexural strength by destroying the chip through a three-point bending test.

Then, by measuring and evaluating the flexural strength of each of the semiconductor wafer chips that have been thinned and diced under different processing conditions, it is possible to set the optimal processing conditions for thinning and dicing.

JP 2021-048279 A

Although flexural strength is measured as a numerical value at the time of fracture, there is a demand to confirm the fracture conditions in more detail, rather than just a numerical value.

That is, there is a demand to confirm the starting point of chip fracture by analyzing the cross section of the chip, for example, to determine whether the condition of the back surface after thinning is the cause of the initiation of fracture, or whether the processing condition during singulation is the cause of the initiation of fracture.

With conventional testing equipment, chip fragments fly off during testing, resulting in poor work efficiency. In addition, the impact of the fragments distorting the cross section makes it impossible to accurately observe the condition immediately after fracture.

In consideration of the above problems, the present invention proposes a new technology that makes it possible to observe the cross-section of a chip that is destroyed during testing.

The problem that the present invention aims to solve is as described above, and the means for solving this problem will be explained next.

According to one aspect of the present invention,
The test apparatus comprises a support unit which supports the underside of a chip which is a test piece, and a pressing unit which moves up and down and has an indenter which presses the supported chip, a feed unit which feeds out a tape wound in a roll so that it is placed on the support unit, and a recovery unit which recovers the chip from the position of the support unit after it has been attached to the tape placed on the support unit and then destroyed by being pressed by the indenter.

According to another aspect of the present invention,
The test apparatus is provided with a load measuring device for measuring the load with which the indenter presses the tip, making it possible to measure the flexural strength of the tip.

According to another aspect of the present invention,
A chip testing method using the above-mentioned testing apparatus includes a tape placement step of placing the tape on the support unit, a chip placement step of attaching a chip to the tape and supporting the chip with the support unit via the tape after the tape placement step, a chip destruction step of pressing the chip with the indenter to destroy it after the chip placement step, and a chip recovery step of recovering the chip attached to the tape in the recovery unit after the chip destruction step.

According to another aspect of the present invention,
After carrying out the chip recovery step, the chip testing method further comprises a damage origin detection step of imaging the recovered chip fragments and detecting the damage origin.

According to another aspect of the present invention,
The testing apparatus is provided with a load measuring instrument that measures the load with which the indenter presses the chip supported by the support unit, and the measurement value of the load measuring instrument is obtained when the chip is destroyed in the chip destruction step, thereby forming a chip testing method.

The present invention provides the following advantages.
That is, according to one aspect of the present invention, since the chip attached to the tape is destroyed, the chip can be collected without scattering, and the cross section of the destroyed chip can be observed and the origin of destruction can be analyzed efficiently and accurately. Also, since the tape can be continuously supplied, the efficiency of the test work can be improved.

Furthermore, according to one aspect of the present invention, by detecting the fracture origin in the fracture origin detection step, it is possible to analyze the correlation between the processing conditions and the flexural strength, and to set optimal processing conditions.

Furthermore, according to one aspect of the present invention, the flexural strength of the chip can be measured by obtaining the measurement value of the load measuring device.

FIG. 1 is a diagram showing the configuration of a pickup device equipped with a test device according to an embodiment of the present invention. FIG. 1 is a diagram showing the configuration of a pickup device equipped with a test device according to an embodiment of the present invention. FIG. 2 is a diagram for explaining the configuration of a wafer unit. 4A to 4C are diagrams for explaining imaging of the top surface of a chip by a wafer imaging camera. 11A to 11C are diagrams for explaining the pushing-up of a tip by a pushing-up mechanism. FIG. 2 is a diagram for explaining an example of the configuration of a test apparatus. 1 is a flow chart showing the steps of a test method. FIG. 4 is a diagram for explaining a tape arrangement step. FIG. 13 is a diagram for explaining a chip arrangement step. FIG. 13 is a diagram for explaining a chip destruction step. FIG. 13 is a diagram for explaining a tip recovery step. 1A is a diagram showing chip fragments, (B) is a diagram showing an example of a captured image, (C) is a diagram showing an example of a captured image, and (D) is a diagram showing an example of a captured image.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 and 2 are diagrams showing the configuration of a pickup device 2 equipped with a test device 200 according to an embodiment of the present invention. In this way, the test device 200 may be provided as an attachment to the pickup device 2, or may be configured as a stand-alone test device 200.

As shown in Figures 1 and 2, the pickup device 2 has a base 4 that supports each of the structural elements that make up the pickup device 2, and each element is controlled by a controller 1.

As shown in FIG. 1, a cassette mounting table 5 is provided at one corner of the base 4, and a cassette 5a is placed on the cassette mounting table 5. The cassette 5a contains, for example, multiple wafer units 11 as shown in FIG. 3.

As shown in FIG. 3, in the wafer unit 11, the back surface 13b of the wafer 13 is fixed to an annular frame 21 via tape 19, and the front surface 13a of the wafer 13 is exposed. The wafer 13 is divided into a plurality of chips 23 by forming division starting points along intended division lines 17 extending in mutually perpendicular directions by cutting or the like. A device 24 is formed on the front surface side of each chip 23.

Each chip 23 is assigned an identification number for identifying it, and stored in the controller 1 (Figure 1). This identification number is assigned, for example, by calculating the number of chips from the wafer size, chip size, and images captured by the wafer imaging camera 60 (Figure 1) input to the device, and based on, for example, the notch formed in the wafer. The flexural strength, which will be described later, and other information are stored in the controller 1 (Figure 1) in association with this identification number. Note that the test to measure the flexural strength, which will be described later, may be performed on all chips, or may be performed on only some of the chips.

As shown in FIG. 1, the wafer unit 11 is pulled out while being clamped by the clamp 22a on one side of the transport mechanism 20, and after being temporarily placed on the temporary placement mechanism 10, it is transported to the frame holding mechanism 14 by the clamp 22b on the other side of the transport mechanism 20. The frame holding mechanism 14 comprises a frame support part 16 disposed on the lower side and capable of moving up and down, and a frame holding part 18 on the upper side, with the annular frame 21 of the wafer unit 11 being sandwiched and fixed between the two. The frame holding part 18 is provided with a notch 18a to allow the transport mechanism 20 to pass through.

As shown in Figures 1 and 2, the frame holding mechanism 14 is supported by a positioning mechanism 30 that controls the position of the frame holding mechanism 14. The positioning mechanism 30 includes an X-axis movement mechanism 32 that moves the frame holding mechanism 14 along the X-axis direction, and a Y-axis movement mechanism 42 that moves the frame holding mechanism 14 along the Y-axis direction. The X-axis movement mechanism 32 and the Y-axis movement mechanism 42 control the horizontal position of the frame holding mechanism 14.

The X-axis movement mechanism 32 has a pair of guide rails 34 arranged along the X-axis direction on the base 4, a ball screw 36 arranged in parallel between the pair of guide rails 34, and a pulse motor 38 provided at one end of the ball screw 36.

A moving block 40 is slidably disposed on a pair of guide rails 34. A nut portion (not shown) is provided on the underside (backside) of the moving block 40, and this nut portion is screwed into the ball screw 36. The moving block 40 moves in the X-axis direction as the ball screw 36 is rotated by the pulse motor 38.

The Y-axis movement mechanism 42 has a pair of guide rails 44 arranged along the Y-axis direction on the moving block 40, a ball screw 46 arranged in parallel between the pair of guide rails 44, and a pulse motor 48 provided at one end of the ball screw 46.

As shown in FIG. 1, the frame holding mechanism 14 is slidably disposed on a pair of guide rails 44. A nut portion (not shown) is provided on the support portion 14f of the frame holding mechanism 14, and this nut portion is screwed into a ball screw 46. When the ball screw 46 is rotated by the pulse motor 48, the frame holding mechanism 14 moves in the Y-axis direction.

As shown in Figures 1 and 2, the moving block 40 is formed in a plate shape, and an opening 41 that penetrates in the vertical direction is formed below the frame holding mechanism 14. This opening 41 allows the pushing mechanism 50, which will be described later, to push it up from below.

A rectangular opening 4b is provided in the region between the pair of guide rails 36 in the base 4. Inside this opening 4b, a cylindrical push-up mechanism 50 is provided that pushes the chips 23 (FIG. 3) included in the wafer 13 of the wafer unit 11 upward from the underside. The push-up mechanism 50 is connected to a lifting mechanism (not shown) comprised of a motor or the like, and moves up and down along the Z-axis direction.

When the annular frame 21 of the wafer unit 11 is fixed by the frame holding mechanism 14, the frame holding mechanism 14 is moved along the X-axis direction by the positioning mechanism 30, and the wafer unit 11 is positioned above the opening.

As shown in Figures 1, 2, and 4, a wafer imaging camera 60 is provided on the path that moves the frame holding mechanism 14 to above the push-up mechanism 50 as an imaging means for imaging the top surface of the wafer 13 (Figure 4) affixed to the annular frame 21 fixed by the frame holding mechanism 14.

As shown in FIG. 4, the top surface of the wafer 13 is imaged by the wafer imaging camera 60, and the position of each chip 23 is obtained based on the captured image.

As shown in Figures 1 and 2, the frame holding mechanism 14 positioned above the opening 4b is adjusted in position by the positioning mechanism 30 (Figures 1 and 2) to align the position of the chip 23 to be picked up directly above the push-up mechanism 50, as shown in Figure 5.

Figure 5 shows the wafer unit 11 arranged above the push-up mechanism 50, which pushes up a specific chip 23. The push-up mechanism 50 is configured to move up and down in the Z-axis direction and has a suction section formed in a hollow cylindrical shape that constitutes the outer layer, and a rectangular column-shaped push-up section arranged inside the suction section. The suction section sucks the bottom surface of the tape 19 while the push-up section pushes up the inside, peeling the chip 23 off the top surface of the tape 19.

As shown in FIG. 5, the pickup mechanism 70 is positioned above the push-up mechanism 50 to pick up the pushed-up chip 23.

As shown in FIG. 2, the pickup mechanism 70 is equipped with a chip holder 76 (collet) that is capable of moving up and down in the Z-axis direction and that suction-holds the pushed-up chip, and is connected to a chip holder moving mechanism 80 that moves in the Y-axis direction.

As shown in FIG. 2, the chip holder 76 is provided at the tip of a horizontally extending arm 74 so as to be movable in the X-axis direction and the Z-axis direction. The rear end of the arm 74 is connected to the chip holder moving mechanism 80 via the moving base 72.

The pick-up mechanism 70 is connected to a chip holder moving mechanism 80. The chip holder moving mechanism 80 includes a Y-axis moving mechanism 82 that moves the pick-up mechanism 70 along the Y-axis direction, and a Z-axis moving mechanism 92 that moves the pick-up mechanism 70 along the Z-axis direction. The Y-axis moving mechanism 82 and the Z-axis moving mechanism 92 control the position of the chip holder 76 in the Y-axis and Z-axis directions.

The Y-axis movement mechanism 82 has a pair of guide rails 84 arranged along the Y-axis direction. A ball screw 86 is arranged in parallel between the pair of guide rails 84, and a pulse motor 88 is connected to one end of the ball screw 86.

A moving block 90 is slidably mounted on the pair of guide rails 84, and a nut portion (not shown) of the moving block 90 is screwed into a ball screw 86. When the ball screw 86 is rotated by a pulse motor 88, the moving block 90 moves in the Y-axis direction.

As shown in FIG. 2, the Z-axis movement mechanism 92 has a pair of guide rails 94 arranged along the Z-axis direction on the side of the movement block 90, a ball screw 96 arranged in parallel between the pair of guide rails 94, and a pulse motor 98 provided at one end of the ball screw 96.

The movable base 72 of the pickup mechanism 70 is slidably mounted on a pair of guide rails 94, and a nut portion (not shown) of the movable base 72 is screwed into a ball screw 96. Rotation of the ball screw 96 by a pulse motor 98 moves the movable base 72 in the Z-axis direction.

The pickup mechanism 70 configured as described above picks up the chip 23 pushed up by the push-up mechanism 50. An identification number is set for the chip 23 that is picked up, and the flexural strength, which will be described later, and other information are stored in the controller 1 (FIG. 1) in association with this identification number.

As shown in FIG. 1, the back and side of the picked-up chip are observed by a chip observation mechanism 100. The chip observation mechanism 100 is configured with a back observation mechanism 102 that observes the back of the chip and a side observation mechanism 112 that observes the side of the chip, and the back and side of the chip are imaged by each observation mechanism.

The chip observed by the chip observation mechanism 100 is transported to the testing device 200, where its flexural strength (bending strength) is measured.

Next, the configuration of the test apparatus 200 shown in FIG. 6 will be described.
The testing apparatus 200 is mainly composed of a support unit 210 that supports the chip 23 to be tested, a pressing unit 226 that moves up and down and is equipped with an indenter 204 that presses the chip 23 supported by the support unit 210, a feed unit 310 that feeds out tape T relative to the support unit 210, a recovery unit 320 for recovering the broken chip 23, a drive unit 240 that moves the pressing unit 226 up and down, and a load measuring instrument 225 that measures the load acting on the indenter 204.

To explain in more detail below, the support unit 210 has a pair of support bases 213 that support the chip 23. Each of the pair of support bases 213 is configured in a rectangular parallelepiped shape, with a gap 217 secured between them.

A support portion 215 that forms a convex ridge that protrudes upward is formed at each of the opposing upper portions of the pair of support bases 213. Each support portion 215 is formed to extend in the Y-axis direction, and supports the chip 23 from below via the tape T.

The upper end of the support portion 215 is formed into a curved surface, forming a fulcrum that supports the chip 23 via the tape T. Each support base 213 is configured to move in the X-axis direction by a drive mechanism (not shown), and the distance between the fulcrums of each support portion 215 is adjusted.

A pressing unit 226 is disposed above the support unit 210. The pressing unit 226 presses the chip 23, which is the test piece supported by the support unit 210, and measures the load applied to the indenter 204 of the pressing unit 226 when the chip 23 is pressed.

The pressing unit 226 is equipped with a moving unit 228 that is raised and lowered in the vertical direction by a driving unit 240. A cylindrical first support member 227 is connected to the lower part of the moving unit 228, and a load measuring device 225 such as a load cell is fixed to the lower part of the first support member 227. The load measured by the load measuring device 225 is stored by the controller 1.

A clamping member 239 is connected to the lower part of the load measuring device 225 via a cylindrical second support member 229. The clamping member 239 is formed in a roughly gate-like shape when viewed from the front, and an indenter 204 for pressing the chip 23 is fixed between a pair of opposing clamping surfaces.

The indenter 204 is composed of a plate-like member having a width in the same direction as the Y-axis direction in which the support portion 215 of the support unit 210 extends. The tip (lower end) of the indenter 204 is formed in a tapered, approximately V-shape that narrows in width in the X-axis direction downward. The tip of the indenter 204 is formed in a rounded shape (R-shape). The shape of the indenter 204 is not particularly limited.

A drive unit 240 is provided on the rear side (back side) of the pressing unit 226 to move the pressing unit 226 in the vertical direction (Z-axis direction, up and down direction). The drive unit 240 has a support structure 242 that forms a vertical surface, and a pair of guide rails 244 are fixed at a predetermined interval along the Z-axis direction on the front side (surface side) of the support structure 242.

A ball screw 246 is disposed between the pair of guide rails 244 in parallel with the pair of guide rails 244, and a pulse motor 248 is connected to one end of the ball screw 246.

The rear side of the moving unit 228 is slidably mounted on a pair of guide rails 244, and the rear side of the moving unit 228 is screwed into a ball screw 246 via a connecting part (not shown).

When the ball screw 246 is rotated by the pulse motor 248, the moving unit 228 moves in the Z-axis direction along the guide rail 244, and the indenter 204 moves closer to and away from the support unit 210 relative to the support unit 210.

The moving unit 228 is provided with a scale reading unit 221 for reading the graduations of the scale 222 and detecting the height position of the moving unit 228 in the Z-axis direction. The controller 1 can identify the position of the tip of the indenter 204 based on the position of the scale reading unit 221.

A feeding unit 310 is provided to the side of the support unit 210 to feed out tape T for attaching the chip 23.

The delivery unit 310 is composed of a tape delivery roller 311 that delivers the tape T wound integrally with the separator S (release paper), a peel plate 312 that guides the delivered separator S in the opposite direction to the tape T to peel it off, a separator winding roller 313 that winds up the separator S, and a guide roller 314 that guides the tape T above the support unit 210.

On the opposite side of the support unit 210 from the feed unit 310, a recovery unit 320 is provided to clamp and pull the tape T to recover the destroyed chip from the position of the support unit 210.

The recovery unit 320 is configured to have a first clamp mechanism 321 for clamping and pulling the tip of the tape T, and a second clamp mechanism 331 for clamping the tape T between the support unit 210 and the first clamp mechanism 321.

The first clamping mechanism 321 has a clamping section 322 that clamps the leading end of the tape T, and a moving unit 323 that moves the clamping section 322 in a horizontal direction. The clamping section 322 is configured, for example, with a beak-shaped clamp structure that is operated manually or electrically. The moving unit 323 is configured, for example, with an air cylinder mechanism.

The second clamp mechanism 331 has a lower clamp portion 332 that faces the lower side of the tape T, an upper clamp portion 333 that faces the upper side of the tape T, and a lifting unit 334 for moving the upper clamp portion 333 in the vertical direction. The surfaces of the lower clamp portion 332 and the upper clamp portion 333 that face the tape T are each configured to contact the surface of the tape T and suppress lateral shifting of the tape T. The lifting unit 334 is configured, for example, by an air cylinder mechanism.

The sending unit 310 and the recovery unit 320 can be switched between a state in which the tape T is supplied above the support unit 210 and a state in which it is not supplied. In the latter case, it is possible to perform testing by supporting the chip 23 directly on the support unit 210 without placing the chip 23 on the tape T.

Next, a method for testing the chip will be described.
FIG. 7 is a flow chart showing an example of a chip testing method, and each step shown in this flow chart will be explained below in the order shown.

<Tape placement step>
As shown in FIG. 8, this is a step in which the tape T is placed on the support unit 210.

Specifically, the tape T is pulled out from the delivery unit 310, the separator S is peeled off at the peel plate 312, and the leading end of the tape T is clamped by the clamp portion 322 of the first clamp mechanism 321. The separator S is taken up by the separator take-up roller 313. The tape T is placed on the support unit 210 with the separator S peeled off, and the adhesive surface is exposed upward. This operation may be performed manually by an operator the first time, and thereafter automatically.

<Chip placement step>
As shown in FIG. 9, after the tape placement step is performed, the chip 23 is attached onto the tape T, and the chip 23 is supported by the support unit 210 via the tape T.

Specifically, first, the upper clamp portion 333 of the second clamp mechanism 331 is lowered by the lifting unit 334, and the tape T is clamped between the lower clamp portion 332 and the upper clamp portion 333.

Then, the chip 23 is placed on the tape T so as to align it with the position of the support unit 210, and the chip 23 is attached to the adhesive surface of the tape T. The chip 23 is supported by a pair of support parts 215 of the support unit 210 via the tape T.

<Chip destruction step>
As shown in FIG. 10, after the chip placement step, the chip 23 is pressed with a presser 204 to be destroyed.

Specifically, the pressing unit 226 (Figure 6) is lowered to press the chip 23 with the indenter 204. The bottom surface of the chip 23 is supported by a pair of support parts 215 of the support unit 210, and the top surface is pressed by the indenter 204, thereby performing a three-point bending test. The indenter 204 is lowered to a predetermined position to press the chip 23, and then retreats upward to return to its original position.

The load acting on the indenter 204 increases until the tip 23 breaks, and when the tip 23 is completely broken, the load becomes zero. For example, the maximum load until the tip 23 breaks and the load suddenly drops can be detected as the flexural strength and evaluated. In this way, the measurement value of the load measuring device 225 (Figure 6) can be obtained to measure the flexural strength of the tip (flexural strength by three-point bending according to SEMI standard G86-0303).

The flexural strength can be calculated by calculating the bending stress value σ. Specifically, when the maximum load applied to the indenter 204 is W [N], the distance between the upper ends of the pair of supports 215 is L [mm], the width of the chip 23 (the length of the chip 23 in the direction perpendicular to the line connecting the pair of supports 215 (Y-axis direction)) is b [mm], and the thickness of the chip 23 is h [mm], the bending stress value σ=3WL/ ^2bh2 .

Here, as the indenter 204 moves, the chip 23 is broken and divided into several pieces. However, since the chip 23 is broken while attached to the tape T, each of the divided pieces 23a does not scatter around, and it is possible to collect the pieces 23a attached to the tape T.

<Tip collection step>
As shown in FIG. 11, this is a step in which, after the chip destruction step is carried out, the recovery unit 320 recovers the chip 23 attached to the tape T.

Specifically, first, the upper clamp portion 333 of the second clamp mechanism 331 is raised by the lifting unit 334, and the tape T is released from the clamping by the lower clamp portion 332 and the upper clamp portion 333.

Then, the clamp portion 322 of the first clamp mechanism 321 is moved by the moving unit 323 to move the chip 23 away from the position of the support unit 210, and the chip 23 is peeled off from the tape T and collected.

In the example of FIG. 11, the recovery unit 320 is configured to include a chip receiver 324 and a tape cutter 325, and the clamp section 322 is moved until the chip 23 is positioned above the chip receiver 324, and the tape cutter 325 cuts the tape T, allowing the chip 23 to be automatically recovered onto the chip receiver 324. In addition to the above, the clamp section 322 may be moved manually by an operator to peel off the fragments 23a of the divided chip from the tape T.

<Breakdown origin detection step>
As shown in FIGS. 12A to 12D, after the chip recovery step is performed, an image of the broken pieces 23a of the recovered chip is captured to detect the starting point of destruction.

As shown in FIG. 12(A), the operator can set the divided fragment 23a in another microscope device or the like, thereby capturing images of the regions Ka to Kc of the fracture cross section 23b and detecting the fracture origin. FIGS. 12(B) to 11(D) are examples of captured images of the regions Ka to Kc. Note that the fracture cross section 23b may also be captured using the side observation mechanism 112 shown in FIG. 1.

An operator can visually check the captured images to detect the fracture starting points Pa to Pc. Alternatively, the captured images can be analyzed by a controller to automatically detect the fracture starting points Pa to Pc.

Figure 12 (B) shows an example in which the fracture origin Pa is reflected in the captured image of the area Ka close to the back surface 23u of the chip. In this way, when the fracture origin Pa is formed near the back surface 23u of the chip, it can be analyzed that it is caused by the presence of grinding marks caused by back grinding the wafer before dividing it into chips. By using this analysis, for example, it is possible to analyze the correlation between back grinding conditions and flexural strength, and to set optimal processing conditions for back grinding. The fracture origin Pa can be the center position of the mirror M that shines in the captured image, and the fracture stress can be estimated from the area of the mirror M. In addition, the line that is reflected as extending from the mirror M is the hackle H, and the fracture origin can be identified from the direction in which the hackle H advances.

Figure 12 (C) shows an example where fracture origin Pb is seen in an image of region Kb near the bottom in the vertical direction at corner 23d where fracture cross section 23b and side surface 23c of the chip intersect. In this way, when fracture origin Pb is confirmed at the bottom end of corner 23d of the chip, it can be analyzed that chipping has occurred on the back side of the chip when, for example, the wafer is divided into chips by cutting using a cutting blade. By using this analysis, it is possible to analyze the correlation between cutting conditions and flexural strength, and to set optimal cutting conditions. The same applies when fracture origin is confirmed at the top end of corner 23d of the chip.

Figure 12 (D) shows an example where fracture origin Pc is seen in an image of a region Kc midway up and down at corner 23d where chip fracture cross section 23b and side surface 23c intersect. In this way, when fracture origin Pc is confirmed midway through the thickness direction of chip corner 23d, for example, when division of a wafer into chips is performed by forming a modified layer with a laser beam, it can be analyzed that the modified layer is the fracture origin. By using this analysis, for example, it is possible to analyze the correlation between laser processing conditions and flexural strength, and to set optimal processing conditions for laser processing.

As described above, according to the present invention, the chip attached to the tape is destroyed, so that the chip can be collected without scattering, and the cross section of the destroyed chip can be observed and the origin of the destruction can be analyzed efficiently and accurately. In addition, the tape can be continuously supplied, so the efficiency of the test work can be improved.

In addition, slowing down the processing speed generally reduces the amount of fine damage such as cracks and chips that occur in the chip, improving processing quality. On the other hand, the processing time increases, which reduces productivity. For this reason, there is a trade-off between processing quality and productivity. By analyzing the fracture origin as described above, for example, by analyzing the correlation between flexural strength and processing conditions and optimizing the processing conditions that affect flexural strength, it is possible to achieve both the desired flexural strength (quality) and reduced processing time (improved productivity).

Furthermore, in the embodiment described above, the feeding unit and the recovery unit may be linked to enable automatic tape supply.

1 Controller 2 Pick-up device 11 Wafer unit 13 Wafer 23 Chip 23a Broken piece 23b Fracture surface 23c Side surface 23d Corner 100 Chip observation mechanism 102 Back surface observation mechanism 112 Side surface observation mechanism 200 Test device 204 Indenter 210 Support unit 213 Support stand 215 Support section 217 Gap 221 Scale reading section 222 Scale 225 Load measuring device 226 Pressing unit 228 Moving unit 239 Clamping member 240 Drive unit 242 Support structure 244 Guide rail 246 Ball screw 248 Pulse motor 310 Feed-out unit 311 Feed-out roller 312 Peel plate 313 Winding roller 314 Guide roller 320 Collection unit 321 First clamp mechanism 322 Clamp section 323 Moving unit 325 Tape cutter 331 Second clamp mechanism 332 Lower clamp section 333 Upper clamp section 334 Lifting unit Pa Breakage starting point Pb Breakage starting point Pc Breakage starting point S Separator T Tape

Claims (5)

a support unit for supporting a lower surface side of a chip as a test piece;
a pressing unit that is provided with a pressing tool for pressing the supported chip and moves up and down;
A test device comprising:
a delivery unit that delivers the tape wound in a roll so that the tape is placed on the support unit;
a recovery unit for recovering, from the position of the support unit, the chip that has been attached to the tape placed on the support unit and then pressed and broken by the indenter;
A test device comprising: the testing device includes a load measuring device for measuring the load applied by the indenter to the tip;
2. The test device according to claim 1, wherein the test device is capable of measuring the flexural strength of the chip. A method for testing a chip using the test device according to claim 1 or 2, comprising:
a tape placement step of placing the tape on the support unit;
a chip placement step of attaching a chip onto the tape and supporting the chip with the support unit via the tape after the tape placement step is performed;
a chip breaking step of pressing and breaking the chip with the indenter after the chip placement step is performed;
and a chip recovery step of recovering the chip attached to the tape in the recovery unit after the chip destruction step is performed. After carrying out the chip recovery step,
A fracture origin detection step of imaging the recovered chip fragments and detecting the fracture origin.
4. The method for testing a chip according to claim 3. the test apparatus includes a load measuring device that measures a load applied by the indenter to the tip supported by the support unit;
5. The chip testing method according to claim 3, further comprising obtaining a measurement value of the load measuring device when the chip is broken in the chip breaking step.