JP4993806B2 - Composition for optical material, optical material, method for producing the same, and liquid crystal display device using the same - Google Patents
Composition for optical material, optical material, method for producing the same, and liquid crystal display device using the same Download PDFInfo
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- JP4993806B2 JP4993806B2 JP2000398382A JP2000398382A JP4993806B2 JP 4993806 B2 JP4993806 B2 JP 4993806B2 JP 2000398382 A JP2000398382 A JP 2000398382A JP 2000398382 A JP2000398382 A JP 2000398382A JP 4993806 B2 JP4993806 B2 JP 4993806B2
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- optical material
- carbon
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- optical
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- 229920001400 block copolymer Polymers 0.000 description 1
- 239000002981 blocking agent Substances 0.000 description 1
- 239000004202 carbamide Chemical group 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- LDKSTCHEYCNPDS-UHFFFAOYSA-L carbon monoxide;dichloroplatinum Chemical compound O=C=[Pt](Cl)(Cl)=C=O LDKSTCHEYCNPDS-UHFFFAOYSA-L 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005119 centrifugation Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910002026 crystalline silica Inorganic materials 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- AFZSMODLJJCVPP-UHFFFAOYSA-N dibenzothiazol-2-yl disulfide Chemical compound C1=CC=C2SC(SSC=3SC4=CC=CC=C4N=3)=NC2=C1 AFZSMODLJJCVPP-UHFFFAOYSA-N 0.000 description 1
- LDCRTTXIJACKKU-ARJAWSKDSA-N dimethyl maleate Chemical compound COC(=O)\C=C/C(=O)OC LDCRTTXIJACKKU-ARJAWSKDSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000004210 ether based solvent Substances 0.000 description 1
- 238000006266 etherification reaction Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 229910000037 hydrogen sulfide Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000005453 ketone based solvent Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000003760 magnetic stirring Methods 0.000 description 1
- 150000002688 maleic acid derivatives Chemical class 0.000 description 1
- 239000006078 metal deactivator Substances 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 125000005394 methallyl group Chemical group 0.000 description 1
- 238000001393 microlithography Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- PKELYQZIUROQSI-UHFFFAOYSA-N phosphane;platinum Chemical class P.[Pt] PKELYQZIUROQSI-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- 150000004980 phosphorus peroxides Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical compound Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 229910000027 potassium carbonate Inorganic materials 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000000979 retarding effect Effects 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229910052938 sodium sulfate Inorganic materials 0.000 description 1
- 235000011152 sodium sulphate Nutrition 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
Description
【0001】
【発明の属する技術分野】
本発明は光学用材料に関するものであり、更に詳しくは、高い耐熱性を有し、光学的透明性が高く、さらに強靭性を有する光学用材料用組成物、光学用材料、その製造方法、およびそれを用いた液晶表示装置に関するものである。
【0002】
【従来の技術】
液晶表示装置用をはじめとする光学用材料としては、複屈折率が低く、光弾性係数が小さく、光学的透明性の高い材料が使用される。また、液晶表示装置用等の材料の場合には、製造プロセス上使用する材料には高い耐熱性が必要である。こういった要求を満足する材料として従来ガラス等が使用されてきた。
【0003】
液晶表示装置用をはじめとする光学用材料は薄いフィルム状あるいは細いチューブやロッド状で多く使用されるが、近年の市場要求に従い、より薄いフィルム状、あるいはより細いチューブまたはロッド状での使用が必要になってきている。しかし、従来使用されてきたガラスは強度的に脆い性質を有しているため、使用範囲に限界が生じてきている。
【0004】
強靭性のある材料としては高分子材料があるが、例えば熱可塑性樹脂の場合は、一般に高い耐熱性を発現させるために芳香族骨格を導入すると、複屈折率が高くなり光弾性係数が大きくなるため、高い耐熱性と光学的性能の両立が困難である。また熱硬化性樹脂の場合は、従来知られている熱硬化性樹脂は一般に着色しており、光学用材料用途には向かない。さらに、一般に極性を有しており光学的性能発現にも不利である。
【0005】
【発明が解決しようとする課題】
従って、本発明の目的は、高い耐熱性を有し、複屈折率が低く、光弾性係数が小さく、光学的透明性が高く、さらに強靭性を有する光学用材料用組成物、光学用材料、その製造方法、およびそれを用いた液晶表示装置およびLEDを提供することである。
【0006】
【課題を解決するための手段】
かかる課題を解決するために本発明者らは鋭意研究の結果、SiH基と反応性を有する炭素−炭素二重結合を1分子中に少なくとも2個含有する有機化合物、と1分子中に少なくとも2個のSiH基を含有するケイ素化合物を必須成分として光学用材料用組成物とすることにより、上記課題を解決できることを見出し、本発明に至った。
【0007】
すなわち、本発明は、
(A)SiH基と反応性を有する炭素−炭素二重結合を1分子中に少なくとも2個含有する有機系骨格からなる有機化合物、(B)1分子中に少なくとも2個のSiH基を含有するケイ素化合物、(C)ヒドロシリル化触媒、を必須成分として含有する組成物からなることを特徴とする光学材料用組成物(請求項1)であり、
請求項1記載の組成物において、上記(A)成分がSiH基と反応性を有するビニル基を1分子中に少なくとも1個(請求項2)であり、
請求項1記載の組成物において、上記(A)成分がSiH基と反応性を有するアリル基を1分子中に少なくとも1個含有する有機系骨格からなる有機化合物であることを特徴とする光学材料用組成物(請求項3)であり、
請求項1記載の組成物において、上記(A)成分がポリブタジエン、ビニルシクロヘキセン、シクロペンタジエン、ジシクロペンタジエン、ジビニルビフェニル、またはビスフェノールAジアリルエーテルであることを特徴とする光学材料用組成物(請求項4)であり、
請求項1記載の組成物において、上記(A)成分がトリアリルイソシアヌレート、トリビニルシクロヘキサンであることを特徴とする光学材料用組成物(請求項5)であり、
光学用材料が液晶用フィルムである請求項1乃至5のいずれか一項に記載の光学材料用組成物(請求項6)であり、
光学用材料が液晶用プラスチックセルである請求項1乃至5のいずれか一項に記載の光学材料用組成物(請求項7)であり、
光学用材料がLEDの封止材である請求項1乃至6のいずれか一項に記載の光学材料用組成物(請求項8)であり、
請求項1乃至8のいずれか一項に記載の光学用材料用組成物をあらかじめ混合し、組成物中のSiH基と反応性を有する炭素−炭素二重結合とSiH基の一部または全部を反応させることによって硬化させてなる光学用材料(請求項9)であり、
請求項1乃至8にいずれか一項に記載の光学用材料用組成物をあらかじめ混合し、組成物中のSiH基と反応性を有する炭素−炭素二重結合とSiH基の一部または全部を反応させることによる請求項9に記載の光学用材料の製造方法(請求項10)であり、
請求項9に記載の光学用材料を用いた液晶表示装置(請求項11)であり、
請求項9に記載の光学用材料を用いたLED(請求項12)である。
【0008】
【発明の実施の形態】
以下、本発明を詳細に説明する。
【0009】
まず、本発明における(A)成分について説明する。
【0010】
(A)成分はSiH基と反応性を有する炭素−炭素二重結合を1分子中に少なくとも2個含有する有機系骨格からなる有機化合物である。有機系骨格としてはポリシロキサン−有機ブロックコポリマーやポリシロキサン−有機グラフトコポリマーのようなシロキサン単位(Si−O−Si)を含むものではなく、構成元素としてC、H、N、O、S、ハロゲンのみを含む骨格であることが好ましい。シロキサン単位を含むものの場合は、ガス透過性やはじきの問題がある。
【0011】
(A)成分において、その構造を骨格部分と、その骨格に共有結合によって(場合によっては2価以上の置換基を介して)結合していてかつSiH基と反応性を有する炭素−炭素二重結合を有する基(アルケニル基)とに分けて表した場合、アルケニル基は分子内のどこに存在してもよい。
【0012】
有機化合物である(A)成分の骨格としては、特に限定はなく有機重合体骨格または有機単量体骨格を用いればよい。
【0013】
有機重合体骨格の例としては、ポリエーテル系、ポリエステル系、ポリアリレート系、ポリカーボネート系、飽和炭化水素系、ポリアクリル酸エステル系、ポリアミド系、フェノール−ホルムアルデヒド系(フェノール樹脂系)、ポリイミド系の骨格を用いることができる。
【0014】
また単量体骨格としては例えばフェノール系、ビスフェノール系、ベンゼン、ナフタレンなどの芳香族炭化水素系、脂肪族炭化水素系、およびこれらの混合物が挙げられる。
【0015】
(A)成分のアルケニル基としてはSiH基と反応性を有するものであれば特に制限されないが、下記一般式(I)
【0016】
【化1】
(式中R1は水素原子あるいはメチル基を表す。)で示されるアルケニル基が反応性の点から好適である。また、原料の入手の容易さからは、
【0017】
【化2】
が特に好ましい。
【0018】
(A)成分のアルケニル基としては、下記一般式(II)
【0019】
【化3】
(式中R1は水素原子あるいはメチル基を表す。)で示されるアルケニル基が、硬化物の耐熱性が高いという点から好適である。また、原料の入手の容易さからは、
【0020】
【化4】
が特に好ましい。
【0021】
アルケニル基は2価以上の置換基を介して(A)成分の骨格部分に共有結合していても良く、2価以上の置換基としては炭素数0〜10の置換基であれば特に制限はないが、構成元素としてC、H、N、O、S、ハロゲンのみを含むものが好ましい。これらの置換基の例としては、
【0022】
【化5】
【0023】
【化6】
が挙げられる。また、これらの2価以上の置換基の2つ以上が共有結合によりつながって1つの2価以上の置換基を構成していてもよい。
【0024】
以上のような骨格部分に共有結合する基の例としては、ビニル基、アリル基、メタリル基、アクリル基、メタクリル基、2−ヒドロキシ−3−(アリルオキシ)プロピル基、2−アリルフェニル基、3−アリルフェニル基、4−アリルフェニル基、2−(アリルオキシ)フェニル基、3−(アリルオキシ)フェニル基、4−(アリルオキシ)フェニル基、2−(アリルオキシ)エチル基、2、2−ビス(アリルオキシメチル)ブチル基、3−アリルオキシ−2、2−ビス(アリルオキシメチル)プロピル基、
【0025】
【化7】
が挙げられる。
【0026】
(A)成分としては、上記のように骨格部分とアルケニル基とに分けて表現しがたい、低分子量化合物も用いることができる。これらの低分子量化合物の具体例としては、ブタジエン、イソプレン、オクタジエン、デカジエンなどの脂肪族鎖状ポリエン化合物系、シクロペンタジエン、シクロオクタジエン、ジシクロペンタジエン、トリシクロペンタジエン、ノルボルナジエン、トリアリルイソシアヌレート、トリビニルシクロヘキサンなどの脂肪族環状ポリエン化合物系、ビニルシクロペンテン、ビニルシクロヘキセンなどの置換脂肪族環状オレフィン化合物系などが挙げられる。
【0027】
上記した(A)成分としては、耐熱性をより向上し得るという観点から、SiH基と反応性を有する炭素−炭素二重結合を(A)成分1gあたり0.001mol以上含有するものであればよいが、さらに、1gあたり0.005mol以上含有するものが好ましく、0.008mol以上含有するものが特に好ましい。具体的な例としては、ブタジエン、イソプレン、ビニルシクロヘキセン、シクロペンタジエン、ジシクロペンタジエン、シクロヘキサジエン、デカジエン、ジアリルフタレート、トリメチロールプロパンジアリルエーテル、ペンタエリスリトールトリアリルエーテル、ジビニルベンゼン類(純度50〜100%のもの、好ましくは純度80〜100%のもの)、1、3−ジイソプロペニルベンゼン、1、4−ジイソプロペニルベンゼン、およびそれらのオリゴマー、1,2−ポリブタジエン(1、2比率10〜100%のもの、好ましくは1、2比率50〜100%のもの)、トリアリルイソシアヌレート、トリビニルシクロヘキサン
【0028】
【化8】
などが挙げられる。
【0029】
また、(A)成分としては、複屈折率が低い、光弾性係数が低いなどのように光学特性が良好であるという観点からは、芳香環の(A)成分中の成分重量比が50wt%以下であるものが好ましく、40wt%以下のものがより好ましく、30%以下のものがさらに好ましい。最も好ましいのは芳香環を含まないものである。
【0030】
得られる硬化物の着色が少なく光学的透明性が高いという観点、および耐光着色性が少ないという観点から、(A)成分としては、ビニルシクロヘキセン、ジシクロペンタジエン、トリアリルイソシアヌレート、トリビニルシクロヘキサンが好ましく、中でもトリアリルイソシアヌレート、トリビニルシクロヘキサンがより好ましい。
【0031】
(A)成分のSiH基と反応性を有する炭素−炭素二重結合の数は、平均して1分子当たり少なくとも2個あればよいが、耐熱性をより向上し得るという観点から、2を越えることが好ましく、3個以上であることがより好ましく、4個以上であることが特に好ましい。(A)成分のSiH基と反応性を有する炭素−炭素二重結合の数が1分子内当たり1個以下の場合は、(B)成分と反応してもグラフト構造となるのみで架橋構造とならない。
(A)成分としては、他の成分との均一な混合、および良好な作業性を得るためには100℃以下の温度において流動性があるものが好ましく、線状でも枝分かれ状でもよく、分子量は特に制約はないが、50〜100,000の任意のものが好適に使用できる。分子量が100、000以上では一般に原料が高粘度となり作業性に劣るとともに、アルケニル基とSiH基との反応による架橋の効果が発現し難い。
さらに(B)成分との反応性を高めるため、(A)成分としてはSiH基と反応性を有するビニル基を1分子中に少なくとも1個含有する有機系骨格からなる有機化合物であることが好ましく、さらに好ましくはビニル基を1分子中に少なくとも2個含有する有機系骨格からなる有機化合物であることが好ましい。
また、(B)成分との反応性をさらに高めるため、(A)成分としてはSiH基と反応性を有するアリル基を1分子中に少なくとも1個含有する有機系骨格からなる有機化合物であることが好ましく、さらに好ましくはビニル基を1分子中に少なくとも2個含有する有機系骨格からなる有機化合物であることが好ましい。また、その工業的入手性の容易さから、好ましい(A)成分の具体例としてポリブタジエン、ビニルシクロヘキセン、シクロペンタジエン、ジシクロペンタジエン、ジビニルビフェニル、トリアリルイソシアヌレート、トリビニルシクロヘキサンまたはビスフェノールAジアリルエーテルを挙げることが出来る。
【0032】
次に、(B)成分であるSiH基を有する化合物について説明する。
本発明に使用できるSiH基を有する化合物については特に制限がなく、例えば国際公開WO96/15194に記載される化合物で、1分子中に少なくとも2個のSiH基を有するものなどが使用できる。
【0033】
これらのうち、入手性の面からは、1分子中に少なくとも2個のSiH基を有する鎖状、及び/又は、環状ポリオルガノシロキサンが好ましく、(A)成分との相溶性が良いという観点から、さらに、下記一般式(III)
【0034】
【化9】
(式中、R2は炭素数1〜6の有機基を表し、nは3〜10の数を表す。)で表される、1分子中に少なくとも2個のSiH基を有する環状ポリオルガノシロキサンが好ましい。なお、一般式(III)で表される化合物中の置換基R2は、C、H、Oから構成されるものであることが好ましく、炭化水素基であることがより好ましい。
【0035】
また、前記(A)成分と良好な相溶性を有するという観点からは、鎖状、及び/又は、環状ポリオルガノシロキサンと、炭素−炭素二重結合を有する有機化合物から選ばれた1種以上の化合物(以降(E)成分と称する)との反応物も好ましい。この場合、反応物の(A)成分との相溶性をさらに高めるために、反応物から未反応のシロキサン類などを脱揮などにより除去したものを用いることもできる。
【0036】
(E)成分はSiH基と反応性を有する炭素−炭素二重結合を1分子中に少なくとも1個含有する有機系骨格からなる有機化合物であって、前記(A)成分と同じ説明のものも使用できる。
【0037】
(B)成分の(A)成分に対する相溶性が高くし得るという観点からは、(E)成分の好ましい具体例として、ノボラックフェノールのアリルエーテルおよびビスフェノールAジアリルエーテル、2、2’−ジアリルビスフェノールA、ジアリルフタレート、フタル酸のビス(2−アリルオキシエチル)エステル、スチレン、α−メチルスチレン、アリル末端ポリプロピレンオキシド及びポリエチレンオキシド、トリアリルイソシアヌレートなどが挙げられる。(E)成分の有機化合物は、単独もしくは2種以上のものを混合して用いることが可能である。
【0038】
上記したような各種(B)成分は単独もしくは2種以上のものを混合して用いることが可能である。
【0039】
上記したような(A)成分と(B)成分の混合比率は、必要な強度を失わない限りは特に限定されないが、一般に前記(A)成分中のSiH基と反応性を有する炭素−炭素二重結合の数(X)と、前記(B)成分中のSiH基の数(Y)との比が、2≧Y/X≧0.5であることが好ましく。Y/X>2、あるいは0.5>Y/Xの場合は、十分な硬化性が得られず、充分な強度が得られない場合があり、耐熱性も低くなりうる。
【0040】
次に(C)成分であるヒドロシリル化触媒について説明する。ヒドロシリル化触媒としては、ヒドロシリル化反応の触媒活性があれば特に限定されないが、例えば、白金の単体、アルミナ、シリカ、カーボンブラックなどの担体に固体白金を担持させたもの、塩化白金酸、塩化白金酸とアルコール、アルデヒド、ケトンなどとの錯体、白金−オレフィン錯体(例えば、Pt(CH2=CH2)2(PPh3)2、Pt(CH2=CH2)2Cl2)、白金−ビニルシロキサン錯体(例えば、Pt(ViMe2SiOSiMe2Vi)n、Pt[(MeViSiO)4]m)、白金−ホスフィン錯体(例えば、Pt(PPh3)4、Pt(PBu3)4)、白金−ホスファイト錯体(例えば、Pt[P(OPh)3]4、Pt[P(OBu)3]4)(式中、Meはメチル基、Buはブチル基、Viはビニル基、Phはフェニル基を表し、n、mは、整数を示す。)、ジカルボニルジクロロ白金、カールシュテト(Karstedt)触媒、また、アシュビー(Ashby)の米国特許第3159601号および3159662号明細書中に記載された白金−炭化水素複合体、ならびにラモロー(Lamoreaux)の米国特許第3220972号明細書中に記載された白金アルコラート触媒が挙げられる。さらに、モディック(Modic)の米国特許第3516946号明細書中に記載された塩化白金−オレフィン複合体も本発明において有用である。
【0041】
また、白金化合物以外の触媒の例としては、RhCl(PPh)3、RhCl3、RhAl2O3、RuCl3、IrCl3、FeCl3、AlCl3、PdCl2・2H2O、NiCl2、TiCl4、などが挙げられる。
【0042】
これらの中では、触媒活性の点から塩化白金酸、白金−オレフィン錯体、白金−ビニルシロキサン錯体などが好ましい。また、これらの触媒は単独で使用してもよく、2種以上併用してもよい。
【0043】
触媒の添加量は特に限定されないが、十分な硬化性を有し、かつ硬化性組成物のコストを比較的低く抑えるために、SiH基1モルに対して、10-1〜10-8モルの範囲が好ましく、より好ましくは、10-2〜10-6モルの範囲である。
【0044】
また、上記触媒には助触媒を併用することが可能であり、例としてトリフェニルホスフィンなどのリン系化合物、ジメチルマレエートなどの1、2−ジエステル系化合物、2−ヒドロキシ−2−メチル−1−ブチンなどのアセチレンアルコール系化合物、単体の硫黄などの硫黄系化合物、トリエチルアミンなどのアミン系化合物などが挙げられる。助触媒の添加量は特に限定されないが、触媒1モルに対して、10-2〜102モルの範囲が好ましく、より好ましくは10-1〜10モルの範囲である。
【0045】
さらに本発明の組成物の保存安定性を改良する目的、あるいは製造過程でのヒドロシリル化反応の反応性を調整する目的で、硬化遅延剤を使用することができる。硬化遅延剤としては、脂肪族不飽和結合を含有する化合物、有機リン化合物、有機イオウ化合物、窒素含有化合物、スズ系化合物、有機過酸化物などが挙げられ、これらを併用してもかまわない。脂肪族不飽和結合を含有する化合物として、プロパギルアルコール類、エン−イン化合物類、マレイン酸エステル類などが例示される。有機リン化合物としては、トリオルガノフォスフィン類、ジオルガノフォスフィン類、オルガノフォスフォン類、トリオルガノフォスファイト類などが例示される。有機イオウ化合物としては、オルガノメルカプタン類、ジオルガノスルフィド類、硫化水素、ベンゾチアゾール、ベンゾチアゾールジサルファイドなどが例示される。窒素含有化合物としては、アンモニア、1〜3級アルキルアミン類、アリールアミン類、尿素、ヒドラジンなどが例示される。スズ系化合物としては、ハロゲン化第一スズ2水和物、カルボン酸第一スズなどが例示される。有機過酸化物としては、ジ−t−ブチルペルオキシド、ジクミルペルオキシド、ベンゾイルペルオキシド、過安息香酸t−ブチルなどが例示される。
【0046】
これらの硬化遅延剤のうち、遅延活性が良好で原料入手性がよいという観点からは、ベンゾチアゾール、チアゾール、ジメチルマレート、3−ヒドロキシ−3−メチル−1−ブチンが好ましい。
【0047】
貯蔵安定性改良剤の添加量は、使用するヒドロシリル化触媒1molに対し、10-1〜103モルの範囲が好ましく、より好ましくは1〜50モルの範囲である。
【0048】
本発明の組成物としては上記したように各種組み合わせのものが使用できるが、耐熱性が良好であるという観点から、組成物を硬化させて得られる硬化物のTgが50℃以上となるものが好ましく、100℃以上となるものがさらに好ましく、150℃以上となるものが特に好ましい。
【0049】
本発明の組成物には必要に応じて無機フィラーを添加してもよい。無機フィラーを添加すると、組成物の流動性の防止、材料の高強度化に効果がある。無機フィラーとしては光学特性を低下させない、微粒子状なものが好ましく、アルミナ、水酸化アルミニウム、溶融シリカ、結晶性シリカ、超微粉無定型シリカや疎水性超微粉シリカ、タルク、硫酸バリウムなどを挙げることができる。
【0050】
また更に、本発明の組成物の特性を改質する目的で、種々の樹脂を添加することも可能である。樹脂としては、ポリカーボネート樹脂、ポリエーテルスルホン樹脂、ポリアリレート樹脂、エポキシ樹脂、シアナート樹脂、フェノール樹脂、アクリル樹脂、ポリイミド樹脂、ポリビニルアセタール樹脂、ウレタン樹脂及びポリエステル樹脂などが例示されるがこれに限定されるものではない。
【0051】
本発明の組成物をそのままフィルムなどに成形することも可能であるが、該組成物を有機溶剤に溶解してワニスとすることも可能である。使用できる溶剤は特に限定されるものではなく、具体的に例示すれば、ベンゼン、トルエン、ヘキサン、ヘプタンなどの炭化水素系溶媒、テトラヒドロフラン、1, 4−ジオキサン、ジエチルエーテルなどのエーテル系溶媒、アセトン、メチルエチルケトンなどのケトン系溶媒、クロロホルム、塩化メチレン、1, 2−ジクロロエタンなどのハロゲン系溶媒を好適に用いることができる。溶媒は2種類以上の混合溶媒として用いることもできる。溶媒としては、トルエン、テトラヒドロフラン、クロロホルムが好ましい。使用する溶媒量は、用いる反応性(A)成分1gに対し、0〜10 mLの範囲で用いるのが好ましく、0.5〜5mLの範囲で用いるのがさらに好ましく、1〜3mLの範囲で用いるのが特に好ましい。使用量が少ないと、低粘度化などの溶媒を用いることの効果が得られにくく、また、使用量が多いと、材料に溶剤が残留して熱クラックなどの問題となり易く、またコスト的にも不利になり工業的利用価値が低下する。
【0052】
本発明の組成物には、その他、老化防止剤、ラジカル禁止剤、紫外線吸収剤、接着性改良剤、難燃剤、界面活性剤、保存安定改良剤、オゾン劣化防止剤、光安定剤、増粘剤、可塑剤、カップリング剤、酸化防止剤、熱安定剤、導電性付与剤、帯電防止剤、放射線遮断剤、核剤、リン系過酸化物分解剤、滑剤、金属不活性化剤、物性調整剤などを本発明の目的および効果を損なわない範囲において添加することができる。
【0053】
本発明で言う光学用材料とは、可視光、赤外線、紫外線、X線、レーザーなどの光をその材料中を通過させる用途に用いる材料一般を示す。
【0054】
より具体的には、液晶ディスプレイ分野における基板材料、導光板、プリズムシート、偏向板、位相差板、視野角補正フィルム、接着剤、偏光子保護フィルムなどの液晶用フィルムなどの液晶表示装置周辺材料である。また、次世代フラットパネルディスプレイとして期待されるカラーPDP(プラズマディスプレイ)の封止剤、反射防止フィルム、光学補正フィルム、ハウジング材、前面ガラスの保護フィルム、前面ガラス代替材料、接着剤、またLED表示装置に使用される前面ガラスの保護フィルム、前面ガラス代替材料、接着剤、またプラズマアドレス液晶(PALC)ディスプレイにおける基板材料、導光板、プリズムシート、偏向板、位相差板、視野角補正フィルム、接着剤、偏光子保護フィルム、また有機EL(エレクトロルミネッセンス)ディスプレイにおける前面ガラスの保護フィルム、前面ガラス代替材料、接着剤、またフィールドエミッションディスプレイ(FED)における各種フィルム基板、前面ガラスの保護フィルム、前面ガラス代替材料、接着剤である。
【0055】
光記録分野では、VD(ビデオディスク)、CD/CD−ROM、CD−R/RW、DVD−R/DVD−RAM、MO/MD、PD(相変化ディスク)、光カード用のディスク基板材料、ピックアップレンズ、保護フィルム、封止剤、接着剤などである。
【0056】
光学機器分野では、スチールカメラのレンズ用材料、ファインダプリズム、ターゲットプリズム、ファインダーカバー、受光センサー部である。また、ビデオカメラの撮影レンズ、ファインダーである。またプロジェクションテレビの投射レンズ、保護フィルム、封止剤、接着剤などである。光センシング機器のレンズ用材料、封止剤、接着剤、フィルムなどである。
【0057】
光部品分野では、光通信システムでの光スイッチ周辺のファイバー材料、レンズ、導波路、素子の封止剤、接着剤などである。光コネクタ周辺の光ファイバー材料、フェルール、封止剤、接着剤などである。光受動部品、光回路部品ではレンズ、導波路、LED素子の接着剤などである。光電子集積回路(OEIC)周辺の基板材料、ファイバー材料、素子の封止剤、接着剤などである。
【0058】
光ファイバー分野では、装飾ディスプレイ用照明・ライトガイドなど、工業用途のセンサー類、表示・標識類など、また通信インフラ用および家庭内のデジタル機器接続用の光ファイバーである。
【0059】
半導体集積回路周辺材料では、LSI、超LSI材料用のマイクロリソグラフィー用のレジスト材料である。
【0060】
自動車・輸送機分野では、自動車用のランプリフレクタ、耐蝕コート、スイッチ部分、ヘッドランプ、電装部品、各種内外装品、自動車用防錆鋼板、保護・結束用ワイヤーネス、自動車ランプ、ガラス代替品である。また、鉄道車輌用の複層ガラスである。また、航空機の保護・結束用ワイヤーネス、耐蝕コートである。
【0061】
建築分野では、内装・加工用材料、電気カバー、シート、ガラス中間膜、ガラス代替品、太陽電池周辺材料である。農業用では、ハウス被覆用フィルムである。
【0062】
次世代の光・電子機能有機材料としては、有機EL素子周辺材料、有機フォトリフラクティブ素子、光−光変換デバイスである光増幅素子、光演算素子、有機太陽電池周辺の基板材料、ファイバー材料、素子の封止剤、接着剤などである。
【0063】
本発明の光学材料用組成物は、あらかじめ混合し、組成物中のSiH基と反応性を有する炭素−炭素二重結合とSiH基の一部または全部を反応させることによって硬化させて光学用材料とすることができる。
【0064】
混合の方法としては、各種方法をとることができるが、(A)成分に(C)成分を混合したものと、(B)成分を混合する方法が好ましい。(A)成分と(B)成分との混合物に(C)成分を混合する方法だと反応の制御が困難である。(B)成分に(C)成分を混合したものに(A)成分を混合する方法をとる場合は、(C)成分の存在下(B)成分が水分と反応性を有するため、貯蔵中などに変質することもある。
【0065】
組成物を反応させて硬化させる場合において、(A)、(B)、(C)各成分それぞれの必要量を一度に混合して反応させてもよいが、一部を混合して反応させた後残量を混合してさらに反応させる方法や、混合した後反応条件の制御や置換基の反応性の差の利用により組成物中の官能基の一部のみを反応(Bステージ化)させてから成形などの処理を行いさらに硬化させる方法をとることもできる。これらの方法によれば成形時の粘度調整が容易となる。
【0066】
硬化させる方法としては、単に混合するだけで反応させることもできるし、加熱して反応させることもできる。反応が速く、一般に耐熱性の高い材料が得られやすいという観点から加熱して反応させる方法が好ましい。
【0067】
反応温度としては種々設定できるが、例えば30〜300℃の温度が適用でき、100〜250℃がより好ましく、150〜200℃がさらに好ましい。反応温度が低いと十分に反応させるための反応時間が長くなり、反応温度が高いと成形加工が困難となりやすい。
【0068】
反応は一定の温度で行ってもよいが、必要に応じて多段階あるいは連続的に温度を変化させてもよい。
【0069】
反応時間も種々設定できる。
【0070】
反応時の圧力も必要に応じ種々設定でき、常圧、高圧、あるいは減圧状態で反応させることもできる。
【0071】
硬化させて得られる光学用材料の形状も用途に応じて種々とりうるので特に限定されないが、例えばフィルム状、シート状、チューブ状、ロッド状、塗膜状、バルク状などの形状とすることができる。
【0072】
成形する方法も従来の熱硬化性樹脂の成形方法をはじめとして種々の方法をとることができる。例えば、キャスト法、プレス法、注型法、トランスファー成形法、コーティング法、RIM法などの成形方法を適用することができる。成形型は研磨ガラス、硬質ステンレス研磨板、ポリカーボネート板、ポリエチレンテレフタレート板、ポリメチルメタクリレート板等を適用することができる。また、成形型との離型性を向上させるためポリエチレンテレフタレートフィルム、ポリカーボネートフィルム、ポリ塩化ビニルフィルム、ポリエチレンフィルム、ポリテトラフルオロエチレンフィルム、ポリプロピレンフィルム、ポリイミドフィルム等を適用することができる。
【0073】
成形時に必要に応じ各種処理を施すこともできる。例えば、成形時に発生するボイドの抑制のために組成物あるいは一部反応させた組成物を遠心、減圧などにより脱泡する処理、プレス時に一旦圧力を開放する処理などを適用することもできる。
【0074】
本発明の光学用材料を用いて液晶表示装置を製造することができる。
【0075】
この場合、本発明の光学用材料を液晶用プラスチックセル、偏光板、位相差板、偏光子保護フィルムなどの液晶用フィルムとして使用し、通常の方法によって液晶表示装置を製造すればよい。
【0076】
本発明の光学用材料を用いてLEDを製造することができる。
【0077】
この場合、本発明の光学用材料をLEDの封止材として使用し、通常の方法によってLEDを製造すればよい。
【0078】
【実施例】
以下に、本発明の実施例および比較例を示すが、本発明は以下によって限定されるものではない。
(合成例1)
1Lの3つ口フラスコに、撹拌装置、冷却管をセットした。このフラスコに、ビスフェノールA114g、炭酸カリウム145g、アリルブロマイド140g、アセトン250mLを入れ、60℃で12時間撹拌した。上澄み液をとり、分液ロートで水酸化ナトリウム水溶液により洗浄し、その後水洗した。油層を硫酸ナトリウムで乾燥させた後、エバポレーターで溶媒を留去したところ、淡黄色の液体126gが得られた。1H−NMRにより、ビスフェノールAのOH基がアリルエーテル化したビスフェノールAジアリルエーテルであることがわかった。収率は82%であり純度は95%以上であった。
(実施例1)
1Lの4つ口フラスコに、攪拌装置、冷却管、滴下漏斗をセットした。このフラスコにトルエン150g、白金ビニルシロキサン錯体のキシレン溶液(白金として3wt%含有)15.6μL、1、3、5、7−テトラメチルシクロテトラシロキサン500gを加えてオイルバス中で70℃に加温、攪拌した。合成例1で製造したビスフェノールAジアリルエーテル64gをトルエン40gで希釈して滴下漏斗から滴下した。同温で60分攪拌後放冷し、ベンゾチアゾール4.74mgを添加した。未反応の1、3、5、7−テトラメチルシクロテトラシロキサンおよびトルエンを減圧留去し、やや粘ちょうな液体を得た。1H−NMRによりこのものは1、3、5、7−テトラメチルシクロテトラシロキサンのSiH基の一部がビスフェノールAジアリルエーテルと反応したもの(部分反応物Aと称す)であることがわかった。
(実施例2)
合成例1で製造したビスフェノールAジアリルエーテル16.09gと部分反応物A15.41g、とをカップ中で混合し、約1torrの減圧下で1時間脱泡した。実施例1で示したように部分反応物Aは本発明の(C)成分としての白金ビニルシロキサン錯体を含有している。このものを端に沿って1cm幅、0.36mm厚みのシリコーンゴムシートを付けた鏡面研磨仕上げ(#1200研磨仕上げ)のステンレス研磨板に流し、上部よりさらに一枚の鏡面研磨仕上げ(#1200研磨仕上げ)のステンレス研磨板で挟み込み、100℃/45分、続けて150℃/2.5時間加熱を行い目視で均一かつ無色透明のシートを得た。
(実施例3)
合成例1で製造したビスフェノールAジアリルエーテル3.08gと、1、3、5、7−テトラメチルシクロテトラシロキサン1.20gと、白金ビニルシロキサン錯体のキシレン溶液(白金として0.25wt%含有)3μLとを混合して本発明の組成物とした。このものを直径6.7cmの軟膏缶に流延し、オーブン中で50℃から120℃まで5時間かけて昇温し透明フィルムを得た。このものを2枚のガラス板にはさみ、窒素気流下(20mL/分)150℃で3時間加熱硬化させた。得られた材料は目視で均一透明であり、強靭性を有していた。
(実施例4)
合成例1で製造したビスフェノールAジアリルエーテル6.16gと、1、3、5、7−テトラメチルシクロテトラシロキサン2.40gと、白金ビニルシロキサン錯体のキシレン溶液(白金として0.5wt%含有)3μLとを混合して本発明の組成物とした。このものをすきま2mm厚のガラスセルにポリイミドフィルムを離型フィルムとして用いて充填し、75℃で30分、110℃で30分、さらに150℃で12時間加熱硬化させた。得られた材料は目視で均一かつ無色透明であった。
(実施例5)
1,2−ポリブタジエン(日本曹達社製B−1000)1.27gと、1、3、5、7−テトラメチルシクロテトラシロキサン1.20gと、白金ビニルシロキサン錯体のキシレン溶液(白金として0.25wt%含有)10μLとを混合して本発明の組成物とした。このものを直径6.7cmの軟膏缶に流延し、オーブン中で50℃から120℃まで5時間かけて昇温し透明フィルムを得た。このものを2枚のガラス板にはさみ、窒素気流下(20mL/分)150℃で3時間加熱硬化させた。得られた材料は目視で均一透明であり、強靭性を有していた。
(実施例6)
1,2−ポリブタジエン(日本曹達社製B−1000)5.08gと、1、3、5、7−テトラメチルシクロテトラシロキサン4.80gと、白金ビニルシロキサン錯体のキシレン溶液(白金として0.25wt%含有)40μLとを混合して本発明の組成物とした。このものをすきま2mm厚のガラスセルにポリイミドフィルムを離型フィルムとして用いて充填し、75℃で30分、110℃で30分、さらに150℃で12時間加熱硬化させた。得られた材料は目視で均一かつ無色透明であった。
(実施例7)
1,2−ポリブタジエン(日本曹達社製B−1000)1.27gと4−ビニルシクロヘキセン1.08g、1、3、5、7−テトラメチルシクロテトラシロキサン2.40gと、白金ビニルシロキサン錯体のキシレン溶液(白金として0.25wt%含有)20μLとを混合して本発明の組成物とした。このものを直径6.7cmの軟膏缶に流延し、オーブン中で50℃から120℃まで5時間かけて昇温し透明フィルムを得た。このものを2枚のガラス板にはさみ、窒素気流下(20mL/分)150℃で3時間加熱硬化させた。得られた材料は目視で均一透明であり、強靭性を有していた。
(実施例8)
実施例2と同じ組成物を、約1torrの減圧下で1時間脱泡した後、結晶化PETフィルムを離型フィルムとして用い、0.3mm厚のシリコーンゴムをスペーサーとして用いて150℃の温度で1時間3kg/cm2の圧力でプレス成形した。得られた材料は実施例2で得た材料と同様の性状を有していた。
(実施例9)
ジシクロペンタジエン7.2gと、1、3、5、7−テトラメチルシクロテトラシロキサン6.0gと、白金ビニルシロキサン錯体のキシレン溶液(白金として3wt%含有)50.0μLとを混合して本発明の組成物とした。このものを実施例3と同じ方法で加熱硬化させた。得られた材料は目視で均一かつ無色透明であった。
(実施例10)
ジビニルビフェニル(新日鐵化学社製DVB−960)8.0gと、1、3、5、7−テトラメチルシクロテトラシロキサン7.2gと、白金ビニルシロキサン錯体のキシレン溶液(白金として0.5wt%含有)5.0μLとを混合して本発明の組成物とした。このものを実施例3と同じ方法で加熱硬化させた。得られた材料は目視で均一かつ無色透明であった。
(実施例11)
ジビニルビフェニル(新日鐵化学社製DVB−960)8.0gと、ポリメチルハイドロジェンシロキサン(信越化学社製KF−99)7.7gと、白金ビニルシロキサン錯体のキシレン溶液(白金として0.5wt%含有)5.0μLとを混合して本発明の組成物とした。このものを実施例3と同じ方法で加熱硬化させた。得られた材料は目視で均一かつ無色透明であった。
(実施例12)
200mLの二口フラスコに、磁気攪拌子、冷却管をセットした。このフラスコにトルエン50g、白金ビニルシロキサン錯体のキシレン溶液(白金として3wt%含有)11.3μL、トリアリルイソシアヌレート5.0g、1、3、5、7−テトラメチルシクロテトラシロキサン37.04gを加えて、90℃のオイルバス中で30分加温、攪拌した。さらに130℃のオイルバス中で2時間加熱還流させた。1−エチニル−1−シクロヘキサノール176mgを加えた。未反応の1、3、5、7−テトラメチルシクロテトラシロキサンおよびトルエンを減圧留去した。1H−NMRによりこのものは1、3、5、7−テトラメチルシクロテトラシロキサンのSiH基の一部がトリアリルイソシアヌレートと反応したもの(部分反応物Bと称す)であることがわかった。
(実施例13)
1Lの四つ口フラスコに、攪拌装置、冷却管、滴下漏斗をセットした。このフラスコにトルエン190g、白金ビニルシロキサン錯体のキシレン溶液(白金として3wt%含有)48mg、1、3、5、7−テトラメチルシクロテトラシロキサン236.2gを入れ、オイルバス中で70℃に加熱攪拌した。この溶液に1、2、4−トリビニルシクロヘキサン20.0gのトルエン10g溶液を1時間かけて滴下した。得られた溶液を70℃のオイルバス中で90分加温、攪拌した。1−エチニル−1−シクロヘキサノール9.2mgを加えた。未反応の1、3、5、7−テトラメチルシクロテトラシロキサンおよびトルエンを減圧留去した。1H−NMRによりこのものは1、3、5、7−テトラメチルシクロテトラシロキサンのSiH基の一部が1、2、4−トリビニルシクロヘキサンと反応したもの(部分反応物Cと称す)であることがわかった。
(実施例14)
トリアリルイソシアヌレート2.5gと実施例12で合成した部分反応物B3.0g、とをカップ中で混合し、約1torrの減圧下で30分脱泡した。実施例12で示したように部分反応物Bは本発明の(C)成分としての白金ビニルシロキサン錯体を含有している。このものを、2枚のガラス板に3mm厚みのシリコーンゴムシートをスペーサーとしてはさみこんで作成したセルに流し、80℃/60分、100℃/60分、120℃/60分加熱を行い目視で均一かつ無色透明の硬化物を得た。
(実施例15)
1、2、4−トリビニルシクロヘキサン1.00gと実施例13で合成した部分反応物C1.87g、とをカップ中で混合した。実施例13で示したように部分反応物Cは本発明の(C)成分としての白金ビニルシロキサン錯体を含有している。このものを、2枚のガラス板に3mm厚みのシリコーンゴムシートをスペーサーとしてはさみこんで作成したセルに流し、100℃/60分加熱した。得られたゴム状の部分硬化物をセルからはずしてあらためて2枚のガラス板にはさみこみ、120℃/180分、150℃/60分加熱を行い目視で均一かつ無色透明の硬化物を得た。
(比較例1)
帝人化成(株)製ポリカーボネート樹脂C−1400(平均分子量37000)を用いてフィルム(厚み:100μm、3mm)を作製し光学特性を評価した。
(測定例1)
実施例2〜7、比較例1で得られた試料について光学特性を評価した。
【0079】
リターデーション:フィルムから20mm×20mmのサイズで試験片を切り出した。温度25℃、湿度50%において、オーク製作所製顕微偏光分光光度計(波長515nm)を用いて各試験片について無荷重の場合の角位相を測定し、次式よりリターデーション値を求めた。
リターデーション=(角位相−90)/180×515
全光線透過率:フィルムから30mm×30mmのサイズで試験片を切り出した。温度23℃、湿度50%において、日本電色工業製濁度計300Aを用いて測定した。
【0080】
【表1】
表1から明らかなように、本発明の光学用材料はポリカーボネートフィルムと比較して、低複屈折を持ち、高全光線透過率である優れた性能を有する。
(測定例2)
実施例2、実施例14、および実施例15で作成した硬化物をスガ試験機SX120型キセノンウェザーメーター(ブラックパネル温度63℃、照射2時間中降雨18分)にて70時間照射して硬化物の状態を目視で観察した。
【0081】
実施例2の硬化物はやや黄変がみられたが、実施例14、実施例15で作成した硬化物は黄変がみられず、無色透明の状態を保った。
【0082】
【発明の効果】
本発明の組成物から製造した材料は、複屈折率が低く、光学的透明性が高く、さらに強靭性を有する光学用材料用に適した材料である。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an optical material. More specifically, the present invention relates to an optical material composition having high heat resistance, high optical transparency, and toughness, an optical material, a production method thereof, The present invention relates to a liquid crystal display device using the same.
[0002]
[Prior art]
As an optical material including liquid crystal display devices, a material having a low birefringence, a small photoelastic coefficient, and a high optical transparency is used. In the case of a material for a liquid crystal display device or the like, the material used in the manufacturing process needs high heat resistance. Conventionally, glass or the like has been used as a material that satisfies these requirements.
[0003]
Optical materials such as those for liquid crystal display devices are often used in the form of thin films or thin tubes or rods, but they can be used in the form of thinner films or thinner tubes or rods in accordance with recent market demands. It is becoming necessary. However, since the glass that has been used conventionally has a brittle property in strength, the range of use has been limited.
[0004]
As a material having toughness, there is a polymer material. For example, in the case of a thermoplastic resin, generally, when an aromatic skeleton is introduced to develop high heat resistance, the birefringence increases and the photoelastic coefficient increases. Therefore, it is difficult to achieve both high heat resistance and optical performance. In the case of a thermosetting resin, conventionally known thermosetting resins are generally colored and are not suitable for optical materials. Furthermore, it generally has polarity, which is disadvantageous for optical performance.
[0005]
[Problems to be solved by the invention]
Therefore, the object of the present invention is to provide a composition for optical materials, optical materials having high heat resistance, low birefringence, low photoelastic coefficient, high optical transparency, and toughness. The manufacturing method, and a liquid crystal display device and LED using the same are provided.
[0006]
[Means for Solving the Problems]
In order to solve such a problem, the present inventors have conducted intensive research, and as a result, have an organic compound containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, and at least 2 in one molecule. The present inventors have found that the above-mentioned problems can be solved by using a silicon compound containing a single SiH group as an essential component for an optical material composition, and the present invention has been achieved.
[0007]
That is, the present invention
(A) An organic compound composed of an organic skeleton containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, and (B) containing at least two SiH groups in one molecule. An optical material composition comprising a composition containing a silicon compound and (C) a hydrosilylation catalyst as essential components.
The composition according to claim 1, wherein the component (A) is at least one vinyl group reactive with SiH groups in one molecule (claim 2).
2. The optical material according to claim 1, wherein the component (A) is an organic compound having an organic skeleton containing at least one allyl group having reactivity with a SiH group in one molecule. Composition (claim 3),
The composition for optical materials according to claim 1, wherein the component (A) is polybutadiene, vinylcyclohexene, cyclopentadiene, dicyclopentadiene, divinylbiphenyl, or bisphenol A diallyl ether (claim). 4)
The composition according to claim 1, wherein the component (A) is triallyl isocyanurate or trivinylcyclohexane (claim 5),
The optical material is a liquid crystal film, the composition for optical material according to any one of claims 1 to 5 (claim 6),
The optical material is a plastic cell for liquid crystal, the composition for optical material according to any one of claims 1 to 5 (claim 7),
The optical material is an LED encapsulant, and is the optical material composition (claim 8) according to any one of claims 1 to 6.
The optical material composition according to any one of claims 1 to 8 is mixed in advance, and a carbon-carbon double bond having reactivity with SiH groups in the composition and part or all of the SiH groups are mixed. An optical material cured by reacting (Claim 9),
The optical material composition according to any one of claims 1 to 8 is preliminarily mixed, and a carbon-carbon double bond having reactivity with SiH groups in the composition and a part or all of SiH groups are mixed. It is a manufacturing method (claim 10) of the optical material according to claim 9 by reacting,
A liquid crystal display device using the optical material according to claim 9 (claim 11),
An LED using the optical material according to claim 9 (claim 12).
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail.
[0009]
First, the component (A) in the present invention will be described.
[0010]
The component (A) is an organic compound composed of an organic skeleton containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule. The organic skeleton does not contain siloxane units (Si—O—Si) such as polysiloxane-organic block copolymers and polysiloxane-organic graft copolymers, and C, H, N, O, S, halogens as constituent elements It is preferable that the skeleton contains only. Those containing siloxane units have gas permeability and repelling problems.
[0011]
In the component (A), a carbon-carbon double bond in which the structure is bonded to the skeleton portion by a covalent bond (possibly via a substituent having a valence of 2 or more) and reactive to the SiH group. When divided into groups having a bond (alkenyl group), the alkenyl group may be present anywhere in the molecule.
[0012]
The skeleton of the component (A) that is an organic compound is not particularly limited, and an organic polymer skeleton or an organic monomer skeleton may be used.
[0013]
Examples of organic polymer skeletons include polyether, polyester, polyarylate, polycarbonate, saturated hydrocarbon, polyacrylate, polyamide, phenol-formaldehyde (phenolic resin), and polyimide. A skeleton can be used.
[0014]
Examples of the monomer skeleton include phenolic, bisphenolic, aromatic hydrocarbons such as benzene and naphthalene, aliphatic hydrocarbons, and mixtures thereof.
[0015]
The alkenyl group of the component (A) is not particularly limited as long as it has reactivity with the SiH group, but the following general formula (I)
[0016]
[Chemical 1]
(Where R 1 Represents a hydrogen atom or a methyl group. ) Is preferable from the viewpoint of reactivity. In addition, from the availability of raw materials,
[0017]
[Chemical formula 2]
Is particularly preferred.
[0018]
As the alkenyl group of the component (A), the following general formula (II)
[0019]
[Chemical 3]
(Where R 1 Represents a hydrogen atom or a methyl group. ) Is preferable from the viewpoint that the cured product has high heat resistance. In addition, from the availability of raw materials,
[0020]
[Formula 4]
Is particularly preferred.
[0021]
The alkenyl group may be covalently bonded to the skeleton of the component (A) via a divalent or higher substituent, and the divalent or higher valent substituent is not particularly limited as long as it is a substituent having 0 to 10 carbon atoms. Although it does not exist, what contains only C, H, N, O, S, and a halogen is preferable. Examples of these substituents include
[0022]
[Chemical formula 5]
[0023]
[Chemical 6]
Is mentioned. Moreover, two or more of these divalent or higher valent substituents may be connected by a covalent bond to constitute one divalent or higher valent substituent.
[0024]
Examples of the group covalently bonded to the skeleton as described above include vinyl group, allyl group, methallyl group, acrylic group, methacryl group, 2-hydroxy-3- (allyloxy) propyl group, 2-allylphenyl group, 3 -Allylphenyl group, 4-allylphenyl group, 2- (allyloxy) phenyl group, 3- (allyloxy) phenyl group, 4- (allyloxy) phenyl group, 2- (allyloxy) ethyl group, 2,2-bis (allyl) Oxymethyl) butyl group, 3-allyloxy-2, 2-bis (allyloxymethyl) propyl group,
[0025]
[Chemical 7]
Is mentioned.
[0026]
As the component (A), low molecular weight compounds that are difficult to express separately as described above for the skeleton portion and the alkenyl group can also be used. Specific examples of these low molecular weight compounds include aliphatic chain polyene compound systems such as butadiene, isoprene, octadiene, decadiene, cyclopentadiene, cyclooctadiene, dicyclopentadiene, tricyclopentadiene, norbornadiene, triallyl isocyanurate, Examples include aliphatic cyclic polyene compound systems such as trivinylcyclohexane, and substituted aliphatic cyclic olefin compound systems such as vinylcyclopentene and vinylcyclohexene.
[0027]
From the viewpoint that the heat resistance can be further improved, the component (A) described above may contain 0.001 mol or more of a carbon-carbon double bond having reactivity with the SiH group per gram of the component (A). However, those containing 0.005 mol or more per gram are preferable, and those containing 0.008 mol or more are particularly preferable. Specific examples include butadiene, isoprene, vinylcyclohexene, cyclopentadiene, dicyclopentadiene, cyclohexadiene, decadiene, diallyl phthalate, trimethylolpropane diallyl ether, pentaerythritol triallyl ether, divinylbenzenes (purity 50-100% 1,3-diisopropenylbenzene, 1,4-diisopropenylbenzene, and oligomers thereof, 1,2-polybutadiene (1,2 ratio 10-100) %, Preferably 1,2 ratio 50-100%), triallyl isocyanurate, trivinylcyclohexane
[0028]
[Chemical 8]
Etc.
[0029]
In addition, as the component (A), the component weight ratio in the component (A) of the aromatic ring is 50 wt% from the viewpoint of good optical properties such as low birefringence and low photoelastic coefficient. The following are preferable, those of 40 wt% or less are more preferable, and those of 30% or less are more preferable. Most preferred are those that do not contain an aromatic ring.
[0030]
From the viewpoint that the resulting cured product has little coloration and high optical transparency and low light resistance, the component (A) includes vinylcyclohexene, dicyclopentadiene, triallyl isocyanurate, and trivinylcyclohexane. Among them, triallyl isocyanurate and trivinylcyclohexane are more preferable.
[0031]
The number of carbon-carbon double bonds reactive with the SiH group of component (A) should be at least 2 on average per molecule, but exceeds 2 from the viewpoint of further improving heat resistance. It is preferably 3, or more, more preferably 4 or more. When the number of carbon-carbon double bonds having reactivity with the SiH group of component (A) is 1 or less per molecule, only a graft structure is formed even if it reacts with component (B). Don't be.
As the component (A), in order to obtain uniform mixing with other components and good workability, those having fluidity at a temperature of 100 ° C. or less are preferable, and may be linear or branched, and the molecular weight may be Although there is no restriction | limiting in particular, Arbitrary things of 50-100,000 can be used conveniently. When the molecular weight is 100,000 or more, the raw material generally has a high viscosity and is inferior in workability, and the effect of crosslinking due to the reaction between the alkenyl group and the SiH group is hardly exhibited.
Further, in order to increase the reactivity with the component (B), the component (A) is preferably an organic compound having an organic skeleton containing at least one vinyl group having reactivity with the SiH group in one molecule. More preferably, it is an organic compound composed of an organic skeleton containing at least two vinyl groups in one molecule.
Further, in order to further enhance the reactivity with the component (B), the component (A) is an organic compound having an organic skeleton containing at least one allyl group reactive with the SiH group in one molecule. The organic compound is preferably an organic compound having an organic skeleton containing at least two vinyl groups in one molecule. Also, because of its industrial availability, specific examples of preferred component (A) include polybutadiene, vinylcyclohexene, cyclopentadiene, dicyclopentadiene, divinylbiphenyl, triallyl isocyanurate, trivinylcyclohexane or bisphenol A diallyl ether. I can list them.
[0032]
Next, the compound which has SiH group which is (B) component is demonstrated.
The compound having a SiH group that can be used in the present invention is not particularly limited. For example, a compound described in International Publication WO96 / 15194 having at least two SiH groups in one molecule can be used.
[0033]
Among these, from the viewpoint of availability, a chain having at least two SiH groups in one molecule and / or a cyclic polyorganosiloxane is preferable, and from the viewpoint of good compatibility with the component (A). Furthermore, the following general formula (III)
[0034]
[Chemical 9]
(Wherein R 2 Represents an organic group having 1 to 6 carbon atoms, and n represents a number of 3 to 10. And a cyclic polyorganosiloxane having at least two SiH groups in one molecule is preferred. The substituent R in the compound represented by the general formula (III) 2 Is preferably composed of C, H, and O, more preferably a hydrocarbon group.
[0035]
Further, from the viewpoint of having good compatibility with the component (A), at least one selected from chain-like and / or cyclic polyorganosiloxane and an organic compound having a carbon-carbon double bond. A reaction product with a compound (hereinafter referred to as component (E)) is also preferred. In this case, in order to further enhance the compatibility of the reactant with the component (A), it is possible to use a product obtained by removing unreacted siloxanes from the reactant by devolatilization or the like.
[0036]
Component (E) is an organic compound comprising an organic skeleton containing at least one carbon-carbon double bond having reactivity with the SiH group in one molecule, and the component having the same description as the component (A) Can be used.
[0037]
From the viewpoint that the compatibility of the component (B) with the component (A) can be increased, as preferred specific examples of the component (E), allyl ether of novolak phenol and bisphenol A diallyl ether, 2,2′-diallyl bisphenol A , Diallyl phthalate, bis (2-allyloxyethyl) ester of phthalic acid, styrene, α-methylstyrene, allyl-terminated polypropylene oxide and polyethylene oxide, triallyl isocyanurate, and the like. (E) The organic compound of a component can be used individually or in mixture of 2 or more types.
[0038]
Various components (B) as described above can be used alone or in admixture of two or more.
[0039]
The mixing ratio of the (A) component and the (B) component as described above is not particularly limited as long as the necessary strength is not lost, but generally, the carbon-carbon dioxygen having reactivity with the SiH group in the (A) component. The ratio of the number of heavy bonds (X) to the number of SiH groups (Y) in the component (B) is preferably 2 ≧ Y / X ≧ 0.5. When Y / X> 2 or 0.5> Y / X, sufficient curability may not be obtained, sufficient strength may not be obtained, and heat resistance may be lowered.
[0040]
Next, the hydrosilylation catalyst as component (C) will be described. The hydrosilylation catalyst is not particularly limited as long as it has a catalytic activity for the hydrosilylation reaction. For example, platinum having a solid platinum supported on a carrier such as simple substance of alumina, alumina, silica, carbon black, chloroplatinic acid, platinum chloride, etc. Complexes of acids with alcohols, aldehydes, ketones, etc., platinum-olefin complexes (for example, Pt (CH 2 = CH 2 ) 2 (PPh Three ) 2 , Pt (CH 2 = CH 2 ) 2 Cl 2 ), Platinum-vinylsiloxane complexes (e.g., Pt (ViMe 2 SiOSiMe 2 Vi) n , Pt [(MeViSiO) Four ] m ), Platinum-phosphine complexes (e.g. Pt (PPh Three ) Four , Pt (PBu Three ) Four ), Platinum-phosphite complexes (e.g. Pt [P (OPh) Three ] Four , Pt [P (OBu) Three ] Four ) (Wherein Me represents a methyl group, Bu represents a butyl group, Vi represents a vinyl group, Ph represents a phenyl group, and n and m represent integers), dicarbonyldichloroplatinum, a Karlstedt catalyst, A platinum-hydrocarbon complex described in Ashby, U.S. Pat. Nos. 3,159,601 and 3,159,622, and a platinum alcoholate catalyst described in Lamoreaux, U.S. Pat. No. 3,220,972. Can be mentioned. In addition, platinum chloride-olefin complexes described in Modic US Pat. No. 3,516,946 are also useful in the present invention.
[0041]
Examples of catalysts other than platinum compounds include RhCl (PPh) Three , RhCl Three , RhAl 2 O Three , RuCl Three , IrCl Three , FeCl Three AlCl Three , PdCl 2 ・ 2H 2 O, NiCl 2 TiCl Four , Etc.
[0042]
Of these, chloroplatinic acid, platinum-olefin complexes, platinum-vinylsiloxane complexes and the like are preferable from the viewpoint of catalytic activity. Moreover, these catalysts may be used independently and may be used together 2 or more types.
[0043]
The addition amount of the catalyst is not particularly limited, but in order to have sufficient curability and keep the cost of the curable composition relatively low, -1 -10 -8 The molar range is preferred, more preferably 10 -2 -10 -6 The range of moles.
[0044]
In addition, a cocatalyst can be used in combination with the above catalyst. Examples thereof include phosphorus compounds such as triphenylphosphine, 1,2-diester compounds such as dimethyl maleate, 2-hydroxy-2-methyl-1 -Acetylene alcohol compounds such as butyne, sulfur compounds such as simple sulfur, and amine compounds such as triethylamine. The amount of the cocatalyst added is not particularly limited. -2 -10 2 The molar range is preferred, more preferably 10 -1 It is the range of -10 mol.
[0045]
Furthermore, a curing retarder can be used for the purpose of improving the storage stability of the composition of the present invention or adjusting the reactivity of the hydrosilylation reaction during the production process. Examples of the curing retarder include a compound containing an aliphatic unsaturated bond, an organic phosphorus compound, an organic sulfur compound, a nitrogen-containing compound, a tin-based compound, and an organic peroxide, and these may be used in combination. Examples of the compound containing an aliphatic unsaturated bond include propargyl alcohols, ene-yne compounds, maleate esters and the like. Examples of the organophosphorus compound include triorganophosphine, diorganophosphine, organophosphon, and triorganophosphite. Examples of organic sulfur compounds include organomercaptans, diorganosulfides, hydrogen sulfide, benzothiazole, benzothiazole disulfide and the like. Examples of nitrogen-containing compounds include ammonia, primary to tertiary alkylamines, arylamines, urea, hydrazine and the like. Examples of tin compounds include stannous halide dihydrate and stannous carboxylate. Examples of the organic peroxide include di-t-butyl peroxide, dicumyl peroxide, benzoyl peroxide, and t-butyl perbenzoate.
[0046]
Of these curing retarders, benzothiazole, thiazole, dimethyl malate, and 3-hydroxy-3-methyl-1-butyne are preferred from the viewpoint of good retarding activity and good raw material availability.
[0047]
The addition amount of the storage stability improver is 10 with respect to 1 mol of the hydrosilylation catalyst used. -1 -10 Three The range of mole is preferable, and the range of 1 to 50 mole is more preferable.
[0048]
As described above, various combinations can be used as the composition of the present invention. From the viewpoint of good heat resistance, a cured product obtained by curing the composition has a Tg of 50 ° C. or higher. Preferably, a temperature of 100 ° C. or higher is more preferable, and a temperature of 150 ° C. or higher is particularly preferable.
[0049]
You may add an inorganic filler to the composition of this invention as needed. Addition of an inorganic filler is effective in preventing fluidity of the composition and increasing the strength of the material. The inorganic filler is preferably in the form of fine particles that do not degrade the optical properties, and examples include alumina, aluminum hydroxide, fused silica, crystalline silica, ultrafine amorphous silica, hydrophobic ultrafine silica, talc, and barium sulfate. Can do.
[0050]
Furthermore, various resins can be added for the purpose of modifying the properties of the composition of the present invention. Examples of the resin include, but are not limited to, polycarbonate resin, polyethersulfone resin, polyarylate resin, epoxy resin, cyanate resin, phenol resin, acrylic resin, polyimide resin, polyvinyl acetal resin, urethane resin, and polyester resin. It is not something.
[0051]
The composition of the present invention can be directly formed into a film or the like, but the composition can be dissolved in an organic solvent to form a varnish. Solvents that can be used are not particularly limited, and specific examples include hydrocarbon solvents such as benzene, toluene, hexane, and heptane, ether solvents such as tetrahydrofuran, 1,4-dioxane, and diethyl ether, and acetone. And ketone solvents such as methyl ethyl ketone, and halogen solvents such as chloroform, methylene chloride, and 1,2-dichloroethane can be preferably used. The solvent can also be used as a mixed solvent of two or more types. As the solvent, toluene, tetrahydrofuran and chloroform are preferable. The amount of the solvent used is preferably in the range of 0 to 10 mL, more preferably in the range of 0.5 to 5 mL, and in the range of 1 to 3 mL with respect to 1 g of the reactive (A) component to be used. Is particularly preferred. If the amount used is small, it is difficult to obtain the effect of using a solvent such as a low viscosity, and if the amount used is large, the solvent will remain in the material and easily cause problems such as thermal cracks. It is disadvantageous and the industrial utility value decreases.
[0052]
In addition, the composition of the present invention includes an antioxidant, a radical inhibitor, an ultraviolet absorber, an adhesion improver, a flame retardant, a surfactant, a storage stability improver, an ozone degradation inhibitor, a light stabilizer, a thickener Agent, plasticizer, coupling agent, antioxidant, heat stabilizer, conductivity imparting agent, antistatic agent, radiation blocking agent, nucleating agent, phosphorus peroxide decomposing agent, lubricant , Metal deactivators, physical property modifiers, and the like can be added as long as the objects and effects of the present invention are not impaired.
[0053]
The optical material referred to in the present invention is a general material used for the purpose of allowing light such as visible light, infrared light, ultraviolet light, X-rays, and laser to pass through the material.
[0054]
More specifically, peripheral materials for liquid crystal display devices such as substrate materials, light guide plates, prism sheets, deflector plates, retardation plates, viewing angle correction films, adhesives, and films for liquid crystals such as polarizer protective films in the field of liquid crystal displays It is. In addition, color PDP (plasma display) sealants, antireflection films, optical correction films, housing materials, front glass protective films, front glass substitute materials, adhesives, and LED displays that are expected as next-generation flat panel displays Used for equipment Be done Protective film for front glass, substitute material for front glass, adhesive, substrate material for plasma addressed liquid crystal (PALC) display, light guide plate, prism sheet, deflector plate, phase difference plate, viewing angle correction film, adhesive, polarizer protection Film, front glass protective film, front glass substitute material, adhesive for organic EL (electroluminescence) display, and various film substrates, front glass protective film, front glass substitute material, adhesive for field emission display (FED) It is.
[0055]
In the optical recording field, VD (video disc), CD / CD-ROM, CD-R / RW, DVD-R / DVD-RAM, MO / MD, PD (phase change disc), disc substrate material for optical cards, Pickup lenses, protective films, sealants, adhesives and the like.
[0056]
In the optical equipment field, they are still camera lens materials, finder prisms, target prisms, finder covers, and light receiving sensor sections. It is also a photographic lens and viewfinder for video cameras. Projection lenses for projection televisions, protective films, sealants, adhesives, and the like. Materials for lenses of optical sensing devices, sealants, adhesives, films, etc.
[0057]
In the field of optical components, they are fiber materials, lenses, waveguides, element sealants, adhesives, etc. around optical switches in optical communication systems. Optical fiber material, ferrule, sealant, adhesive, etc. around the optical connector. Lenses, waveguides, and LED elements for optical passive components and optical circuit components of Such as an adhesive. These are substrate materials, fiber materials, device sealants, adhesives, etc. around an optoelectronic integrated circuit (OEIC).
[0058]
In the field of optical fiber, it is an optical fiber for lighting, light guides for decorative displays, sensors for industrial use, displays / signs, etc., and for communication infrastructure and home digital equipment connection.
[0059]
As the semiconductor integrated circuit peripheral material, it is a resist material for microlithography for LSI and VLSI material.
[0060]
In the field of automobiles and transportation equipment, automotive lamp reflectors , Corrosion-resistant coating, switch part, headlamp , Electrical components, various interior and exterior products The Rust-proof steel plate for vehicles , Wireness for protection and bundling , It is an automotive lamp and glass substitute. In addition, it is a multilayer glass for railway vehicles. Also aircraft of Protective / bundling wireness and corrosion resistant coating.
[0061]
In the construction field, it is interior / processing materials, electrical covers, sheets, glass interlayers, glass substitutes, and solar cell peripheral materials. For agriculture, it is a house covering film.
[0062]
Next-generation optical / electronic functional organic materials include organic EL element peripheral materials, organic photorefractive elements, optical amplification elements that are light-to-light conversion devices, optical arithmetic elements, substrate materials around organic solar cells, fiber materials, elements Sealing agent, adhesive and the like.
[0063]
The composition for optical material of the present invention is mixed in advance and cured by reacting a part of or all of the SiH group with a carbon-carbon double bond having reactivity with the SiH group in the composition. It can be.
[0064]
Various methods can be used as the mixing method, and a method in which the component (A) is mixed with the component (C) and the method of mixing the component (B) are preferable. Control of the reaction is difficult if the method of mixing the component (C) with the mixture of the component (A) and the component (B). When the method of mixing the component (A) with the component (B) mixed with the component (B), the component (B) is reactive with moisture in the presence of the component (C), and so on during storage. It may be altered.
[0065]
In the case of curing by reacting the composition, the necessary amounts of the respective components (A), (B), and (C) may be mixed and reacted at one time, but a part of them is mixed and reacted. Only a part of the functional group in the composition is reacted (B stage) by mixing the remaining amount and reacting further, or by controlling the reaction conditions after mixing and using the difference in the reactivity of the substituents. It is also possible to take a method of further curing by performing a treatment such as molding. According to these methods, viscosity adjustment at the time of molding becomes easy.
[0066]
As a curing method, the reaction can be performed by simply mixing, or the reaction can be performed by heating. A method of heating and reacting is preferable from the viewpoint that the reaction is fast and generally a material having high heat resistance is easily obtained.
[0067]
Although various reaction temperatures can be set, for example, a temperature of 30 to 300 ° C. can be applied, 100 to 250 ° C. is more preferable, and 150 to 200 ° C. is more preferable. If the reaction temperature is low, the reaction time for sufficient reaction will be long, and if the reaction temperature is high, molding will tend to be difficult.
[0068]
The reaction may be carried out at a constant temperature, but the temperature may be changed in multiple steps or continuously as required.
[0069]
Various reaction times can be set.
[0070]
The pressure during the reaction can be variously set as required, and the reaction can be carried out under normal pressure, high pressure, or reduced pressure.
[0071]
The shape of the optical material obtained by curing can be variously selected depending on the application and is not particularly limited. For example, the shape may be a film shape, a sheet shape, a tube shape, a rod shape, a coating shape, a bulk shape, or the like. it can.
[0072]
Various molding methods can be used including a conventional thermosetting resin molding method. For example, a molding method such as a cast method, a press method, a casting method, a transfer molding method, a coating method, or a RIM method can be applied. As the mold, polishing glass, hard stainless steel polishing plate, polycarbonate plate, polyethylene terephthalate plate, polymethyl methacrylate plate, or the like can be applied. In addition, a polyethylene terephthalate film, a polycarbonate film, a polyvinyl chloride film, a polyethylene film, a polytetrafluoroethylene film, a polypropylene film, a polyimide film, or the like can be applied in order to improve releasability from the mold.
[0073]
Various treatments can be performed as necessary during molding. For example, a treatment for defoaming the composition or a partially reacted composition by centrifugation, decompression, or the like for releasing the pressure once during pressing may be applied to suppress voids generated during molding.
[0074]
A liquid crystal display device can be manufactured using the optical material of the present invention.
[0075]
In this case, the optical material of the present invention may be used as a liquid crystal film such as a plastic cell for liquid crystal, a polarizing plate, a retardation plate, and a polarizer protective film, and a liquid crystal display device may be produced by an ordinary method.
[0076]
An LED can be manufactured using the optical material of the present invention.
[0077]
In this case, the optical material of the present invention may be used as an LED sealing material, and the LED may be produced by a normal method.
[0078]
【Example】
Examples and Comparative Examples of the present invention are shown below, but the present invention is not limited to the following.
(Synthesis Example 1)
A stirrer and a condenser tube were set in a 1 L three-necked flask. Into this flask, 114 g of bisphenol A, 145 g of potassium carbonate, 140 g of allyl bromide, and 250 mL of acetone were added and stirred at 60 ° C. for 12 hours. The supernatant was taken, washed with a sodium hydroxide aqueous solution with a separatory funnel, and then washed with water. After drying the oil layer with sodium sulfate, the solvent was distilled off with an evaporator to obtain 126 g of a pale yellow liquid. 1 By H-NMR, it was found that the OH group of bisphenol A was bisphenol A diallyl ether obtained by allyl etherification. The yield was 82% and the purity was 95% or more.
Example 1
A stirrer, a condenser tube, and a dropping funnel were set in a 1 L four-necked flask. To this flask, 150 g of toluene, 15.6 μL of a platinum vinylsiloxane complex xylene solution (containing 3 wt% as platinum), 500 g of 1,3,5,7-tetramethylcyclotetrasiloxane were added and heated to 70 ° C. in an oil bath. , Stirred. 64 g of bisphenol A diallyl ether produced in Synthesis Example 1 was diluted with 40 g of toluene and added dropwise from a dropping funnel. The mixture was stirred at the same temperature for 60 minutes and allowed to cool, and 4.74 mg of benzothiazole was added. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure to obtain a slightly viscous liquid. 1 By H-NMR, it was found that this was a product in which a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane was reacted with bisphenol A diallyl ether (referred to as partial reactant A).
(Example 2)
16.09 g of bisphenol A diallyl ether prepared in Synthesis Example 1 and 15.41 g of partial reaction product A were mixed in a cup and degassed for 1 hour under reduced pressure of about 1 torr. As shown in Example 1, the partial reactant A contains a platinum vinylsiloxane complex as the component (C) of the present invention. This material is poured on a mirror polished (# 1200 polished) stainless steel polishing plate with a 1 cm wide and 0.36 mm thick silicone rubber sheet along the edge, and one more mirror polished (# 1200 polished) from the top. Finished) was sandwiched between stainless polishing plates and heated at 100 ° C./45 minutes, followed by heating at 150 ° C./2.5 hours to obtain a uniform, colorless and transparent sheet visually.
(Example 3)
3.08 g of bisphenol A diallyl ether prepared in Synthesis Example 1, 1.20 g of 1,3,5,7-tetramethylcyclotetrasiloxane, and 3 μL of a xylene solution of platinum vinylsiloxane complex (containing 0.25 wt% as platinum) To obtain a composition of the present invention. This was cast into an ointment can having a diameter of 6.7 cm and heated in an oven from 50 ° C. to 120 ° C. over 5 hours to obtain a transparent film. This was sandwiched between two glass plates and cured by heating at 150 ° C. for 3 hours under a nitrogen stream (20 mL / min). The obtained material was uniformly transparent visually and had toughness.
Example 4
6.16 g of bisphenol A diallyl ether prepared in Synthesis Example 1, 2.40 g of 1,3,5,7-tetramethylcyclotetrasiloxane, 3 μL of a xylene solution of platinum vinylsiloxane complex (containing 0.5 wt% as platinum) To obtain a composition of the present invention. This was filled into a glass cell having a thickness of 2 mm using a polyimide film as a release film and cured by heating at 75 ° C. for 30 minutes, 110 ° C. for 30 minutes, and further at 150 ° C. for 12 hours. The obtained material was visually uniform and colorless and transparent.
(Example 5)
1.27 g of 1,2-polybutadiene (B-1000 manufactured by Nippon Soda Co., Ltd.), 1.20 g of 1,3,5,7-tetramethylcyclotetrasiloxane and a xylene solution of platinum vinylsiloxane complex (0.25 wt as platinum) % Composition) was mixed with 10 μL to obtain a composition of the present invention. This was cast into an ointment can having a diameter of 6.7 cm and heated in an oven from 50 ° C. to 120 ° C. over 5 hours to obtain a transparent film. This was sandwiched between two glass plates and cured by heating at 150 ° C. for 3 hours under a nitrogen stream (20 mL / min). The obtained material was uniformly transparent visually and had toughness.
(Example 6)
5.08 g of 1,2-polybutadiene (B-1000 manufactured by Nippon Soda Co., Ltd.), 4.80 g of 1,3,5,7-tetramethylcyclotetrasiloxane, and a xylene solution of platinum vinylsiloxane complex (0.25 wt as platinum) % Composition) was mixed with 40 μL to obtain a composition of the present invention. This was filled into a glass cell having a thickness of 2 mm using a polyimide film as a release film and cured by heating at 75 ° C. for 30 minutes, 110 ° C. for 30 minutes, and further at 150 ° C. for 12 hours. The obtained material was visually uniform and colorless and transparent.
(Example 7)
1.27 g of 1,2-polybutadiene (B-1000 manufactured by Nippon Soda Co., Ltd.), 1.08 g of 4-vinylcyclohexene, 2.40 g of 1,3,5,7-tetramethylcyclotetrasiloxane, and xylene of a platinum vinylsiloxane complex 20 μL of a solution (containing 0.25 wt% as platinum) was mixed to obtain the composition of the present invention. This was cast into an ointment can having a diameter of 6.7 cm and heated in an oven from 50 ° C. to 120 ° C. over 5 hours to obtain a transparent film. This was sandwiched between two glass plates and cured by heating at 150 ° C. for 3 hours under a nitrogen stream (20 mL / min). The obtained material was uniformly transparent visually and had toughness.
(Example 8)
The same composition as in Example 2 was degassed under a reduced pressure of about 1 torr for 1 hour, and then crystallized PET film was used as a release film, and 0.3 mm thick silicone rubber was used as a spacer at a temperature of 150 ° C. 1 hour 3kg / cm 2 Press molding was performed at a pressure of The obtained material had the same properties as the material obtained in Example 2.
Example 9
The present invention was prepared by mixing 7.2 g of dicyclopentadiene, 6.0 g of 1,3,5,7-tetramethylcyclotetrasiloxane and 50.0 μL of a xylene solution of platinum vinylsiloxane complex (containing 3 wt% as platinum). It was set as the composition of this. This was heat-cured in the same manner as in Example 3. The obtained material was visually uniform and colorless and transparent.
(Example 10)
8.0 g of divinylbiphenyl (DVB-960 manufactured by Nippon Steel Chemical Co., Ltd.), 7.2 g of 1,3,5,7-tetramethylcyclotetrasiloxane, and a xylene solution of a platinum vinylsiloxane complex (0.5 wt% as platinum) Contained) 5.0 μL was mixed to obtain the composition of the present invention. This was heat-cured in the same manner as in Example 3. The obtained material was visually uniform and colorless and transparent.
(Example 11)
Divinylbiphenyl (DVB-960 made by Nippon Steel Chemical Co., Ltd.), polymethylhydrogensiloxane (KF-99 made by Shin-Etsu Chemical Co., Ltd.) 7.7 g, and a xylene solution of platinum vinylsiloxane complex (0.5 wt. As platinum) % Composition) 5.0 μL was mixed to obtain the composition of the present invention. This was heat-cured in the same manner as in Example 3. The obtained material was visually uniform and colorless and transparent.
(Example 12)
A magnetic stirring bar and a condenser tube were set in a 200 mL two-necked flask. To this flask was added 50 g of toluene, 11.3 μL of a platinum vinylsiloxane complex xylene solution (containing 3 wt% as platinum), 5.0 g of triallyl isocyanurate, 37.04 g of 1,3,5,7-tetramethylcyclotetrasiloxane. The mixture was heated and stirred for 30 minutes in an oil bath at 90 ° C. Further, the mixture was heated to reflux in an oil bath at 130 ° C. for 2 hours. 176 mg of 1-ethynyl-1-cyclohexanol was added. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure. 1 It was found by 1 H-NMR that this was a product in which a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane was reacted with triallyl isocyanurate (referred to as partial reaction product B).
(Example 13)
A stirrer, a condenser tube, and a dropping funnel were set in a 1 L four-necked flask. Into this flask, 190 g of toluene, 48 mg of a xylene solution of platinum vinylsiloxane complex (containing 3 wt% as platinum), 236.2 g of 1,3,5,7-tetramethylcyclotetrasiloxane were placed, and heated and stirred at 70 ° C. in an oil bath. did. To this solution, a 10 g toluene solution of 20.0 g 1,2,4-trivinylcyclohexane was added dropwise over 1 hour. The resulting solution was heated and stirred in an oil bath at 70 ° C. for 90 minutes. 9.2 mg of 1-ethynyl-1-cyclohexanol was added. Unreacted 1,3,5,7-tetramethylcyclotetrasiloxane and toluene were distilled off under reduced pressure. 1 According to 1 H-NMR, this is a product in which a part of the SiH group of 1,3,5,7-tetramethylcyclotetrasiloxane has reacted with 1,2,4-trivinylcyclohexane (referred to as partial reactant C). I understood it.
(Example 14)
2.5 g of triallyl isocyanurate and 3.0 g of the partial reaction product B synthesized in Example 12 were mixed in a cup and deaerated under a reduced pressure of about 1 torr for 30 minutes. As shown in Example 12, the partial reactant B contains a platinum vinylsiloxane complex as the component (C) of the present invention. This was poured into a cell made by sandwiching a 3 mm-thick silicone rubber sheet between two glass plates as a spacer, heated at 80 ° C./60 minutes, 100 ° C./60 minutes, 120 ° C./60 minutes and visually observed. A uniform, colorless and transparent cured product was obtained.
(Example 15)
1.00 g of 1,2,4-trivinylcyclohexane and 1.87 g of the partial reaction product C synthesized in Example 13 were mixed in a cup. As shown in Example 13, the partial reactant C contains a platinum vinylsiloxane complex as the component (C) of the present invention. This was poured into a cell formed by sandwiching a 3 mm thick silicone rubber sheet as a spacer between two glass plates, and heated at 100 ° C./60 minutes. The obtained rubber-like partially cured product was removed from the cell and sandwiched between two glass plates, heated at 120 ° C./180 minutes and 150 ° C./60 minutes to obtain a uniform, colorless and transparent cured product.
(Comparative Example 1)
A film (thickness: 100 μm, 3 mm) was prepared using polycarbonate resin C-1400 (average molecular weight 37000) manufactured by Teijin Chemicals Ltd., and optical characteristics were evaluated.
(Measurement Example 1)
The optical characteristics of the samples obtained in Examples 2 to 7 and Comparative Example 1 were evaluated.
[0079]
Retardation : A test piece was cut out from the film with a size of 20 mm × 20 mm. At a temperature of 25 ° C. and a humidity of 50%, an angular phase in the case of no load was measured for each test piece using a micro-polarization spectrophotometer (wavelength 515 nm) manufactured by Oak Manufacturing Co., Ltd., and a retardation value was obtained from the following equation.
Retardation = (angular phase−90) / 180 × 515
Total light transmittance : A test piece was cut out from the film with a size of 30 mm × 30 mm. The measurement was performed using a Nippon Denshoku Industries turbidimeter 300A at a temperature of 23 ° C. and a humidity of 50%.
[0080]
[Table 1]
As is apparent from Table 1, the optical material of the present invention has an excellent performance having a low birefringence and a high total light transmittance as compared with the polycarbonate film.
(Measurement example 2)
The cured products prepared in Example 2, Example 14, and Example 15 were irradiated with a Suga test machine SX120 type xenon weather meter (black panel temperature 63 ° C., 18 minutes of rainfall during 2 hours of irradiation) for 70 hours to be cured. The state of was observed visually.
[0081]
The cured product of Example 2 was slightly yellowed, but the cured products prepared in Examples 14 and 15 were not yellowed and kept colorless and transparent.
[0082]
【Effect of the invention】
The material produced from the composition of the present invention is a material suitable for an optical material having a low birefringence, high optical transparency, and toughness.
Claims (8)
上記(A)成分が、ビスフェノールAジアリルエーテル、トリアリルイソシアヌレート、又は、トリビニルシクロヘキサンであり、
上記(B)成分が、下記一般式(III)
(式中、R2は炭素数1〜6の炭化水素基を表し、nは3〜10の数を表す。)で表される環状ポリオルガノシロキサンと、炭素−炭素二重結合を有する有機化合物との反応物であって1分子中に少なくとも2個のSiH基を含有する反応物であり、
上記炭素−炭素二重結合を有する有機化合物が、ビスフェノールAジアリルエーテル、トリアリルイソシアヌレート、又は、トリビニルシクロヘキサンであり、
前記(A)成分中のSiH基と反応性を有する炭素−炭素二重結合の数(X)と、前記(B)成分中のSiH基の数(Y)との比が、2≧Y/X≧0.5であることを特徴とする光学材料用組成物。(A) An organic compound composed of an organic skeleton containing at least two carbon-carbon double bonds reactive with SiH groups in one molecule, and (B) containing at least two SiH groups in one molecule. An optical material composition comprising a composition containing a silicon compound and (C) a hydrosilylation catalyst as essential components,
It said component (A), bisphenol A diallyl ether, triallyl isocyanurate, or a tri-vinyl cyclohexane,
The component (B) is represented by the following general formula (III)
(Wherein, R 2 represents a hydrocarbon group having 1 to 6 carbon atoms, n represents a number from 3-10.) A cyclic polyorganosiloxane represented by the carbon - organic compound having a carbon-carbon double bond A reaction product containing at least two SiH groups in one molecule,
The carbon - organic compound having a carbon double bond, bis bisphenol A diallyl ether, triallyl isocyanurate, or a tri-vinyl cyclohexanol Sun,
The ratio of the number of carbon-carbon double bonds (X) having reactivity with SiH groups in the component (A) and the number of SiH groups (Y) in the component (B) is 2 ≧ Y / A composition for optical materials, wherein X ≧ 0.5 .
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| JP2000398382A JP4993806B2 (en) | 2000-04-21 | 2000-12-27 | Composition for optical material, optical material, method for producing the same, and liquid crystal display device using the same |
| CN2007101381532A CN101125925B (en) | 2000-12-27 | 2001-12-10 | Curing agents, curable compositions, compositions for optical materials, optical materials, and application thereof |
| CA 2430866 CA2430866A1 (en) | 2000-12-27 | 2001-12-10 | Curing agents, curable compositions, compositions for optical materials, optical materials, their production, and liquid crystal displays and led's made by using the materials |
| EP20100179272 EP2270103A2 (en) | 2000-12-27 | 2001-12-10 | Curing agent, curable compositions, compositions for optical materials, optical materials, their production, and liquid crystal displays and LED's made by using the materials |
| CNB018224806A CN100338142C (en) | 2000-12-27 | 2001-12-10 | Curing agent, curable composition, composition for optical material, optical material, production method thereof, and liquid crystal display and light emitting diode produced using same |
| US10/433,981 US7560145B2 (en) | 2000-12-27 | 2001-12-10 | Curing agent, curable compositions, compositions for optical materials, optical materials, their production and liquid crystal displays and LED's made by using the materials |
| TW90130589A TW588084B (en) | 2000-12-27 | 2001-12-10 | Curing agents, curable compositions, compositions for optical materials, optical materials, optical materials, their production, and liquid crystal displays and LEDs made by using the materials |
| KR1020037008807A KR100806553B1 (en) | 2000-12-27 | 2001-12-10 | Curing agent, curable composition, composition for optical material, optical material, manufacturing method thereof and liquid crystal display device and LED made using the same |
| EP20010272509 EP1369458B1 (en) | 2000-12-27 | 2001-12-10 | Curing agents, curable compositions, compositions for optical materials, optical materials, their production, and liquid crystal displays and led's made by using the materials |
| PCT/JP2001/010802 WO2002053648A1 (en) | 2000-12-27 | 2001-12-10 | Curing agents, curable compositions, compositions for optical materials, optical materials, their production, and liquid crystal displays and led's made by using the materials |
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| JP4275889B2 (en) * | 2001-02-09 | 2009-06-10 | 株式会社カネカ | Light emitting diode and manufacturing method thereof |
| JP2002235006A (en) * | 2001-02-13 | 2002-08-23 | Kanegafuchi Chem Ind Co Ltd | Composition for optical material, optical material and method for producing the same |
| JP4514997B2 (en) * | 2001-07-24 | 2010-07-28 | 株式会社カネカ | Composition for optical material, optical material, method for producing the same, liquid crystal display device using the same, and light emitting diode |
| JP2003073549A (en) * | 2001-09-05 | 2003-03-12 | Kanegafuchi Chem Ind Co Ltd | Curable composition for optical material, optical material, method for producing the same, and light emitting diode using the same |
| JP2006183061A (en) * | 2002-04-04 | 2006-07-13 | Kaneka Corp | Composition for electronic material, and electronic material |
| JP2006241462A (en) * | 2002-04-04 | 2006-09-14 | Kaneka Corp | Composition for optical material, optical material, manufacturing method thereof, and liquid crystal display device using the same |
| JP4937492B2 (en) * | 2002-04-16 | 2012-05-23 | 株式会社カネカ | Light emitting diode |
| CA2483510A1 (en) * | 2002-04-26 | 2003-11-06 | Kaneka Corporation | Hardenable composition, hardening product, process for producing the same and light emitting diode sealed with the hardening product |
| JP2004002823A (en) * | 2002-04-26 | 2004-01-08 | Kanegafuchi Chem Ind Co Ltd | Composition for optical material, material for optical, method for producing the same, and light emitting diode using the same |
| JP5026730B2 (en) * | 2002-04-26 | 2012-09-19 | 株式会社カネカ | Composition for optical material, optical material and method for producing the same |
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| TW200502372A (en) | 2003-02-25 | 2005-01-16 | Kaneka Corp | Curing composition and method for preparing same, light-shielding paste, light-shielding resin and method for producing same, package for light-emitting diode, and semiconductor device |
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