JP3125163U - Chamfering wheel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To extend the life of a chamfering grindstone due to wear of a cutting groove.
A disk 12 fixed to a rotating shaft 14 constituting an ultrasonic wave propagation path and an annular cutting layer 26 fixed to the outer peripheral surface of the disk 12 are provided. The cutting grooves 28, 30, and 32 are formed. By sequentially using each of the cutting grooves 28, 30, and 32 for chamfering, the service life can be tripled as compared with one cutting groove.
[Selection] Figure 1

Description

  The present invention relates to a chamfering grindstone, and more particularly, to a chamfering grindstone that is attached to a rotating shaft of an ultrasonic cutting device or an ultrasonic grinding device and used for chamfering processing of glass or the like.

  When chamfering hard brittle materials such as glass and ceramics, an ultrasonic machining method is known as a processing method for hard brittle materials (see Japanese Patent Laid-Open No. 62-162451). The ultrasonic machining method takes into account that hard brittle materials are vulnerable to impacts. For example, while rotating a grindstone mounted on the rotating shaft of an ultrasonic cutting device or an ultrasonic grinding device, the workpiece is subjected to ultrasonic vibration. Is a method of crushing a small amount. When chamfering a workpiece using ultrasonic machining, the grindstone can be chamfered without constantly contacting the workpiece, so the workpiece can be chamfered using a machining method that does not use ultrasonic waves. The service life of the grindstone can be extended compared to when processing is performed.

  When chamfering is performed on the workpiece using the ultrasonic machining method, the surface of the workpiece is processed with the contour shape (surface shape) of the grindstone inverted, so the contour shape (surface of the grindstone) The workpiece can be chamfered according to the shape.

  However, since the conventional chamfering grindstone has only a single cutting groove, the chamfering grindstone must be replaced when the cutting groove is worn.

  The present invention has been made in view of the problems of the prior art, and an object thereof is to extend the life of a chamfering grindstone accompanying wear of a cutting groove.

  In order to solve the above-mentioned problem, a chamfering grindstone according to claim 1 includes a disk fixed to a rotating shaft constituting an ultrasonic wave propagation path, and an annular cutting layer fixed to the outer peripheral surface of the disk, A plurality of annular cutting grooves are formed on the surface of the cutting layer.

  (Operation) Since a plurality of cutting grooves are formed in the cutting layer, when one cutting groove is worn, a chamfering process can be performed on the workpiece using the other cutting grooves. The lifetime of the chamfering grindstone accompanying wear can be extended.

  The chamfering grindstone according to claim 2 is the chamfering grindstone according to claim 1, wherein the cutting layer is composed of a plurality of cutting layers having different particle sizes, and the plurality of cutting layers are arranged in an axial direction of the rotating shaft. It was arranged adjacent to each other along the surface, and each cutting layer was formed with annular cutting grooves on the surface.

  (Operation) The cutting layer is composed of a plurality of cutting layers having different particle sizes, and the cutting groove is formed on the surface of each cutting layer. Chamfering can be performed with a chamfering grindstone, and it is not necessary to replace the chamfering grindstone when chamfering a plurality of workpieces having different surface finishing roughnesses, thereby improving work efficiency.

  As apparent from the above description, according to the chamfering grindstone according to the first aspect, the life of the chamfering grindstone accompanying the wear of the cutting groove can be extended.

  According to the second aspect, it is possible to perform chamfering with a single chamfering grindstone on a plurality of workpieces having different surface finishing roughnesses, and it is possible to improve work efficiency.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view of a chamfering grindstone showing an embodiment of the present invention, FIG. 2 is an enlarged sectional view of a cutting layer, FIG. 3 is a flowchart for explaining a manufacturing process of the chamfering grindstone, and FIG. FIG. 5 is an enlarged cross-sectional view of a chamfering grindstone having two cutting layers, and FIG. 5 is an essential cross-sectional configuration diagram for explaining the relationship between a mold used for manufacturing a chamfering grindstone and a chamfering grindstone.

  In these drawings, a chamfering grindstone 10 includes a steel disk (steel base metal) 12, and the steel disk 12 is detachably fixed to a rotating shaft 14 of, for example, an ultrasonic cutting apparatus or an ultrasonic grinding apparatus. It has come to be. The disk 12 includes a body 16 formed in a substantially columnar shape and a flange portion 18 formed in a substantially annular shape. A recess 20 is formed at the center of the main body 16, and a through hole 22 whose center coincides with the axis of the rotary shaft 14 is formed adjacent to the recess 20. A head portion of a bolt 24 is mounted in the recess 20, and a bolt 24 is inserted into the through hole 22, and a screw portion on the tip end side of the bolt 24 is fastened to a screw portion of the rotary shaft 14.

  An annular cutting layer 26 is fixed to the outer peripheral surface of the disk 12 (the outer peripheral surface parallel to the through hole 22), that is, the outer peripheral surface of the flange portion 18. Three cutting grooves 28, 30, and 32 are formed. Each of the cutting grooves 28, 30, and 32 is formed in a substantially arc shape in cross section, for example, in accordance with the shape after chamfering the glass workpiece. The cutting layer 26 is formed, for example, by mixing industrial diamond (SD diamond) having a particle size of 50 μm to 70 μm and an adhesive (bond). In this case, the cutting layer 26 having different particle sizes can be formed by adjusting the particle size of the industrial diamond and the mixing ratio of the industrial diamond and the adhesive, and the cutting groove 28 formed in the cutting layer 26. 30 and 32 can be used for top finishing or rough finishing depending on the particle size.

  The diameter of the main body 16, the diameter of the flange portion 18, the length (width) of the flange portion 18 along the axial direction of the rotating shaft 14, the diameter of the cutting layer 26, and the axial direction of the rotating shaft 14 of the cutting layer 26. The length (width) is set in consideration of the frequency of ultrasonic waves and the propagation characteristics of ultrasonic waves.

  Moreover, as each cutting groove 28, 30, 32, the cross-sectional shape can also be made into a rectangular shape, a triangular shape, and a trapezoid shape according to the shape after chamfering processing with respect to a glass workpiece.

  On the other hand, when the chamfering grindstone 10 is fixed to the rotating shaft 14 attached to the ultrasonic cutting device or the ultrasonic grinding device, when the ultrasonic cutting device or the ultrasonic grinding device is driven, A rotational force and ultrasonic vibration (for example, vibration due to ultrasonic waves of 40 kHz) are transmitted from the rotary shaft 14 constituting the ultrasonic wave propagation path to the chamfering grindstone 10, and the chamfering grindstone 10 rotates around the bolt 24 and ultrasonic waves are transmitted. Vibrate.

At this time, when any one of the cutting grooves 28, 30, and 32 of the chamfering grindstone 10 is pressed against a surface to be processed such as a glass workpiece, the glass is cut by any of the cutting grooves, for example, the cutting grooves 28. A chamfering process is performed on a surface to be processed such as a workpiece.
When the chamfering process by the cutting groove 28 is continued and the cutting groove 28 is worn, the chamfering process can be performed on the workpiece using the cutting groove 30 or the cutting groove 32. In other words, by sequentially using the three cutting grooves 28, 30, and 32, the life of the chamfering grindstone 10 accompanying the wear of the cutting grooves is tripled compared to the case of using a chamfering grindstone in which only one cutting groove is formed. Can be long.

  According to the present embodiment, as the chamfering grindstone 10, a chamfering grindstone in which only one cutting groove is formed is used by using the cutting layer 26 having three cutting grooves 28, 30, and 32. The life of the chamfering grindstone 10 accompanying the wear of the cutting groove can be increased by a factor of three, which can contribute to a reduction in running cost.

  In the above-described embodiment, the chamfering grindstone 10 is described in which three cutting grooves 28, 30 and 32 are formed in the cutting layer 26. However, the chamfering grindstone 10 has two cutting grooves in the cutting layer 26. What was formed and what formed four or more cutting grooves can be used. In this case, according to the number of cutting grooves formed in the cutting layer 26, the life of the chamfering grindstone 10 accompanying the wear of the cutting grooves can be extended.

  Moreover, in the said Example, although what chamfering grindstone 10 formed the whole cutting layer 26 with the same particle size was described, as chamfering grindstone 10, cutting layer 26 is comprised by several cutting layers from which a particle size differs. can do. For example, a plurality of cutting layers having different particle sizes are arranged adjacent to each other along the axial direction of the rotating shaft 14 (longitudinal direction of the through hole 22), and each cutting layer is fixed to the outer peripheral surface of the disk 12, and each cutting is performed. A configuration in which one or two or more cutting grooves are formed on the surface of the layer can be employed. In this case, chamfering can be performed with a single chamfering grindstone 10 on a plurality of workpieces having different surface finish roughness, and therefore, when chamfering is performed on a plurality of workpieces having different surface finish roughness. It is not necessary to replace the chamfering grindstone 10 and work efficiency can be improved.

  Next, the manufacturing method of the chamfering grindstone 10 will be described according to the flowchart of FIG. First, when forming the chamfering grindstone 10 having two cutting layers having different particle sizes, as a material for forming the two cutting layers, industrial diamond (grinding) having a particle size corresponding to each cutting layer is used. (Grain) and an adhesive (bond) are prepared (step S1). At this time, the disk 12 processed in a separate process is prepared (step S2). Next, the abrasive grains corresponding to two cutting layers, for example, a cutting layer using fine-grained industrial diamond and a cutting layer using coarse-grained industrial diamond, are weighed, and each cutting layer is adjusted to a particle size. In order to obtain a corresponding degree of concentration, the mixing ratio of abrasive grains and adhesive (bond) is set for each cutting layer, and the amount of abrasive grains and adhesive (bond) according to this setting is mixed (kneaded). (Step S3).

  Next, as shown in FIG. 4, the molds 100, 102, 104, 106, 108, 110 for forming the cutting layer are set, and the disk 12 is set in the molds 100 to 110 (step S4). . Thereafter, a mixture 50 in which fine abrasive grains and an adhesive (bond) are mixed is packed on the outer peripheral side of the disk 12 set in the molds 100 to 110 (step S5), and the mixture 50 is accustomed. Thereafter, the mixture 50 is pressed by the molds 112 and 114, and the annular mixture 50 is brought into contact with the outer peripheral side of the disk 12 (the outer peripheral surface of the flange portion 18) (step S6).

  Next, after the dies 112 and 114 are pulled out, coarse abrasive grains and an adhesive (bond) are mixed in a region adjacent to the mixture 50 on the outer peripheral side of the disk 12 set in the dies 100 to 110. The prepared mixture 52 is filled (step S7), and the mixture 52 is acclimated, and then the mixture 52 is pressed by the molds 112 and 114. ) And the mixture 50 (step S6).

Then, high temperature environment around the mold 100 to 114 from room temperature, e.g., calcined as an atmosphere of 700 ° C., the mixture 50 and 52 (step S9), and then, the mixture 50, 52 a pressure 800 kg / cm ² And pressing the annular mixtures 50 and 52 to the outer peripheral side of the disk 12 (the outer peripheral surface of the flange portion 18), respectively, and fixing the mixtures 50 and 52 to each other, as shown in FIG. Is formed as a fine-grain cutting layer 54, and the mixture 52 is formed as a coarse-grain cutting layer 56 (step S10).

  Next, the molds 112 and 114 are removed from the molds 100 to 110 in a room temperature atmosphere, and the disk 12 to which the cutting layers 54 and 56 are fixed is removed from the molds 100 to 110 (step S11). Thereafter, wire cutting (electric discharge machining) is performed on the surfaces of the cutting layers 54 and 56, respectively, and one or more cutting grooves 58 and 60 are formed in an annular shape on the surfaces of the cutting layers 54 and 56 (step S12). ). At this time, when there is a diamond protrusion in each of the cutting grooves 58 and 60, a truing process for cutting the protrusion of each of the cutting grooves 58 and 60 is performed.

  By the above processing, the chamfering grindstone 10 having two cutting layers 54 and 56 having different particle sizes can be formed on the outer peripheral side of the disk 12.

  On the other hand, when forming the one having the cutting layer 54 or the cutting layer 56 as one cutting layer on the outer peripheral side of the disk 12, the processing in steps S7 and S8 is omitted or the processing in steps S5 and S6 is omitted. By doing so, the chamfering grindstone 10 having the cutting layer 54 or the cutting layer 56 on the outer peripheral side of the disk 12 can be formed. In addition, as a cutting layer, the thing of three or more layers can be formed as several cutting layers from which a particle size differs.

It is a longitudinal cross-sectional view of the chamfering grindstone which shows one Example of this invention. It is an expanded sectional view of a cutting layer. It is a flowchart for demonstrating the manufacturing process of a chamfering grindstone. It is principal part sectional block diagram for demonstrating the relationship between the metal mold | die used for manufacture of a chamfering grindstone, and a chamfering grindstone. It is an expanded sectional view of a chamfering grindstone having two cutting layers.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Chamfering grindstone 12 Disk 14 Rotating shaft 16 Main body 18 Flange part 20 Recessed part 22 Through-hole 24 Bolt 26, 54, 56 Cutting layer 28, 30, 32, 58, 60 Cutting groove

Claims (2)

  A disk fixed to a rotating shaft constituting an ultrasonic wave propagation path, and an annular cutting layer fixed to the outer peripheral surface of the disk, and a plurality of annular cutting grooves are formed on the surface of the cutting layer. Chamfering whetstone.   The chamfering grindstone according to claim 1, wherein the cutting layer is composed of a plurality of cutting layers having different particle sizes, and the plurality of cutting layers are arranged adjacent to each other along the axial direction of the rotating shaft, A chamfering grindstone characterized in that an annular cutting groove is formed on the surface of each cutting layer.

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