JP2994346B1 - Component mounting method - Google Patents

Abstract

The present invention provides an automatic component mounting method for reducing the area required around a component during mounting. SOLUTION: In an automatic mounting method of a component in which a plurality of shield cases 1 and 2 are mounted on a substrate 3, a positioning hole 15 provided in a component other than the substrate 3 and a positioning hole 15 provided in a component other than the substrate 3 are provided. A positioning foot 24 is provided, and the positioning foot 24 is inserted into the positioning hole 15 to perform positioning, thereby reducing the area required around the component when mounting the component. The positioning hole 15 is provided on the top surface 1 of each one of the plurality of shield cases.
The positioning feet 24 are provided at portions where the other top surfaces 21 of the plurality of shield cases project to the positioning holes 15.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system for automatically mounting components, and more particularly, to a system for automatically mounting components that reduces the area required around components during mounting.

[0002]

2. Description of the Related Art Conventionally, when a component is automatically mounted, the position of the component is determined by putting a foot of the component into a positioning hole of a substrate.

[0003] This conventional automatic component mounting method will be described with reference to FIGS. 9 to 11.

FIG. 9 is a perspective view showing a conventional automatic component mounting method. In this method, the shield case 1 is
When mounted on the shield case 1, the positioning feet 13
a, 13b, 13c are formed in positioning holes 3 provided in the substrate 3.
The positions of the components 1a, 31b, and 31c to be mounted on the substrate 3 are determined. Shield case 2 to substrate 3
Similarly, when mounting on top, the positioning feet 23d, 23
e, 23f are aligned with positioning holes 31d, 3 provided in the substrate 3.
1e and 31f, the position to be mounted on the substrate 3 is determined.

FIG. 10 is a plan view showing the positions of the positioning holes in FIG. As shown in the figure, positioning holes 31a, 31b, 31c are provided on a substrate corresponding to shield case 1.
Is provided, and on the substrate corresponding to the shield case 2,
Positioning holes 31d, 31e, 31f are provided.

FIG. 11 is a sectional view taken along the line BB of FIG.
An electric component 4 and the like are arranged on the substrate 3.
Is shielded by the shield case 1 and the shield case 2 having the top surface 11,
2 are provided independently of each other.

As a conventional example described above, Japanese Utility Model Laid-Open No. 59-07 is disclosed.
There is a positioning structure between a chip component and a substrate described in Japanese Patent No. 2706. In this structure, chip components are mounted on lands formed on a printed circuit board, and at least two or more projections are provided on the back surface of the chip components, and the projections are mounted on a substrate on which the chip components are mounted. The protrusion is put in the hole corresponding to the above, and is fixed to the substrate.

As another conventional example, Japanese Utility Model Application Laid-Open No.
Japanese Patent Application Publication No. 8296 discloses a printed circuit board which fits a device for automatically mounting electronic components by inserting a positioning pin installed at a fixed position into a positioning hole of the printed circuit board. It is a printed circuit board on which a slit for absorbing a dimensional deviation of a hole is formed.

Further, as another conventional example, Japanese Patent Application Laid-Open No.
There is a mini flat IC described in Japanese Patent Application Laid-Open No. 1-120449, in which a positioning hole is provided on the surface of a case of the mini flat IC. By providing positioning protrusions on the case surface of the mini flat IC, the positional relationship with the automatic mounting machine can be regulated and the mini flat IC can be sucked, and the positioning between the lead pads of the mounting board and the lead terminals of the mini flat IC can be performed. This is an example of accurately performing.

[0010]

However, in the above-described conventional example, if a positioning hole is provided between components, it is necessary to prevent the mounting position of components other than the component using the hole from overlapping the hole. Therefore, when mounting a plurality of components, a gap must be provided between the components, and as a result, there is a problem that other components cannot be mounted unless the board area is increased.

Further, by providing a hole in the substrate, it becomes impossible to mount other electric components around the hole, and there is a problem that the position of the hole provided in the substrate is restricted.

As described above, in the conventional component mounting method, a positioning hole for a component provided on a substrate is provided in another component. At this time, when a positioning hole is provided between components, the hole is used. The mounting position other than the parts to be mounted had to be prevented from hitting the hole.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an automatic component mounting system for reducing the area required around components at the time of mounting in order to solve the above problems.

Another object of the present invention is to provide a system for automatically mounting components which can eliminate a gap required between components.

[0015]

To achieve the above object, according to the solution to ## parts mounting method of the present invention, in the component mounting method in which a plurality of shield case are mounted on a substrate, a plurality of seals
One of two adjacent shield cases
When the shield case is
And a projection that extends to the top of the
Extended from the tip, facing the top of the other shield case
And the other shield cable
Matches the positioning foot of one shield case
So that it has a positioning hole
Is inserted into the positioning hole, and the two adjacent shield cables
It is characterized in that a gap between the bases is not required .

[0016]

[0017]

Furthermore, it is preferable that the positioning foot is formed in a tapered shape.

After positioning one of the plurality of shield cases on the substrate, it is preferable that the other one of the plurality of shield cases is positioned on the substrate and also positioned on one of the plurality of shield cases. .

Further, when positioning one and the other of the plurality of shield cases on the board, it is preferable to include soldering.

Further, the material of the plurality of shield cases is preferably copper, which can be easily soldered and whose shape can be accurately determined.

Further, it is preferable that the plurality of shield cases be plated at the soldering points, and that the type of plating be tin-containing plating which is excellent in solderability.

[0023]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view showing a state before a shield case 2 is mounted in a first embodiment of an automatic mounting method of parts according to the present invention. This method uses a shield case 1 and a shield case 2 for shielding an electric component 4 disposed on a substrate 3.
And

First, the shield case 1 has a top surface 11 and side walls 12. Positioning feet 13a, 13b, 13c and soldering points 14
a, 14b, and the top surface 11 has a positioning hole 15. The positioning feet 13a, 13b, 13c
2, which are located in the direction penetrating the substrate at the end face (side in contact with the substrate), and are provided with positioning holes 31 provided in the substrate 3.
a, 31b, 31c
The tips of 3a, 13b and 13c are tapered. The soldering points 14a and 14b are located on the end face of the side wall 12 and are in contact with the substrate. Further, the positioning hole 15 is
1 is a hole penetrating therethrough.

Next, the shield case 2 has a top surface 21 and side walls 22. Positioning feet 2 are provided at the lower part of the side wall 22.
3a and 23b, and positioning feet 24,
It has soldering points 25a and 25b. The positioning feet 23a and 23b are provided at the end surfaces of the side walls 22 (sides in contact with the substrate).
And exist in a direction penetrating the substrate. The positioning foot 24 is formed by extending a part of the top surface 21,
It exists vertically on the substrate surface. The positioning feet 24
The positioning feet 23a and 23b are inserted into the positioning holes 15 provided in the shield case 1 so as to be easily inserted into the positioning holes 31d and 31e provided in the substrate 3.
The tips of 3a, 23b and 24 are tapered. The soldering points 25a and 25b are located on the side wall 2
2 are present so as to be in contact with the substrate. The material of the shield case 1 and the shield case 2 is preferably copper, which can be easily soldered and whose shape can be accurately determined. At least the soldering points 14a, 14b, 25a, 25b are plated on the shield case 1 and the shield case 2 for soldering. As for the type of plating, it is preferable to use plating containing tin which is excellent in solderability.

Next, the positioning feet 13
a, 13b, 13c, 23a, and 23e, positioning holes 31a, 31b, 31c, 31d, and 31e, respectively.
And soldering points 14a, 14b, 25a, 25b
Lands 32a, 32b for soldering components and boards with
32c and 32d.

As described above, the positioning feet 13a, 13b, 13c of the shield case 1 are located in the positioning holes 31a, 31b, 31c, respectively. Thus, the position where the shield case 1 is mounted on the substrate is determined. Positioning feet 23a, 2 of shield case 2
Like the shield case 1, 3b is located in positioning holes 31d and 31e provided in the substrate 3. Another positioning foot 24 is in a positioning hole 15 in the top surface 11 of the shield case 1. The shield case 1 and the shield case 2 are connected to the soldering points 14a, 14b,
Lands 32a, 32b, 32c, 32 at 25a, 25b
d and is soldered. When the shield case 1 is mounted on the board 3, the positioning feet 23 a and 23 b are provided with positioning holes 31 d and 3 respectively provided on the board 3.
1e, another positioning foot 24 enters the positioning hole 15 in the top surface 11 of the shield case 1. Thereby, the positioning of the shield case 2 is performed.

FIG. 2 is a perspective view showing a state after the shield case is mounted according to the first embodiment of the automatic mounting method of parts according to the present invention. In this method, a shield case 1 and a shield case 2 for shielding an electric component 4 are mounted on a substrate 3. The shield case 1 includes a top surface 11 and side walls 12, positioning feet 13a, 13b, 13c, soldering points 14a, 14b, and positioning holes 15. The positioning feet 13a, 13b, 13c are located on the end face of the side wall 12 (sides in contact with the substrate) and exist in a direction penetrating the substrate. The tips of the positioning feet 13a, 13b, 13c are tapered to facilitate insertion into the positioning holes 31a, 31b, 31c provided in the substrate 3. Soldering points 14a, 14b
Is located on the end face of the side wall 12 so as to be in contact with the substrate. The positioning hole 15 is
Through the hole. The shield case 2 includes a top surface 21,
Side wall 22, positioning feet 23a and 23b, positioning feet 2
4, which are composed of soldering points 25a and 25b. The positioning feet 23a and 23b are located on the end surface of the side wall 22 (the side in contact with the substrate) and extend in a direction penetrating the substrate. The positioning feet 24 are present on the board surface in a vertical direction before a part of the top surface 21 is extended. The tips of the positioning feet 23a, 23b and 24 are tapered so that they can be easily inserted into the positioning holes 15 provided in the shield case 1 and the positioning holes 31d and 31e provided in the substrate 3. Soldering points 25a, 25
“b” is on the end face of the side wall 22 and exists so as to be in contact with the substrate. The material of the shield case 1 and the shield case 2 is preferably copper, which can be easily soldered and whose shape can be accurately determined. At least one of the soldering points 14a, 14b, 25
A and 25b are plated. As for the type of plating, plating containing tin which is excellent in solderability is desirable. The substrate 3 has positioning feet 13a, 13b, 13c, 23a,
Positioning holes 31a, 31b, 31c for inserting 23b,
31d, 31e, soldering points 14a, 14b, 2
Land 32 for soldering the component and the board at 5a and 25b
a, 32b, 32c, and 32d. Shield case 1
Of the positioning holes 13a, 13b, 13c
1a, 31b and 31c. Thus, the position where the shield case 1 is mounted on the substrate is determined. The positioning feet 23a and 23b of the shield case 2
Like the shield case 1, they are located in positioning holes 31d and 31e provided in the substrate 3. Another positioning foot 2
4 is a positioning hole 1 in the top surface 11 of the shield case 1.
It is in 5. The shield case 1 and the shield case 2 are connected to the soldering points 14a, 14b, 25a, 2
5b contacts the lands 32a, 32b, 32c, 32d,
Soldered.

FIG. 3 is a sectional view taken along line AA of FIG. As shown in FIG.
It is necessary to make the height of the part of the electric component 4 located directly below the positioning hole 15 among the electric parts 4 inside the shield case 1 with a margin lower than the height of the top surface 11 of the shield case 1. The reason is that the tip of the positioning foot 24 of the shield case 2 is
This is because it has escaped below 1.

Next, the operation of the embodiment of the present invention will be described in detail.

FIG. 4 shows a first embodiment of the automatic component mounting system according to the present invention.
It is a figure which shows the positional relationship before mounting a shield case in Example of FIG. First, the shield case 1 is mounted on the board 3 as shown in the shield cases 1 and 2 in FIG. Next, the shield case 1 is positioned by inserting the positioning feet 13a, 13b, 13c into the positioning holes 31a, 31b, 31c provided in the substrate 3.
This situation is shown in FIG. 1 described above. Next, the shield case 2 is mounted on the substrate 3. At this time, the positioning feet 23a and 23b enter the positioning holes 31d and 31e provided in the substrate 3, and at the same time, the positioning feet 24 of the shield case 2 enter the positioning holes 15 on the top surface 11 of the shield case 1. Thereby, the positioning of the shield case 2 is performed. FIG. 2 shows a state in which the positioning of the shield case 1 and the shield case 2 has been completed. afterwards,
The parts are placed in a temperature bath, and the lands 32a, 32b, 32c,
The solder applied to 32d is melted and soldered to soldering points 14a, 14b, 25a, 25b.

Next, a second embodiment of the present invention will be described with reference to the drawings.

FIG. 5 shows a second embodiment of the automatic component mounting system according to the present invention.
It is a perspective view which shows the Example of FIG. This figure is a diagram showing each component before mounting the I / O unit 5 and the shield case 2 on the board 3. The I / O unit 5 includes an I / O connector 51, an I / O connector unit 52, positioning feet 53a and 53b, and a positioning hole 54. The material of the I / O unit 5 is preferably a heat-resistant resin such as polyferrinene sulfide (PPS) which does not have a problem such as deformation even when placed in a temperature bath. The shield case 2 is the top surface 2
1 and side walls 22, positioning feet 23a and 23b, positioning feet 24, and soldering points 25a and 25b. The board 3 has positioning holes 3 into which positioning feet 23a and 23b are inserted for positioning components.
1d and 31e, and lands 32c and 32d for soldering the component and the board at the soldering points 25a and 25b.

Next, the operation of the second embodiment of the present invention will be described with reference to FIGS.

FIG. 6 shows a second embodiment of the automatic component mounting system according to the present invention.
It is a figure which shows operation | movement of Example. First, as shown in FIG. 6, the positioning feet 53a and 53b of the I / O unit 5 enter the positioning holes 31f and 31g of the board 3. This allows
The position where the I / O unit 5 is mounted on the board is determined.

FIG. 7 is a perspective view showing a state after the positioning is completed. As shown in FIG.
The other positioning feet 24 enter the positioning holes 54 in the I / O unit 5 at the same time as the positioning feet 23a, 23b of the I / O unit 5 enter the positioning holes 31d, 31e provided in the substrate 3.

Next, a third embodiment of the automatic component mounting system according to the present invention will be described in detail.

FIG. 8 shows a third embodiment of the automatic component mounting system according to the present invention.
FIG. 3 is a perspective view showing a configuration of the example. In this embodiment, the soldering points 14a, 14b, 25a, and 2 are formed from the shield case 1 and the shield case 2 of the first embodiment.
5b is deleted. Lands 32a, 3 of substrate 3
Shield cases 1 and 2 instead of 2b, 32c and 32d
The lands 32e, 32f, 32g, and 32h are provided along the end faces of the side walls 12 and 22 (thick surfaces facing the substrate), and the end faces of the side walls 12 and 22 are brought into contact with each other to perform soldering. This embodiment has the effect that the area required around the soldering point in the mounted component can be further reduced.

[0040]

As described above, in the present invention, the positioning holes provided in the conventional substrate are provided in other parts.
Therefore, there is an effect that an area required around the component at the time of mounting (a range where other components cannot be mounted) can be made smaller than before.

In the past, when a positioning hole was provided between components, it was necessary to prevent the mounting position of a component other than the component using the hole from overlapping the hole. There is an effect that a gap required between components can be eliminated.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a state before a shield case 2 according to a first embodiment of the present invention is mounted.

FIG. 2 is a perspective view showing a state after mounting the shield case according to the first embodiment of the present invention.

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a perspective view showing a positional relationship before mounting the shield case according to the first embodiment of the present invention.

FIG. 5 is a perspective view showing a state before mounting a shield case according to a second embodiment of the present invention.

FIG. 6 is a perspective view showing the operation of the second embodiment of the present invention.

FIG. 7 is a perspective view showing the operation of the second embodiment of the present invention.

FIG. 8 is a perspective view showing a third embodiment of the present invention.

FIG. 9 is a perspective view showing a conventional example.

FIG. 10 is a plan view showing a conventional example.

FIG. 11 is a sectional view showing a conventional example.

[Description of Signs] 1, 2 shield case 3 board 4 electrical component 5 I / O unit 11 top surface 12 side wall 13 positioning foot 14 soldering point 15 positioning hole 21 top surface 22 side wall 23, 24 positioning foot 25 soldering point 31 Positioning hole 32 Land 53 Positioning foot 54 Positioning hole

Claims (6)

(57) [Claims] 1. A plurality of shield cases are mounted on a substrate.
In the component mounting method , two adjacent seals of the plurality of shield cases are used.
Of the shield case from one part of the top surface to the other
Of the shield case extended to the top of the other shield case
A protrusion, extending from the tip of the protrusion, and
Positioning feet provided toward the top of the
And the other shield case is provided with the one shield case.
Provided on the top surface to match the positioning feet
A positioning hole, wherein the positioning foot is inserted into the positioning hole,
An automatic component mounting method characterized by eliminating the need for a gap between two shield cases in contact with each other . 2. The component mounting method according to claim 1 , wherein the positioning foot is formed in a tapered shape.
Expression . 3. The component mounting according to claim 1 , wherein said one shield case is positioned with respect to said other shield case simultaneously with positioning said other shield case on said substrate. Method . 4. When positioning the other of the shield case and the other of the shield case on the substrate, characterized in that it comprises a soldering part mounting method according to claim 1. The material of claim 5, wherein the plurality of shield case is easy to be soldered, characterized in that the shape of the shield case is liable copper exactly out component according to claim 4 tower
Mounting method . The method according to claim 6, wherein the plurality of shield case, given the plated soldering points, the type of the plating is characterized by a plating containing tin having excellent solderability, claim 4 or 5 Component mounting method described in.