JP2553665B2 - Semiconductor device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device used for mounting a film carrier type semiconductor element on a printed board.

2. Description of the Related Art Conventionally, as a method of mounting a semiconductor element on a printed board in a film carrier mounting method, outer lead bonding in a film state has been performed. A conventional example will be described below with reference to FIG.

In FIG. 3, 21 is a semiconductor element, 22 is a bump, 23 is a film carrier, 24 is an inner lead, 25 is an outer lead, 26 is a conductor wiring layer on a printed circuit board, 27 is a printed circuit board, 28 is a sealant, and 29 is a sealant. Is a jacket material. First, after bonding the semiconductor element 21 to the inner lead 24, a film carrier for one element is punched out from a series of film carriers in which the semiconductor element 21 and the inner lead 24 are sealed with a sealant 28, and a conductor on the printed circuit board 27. Transfer to the wiring layer 26. After that, the outer leads 25 of the film carrier 23 and the conductor wiring layer 26 on the printed circuit board are joined by thermocompression bonding or the like, and the outer cover material 29 is covered.

However, in the above-described conventional configuration, the outer lead bonding apparatus is dedicated to the process, and therefore, there is a problem in that the cost of assembling equipment is high during implementation. Furthermore, since the number and pitch of outer leads are not constant and vary depending on the product, the outer lead bonding process is individually tailored and requires experience in joining conditions, etc., which also hinders the spread of film carrier mounting technology. . It is difficult to guarantee the reliability as an element when the semiconductor element is mounted on the film carrier.

The present invention solves the above-mentioned conventional problems, is easy to handle when mounted on a printed circuit board, and can be mounted by a method similar to that used for a conventional surface mount device. An object of the present invention is to provide a semiconductor device device.

In order to achieve this object, the semiconductor device of the present invention,
The structure is such that outer lead bonding is performed on a container having a conductor wiring layer and having a recess for accommodating a semiconductor element, and the recess is sealed to mold. Further, at this time, if a through hole is provided in the concave portion, the resin or the like can be sealed from the side opposite to the concave portion of the container, and better sealing without generation of bubbles or the like is possible. Further, this through hole can also be used as a heat sink mounting hole. further,
If the side wall of the concave portion of the container is inclined, the state of adhesion between the conductor wiring layer and the surface of the container can be improved. In addition, if a groove is provided between the conductor wiring layers on the convex portion around the concave portion of the container, solder may flow when the package is mounted on the conductor wiring of the printed circuit board, resulting in a short circuit with an adjacent conductor wiring. It can be lost. If the container or the sealing portion is provided with a concave portion, a convex portion, or an indication, it can be used for identifying the terminal number or can be used as a mark when the package is mounted on the printed board.

Action With this configuration, the semiconductor element mounted on the film carrier is mounted on the rigid substrate, and the handling becomes extremely easy. Mounting on the printed circuit board conductor wiring can also be performed by the reflow soldering method or the vapor phase soldering method as in the case of the conventional surface mounting package such as a flat package.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1a shows the structure of a semiconductor device according to the first embodiment of the present invention, and FIG. 1b shows a sectional view. In FIG. 1, 1 is a semiconductor element, 2 is a bump, 3 is a film carrier, 4 is a container, 5 is a conductor wiring layer, 6 is a sealant, and 7 is a sealant.
Is a through hole, 8 is a groove provided on the convex portion around the concave portion of the container 4, 9 is a notch, and 10 is a side wall of the concave portion of the container.

First, the film carrier 3 to which the semiconductor element 1 is inner lead bonded is outer lead bonded to the recessed conductor wiring layer 5 of the container 4. The material of this container 4 is rigid and warps even when exposed to the soldering temperature for several seconds.
Any material may be used as long as it has heat resistance that does not cause distortion, and may be, for example, an epoxy resin or ceramics. If the side wall of the recess is inclined as shown in FIG. 1, the container and the conductor wiring layer can be bonded well. After this, the recess is sealed with the sealant 6. The sealant 6 may be, for example, an epoxy potting resin. In addition, at the time of sealing,
By encapsulating the encapsulant 6 also through the through-hole 7 provided in the recess, it is possible to improve the surroundings of the encapsulant and perform better encapsulation without generation of bubbles or the like. Further, if the groove portion 8 is provided between the conductor wiring layers 5 on the surface of the convex portion around the concave portion of the container 4, the conductor wiring layers adjacent to each other when the semiconductor package is mounted on the printed circuit board surface or the conductor wiring layer. You can avoid troubles such as short circuit. Further, by providing the cutout portion 9, the terminal number can be identified. Furthermore, by making the side wall 10 of the recess of the container inclined, the adhesion between the container 4 and the conductor wiring layer 5 at the corner can be improved.

A second embodiment of the present invention will be described below with reference to the drawings.

FIG. 2 shows the configuration of a semiconductor device according to the second embodiment of the present invention. In FIG. 2, 11 is a container and 12
Is a heat sink, 13 is a recess provided on the side surface of the container 11, 14 is a printed circuit board, 15 is a conductor wiring layer formed on the printed circuit board 14, and 16 is a notch.

First, the semiconductor element is joined to the container 11 by the same method as in the first embodiment, the recess is sealed, and then the heat dissipation plate 12 is attached when sealing through the recess through hole. You may display on this heat sink and use it for identification of a semiconductor element. Further, by providing the concave portion 13 on the side surface of the container 11,
It can be used as a positioning mark when the present semiconductor package is mounted on the conductor wiring layer 15 on the printed board 14. The notch 16 is used to identify the terminal number, as in the first embodiment.

In each of the embodiments, the conductor wiring layer is formed only on the concave surface of the container, but it may be formed on both surfaces. The method of joining the semiconductor element and the container recessed conductor wiring layer may not be the film carrier method, but may be wire bonding, for example.

Effects of the Invention As described above, the present invention forms a conductor wiring layer on the surface of a container having a recess, and after bonding a film carrier on which a semiconductor element is mounted, the recess is sealed to form a semiconductor package, It is easy to handle and can be mounted on a printed circuit board in the same manner as other surface mount packages.

At this time, by providing a through hole in the concave portion of the container, the circumference of the sealant can be improved, and better sealing can be performed. Also,
By providing the side wall of the concave portion of the container with an inclination, it is possible to improve the adhesion between the surface of the container and the conductor wiring layer formed thereon. Furthermore, by providing a groove between the conductor wiring layers on the container, which are bonded to the conductor wiring layers on the printed circuit board, it is possible to eliminate a short circuit during soldering. By providing a concave portion, a convex portion, a cutout portion, or an indication on the container or the sealing portion, it can be used as a mark for identifying the terminal number or a mark for alignment when mounting on the printed board.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a semiconductor device according to a first embodiment of the present invention, FIG. 2 is a configuration diagram of a semiconductor device according to a second embodiment of the present invention, and FIG. 3 is a configuration diagram of a conventional outer lead bonding. Is. 1 ... Semiconductor element, 2 ... Bump, 3 ... Film carrier, 4 ... Container, 5 ... Conductor wiring layer, 6 ... Sealant,
7 ... through hole, 8 ... groove, 9 ... notch, 10 ...
Side wall of the concave part of the container, 13 ...

Claims (1)

(57) [Claims] 1. A rigid container having a concave portion capable of accommodating a semiconductor element and having a conductor wiring layer extending from the concave portion to a peripheral convex portion on a surface thereof is arranged with the semiconductor element in the concave portion, and the electrode and the electrode are provided. A semiconductor device in which a conductor wiring layer is connected and the recess is filled with a sealant, wherein the conductor wiring layer is formed on the surface of the protrusion around the recess, and a groove portion is formed between adjacent conductor wiring layers. A semiconductor device comprising: