JP2019080457A - Non-contact power supply device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact power feeding device capable of miniaturization and inexpensive. SOLUTION: A contactless power feeding device 10 is electrically connected to a power supply unit 205, a first power transmission antenna 231 arranged in a loop, and a first power transmission antenna, and a plurality of non-contact power transmission devices 10 are around the first power transmission antenna. Includes a second power transmission antenna 233 provided, a power transmission device 200 including a power transmission antenna unit 230 connected to a power supply unit, a power storage unit 110, and a first power reception antenna 131 arranged in a loop. It has a power receiving device 100 including a power receiving antenna unit 130 connected to the power storage unit. The second power transmission antenna is arranged orthogonally to the first power transmission antenna, and the power transmission antenna unit and the power reception antenna unit are arranged in parallel. [Selection diagram] Fig. 1

Description

  The present invention relates to a noncontact power feeding device.

  BACKGROUND In recent years, electronic devices using a noncontact power feeding method are widely used. In the case of non-contact power feeding, power is transmitted from the power transmitting antenna to the power receiving antenna by mounting the electronic device including the power receiving device on the power transmitting device (power feeding device) such that the power transmitting antenna and the power receiving antenna face each other. The power generated by the power receiving antenna is stored in the secondary battery of the electronic device.

JP 2012-44735 A

  In the case of conventional non-contact power feeding, for example, it is necessary to provide a shielding material on one side of the power transmission antenna to shield the electric field or the magnetic field so that the influence of the electric field or the magnetic field does not affect other electronic components of the electronic device. There is. However, when a metal plate is used as the shielding material, when the metal plate is disposed in the vicinity of the antenna along with the miniaturization of the electronic device or the feeding device, the electric field or magnetic field to be transmitted or received becomes smaller. , It may not be possible to supply power enough. On the other hand, when a magnetic material is used as the shielding material, the electric field or the magnetic field is not reduced even if the shielding material is arranged in the vicinity of the antenna. However, since the magnetic material is expensive, the manufacturing cost of the antenna is increased.

  In view of the above problems, an object of the present invention is to provide a non-contact power feeding apparatus which can be miniaturized and which is inexpensive.

  According to an embodiment of the present invention, a plurality of power supply units are electrically connected to the first power transmitting antenna and the first power transmitting antenna arranged in a loop and provided around the first power transmitting antenna. A power transmission device including a second power transmission antenna and including a power transmission antenna unit connected to a power supply unit, a power storage unit, and a first power receiving antenna arranged in a loop, and a power reception unit connected to the power storage unit And a second power transmitting antenna is disposed orthogonal to the first power transmitting antenna, and the power transmitting antenna and the power receiving antenna are disposed in parallel. A contactless power supply is provided.

  In the non-contact power feeding apparatus, the power receiving antenna unit includes a second power receiving antenna electrically connected to the first power receiving antenna and provided in a plurality around the first power receiving antenna, and the second power receiving antenna is , And may be disposed orthogonal to the first power receiving antenna.

  In the non-contact power feeding device, the size of the second power transmitting antenna may be smaller than that of the first power transmitting antenna, and the size of the second power receiving antenna may be smaller than that of the first power receiving antenna.

  In the noncontact power feeding apparatus, the number of turns of the second power transmitting antenna is larger than the number of turns of the first power transmitting antenna, and the number of turns of the second power receiving antenna is larger than the number of turns of the first power receiving antenna May be

  In the above non-contact power feeding device, the power transmission device has a first surface and a second surface opposite to the first surface in a cross sectional view, and the power receiving device faces the first surface in a cross sectional view The magnetic force on the first surface side of the power transmitting antenna unit is different from the magnetic force on the second surface side, and the magnetic force on the third surface side of the power receiving antenna unit has three surfaces and the fourth surface opposite to the third surface. May be different from the magnetic force on the fourth surface side.

  In the non-contact power feeding device, the magnetic force on the first surface side may be stronger than the magnetic force on the second surface side.

  In the non-contact power feeding apparatus, the power transmission antenna unit further includes a first substrate, and the second power transmission antenna has a first upper wiring on the first surface side, a first through wiring in the first substrate, and a second surface. The first upper wiring and the first lower wiring are connected via the first through wiring, the power receiving antenna unit further includes the second substrate, and the second power receiving antenna is The third upper surface includes the second upper wiring, the second substrate includes the second through wiring, and the fourth surface includes the second lower wiring, and the second upper wiring and the second lower wiring are connected via the second through wiring. The second upper wiring and the second lower wiring to be connected may be connected via the second through wiring.

  In the non-contact power feeding apparatus, the first power transmission antenna includes a first connection wire connecting the second power transmission antenna and the second power transmission antenna, and the first power receiving antenna is a second power receiving antenna and You may include the 2nd connection wiring which connects each of a 2nd power receiving antenna.

  In the non-contact power feeding device, at least one of the first substrate and the second substrate may include a resin material.

  In the non-contact power feeding device, at least one of the first through wiring and the second through wiring may include copper.

It is a perspective view of the non-contact electric power supply of one embodiment of the present invention. It is the top view and sectional drawing of the antenna part arrange | positioned at the power transmission apparatus of one Embodiment of this invention. It is the top view and sectional drawing of the antenna part arrange | positioned at the power receiving apparatus of one Embodiment of this invention. It is sectional drawing of the power transmission antenna part of the power transmission apparatus of one Embodiment of this invention, and the call | power receiving antenna part of a call | power receiving apparatus. It is a schematic diagram which shows the magnetic force line in the power transmission antenna part of the power transmission apparatus of one Embodiment of this invention. It is a schematic diagram which shows the magnetic force line in the power transmission antenna part of the power transmission apparatus of one Embodiment of this invention. It is a block diagram of the non-contact electric power supply of one embodiment of the present invention. It is sectional drawing which shows the drive state of the non-contact electric power supply of one Embodiment of this invention. It is the top view and perspective view of the power transmission antenna part arrange | positioned at the power transmission apparatus of one Embodiment of this invention. It is the top view and perspective view of the receiving antenna part arrange | positioned at the receiving device of one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the power transmission antenna part of one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the power transmission antenna part of one Embodiment of this invention. It is sectional drawing which shows the manufacturing method of the power transmission antenna part of one Embodiment of this invention. It is a specific example of the non-contact electric power supply of one Embodiment of this invention. It is a specific example of the non-contact electric power supply of one Embodiment of this invention. It is a specific example of the non-contact electric power supply of one Embodiment of this invention. It is a specific example of the non-contact electric power supply of one Embodiment of this invention. It is the top view and sectional drawing of the power transmission antenna part arrange | positioned at the power transmission apparatus of one Embodiment of this invention. It is sectional drawing which shows the drive state of the non-contact electric power supply apparatus of a prior art example.

  Hereinafter, embodiments of the invention disclosed in the present application will be described with reference to the drawings. However, the present invention can be implemented in various forms without departing from the scope of the present invention, and the present invention is not interpreted as being limited to the description of the embodiments exemplified below.

  In the drawings referred to in this embodiment, the same portions or portions having similar functions are denoted by the same reference numerals or similar reference numerals (reference numerals with only -1, -2, etc. appended after numbers), The repeated description may be omitted. Further, the dimensional ratio of the drawings may be different from the actual ratio for convenience of explanation, or part of the configuration may be omitted from the drawings.

First Embodiment
Hereafter, the non-contact electric power supply of one Embodiment of this invention is demonstrated.

  FIG. 1 is a schematic view of the non-contact power feeding device 10. Non-contact power feeding device 10 includes a power transmission device 200 and a power reception device 100.

(1-1. Configuration of power transmission device)
As shown in FIG. 1, the power transmission device 200 includes a power supply unit 205, a control unit 210, a power transmission antenna unit 230, and a support unit 240. The power supply unit 205, the control unit 210, and the power transmission antenna unit 230 are provided on the surface or inside of the support unit 240. The power supply unit 205 may be disposed outside the support unit 240. The power supply unit 205, the control unit 210, and the power transmission antenna unit 230 are electrically connected.

  For the power supply unit 205, for example, an alternating current power supply is used. When the power supply unit 205 is a portable power supply, a DC power supply may be used.

  Power transmission antenna unit 230 supplies power to power reception device 100 via an electric field or a magnetic field according to an instruction from control unit 210.

  The support unit 240 has a function of supporting the power supply unit 205, the control unit 210, and the power transmission antenna unit 230. The support part 240 can be paraphrased as a housing. For the support portion 240, for example, a resin material such as polyethylene terephthalate (PET) or polyvinyl chloride (PVC) is used. The support portion 240 has an upper surface 240A and a lower surface 240B (described in FIG. 2 described later). The lower surface 240B is a surface provided on the opposite side of the upper surface 240A. The thickness of the support portion 240 is appropriately selected from several hundred μm to several tens cm according to the purpose.

  The power transmission antenna unit 230 includes a power transmission antenna 231 and a power transmission antenna 233. The power transmission antenna 231 and the power transmission antenna 233 are antennas of an electromagnetic induction system, and are also called loop antennas. A current for power transmission is sent to the power transmission antenna 231 and the power transmission antenna 233, and a magnetic field is generated. The power transmission antenna unit 230 is configured to resonate in a frequency band of, for example, a short wave (HF) or an ultra high frequency (UHF). Specifically, the short wave corresponds to the 13.56 MHz frequency band. Further, the ultra high frequency wave corresponds to a frequency band of 860 to 960 MHz and further to several GHz.

  For the power transmission antenna 231 and the power transmission antenna 233, a material having a low resistivity is used. For example, copper (Cu) is used for the power transmission antenna 231 and the power transmission antenna 233. Copper is desirable as a material of an antenna because it has high ductility and is easy to process. The power transmission antenna 231 and the power transmission antenna 233 are not limited to copper, and a material with low resistivity, such as aluminum (Al), silver (Ag), gold (Au) or the like may be used. In addition, for the power transmission antenna 231 and the power transmission antenna 233, a conductor having magnetism such as iron (Fe), nickel (Ni), cobalt (Co), or ferrite may be used. The magnetic conductor may be a single element or an alloy. In addition, the conductor having magnetism may contain boron. In addition, a shape memory alloy such as a titanium-nickel alloy, stainless steel, or the like may be used for the power transmission antenna 231 and the power transmission antenna 233. The power transmission antenna 231 and the surface of the power transmission antenna 233 may be provided with a covering material such as enamel.

(1-2. Configuration of power reception device)
As shown in FIG. 1, power reception device 100 includes a power storage unit 110, a control unit 119, a power reception antenna unit 130, and a support unit 140. Power storage unit 110, control unit 119, and power reception antenna unit 130 are provided on the surface or inside of support unit 140. Power storage unit 110, control unit 119, and power reception antenna unit 130 are electrically connected.

  Power reception antenna unit 130 transmits the power received from power transmission device 200 via electric field or magnetic field to power storage unit 110 and control unit 119.

  Power storage unit 110 functions as a battery (secondary battery) that stores the supplied power. For example, a lithium ion battery is used for power storage unit 110.

  Support portion 140 has a function of supporting power storage portion 110, control portion 119, and power reception antenna portion 130. For the support portion 140, the same material as the support portion 240 may be used. The thickness of the support portion 140 is appropriately selected from several hundred μm to several cm according to the purpose.

  The power receiving antenna unit 130 includes a power receiving antenna 131 and a power receiving antenna 133. The power receiving antenna unit 130 has the same configuration as the power transmitting antenna unit 230. The power receiving antenna 131 and the power receiving antenna 133 are antennas of an electromagnetic induction system, and are loop antennas. An electromotive force (voltage) having a magnitude corresponding to the change in magnetic flux density passing through the region surrounded by the power receiving antenna 131 and the power receiving antenna 133 is generated in the power receiving antenna unit 130. The generated voltage is applied to power storage unit 110. As a result, the electronic device in which the power receiving device 100 is used is driven.

(1-3. Configuration of antenna unit)
Hereinafter, the power transmission antenna unit 230 of the power transmission device 200 and the power reception antenna unit 130 of the power reception device 100 will be described.

  FIG. 2A is a top view of the power transmission antenna unit 230. FIG. FIG. 2B is a cross-sectional view between the top view A <b> 1 and A <b> 2 of the power transmission antenna unit 230.

  As shown in FIGS. 2A and 2B, the power transmission antenna 231 (which may be referred to as a first power transmission antenna) is arranged in a loop. The power transmission antenna 231 is not limited to the shape illustrated in FIG. 2A, and may be configured to be wound multiple times. A plurality of power transmission antennas 233 (sometimes referred to as a second power transmission antenna) are disposed around the power transmission antenna 231. In this example, six power transmission antennas 233 are arranged at equal intervals outside the power transmission antenna 231. In addition, as the power transmission antenna 233, one smaller than the power transmission antenna 231 is used. The power transmission antenna 231 and the power transmission antenna 233 are electrically connected. In this example, the power transmission antenna 231 and the plurality of power transmission antennas 233 are configured by processing and shaping one wire (specifically, it is configured as one-stroke writing). At this time, a portion connecting one of the power transmission antenna 233 (power transmission antenna 233A) and the other one of the antennas (power transmission antenna 233B) is the power transmission antenna 231.

  Moreover, as shown to FIG. 2 (B), center 233C of the power transmission antenna 233 is provided in the plane 231S in which the power transmission antenna 231 is arrange | positioned. The power transmission antenna 233 is disposed orthogonal to the plane 231S of the power transmission antenna 231. With this arrangement, a greater effect can be obtained in providing a difference in magnetic force between the upper surface 240A side and the lower surface 240B side of the support portion 240, which will be described in detail later.

  In addition, it is not limited to said structure, The power transmission antenna 233 may be arrange | positioned. For example, the center 233C of the power transmission antenna 233 may be disposed apart from the plane 231S. Further, the power transmission antenna 233 may be disposed substantially orthogonal to the plane 231S of the power transmission antenna 231 due to the influence of a manufacturing process or the like. The term "substantially orthogonal" in this case refers to a state in which it is inclined upward or downward by 1 degree or more and 20 degrees or less from the orthogonal state. In addition, the power transmission antennas 233 may be arranged not necessarily at regular intervals but localized.

  As shown in FIGS. 2A and 2B, the power transmission antenna 233 is smaller than the power transmission antenna 231. In this case, in order to increase the magnetic field (magnetic force) of the power transmission antenna 233, it is desirable that the number of turns of the power transmission antenna 233 be larger than the number of turns of the power transmission antenna 231. Thereby, the magnetic field (magnetic force) in the power transmission antenna 233 is enhanced.

  FIG. 3A is a top view of the power receiving antenna portion 130 of the power receiving device 100. FIG. FIG. 3B is a cross-sectional view between the top view A <b> 1 and A <b> 2 of the power receiving antenna unit 130.

  The power reception antenna unit 130 has the same configuration as the power transmission antenna unit 230 of the power transmission device 200. As shown in FIGS. 3A and 3B, the power receiving antenna 131 (sometimes referred to as a first power receiving antenna) is arranged in a loop. Note that the power receiving antenna 131 is not limited to the shape shown in FIG. 3A, and may be wound a plurality of times. A plurality of power receiving antennas 133 (sometimes referred to as second power receiving antennas) are arranged around the power receiving antenna 131. In this example, six power receiving antennas 133 are arranged at equal intervals outside the power receiving antenna 131. Further, as the power receiving antenna 133, one smaller than the power receiving antenna 131 is used. The power receiving antenna 131 and the power receiving antenna 133 are electrically connected. In this example, the power receiving antenna 131 and the plurality of power receiving antennas 133 are configured by processing and shaping one wire (specifically, it is configured as one-stroke writing). At this time, a portion connecting one of the power receiving antenna 133 (power receiving antenna 133A) and the other one of the antennas (power receiving antenna 133B) is the power receiving antenna 131.

  Further, as shown in FIG. 3B, the center 133C of the power receiving antenna 133 is provided on the plane 131S on which the power receiving antenna 131 is disposed. Further, the power receiving antenna 133 is disposed orthogonal to the plane 131S of the power receiving antenna 131.

  As shown in FIGS. 3A and 3B, the power receiving antenna 133 is smaller than the power receiving antenna 131. In this case, in order to increase the magnetic field (magnetic force) of the power receiving antenna 133, it is desirable that the number of turns of the power receiving antenna 133 be larger than the number of turns of the power receiving antenna 131. Thereby, the magnetic field (magnetic force) in the power receiving antenna 133 is enhanced.

  With the above-described structure, the magnetic field from the power transmission antenna unit 230 influences the power reception antenna unit 130, and an induced current flows.

  FIG. 4 is a cross-sectional view showing the arrangement of the power transmitting antenna unit 230 of the power transmitting apparatus 200 and the power receiving antenna unit 130 of the power receiving apparatus 100. In FIG. 4, the upper surface (the upper surface 140A of the support portion 140) of the power receiving device 100 and the upper surface (the upper surface 240A of the support portion 240) of the power transmission device 200 are disposed to face each other. At this time, as shown in FIG. 4, the power transmitting antenna unit 230 and the power receiving antenna unit 130 are disposed in parallel. With this configuration, power loss can be suppressed when power is sent from the power transmission device 200 to the power receiving device 100 by an electromagnetic induction method. Further, in the above, the power receiving antenna 133 of the power receiving antenna unit 130 is disposed so as to be opposite to the power transmitting antenna 233 of the power transmitting antenna unit 230. Thus, the generation of the magnetic field on the upper surface side of the power receiving device 100 can be suppressed.

  5 and 6 are schematic diagrams showing magnetic lines of force in the power transmission antenna unit 230. FIG. As shown in FIG. 5, in the region R1 below the plane 231S, the magnetic field lines M231 of the power transmission antenna 231 face upward while the magnetic field lines M233 of the power transmission antenna 233 face downward. Therefore, magnetic field line M231 of power transmission antenna 231 and magnetic field line M233 of power transmission antenna 233 interfere in region R1. Therefore, in the region R1, the magnetic force lines M231 of the power transmission antenna 231 are disturbed. On the other hand, in the region R2 above the plane 231S, the magnetic field line M231 of the power transmission antenna 231 and the magnetic field line M233 of the power transmission antenna 233 both face upward. Therefore, in the region R2, the magnetic force lines M231 of the power transmission antenna 231 are not disturbed. Therefore, as shown in FIG. 6, in the power transmission antenna unit 230, the magnetic force on the upper surface 240A side of the support 240 is larger than the magnetic force of the lower surface 240B of the support 240, that is, lower than the plane 231S. That is, it can be said that the magnetic force on the upper surface 240A side of the power transmission antenna unit 230 is different from the magnetic force on the lower surface 240B side.

  The power receiving antenna unit 130 of the power receiving device 100 also has the same configuration. Therefore, it can be said that the magnetic force on the upper surface 140A side of the power receiving antenna unit 130 is different from the magnetic force on the lower surface 140B side.

(1-4. Block diagram of power reception device)
Next, FIG. 7A shows a block diagram of the power receiving device 100. FIG.

  The power receiving device 100 can include a voltage limit circuit 111, a rectifier circuit 113, a storage portion 121, a resistor 123, a load portion 125, and the like in addition to the power storage portion 110, the control portion 119, and the power receiving antenna portion 130.

  The voltage limit circuit 111 has a function of protecting the power receiving device 100 from an input voltage when an excessive voltage is induced in the power receiving antenna unit 130. When an excessive voltage is induced, an unnecessary portion of the generated current is converted to heat using the resistor 123 and released to the outside.

  The rectifier circuit 113 has a function of converting alternating current induced in the power receiving antenna unit 130 into direct current. The power supply voltage that has become direct current by the rectification circuit 113 is supplied to all the circuits that constitute the power receiving device 100.

  The control unit 119 has a function of controlling the entire function related to power reception. The control unit 119 is configured by various logic circuits. For the control unit 119, a CPU (Central Processing Unit) or the like may be used.

  The storage unit 121 is provided with a memory element for storing data regarding power reception. The storage unit 121 may not necessarily be provided.

  The load unit 125 has a function of converting power into physical operation. For example, an actuator is used as the load unit 125. The load unit 125 may not necessarily be provided.

(1-5. Other Configurations of Power Transmission Device)
The structural example of the power transmission apparatus 200 is shown to FIG. 7 (B). The power transmission device 200 includes a storage unit 213, an oscillation circuit 220, and a transmission circuit 225 in addition to the power supply unit 205, the control unit 210, and the power transmission antenna unit 230.

  The control unit 210 controls the entire power transmission device 200. The control unit 210 controls the power transmission time and the amount of transmitted power using the storage unit 213. The control unit 210 may use a memory as well as the CPU.

  The oscillator circuit 220 has a function of generating a signal of a frequency used for power transmission based on the power from the power supply unit 205. For example, a high frequency of 13.56 MHz is generated as a carrier wave. Note that the carrier wave is not limited to this, and a frequency signal of 110 kHz to 205 kHz may be used, or a high frequency (2.45 GHz) signal may be used.

  The transmission circuit 225 amplifies the signal, attenuates unnecessary frequencies, and the like, and takes out only the frequency to be transmitted. In addition, the transmission circuit 225 generates transmission power. The transmission circuit 225 may also include a resonant circuit using a coil or a capacitor.

(Operation of non-contact power feeding device 10)
Next, the operation of the non-contact power feeding device 10 will be described. FIG. 8 is a cross-sectional view of the non-contact power feeding device 10 at the time of driving.

  As shown in FIG. 8, the power transmission device 200 is driven with the upper surface (the upper surface 140A of the support portion 140) of the power reception device 100 at the lower side and the lower surface (the lower surface 140B of the support portion 140) at the upper side. When the power transmission device 200 is driven, an AC signal is applied to the power transmission antenna unit 230, and a magnetic field M231 is generated (carrier wave). The magnetic field M 231 passes through the power receiving antenna unit 130 of the power receiving device 100. At this time, power is supplied from the power transmitting apparatus 200 to the power receiving apparatus 100 by the induced electromotive force working.

  At this time, as shown in FIG. 6, the magnetic lines of force M 231 B generate asymmetric magnetic characteristics, that is, a stronger magnetic field on the upper surface side than the lower surface side of the power transmission device 200. In other words, the magnetic field generated on the lower surface side of the power transmission device 200 can be weakened.

  Here, FIG. 19 shows a cross-sectional view of the conventional non-contact power feeding device 50. Non-contact power feeding device 50 includes shielding member 190 in addition to power transmission device 201 and power reception device 101. The power transmission device 201 does not include the power transmission antenna 233 in the power transmission antenna unit 230. The power receiving device 101 does not include the power receiving antenna 133 in the power receiving antenna unit 130. For example, when the power transmission device 201 is small, when the shielding material 190 including a metal material that is not a magnetic material is disposed in the vicinity of the power transmission antenna unit 230, the magnetic field or the electric field to be transmitted also becomes small. As a result, the power receiving apparatus 101 may not be sufficiently powered. Therefore, it is necessary to widely provide a space between the support portion 240 and the shielding material 190 so that the power reception device 101 is supplied with power, and the miniaturization of the power transmission device 201 is limited. In addition, when the magnetic material is used as a shielding material, even if the shielding material is disposed in the vicinity of the antenna, the transmitted electric field or magnetic field is not reduced and is maintained. However, since the magnetic material is expensive, the manufacturing cost of the antenna is increased.

  On the other hand, by using this embodiment, the non-contact power feeding device 10 may not be provided with the shielding material. Moreover, even when the shielding material is provided, it is not necessary to provide an extra space. Therefore, downsizing of the power transmission device 200, that is, downsizing of the non-contact power feeding device can be achieved. Moreover, by using this embodiment, it is possible to obtain the same effect as in the case of using a shielding material containing a magnetic material. That is, the non-contact power feeding device can be provided inexpensively. Moreover, by using this embodiment, since it has an asymmetrical magnetic characteristic, the non-contact electric power supply which has high directivity can be provided.

Second Embodiment
An antenna unit having a different structure from that of the first embodiment will be described below.

(2-1. Configuration of antenna unit)
FIG. 9A is a top view of the power transmission antenna unit 230-1 of the power transmission device 200. FIG. FIG. 9B is a perspective view of the power transmission antenna 233-1 of the power transmission antenna unit 230-1. As shown to FIG. 9 (A) and FIG. 9 (B), power transmission antenna part 230-1 has the board | substrate 245, the connection wiring 232, and the power transmission antenna 233-1. When a portion connecting one of the power transmission antenna 233-1 (the power transmission antenna 233-1 A) and the other one (the power transmission antenna 233-1 B) of the power transmission antenna 233-1 is the connection wiring 232, It may be combined with the power transmission antenna 231-1.

  As shown in FIG. 9B, the power transmission antenna 233-1 includes an upper wire 235, a lower wire 236 and a through wire 237. The upper wiring 235 and the lower wiring 236 are electrically connected via the through wiring 237.

  The substrate 245 may be provided inside the support portion 240 or may be provided as an alternative to the support portion 240. For the substrate 245, a high resistance material is used. For example, a glass epoxy resin substrate is used for the substrate 245. The substrate 245 is not limited to glass and epoxy resin, and a resin material such as acrylic resin and polyethylene terephthalate resin may be used, and a paper phenol resin substrate made by containing a phenol resin in a paper base and curing it May be used.

The substrate 245 is a quartz glass substrate, a soda glass substrate, a borosilicate glass substrate, an alkali-free glass substrate, a sapphire substrate, a silicon substrate, a silicon carbide substrate, an alumina (Al ₂ O ₃ ) substrate, an aluminum nitride (AlN) substrate, Inorganic materials such as zirconia (ZrO ₂ ) substrates may be used.

  The upper wire 235 is disposed on the upper surface 245 A of the substrate 245. The upper wiring 235 is made of a material with low resistance. For example, copper is used for the upper wiring 235.

  The upper wiring 235 is not limited to copper, and a material with low resistivity, such as aluminum, silver, or gold may be used. In addition, a conductor having magnetism such as iron, nickel, cobalt, or ferrite may be included. The magnetic conductor may be a single element or an alloy. In addition, the upper wiring 235 may contain boron in a magnetic conductor. Further, the upper wiring 235 is not limited to a magnetic material, and may be a shape memory alloy such as a titanium-nickel alloy or stainless steel.

  The lower wire 236 is disposed on the lower surface 245 B of the substrate 245. The lower wiring 236 is made of the same material as the upper wiring 235.

  The through wiring 237 is provided on the substrate 245. Copper is used for the through wiring 237. The through wiring 237 is not limited to copper, and a material containing gold, silver, copper, nickel or tin may be used.

  FIG. 10A is a top view of the power receiving antenna portion 130-1 of the power receiving device 100. FIG. 10B is a perspective view of the power receiving antenna portion 130-1. As shown in FIGS. 10A and 10B, the power receiving antenna portion 130-1 includes a substrate 145, a connection wiring 132, and a power receiving antenna 133-1. When a portion connecting one of the power receiving antenna 133-1 (the power receiving antenna 133-1A) and the other (the power receiving antenna 133-1B) of the power receiving antenna 133-1 is the connection wiring 132, 133-1 and 132 are It may be combined with the power receiving antenna 131-1. The power receiving antenna unit 130-1 has the same configuration as the power transmitting antenna unit 230-1. Of the power receiving antenna portion 130-1, the power receiving antenna 133-1 includes the upper wiring 135 on the upper surface 145A side, the through wiring 137 in the substrate 145, and the lower wiring 136 on the lower surface 145B side. The upper wiring 135 and the lower wiring 136 are connected via the through wiring 137.

(2-2. Manufacturing method of antenna unit)
Next, a method of manufacturing the power transmission antenna 233-1 of the power transmission antenna unit 230-1 will be described. The power receiving antenna 133-1 of the power receiving antenna unit 130-1 is also formed by the same method.

  First, as shown in FIG. 11, the through holes 247 are formed in the substrate 245.

  For the substrate 245, a high resistance material is used. For example, for the substrate 245, a resin material such as glass epoxy resin is used.

  The through holes 247 are formed on the substrate 245 by mechanical processing using a drill or the like. The diameter of the through hole 247 is appropriately set to 10 μm or more and 1000 μm or less.

  The through holes 247 may be formed by a laser irradiation method (which can be called a laser ablation method). As the laser, an excimer laser, a neodymium: Yag laser (Nd: YAG) or the like is used. For example, when using xenon chloride in an excimer laser, light with a wavelength of 308 nm is emitted. The through holes 247 may be formed by photolithography and etching when using a silicon substrate or a glass substrate.

  Next, as shown in FIG. 12, the through wiring 237 is formed in the through hole 247. Copper is used for the through wiring 237. The through wiring 237 may be formed by electrolytic plating or electroless plating. For example, when forming the through wiring 237 using copper, a copper thin film is formed by a sputtering method. Next, using a copper thin film as a seed layer, a copper film is formed by electrolytic plating. Lastly, the copper film formed on the upper surface 245A and the lower surface 245B of the substrate 245 is removed by copper on the upper surface 245A and the lower surface 245B of the substrate 245 by a chemical mechanical polishing (CMP) method. 237 is filled and formed.

  Next, as shown in FIG. 13, the connection wiring 232 and the upper wiring 235 are formed on the upper surface 245 A side of the substrate 245. Copper is used for the connection wiring 232 and the upper wiring 235. The connection wiring 232 and the upper wiring 235 are formed by plating, for example. When the connection wiring 232 and the upper wiring 235 are formed by plating, for example, the following method may be used. First, a copper thin film (seed layer) is formed by sputtering. Next, after a resist film is formed on the seed layer, the resist film is processed into a predetermined shape using a photolithography method or the like. Next, the connection wiring 232 and the upper wiring 235 are formed on the exposed seed layer. A copper film is formed on the connection wiring 232 and the upper wiring 235 by electrolytic plating. Finally, the resist film and the seed layer under the resist film are removed.

  The upper wiring 235 is not limited to the plating method, and may be formed by a printing method, sputtering, a CVD method, a coating method, or the like. At this time, the upper wiring 235 may be processed into a predetermined shape by a photolithography method and an etching method.

  Next, the lower wiring 236 is formed on the lower surface 245 B of the substrate 245. The lower interconnection 236 may be formed by the same material and method as the upper interconnection 235.

  The power transmission antenna unit 230-1 of the power transmission device 200 is manufactured by the above method. By using the above manufacturing method, it is possible to control the power transmission antenna 233-1 of the power transmission antenna unit 230 with the thickness of the substrate 245. At this time, the power transmission antenna unit 230 can be further reduced by reducing the thickness of the substrate 245. By reducing the size of the power transmission antenna unit 230, the power transmission device 200 can be miniaturized. The above method is also applied to the power receiving antenna unit 130 of the power receiving device 100. Therefore, the power receiving antenna unit 130 can be downsized, and the power receiving device 100 can also be downsized. Further, the shielding material may not be used in the present embodiment as well. Therefore, by using the above-described manufacturing method, the non-contact power feeding device can be manufactured small and inexpensive.

Third Embodiment
In this embodiment, a specific example of the non-contact power feeding device described in the first embodiment will be described.

  FIG. 14 to FIG. 17 illustrate the non-contact power feeding device. The non-contact power feeding device is used, for example, in various scenes such as medical instruments, industrial devices, automobiles, as well as precision electronic devices. FIG. 14A is a schematic view of the smartphone 1000. FIG. 14B is a schematic view of the notebook personal computer 2000. FIG. 15 is a schematic view of an ID (Identification) card 3000.

  FIG. 16 is a schematic view of a bioelectrical stimulation device 6000 embedded in a cochlear implant 4000, a cardiac pacemaker 5000, a muscle or the like among medical devices provided on the human body.

  FIG. 17A is a schematic view of an industrial robot. At this time, the power receiving device 100 is provided in the rotating unit 7100. FIG. 17B is a schematic view of a passenger car 8000.

  The embodiments described above as the embodiments of the present invention can be implemented in combination as appropriate as long as they do not contradict each other. In addition, those to which a person skilled in the art appropriately adds, deletes, or changes the design of components based on each embodiment are also included in the scope of the present invention as long as the gist of the present invention is included.

  In addition, even if other functions and effects different from the functions and effects provided by the above-described embodiments are apparent from the description of the present specification or those that can be easily predicted by those skilled in the art, it is natural. It is understood that the present invention provides.

(Modification 1)
In addition, although 1st Embodiment of this invention demonstrated the non-contact electric power supply which uses an electromagnetic induction system, it is not limited to this. For example, the present invention is also applied to a noncontact power feeding apparatus using electric field resonance, magnetic field resonance, and an evanescent wave other than the electromagnetic induction system.

  Moreover, in the first embodiment of the present invention, although the example in which all the power transmission antennas 233 are disposed outside the power transmission antenna 231 is shown, the present invention is not limited to this. The power transmission antenna 233 may be provided on the inside and the outside of the power transmission antenna 231, respectively. Further, the power transmission antenna 233 provided inside the power transmission antenna 231 and the power transmission antenna 233 provided outside may have the same size or different sizes. Thereby, the magnetic force of the antenna unit can be controlled.

  In addition, all the power transmission antennas 233 may be provided inside the power transmission antenna 231. Thereby, the area of the power transmission antenna unit 230 can be reduced while obtaining the effects of the present invention.

  Moreover, according to the convenience of preparation of the power transmission antenna part 230, the power transmission antenna 231 and the power transmission antenna 233 may have a rectangular shape.

  In the second embodiment of the present invention, an example is shown in which the power transmission antenna 233-1 is manufactured using the through wiring 237 provided in the substrate 245, but the present invention is not limited to this. FIG. 18A is a top view of the power transmission antenna unit 230-2, and FIG. 18B is a cross-sectional view between B1 and B2. As shown in FIG. 18B, the power transmission antenna 233-2 includes an upper wiring 235-1, an upper wiring 235-2, an upper wiring 235-3, an upper wiring 235-4, and an upper wiring 235-5 on the substrate 245. Upper wiring 235-6, upper wiring 235-7, insulating layer 247-1, insulating layer 247-2, insulating layer 247-3, insulating layer 247-4, insulating layer 247-5, and insulating layer 247-6. Including. The same material as the upper wiring 235 is used for the upper wiring 235-1 to the upper wiring 235-7. The upper wiring 235-1 to the upper wiring 235-7 are each connected by a through wiring. For the insulating layers 247-1 to 247-6, an organic material such as an acrylic resin, an epoxy resin, or a polyimide resin, or an inorganic material such as silicon oxide or silicon nitride is used. Note that although the upper wiring 235-1 to the upper wiring 235-6 are arranged on the same straight line when viewed from the top in FIG. 18A, the positions may be changed as appropriate.

  In the first embodiment of the present invention, the example in which the power receiving antenna unit 130 includes the power receiving antenna 133 is shown, but the present invention is not limited to this. In the present invention, even if the power receiving antenna 133 is not necessarily provided, the shielding material can be reduced.

DESCRIPTION OF SYMBOLS 10 ... Non-contact electric power supply apparatus 50: Conventional non-contact electric power supply apparatus 100 ... Power receiving apparatus 110 ... Electrical storage part 111 ... Voltage limit circuit 113: Rectification circuit 119 ... control unit, 121 ... storage unit, 123 ... resistance, 125 ... load unit, 130 ... power receiving antenna unit, 131 ... power receiving antenna, 131 S ... plane, 132 · · ·・ Connection wiring, 133: power receiving antenna, 135: upper wiring, 136: lower wiring, 137: penetrating wiring, 140: supporting portion, 145: substrate, 200: power transmission Device, 205: power supply unit, 210: control unit, 213: storage unit, 220: oscillation circuit, 225: transmission circuit, 230: power transmission antenna unit, 231: power transmission Antenna, 232 ... connection wiring, 233 · · Power transmission antenna, 235 · · · upper wiring, 236 · · · lower wiring, 237 · · · through wiring, 240 · · · support portion, 245 · · · substrate, 247 · · · · · · · · · · · · smartphone , 2000 ... notebook type personal computer, 3000 ... ID card, 4000 ... cochlear implant, 5000 ... cardiac pacemaker, 6000 ... bioelectric stimulation device, 7100 ... rotating part, 8000 ...・ Car

Claims (10)

A power supply unit, a first power transmitting antenna arranged in a loop, and a plurality of second power transmitting antennas electrically connected to the first power transmitting antenna and provided around the first power transmitting antenna; A power transmission device including a power transmission antenna unit connected to the power supply unit;
A power receiving device including a power storage unit, and a first power receiving antenna arranged in a loop and including a power receiving antenna unit connected to the power storage unit;
Including
The second power transmitting antenna is disposed orthogonal to the first power transmitting antenna,
The power transmitting antenna unit and the power receiving antenna unit are disposed in parallel.
Contactless power supply device. The power receiving antenna unit is electrically connected to the first power receiving antenna, and includes a plurality of second power receiving antennas provided around the first power receiving antenna.
The second power receiving antenna is disposed orthogonal to the first power receiving antenna.
The contactless power supply device according to claim 1. The size of the second power transmitting antenna is smaller than that of the first power transmitting antenna,
The size of the second power receiving antenna is smaller than that of the first power receiving antenna,
The contactless power supply device according to claim 2. The number of turns of the second power transmitting antenna is greater than the number of turns of the first power transmitting antenna,
The number of turns of the second power receiving antenna is larger than the number of turns of the first power receiving antenna,
The non-contact electric power supply according to claim 2 or 3. The power transmission device has a first surface and a second surface opposite to the first surface in a cross sectional view,
The power receiving device has a third surface facing the first surface and a fourth surface opposite to the third surface in a cross sectional view,
The magnetic force on the first surface side of the power transmission antenna unit is different from the magnetic force on the second surface side,
The magnetic force on the third surface side of the power receiving antenna unit is different from the magnetic force on the fourth surface side,
The non-contact electric power supply as described in any one of Claims 2-4. The magnetic force on the first surface side is stronger than the magnetic force on the second surface side,
The non-contact power feeding device according to claim 5. The power transmission antenna unit further includes a first substrate,
The second power transmission antenna includes a first upper wiring on the first surface side, a first through wiring in the first substrate, and a first lower wiring on the second surface,
The first upper wiring and the first lower wiring are connected via the first through wiring,
The power receiving antenna unit further includes a second substrate,
The second power receiving antenna includes a second upper wiring on the third surface side, a second through wiring in the second substrate, and a second lower wiring on the fourth surface side.
The second upper wiring and the second lower wiring are connected via the second through wiring.
The non-contact electric power supply as described in any one of Claims 2 thru | or 6. The first power transmitting antenna includes a first connection wire connecting each of the second power transmitting antenna and the second power transmitting antenna.
The first power receiving antenna includes a second connection wire connecting each of the second power receiving antenna and the second power receiving antenna.
The non-contact power feeding device according to claim 7. At least one of the first substrate and the second substrate includes a resin material.
The non-contact electric power supply according to claim 7 or 8.   The non-contact power feeding device according to any one of claims 7 to 9, wherein at least one of the first through wiring and the second through wiring includes copper.

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