JP2016134543A - Semiconductor module, semiconductor device, and electro-optic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a semiconductor module capable of increasing reliability, a semiconductor device, and an electro-optic device.SOLUTION: There is provided a semiconductor module 200 in which a plurality of external connection terminals 202 are arranged in a plurality of columns. External connection terminals 202 connected to the same power source line among the external connection terminals 202 are arranged in an outer peripheral column of the semiconductor module 200 among the plurality of columns.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a semiconductor module, a semiconductor device, and an electro-optical device.

  As an example of a device including the semiconductor device, a liquid crystal device having a structure in which a liquid crystal layer is sandwiched between an element substrate and a counter substrate over a substrate can be given. The liquid crystal device is used for a light valve of a projector, for example.

  As what constitutes a semiconductor device, for example, as disclosed in Patent Document 1, a device having a package in which mounting terminals are arranged in a matrix is known. Such a semiconductor device in which multi-row terminals are arranged includes, for example, a semiconductor module such as BGA (Ball Grid Array) and HMT (Hybrid Manufacturing Technologies Package) (registered trademark), and a plurality of semiconductor modules mounted thereon. A circuit board formed by stacking a plurality of substrates.

  This stacked circuit board uses a through via (through-hole via) that penetrates the circuit board on the inner peripheral side of the multi-row terminals to reduce the cost. It is electrically connected to a layer (GND layer) or the like.

Japanese Patent Laid-Open No. 8-250641

  However, since many through holes are formed inside the multi-row terminals on the circuit board, there is a problem that the resistance between the semiconductor module and the circuit board increases and the operation of the semiconductor device becomes unstable. . Further, when the resistance increases, heat is easily generated, and when the allowable heat amount of the semiconductor module is exceeded, there is a problem that the semiconductor module may be broken. Furthermore, there is a problem that the heat dissipation effect using the connected power supply line as a route is reduced.

  In addition, for example, such a semiconductor device may be provided for each color (R, G, B) in the projector, but as the size is reduced, the semiconductor device is often driven by one semiconductor device. It is coming. Therefore, the number of terminals arranged in a multi-row is increased, and there is a problem that the wiring pattern connected to the power supply line of the circuit board cannot be electrically connected to the outside by avoiding these many through holes and terminals. .

  An aspect of the present invention has been made to solve at least a part of the above problems, and can be realized as the following forms or application examples.

  Application Example 1 A semiconductor module according to this application example is a semiconductor module in which a plurality of terminals are arranged in a plurality of rows, and a terminal connected to the same power supply line among the plurality of terminals is the plurality of rows. Of these, the semiconductor modules are arranged at least in a row on the outer peripheral side of the semiconductor module.

  According to this application example, since the terminals connected to the same power supply line (including GND) are arranged in the outer row of the semiconductor module, for example, the same formed on the circuit board on which the semiconductor module is placed It can be easily connected electrically to the wiring pattern connected to the power supply line. In other words, the wiring connected to the same power supply line can be easily drawn outside the semiconductor module. Further, even when the number of terminals of the semiconductor module increases, the power supply line can be easily drawn out of the semiconductor module. In addition, since it can be reliably connected to the same power line, the heat radiation effect using the power line as a route can be enhanced.

  Application Example 2 In the semiconductor module according to the application example described above, it is preferable that the terminals connected to the same power supply line are arranged side by side continuously from the inside to the outside of the semiconductor module.

  According to this application example, the terminals connected to the same power supply line (including GND) are arranged adjacent (continuously) from the inside to the outside of the semiconductor module, so that the power supply line of the semiconductor module can be easily arranged. It can be pulled out of the semiconductor module. Further, since the terminals connected to the power supply line are continuously arranged, for example, it is not necessary to form a through hole in the circuit board on which the semiconductor module is placed, and the electrical resistance between the semiconductor module and the circuit board is reduced. It becomes possible. Therefore, it is possible to prevent the operation of the semiconductor module from becoming unstable due to the electrical resistance. Furthermore, it is possible to prevent the semiconductor module from being destroyed due to being heated by electric resistance.

  Application Example 3 In the semiconductor module according to the application example, the plurality of terminals include a digital signal terminal to which a digital signal is supplied and an analog signal terminal to which an analog signal is supplied, and the same power line It is preferable that the terminal connected to is disposed between the first region where the digital signal terminal is disposed and the second region where the analog signal terminal is disposed.

  According to this application example, since the terminal connected to the power supply line (including GND) is arranged between the first region where the digital signal terminals gather and the second region where the analog signal terminals gather, the potential at the boundary is stabilized. It is possible to suppress the generation of noise. In particular, it is possible to suppress the occurrence of noise at an analog signal terminal that is vulnerable to noise.

  Application Example 4 In the semiconductor module according to the application example described above, it is preferable that the terminals connected to the same power supply line are arranged in a shortest path.

  According to this application example, since they are arranged so as to be the shortest path, it is possible to reduce the electrical resistance as compared with the method of arranging them so as to be routed for a long time. Therefore, it is possible to prevent the operation of the semiconductor module from becoming unstable due to the electrical resistance. Furthermore, it is possible to prevent the semiconductor module from being destroyed due to being heated by electric resistance.

  Application Example 5 A semiconductor device according to this application example includes the semiconductor module and a circuit board electrically connected to the plurality of terminals of the semiconductor module.

  According to this application example, since the semiconductor module and the circuit board are included, the terminal connected to the power supply line of the semiconductor module and the same power supply line formed on the circuit board are connected without forming a through hole in the circuit board. For example, the wiring pattern can be electrically connected. Therefore, the electrical resistance between the semiconductor module and the circuit board can be reduced by forming the through hole in the circuit board. Thereby, it can suppress that operation | movement of a semiconductor module becomes unstable resulting from an electrical resistance. Furthermore, it is possible to prevent the semiconductor module from being destroyed due to being heated by electric resistance.

  Application Example 6 An electro-optical device according to this application example includes the semiconductor device.

  According to this application example, since the semiconductor device is provided, a highly reliable electro-optical device can be provided.

1 is a schematic perspective view illustrating a configuration of a semiconductor device. The schematic perspective view which shows the structure of the semiconductor module which comprises a semiconductor device. (A) is the schematic plan view which looked at the semiconductor module shown in FIG. 2 from the upper part, (b) is a schematic sectional drawing in alignment with the A-A 'line | wire of the semiconductor module of (a). It is a schematic diagram which shows the structure of the circuit board which comprises a semiconductor device, (a) is the schematic plan view which looked at the circuit board from the upper direction, (b) is the model which follows the BB 'line | wire of the circuit board shown to (a). Sectional drawing. It is a schematic diagram which shows the specific example of a structure of a circuit board, (a) is a schematic cross section which shows the structure of a circuit board, (b)-(e) is a schematic plan view which decomposes | disassembles and shows the board | substrate of each layer. It is the schematic which shows the specific example of the structure of the semiconductor device of 1st Embodiment, (a) is the schematic plan view which looked at the structure of the semiconductor device from upper direction, (b) is C- of the semiconductor device shown to (a). The schematic sectional drawing which follows C 'line. The schematic plan view which shows the specific example of the structure of a semiconductor module. The schematic plan view which shows the specific example of the structure of a circuit board. FIG. 2 is a schematic diagram illustrating a configuration of a projector as an electro-optical device. It is a schematic diagram which shows the specific example of the structure of the semiconductor device of 2nd Embodiment, (a) is a schematic plan view which shows the structure of the semiconductor module which comprises a semiconductor device, (b) is the circuit board which comprises a semiconductor device. The schematic plan view which shows a structure. The schematic plan view which shows the structure of the modification of a semiconductor device.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized.

  In the following embodiments, for example, when “on the substrate” is described, the substrate is disposed so as to be in contact with the substrate, or is disposed on the substrate via another component, or the substrate. It is assumed that a part is arranged so as to be in contact with each other and a part is arranged via another component.

(First embodiment)
<Basic configuration of semiconductor device>
FIG. 1 is a schematic perspective view showing a configuration of a semiconductor device. Hereinafter, the configuration of the semiconductor device will be described with reference to FIG. FIG. 1 illustrates an internal structure of a part of a semiconductor module constituting the semiconductor device.

  As shown in FIG. 1, the semiconductor device 100 includes a semiconductor module 200 and a circuit board 300 that is electrically connected to the semiconductor module 200.

  A semiconductor element 201 is disposed inside the semiconductor module 200. A plurality of external connection terminals 202 are arranged in an array around the semiconductor element 201.

  The circuit board 300 is provided with a placement portion 301 on which the semiconductor module 200 is placed. In the circuit board 300, a plurality of wirings 302 extend from the area of the placement portion 301 to the periphery. That is, a signal processed by the semiconductor element 201 constituting the semiconductor module 200 can be transmitted to and received from an external device via the circuit board 300.

<Basic configuration of semiconductor module>
FIG. 2 is a schematic perspective view showing a configuration of a semiconductor module constituting the semiconductor device. FIG. 3A is a schematic plan view of the semiconductor module shown in FIG. 2 as viewed from above, and FIG. 3B is a schematic cross-sectional view taken along the line AA ′ of the semiconductor module in FIG. Hereinafter, the configuration of the semiconductor module will be described with reference to FIGS. Note that, as described above, the semiconductor module shown in FIG. 2 partially illustrates the internal structure.

  As shown in FIGS. 2 and 3, the semiconductor module 200 includes a semiconductor element 201, a heat dissipating plate 203 disposed on the lower surface side of the semiconductor element 201, and a plurality of lines disposed in a multi-row around the heat dissipating plate 203. The external connection terminal 202, the semiconductor element 201, the heat sink 203, and the sealing resin 204 arrange | positioned so that a part of several external connection terminal 202 may be provided. The semiconductor element 201 and the external connection terminal 202 are electrically connected via a bonding wire 205.

  The heat radiating plate 203 has a large area in order to dissipate the heat accumulated in the semiconductor element 201. Moreover, the heat sink 203 is connected to the entire surface GND.

<Basic configuration of circuit board>
4A and 4B are schematic views showing the configuration of a circuit board constituting the semiconductor device, wherein FIG. 4A is a schematic plan view of the circuit board as viewed from above, and FIG. 4B is a B- It is a schematic cross section along a B 'line. FIG. 5 is a schematic diagram showing a method of connecting wirings on a circuit board, (a) is a schematic cross-sectional view showing the structure of the circuit board, and (b) to (e) are exploded views of the substrates of each layer. It is a schematic plan view. Hereinafter, the configuration of the circuit board will be described with reference to FIGS.

  As shown in FIG. 4A, the circuit board 300 includes a mounting portion 301 that is a portion electrically connected to the semiconductor module 200 described above, an external connection pad 303 formed on the mounting portion 301, and Wiring 302 formed extending from the external connection pad 303 to each region of the circuit board 300.

  On the mounting portion 301, a heat radiating pad 304 that contacts the heat radiating plate 203 of the semiconductor module 200 is formed. As described above, the heat dissipation plate 203 and the heat dissipation pad 304 are in contact with each other over a wide area (the ratio of the planar area of the radiator plate 203 to the planar area of the semiconductor module is large). The heat accumulated in 201 can be dissipated.

  In addition, on the mounting portion 301, external connection pads 303 that are electrically connected to the external connection terminals 202 of the semiconductor module 200 are formed corresponding to the arrangement positions of the external connection terminals 202.

  Further, as shown in FIG. 4B, the circuit board 300 is configured by stacking four substrates (311, 312, 313, 314). Specifically, the circuit board 300 includes a first substrate 311, a second substrate 312, a third substrate 313, and a lowermost fourth substrate 314 that are stacked from the upper layer (semiconductor module 200 side).

  As described above, the first substrate 311 is a substrate on which the semiconductor module 200 is placed. The second substrate 312 to the fourth substrate 314 are used for making a detour connection via a contact hole or wiring, for example, when the wiring cannot be connected by the first substrate 311.

  For example, in the cross-sectional view shown in FIG. 4B, through holes (contact holes 331 and 332) are provided in the lower layer (first substrate 311 to fourth substrate 314) of the external connection pad 303a close to the heat dissipation pad 304, and the fourth An example in which the wiring is electrically connected to the wiring on the back surface side 314a of the substrate 314 is shown.

  Here, as shown in FIG. 5B, in the uppermost first substrate 311, a method of electrically connecting the second wiring 322 to the third wiring 323 separated from each other by the first wiring 321, This will be described with reference to FIG.

  As shown in FIG. 5A, the circuit board 300 is configured by stacking four boards (311 to 314). FIG. 5B is a schematic plan view showing the configuration of the uppermost first substrate 311. FIG. 5C is a schematic plan view showing the configuration of the second substrate 312 in the second layer. FIG. 5D is a schematic plan view showing the configuration of the third substrate 313 in the third layer. FIG. 5E is a schematic plan view showing the configuration of the fourth substrate 314 in the fourth layer, which is the lowest layer. Note that a power supply / GND layer 340 connected to a power supply line (GND) is formed on the third substrate 313.

  When through holes such as contact holes 331 and 332 are formed in the power supply / GND layer 340, impedance (resistance) increases. When the resistance of the power supply / GND layer 340 connected to the same power supply line is increased, the resistance as a path for releasing heat is also increased, and it is difficult to dissipate heat. In the present embodiment, it is assumed that GND is also included in the power supply line.

  As shown in FIG. 5A, the second wiring 322 formed on the first substrate 311 is electrically connected to the first contact hole 331 that penetrates the first substrate 311 to the fourth substrate 314. For example, the first contact hole 331 is formed to penetrate from the first substrate 311 to the fourth substrate 314 in order to reduce the cost.

  On the other hand, the third wiring 323 is electrically connected to the second contact hole 332 that penetrates the first substrate 311 to the fourth substrate 314. The first contact hole 331 and the second contact hole 332 are electrically connected by a fourth wiring 324 formed in the second substrate 312.

  Thus, even when the first wiring 321 connected to the different power supply line is formed between the second wiring 322 and the third wiring 323, the second wiring 322 and the third wiring 323 are electrically connected. Can be connected.

  By forming the first contact hole 331 and the second contact hole 332, through holes 331a and 332a are formed in the third substrate 313 on which the power supply / GND layer 340 is formed. As a result, the resistance of the power supply / GND layer 340 is increased. Thus, providing the through hole may affect the semiconductor device 100.

<Specific Example of Configuration of Semiconductor Device of First Embodiment>
6A and 6B are schematic views illustrating a specific example of the configuration of the semiconductor device, in which FIG. 6A is a schematic plan view of the configuration of the semiconductor device viewed from above, and FIG. 6B is a CC view of the semiconductor device illustrated in FIG. It is a schematic sectional drawing in alignment with a line. FIG. 7 is a schematic plan view showing a specific example of the structure of the semiconductor module constituting the semiconductor device. FIG. 8 is a schematic plan view showing a specific example of the structure of the circuit board constituting the semiconductor device. Hereinafter, the configuration of the semiconductor device will be described with reference to FIGS.

  As illustrated in FIG. 6, the semiconductor device 100 includes the semiconductor module 200 and the circuit board 300 that is electrically connected to the semiconductor module 200 as described above.

  As shown in FIG. 6A and FIG. 7, among the external connection terminals 202 constituting the semiconductor module 200, the external connection terminals 202 that are electrically connected to the same power supply line (GND) are close to the heat dissipation plate 203. In order from the side toward the outside, the external connection terminal 202x, the external connection terminal 202y, and the external connection terminal 202z are arranged adjacent to each other.

  Furthermore, the external connection terminals 202x, 202y, 202z connected to the same power supply line are arranged so as to be drawn out in the shortest distance from the heat sink 203 side toward the outside. In the present embodiment, three parts of the semiconductor module 200 are electrically connected to different power supply lines.

  On the other hand, as shown in FIGS. 6A and 8, the circuit board 300 is drawn out of the mounting portion 301 from a part of the external connection pad 303 in the mounting portion 301 on which the semiconductor module 200 is disposed. A first power supply wiring 351 is formed.

  The circuit board 300 includes, for example, a second power supply line 352 connected to a second power supply line different from the first power supply line, a first power supply line, and a third power supply line connected to a third power supply line different from the second power supply line. Three power supply wirings 353 are formed.

  When the semiconductor module 200 thus formed and the circuit board 300 are bonded together, as shown in FIG. 6, for example, the first power supply wiring 351 formed on the circuit board 300 and the external connection provided on the semiconductor module 200, for example. The terminals 202x, 202y, and 202z can be connected at the shortest distance.

  The first power supply wiring 351 is provided with external connection pads 303 corresponding to the arrangement of the external connection terminals 202x, 202y, 202z of the semiconductor module.

  Furthermore, since the external connection terminals 202x, 202y, and 202z are continuously arranged adjacent to each other so as to go outward from the heat dissipation plate 203 side, the power supply / GND layer formed on the third substrate 313 of the circuit board 300 Each power supply wiring 351, 352, 353 can be electrically connected without making a hole in 340 (see FIG. 5D). Therefore, the resistance of the power supply / GND layer 340 can be reduced, and as a result, heating of the semiconductor module 200 can be suppressed.

  Of the plurality of external connection terminals 202, an external connection terminal 202 (digital signal terminal) area (D) to which a digital signal is supplied and an external connection terminal 202 (analog signal terminal) area (to which an analog signal is supplied) ( It is preferable that external connection terminals 202x, 202y, and 202z that are connected to the same power line are disposed between A) and A).

  According to this, it is possible to stabilize the potential at the boundary between the region (first region) to which the digital signal is supplied and the region (second region) to which the analog signal is supplied, and noise is generated. Can be suppressed. In particular, it is possible to suppress the occurrence of noise in a region where an analog signal weak against noise is supplied.

<Configuration of projector as electro-optical device>
FIG. 9 is a schematic diagram illustrating a configuration of a projector as an electro-optical device. Hereinafter, the configuration of the projector will be described with reference to FIG.

  As shown in FIG. 9, the projector 1001 according to the present embodiment includes a polarization illumination device 1100 arranged along the system optical axis L, two dichroic mirrors 1104 and 1105 as light separation elements, and three reflection mirrors 1106. , 1107, 1108, five relay lenses 1201, 1202, 1203, 1204, 1205, three transmissive liquid crystal light valves 1210, 1220, 1230 as light modulating means, and a cross dichroic prism 1206 as a light combining element. A projection lens 1207.

  The polarized light illumination device 1100 is generally configured by a lamp unit 1101 as a light source composed of a white light source such as an ultra-high pressure mercury lamp or a halogen lamp, an integrator lens 1102, and a polarization conversion element 1103.

  The dichroic mirror 1104 reflects red light (R) and transmits green light (G) and blue light (B) among the polarized light beams emitted from the polarization illumination device 1100. Another dichroic mirror 1105 reflects the green light (G) transmitted through the dichroic mirror 1104 and transmits the blue light (B).

  The red light (R) reflected by the dichroic mirror 1104 is reflected by the reflection mirror 1106 and then enters the liquid crystal light valve 1210 via the relay lens 1205. Green light (G) reflected by the dichroic mirror 1105 enters the liquid crystal light valve 1220 via the relay lens 1204. The blue light (B) transmitted through the dichroic mirror 1105 enters the liquid crystal light valve 1230 via a light guide system including three relay lenses 1201, 1202, 1203 and two reflection mirrors 1107, 1108.

  The liquid crystal light valves 1210, 1220, and 1230 are disposed to face the incident surfaces of the cross dichroic prism 1206 for each color light. The color light incident on the liquid crystal light valves 1210, 1220, and 1230 is modulated based on video information (video signal) and emitted toward the cross dichroic prism 1206.

  In this prism, four right-angle prisms are bonded together, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are formed in a cross shape on the inner surface thereof. The three color lights are synthesized by these dielectric multilayer films, and the light representing the color image is synthesized. The synthesized light is projected onto the screen 1300 by the projection lens 1207, which is a projection optical system, and the image is enlarged and displayed.

  As the liquid crystal light valve 1210, for example, a liquid crystal device including a liquid crystal panel is applied. The liquid crystal device is arranged with a gap between a pair of polarizing elements arranged in crossed Nicols on the incident side and the emission side of colored light. The same applies to the other liquid crystal light valves 1220 and 1230.

  The semiconductor device 100 is disposed in the vicinity of the liquid crystal device in order to transmit and receive signals between the external device and the liquid crystal device. In addition, the semiconductor device 100 according to the present embodiment is not provided in each of the R, G, and B liquid crystal devices, and the single semiconductor device 100 transmits and receives signals processed with the respective liquid crystal devices. It is carried out.

  According to such a projector 1001, since the semiconductor device 100 is provided, a highly reliable projector 1001 can be provided.

  The electro-optical device on which the semiconductor device 100 is mounted includes a projector 1001, a head-up display (HUD), a head-mounted display (HMD), a smartphone, an EVF (Electrical View Finder), a mobile mini projector, an electronic book, It can be used for various electronic devices such as mobile phones, mobile computers, digital cameras, digital video cameras, displays, in-vehicle devices, audio devices, exposure apparatuses and lighting devices.

  As described above in detail, according to the semiconductor module 200, the semiconductor device 100, and the projector 1001 of the first embodiment, the following effects can be obtained.

  (1) According to the semiconductor module 200 of the first embodiment, the external connection terminals 202x, 202y, and 202z connected to the same power supply line (including GND) are adjacent to each other so as to go from the inside to the outside of the semiconductor module 200 (continuous). Therefore, the power supply line of the semiconductor module 200 can be easily pulled out of the semiconductor module 200. In addition, since the terminals connected to the power supply line are continuously arranged, for example, there is no need to form a through hole in the circuit board 300 on which the semiconductor module 200 is placed, and the electrical connection between the semiconductor module 200 and the circuit board 300 is achieved. The resistance can be reduced. Therefore, it is possible to suppress the operation of the semiconductor module 200 from becoming unstable due to the electrical resistance. Furthermore, it is possible to prevent the semiconductor module 200 from being destroyed due to being heated by electric resistance.

  (2) According to the semiconductor module 200 of the first embodiment, since the external connection terminals 202x, 202y, and 202z are arranged so as to be the shortest path, the electrical resistance is reduced as compared with the method of arranging them so as to be extended for a long time. Can be small. Therefore, it is possible to prevent the operation of the semiconductor module from becoming unstable due to the electrical resistance. Furthermore, it is possible to prevent the semiconductor module from being destroyed due to being heated by electric resistance.

  (3) According to the semiconductor module 200 of the first embodiment, the external connection terminals 202x, 202y connected to the power supply line (including GND) between the area where the digital signal terminals gather and the area where the analog signal terminals gather. Since 202z is disposed, the boundary potential can be stabilized, and noise can be suppressed. In particular, it is possible to suppress the generation of noise at the external connection terminal 202 of an analog signal that is vulnerable to noise.

  (4) According to the semiconductor device 100 of the first embodiment, since the semiconductor module and the circuit board are included, the terminal connected to the power supply line of the semiconductor module and the circuit board are formed without forming a through hole in the circuit board. For example, power supply wirings 351, 352, and 353 connected to the formed power supply line can be electrically connected. Therefore, the electrical resistance between the semiconductor module and the circuit board can be reduced by forming the through hole in the circuit board. Thereby, it can suppress that operation | movement of a semiconductor module becomes unstable resulting from an electrical resistance. Furthermore, it is possible to prevent the semiconductor module from being destroyed due to being heated by electric resistance.

  (5) According to the projector 1001 of the first embodiment, since the semiconductor device 100 is provided, the projector 1001 with high reliability can be provided.

(Second Embodiment)
<Specific Example of Semiconductor Device Structure>
FIG. 10 is a schematic diagram illustrating a specific example of the structure of the semiconductor device according to the second embodiment. FIG. 10A is a schematic plan view illustrating the structure of a semiconductor module constituting the semiconductor device. FIG. 10B illustrates the semiconductor device. It is a schematic plan view which shows the structure of the circuit board to perform. Hereinafter, the structure of the semiconductor device will be described with reference to FIG.

  In the semiconductor device 500 of the second embodiment, the arrangement positions of the external connection terminals 602a, 602b, and 602c connected to the power supply line are part of the outer periphery of the semiconductor module 600, as compared with the semiconductor device 100 of the first embodiment described above. The arranged parts are different, and the other parts are generally the same. Therefore, in the second embodiment, portions different from the first embodiment will be described in detail, and descriptions of other overlapping portions will be omitted as appropriate.

  As shown in FIG. 10, in the semiconductor module 600, the external connection terminals 602a, 602b, and 602c in the outer peripheral portion of the external connection terminals 602 are terminals connected to the power supply line.

  In the present embodiment, for example, three of the four corners of the semiconductor module 600 are external connection terminals 602a, 602b, and 602c that are connected to the power supply line. Note that the present invention is not limited to setting the external connection terminals 602a, 602b, and 602c connected to the power supply lines at the four corners, and a portion close to each side 811 of the semiconductor module is connected to the power supply line as in the semiconductor device 800 illustrated in FIG. The external connection terminal 812 may be used.

  As described above in detail, according to the semiconductor module 600 and the semiconductor device 500 of the second embodiment, the following effects can be obtained.

  (6) According to the semiconductor module 600 and the semiconductor device 500 of the second embodiment, the external connection terminals 602a, 602b, and 602c connected to each power line (including GND) are on the outside (outer peripheral portion) of the semiconductor module 600. Since they are arranged in a row, for example, it is possible to facilitate electrical connection to power supply wirings 351, 352, and 353 connected to the power supply line formed on the circuit board 700 on which the semiconductor module 600 is placed. In other words, the power supply line can be easily pulled out of the semiconductor module 600. Further, even when the number of terminals of the semiconductor module 600 is increased, the power supply line can be easily drawn out of the semiconductor module 600. In addition, since it can be connected to the power supply line, the heat dissipation effect through the power supply line as a route can be enhanced. Further, even when there is a through hole on the center side of the external connection pad of the circuit board 700, the power supply line can be drawn outside without being affected by the through hole.

  The aspect of the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification. It is included in the range. Moreover, it can also implement with the following forms.

(Modification 1)
As in the first embodiment described above, the external connection terminals 202x, 202y, and 202z that are connected to the power supply line toward the corner of the semiconductor module 200 are not limited to being arranged, and may be drawn out in the shortest distance without detouring. The external connection terminals 202 may be continuously arranged toward the outer peripheral side of the semiconductor module 200.

(Modification 2)
As in the second embodiment described above, the external connection terminal 602 connected to the power supply line is not limited to being arranged in the outermost row, and for example, the external connection terminal 602 connected to the power supply line in the second row from the outer periphery side. May be arranged.

(Modification 3)
As described above, the number of substrates constituting the circuit board 300 is not limited to four (the first substrate 311 to the fourth substrate 314), and may be less than four or more than four. It may be the number of sheets.

  DESCRIPTION OF SYMBOLS 100 ... Semiconductor device, 200 ... Semiconductor module, 201 ... Semiconductor element, 202 ... External connection terminal, 202x, 202y, 202z ... External connection terminal, 203 ... Heat sink, 204 ... Sealing resin, 205 ... Bonding wire, 300 ... Circuit Substrate, 301... Mounting portion, 302 .. wiring, 303, 303 a .. external connection pad, 304 .. heat radiation pad, 311... First substrate, 312 ... second substrate, 313 ... third substrate, 314 ... fourth substrate, 314 a ... back side, 321 ... first wiring, 322 ... second wiring, 323 ... third wiring, 324 ... fourth wiring, 331 ... first contact hole, 331a ... through hole, 332 ... second contact hole, 340 ... power supply / GND layer, 351 ... first power supply wiring, 352 ... second power supply wiring, 353 ... third power supply wiring, 500 ... semiconductor device, 600 ... semiconductor module 602, 602a ... external connection terminal, 700 ... circuit board, 800 ... semiconductor device, 811 ... each side of the semiconductor module, 812 ... external connection terminal, 1001 ... projector, 1100 ... polarized illumination device, 1101 ... lamp unit, 1102 ... integrator lens, 1103 ... polarization conversion element, 1104, 1105 ... dichroic mirror, 1106, 1107, 1108 ... reflection mirror, 1201, 1202, 1203, 1204, 1205 ... relay lens, 1206 ... cross dichroic prism, 1207 ... projection lens, 1210, 1220, 1230 ... Liquid crystal light valve, 1300 ... Screen.

Claims (6)

A semiconductor module in which a plurality of terminals are arranged in a plurality of rows,
A terminal connected to the same power line among the plurality of terminals is arranged in at least a column on the outer peripheral side of the semiconductor module among the plurality of columns. The semiconductor module according to claim 1,
Terminals connected to the same power supply line are arranged in a row continuously from the inside to the outside of the semiconductor module. The semiconductor module according to claim 2,
The plurality of terminals include a digital signal terminal to which a digital signal is supplied and an analog signal terminal to which an analog signal is supplied,
A terminal connected to the same power supply line is disposed between a first region where the digital signal terminal is disposed and a second region where the analog signal terminal is disposed. The semiconductor module according to claim 2 or 3, wherein
The semiconductor module, wherein the terminals connected to the same power line are arranged in a shortest path. A semiconductor module according to any one of claims 1 to 4,
A circuit board electrically connected to the plurality of terminals of the semiconductor module;
A semiconductor device comprising:   An electro-optical device comprising the semiconductor device according to claim 5.

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