JP2015174103A - laser processing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser processing method capable of removing burrs produced on the surrounding of an opening part of a groove on an outer surface of a workpiece and capable of providing a product which is excellent in appearance quality and has high processing accuracy.SOLUTION: A laser processing method includes: a groove processing process for forming a groove 38 of a predetermined depth by irradiating a workpiece W with a laser beam for groove processing; and a trimming process for processing burrs 34 by irradiating the burrs 34 produced on the surrounding of an opening part of the groove 38 on an external surface of the workpiece W during the groove processing process with the laser beam for the trimming. The energy amount per unit area of the laser beam for trimming with which the burrs 34 is irradiated is less than the energy amount per unit area of a lase beam for groove processing with which the workpiece W is irradiated.

Description

  The present invention relates to a laser processing method for forming a groove having a predetermined depth by irradiating a workpiece with a laser beam for groove processing.

  For example, Patent Document 1 described below describes a laser processing method in which a workpiece is scanned with laser light to form a groove having a predetermined depth.

Japanese Patent Laid-Open No. 2000-288752

  However, when a groove is formed in the workpiece by laser light, burrs (residues) may be generated around the groove opening on the outer surface of the workpiece. Such burrs may deteriorate the appearance quality of the product and may not satisfy the processing accuracy required for the workpiece. In addition, when a burr | flash is processed with the laser beam for groove processing, a groove | channel width (groove length) will become large and a new burr | flash may generate | occur | produce.

  The present invention has been made in consideration of such a problem, and can remove burrs generated around the opening of the groove on the outer surface of the workpiece, and has excellent appearance quality and high processing accuracy. An object is to provide a laser processing method capable of obtaining a product.

  The laser processing method according to the present invention includes a groove processing step of irradiating a workpiece with laser light for groove processing to form a groove having a predetermined depth, and an opening of the groove on the outer surface of the workpiece during the groove processing step. The trim processing step of processing the burrs by irradiating the burrs generated around the burrs, and the amount of energy per unit area of the trim processing laser beams irradiated to the burrs is: It is smaller than the energy amount per unit area of the laser beam for groove processing irradiated to the workpiece.

  According to the laser processing method of the present invention, the energy amount per unit area of the trim processing laser light irradiated to the burr is made smaller than the energy amount per unit area of the groove processing laser light irradiated to the workpiece. Therefore, burrs generated around the opening of the groove on the outer surface of the workpiece can be removed, and a product with excellent appearance quality and high processing accuracy can be obtained.

  In the laser processing method described above, in the trim processing step, the trim processing laser beam may be scanned over the entire trim processing region that is slightly larger than the groove bottom surface constituting the groove.

  According to such a method, the burr | flash which generate | occur | produced around the opening part of the groove | channel on the outer surface of a workpiece | work can be removed reliably, and a groove bottom face can be smoothed. Thereby, it is possible to efficiently obtain a product having excellent appearance quality and high processing accuracy.

  In the laser processing method described above, in the trim processing step, the trim processing laser beam may be continuously scanned over the entire trim processing region.

  According to such a method, compared with the case where the trim processing region is divided into a plurality of small regions and the trim processing laser light is individually scanned in each small region, the cycle time of the trim processing step can be shortened. You can plan.

  In the laser processing method, in the trim processing step, the entire trim processing region may be scanned a plurality of times with the trim processing laser light.

  According to such a method, the amount of energy per unit time and unit area of the trim processing laser light irradiated to the trim processing region can be made relatively small, so that the workpiece can be burned by the trim processing laser light. The burr can be removed while suppressing.

  In the laser processing method, in the trim processing step, after the trim processing laser beam is scanned over the entire trim processing region, the trim processing laser is applied to the entire surface of the region that is slightly larger than the trim processing region. Light may be scanned.

  According to such a method, even if the burrs are processed by the irradiation of the trim processing laser light and spread to the outside of the groove, the trim processing laser light is surely irradiated to the portion extending to the outside of the burr. be able to. Thereby, a burr | flash can be removed reliably.

  In the laser processing method described above, in the trim processing step, a burr processing surface formed by irradiating the trimming laser beam to the burr may be recessed from the outer surface of the workpiece.

  According to such a method, burrs can be more reliably removed.

  In the laser processing method, in the groove processing step, a pre-processing step of forming a preliminary groove by irradiating the workpiece with laser light for first groove processing, and the groove depth of the preliminary groove is set to the predetermined depth. The first groove processing laser irradiated to the workpiece by performing a main processing step of processing the groove bottom surface by irradiating the groove bottom surface constituting the preliminary groove with the second groove processing laser light. The amount of energy per unit area of light is larger than the amount of energy per unit area of the trim processing laser light irradiated to the burrs, and the second groove processing laser light irradiated to the groove bottom surface. It may be smaller than the amount of energy per unit area.

  According to such a method, since a groove having a predetermined depth is formed by the pre-machining process and the main machining process, burrs generated around the groove opening on the outer surface of the workpiece during the pre-machining process are formed in the main machining process. It can be suppressed from becoming high inside. That is, the height of the burr can be reduced as compared with the case where a groove having a predetermined depth is formed by irradiating the workpiece with the second groove processing laser beam without performing the pre-processing step. Therefore, even when a relatively deep groove is formed, burrs can be easily removed by the trim processing step.

  In the above laser processing method, in the groove processing step, the entire surface of a predetermined groove processing region may be continuously scanned with the laser light for groove processing.

  According to such a method, the cycle time of the grooving process is shortened compared to the case where the grooving area is divided into a plurality of small areas and the grooving laser beam is individually scanned in each small area. be able to.

  According to the present invention, the energy amount per unit area of the trimming laser beam irradiated to the burr is made smaller than the energy amount per unit area of the groove processing laser light irradiated to the workpiece. Can be removed, and a product having excellent appearance quality and high processing accuracy can be obtained.

It is a schematic diagram of the laser processing apparatus used for the laser processing method which concerns on this invention. It is a flowchart for demonstrating the said laser processing method. 3A is a plan view of a workpiece for explaining the pre-machining step, FIG. 3B is a longitudinal sectional view of the workpiece obtained by the pre-machining step, and FIG. 3C is a plan view of the workpiece for explaining the main machining step. 3D is a longitudinal sectional view of a workpiece obtained by the main machining process. 4A is a plan view of a workpiece for explaining the first to third trim processing steps, FIG. 4B is a longitudinal sectional view of the workpiece obtained by the first trim processing step, and FIG. 4C is obtained by the second trim processing step. 4D is a longitudinal sectional view of a product obtained by the third trimming process. FIG. 4D is a perspective view of the product shown in FIG. 4D.

  DESCRIPTION OF EMBODIMENTS Hereinafter, a laser processing method according to the present invention will be described with reference to the accompanying drawings by giving preferred embodiments in relation to a laser processing apparatus used therein.

  As shown in FIG. 1, the laser processing apparatus 10 is for condensing and irradiating laser light L on the outer surface of a work W to form a groove (deep groove) 38, and the work W is placed thereon. A processing table 12 and a laser processing apparatus main body 14 for irradiating the workpiece W with a predetermined laser beam L are provided.

  For the workpiece W, for example, a metal plate such as SPCC (cold rolled steel plate) or SUS304 (stainless steel) can be used. However, the shape, material, and the like of the workpiece W can be arbitrarily selected. The processing table 12 is configured to be able to fix the workpiece W in a predetermined posture. The processing table 12 may be movable with respect to the laser processing apparatus main body 14 along a plane orthogonal to the optical axis of the laser light L irradiated to the workpiece W by a driving unit (not shown), for example.

  The laser processing apparatus body 14 includes a laser oscillator 16 that oscillates laser light L having a predetermined wavelength, a galvano scanner 18 that scans the outer surface of the workpiece W with the laser light L oscillated from the laser oscillator 16, and a galvano scanner 18. The f (theta) lens 20 which condenses the laser beam L guide | induced from 1 and the control part 22 are provided.

In the present embodiment, the laser oscillator 16 is configured as a so-called fiber laser oscillator. However, the laser oscillator 16 is not limited to a fiber laser oscillator, and various laser oscillators such as a YAG laser oscillator, a CO ₂ laser oscillator, a semiconductor laser oscillator, or an excimer laser oscillator can be adopted. In this embodiment, the laser oscillator 16 oscillates a pulsed laser beam, but may oscillate a continuous laser beam.

  The galvano scanner 18 includes a first mirror 24 that scans the laser beam L in the X direction (left and right direction in FIG. 1), and a second mirror 26 that scans the laser beam L in the Y direction (direction perpendicular to the paper surface in FIG. 1). And have. Each of the first mirror 24 and the second mirror 26 is configured to be rotatable under the action of a motor (not shown) driven and controlled by the control unit 22. The fθ lens 20 condenses and irradiates the workpiece W with the laser light L guided from the second mirror 26.

  The control unit 22 controls the laser oscillator 16 and the galvano scanner 18 based on laser processing conditions (such as the shape and material of the workpiece W) input to the laser processing apparatus main body 14 by input means (not shown). Specifically, the control unit 22 adjusts the LD (Laser Diode) current value and pulse repetition frequency by controlling the laser oscillator 16, and adjusts the scan speed by controlling the motor of the galvano scanner 18. .

  As described above, the control unit 22 adjusts parameters such as the LD current value, the pulse repetition frequency, and the scan speed, thereby adjusting the laser light L (the first groove processing laser light L1 and the second laser light L2 irradiated to the workpiece W). The amount of energy per unit area of the groove processing laser beam L2 and the trim processing laser beam L3) can be changed.

  The laser processing apparatus 10 according to the present embodiment is basically configured as described above. Hereinafter, a laser processing method using the laser processing apparatus 10 will be described. Here, a laser processing method for forming a rectangular groove 38 in a plan view on a workpiece W that is a metal plate using the laser processing apparatus 10 will be described.

  First, as a preparatory step, the workpiece W is fixed to the machining table 12 in a predetermined posture so that the predetermined groove processing region 30 of the workpiece W is positioned within the irradiation range of the laser light L.

  Subsequently, a groove processing step for forming a groove 38 having a predetermined depth in the workpiece W is performed. The groove machining process of the present embodiment includes a pre-machining process and a main machining process. In the pre-processing step, the preliminary groove 32 is formed by irradiating the groove processing region 30 of the workpiece W with the first groove processing laser beam L1 (see step S1, FIG. 3A and FIG. 3B in FIG. 2). Specifically, the preliminary groove 32 is formed on the entire surface of the groove processing region 30 by continuously scanning the first groove processing laser beam L1 a plurality of times.

  In the pre-processing step in the present embodiment, the first groove processing laser beam L1 is reciprocally scanned a plurality of times in a straight line along the longitudinal direction while shifting by a predetermined pitch P in the short direction of the groove processing region 30 (FIG. (See solid line arrow 3A). 3A indicates the spot movement (scanning pattern) of the first groove processing laser beam L1. The same applies to the solid arrow in FIG. 3C described later.

  For example, the pitch (interval) P of the scanning lines adjacent in the short direction of the groove processing region 30 is set to be smaller than the spot diameter (diameter) of the first groove processing laser beam L1 irradiated onto the workpiece W. In this case, since the first groove processing laser beam L1 is also irradiated on the intermediate portion of the scanning line adjacent to the groove processing region 30 in the short direction, the entire surface of the groove processing region 30 can be processed reliably. However, the pitch P of the scanning lines can be set arbitrarily.

  The scanning pattern of the first groove processing laser beam L1 is not limited to the example of FIG. 3A described above, and can be arbitrarily set. For example, the first grooving laser beam L1 may be reciprocally scanned a plurality of times in a straight line along the short direction while shifting a predetermined pitch P in the longitudinal direction of the grooving region 30, or the first grooving laser beam. L1 may be continuously scanned spirally over the entire surface of the groove processing region 30. The same applies to the scanning patterns of the second groove processing laser beam L2 and the trim processing laser beam L3, which will be described later.

  The number of times of scanning the first groove processing laser beam L1 over the entire surface of the groove processing region 30 (number of overwriting) can be arbitrarily set, and can be set to, for example, 5 to 15 times. The focal point of the first groove processing laser beam L1 is set on the outer surface of the workpiece W. Thereby, the preliminary | backup groove | channel 32 can be processed efficiently. However, the focal position of the first groove machining laser beam L1 with respect to the workpiece W can be arbitrarily set.

  In such a pre-processing step, the metal melted by the first groove processing laser beam L1 adheres and solidifies around the opening of the preliminary groove 32 on the outer surface of the workpiece W, thereby generating burrs (residues) 34. (See FIG. 3B). The groove depth of the preliminary groove 32 formed in the pre-processing step is substantially the same as the height of the burr 34 and is substantially half the target depth of the groove 38.

  Next, in the main processing step, the groove bottom surface 36 is processed by irradiating the groove bottom surface 36 constituting the preliminary groove 32 with the second groove processing laser beam L2 so that the groove depth of the preliminary groove 32 becomes a predetermined depth. (See step S2, FIG. 3C and FIG. 3D). Specifically, the second groove processing laser beam L2 is continuously scanned a plurality of times on the entire surface of the groove bottom surface 36 of the preliminary groove 32.

  The scanning pattern of the second groove processing laser beam L2 in the main processing step in the present embodiment is the same as the scanning pattern of the first groove processing laser beam L1 in the pre-processing step described above. The same applies to the scanning pattern of the trim processing laser beam L3 in the first to third trim processing steps to be described later. However, the scanning pattern of the first groove processing laser beam L1 in the pre-processing step, the scanning pattern of the second groove processing laser beam L2 in the main processing step, and the trim processing laser beam L3 in the first to third trim processing steps. These scanning patterns may be different from each other.

  In this main processing step, for example, the groove bottom surface 36 of the preliminary groove 32 is irradiated by setting the repetition frequency smaller without changing the LD current value and the scanning speed as compared with the first groove processing laser beam L1. The main processing energy amount per unit area of the second groove processing laser beam L2 is set larger than the pre-processing energy amount per unit area of the first groove processing laser beam L1 irradiated on the outer surface of the workpiece W. Yes. Therefore, the groove bottom surface 36 constituting the preliminary groove 32 can be processed efficiently.

  The number of times of scanning the second groove processing laser beam L2 over the entire surface of the groove bottom surface 36 of the preliminary groove 32 (number of overwriting) can be arbitrarily set, and can be set to 10 to 20 times, for example.

  The focal point of the second groove processing laser beam L2 is set on the outer surface of the workpiece W. In this case, since it is not necessary to adjust the focal position between the pre-processing step and the main processing step, the control of laser processing can be simplified. However, the focal position of the second groove machining laser beam L2 with respect to the workpiece W can be set to an arbitrary position, and may be set to the groove bottom surface 36, for example.

  In such a main processing step, the groove bottom surface 36 of the preliminary groove 32 is processed by the second groove processing laser beam L2, and the groove 38 having a predetermined depth is formed. At this time, the metal melted by the second grooving laser beam L2 does not adhere to the burr 34 generated during the pre-machining process, and adheres to and solidifies on the side surface of the groove constituting the preliminary groove 32, for example. Therefore, the burr 34 generated during the pre-processing step does not increase in the main processing step.

  Thereafter, a trim processing step is performed for processing the burr 34 generated in the groove processing step and smoothing the groove bottom surface 40 constituting the groove 38. The trim processing step of the present embodiment includes a first trim processing step, a second trim processing step, and a third trim processing step.

  In the first trim processing step, the trim processing laser light L3 is continuously scanned a plurality of times over the entire surface of the first trim processing region 42 that is slightly larger than the groove bottom surface 40 of the groove 38 formed in the main processing step. The burr 34 and the groove bottom surface 40 are processed (see step S3, FIG. 4A and FIG. 4B). The first trim processing region 42 is set to a size that includes the square annular burr 34.

  In this first trim processing step, for example, by setting the LD current value smaller than the first groove processing laser beam L1, and setting the pulse repetition frequency and scan speed larger, the first trim processing region 42 ( The trim processing energy amount per unit area of the trim processing laser beam L3 irradiated to the burr 34) is made smaller than the pre-processing energy amount. Therefore, it is possible to process the burr 34 step by step and smooth the groove bottom surface 40.

  The number of times (the number of overwriting) of scanning the trim processing laser beam L3 over the entire surface of the first trim processing region 42 can be arbitrarily set, and can be set to 2 to 5 times, for example. The focus of the trim processing laser beam L3 in the first trim processing step is set on the outer surface of the workpiece W. In this case, the burr 34 can be processed efficiently, and it is not necessary to adjust the focal position between the groove processing step and the first trim processing step, so that control of laser processing can be simplified. However, the focal position of the trimming laser beam L3 with respect to the workpiece W can be arbitrarily set.

  In such a first trim processing step, since the trim processing laser light L3 is irradiated to the first trim processing region 42 that is slightly larger than the groove bottom surface 40 of the groove 38, trimming to the region outside the burr 34 is performed. The burr 34 can be reliably irradiated with the trimming laser beam L3 while suppressing the irradiation of the processing laser beam L3. As a result, the burr 34 is processed by the trimming laser beam L3 and spreads outside the groove 38, and the groove bottom surface 40 is smoothed.

  Subsequently, in the second trim processing step, the trim processing laser light L3 is continuously scanned a plurality of times over the entire surface of the second trim processing region 44 that is slightly larger than the first trim processing region 42, thereby causing the burrs 34 and grooves to be scanned. The bottom surface 40 is further processed (see step S4, FIG. 4A and FIG. 4C). The second trim processing region 44 is set so as to include the burr 34 processed by the first trim processing step.

  In the second trim processing step, the same processing as the first trim processing step described above is performed except that the processing region becomes wider than the first trim processing region 42. Therefore, detailed description is omitted.

  In such a second trim processing step, since the trim processing laser light L3 is irradiated to the second trim processing region 44 that is slightly larger than the first trim processing region 42, trimming to the region outside the burr 34 is performed. While suppressing the irradiation of the processing laser beam L3, it is possible to reliably irradiate the trim processing laser beam L3 to the burr 34 spreading outside the groove 38 in the first trim processing step. As a result, the burr 34 is processed to be further lowered and spread to the outside of the groove 38, and the groove bottom surface 40 is further smoothed.

  Next, in the third trim processing step, the trim processing laser light L3 is continuously scanned a plurality of times over the entire surface of the third trim processing region 46, which is slightly larger than the second trim processing region 44, so that the burrs 34 and grooves are formed. The bottom surface 40 is further processed (see step S5, FIG. 4A and FIG. 4D). The third trim processing region 46 is set so as to include the burr 34 processed by the second trim processing step.

  In the third trim processing step, the same processing as that of the second trim processing step described above is performed except that the processing region becomes wider than the second trim processing region 44. Therefore, detailed description is omitted.

  In such a third trim processing step, the trim processing laser beam L3 is irradiated to the third trim processing region 46 that is slightly larger than the second trim processing region 44, so trimming to the region outside the burr 34 is performed. While suppressing the irradiation of the processing laser beam L3, it is possible to reliably irradiate the trim processing laser beam L3 to the burr 34 spreading outside the groove 38 in the second trim processing step. Thereby, the burr 34 is completely removed and the groove bottom surface 40 is further smoothed.

  At this time, the burr processing surface 48 formed by processing the burr 34 can be recessed from the outer surface of the workpiece W. The depth dimension of the burr processing surface 48 is sufficiently smaller than the depth dimension of the groove 38, for example, 10% or less of the depth dimension of the groove 38. As a result, the high-quality product 50 in which the groove 38 having a predetermined depth without the burr 34 is formed on the outer surface is processed (see FIG. 5).

  According to the present embodiment, the groove processing step of irradiating the workpiece W with the groove processing laser light (the first groove processing laser light L1 and the second groove processing laser light L2) to form the groove 38 having a predetermined depth. And the trim processing step of processing the burr 34 by irradiating the trimming laser beam L3 to the burr 34 generated around the opening of the groove 38 on the outer surface of the workpiece W during the groove processing step.

  Then, the amount of trim processing energy per unit area of the trim processing laser beam L3 irradiated to the burr 34 is set to the amount of energy per unit area of the groove processing laser beam irradiated to the workpiece W (the amount of pre-processing energy and the main processing). Less than the amount of energy). Therefore, the burr 34 generated around the opening of the groove 38 on the outer surface of the workpiece W can be removed, and the product 50 having excellent appearance quality and high processing accuracy can be obtained.

  Further, in the groove processing step, the pre-processing step of forming the preliminary groove 32 by irradiating the workpiece W with the first groove processing laser beam L1, and the preliminary so that the groove 38 depth of the preliminary groove 32 becomes a predetermined depth. A main processing step is performed in which the groove bottom surface 36 is formed by irradiating the groove bottom surface 36 constituting the groove 32 with the second groove processing laser beam L2.

  Further, the second groove processing for irradiating the groove bottom surface 36 of the preliminary groove 32 with the pre-processing energy amount per unit area of the first groove processing laser beam L1 irradiated to the workpiece W being larger than the trim processing energy amount. This is smaller than the main processing energy amount per unit area of the laser beam L2.

  Therefore, it is possible to suppress the burrs 34 generated around the opening of the groove 38 on the outer surface of the work W during the pre-machining process from becoming high during the main machining process. That is, the height of the burr 34 can be reduced as compared with the case where the groove W having a predetermined depth is formed by irradiating the workpiece W with the second groove processing laser light L2 without performing the pre-processing step. . Therefore, even when the relatively deep groove 38 is formed, the burr 34 can be easily removed by the trim processing step.

  According to the present embodiment, since the first grooving laser beam L1 is continuously scanned over the entire surface of the predetermined grooving region 30 in the pre-machining step, the grooving region 30 is divided into a plurality of small regions. Thus, the cycle time of the pre-processing step can be shortened as compared with the case where the first groove processing laser beam L1 is individually scanned in each small region.

  Further, in the main processing step, the second groove processing laser beam L2 is continuously scanned over the entire surface of the groove bottom surface 36 of the preliminary groove 32. Therefore, the groove bottom surface 36 is divided into a plurality of small regions. The cycle time of the main processing step can be shortened as compared with the case where the second groove processing laser beam L2 is individually scanned in the region.

  According to this embodiment, in the trim processing step, the first to third trim processing steps are performed. Then, in the first trim processing step, the trim processing laser light L3 is scanned over the entire surface of the first trim processing region 42 that is slightly larger than the groove bottom surface 40 constituting the groove 38 formed in the main processing step. Therefore, the burr 34 generated around the opening of the groove 38 on the outer surface of the workpiece W can be reliably removed and the groove bottom surface 40 can be smoothed. Therefore, it is possible to efficiently obtain the product 50 having excellent appearance quality and high processing accuracy.

  In the second trim processing step, the trim processing laser beam L3 is scanned over the entire surface of the second trim processing region 44 that is slightly larger than the first trim processing region 42. In the third trim processing step, the second trim processing step is performed. The trim processing laser beam L3 is scanned over the entire surface of the third trim processing region 46 that is slightly larger than the region 44. As a result, even if the burr 34 is processed by the irradiation of the trim processing laser beam L3 and spreads outside the groove 38, the trim processing laser beam L3 is reliably irradiated to the portion spreading outside the burr 34. be able to. Therefore, the burr 34 can be removed more reliably.

  Furthermore, in the trim processing step, the trim processing laser light L3 is continuously scanned over the entire surface of the first to third trim processing regions 42, 44, 46, so the first to third trim processing regions 42, 44 are scanned. , 46 can be divided into a plurality of small regions, and the trim processing step cycle time can be shortened as compared with the case where each small region is individually scanned with the trimming laser beam L3.

  Furthermore, since the trim processing laser beam L3 is scanned a plurality of times on the entire surface of the first to third trim processing regions 42, 44, 46, the first to third trim processing regions 42, 44, 46 are irradiated. The trim processing energy amount per unit time and unit area of the trim processing laser beam L3 can be made relatively small. Therefore, the burr 34 can be removed while suppressing the burning of the workpiece W by the trim processing laser light L3.

  The laser processing method according to the present invention is not limited to the above-described embodiment, and various methods can be adopted without departing from the gist of the present invention.

  In the above-described embodiment, as shown in FIG. 4D, the burr processing surface 48 after the burr 34 is completely removed in the third trim processing step is formed so as to be recessed from the outer surface of the workpiece W. However, the burr 34 and the bulge may remain as long as there is no problem in the appearance or accuracy of the workpiece W. In addition, it is more desirable in terms of appearance and accuracy that the burr processing surface 48 and the outer surface of the workpiece W are the same smooth surface.

  Further, the number of times of scanning the first groove processing laser beam over the entire surface of the groove processing region, the number of times of scanning the second groove processing laser light over the entire groove bottom surface of the preliminary groove, and the first to third trim processing regions The number of times the trim processing laser beam is scanned over the entire surface may be one instead of a plurality of times. In this case, the cycle time can be further shortened.

  Further, in the groove processing step, only the main processing step may be performed without performing the pre-processing step. In this case, for example, since the groove 38 having a predetermined depth is formed by irradiating the workpiece W with the second groove processing laser beam (groove processing laser beam), the cycle time of the groove processing step is shortened. Can be

  Further, in the trim processing step, the trimming laser beam may be irradiated to the burrs without irradiating the groove bottom surface constituting the groove formed in the groove processing step. In the trim processing step, the third trim processing step may be performed without performing at least one of the first trim processing step and the second trim processing step.

DESCRIPTION OF SYMBOLS 10 ... Laser processing apparatus 12 ... Processing table 16 ... Laser oscillator 18 ... Galvano scanner 20 ... f (theta) lens 22 ... Control part 30 ... Groove processing area | region 32 ... Spare groove 34 ... Burr 36, 40 ... Groove bottom 38 ... Groove 42 ... 1st Trimming area 44 ... second trimming area 46 ... third trimming area 48 ... burr machining surface 50 ... product L1 ... first groove machining laser beam L2 ... second groove machining laser beam L3 ... trim machining laser beam W ... Work

Claims (8)

A groove processing step of irradiating the workpiece with a laser beam for groove processing to form a groove of a predetermined depth;
Performing a trim processing step of processing the burr by irradiating the burr generated around the opening of the groove on the outer surface of the workpiece during the groove processing step with a laser beam for trim processing;
The amount of energy per unit area of the trim processing laser light irradiated to the burr is smaller than the amount of energy per unit area of the groove processing laser light irradiated to the workpiece.
The laser processing method characterized by the above-mentioned. The laser processing method according to claim 1,
In the trim processing step, the laser beam for trim processing is scanned over the entire trim processing region that is slightly larger than the bottom surface of the groove constituting the groove. The laser processing method according to claim 2, wherein
In the trim processing step, the laser beam for trim processing is continuously scanned over the entire trim processing region. In the laser processing method of Claim 2 or 3,
In the trim processing step, the entire trim processing region is scanned with the trim processing laser light a plurality of times. In the laser processing method of any one of Claims 2-4,
In the trim processing step, after the trim processing laser light is scanned over the entire trim processing area, the trim processing laser light is scanned over the entire area that is slightly larger than the trim processing area. A laser processing method. In the laser processing method of any one of Claims 1-5,
In the trim processing step, a laser processing method is characterized in that a burr processing surface formed by irradiating the trim processing laser beam to the burr is recessed from an outer surface of the workpiece. In the laser processing method of any one of Claims 1-6,
In the groove processing step, a pre-processing step of forming a preliminary groove by irradiating the workpiece with a first groove processing laser beam;
Performing a main processing step of processing the groove bottom surface by irradiating the groove bottom surface constituting the preliminary groove with a second groove processing laser beam so that the groove depth of the preliminary groove becomes the predetermined depth,
The amount of energy per unit area of the first groove processing laser light irradiated to the workpiece is larger than the amount of energy per unit area of the trim processing laser light irradiated to the burrs, and the groove bottom surface. The laser processing method is characterized by being smaller than the energy amount per unit area of the second groove processing laser light irradiated on the surface. In the laser processing method of any one of Claims 1-7,
In the grooving step, the grooving laser beam is continuously scanned over the entire surface of a predetermined grooving region.

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