JP2010129940A - Substrate holder for use in soldering - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate holder by which a substrate can be released from an adhesive sheet without deformation of the substrate while enhancing the effect of preventing the substrate from warping during heating in reflow soldering. <P>SOLUTION: The substrate holder includes a body part, an adhesive sheet provided on the upper surface of the body part for adhesion-fixing the substrate, one or more openings provided in the body part on the side where the adhesive sheet is disposed, and a suction port communicating with the openings. A negative pressure is exerted on the suction port to release the adhesive sheet covering the opening from the substrate, so that the adhesive force between the substrate and the adhesive sheet is reduced. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a soldering board holder for mounting components on a board. In particular, the present invention relates to a board holder for reflow soldering a component to a flexible printed circuit board (FPC).

  In recent years, a thin circuit board, particularly a sheet-like flexible printed circuit board, has been used to cope with the reduction in size and weight of electronic devices. Reflow soldering is known as a method for soldering a flexible printed circuit board. The reflow soldering is a method of mounting an electronic component by printing a solder paste and heating a flexible printed circuit board on which the electronic component is placed to melt the solder.

  However, as the substrate becomes thinner, the rigidity of the substrate decreases, and the substrate is easily warped and deformed. Since FPC is particularly thin and flexible, warpage during reflow soldering heating is large. When the substrate is warped or deformed, problems such as poor bonding of electronic components mounted on the substrate occur. Therefore, various means have been studied to prevent warpage and deformation during heating of substrates such as FPC and to suppress the occurrence of defects. As one of these, there is a method in which reflow soldering is performed by attaching a substrate to a substrate holder.

  There are two main types of substrate holders. One type is a method of sandwiching a substrate from both sides with a substrate holder. However, the board holder on the component mounting surface side of the board has a structure that avoids the part where parts are mounted, and if the component mounting area is wide, only a part of the board can be fixed. There is a problem that it cannot be prevented sufficiently.

  The other type is a type in which an adhesive sheet is attached to the substrate holder and the substrate is attached to the adhesive sheet. The structure of a conventional substrate holder is shown in FIG. The conventional substrate holder 10 includes an adhesive sheet 20 and guide pins 30. The substrate 50 on which the component 40 is mounted is aligned with the guide pins 30 and bonded and fixed to the adhesive sheet 20 to prevent the substrate from warping during heating. In this case, since the entire surface opposite to the component mounting surface of the substrate is fixed by the adhesive sheet, the effect of preventing warpage can be enhanced. However, the adhesive strength of the adhesive sheet does not weaken even after reflow soldering, so if you try to peel off the substrate from the substrate holder, a large stress is generated on the substrate due to the adhesive force of the substrate holder, and the substrate and mounted components are It may be damaged.

  In order to deal with such problems, in conventional research, reflow soldering is performed by adsorbing and fixing the substrate to the substrate holder by negative pressure means without using an adhesive, and after the soldering is completed, the negative pressure state is changed. A method of removing the unwound substrate (for example, Patent Document 1), a method of pushing the substrate through a pin passing through the substrate holder and the adhesive material, and peeling the adhesive material and the substrate (for example, Patent Document 2) are disclosed. Has been.

JP 2000-357711 A JP 2005-123636 A

  However, since the method of Patent Document 1 does not use an adhesive sheet and does not fix the entire surface opposite to the component mounting surface of the substrate, it can effectively prevent the substrate from warping. Can not. Further, in the method of Patent Document 2, since the surface opposite to the component mounting surface of the substrate is directly pushed up by the pins, the pushed-up portion of the substrate may be deformed into a convex shape.

  Accordingly, an object of the present invention is to provide a substrate holder capable of peeling a substrate from an adhesive sheet without deforming the substrate while enhancing the effect of preventing the substrate from warping during heating during reflow soldering.

  The present invention provides a substrate holder for holding a substrate when soldering to the substrate, wherein the substrate holder is disposed on the main body portion, the pressure-sensitive adhesive sheet that adheres and fixes the substrate, A pressure-sensitive adhesive sheet comprising one or more openings provided on a side of the main body on which the pressure-sensitive adhesive sheet is disposed and a suction port communicating with the opening, and covering the opening when negative pressure is applied to the suction port A part peels from the said board | substrate, The adhesive force between the said board | substrate and the said adhesive sheet becomes weak, It is characterized by the above-mentioned.

  The present invention is characterized in that the substrate holder has a plurality of the openings, the main body has a passage communicating with the plurality of openings, and the passage communicates with the suction port.

  The present invention is characterized in that the substrate holder further comprises removable negative pressure means connected to the suction port.

  The present invention is characterized in that in the substrate holder, the main body portion includes one or more guide pins for positioning the substrate on the adhesive sheet disposition surface.

  The present invention relates to a reflow soldering method using a substrate holder, wherein one or more openings are provided on the upper surface, and an adhesive sheet is disposed on the upper surface of the substrate holder having a suction port communicating with the opening. And placing the substrate to be reflowed on the upper surface of the adhesive sheet disposed on the upper surface of the substrate holder, heating the substrate holder on which the substrate and the adhesive sheet are disposed, A negative pressure means is connected to the suction port of the substrate holder to apply a negative pressure, and the adhesive sheet portion covering the opening is separated from the substrate, and the adhesive sheet portion covering the opening is separated from the substrate. And peeling the entire substrate from the pressure-sensitive adhesive sheet.

  The present invention relates to a reflow soldering method, wherein the substrate holder includes one or more guide pins on an upper surface, the substrate includes an opening corresponding to the guide pin, and the opening is formed as the guide pin. According to the above, the substrate is arranged.

  In the present invention, since the substrate is fixed to the substrate holder using the adhesive sheet, the surface on the opposite side of the component mounting surface of the substrate can be securely fixed, effectively preventing the substrate from warping during heating. can do. In addition, the present invention provides a pressure-sensitive adhesive force between the pressure-sensitive adhesive sheet and the substrate by applying a negative pressure to the pressure-sensitive adhesive sheet through the opening provided in the substrate holder using a negative pressure means and peeling the pressure-sensitive adhesive sheet portion covering the opening from the substrate. Therefore, it is possible to prevent the substrate from being deformed when the entire substrate is peeled from the adhesive sheet.

  Moreover, this invention can weaken the adhesive force between an adhesive sheet and a board | substrate by efficiently applying a negative pressure to an adhesive sheet by providing several opening in a board | substrate holder. Furthermore, by providing a passage communicating with the plurality of openings, the adhesive force between the adhesive sheet and the substrate can be effectively reduced with one negative pressure means.

  Further, since the negative pressure means in the present invention is removable, it is not necessary to always connect the negative pressure means to the substrate holder, and the substrate holder can be easily transferred and heated.

  Further, according to the present invention, the substrate holder is provided with guide pins, and the substrate can be arranged at an accurate position with respect to the substrate holder.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings.

  FIG. 1 is a schematic sectional view showing an embodiment of the overall configuration of a substrate holder according to the present invention. This substrate holder is, for example, a substrate holder used in a substrate reflow soldering process, and reflow soldering is performed in a state where a printed circuit board is fixed to an adhesive sheet of the substrate holder. The substrate holder 110 includes a main body 111 of a substrate holder having an opening 112 and a suction port 113, an adhesive sheet 120 disposed on the upper surface of the main body 111, and a guide pin 130 for positioning the substrate and the adhesive sheet. With. As shown in the drawing, a substrate 150 on which a component 140 is placed is placed on the upper surface of the adhesive sheet 120, and the substrate 150 is held and fixed. Further, the negative pressure means 160 is connected to the suction port 113 via a connector 170 for connecting the negative pressure means 160 to the substrate holder.

  FIG. 2 shows a schematic perspective view of the substrate holder 110 with the adhesive sheet removed. As shown in FIG. 2, the main body 111 of the substrate holder 110 includes a plurality of openings 112, suction ports 113, and a plurality of guide pins 130 on the upper surface. An adhesive sheet 120 is disposed on the surface having the opening 112. As shown in FIG. 1, the opening 112 communicates with the suction port 113, an adhesive sheet 120 is disposed on the upper surface of the main body 111 so as to cover the opening 112, and negative pressure is applied to the suction port 113 via the connector 170. By connecting the means 160, the opening 112 and the suction port 113 are sealed.

  When peeling the substrate 150 from the adhesive sheet, the negative pressure means 160 is connected to the suction port 113 via the connector 170, and negative pressure is applied to the adhesive sheet 120 through the opening 112. Thereby, a part of the pressure-sensitive adhesive sheet 120 is drawn into the opening 112, a part of the pressure-sensitive adhesive sheet is peeled off from the substrate 150, and the adhesive force of the pressure-sensitive adhesive sheet to the substrate can be weakened. FIG. 3 shows a state where a part of the pressure-sensitive adhesive sheet is peeled off from the substrate by applying a negative pressure.

  The main body 111 of the substrate holder 110 has a flat surface, such as stainless steel or ceramic, is easy to process such as drilling, and is not thermally deformed when heated to a reflow peak temperature (generally 230 to 240 ° C.). Or it is preferable to form from a material with little heat deformation.

  The material of the pressure-sensitive adhesive sheet 120 has sufficient adhesive strength to hold the substrate 150 during heating, and further heats when exposed to a reflow soldering peak temperature (generally about 230 to 240 ° C.). It is preferably formed from a material that is not deformed or has little thermal deformation, and that is deformed by a negative pressure, and has elasticity that can be reused by returning to the original state when the negative pressure is released, such as silicon rubber. . In this embodiment, the pressure-sensitive adhesive sheet 120 is disposed so as to adhere to the entire lower surface of the substrate, but the pressure-sensitive adhesive sheet 120 does not necessarily have to be adhered to the entire lower surface of the substrate. However, it is preferable that the adhesive surface between the pressure-sensitive adhesive sheet and the substrate is larger in order to effectively prevent the substrate from warping during heating. In addition to arranging a single sheet-like adhesive sheet, the shape and arrangement of the adhesive sheet may be arranged by arranging a plurality of small pieces of adhesive sheets, or only on the opening 112. Also good.

  In this embodiment, the openings 112 are uniformly distributed over the entire upper surface of the main body of the substrate holder. However, the present invention is not limited to this arrangement, and the openings 112 are densely arranged at the center of the main body of the substrate holder. It is possible to make a suitable arrangement pattern corresponding to the size and shape of the pressure-sensitive adhesive sheet and the substrate, such as arranging only in the peripheral portion, or arranging in a lattice shape.

  The guide pins 130 provided on the upper surface of the main body 111 are pins for positioning the adhesive sheet and the substrate disposed on the main body 111. As shown in FIG. 1, the adhesive sheet 120 and the substrate 150 each have an opening corresponding to the guide pin 130, and by aligning the opening and the guide pin, the adhesive sheet and the substrate are attached to the substrate holder. It can be accurately placed at a suitable position. In the embodiment shown in FIG. 2, the guide pins 130 are arranged at the four corners of the substrate holder. However, the arrangement and number of the guide pins 130 are not limited, and the substrate and the adhesive sheet can be easily positioned. Furthermore, it can be arranged in a suitable arrangement pattern and number corresponding to the size and shape of the pressure-sensitive adhesive sheet and the substrate, such as being arranged at the center of the substrate holder or arranged at the peripheral edge of the substrate holder. In addition, the shape of the opening corresponding to the guide pin 130 can be changed as necessary, such as a round hole, a square hole, or a notch shape, according to the shape of the guide pin.

  In FIG. 1, the negative pressure means 160 is shown connected to the substrate holder 110, but may be removable so as to be connected when necessary, such as when the substrate 150 is peeled from the adhesive sheet 120. preferable. The use of the connecting tool 170 has an advantage that only the connecting tool 170 needs to be replaced when the connecting portion is worn by repeatedly connecting and removing the negative pressure means 160 and the substrate holder 110. The connector 170 may have a structure that can maintain the negative pressure state between the opening 112 and the suction port 113 even after the negative pressure means is removed, or an appropriate structure such as a check valve.

  Hereinafter, an embodiment of a method for performing reflow soldering using the substrate holder 110 and peeling the substrate 150 from the adhesive sheet 120 will be described in detail.

  First, the adhesive sheet 120 is disposed on the upper surface of the substrate holder 110 along the guide pins 130. Next, on the upper surface of the pressure-sensitive adhesive sheet 120 disposed on the substrate holder 110, a substrate 150 on which a component 140 is mounted by printing a solder paste along the guide pins 130 is placed and bonded. However, the substrate 150 may be arranged on the adhesive sheet before printing the solder paste and mounting the components, or after the solder paste is printed and arranged on the adhesive sheet before mounting the components. May be changed.

  Thereafter, the substrate holder 110 including the substrate 150 and the adhesive sheet 120 is put into a reflow furnace. In the reflow furnace, the substrate tends to warp due to high temperature, but warpage is prevented because the substrate is bonded and fixed to the adhesive sheet 120. After the solder paste is melted, the substrate holder 110 is taken out of the reflow furnace.

  After the solder is solidified, the negative pressure means 160 is connected to the suction port 113 and operated. Thereby, a negative pressure is applied to the adhesive sheet 120 through the opening 112, and a part of the adhesive sheet 120 is drawn into the opening 112 and peeled off from the substrate 150 as shown in FIG. Thus, the adhesive force with respect to the board | substrate 150 of the adhesive sheet 120 becomes weak because a part of adhesive sheet 120 peels from the board | substrate 150. FIG. In this state, by peeling the entire substrate 150 from the adhesive sheet 120, the substrate 150 can be easily peeled from the adhesive sheet 120 without generating a large stress on the substrate 150.

  While the preferred embodiment of the invention has been illustrated and described, it is not intended that the invention be limited to this embodiment. For example, the substrate holder does not have to be configured to have suction ports via passages communicating with the plurality of openings, and has a plurality of suction ports respectively corresponding to the plurality of openings. Various modifications can be made to the present invention without departing from the object or scope of the present invention, such as connecting negative pressure means.

  The present invention can be used in the electronic equipment manufacturing industry and the precision machine manufacturing industry. In particular, it is used for a soldering process of a substrate on which components are mounted by soldering.

FIG. 1 is a schematic cross-sectional view showing the overall configuration of a substrate holder according to the present invention. FIG. 2 is a perspective view showing the main body of the substrate holder according to the present invention. FIG. 3 is a schematic cross-sectional view showing a state where negative pressure is applied to the substrate holder of FIG. FIG. 4 is a schematic cross-sectional view of a conventional substrate holder.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,110 Board | substrate holder 111 Main-body part 112 Opening 113 Suction port 20,120 Adhesive sheet 30,130 Guide pin 40,140 Parts 50,150 Board | substrate 160 Negative pressure means 170 Connection tool

Claims (6)

In the substrate holder that holds the substrate when soldering to the substrate, the substrate holder is
The main body,
An adhesive sheet that is disposed on the upper surface of the main body and adheres and fixes the substrate;
One or more openings provided on the side of the main body where the adhesive sheet is disposed;
A suction port communicating with the opening;
When a negative pressure is applied to the suction port, the adhesive sheet portion covering the opening is peeled from the substrate, and the adhesive force between the substrate and the adhesive sheet is weakened.   2. The substrate holder according to claim 1, wherein the plurality of openings are provided, the main body includes a passage communicating with the plurality of openings, and the passage communicates with the suction port. Board holder.   3. The substrate holder according to claim 1, further comprising a removable negative pressure means connected to the suction port.   The substrate holder according to any one of claims 1 to 3, wherein the main body portion includes one or more guide pins for positioning the substrate on the adhesive sheet disposition surface. Board holder. In the reflow soldering method using a substrate holder,
Providing an adhesive sheet on an upper surface of a substrate holder having one or more openings on the upper surface and a suction port communicating with the opening;
Placing a substrate to be reflowed on the top surface of the adhesive sheet disposed on the top surface of the substrate holder;
Heating the substrate holder provided with the substrate and the adhesive sheet;
Connecting a negative pressure means to the suction port of the substrate holder to apply a negative pressure, and peeling the adhesive sheet portion covering the opening from the substrate;
And a step of peeling the entire substrate from the pressure-sensitive adhesive sheet in a state where the pressure-sensitive adhesive sheet portion covering the opening is peeled off from the substrate.   6. The reflow soldering method according to claim 5, wherein the substrate holder includes one or more guide pins on an upper surface, the substrate includes an opening at a location corresponding to the guide pin, and the opening includes the opening. A reflow soldering method comprising arranging the substrate in accordance with a guide pin.

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