JP2008276042A - Nameplate - Google Patents

Abstract

A nameplate capable of recording more information is provided.
An RFID unit 20 includes resin members 11 and 14 for housing the RFID unit 20, and a metal plate 12 bonded to the resin member so that the RFID unit 20 of the resin member is covered. According to the nameplate 10, an RFID unit 20 that can record information and transmit it as a radio signal is integrated with the nameplate 10. Therefore, it is possible to record more information than the conventional nameplate 10.
[Selection] Figure 2

Description

  The present invention relates to a nameplate.

Many of the nameplates are made of metal, and information such as an identification code is written on the surface by using a color material or a stamp, and is attached to a managed object such as a product or equipment. Patent Document 1 discloses a method for creating this type of nameplate. In the nameplate producing method disclosed in this document 1, information is recorded on the surface of the aluminum substrate having an anodized film by irradiating a laser.
JP-A-11-78245

  By the way, in recent years, by centrally managing various attributes such as the production date, standards, specifications, and service life of various controlled items to which nameplates are attached, the processes of manufacturing, shipping, and disposal of the controlled items are performed. Attempts have been made to improve efficiency. However, since the nameplates proposed so far can record only a limited number of characters by coloring materials, engravings, etc., there is a problem that it cannot sufficiently satisfy such a demand for efficiency.

  The present invention has been devised under such a background, and an object thereof is to provide a nameplate capable of recording more information.

  A nameplate according to a preferred aspect of the present invention includes an RFID unit, a resin member that accommodates the RFID unit, and a metal plate that is bonded to the resin member so that the RFID unit of the resin member is covered. Features. According to this aspect, more information can be recorded than the conventional nameplate.

  In this aspect, the resin member has a flat, substantially rectangular parallelepiped shape, and is formed of a resin frame having a recess in the center and a resin plate that enters the recess. The metal plate is bonded to the upper surface of the resin plate. You may have a board and the 2nd metal plate joined to the lower surface of a resin frame. According to this, a nameplate with higher rigidity can be realized by being sandwiched between two metal plates.

  Further, one or a plurality of holes penetrating the resin frame, the resin plate, the first metal plate, and the second metal plate in the vertical direction may be formed. According to this, it can mount | wear to a to-be-managed thing more reliably by screwing the one or some hole.

  Further, the metal plate may have a part of its surface joined to the resin member, and one or a plurality of holes may be formed in a portion extending to the outside of the resin member. According to this, it can mount | wear to a to-be-managed thing more reliably by screwing the hole of a metal plate.

  In the present invention, an RFID unit capable of transmitting information as a radio signal is integrated with a nameplate. Therefore, more information can be recorded than the conventional nameplate.

(Embodiment of the Invention)
Embodiments of the present invention will be described below with reference to the drawings.

  FIG. 1 is a plan view of a nameplate 10 according to the present embodiment. 2A is a partial cross-sectional view taken along the line AA in FIG. 1, and FIG. 2B is a partial cross-sectional view taken along the line BB in FIG. FIG. 3 is a view of the nameplate 10 as seen from the upper side and slightly forward. FIG. 4 is a front view of the nameplate 10 as viewed from the front. The nameplate 10 has a structure in which a first metal plate 12 and a second metal plate 13 are respectively joined to an upper surface and a lower surface of a resin frame 11 that accommodates an RFID (Radio Frequency IDentification) unit (see FIG. 5).

  The resin frame 11 is a member formed by molding ABS (acrylonitrile butadiene styrene) resin into a flat, substantially rectangular parallelepiped shape. The upper surface of the resin frame 11 is provided with a concave portion 11a having a slight thickness at the front, rear, left, and right edges, with the inside slightly recessed on the lower surface side. A rectangular space 11b (hereinafter referred to as “RFID accommodating space”) for accommodating the RFID unit 20 is formed in the approximate center of the concave portion 11a that is recessed in the rectangular shape.

  FIG. 5 is a diagram illustrating a schematic configuration of the RFID unit 20. As shown in FIG. 5, the RFID unit 20 includes an antenna coil 21 and a semiconductor chip 25. The antenna coil 21 is a member in which a copper wire 23 is wound around a thin plate-like core member 22. The antenna coil 21 has a rectangular shape in which the width dimension in the front-rear direction and the left-right direction is slightly shorter than that of the first metal plate 12, and is accommodated in the RFID accommodating space 11b. The semiconductor chip 25 is obtained by integrating a CPU (Central Processing Unit) 26, a memory 27, a transceiver 28, and a capacitor 29 as an integrated circuit.

  The antenna coil 21 of the RFID unit 20 generates a magnetic flux penetrating the core member 22 when receiving a radio signal from a reader / writer (not shown). Then, an electrical signal obtained by the action of the magnetic flux change is transmitted from the transceiver 28 to the CPU 26, and electric power is stored in the capacitor 29. The CPU 26 reads data from the memory 27 using the electric power stored in the capacitor 29, and transmits the read data from the transceiver 28 via the antenna coil 21.

  As shown in FIGS. 2A and 2B, a transparent resin plate 14 is joined to the resin frame 11, and a first metal plate 12 is joined to the upper surface of the transparent resin plate 14. . The transparent resin plate 14 is a member formed by molding a methacrylic resin, which is a transparent resin, in accordance with the shape of the recess 11 a of the resin frame 11. The width dimension of the transparent resin plate 14 in the front-rear direction and the left-right direction is slightly shorter than the width dimension in the front-rear direction and the left-right direction of the recess 11 a of the resin frame 11. The transparent resin plate 14 is fitted into the recess 11a of the resin frame 11, and is joined to the recess 11a by an adhesive. Due to the bonding of the transparent resin plate 14, the RFID housing space 11 b at the substantially center of the recess 11 a is sealed with the second metal plate 13.

  The first metal plate 12 is a member obtained by processing stainless steel into a plate shape. The width dimension of the first metal plate 12 in the front-rear direction and the left-right direction is substantially the same as the width dimension of the transparent resin plate 14 in the front-rear direction and the left-right direction. And this 1st metal plate 12 is joined to the upper surface of the transparent resin board 14 with the adhesive so that the front, back, left and right edges of the first metal board 12 are aligned with that of the transparent resin board 14. Thereby, the RFID unit 20 accommodated in the RFID accommodating space 11b of the resin frame 11 is covered with the first metal plate 12 on the transparent resin plate 14 therebetween. The first metal plate 12 is subjected to surface processing with reduced gloss so that when characters such as management information are written with color materials, the characters are easy to see.

  Similar to the first metal plate 12, the second metal plate 13 is a member obtained by processing stainless steel into a plate shape. The width dimension of the second metal plate 13 in the front-rear direction and the left-right direction is substantially the same as the width dimension of the resin frame 11 in the front-rear direction and the left-right direction. The second metal plate 13 is joined to the lower surface of the resin frame 11 with an adhesive so that its front, rear, left and right edges are aligned with that of the resin frame 11. In other words, the name plate 10 includes a second metal plate 13, a resin frame 11, a transparent resin plate 14, and a first metal plate 12, which are stacked in order from the bottom, and the RFID unit 20 is placed in the RFID accommodating space 11 b at the substantially center of the resin frame 11. It has a structure that accommodates.

  As shown in FIG. 1 and FIG. 3, the transparent resin plate 14, the resin frame 11, and the second resin plate 12 are located at positions slightly inside the left and right edges of the first metal plate 12 from the upper surface of the first metal plate 12. Screw fixing holes 15, 16, 17, and 18 that penetrate through the metal plate 13 and reach the back side thereof are formed. Therefore, the back surface of the second metal plate 13 of the nameplate 10 is brought into contact with one surface of the product or equipment that is the management object, and the holes 15, 16, 17, and 18 are screwed from the first metal plate 12 side. As a result, the nameplate 10 can be attached to those objects to be managed.

  Further, the RFID unit 20 is fixed to the transparent resin plate 14 with an adhesive and is not fixed to the second metal plate 13. However, since the surface of the core member 22 has adhesiveness, the copper wire 23 sinks into the surface of the core member 22, so that the surface of the core member 22 having adhesiveness becomes the second metal plate 13. It abuts and is fixed to some extent. Further, the sealing material 50 that enters the recess 11c of the resin frame 11 prevents water, oil, and the like from entering the RFID accommodating space 11b, thereby preventing malfunction of the RFID unit 20.

  Further, the upper surface of the first metal plate 12 and the upper surface of the resin frame 11 other than the recess 11a are all at the same height, and the upper surface of the nameplate 10 is flat. Furthermore, a slight gap S1 is provided between the resin frame 11 and the transparent resin plate 14 on both sides in the longitudinal direction (left and right direction) of the nameplate 10, and a slight gap is also provided on both sides in the short direction (front and back direction). S2 is provided. The gaps S1 and S2 act as a refuge for the adhesive, and also have an effect of making it easier to put the transparent resin plate 14 into the recess 11a. The gaps S1 and S2 are S1> S2, and the deformation and shape accuracy of the resin frame 11 and the transparent resin plate 14 are taken into consideration.

  In the nameplate 10 according to the embodiment described above, the first metal plate 12 on which characters such as management information are written and the resin member that houses the RFID unit 20 are integrated. Therefore, the amount of information that cannot be recorded on the surface of the first metal plate 12 is stored in the memory 27 of the RFID unit 20, and the information is read by the reader / writer and is referred to as appropriate so that the nameplate 10 is attached. Things can be managed more efficiently.

 Further, the nameplate 10 according to the present embodiment has a structure in which the RFID unit 20 is accommodated in a resin member composed of the resin frame 11 and the transparent resin 14 and the resin member is sandwiched between the first metal plate 12 and the second metal plate 13. It has become. Therefore, electromagnetic wave communication with the reader / writer can be performed satisfactorily while ensuring sufficient rigidity by the first metal plate 12 and the second metal plate 13.

  This effect will be described in detail with reference to FIG. As described above, the RFID unit 20 performs communication under the action of a change in magnetic flux formed so as to penetrate the antenna coil 21 that has received the radio signal. However, there is a metal material in the vicinity of the antenna coil 21. In this case, the magnetic flux crosses the metal material and an eddy current is generated in the portion. When an eddy current flows through the metal material, a magnetic flux is generated in a direction that cancels the magnetic flux that passes through the antenna coil 21. As a result, the sensitivity of the radio signal is significantly impaired.

  On the other hand, the nameplate 10 according to the present embodiment accommodates the RFID unit 20 by a resin member composed of a resin frame 11 and a transparent resin plate 14 which are non-conductors, and the resin member is used as the first metal plate 12 and the first metal plate 12. Two metal plates 13 are sandwiched. Therefore, a sufficient gap is formed between the first metal plate 12 and the second metal plate 13 to form the magnetic flux leakage path 40 as shown in FIG. Communication with good sensitivity. The antenna coil 21 of the nameplate 10 according to the present embodiment is housed in the RFID housing space 11b so that the core member 22 faces in the front-rear direction parallel to the first metal plate 12 and the second metal plate 13. The proper accommodation direction further contributes to the formation of the magnetic flux leakage path 40 shown in FIG. Even if the reader / writer serving as a radio signal transmission source is on the first metal plate 12 side of the nameplate 10, the radio signal propagated from the direction acts on the magnetic flux in the magnetic flux leakage path 40 by the diffraction phenomenon. Therefore, highly sensitive communication is maintained. According to the verification by the inventors, when the resonance frequency of the RFID unit 20 of the nameplate 10 having such a configuration was set to a frequency of the 13,56 MHz band that has been spreading in recent years, communication with a reader / writer was attempted. It has been confirmed that the communication sensitivity was good.

(Other embodiments)
The present invention is not limited to the above-described embodiment, and various modifications can be made.

  For example, the 1st metal plate 12 is good also as the thing of the matte state which has an unevenness | corrugation on the surface, or the thing which provided the hole or the convex part in the end.

  Moreover, the 1st metal plate 12 and the 2nd metal plate 13 of the nameplate 10 concerning the said embodiment are formed with stainless steel. On the other hand, you may form them with other metals, such as copper, aluminum, cobalt, nickel, a ferrite, chromium, and those alloys. Moreover, the 1st metal plate 12 and the 2nd metal plate 13 may be formed with a different metal. Further, the resin member may not be formed by the two members of the resin frame 11 and the transparent resin plate 14, but may be a single member obtained by integrating them. Furthermore, the transparent resin plate 14 may not be transparent but may be a non-transparent resin plate.

  The resin frame 11 of the nameplate 10 according to the above embodiment is made of ABS (acrylonitrile butadiene styrene) resin, and the transparent resin plate 14 is made of methacrylic resin. On the other hand, you may make both members into the same resin material, or form them with other thermoplastic resins, such as a polyethylene resin, a polypropylene resin, and a vinyl chloride resin. Moreover, you may form them with thermosetting resins, such as a phenol resin, a polyester resin, an epoxy resin, a urea resin, and a melamine resin.

  The nameplate 10 according to the above embodiment is a controlled object by screwing holes 15, 16, 17, and 18 penetrating the first metal plate 12, the transparent resin plate 14, the resin frame 11, and the second metal plate 13. It comes to be attached to. On the other hand, mounting may be performed by directly bonding the second metal plate 13 to an object to be managed without providing such holes 15, 16, 17, and 18. Moreover, you may mount | wear by adhere | attaching the lower surface of resin frame 11 itself to a to-be-managed thing, without joining the 2nd metal plate 13. FIG.

  The nameplate 10 according to the above embodiment has substantially the same width dimension in the front-rear direction and the left-right direction of the first metal plate 12 and the transparent resin plate 14, and is bonded so that the front-rear, left-right edges thereof are aligned. On the other hand, the dimension of the width of the 1st metal plate 12 and the transparent resin board 14 in the front-back direction or the left-right direction may be different. FIG. 7 is a plan view of a nameplate 10A according to such a modification. The width dimension in the front-rear direction of the first metal plate 12 of the nameplate 10 </ b> A shown in this figure is slightly shorter than the width dimension in the front-rear direction of the transparent resin plate 14. Further, the width dimension in the left-right direction is substantially the same as the width dimension in the left-right direction of the transparent resin plate 14. And this 1st metal plate 12 is joined by the adhesive agent in the center position which is substantially the same distance from the front and rear edges of the transparent resin plate 14. For this reason, a part of the front and rear edge sides of the transparent resin plate 14 is exposed without being covered by the first metal plate 12. Further, a central recess that is substantially the same distance from the front and rear edges of the transparent resin plate 14 is recessed in the same shape as the outer extension of the first metal plate 12 to form a joint recess, and the first metal plate 12 is inserted into the joint recess. You may join so that it may fit. In this way, the height of the upper surface of the transparent resin plate 14 other than the bonding recess, the upper surface of the first metal plate 12, and the upper surface of the resin frame 11 other than the recess 11a are all the same, and the upper surface of the nameplate 10 is flat. Can be.

  The nameplate 10 according to the above embodiment has the resin frame 11 and the second metal plate 13 with substantially the same width in the front-rear direction and the left-right direction, and is bonded so that the front-rear and left-right edges of both are aligned. In contrast, the resin frame 11 and the second metal plate 13 may have different dimensions in the front-rear direction or the left-right direction. For example, the dimension of the width of the second metal plate 13 in the front-rear direction and the dimension of the width of the resin frame 11 in the front-rear direction are made substantially the same, The resin frame is made larger than the width dimension so that the distance from the left and right edges of the second metal plate 13 to the left and right edges of the resin frame 11 is equal, and the front and rear edges thereof substantially coincide with each other. 11 may be bonded to the lower surface. Further, one or a plurality of holes for screwing may be formed in the outer portion of the second metal plate 13 extending on the left and right sides of the resin frame 11. By doing so, it becomes possible to attach the nameplate 10 to the controlled object by screwing the hole of the second metal plate 13, and the resin frame 11, the first metal plate 12, and the transparent resin plate. Since it is not necessary to provide a hole penetrating through 14, the length of the screw used for mounting can be further shortened.

It is a top view of the nameplate concerning the embodiment of the present invention. It is an AA partial sectional view and a BB partial sectional view of a nameplate shown in FIG. It is the figure which looked at the nameplate shown in FIG. It is the front view which looked at the nameplate shown in FIG. 1 from the front. It is a figure which shows schematic structure of an RFID unit. It is a figure which shows a mode that a magnetic flux leak path is formed. It is a top view of the nameplate concerning the modification of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Name plate, 11 ... Resin frame, 11a ... Recess, 11b ... RFID accommodation space, 12 ... First metal plate, 13 ... Second metal plate, 14 ... Transparent resin plate, 20 ... RFID unit, 21 ... Antenna coil, 25 ... Semiconductor chip, 22 ... Core member, 23 ... Copper wire, 26 ... CPU, 27 ... Memory, 28 ... Transceiver, 29 ... Capacitor, 15, 16, 17, 18 ... Hole, 40 ... Magnetic flux leakage path, 50 ... Seal Material

Claims (4)

An RFID unit;
A resin member for housing the RFID unit;
A metal plate joined to the resin member so that the RFID unit of the resin member is covered;
A nameplate characterized by comprising. The resin member is
A flat, substantially rectangular parallelepiped is formed with a resin frame having a recess in the center and a resin plate that enters the recess,
The metal plate is
A first metal plate bonded to the upper surface of the resin plate; and a second metal plate bonded to the lower surface of the resin frame.
The nameplate according to claim 1, wherein: One or a plurality of holes penetrating the resin frame, the resin plate, the first metal plate, and the second metal plate in the vertical direction are formed.
The nameplate according to claim 2, wherein: As for the said metal plate, a part of own surface is joined to the said resin member, and the one or some hole is formed in the part extended on the outer side of the said resin member,
The nameplate according to claim 1 or 2, characterized in that.

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