JP2006048366A - Non-contact IC tag sheet manufacturing method, non-contact IC tag sheet manufacturing apparatus, interposer mounting method, and interposer mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a manufacturing method capable of simply and easily manufacturing a sheet with a non-contact IC tag.
A manufacturing method includes a step of supplying an IC chip mounted sheet 10, a step of sequentially forming an interposer 2 from a conveyed IC chip mounted sheet, and the formed interposer at a constant rotational speed. And holding the holding member 42 of the carrying member 41 rotating in step, carrying the carrying body 20, and sequentially mounting the interposer on the carrying body to be carried. The IC chip mounted sheet is conveyed at a low first speed. The mounted body is transported at a high-speed second speed. The holding unit moves at the first speed when receiving the interposer, and the holding unit moves at the second speed when mounting the interposer.

Description

  The present invention relates to a manufacturing method and a manufacturing apparatus for manufacturing a sheet with a non-contact IC tag having a non-contact IC tag that can exchange data with an external reader / writer in a non-contact manner. The present invention also relates to an interposer mounting method and mounting device for manufacturing a sheet with a non-contact IC tag.

  2. Description of the Related Art As a non-contact IC tag that exchanges data without contact with an external reader / writer, an RFID tag that includes an antenna formed on a base sheet and having a pair of contacts and an interposer is known.

  Of these, the interposer has a pair of enlarged electrodes and an IC chip having a pair of electrodes joined to different enlarged electrodes, and each enlarged electrode of the interposer is electrically connected to a different contact of the antenna. It is connected. The shape of the antenna is determined by the frequency of electromagnetic waves when data is transmitted and received between the IC tag and the reader / writer.

  As a method for manufacturing such an interposer, a pair of conductors extending in the feeding direction is provided on a non-conductor sheet, and then an IC chip is continuously mounted between the pair of conductors. An attached sheet (also referred to as an IC chip mounted sheet) is produced. And by cutting this sheet with an interposer for each IC chip, individual interposers can be obtained.

  On the other hand, the antenna is also continuously formed as an antenna-formed sheet by forming a plurality of antennas on a base material sheet extending in a strip shape by printing, foil transfer, etching, etc. Individual antennas can be obtained by cutting the antenna.

  In this case, the non-contact IC tag produced by joining the interposer and the antenna cuts the sheet with the interposer for each IC chip to form the interposer, and the interposer is formed on the sheet-like antenna-formed sheet. By successively mounting, a sheet with a non-contact IC tag in which a large number of non-contact IC tags are formed on a sheet extending in a strip shape is continuously manufactured, and the sheet with the non-contact IC tag is cut for each IC tag. It is desirable in terms of production efficiency to obtain the above.

  For this reason, development of the manufacturing method of such a sheet | seat with a non-contact IC tag is performed (for example, refer patent document 1).

  Note that the interposer itself can be used as a non-contact IC tag depending on the frequency band of the electromagnetic wave used when transmitting / receiving data to / from the reader / writer. In this case, the pair of enlarged electrodes function as an antenna, but the pair of enlarged electrodes may be joined to the antenna of the antenna-formed sheet in order to facilitate mounting on the final product or a packaging body for packaging the product. is there.

  In addition, an interposer that functions as a non-contact IC tag may be directly mounted on a product or a package that wraps the product. Similarly, in this case, a sheet with an interposer is cut for each IC chip on a sheet-like mounted body, for example, a plastic sheet cut to form a card or a vinyl sheet cut to form a packaging bag. It is preferable in terms of production efficiency that the formed interposers are sequentially mounted.

The term interposer in the present application is a concept including an interposer that itself functions as a non-contact IC tag. Further, the term “sheet with non-contact IC tag” in the present application is a non-contact type in which an interposer that itself functions as a non-contact IC tag is mounted on a sheet-like mounted body other than the antenna-formed sheet. It is a concept that includes a sheet with an IC tag.
JP 2003-281491 A

  When trying to manufacture a non-contact IC tag-attached sheet from an interposer-attached sheet and an antenna-formed sheet, one interposer is placed on the antenna-formed sheet while one interposer is formed from the interposer-attached sheet. A sheet with a non-contact IC tag for one non-contact IC tag must be manufactured. That is, while the sheet with interposer is conveyed by one interposer, the antenna-formed sheet is conveyed by one antenna.

  By the way, since the interposer is smaller than the antenna, the interposer is arranged at a relatively small pitch in the sheet with the interposer, while the antenna is arranged at a relatively large pitch in the antenna-formed sheet. Therefore, the conveyance speed of the interposer-attached sheet and the conveyance speed of the antenna-formed sheet are not the same, and the conveyance speed of the antenna-formed sheet must be increased.

  On the other hand, it is difficult to handle an interposer having a small shape and a thin thickness and an antenna-formed sheet. Furthermore, if the interposer is not accurately mounted on the antenna-formed sheet, the manufactured non-contact IC tag will not function.

  Therefore, in the case where an interposer is sequentially formed from a sheet with an interposer and the formed interposer is sequentially mounted on an antenna-formed sheet with high accuracy to manufacture a sheet with a non-contact IC tag, the following two methods are conceivable.

  In the first method, the interposer-attached sheet and the antenna-formed sheet are intermittently conveyed, and the receiving of the interposer and the mounting of the interposer by the mounting means are stopped for the interposer-attached sheet and the antenna-formed sheet, respectively. To do in the state. The second method uses mounting means that can synchronize the transport of the formed interposer and the transport of the antenna-formed sheet on which the interposer is mounted, and synchronizes the interposer with the transport speed of the interposer. Receiving and mounting the interposer on the antenna-formed sheet while synchronizing with the conveying speed of the antenna-formed sheet.

  However, the first method is not suitable for manufacturing a non-contact IC tag-attached sheet smoothly and at high speed. On the other hand, according to the second method, the sheet with the non-contact IC tag can be manufactured smoothly and continuously at a high speed. Patent Document 1 described above also uses the second method.

  Patent Document 1 discloses a mounting means including a first transport device that synchronizes with the transport speed of the formed interposer and a second transport device that synchronizes with the transport speed of the antenna-formed sheet on which the interposer is mounted. Yes. The interposer is transferred from the first transfer device to the second transfer device. In order to transfer the interposer with high accuracy, the first transfer device and the second transfer device are further synchronized at the time of transfer. It has become.

  That is, the control of the manufacturing apparatus disclosed in Patent Document 1 is very complicated. For this reason, even if the interposer can be mounted on the antenna-formed sheet with high accuracy, there is a limit to mounting the interposer continuously and smoothly at high speed.

  Such a problem also occurs when the interposer is successively and sequentially mounted on a mounted body other than the antenna-formed sheet, for example, the above-described plastic sheet or vinyl sheet.

  The present invention has been made in consideration of the above points, and the interposer can be continuously and smoothly and accurately mounted on a mounted body such as an antenna-formed sheet. To provide a manufacturing method for a sheet with a non-contact IC tag, a manufacturing apparatus for a sheet with a non-contact IC tag, a mounting method for an interposer, and a mounting apparatus for an interposer, which can manufacture the attached sheet simply and easily. Objective.

  The present invention provides an IC chip mounted sheet having a first non-conductive sheet, a conductor disposed on the first non-conductive sheet, and a plurality of IC chips provided on the conductor. A process of feeding and supplying at a speed, an IC chip mounted sheet conveyed at a first speed is punched or cut for each IC chip, and an interposer having an enlarged electrode made of a conductor and an IC chip is sequentially provided A step of forming, a step of transporting the formed interposer while being held by a transport member that rotates at a constant rotational speed, a step of transporting and supplying a sheet-like mounted body at a second speed, A step of sequentially mounting an interposer transported by a transport member on a mounted body transported at two speeds, between a holding unit for holding the interposer of the transport member and a rotation shaft of the transport member Distance And the holder moves at the first speed when receiving the interposer, and the holder moves at the second speed when the interposer is mounted. It is.

  According to the present invention, the mounted body includes a non-contact IC tag having a second non-conductive sheet and an antenna-formed sheet having a plurality of antennas provided on the second non-conductive sheet. It is a manufacturing method of an attached sheet.

  The present invention is a method for manufacturing a sheet with a non-contact IC tag, wherein the IC chip mounted sheet is supplied so that the interposer is formed at a predetermined time interval.

  The present invention is a method for producing a sheet with a non-contact IC tag, further comprising a step of supplying an adhesive material in advance to a portion on which an interposer is mounted on a mounted body.

  The present invention is the method for manufacturing a sheet with a non-contact IC tag, wherein the interposer is positioned by a positioning guide formed in a holding portion of the conveying member and held by the holding portion.

  The present invention is a method for manufacturing a sheet with a non-contact IC tag, wherein the interposer is sequentially transported by a plurality of transport members centered on the same rotation axis.

  The present invention provides a method for producing a sheet with a non-contact IC tag, wherein the formed interposer is sucked and held by the holding portion of the conveying member by being sucked by a suction mechanism that communicates with the holding portion of the conveying member It is.

  The present invention is a method for manufacturing a sheet with a non-contact IC tag, wherein when the interposer is mounted, the interposer is pressed toward the mounted body by a discharge mechanism that communicates with the holding portion of the conveying member.

  The present invention provides an IC chip mounted sheet having a first non-conductive sheet, a conductor disposed on the first non-conductive sheet, and a plurality of IC chips provided on the conductor. IC chip mounted sheet supply device that is transported and supplied at a speed, a mounted body supply device that transports and supplies a sheet-like mounted body at a second speed higher than the first speed, and an IC chip mounting that is transported An interposer forming device for forming an interposer having an enlarged electrode made of a conductor and an IC chip by punching or cutting a finished sheet for each IC chip, and a holding portion for holding the interposer are rotatable. And a mounting device that receives the interposer, transports it, and mounts it on the mounted body, and the distance between the holding member holding portion of the mounting device and the rotation shaft of the transport member varies automatically. It is a non-contact IC apparatus for manufacturing tagged sheet characterized by at.

  According to the present invention, the mounted body includes a non-contact IC tag having a second non-conductive sheet and an antenna-formed sheet having a plurality of antennas provided on the second non-conductive sheet. It is a manufacturing apparatus of an attached sheet.

  The present invention is the apparatus for manufacturing a sheet with a non-contact IC tag, wherein the mounting apparatus has a plurality of conveying members.

  The present invention is the apparatus for manufacturing a sheet with a non-contact IC tag, characterized in that a positioning guide for positioning the interposer is formed in the holding portion of the conveying member of the mounting apparatus.

  The present invention is the apparatus for manufacturing a sheet with a non-contact IC tag, wherein the conveying member of the mounting apparatus further includes a columnar columnar portion that is coupled to the holding unit and is slidable with respect to the rotation shaft.

  The present invention is the apparatus for manufacturing a sheet with a non-contact IC tag, characterized in that the mounting device further includes a side plate that is arranged orthogonal to the rotation axis of the conveying member and engages with the conveying member.

  In the present invention, the side plate is a disc disposed eccentrically with respect to the rotation axis of the conveying member, and the engaging portion provided along the outer periphery of the side plate is engaged with the conveying member. It is a manufacturing apparatus of a sheet with a contact IC tag.

  According to the present invention, the IC chip mounted sheet supply apparatus has a control unit that controls the supply of the IC chip mounted sheet, and the control unit is configured such that the portion of the IC chip mounted sheet on which the IC chip is arranged has a certain time interval. An apparatus for manufacturing a sheet with a non-contact IC tag, wherein the supply of an IC chip mounted sheet is controlled so as to be opened and fed into an interposer forming apparatus.

  The present invention is the apparatus for manufacturing a sheet with a non-contact IC tag, wherein the interposer forming apparatus has a rotary cutter.

  The present invention is a manufacturing apparatus for a sheet with a non-contact IC tag, further comprising a suction mechanism that communicates with a conveyance member of a mounting apparatus, and the interposer is sucked and held by a holding portion of the conveyance member by the suction mechanism. .

  The present invention further includes a discharge mechanism that communicates with the conveying member of the mounting apparatus, and the interposer is pressed toward the mounted body and mounted by the discharge mechanism, and the apparatus for manufacturing a sheet with a non-contact IC tag is provided. It is.

  The present invention is a manufacturing apparatus for a sheet with a non-contact IC tag, further comprising an impression cylinder arranged to face the mounting apparatus, wherein the mounted body is fed between the mounting apparatus and the impression cylinder. .

  The present invention is characterized by further comprising a guide guide that is arranged along the mounting apparatus, has an outer shape corresponding to the movement locus of the holding portion of the conveying member of the mounting apparatus, and guides the interposer to be conveyed. It is an apparatus for manufacturing a sheet with a non-contact IC tag.

  The present invention includes a step of sequentially supplying an interposer having an enlarged electrode and an IC chip, a step of transporting the supplied interposer while being held by a transport member that rotates at a constant rotational speed, The method includes a step of transporting and supplying a mounted body at a constant speed and a step of sequentially mounting an interposer transported by a transport member on the transported mounted body, and holding the interposer of the transport member The distance between the holding part to be rotated and the rotation axis of the conveying member varies, and when the interposer is mounted, the holding part moves at the same speed as the conveying speed of the mounted object. This is an interposer mounting method that implements an interposer.

  The present invention is the mounting method of the interposer, wherein the mounted body includes an antenna-formed sheet having a non-conductive sheet and a plurality of antennas provided on the non-conductive sheet.

  The present invention is an interposer mounting apparatus for mounting an interposer having an enlarged electrode and an IC chip on a sheet-like mounted body that is conveyed at a constant speed, and a holding unit that receives and holds the interposer The interposer mounting apparatus is characterized in that a distance between the holding portion of the conveyance member and the rotation axis of the conveyance member is variable.

  The present invention is the interposer mounting apparatus, wherein the mounted body includes an antenna-formed sheet having a non-conductive sheet and a plurality of antennas provided on the non-conductive sheet.

  According to the present invention, the interposer can be continuously, smoothly and accurately mounted on the mounted body, and thereby the non-contact IC tag-attached sheet can be manufactured simply and easily.

  Embodiments of the present invention will be described below with reference to the drawings.

[Sheet with non-contact IC tag]
First, the non-contact IC tag-attached sheet 1 manufactured according to the present invention will be described with reference to FIG.

  FIG. 9 is a cross-sectional view of the sheet 1 with a non-contact IC tag.

  As shown in FIG. 9, the non-contact IC tag-attached sheet 1 includes an interposer 2 having an enlarged electrode 14 and an IC chip 15 connected to the enlarged electrode 14, and a base sheet 21 (second non-conductor sheet 21). And an antenna-formed sheet (mounting object) 20 having an antenna 24 formed on the base sheet 21.

  Among these, the interposer 2 has a first non-conductive sheet 11, a pair of enlarged electrodes 14, and an IC chip 15 as shown in FIG. 9. The IC chip 15 has a pair of flat electrodes 15a as shown in FIG. 9 or electrodes with pointed tips, etc., and each electrode 15a is electrically connected (conductive) to a different enlarged electrode.

  Such an interposer 2 punches or cuts an IC chip mounted sheet 10 (also called a sheet with an interposer) as shown in FIG. 10 for each IC chip 15 (for example, along the dotted line in FIG. 10). Is obtained. In FIG. 10, an IC chip mounted sheet 10 is made of a first non-conductive sheet 11 made of paper, PET, or the like, and copper, aluminum, or the like, and the longitudinal direction of the first non-conductive sheet 11 (also referred to as a conveyance direction). And a plurality of IC chips 15 arranged (mounted) on the conductor 13.

  However, in the present invention, as long as the so-called interposer 2 having the pair of enlarged electrodes 14 and the IC chip 15 can be obtained by punching or cutting each IC chip 15, the IC chip mounted sheet 10 is It is not restricted to the structure shown in FIG. 10, Moreover, it does not specifically limit also in the manufacturing method. Therefore, the configuration of the conductor is arranged along the longitudinal direction of the first non-conductive sheet 11 instead of the pair of conductors 13 extending along the first non-conductive sheet 11 as shown in FIG. Many pairs of conductors 13 may be used.

  On the other hand, as shown in FIG. 11, the antenna-formed sheet 20 is formed in large numbers on the second non-conductive sheet 21 made of paper, PET or the like, and the second non-conductive sheet 21 made of copper or aluminum, And an antenna 24 having a pair of contacts 24a.

  However, depending on the frequency of electromagnetic waves when data is transmitted and received between the IC tag and the reader / writer, the shape of the antenna 24 and its contact 24a is different from the configuration shown in FIG. In addition, the method for forming the antenna 24 on the second non-conductive sheet 21 is not particularly limited in the present invention, and any method such as printing, foil transfer, or etching may be used.

  As shown in FIG. 9, the above-described interposer 2 is disposed on the antenna-formed sheet 20, and each enlarged electrode 14 of the interposer 2 is electrically connected (conducted) with the antenna contact 24 a of a different antenna-formed sheet 20. )is doing. In addition, the dotted line in FIG. 11 shows the part 25 where the interposer on the antenna-formed sheet 20 is arranged.

  9 shows an example of the sheet 1 with the non-contact IC tag arranged (mounted) so that the IC chip 15 of the interposer 2 and the antenna 24 of the antenna-formed sheet 20 face each other. Not limited to. As long as the enlarged electrode 14 of the interposer 2 and the contact 24a of the antenna 24 can be electrically connected, the arrangement of the interposer 2 and the antenna-formed sheet 20 may be different from the configuration shown in FIG.

  The sheet 1 with a non-contact IC tag configured as described above is punched or cut in units of the antenna 24 in a subsequent process, and individual non-contact IC tags having the interposer 2 and the antenna 24 are obtained.

[Manufacturing method and manufacturing apparatus of sheet with non-contact IC tag]
Next, referring to FIG. 1 to FIG. 8, an embodiment of a method and apparatus for manufacturing a sheet with a non-contact IC tag according to the present invention, and a method and apparatus for mounting an interposer used for manufacturing a sheet with a non-contact IC tag Will be described.

  Among these, FIG. 1 is a schematic view showing a manufacturing method and a manufacturing apparatus 5 of the non-contact IC tag-attached sheet 1 according to the present invention, and FIG.

  First, the manufacturing apparatus 5 of a non-contact IC tag attached sheet will be described.

  As shown in FIG. 1, the non-contact IC tag-attached sheet manufacturing apparatus 5 includes a first non-conductive sheet 11, a conductor 13 disposed on the first non-conductive sheet 11, and the conductor 13. An IC chip mounted sheet supply device 30 that conveys and supplies an IC chip mounted sheet 10 having a plurality of IC chips 15 provided at a first speed, a second non-conductive sheet 21, and the second A mounted body supply device 35 that transports and supplies an antenna-formed sheet (mounted body) 20 having a plurality of antennas 24 provided on the non-conductive sheet 21 at a second speed higher than the first speed; Interposer formation for punching or cutting the IC chip mounted sheet 10 to be conveyed for each IC chip 15 to form the interposer 2 having the enlarged electrode 14 made of the conductor 13 and the IC chip 15 Device 60 and a holding device 42 that holds the interposer 2, a transport member 41 that rotates at a constant rotation speed, receives the interposer 2, transports it, and mounts it on the antenna-formed sheet 20 40.

  In addition, the non-contact IC tag-attached sheet manufacturing apparatus 5 transports the interposer 2 formed by the interposer forming apparatus 60 to the mounting apparatus 40 between the interposer forming apparatus 60 and the mounting apparatus 40. A conveyor 77 is further provided.

  Furthermore, the non-contact IC tag-attached sheet manufacturing apparatus 5 further includes an impression cylinder 74 disposed to face the mounting apparatus 40, and the antenna-formed sheet 20 is sent between the mounting apparatus 40 and the impression cylinder 74.

  Furthermore, the non-contact IC tagged sheet manufacturing apparatus 5 is arranged along the mounting apparatus 40 and has an outer shape corresponding to the movement locus of the holding portion 42 of the conveying member 41 of the mounting apparatus 40 and is conveyed. A guide 72 for guiding the interposer 2 is further provided.

  Among them, the IC chip mounted sheet supply device 30 includes a first transport roller 31 that transports the IC chip mounted sheet 10, a first photographing unit 33 that photographs the conveyed IC chip mounted sheet 10, and a first photographing. And a first control unit 34 that receives an image from the unit 33. The first transport roller 31 transports the IC chip mounted sheet 10 at a low first speed.

  Projections (not shown) are formed on the surface of the first transport roller 31 at equal intervals. These protrusions engage with first through holes 17 (FIG. 10) formed in advance in the vicinity of both edges in the width direction of the IC chip mounted sheet 10 at equal intervals.

  The first control unit 34 detects a shift in the arrangement pitch of the IC chips 15 on the IC chip mounted sheet 10 based on an image from the first imaging unit 33 that images the conveyed IC chip mounted sheet 10. When the first control unit 34 detects a shift in the arrangement pitch of the IC chips 15, the first control unit 34 sends a signal to the first transport roller 31, and the portion of the IC chip mounted sheet 10 where the IC chips 15 are arranged is always at regular intervals. The supply of the IC chip mounted sheet 10 is controlled so that the sheet is fed into the interposer forming apparatus 60 with a gap.

  That is, when receiving a signal from the first control unit 34, the first transport roller 31 interrupts the transport of the IC chip mounted sheet 10 at the first speed, and adjusts the pitch of the IC chip mounted sheet 10. For example, when the arrangement pitch of the IC chips 15 is wider than the planned pitch, the pitch adjustment is performed by feeding the IC chip mounted sheet 10 at a speed higher than the first speed, and conversely, when the arrangement pitch is narrow. Is performed by sending the IC chip mounted sheet 10 at a lower speed than the first speed or by temporarily stopping the IC chip mounted sheet 10.

  On the other hand, when the IC chip mounted sheet 10 is accurately manufactured and the IC chips 15 are arranged on the IC chip mounted sheet 10 at a predetermined arrangement pitch, the first transport roller 31 is the IC chip. Only the IC chip mounted sheet 10 is conveyed without adjusting the pitch of the mounted sheet 10. That is, the IC chip mounted sheet supply device 30 always conveys and supplies the IC chip mounted sheet 10 at the first speed.

  Note that the pitch adjustment of the IC chip mounted sheet 10 by the first transport roller 31 based on the signal from the first control unit 34 is such that an interposer forming device 60 described later is in contact with the IC chip mounted sheet 10. In other words, in other words, it is performed while the portion of the IC chip mounted sheet 10 where the IC chip 15 is arranged is not sent to the interposer forming apparatus 60, that is, not passing through the interposer forming apparatus 60. In other words, when the interposer forming apparatus 60 performs the interposer 2 forming operation, the IC chip mounted sheet 10 is conveyed at a constant first speed.

  As described above, the IC chip mounted sheet supply device 30 not only conveys the IC chip mounted sheet 10 at the first speed, but also adjusts the pitch of the IC chip mounted sheet 10 as necessary. In other words, the IC chip mounted sheet supply device 30 controls the supply of the IC chip mounted sheet 10 by combining conveyance and pitch adjustment.

  In the present embodiment, the IC chip mounted sheet supply device 30 has shown an example in which the IC chip mounted sheet 10 prepared in advance and wound up in a roll shape is conveyed and supplied. However, the present invention is not limited thereto. Absent. The IC chip mounted sheet supply device 30 itself may prepare to prepare the IC chip mounted sheet 10 and may convey and supply the manufactured IC chip mounted sheet 10. In this case, the manufacturing method of the IC chip mounted sheet 10 is not particularly limited as described above, and a single conductor 13 is laminated on the first non-conductive sheet 11, and only a pair of the conductors 13 are paired. The IC chip 15 is mounted after being divided, or the IC chip 15 is mounted after laminating the pair of conductors 13 on the first non-conductive sheet 11, or the conductive ink is applied on the first non-conductive sheet 11. After forming the pair of conductors 13 by printing, the IC chip 15 is mounted, or after forming the pair of conductors 13 on the first non-conductor sheet 11 by etching or foil transfer, the IC chip 15 is mounted. In other words, the IC chip mounted sheet 10 can be produced.

  Next, the mounted body supply device 35 will be described in detail.

  Similarly to the IC chip mounted sheet supply apparatus 30, the mounted body supply apparatus 35 includes a second conveyance roller 36 that conveys the antenna-formed sheet 20 and a second photographing unit that photographs the conveyed antenna-formed sheet 20. 38 and a second control unit 39 that receives an image from the second photographing unit 38. The second transport roller 36 transports the antenna-formed sheet 20 at a high second speed that is faster than the low first speed.

  Projections (not shown) are formed at equal intervals on the surface of the second transport roller 36. The protrusions engage with second through holes 27 (FIG. 11) formed in advance in the vicinity of both edges in the width direction of the antenna-formed sheet 20 at equal intervals.

  The second control unit 39 shifts the arrangement pitch of the antenna 24 on the antenna-formed sheet 20 based on the image from the second photographing unit 38 that photographs the conveyed antenna-formed sheet 20, and more specifically, the antenna-formed A shift in the arrangement pitch of the portion 25 where the interposer of the sheet 20 is mounted is detected. When the second control unit 39 detects a shift in the arrangement pitch of the antenna 24, the second control unit 39 sends a signal to the second transport roller 36, and the portion 25 on which the interposer of the antenna-formed sheet 20 is mounted always has a certain time interval. Then, the feeding of the antenna-formed sheet 20 is controlled so as to be fed between the mounting device 40 and the impression cylinder 74.

  That is, when receiving a signal from the second control unit 39, the second transport roller 36 interrupts the transport of the antenna-formed sheet 20 at the second speed, and adjusts the pitch of the antenna-formed sheet 20. The pitch adjustment is performed, for example, by sending the antenna-formed sheet 20 at a speed higher than the second speed when the arrangement pitch of the antenna 24 (the portion 25 on which the interposer is mounted) is wider than the planned pitch. On the contrary, when the arrangement pitch is narrow, the antenna formed sheet 20 is fed at a speed lower than the second speed, or the antenna formed sheet 20 is temporarily stopped.

  On the other hand, when the antenna-formed sheet 20 is manufactured with high accuracy and the antenna 24 is formed on the antenna-formed sheet 20 at a predetermined arrangement pitch, the second transport roller 36 has a pitch of the antenna-formed sheet 20. Only the antenna-formed sheet 20 is conveyed without adjustment. That is, the mounted body supply device 35 always conveys and supplies the antenna-formed sheet 20 at the second speed.

  The pitch adjustment of the antenna-formed sheet 20 by the second transport roller 36 based on the signal from the second control unit 39 is such that the portion 25 on which the interposer of the antenna-formed sheet 20 is mounted is connected to the mounting device 40. It is performed while not passing between the impression cylinder 74, that is, while not passing between the mounting apparatus 40 and the impression cylinder 74. In other words, when the interposer 2 is mounted on the antenna-formed sheet 20 from the conveyance member 41 of the mounting apparatus 40, the antenna-formed sheet 20 is conveyed at the second speed that is the conveyance speed of the interposer 2. Is done.

  In this way, the mounted body supply device 35 not only carries the antenna-formed sheet 20 at the second speed, but also adjusts the pitch of the antenna-formed sheet 20 as necessary. That is, the mounted object supply device 35 controls the supply of the antenna-formed sheet 20 by combining conveyance and pitch adjustment.

  In the present embodiment, the mounted body supply device 35 has shown an example in which the antenna-formed sheet 20 prepared in advance and wound up in a roll shape is conveyed and supplied. However, the present invention is not limited to this. The mounted body supply device 35 further includes a device capable of forming the antenna 24 on the second non-conductive sheet 21 by printing, transferring, etching, or the like, and the mounted body supply device 35 itself is an antenna-formed sheet. 20 may be prepared and the produced antenna-formed sheet 20 may be conveyed and supplied.

  Next, the interposer forming apparatus 60 will be described in detail.

  In the present embodiment, the interposer forming device 60 includes a rotary cutter 61 that is rotatable and has a plurality of cutting blades 61 a provided at equal intervals on the outer surface, and a rotary cutter 61 that is disposed to face the rotary cutter 61. It has the receiving roller 62 which receives the blade 61a. The rotary cutter 61 rotates at a constant rotational speed, and the interposer 2 is sequentially formed from the IC chip mounted sheet 10 fed to the interposer forming device 60 by the cutting blade 61a of the rotary cutter 61.

  Note that the residue after the interposer 2 of the IC chip mounted sheet 10 is cut or punched is collected by a collection mechanism (not shown).

  Next, the mounting apparatus 40 will be described in detail with reference to FIGS.

  As shown in FIGS. 2 to 6, the mounting apparatus 40 includes a transport member 41 having the above-described holding portion 42, a rotation shaft 50 of the transport member 41, and a transport member that is connected to the rotation shaft 50 via a connection shaft 51. A drive mechanism 52 that rotates 41, a pair of side plates 55 and 56 that are arranged orthogonal to the rotation shaft 50, engage with the conveyance member 41, and also function as bearings for the rotation shaft 50, and are conveyed through the conveyance member 41. And a spring 54 disposed between the holding portion 42 of the member 41 and the rotating shaft 50.

  2 is a cross-sectional view showing the mounting apparatus 40 as described above, and FIGS. 3 and 4 are side views showing the mounting apparatus 40 with one side plate 55 removed. 3 shows a state when the holding unit receives the interposer 2, and FIG. 4 shows a state when the interposer 2 is mounted from the holding unit. In the mounting apparatus 40 shown in FIGS. 2 to 4, only one conveying member 41 is shown for easy understanding. However, in practice, as shown in FIG. 1, the mounting apparatus 40 preferably includes a plurality of conveying members 41.

  First, the conveyance member 41 will be further described in detail.

  As shown in FIGS. 2 to 4, the transport member 41 includes a holding portion 42 that holds the interposer 2 and a columnar columnar portion 46 that is connected to the holding portion 42 and penetrates the rotation shaft 41. . As can be understood from the conveying member 41 located on the right side in FIG. 1, the connection between the holding portion 42 and the columnar portion 46 is rotatable.

  Among these, the columnar part 46 is slidable with respect to the rotating shaft 41, and thus the distance between the holding part 42 and the rotating shaft 50 is freely variable.

  On the other hand, the holding portion 42 has a pair of rotatable rollers 45 and 45 that are provided on both sides and are rotatable. Further, as shown in FIG. 5, a flat holding surface 42 a made of a quadrangle corresponding to the shape of the interposer 2 and on which the interposer 2 is disposed is formed on the upper surface of the holding portion 42. Further, a positioning guide 42b is formed on the periphery of the holding surface 42a. The positioning guide 42b includes four inclined surfaces that are inclined toward the holding surface 42a. The positioning guide 42b positions the interposer 2 on the holding surface 42a as shown in FIG. Further, the height of the positioning guide 42b is lower than the thickness of the interposer 2 (FIG. 6). Furthermore, the holding part 42 has a narrow hole 44 communicating with the holding surface 42a. The narrow hole 44 will be further described later.

  5 is a perspective view showing the holding portion 42, and FIG. 6 is a cross-sectional view taken along the line VI-VI in FIG. 5 and 6, the moving direction of the holding portion 42 is indicated by a thick arrow, and the rotary roller 45 is omitted in the drawings.

  Next, the side plates 55 and 56 will be described in further detail.

  The side plates 55 and 56 are discs arranged eccentrically with respect to the rotation shaft 50. That is, the centers of the side plates 55 and 56 are arranged at positions shifted from the rotation shaft 50. On the inner side of the side plates 55 and 56 (on the side facing the conveying member 41), there are provided engaging portions 55a and 56a, which are provided along the outer periphery of the side plates 55 and 56, respectively, and thus are formed of a step rail. It has been. The engaging portions 55a and 56a are respectively engaged with the rotating rollers 45 and 45 of the holding portion 42 of the conveying member 41 described above (FIG. 2).

  The mounting apparatus 40 having such a configuration rotates the transport member 41 by rotating the rotating shaft 50 via the connecting shaft 51 by the drive mechanism 52. In this case, since the columnar portion 46 of the conveying member 41 is slidable with respect to the rotating shaft 50, the engaging portions 55 a and 56 a of the side plates 55 and 56 and the rotating roller 45 of the conveying member 41 are engaged. The distance between the holding part 42 of the conveying member 41 and the rotating shaft 50 varies.

  In the present embodiment, the spring 54 disposed between the holding portion 42 and the rotating shaft 50 is a tension spring, and connects the holding portion 42 and the rotating shaft 50. Therefore, the holding portion 42 is biased by the spring 54 so as to approach the rotating shaft 50, and the rotating roller 45 of the holding portion 42 always rolls on the engaging portions 55 a and 56 a of the side plates 55 and 56. Thereby, the holding part 42 of the conveying member 41 moves circumferentially along the engaging parts 55 a and 56 a of the side plates 55 and 56.

  Further, in the present embodiment, as shown in FIG. 2, the lower surface of the holding portion 42 is engaged with the engaging portions 55a and 56a of the side plates 55 and 56, and the holding portion 42 and the columnar portion 46 are not rotated. Since it is movably connected, the holding surface 42a of the holding portion 42 moves so as to substantially follow the tangent line at each outer peripheral portion of the side plates 55 and 56 (FIG. 1).

  Further, since the distance between the holding portion 42 of the transport member 41 and the rotating shaft 50 varies, the moving speed of the holding portion 42 changes. In the present embodiment, the moving speed of the holding part 42 in the state where the distance between the holding part 42 and the rotating shaft 50 shown in FIG. 3 is the shortest is the first speed, and the holding part 42 shown in FIG. The moving speed of the holding portion 42 in the state where the distance from the rotation shaft 50 is the longest is the second speed.

  By the way, as shown in FIG. 1, in this Embodiment, the manufacturing apparatus 5 of the sheet | seat 1 with a non-contact IC tag is further provided with the suction mechanism 64 which attracts | sucks air, and the discharge mechanism 66 which discharges air. . Further, as described above, the mounting apparatus 40 has the narrow hole 44 that communicates with the holding surface 42 a of the holding portion 42 of the transport member 41. The narrow hole 44 communicates with the suction mechanism 64 and the discharge mechanism 66 through a control valve (not shown).

  In this case, the mounting apparatus 40 includes a region A from a position where the holding portion 42 of the conveying member 41 receives the interposer 2 to a position just before facing the impression cylinder 74, and a region B where the holding portion 42 faces the impression cylinder 74. And the region C until the holding part 42 passes the impression cylinder 74 and immediately before the interposer 2 is received.

  The control valve communicates the fine hole 44 corresponding to the holding part 42 in the region A to the suction mechanism 64 and is disconnected from the discharge mechanism 66, and communicates the fine hole 44 corresponding to the holding part 42 in the region B to the discharge mechanism 66. At the same time, the suction mechanism 64 is cut off, and the narrow hole 44 corresponding to the holding portion 42 in the region C is cut off from the suction mechanism 64 and the discharge mechanism 66.

  As a result, the holding unit 50 sucks and holds the interposer 2 in the region A, and the sucking and holding interposer 2 is transported by the transport member 41 rotating at a constant speed. In this case, the interposer 2 is transported at a second transport speed that is higher than the first low speed described above.

  Further, the rotating body 40 releases the interposer 2 attracted and held in the region B. That is, the interposer 2 is transferred (mounted) on the antenna-formed sheet 20.

  Furthermore, as shown in FIG. 4, the non-contact IC tag-attached sheet manufacturing apparatus 5 supplies an adhesive material 9 such as an adhesive to the portion 25 of the antenna-formed sheet 20 where the interposer 2 is mounted. The antenna 68 and the interposer 2 mounted thereon are bonded and fixed together with the device 68 and a method in accordance with the properties of the adhesive material 9, and the antenna 24 contact 24a of the antenna formed sheet 20 and the interposer 2 are connected to each other. A fixing device 70 for electrically connecting the enlarged electrode 14 of the poser 2 is provided.

  The adhesive material supply device 68 is a dispenser or screen printer for applying a non-conductive adhesive or anisotropic conductive adhesive, or a tape-like non-conductive adhesive or anisotropic conductive adhesive. An affixing device or the like that is affixed to the formed sheet is used.

  On the other hand, as the fixing device 70, a thermocompression bonding machine, a thermocompression bonding machine, an ultrasonic bonding machine, a welding machine, or the like is used.

  Next, a method for manufacturing the non-contact IC tag-attached sheet 1 will be described.

  First, the above-described IC chip having the first non-conductive sheet 11, the conductive body 13 disposed on the first non-conductive sheet 11, and the plurality of IC chips 15 provided on the conductive body 13. A mounted sheet 10 is prepared (FIG. 10). Then, the IC chip mounted sheet 10 is conveyed by the IC chip mounted sheet supply device 30 toward the interposer forming device 60 at a low first conveying speed.

  In this case, by engaging the first through hole 17 (FIG. 10) of the IC chip mounted sheet 10 and a projection (not shown) of the first transport roller 31, the IC chip mounted sheet 10 is orthogonal to the transport direction. Positioning can be accurately performed in the width direction, and the transport amount in the transport direction can be accurately controlled.

  Further, the conveyed IC chip mounted sheet 10 is photographed by the first photographing unit 33 as described above, and the first control unit 34 performs the IC chip mounted sheet 10 based on the video from the first photographing unit 33. It is inspected whether the arrangement pitch of the upper IC chip 15 is constant. When the arrangement pitch is not constant, the first control unit 34 sends a signal to the first conveying roller 31 to adjust the pitch of the IC chip mounted sheet 10. As a result, the portion of the IC chip mounted sheet 10 where the IC chip 15 is arranged is always sent to the interposer forming apparatus 60 with a certain time interval. As described above, the pitch adjustment of the IC chip mounted sheet 10 by the first control unit 34 is performed while the interposer 2 is not formed by the interposer forming apparatus 60 described later.

  In the interposer forming apparatus 60, the IC chip mounted sheet 10 fed between the rotary cutter 61 and the receiving roller 62 is sequentially cut for each IC chip 15.

  In this case, the part where the IC chip 15 of the IC chip mounted sheet 10 is arranged is always sent to the interposer forming apparatus 60 with a certain time interval. Further, the rotary cutter 61 provided with the cutting blades 61a at equal intervals on the outer surface rotates at a constant rotational speed. Further, the pitch adjustment of the IC chip mounted sheet 10 is performed while the rotary cutter 61 is not in contact with the IC chip mounted sheet 10. When the rotary cutter 61 contacts the IC chip mounted sheet 10, the IC chip mounting is performed. The finished sheet 10 is always conveyed at the first conveyance speed.

  Therefore, the interposer 2 having the enlarged electrode 14 made of the conductor 13 and the IC chip 15 is sequentially formed by the interposer forming device 60 at regular intervals.

  The formed interposer 2 is sequentially transported to the mounting apparatus 40 by the interposer transport conveyor 77. At this time, the conveyance speed by the interposer conveyance conveyor 77 is the first speed. Therefore, the arrangement pitch of the IC chips 15 of each interposer 2 on the interposer transport conveyor 77 is the same as the arrangement pitch of the IC chips 15 of the IC chip mounted sheet 10.

  Next, the interposer 2 transported by the interposer transport conveyor 77 is sequentially received by the transport member 41 of the mounting apparatus 40. The transport member 41 is rotated at a constant rotation speed about the rotation shaft 50 by the drive mechanism 52.

  At this time, the holding part 42 of the conveying member 41 on which the interposer 2 is arranged is located closest to the rotating shaft 50 as shown in FIG. 3, and the holding part 42 moves at the slowest speed. The moving speed of the holding part 42 at this time is the first speed, and is synchronized with the transport speed of the interposer 2. Therefore, the holding part 42 can receive the interposer 2 with high accuracy on the holding surface 42a.

  The holding portion 42 is formed with a positioning guide 42b made of an inclined surface. Therefore, even if the holding part 42 receives the interposer 2 at a position shifted from the holding surface 42 a, the interposer 2 moves the positioning guide 42 b formed of the inclined surface to the holding surface 42 a disposed at the center of the holding part 42. And positioned. Further, at this time, the narrow hole 44 communicating with the holding surface 42a communicates with the suction mechanism 64, and the interposer 2 is sucked toward the holding surface, so that this positioning effect is increased.

  In this way, the interposer 2 is accurately positioned, received by the holding portion 42, and sucked and held on the holding surface 42a of the holding portion 42.

  Thereafter, the interposer 2 is conveyed onto the antenna-formed sheet 20 while being adsorbed and held by the holding portion 42 of the conveying member 41. At this time, the rotating roller 45 of the conveying member 41 rolls on the engaging portions 55a and 56a of the side plates 55 and 56. Accordingly, as the interposer 2 is rotated from the position shown in FIG. 2 toward the position shown in FIG. 3 where the interposer 2 is mounted on the antenna-formed sheet 20, the holding portion 42 resists the elastic force of the spring 54 and rotates the rotating shaft 50. Keep away from.

  Here, the moving speed of the holding portion 42 is proportional to the distance from the rotating shaft 50. Therefore, the moving speed of the holding portion 42 gradually increases until the interposer 2 is received, conveyed, and mounted on the antenna-formed sheet 2. That is, the moving speed of the holding unit 42 increases from a low first speed when the interposer 2 is received to a high second speed when the interposer 2 is mounted. Further, as the moving speed of each holding portion 42 increases, as shown in FIG. 1, each holding portion 42 is attracted to each holding portion 42 from the position where the interposer 2 is received to the position where it is mounted on the antenna-formed sheet 20. The interval between the held interposers 2 increases.

  The interposer 2 thus accelerated is conveyed along the peripheral edges of the side plates 55 and 56. At this time, since the interposer 2 is smoothly guided and conveyed by the guide guide 72, even if the interposer 2 is conveyed while being accelerated, it can be prevented from being displaced from the holding portion 42.

  By the way, while the interposer 2 is formed from the IC chip mounted sheet 10 and the interposer 2 is conveyed, at the same time, the second non-conductive sheet 21 and a plurality of the non-conductive sheets 21 provided on the second non-conductive sheet 21 are provided. The antenna-formed sheet 20 having the antenna 24 is prepared. The antenna-formed sheet 20 is transported by the mounted body supply device 35 between the mounting device 40 and the impression cylinder 74 at a high second speed.

  In this case, by engaging the second through-hole 27 (FIG. 11) of the antenna-formed sheet 20 and a projection (not shown) of the second conveyance roller 36, the width direction perpendicular to the conveyance direction of the antenna-formed sheet 20 is obtained. In addition, the amount of conveyance in the conveyance direction can be accurately controlled.

  The conveyed antenna-formed sheet 20 is photographed by the second photographing unit 38 as described above, and the second control unit 39 receives the antenna on the antenna-formed sheet 20 from the second photographing unit 38 based on the image. It is inspected whether the arrangement pitch of the parts where 24 interposers 2 are mounted is constant. If the arrangement pitch is not constant, the second control unit 39 sends a signal to the second transport roller 36 to adjust the pitch of the antenna-formed sheet 20. As a result, the portion 25 on which the interposer is mounted is always sent between the mounting apparatus 40 and the impression cylinder 74 with a certain time interval. As described above, the pitch adjustment of the antenna-formed sheet 20 by the second control unit 39 is performed while the mounting work for the interposer 2 described later is not performed.

  In the present embodiment, as shown in FIG. 1, the adhesive material 9 is supplied by the adhesive material supply device 68 to the portion 25 of the antenna-formed sheet 20 where the interposer is mounted.

  In this way, the antenna-formed sheet 20 supplied with the adhesive material 9 is conveyed between the mounting apparatus 40 and the impression cylinder 74.

  In this case, the portion 25 on which the interposer of the antenna-formed sheet 20 is mounted is always sent between the mounting device 40 and the impression cylinder 74 with a certain time interval. Further, when the portion 25 on which the interposer of the antenna-formed sheet 20 is mounted passes between the mounting apparatus 40 and the impression cylinder 74, the conveying speed of the antenna-formed sheet 20 is always the speed of the conveying member 41 of the mounting apparatus 40. The second speed is the same as the moving speed of the holding unit 42.

  Accordingly, the interposer 2 is transported while being held by the holding portion 42 of the mounting apparatus 40 on the portion 25 where the interposer of the antenna-formed sheet 20 that is transported at the second speed that is the same as the transport speed of the interposer 2 is mounted. The positioner 2 can be made to face sequentially.

  At this time, the narrow hole 44 communicating with the holding surface 42a of the holding portion 42 that holds the interposer 2 by suction is blocked from the suction mechanism 64 by the control valve (not shown) and communicated with the discharge mechanism 66. Accordingly, the interposer 2 is released from the holding portion 42 and is pressed toward the antenna-formed sheet 20 by the air discharged from the discharge mechanism 66. Thereby, the interposer 2 is reliably mounted on the antenna-formed sheet 20 and fixed through the adhesive material 9.

  In this way, the interposer 2 is sequentially mounted on the antenna-formed sheet 20 with a certain time interval. Thereafter, the expansion device 14 of the interposer 2 and the contact 24 a of the antenna 24 of the antenna-formed sheet 20 are electrically joined by the fixing device 70.

  In the present embodiment, the example in which the adhesive material 9 is applied to the antenna 24 side of the antenna-formed sheet 2 has been shown. However, the present invention is not limited to this, and the adhesive material 9 is applied to the enlarged electrode 14 side of the interposer 2. You may make it apply | coat.

  As described above, the non-contact IC tag-attached sheet 1 having the antenna-formed sheet 20 and the interposer 2 is manufactured. Such a sheet 1 with a non-contact IC tag is cut or punched for each antenna 24, or once wound into a roll shape and then cut or punched for each antenna 24 as necessary to obtain a non-contact IC tag. It is done.

  As described above, according to the present embodiment, the interposer 2 is sequentially and continuously produced from the IC chip mounted sheet 10 conveyed at the first speed with a certain time interval. The sheet 1 with the non-contact IC tag is sequentially received and conveyed by the conveying member 41 of the mounting apparatus 40 rotating at a constant rotation speed, and sequentially mounted on the antenna-formed sheet 20 conveyed at the second speed. Manufacturing.

  Here, while the conveyance member 41 of the mounting apparatus 40 according to the present embodiment rotates at a constant speed, the holding portion 42 that holds the interposer 2 of the conveyance member 41 varies in distance from the rotation shaft 50 and moves. The speed can be increased or decreased. Therefore, when the interposer 2 is received, the holding unit 42 can be moved in synchronization with the conveyance speed of the IC chip mounted sheet 10, and when the interposer 2 is mounted on the antenna formed sheet 20, The holding unit 42 can be moved in synchronization with the conveyance speed of the antenna-formed sheet 20 that is faster than the conveyance speed of the mounted sheet 10.

  Thereby, the mounting apparatus 40 can receive the interposer 2 on the holding portion 42 of the conveying member 41 in a state where the interposer 2 is accurately positioned, and further arrange the interposer 2 on the antenna-formed sheet 20 accurately. You can also. Thereby, an interposer can be mounted with high accuracy.

  In this case, since the positioning guide 42 b is formed on the holding portion 42, the interposer 2 can be positioned more accurately on the holding surface 42 a of the holding portion 42.

  Further, the antenna arrangement interval on the antenna-formed sheet 20, that is, the interposer is mounted, as compared with the arrangement interval of the IC chips 15 on the IC chip-mounted sheet 10, that is, the interval between the portions forming the interposer. The interval between the portions 25 to be processed is wide and the intervals do not match. For this reason, when the IC chip mounted sheet 10 is punched or cut to sequentially produce the interposer 2 and continuously mounted on the antenna formed sheet, the IC chip mounted sheet 10 and the antenna formed sheet are formed. The conveyance speed of 20 is different. However, according to the present embodiment, as described above, both the IC chip mounted sheet 10 and the antenna formed sheet 20 can be obtained by changing the moving speed while the holding unit 42 holds the interposer 2. Instead of intermittently conveying the two, the two can be conveyed at a constant speed, and the holding portion 42 can be synchronized with these conveying speeds, so that the interposer 2 can be continuously and smoothly mounted on the antenna-formed sheet 20. .

  Further, the transport member 41 of the mounting apparatus 40 is only rotated at a constant rotational speed by the drive mechanism 52, and the distance between the holding portion 42 of the transport member 41 and the rotation shaft 50 is simply the rotating roller 45 of the holding portion 42. And the engaging portions 55a and 56a of the side plates 55 and 56 are merely controlled. Therefore, the control of the mounting apparatus 40 is very simple and easy.

  From these, the whole manufacturing apparatus 5 of a non-contact IC tag-attached sheet can be controlled simply and easily, and thereby the non-contact IC tag-attached sheet 1 can be manufactured simply and easily.

  Furthermore, when manufacturing a sheet with a non-contact IC tag by changing the combination of the arrangement interval of the IC chips 15 on the IC chip-mounted sheet 10 and the arrangement interval of the antennas on the antenna-formed sheet 20, the first speed It is necessary to change the ratio between the second speed and the second speed. In this case, the moving speed of the holding portion 42 can be changed by changing the shape of the side plates 55 and 56 used in the mounting device 40, more specifically, the shape of the engaging portions 55a and 56a of the side plates 55 and 56. . Thus, by preparing a large number of side plates 55 and 56 having different shapes, different non-contact IC tag-attached sheets 1 can be manufactured without replacing the entire mounting apparatus 40.

  In the present embodiment, the example in which the holding unit 42 of the conveyance member 41 of the mounting apparatus 40 is synchronized with the conveyance speed of the interposer 2 received by the holding unit 42 is not limited thereto. The holding unit 42 may receive the interposer 2 while moving at a speed faster than the conveyance speed of the interposer 2. Or you may make it the holding | maintenance part 42 receive the interposer 2 supplied in the state stopped along the moving direction of the holding | maintenance part 42. FIG.

  In this case, the control of the entire manufacturing apparatus 5 for the non-contact IC tagged sheet is further facilitated. Further, the same mounting device 40 can be used when the non-contact IC tag-attached sheet 1 is manufactured from the IC chip mounted sheets 10 having different arrangement intervals of the IC chips 15. Can be increased.

  In addition, when the holding | maintenance part 42 receives the interposer 2 by such a method, it is preferable to use the holding | maintenance part 42 shown in FIG. 7 and FIG. 8 instead of the holding | maintenance part 42 mentioned above. The positioning guide 42c of the holding portion 42 shown in FIGS. 7 and 8 is open on the front side in the movement direction of the holding portion 42 and is wide on the front side.

  7 is a perspective view showing the holding portion 42, and FIG. 8 is a cross-sectional view taken along the line VIII-VIII in FIG. 7 and 8, the moving direction of the holding portion 42 is indicated by a thick arrow, and the rotating roller 45 is omitted in the drawings. Further, the holding portion 42 shown in FIGS. 7 and 8 is substantially the same except for the holding portion 42 shown in FIGS. 5 and 6 and the positioning guide 42c. The same parts are denoted by the same reference numerals and detailed description thereof is omitted.

  Furthermore, in this Embodiment, although the example using the interposer formation apparatus 60 which has the rotary cutter 61 was shown, it is not restricted to this. A punching machine or a cutting machine that can sequentially form the interposer 2 with a certain time interval between the IC chip mounted sheets 10 to be conveyed may be used.

  Further, in the present embodiment, the interposer forming device 60 includes a rotary cutter 61 and a receiving roller 62, and the interposer 2 formed by the interposer forming device 60 is transported to the mounting device 40 by the interposer transport conveyor 77. However, the present invention is not limited to this. The mounting device 40 may be disposed at a position facing the rotary cutter 61 of the interposer forming device 60, and the holding portion 42 of the transport member 41 of the mounting device 40 may function as a receiver for the rotary cutter 61. In this case, the interposer 2 separated from the IC chip mounted sheet 10 is held by the holding portion 42 of the conveying member 41 as it is. In the non-contact IC tag-attached sheet manufacturing apparatus 5 configured as described above, the receiving roller 62 of the interposer forming apparatus 60 and the interposer transport conveyor 77 can be omitted as a matter of course. Thereby, the manufacturing apparatus 5 of a sheet with a non-contact IC tag can be made a simpler configuration, and the control can be made simpler and easier.

  Furthermore, in the present embodiment, the mounted body is the antenna-formed sheet 20, and the interposer 2 is sequentially mounted on the antenna 24 formed on the antenna-formed sheet 20 with a predetermined arrangement interval. Although the example which manufactures the sheet | seat 1 with an IC tag was shown, naturally it is not restricted to this. As described above, when the interposer 2 itself is used as a non-contact IC tag, a plastic sheet cut to form a card, a vinyl sheet cut to form a wrapping paper, or the like can be used as the mounted body. And even when a plastic sheet, a vinyl sheet, etc. are used as the to-be-mounted body 30, the manufacturing method and manufacturing apparatus by this Embodiment can be applied and the sheet | seat 1 with a non-contact IC tag can be manufactured.

Schematic which shows one Embodiment of the manufacturing method and manufacturing apparatus of the sheet | seat with a non-contact IC tag by this invention. Sectional drawing which shows one Embodiment of the mounting apparatus by this invention. The side view which shows the mounting apparatus of the state which removed the one side board at the time of receiving an interposer. The side view which shows the mounting apparatus of the state which removed one side board at the time of mounting an interposer. The perspective view which shows a holding | maintenance part. Sectional drawing along the VI-VI line of FIG. The perspective view which shows the modification of a holding | maintenance part. Sectional drawing along the VIII-VIII line of FIG. Sectional drawing which shows a sheet | seat with a non-contact IC tag. The perspective view which shows an IC chip mounting sheet | seat. The perspective view which shows the antenna formed sheet.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Sheet | seat with non-contact IC tag 2 Interposer 5 Manufacturing apparatus 9 of sheet | seat with non-contact IC tag 9 Adhesive material 10 IC chip mounted sheet 11 1st non-conductor sheet 13 Conductor 14 Enlarged electrode 15 IC chip 20 Antenna formed sheet (Subject)
21 Second non-conductive sheet 24 Antenna 25 Part 30 on which the interposer is mounted IC chip mounted sheet supply device 34 First control unit 35 Mounted object supply device 40 Mounting device 41 Conveying member 42 Holding portions 42b and 42c Positioning guide 46 Columnar portion 50 Rotating shaft 55, 56 Side plate 55a, 56a Engaging portion 60 Interposer forming device 64 Suction mechanism 66 Discharging mechanism 68 Adhesive material supply device 70 Fixing device 72 Guide guide 74 Impression cylinder

Claims (25)

An IC chip mounted sheet having a first non-conductor sheet, a conductor disposed on the first non-conductor sheet, and a plurality of IC chips provided on the conductor is conveyed at a first speed. Supplying the process,
Punching or cutting the IC chip mounted sheet conveyed at the first speed for each IC chip to sequentially form an interposer having an enlarged electrode made of a conductor and an IC chip;
A step of transporting the formed interposer while being held by a transporting member that rotates at a constant rotational speed;
A step of transporting and supplying a sheet-like mounted body at a second speed;
A step of sequentially mounting an interposer transported by a transport member on a mounted body transported at a second speed,
The distance between the holding part that holds the interposer of the conveying member and the rotation axis of the conveying member fluctuates, the holding part moves at the first speed when receiving the interposer, and the holding part when mounting the interposer Moves at a second speed, a method for producing a sheet with a non-contact IC tag.   The contactless body according to claim 1, wherein the mounted body includes an antenna-formed sheet having a second non-conductive sheet and a plurality of antennas provided on the second non-conductive sheet. A method of manufacturing a sheet with an IC tag.   3. The method of manufacturing a sheet with a non-contact IC tag according to claim 1, wherein the IC chip mounted sheet is supplied so that the interposer is formed at a predetermined time interval.   The manufacturing of the sheet with a non-contact IC tag according to any one of claims 1 to 3, further comprising a step of supplying an adhesive material in advance to a portion on the mounted body where the interposer is mounted. Method.   5. The non-contact IC tag-attached sheet according to claim 1, wherein the interposer is positioned by a positioning guide formed in a holding portion of the conveying member and is held by the holding portion. Production method.   6. The method for manufacturing a sheet with a non-contact IC tag according to claim 1, wherein the interposer is sequentially transported by a plurality of transport members having the same rotation axis as a center.   The formed interposer is sucked and held by the holding portion of the conveying member by being sucked by a suction mechanism that communicates with the holding portion of the conveying member. A method for producing a sheet with a non-contact IC tag.   The non-contact IC according to any one of claims 1 to 7, wherein when the interposer is mounted, the interposer is pressed toward the mounted body by a discharge mechanism that communicates with the holding portion of the transport member. A method for manufacturing a tagged sheet. An IC chip mounted sheet having a first non-conductor sheet, a conductor disposed on the first non-conductor sheet, and a plurality of IC chips provided on the conductor is conveyed at a first speed. IC chip mounted sheet supply device for supplying
A mounted body supply apparatus for transporting and supplying a sheet-shaped mounted body at a second speed higher than the first speed;
An interposer forming apparatus for punching or cutting the IC chip mounted sheet to be conveyed for each IC chip to form an interposer having an enlarged electrode made of a conductor and an IC chip;
A holding device for holding the interposer, a rotatable transport member, a mounting device for receiving and transporting the interposer and mounting it on the mounted body;
An apparatus for manufacturing a sheet with a non-contact IC tag, wherein a distance between a holding portion of a conveying member of the mounting apparatus and a rotation shaft of the conveying member is freely variable.   The contactless body according to claim 9, wherein the mounted body includes an antenna-formed sheet having a second non-conductive sheet and a plurality of antennas provided on the second non-conductive sheet. IC tag sheet manufacturing equipment.   The apparatus for manufacturing a sheet with a non-contact IC tag according to claim 9 or 10, wherein the mounting apparatus has a plurality of conveying members.   The apparatus for producing a sheet with a non-contact IC tag according to any one of claims 9 to 11, wherein a positioning guide for positioning the interposer is formed in a holding portion of the conveying member of the mounting apparatus.   The contactless IC tag according to any one of claims 9 to 12, wherein the conveyance member of the mounting apparatus further includes a columnar columnar portion that is coupled to the holding portion and is slidable with respect to the rotation shaft. Equipment for manufacturing attached sheets.   14. The non-contact IC tag-attached sheet according to claim 9, wherein the mounting device further includes a side plate that is disposed perpendicular to the rotation axis of the conveying member and engages with the conveying member. Manufacturing equipment.   The side plate is a disc disposed eccentrically with respect to the rotation axis of the transport member, and the engaging portion provided along the outer periphery of the side plate engages with the transport member. Equipment for manufacturing sheets with non-contact IC tags. The IC chip mounted sheet supply device has a control unit that controls the supply of the IC chip mounted sheet,
The control unit controls the supply of the IC chip mounted sheet so that a portion of the IC chip mounted sheet on which the IC chip is arranged is sent to the interposer forming apparatus at a predetermined time interval. The manufacturing apparatus of the sheet | seat with a non-contact IC tag as described in any one of 9 thru | or 15.   The apparatus for producing a sheet with a non-contact IC tag according to any one of claims 9 to 16, wherein the interposer forming device includes a rotary cutter. A suction mechanism that communicates with the carrying member of the mounting apparatus;
The non-contact IC tag-attached sheet manufacturing apparatus according to any one of claims 9 to 17, wherein the interposer is sucked and held by the holding portion of the transport member by the suction mechanism. It further comprises a discharge mechanism that communicates with the conveying member of the mounting device,
The apparatus for manufacturing a sheet with a non-contact IC tag according to any one of claims 9 to 18, wherein the interposer is mounted by being pressed toward the mounted body by the discharge mechanism. It further comprises an impression cylinder arranged facing the mounting device,
The apparatus for manufacturing a sheet with a non-contact IC tag according to any one of claims 9 to 19, wherein the mounted body is fed between the mounting apparatus and the impression cylinder.   The apparatus further comprises a guide guide that is arranged along the mounting apparatus and has an outer shape corresponding to a movement locus of a holding portion of the conveyance member of the mounting apparatus and guides the interposer to be conveyed. The manufacturing apparatus of the sheet | seat with a non-contact IC tag as described in any one of 9 thru | or 20. Sequentially supplying an interposer having an enlarged electrode and an IC chip;
A step of transporting the supplied interposer by holding it on a transporting member that rotates at a constant rotational speed;
A step of transporting and supplying a sheet-like mounted body at a constant speed;
A step of sequentially mounting an interposer conveyed by a conveying member on a substrate to be conveyed; and
The distance between the holding part that holds the interposer of the conveying member and the rotation axis of the conveying member fluctuates, and when the interposer is mounted, the holding part must move at the same speed as the conveying speed of the mounted object. An interposer mounting method for mounting an interposer on a mounted body characterized by the above.   23. The interposer mounting method according to claim 22, wherein the mounted body includes an antenna-formed sheet having a non-conductive sheet and a plurality of antennas provided on the non-conductive sheet. An interposer mounting device that mounts an interposer having an enlarged electrode and an IC chip on a sheet-like mounted object that is conveyed at a constant speed,
A holding member for receiving and holding the interposer and a rotatable conveying member;
An interposer mounting apparatus characterized in that a distance between a holding part of a conveying member and a rotation axis of the conveying member is variable.   25. The interposer mounting apparatus according to claim 24, wherein the mounted body includes an antenna-formed sheet having a non-conductive sheet and a plurality of antennas provided on the non-conductive sheet.

Images