JP2001141966A - Optical switching device, optical transmitting / receiving device, and method of manufacturing them - Google Patents

Abstract

(57) Abstract: A miniaturized optical switch device, optical transmitter / receiver device, and a miniaturized optical switch capable of bidirectional optical switching and optical transmission using a single optical transmission line such as an optical fiber. A manufacturing method is provided. An optical transmission / reception device (10A) includes a first optical waveguide (12) for passing an incident first optical signal (L1) substantially in the incident direction, and a second optical waveguide (12) incident from a direction different from the first optical signal (L1). And a second optical waveguide 13 for guiding the optical signal L2 of the first optical signal L2 in a direction opposite to the first optical signal L1. The first optical waveguide 12 has an incident surface 121 on which the first optical signal L1 is incident.
And an emission surface 122 from which the first optical signal L1 is emitted. The second optical waveguide 13 is attached to the entrance surface 121 of the first optical waveguide 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical switching device used in combination with an optical signal transmission line such as an optical fiber or an optical waveguide, and an optical transmission / reception device for transmitting and receiving optical signals using the optical signal transmission line. And methods for their manufacture.

[0002]

2. Description of the Related Art In so-called ICs (integrated circuits) and LSIs (large-scale integrated circuits), technical progress has been remarkable, and their operating speed and integration scale tend to be improved. As a result, the performance of microprocessors and the capacity of memory chips have been rapidly increased.

[0003] The points that are problematic in improving these various performances include the transfer speed of the signal wiring and the mounting density of the signal wiring. In other words, even if the performance of a functional element such as a transistor is improved, these points become a bottleneck if the signal transfer speed in the signal wiring is not increased and the density of the signal wiring is not increased. Implementation is difficult. Further, generally, there is a delay for signal transmission in the electric signal wiring, and this is also a factor that hinders the above-described performance improvement. In addition, when the signal transfer speed in the signal wiring is increased and the signal wiring density is increased, the influence of EMI (Electromagnetic Interference) becomes remarkable, so that it is necessary to take sufficient measures.

As a solution to such a problem in signal wiring, a so-called optical interconnection is drawing attention. Optical interconnection is considered to be applicable in various situations, such as between devices, between boards in a device, or between chips in a board. For example, as an optical interconnection between devices, use of an optical link using a plastic optical fiber having a large core diameter and easy connection has been proposed. For wiring in a device, for example, use of an optical link using a flexible optical waveguide has been proposed. For connection between chips in a board, use of an optical waveguide or an optical wiring using free space has been proposed.

The configuration of an optical link device using a plastic optical fiber is described in, for example, (a) Japanese Patent Application Laid-Open No. 7-99340. The optical link device described in the same publication is configured by separately using a transmitting package in which a light emitting element chip is sealed and a receiving package in which a light receiving element chip is sealed.

Further, for example, (b) Japanese Patent Application Laid-Open No. 9-1816
No. 75, (c) JP-A-9-318853, etc., one optical link uses only one optical fiber, and data transmission and reception are performed using this one optical fiber. An optical transmitting and receiving device adapted to perform the operation is described.

[0007]

However, since the optical link device described in the above publication (a) is composed of two packages (a transmission package and a reception package), its volume is large. And one transmission link and two reception links in one optical link configuration.
Requires an optical fiber. Therefore, it is desired that an optical link is configured using a single transmission / reception package and using one optical fiber. For example, as shown in the above publications (b) and (c), one optical fiber is used. There have been proposed various optical transmission / reception devices that use a hybrid optical element such as a laser coupler to receive and emit light.

However, in the optical transmission and reception devices disclosed in the above publications (b) and (c), the optical fiber and the optical element must be fixed with high precision. Further, the entire sealing structure and the like are complicated. As a result, it is difficult to realize a highly reliable optical link at low cost. Further, these optical transceivers transmit and receive optical signals to and from the optical fiber along the normal direction of the plane of the base of the optical transceiver. For this reason, when one package is configured by attaching a transmitting circuit and a receiving circuit to an optical transmitting and receiving device, it is difficult to reduce the thickness of the package. Here, the transmission circuit is an electric circuit including a driving IC of the light emitting element and the like,
The receiving circuit is an electric circuit including an impedance conversion IC of a light receiving element.

In general, when the above-mentioned package is built in a device, it is desirable that the package itself be reduced in size or thickness. For miniaturization or thinning, it is desirable to transmit and receive optical signals along a direction parallel to the plane of the base of the optical transceiver. For high density and miniaturization, transmission and reception of optical signals to a single optical transmission line, such as an optical link connecting boards in a device or an optical wiring connecting chips, are performed. It is desired to realize an optical transceiver that can perform both of the above.

The present invention has been made in view of the above problems, and a first object of the present invention is to realize transmission and reception of an optical signal to and from an optical transmission line such as an optical fiber or an optical waveguide, and to reduce the size. Another object of the present invention is to provide an optical switching device and an optical transmitting / receiving device that can be made thin.

Further, a second object of the present invention is to provide the above-mentioned first embodiment.
It is an object of the present invention to provide a method of manufacturing an optical switching device and a method of manufacturing an optical transmitting / receiving device which can be easily manufactured while achieving the object of the present invention.

[0012]

An optical switching device according to the present invention comprises:
A first optical waveguide having a first surface on which the first light is incident, a second surface on which the first light incident from the first surface is emitted, and a first surface of the first optical waveguide Alternatively, the second light guide is attached to one of the second surfaces and guides the second light incident from a direction different from the first light so as to be emitted in a direction opposite to the incident direction of the first light. And an optical waveguide. Here, the “light switch” means that light is guided to different paths according to the propagation direction. The same is true in the following description.

An optical transceiver according to the present invention comprises a first optical waveguide having a first surface on which a first light is incident and a second surface on which the first light incident from the first surface is emitted. A light receiving unit that receives the first light emitted from the first optical waveguide;
A light emitting unit that emits the second light in a direction different from the direction of the first light; and a light emitting unit that is attached to one of the first surface and the second surface of the first optical waveguide and emits the light from the light emitting unit. And a second optical waveguide for guiding the second light, which has been incident, to the direction opposite to the incident direction of the first light.

A method for manufacturing an optical switching device according to the present invention is a method for manufacturing an optical switching device having the above configuration, wherein the first surface or the first surface of a transparent substrate used as a first optical waveguide is provided. Forming an optical waveguide forming layer on the second surface, and selectively removing a portion of the optical waveguide forming layer other than a predetermined portion to form a second optical waveguide including the predetermined portion. Is included.

Another method of manufacturing an optical switching device according to the present invention is a method of manufacturing an optical switching device having the above-described configuration,
Forming an optical waveguide forming layer on a predetermined dummy substrate; and selectively removing a portion of the optical waveguide forming layer except for a predetermined portion, thereby forming a second optical waveguide including the predetermined portion. Forming, and transferring the second optical waveguide formed on the dummy substrate to the first surface or the second surface of the transparent substrate used as the first optical waveguide. Things. Here, "transfer" means to transfer the second optical waveguide formed on the optical waveguide production substrate from the optical waveguide production substrate to the predetermined surface of the first optical waveguide. The same is true in the following description.

A method for manufacturing an optical transmitting / receiving device according to the present invention comprises:
A method for manufacturing an optical transceiver having the above configuration, comprising: forming an optical waveguide forming layer on a first surface or a second surface of a transparent substrate used as a first optical waveguide; A step of selectively removing a portion of the layer except for a predetermined portion to form a second optical waveguide including the predetermined portion; and forming a second optical waveguide on the surface of the second optical waveguide where the second light is incident. The method includes a step of arranging a light emitting unit so as to be opposed, and a step of arranging a light receiving unit at a position facing the second surface of the transparent substrate used as the first optical waveguide or at a position in the vicinity thereof. Things.

Another method of manufacturing an optical transceiver according to the present invention is a method of manufacturing an optical transceiver having the above-described configuration, comprising: forming an optical waveguide forming layer on a predetermined dummy substrate; A step of selectively removing a portion other than a predetermined portion of the waveguide forming layer to form a second optical waveguide formed of the predetermined portion, and a second optical waveguide formed on the dummy substrate, A step of transferring the light to the first surface or the second surface of the transparent substrate used as the first optical waveguide, and a step of causing the light emitting section to face the second light incident surface of the second optical waveguide. The method includes an arranging step and an arranging a light receiving unit at a position facing the second surface of the transparent substrate used as the first optical waveguide or at a position in the vicinity thereof.

In the optical switching device according to the present invention, the first light is incident on the first surface of the first optical waveguide and then exits from the second surface. On the other hand, the second light enters the second optical waveguide from a direction different from that of the first light, and then exits in a direction opposite to the incident direction of the first light.

In the optical transmitting / receiving apparatus of the present invention, the first light is
After entering from the first surface of the first optical waveguide, it exits from the second surface and is received by the light receiving unit. On the other hand, the second light emitted from the light emitting unit enters the second optical waveguide from a direction different from that of the first light, and then exits in a direction opposite to the incident direction of the first light.

In the method for manufacturing an optical switching device or the method for manufacturing an optical transceiver according to the present invention, first, an optical waveguide is formed on a first surface or a second surface of a transparent substrate used as a first optical waveguide. A layer is formed. Next, of the formed optical waveguide forming layer, a portion other than a predetermined portion is selectively removed, and the remaining predetermined portion becomes a second optical waveguide. In particular, in this method for manufacturing an optical transceiver,
The light-emitting portion is disposed so as to face the surface of the second optical waveguide on which the second light is incident, and the light-emitting portion faces the second surface of the transparent substrate used as the first optical waveguide or the position thereof. The light receiving unit is arranged in the vicinity position.

In another method for manufacturing an optical switching device or an optical transmitting / receiving device according to the present invention, first, an optical waveguide forming layer is formed on a predetermined dummy substrate. Next, of the formed optical waveguide forming layer, a portion other than a predetermined portion is selectively removed, and the remaining predetermined portion becomes a second optical waveguide. Next, the second optical waveguide formed on the dummy substrate is transferred to the first surface or the second surface of the transparent substrate used as the first optical waveguide. In particular, in this method for manufacturing an optical transceiver, the light emitting unit is further arranged so as to face the surface of the second optical waveguide on which the second light is incident, and is used as the first optical waveguide. The light receiving section is disposed at a position facing the second surface of the transparent substrate or at a position in the vicinity thereof.

Embodiments of the present invention will be described below in detail with reference to the drawings.

[First Embodiment] First, the configuration of an optical transmitting and receiving apparatus according to a first embodiment of the present invention will be described with reference to FIGS. FIG. 2 is a plan view of the optical transceiver 10A according to the first embodiment of the present invention, and FIG. 1 is a sectional view taken along the line II shown in FIG. Note that the optical switch device according to the present invention is embodied by the optical transmitting and receiving device according to the first embodiment of the present invention and the embodiments described hereinafter. The optical switch device will be described.

As shown in FIGS. 1 and 2, the optical transmitting / receiving apparatus 10A receives the first optical signal L1 from the optical transmission line 1 such as an optical fiber or an optical waveguide, and receives the first optical signal L1 from the optical transmission line 1. The second optical signal L2 is transmitted. The optical transceiver 10A includes a first optical waveguide 12 that guides the incident first optical signal L1 to emit in a predetermined direction;
A light receiving unit 14 that receives the first optical signal L1 emitted from the first optical waveguide 12, and a light emitting unit that emits the second optical signal L2 in a direction different from the direction of the first optical signal L1. 1
5 and the second optical signal L2, which is attached to the incident surface of the first optical signal L1 in the first optical waveguide 12 and is emitted from the light emitting unit 15 and is incident, in the incident direction of the first optical signal L1. A second optical waveguide 13 for guiding the light to be emitted in a direction opposite to that of the second optical waveguide. The first optical waveguide 12 and the light emitting section 15 are provided on the substrate 11. Substrate 11
For example, a silicon (Si) semiconductor or a gallium arsenide (GaAs) semiconductor can be used.

Here, the first optical signal L1 corresponds to a specific example of "first light" in the present invention, and the second optical signal L2
Corresponds to a specific example of “second light” in the present invention.
The first optical waveguide 12 corresponds to a specific example of “first optical waveguide” in the present invention, and the second optical waveguide 13 corresponds to one specific example of “second optical waveguide” in the present invention. The light receiving unit 14 corresponds to a specific example of “light receiving unit” in the present invention, and the light emitting unit 15 corresponds to one specific example of “light emitting unit” in the present invention. The first optical waveguide 12 and the second optical waveguide 13 correspond to a specific example of the “optical waveguide unit” in the present invention and also correspond to a specific example of the “optical switch device” in the present invention.

The first optical waveguide 12 is formed as a so-called ridge-type optical waveguide using a rectangular parallelepiped transparent substrate. The first optical waveguide 12 has an incident surface 121 perpendicular to the propagation direction of the first optical signal L1 on the side facing the optical transmission line 1, and the first optical signal L1 on the opposite side.
Outgoing surface 122 perpendicular to the propagation direction of The first optical waveguide 12 is desirably transparent to the wavelength used for the first optical signal L1. For example, an inorganic material such as quartz glass can be used in addition to a polymer material. Here, the incident surface 121 corresponds to the “first surface” in the present invention, and the output surface 122 corresponds to the “second surface” in the present invention.

A film (not shown) having a refractive index smaller than the refractive index of the first optical waveguide 12 and functioning as a cladding layer is provided at a junction between the first optical waveguide 12 and another portion. Is provided as appropriate, and an optical signal (in this case, the first optical signal L
It is desirable to improve the propagation efficiency of 1). In particular, it is desirable to provide such a low refractive index film between the substrate 11 and the first optical waveguide 12 to improve the propagation efficiency of an optical signal propagating in the first optical waveguide 12. Such a low refractive index film can be easily formed of a dielectric material such as silicon oxide (SiO ₂ ) or a polymer material.

The second optical waveguide 13 is the first optical waveguide 12
Is attached to the incident surface 121 of the light emitting device. The second optical waveguide 13 includes an optical path conversion surface 13B that converts the second optical signal L2 propagating inside the second optical waveguide 13 after the incidence in a direction opposite to the incidence direction of the first optical signal L1.

FIG. 3B is an enlarged side view of the optical waveguide portion of the optical transceiver 10A, and FIG. 3A is a view II shown in FIG.
It is an expanded sectional view of the optical waveguide part of 10 A of optical transmission / reception apparatuses cut | disconnected by the IA-IIIA cutting line. FIG. 3 (A) and FIG.
As shown in (B), the second optical waveguide 1 is formed of an elongated hexahedron having a cross-sectional shape sufficiently smaller than the cross-sectional shape of the first optical waveguide 12 as a whole. One end of the second optical waveguide 13 facing the light emitting unit 15 is the second optical waveguide 13.
Incident surface 131 substantially orthogonal to the light propagation direction of the optical signal L2
It has become. The other end of the second optical waveguide 13
An optical path conversion surface 13B for converting the light propagation direction of the optical signal L2 is formed. The second optical signal L2 whose propagation direction has been converted by the optical path conversion surface 13B is emitted from the emission surface 132 and then enters the optical transmission line 1.

The exit surface 132 and the optical path conversion surface 13B of the second optical waveguide 13 are both the entrance surface 1 of the first optical waveguide 12.
21 and the emission surface 122. The exit surface 132 of the second optical waveguide 13 and the entrance surface 121 of the first optical waveguide 12 are disposed substantially in parallel with a separation distance corresponding to the width dimension of the second optical waveguide 13. Further, the second optical waveguide 13 is configured as a ridge-type optical waveguide. The propagation direction of the second optical signal L2 in the second optical waveguide 13 is the first optical signal L2.
1 is orthogonal to the propagation direction.

The optical path conversion surface 13B is provided on the second optical waveguide 13
Is formed on the other end side as an inclined surface having an angle of 45 degrees with respect to the emission surface 132. For example, gold (A)
u) or a metal film such as aluminum (Al), or a reflection-enhancing film such as a dielectric reflection film may be formed to reduce the propagation loss due to the reflection of the second optical signal L2. Second
It is desirable that the optical waveguide 13 is transparent to the wavelength used of the second optical signal L2. For example, it is preferable to use a polymer material, a plastic material, or the like.
Inorganic materials such as quartz glass can also be used. here,
The optical path conversion surface 13B corresponds to a specific example of “first optical path conversion unit” in the present invention.

In this embodiment, since the side surface 134 of the second optical waveguide 13 is attached to the incident surface 121 of the first optical waveguide 12 in direct contact, the refraction of the first optical waveguide 12 is changed. It is preferable to make a difference between the refractive index and the refractive index of the second optical waveguide 13. For example, the refractive index of the first optical waveguide 12 is set to about 1.50, and the refractive index of the second optical waveguide 13 is set to about 1.56.

The light receiving section 14 shown in FIGS. 1 and 2 is formed of, for example, a photodiode. The light receiving unit 14 is disposed to face the emission surface 122 of the first optical waveguide 12 at a predetermined distance. Although not shown, the first optical waveguide 1
An electrode pattern and an electric wiring pattern (including a signal and a power supply) on the surface around the second emission surface 122.
Are arranged. The light receiving section 14 is electrically connected to this electrode pattern through a conductive bump electrode 20, and secures a predetermined space between the light receiving section 14 and the emission surface 122 of the first optical waveguide 12 by the bump electrode 20. . When a photodiode is used as the light receiving section 14, an electrode pattern, an electric wiring pattern, and the like are generally provided on the light receiving surface side of the photodiode.
It is convenient that the light exit surface 122 and the light receiving surface of the light receiving unit 14 are arranged so as to face each other. As the bump electrode 20, for example, Au, solder (Pb-Sn) or the like is used.

When a low-speed (ie, low bit rate) optical signal is received, it is preferable to use the light-receiving section 14 having a relatively large light-receiving area of about several mm on a side. That is, when an optical signal having a high bit rate is received, it is preferable to use the light receiving section 14 which has a light receiving area of a few hundred μm on one side as small as possible and can respond quickly to a change in the intensity of the optical signal.

The light emitting section 15 receives the second optical signal L from one end face.
2 is an edge emitting type light emitting element configured to emit light, for example, a semiconductor laser diode or the like is used.
The light emitting end face is disposed at a position facing the incident surface 131 of the second optical waveguide 13 (see FIG. 3A). The second optical signal L2 emitted from the light emitting section 15 is output to the optical transmission line 1 through the second optical waveguide 13. A light-emission monitoring light-receiving part 16 is disposed behind the light-emitting part 15 on the opposite side to the emission direction of the second optical signal L2,
The light-emission monitoring light-receiving unit 16 monitors a laser beam emitted backward from the light-emitting unit 15. The light emitting section 15 and the light emitting monitor light receiving section 16 are modularized as a light transmitting semiconductor element 17 sealed in one package.
1 is implemented.

Next, the operation of the optical transmitting / receiving apparatus 10A thus configured will be described.

First, after the first optical signal L 1 propagating in the optical transmission line 1 enters the incident surface 121 of the first optical waveguide 12, it propagates inside and reaches the exit surface 122. Then, the first optical signal L1 is emitted from the emission surface 122, guided to the light receiving unit 14, and received by the light receiving unit 14.

On the other hand, the second optical signal L 2 emitted from the light emitting section 15 is incident on the incident surface 131 of the second optical waveguide 13. This second optical signal L2 propagates inside the second optical waveguide 13, is optically path-converted in the direction of the optical transmission line 1 by the optical path conversion surface 13B, and further reaches the emission surface 132 of the second optical waveguide 13. I do. Then, the second optical signal L2 exits from the exit surface 132 and is guided to the optical transmission line 1. Second
Is propagated in the optical transmission line 1 and reaches the other party, where it is received. On the other hand, the light emitting state of the light emitting section 15 (the transmission state of the second optical signal L2) is monitored by the light emitting monitoring light receiving section 16.

Here, in the second optical waveguide 13, if the inclination angle of the optical path conversion surface 13B is, for example, 45 degrees, if the refractive index n of the second optical waveguide 13 is approximately 1.4 or more, Since the second optical signal L2 that has propagated through the second optical waveguide 13 is totally reflected by the optical path conversion surface 13B and converted into an optical path, optical loss is extremely small and transmission sensitivity can be improved. Even when the inclination angle of the optical path conversion surface 13B or the refractive index n of the second optical waveguide 13 does not satisfy the condition of total reflection, the above-described metal film or dielectric reflection film is formed on the inclined surface of the optical path conversion surface 13B. With the provision, the transmission sensitivity can be improved by increasing the reflectance of the second optical signal L2.

As described above, according to the optical transmission / reception device 10 A of the present embodiment, the first transmission / reception
And a first optical waveguide 12 for guiding the optical signal L1 to enter and exit in the direction of the light receiving unit 14, and the second light emitted from the light emitting unit 15 is incident on the incident surface 121 of the first optical waveguide 12. Since the second waveguide 22 for guiding the optical signal L2 to emit in the direction of the optical transmission line 1 is attached,
Optical two-way communication can be realized with a simple configuration using only one optical transmission line 1.

Further, according to the present embodiment, the second optical waveguide 13 is provided on the surface of the first optical waveguide 12 through which the first optical signal L1 passes (in the first embodiment, the incident surface 121). And the first optical waveguides 12 and the second optical waveguides 13 are arranged along the propagation direction of the first optical signal L1 (that is, along the surface of the substrate 11). The height from the surface of the substrate 11 can be reduced. For this reason, the device can be made thinner and smaller.

Further, according to the present embodiment, since the second optical waveguide 13 only needs to be attached to the incident surface 121 of the first optical waveguide 12, the structure of the device is simple and the device can be easily manufactured. Can be manufactured.

Further, according to the present embodiment, the second optical waveguide 12 is mounted on the incident surface 121 of the first optical waveguide 12 for the first optical signal L1. The first optical waveguide 12 having a relatively large thickness is interposed between the second optical waveguide 12 and the two optical waveguides 12, so that the two can be separated sufficiently. Therefore, crosstalk caused by the light receiving section 14 picking up the second optical signal L2 as noise can be reduced, and the receiving sensitivity of the optical transceiver 10A can be improved.

Next, with reference to FIGS. 4 to 7, a description will be given of a method of manufacturing the optical transmission / reception device of the present embodiment. 4 to 7 are perspective views of the optical transceiver 10A for describing each step in the manufacturing method according to the present embodiment. The method for manufacturing the optical switch device according to the embodiment of the present invention is embodied by the following method for manufacturing an optical transmitting and receiving device, and is also described below.

First, a transparent substrate 120 made of, for example, quartz glass is prepared, and a liquid polymer material, for example, an epoxy resin is coated on the transparent substrate 120 by spin coating.
The entire surface is uniformly coated so as to have a thickness of about 50 μm to 50 μm, and an optical waveguide forming layer 130 is formed from this epoxy resin as shown in FIG. Here, the optical waveguide forming layer 1
Reference numeral 30 corresponds to a specific example of the “optical waveguide forming layer” in the invention.

FIG. 8 is a graph showing the relationship between the light transmittance (%) of the epoxy resin used in the manufacturing method according to the first embodiment and the wavelength of light (nm). In FIG.
The vertical axis indicates the light transmittance of the epoxy resin having a thickness of 1 mm, and the horizontal axis indicates the wavelength of light. This epoxy resin emits light of a wavelength (about 350 nm to 450 nm) emitted from an ultra-high pressure mercury lamp used in a manufacturing method described later in the range of 60 to 8 nm.
It is a photocurable resin that transmits about 5% and absorbs and cures the remaining 15 to 40%.

After forming the optical waveguide forming layer 130, FIG.
As shown in (2), the photomask 37 is positioned and arranged on the transparent substrate 120. The photomask 37 includes a transparent mask substrate 36 made of, for example, quartz glass, and a light-shielding film 35 formed on the surface of the transparent mask substrate 36. For example, chrome (C
r) is used. The thickness of the light shielding film 35 is, for example, about 98
Set to nm.

FIG. 9 shows a light shielding film 35 according to the first embodiment.
FIG. 4 is a perspective view showing an opening pattern shape of FIG. An opening 35A having a shape corresponding to the second optical waveguide 13 is formed in the light shielding film 35.
And an inclined portion 35B corresponding to the optical path conversion surface 13B and in which the thickness of the light shielding film 35 is gradually reduced along the longitudinal direction of the opening 35A. The width of the opening 35A is, for example, about 100 μm. Inclined part 35B
Functions as a gray scale region that transmits an amount of light according to the gradually changing thickness of the light shielding film 35. In the present invention, the photomask 37 is used.
The opening pattern shape of the light shielding film 35 is not limited to the shape shown in FIG. For example, in the present invention, the light shielding film 35 is used.
Instead of the inclined portion 35B corresponding to the optical path conversion surface 13B,
A practical example is a plurality of openings in which the stripe width gradually decreases along the longitudinal direction of the opening 35A, and a plurality of fine openings in which the density gradually decreases in the longitudinal direction of the opening 35A. Can be used for

Next, as shown in FIG. 5, the optical waveguide forming layer 130 on the transparent substrate 120 is passed through the photomask 37.
Is irradiated with light L3. At this time, the opening 35 of the light shielding film 35
All the light L3 that has passed through A reaches the optical waveguide forming layer 130, and the light L3 that has passed through the inclined portion 35B reaches the optical waveguide forming layer 130 while controlling the amount of transmitted light according to the thickness of the light shielding film 35. The light L3 does not reach the optical waveguide forming layer 130 in a portion other than the opening 35A and the inclined portion 35B where the light-shielding film 35 having a complete thickness is provided. Curing proceeds from the surface side of the optical waveguide forming layer 130 in the region irradiated with the light L3. In the region corresponding to the opening 35A, the optical waveguide forming layer 130 can be cured over the entire thickness direction. Inclined part 35
In the region corresponding to B, the upper layer side of the optical waveguide forming layer 130 is cured, but the lower layer side is not cured. The cured portion of the optical waveguide forming layer 130 is the transparent substrate 1
20 on the surface. When the light L3 is irradiated with a large amount of light in a short time, the second optical waveguide 13 is distorted, and the light propagation loss increases. Then, light L
Irradiation 3 is preferably performed over a long period of time (for example, 3 minutes) at a low output of about 10 mW / cm ² using, for example, an ultra-high pressure mercury lamp (center wavelength is g-line (436 nm)).

Next, by selectively removing the uncured portion of the optical waveguide forming layer 130 that has not been irradiated with the light L3, as shown in FIG. 6, the thickness of the region corresponding to the opening 35A is reduced. The second optical waveguide 13 is formed from the optical waveguide forming layer 130 cured in all directions, and the upper layer is cured in a region corresponding to the inclined portion 35B, and the lower layer is not cured from the optical waveguide forming layer 130 to the optical path conversion surface 13B.
Are simultaneously formed. The inclined surface of the optical path conversion surface 13B is the first
In the manufacturing method according to the embodiment, the angle is formed at about 45 degrees. For removing the uncured portion of the optical waveguide forming layer 130, for example, an organic solvent such as acetone or ethanol can be practically used.

Next, the transparent substrate 12 is subjected to a dicing process.
0 is divided into chips for each first optical waveguide 12, and as shown in FIG. 7, the first optical waveguide 12 is formed from the divided transparent substrates 120, and the first optical waveguide 12 is formed. The second optical waveguide 13 mounted on the incident surface 121 is formed. In the present embodiment, it is necessary to form an electrode pattern, an electric wiring pattern, and the like around the emission surface 122 of the first optical waveguide 12, and these conductive patterns are formed on the optical waveguide forming layer 130. Before the formation, or after the formation of the optical waveguide formation layer 130 and before the dicing step, copper (Cu), nickel (Ni), gold (A)
u), a conductive film of aluminum (Al) or the like is formed, and these conductive films can be patterned by photolithography. It is preferable that these conductive patterns are covered with a protective film as necessary during the manufacturing process. At the stage where the first optical waveguide 12 and the second optical waveguide 13 are formed, an optical waveguide unit including both of them as one assembly part can be completed.

Finally, as shown in FIGS. 1 and 2 described above, the optical waveguide units (the first optical waveguide 12 and the second optical waveguide 13), the light receiving section 14, the light emitting section 15, and the light emitting monitor light receiving section are provided. Each of the optical transmission semiconductor elements 17 in which the unit 16 is modularized is mounted on the substrate 11. Before mounting the optical waveguide unit on the substrate 11,
Alternatively, after mounting, the first optical waveguide 12 is attached to the position facing the emission surface 122 using the bump electrode 20. At the time of attachment, the first optical signal L1 emitted from the emission surface 122 of the first optical waveguide 12 is transmitted to the light receiving unit 14
The first optical waveguide 12 and the light receiving unit 14 are positioned with high precision so that the light is efficiently incident on the first optical waveguide 12. Further, the light emitting unit 15 is attached at a position facing the incident surface 131 of the second optical waveguide 13, but for the same reason, the alignment between the second optical waveguide 13 and the light emitting unit 15 is performed with high accuracy. Will be When a series of these main steps is completed, the optical transceiver 10A is completed.

As described above, according to the method of manufacturing the optical transmitting / receiving device 10A according to the present embodiment, the surface of the transparent substrate 120 used as the first optical waveguide 12 that becomes the surface through which the first optical signal L1 passes. After the optical waveguide forming layer 130 is formed on the entire upper surface, a part of the optical waveguide forming layer 130 is removed and the other part is removed, so that the remaining optical waveguide forming layer 10 is formed.
Becomes the second optical waveguide 13. At the point when the optical waveguide forming layer 130 is formed on the surface of the transparent substrate 120, the attachment of the second optical waveguide 13 to the first optical waveguide 12 is substantially completed. It is not necessary, and the number of manufacturing steps of the optical transceiver 10A can be reduced.

Further, according to the manufacturing method of the present embodiment, the first optical waveguide 12 to which the second optical waveguide 13 and the light receiving section 14 are attached in advance, and the light emitting section 15
1, and there is no need to mount the second optical waveguide 13, which is a delicate optical component, on the substrate 11, which facilitates manufacture.

Next, the optical transmitting / receiving apparatus 1 according to this embodiment
An application example of 0A will be described.

(First Application Example) FIG. 10 is a configuration diagram of a bidirectional optical transmission module according to a first application example of the present embodiment. As shown in FIG. 10, the bidirectional optical transmission module 40 includes an electric circuit board 41A such as a printed circuit board (PCB), an optical transceiver 10A mounted on the electric circuit board 41A, and an optical transceiver Plural semiconductor elements 42A to 42D mounted on a substrate around 10A
And The semiconductor elements 42A to 42D include, for example, a driving IC (for example, a driving circuit element of a laser diode) for driving the light emitting unit 15, an impedance conversion IC of the light receiving unit 14 and the light emitting monitoring light receiving unit 16, and an amplification IC.
C (for example, an amplifier circuit element of a photodiode) and the like. Between each of the semiconductor elements 42A to 42D and the light emitting unit 15 or the light receiving unit 14 of the optical transceiver 10A, for example, the bonding wire 43 and the electric circuit board 41A
They are electrically connected by a wiring pattern (not shown). As the bonding wire 43, for example, A
u, Cu or Al can be used.

In the bidirectional optical transmission module 40, an optical transceiver 10A and a plurality of semiconductor elements 42A to 42D are arranged along the mounting surface of the electric circuit board 10. For example, the core diameter of the optical transmission line 1 is about 0.5 mm, the thickness (height) of the first optical waveguide 12 is about 1.0 mm, and the thickness of the substrate 11 of the optical transceiver 10A is 0, which is a practical value. When the thickness of the electric circuit board 41A is set to about 1.0 mm, which is a practical value, about 0.5 mm, the total thickness (height) of the bidirectional optical transmission module 40 becomes about 2.5 mm, An extremely thin bidirectional optical transmission module 40 can be configured, and downsizing of the bidirectional optical transmission module 40 can be realized.

(Second Application) FIG. 11 is a plan view of an optical transceiver having a multi-channel structure according to a second application of the present embodiment. The optical transceiver 50 includes a common substrate 111 and a plurality of optical transceivers 10AA regularly arranged on the surface of the substrate 111 so as to correspond to each of the plurality of optical transmission lines 1. This optical transceiver 50
Thus, a multi-channel optical link can be easily configured. As shown in FIGS. 1 and 2, each optical transmitting / receiving device 10A is formed using an individual substrate 11, and the plurality of optical transmitting / receiving devices 10A are
May be arranged on a common electric circuit board 41A to constitute an optical transmitting / receiving device having a multi-channel structure.

Next, a modified example of the optical transmitting / receiving apparatus of the present embodiment will be described.

(First Modification) FIG. 12B is an enlarged side view of an optical waveguide portion of an optical transceiver according to a first modification of the present embodiment, and FIG. XXII shown in)
FIG. 3 is an enlarged cross-sectional view of the optical transmitting / receiving device taken along a cutting line A-XXIIA. In the optical transmitting and receiving device of this modification, the second optical waveguide 13 is configured as a ridge-type optical waveguide mounted on the incident surface 121 of the first optical waveguide 12 via the lower cladding layer 60. The lower cladding layer 60 is
The second optical waveguide 1 so that the propagation efficiency of the second optical signal L2 propagating in the optical waveguide 13 can be improved.
It is preferable to use a material having a refractive index lower than 3.
As such a low refractive index material, for example, a dielectric material such as SiO ₂ or a polymer material can be used.

(Second Modification) FIG. 13B is an enlarged side view of an optical waveguide portion of an optical transceiver according to a second modification of the present embodiment, and FIG. XXII shown in)
FIG. 3 is an enlarged cross-sectional view of the optical transmitting / receiving device taken along a cutting line IA-XXIIIA. In the optical transceiver of the present modification, the second optical waveguide 13 is directly mounted on the incident surface 121 of the first optical waveguide 12. Outgoing surface 1 of second optical waveguide 13
The portion other than 32 is covered with the upper cladding layer 61 to form a buried optical waveguide. Like the lower cladding layer 60, the upper cladding layer 61 is higher than the second optical waveguide 13 so that the propagation efficiency of the second optical signal L2 propagating in the second optical waveguide 13 can be improved. It is preferable to use a material having a low refractive index.

(Third Modification) FIG. 14B is an enlarged side view of an optical waveguide portion of an optical transceiver according to a third modification of the present embodiment, and FIG. XIV shown in)
FIG. 4 is an enlarged cross-sectional view of the optical transmission / reception device taken along line A-XIV A. In the optical transmitting and receiving device of the present modification, the second optical waveguide 13 is attached to the incident surface 121 of the first optical waveguide 12 via the lower cladding layer 60, and the output surface 1
The portion excluding 32 is covered by the upper cladding layer 61,
It is configured as a buried optical waveguide.

[Second Embodiment] Next, a second embodiment of the present invention will be described.
An embodiment will be described.

The optical transmitting and receiving apparatus according to the present embodiment has the first
The arrangement position of the second optical waveguide 13 in the embodiment is changed from the incident surface 121 of the first optical waveguide 12 to the emission surface 12.
It has been changed to 2. Note that, in this embodiment and the embodiments described hereinafter, the same components as those described in the first embodiment are denoted by the same reference numerals, and the description will not be repeated unless necessary. Is omitted.

First, the configuration of the optical transceiver 10B according to the present embodiment will be described with reference to FIGS. Here, FIG. 16 is a plan view of the optical transceiver 10B according to the present embodiment, and FIG.
It is arrow sectional drawing cut | disconnected by the cutting line. FIG. 17B is an enlarged side view of the optical waveguide portion of the optical transceiver 10B, and FIG. 17A is an optical waveguide portion of the optical transceiver 10B cut along the XVIIA-XVIIA cutting line shown in FIG. 17B. FIG. 3 is an enlarged cross-sectional view of FIG. In these figures, the same components as those shown in FIGS. 1 to 3 of the first embodiment are denoted by the same reference numerals, and description thereof will be omitted as appropriate.

As shown in FIGS. 15 to 17, the optical transceiver 10B includes the second optical waveguide 13 attached to the emission surface 122 of the first optical waveguide 12 for the first optical signal L1. I have. The second optical waveguide 13 transmits the second optical signal L2 emitted from the light emitting unit 15 and incident thereon,
The light is emitted in a direction opposite to the incident direction of the first optical signal L <b> 1, and is guided into the second waveguide 13. The light receiving unit 14 is disposed on the emission surface 122 of the first optical waveguide 12 as in the case of the first embodiment, but in the present embodiment, the second optical waveguide is provided on the emission surface 122. 13 is arranged, so that both do not interfere,
The light receiving section 14 is connected to the second optical waveguide 1 by the bump electrode 20.
3 are arranged. Other configurations are
1. FIG. 2 is the same as FIG.

In the optical transmitting / receiving device 10 B according to the present embodiment, the first optical signal L 1 propagating in the optical transmission line 1 enters the incident surface 121 of the first optical waveguide 12, and then propagates therein. Then, the light reaches the emission surface 122. The first optical signal L1 is emitted from the emission surface 122, guided to the light receiving unit 14, and received by the light receiving unit 14. On the other hand, the light emitting unit 15
The second optical signal L2 emitted from the second optical waveguide 1
After the light is incident on the incident surface 131 of No. 3, the light propagates through the inside,
The optical path conversion surface 13B converts the optical path in a direction opposite to the incident direction of the first optical signal L1 (the direction of the optical transmission path 1). The second optical signal L2 is guided to the inside of the first optical waveguide 12 via the emission surface 132 and the emission surface 122 of the first optical waveguide 12, and propagates inside the first optical waveguide 12, and thereafter, the incident surface 121. And is guided to the optical transmission line 1. The second optical signal L2 propagates through the optical transmission line 1 and reaches the other party, where it is received. On the other hand, the light emitting state of the light emitting section 15 (the transmission state of the second optical signal L2) is monitored by the light emitting monitoring light receiving section 16.

Next, a method of manufacturing the optical transceiver 10B according to the second embodiment of the present invention will be described with reference to FIGS. 18 to 21 are cross-sectional views of the optical transceiver 10B for explaining main steps of the manufacturing method according to the present embodiment, and FIG. 22 is a perspective view.

First, as shown in FIG. 18, an optical waveguide production substrate 120D made of, for example, quartz glass, plastic, silicon semiconductor or the like is prepared. This optical waveguide production substrate 120D is a temporary substrate for manufacturing a second optical waveguide 13 thereon in advance and transferring the second optical waveguide 13 to a transparent substrate used as the first optical waveguide 12. Is used as a substrate. Here, the optical waveguide production substrate 120D corresponds to a specific example of a “dummy substrate” according to the present invention.

In this embodiment, first, as shown in FIG. 18, an optical waveguide forming layer 130 made of, for example, a thermosetting resin is formed on an optical waveguide manufacturing substrate 120D.

Next, as shown in FIG. 19, the photomask 37 is positioned and arranged on the optical waveguide production substrate 120D. The same photomask as that used in the first embodiment is used as the photomask 37 (see FIG. 9 for the light-shielding film 35).

Next, as shown in FIG. 19, light L3 is applied to the optical waveguide forming layer 130 on the optical waveguide manufacturing substrate 120D through the photomask 37. Thus, as in the case of FIG. 5 in the first embodiment, the opening 3
In the region corresponding to 5A, the optical waveguide forming layer 130 is hardened over the entire thickness direction and the inclined portion 3 is formed.
In the region corresponding to 5B, the optical waveguide forming layer 130
From the upper layer side to a depth corresponding to the inclined portion 35B. The cured portion of the optical waveguide forming layer 130 is adhered to the surface of the optical waveguide production substrate 120D with an appropriate adhesive force. At this time, the adhesive strength is made weaker than the adhesive strength between the surface of the transparent substrate 120 (FIG. 21) and the second optical waveguide 13 to be used later. For this purpose, for example, an adhesive force adjusting film for reducing the adhesive force between the two may be appropriately formed between the surface of the optical waveguide manufacturing substrate 120D and the optical waveguide forming layer 130.

Next, FIG. 6 in the first embodiment will be described.
In the same manner as in the above case, the uncured portion of the optical waveguide forming layer 130 that has not been irradiated with the light L3 is selectively removed. Thus, the second optical waveguide 13 is formed as shown in FIG.

Next, as shown in FIG. 21, the second optical waveguide 13 formed on the surface of the optical waveguide manufacturing substrate 120D is replaced with the transparent substrate 120 used as the first optical waveguide 12. (The surface to be the emission surface 122 of the first optical waveguide 12). Here, the transfer corresponds to a specific example of “transfer” in the present invention. As described above, the adhesive force between the surface of the transparent substrate 120 and the second optical waveguide 13 is stronger than the adhesive force between the surface of the optical waveguide manufacturing substrate 120D and the second optical waveguide 13. Is necessary,
Between the surface of the transparent substrate 120 and the second optical waveguide 13,
In order to increase the adhesive force between the two, an adhesive force adjusting film may be appropriately formed. In this case, it is desirable that the adhesive force adjusting film also serves as a cladding layer having a refractive index lower than that of the second optical waveguide 13.

Next, the transparent substrate 12 is subjected to a dicing process.
0 is divided into chips for each first optical waveguide 12. Thereby, as shown in FIG. 22, the first optical waveguide 12
An individual optical waveguide unit including the first optical waveguide 12 and the second optical waveguide 13 attached to the emission surface 122 of the first optical waveguide 12 is formed.

Finally, as shown in FIGS. 15 and 16, an optical waveguide unit including a first optical waveguide 12 and a second optical waveguide 13, a light receiving section 14, a light emitting section 15, and a light receiving section for light emission monitoring. The optical transmission semiconductor element 17 in which the unit 16 is modularized is mounted on the substrate 11. Thereby, the optical transceiver 10B is completed.

As described above, according to the method of manufacturing the optical transceiver according to the present embodiment, the optical waveguide production substrate 120D
The optical waveguide forming layer 130 is formed on the entire surface on the surface of the optical waveguide. By removing a part of the optical waveguide forming layer 130 and removing the other part, the second optical waveguide is formed from the remaining optical waveguide forming layer 130. Wave path 13 can be formed. And this second
Of the optical waveguide 13 from the optical waveguide manufacturing substrate 120D to the first
Of the transparent substrate 120 used as the optical waveguide 12 of FIG.
Is transferred onto a predetermined surface of the emission surface 122 which is a passage surface of the optical signal L1 of the second optical signal L1.
Of the optical waveguide 13 can be completed.

The second optical waveguide 13 is formed by the above-described transfer method.
After the optical waveguide forming layer 130 is selectively formed on the substrate 20, unnecessary portions (portions other than the optical waveguide portion defined by the optical path conversion surface 13B) are mechanically removed using a dicing blade (not shown). It is also possible to form by removing by processing.

Next, a modified example of this embodiment will be described.

(First Modification) FIG. 23 (B) is a partially enlarged side view of an optical transceiver according to a first modification of the present embodiment, and FIG. 23 (A) is FIG. 23 (B). XXIII A shown in
-XXIII It is arrow sectional drawing cut | disconnected by the A cutting line. In the optical transmitting / receiving device of the present modification, the second optical waveguide 13 is connected to the output surface 122 of the first optical waveguide 12 via the lower cladding layer 60.
And a ridge-type optical waveguide attached to the optical waveguide.
Other configurations and operations are the same as those of the first embodiment.
This is the same as the modification (FIG. 12).

(Second Modification) FIG. 24 (B) is a partially enlarged side view of an optical transceiver according to a second modification of the present embodiment, and FIG. 24 (A) is FIG. 24 (B). XXIVA- shown in
It is the expanded sectional view cut | disconnected by XXIVA cutting line. In the optical transmitting and receiving device of this modification, the second optical waveguide 13 is directly attached to the emission surface 122 of the first optical waveguide 12, and the portion other than the emission surface 132 and the optical path conversion surface 13 </ b> B is formed by the upper cladding layer 61. It consists of a covered embedded optical waveguide. Other configurations and operations are the same as those in the first modification (FIG. 12) of the first embodiment.

(Third Modification) FIG. 25 (B) is a partially enlarged side view of an optical transceiver according to a third modification of the present embodiment, and FIG. 25 (A) is a sectional view of FIG. XXV shown in)
It is the expanded sectional view cut | disconnected by the A-XXV A cutting line. In the optical transmitting / receiving device of the present modification, the second optical waveguide 13 is attached to the emission surface 122 of the first optical waveguide 12 via the lower cladding layer 60, and a portion excluding the emission surface 132 and the optical path conversion surface 13B. It is composed of a buried optical waveguide covered by an upper cladding layer 61. Other configurations and operations are the same as those of the first modification of the first embodiment (FIG. 1).
It is the same as the case of 2).

[Third Embodiment] Next, a third embodiment of the present invention will be described.
An embodiment will be described.

The present embodiment relates to an optical transmission / reception apparatus which employs a light receiving section having a small light receiving area to enable a high-speed reception operation and at the same time ensure sufficient reception sensitivity. In each of the above-described embodiments, if the first optical signal L1 as a received signal is used for high-speed signal transmission, the first optical signal L1 shown in FIGS. It is necessary to reduce the light receiving area of the unit 14 to increase the response speed of the light receiving unit 14. In order to be able to receive as much light incident on the first optical waveguide 12 as possible while using the light receiving section 14 having a small light receiving area, the cross-sectional area of the first optical waveguide 12 must be reduced. In some cases, the first optical waveguide 12 needs to have a smaller cross-sectional area than the cross-sectional area of the optical transmission line 1. In such a case, part of the first optical signal L1 emitted from the optical transmission line 1 leaks to the outside without being incident on the first optical waveguide 12, and as a result, The amount of light that arrives is reduced, and the receiving sensitivity is reduced. The optical transmission / reception device of the third embodiment can improve the reception sensitivity in such a case.

FIG. 26 is a plan view of an optical transceiver according to the third embodiment of the present invention. The basic configuration of the optical transceiver 10C shown in FIG. 26 is the first configuration shown in FIG. 1 and FIG.
10A is the same as that of the optical transmitting and receiving apparatus 10A according to the first embodiment, except that the optical transmission line 1 is placed on the substrate 11 between the entrance surface 121 of the first optical waveguide 12 or the exit surface 132 of the second optical waveguide 13. And a condensing unit 70 for condensing at least the first optical signal L1 emitted from the optical transmission line 1. The light collecting unit 70 is a lens for optical coupling. As the optical coupling lens, a normal optical lens such as a spherical lens as shown in FIG. 26 or an aspherical lens (not shown), as well as a cylindrical refractive index distribution type lens or the like can be used.

In the optical transmitting and receiving apparatus 10 C according to the present embodiment, the provision of the condensing section 70 makes it possible to effectively reduce the cross-sectional area of the first optical waveguide 12 as compared with the case of the first embodiment. The light receiving unit 14 having a smaller light receiving area than that of the first embodiment can be used. The light transmission path 1
This is because the optical signal input / output coupling efficiency between the first optical waveguide 12 and the first optical waveguide 12 can be improved. Specifically, the first optical signal L1 that has propagated through the optical transmission line 1 is condensed by the condensing unit 70 and efficiently guided to the first optical waveguide 12, and The second that has propagated
The optical signal L2 of the optical transmission line 1
It is guided efficiently to. That is, even when the light receiving unit 14 having a small light receiving area is used, the amount of light received by the light receiving unit 14 can be increased, so that a high-speed receiving operation can be performed and the receiving sensitivity can be improved at the same time.

The condensing section 70 is formed by modularizing the first optical waveguide 12 having the second optical waveguide 13 mounted on the substrate 11, the light receiving section 14, the light emitting section 15, and the monitor light receiving section 16 for light emission. At the same time as mounting the light transmitting semiconductor element 17 or the like, or before or after mounting. For attaching the light collector 70, for example, an adhesive can be used.

(Modification) The condensing section 70 used in the optical transceiver 10C according to the present embodiment is applicable to the optical transceiver 10B according to the second embodiment.
That is, the optical transmitting and receiving apparatus 1 shown in FIGS.
At 0B, a condensing portion 70 can be provided between the optical transmission line 1 and the incident surface 121 of the first optical waveguide 12.

[Fourth Embodiment] Next, a fourth embodiment of the present invention will be described with reference to FIGS.

FIG. 28 is a plan view of an optical transceiver 10D according to a fourth embodiment of the present invention, and FIG. 27 is a sectional view taken along the line XXVII-XXVII in FIG. In this figure, the same components as those shown in FIGS. 1 and 2 are denoted by the same reference numerals, and the description thereof will not be repeated.

In each of the above embodiments, the first optical waveguide 1
In this embodiment, the light receiving section 14 is arranged on the substrate 11 itself instead of the light receiving section 14 as shown in FIGS. 27 and 28.
1 is formed. More specifically, the optical transceiver 10D according to the present embodiment includes an optical path conversion surface 125 provided so as to be in contact with the emission surface 122 of the first optical waveguide 12 and the surface of the substrate 11, and an optical path conversion surface 125. And a light receiving portion 141 formed on the surface of the substrate 11 below the light receiving portion 141. The optical path conversion surface 125 converts the first optical signal L1 in a direction different from this direction (the direction of the substrate 11) and emits it. The light receiving unit 141 includes an optical path conversion surface 125.
For receiving the first optical signal L1 whose propagation direction has been changed.

The optical transmission / reception device 10D also collects the first optical signal L1 emitted from the optical transmission line 1 between the optical transmission line 1 and the incident surface 121 of the first optical waveguide 12. First
Light condensing unit 70 that is incident on the incident surface 121 of the optical waveguide 12 of FIG.
Are arranged.

As the substrate 11, for example, a silicon semiconductor substrate is used. The light receiving section 141 is formed on the surface of the substrate 11 by using a semiconductor manufacturing technique. The light receiving section 141 is formed, for example, as a photodiode.

The optical path conversion surface 125 is provided on the first optical waveguide 12.
And the propagation direction of the first optical signal L1 incident on the incident surface 125A that is inclined at approximately 45 degrees with respect to the surface of the substrate 11 and is in contact with the exit surface 122 of the first optical signal L1. Optical path conversion surface 1 for conversion toward the surface of substrate 11
It is configured as a triangular prism having a light-emitting surface 125 </ b> C that emits the first optical signal L <b> 1 toward a light-receiving unit 141 disposed on the substrate 11 in contact with the surface of the substrate 11.

The optical path conversion surface 125 is desirably transparent to the operating wavelength of the first optical signal L1, and can be formed of, for example, a polymer material or a plastic material. Materials and the like may be used. The optical path conversion mirror 125B may be merely an inclined surface, but a metal film of, for example, Au or Al, or an enhanced reflection film such as a dielectric reflection film is formed on the inclined surface, and the first reflection mirror is formed.
Of the optical signal L1 at the time of reflection may be reduced. At least the incident surface 125 of the optical path conversion surface 125
The interface between A and the exit surface 122 of the first optical waveguide 12 is preferably non-reflective to the first optical signal L1 to reduce light loss. Therefore, the optical path conversion surface 125 is made of a material having the same refractive index as that of the first optical waveguide 12, and the optical path conversion surface 125 and the first optical waveguide 12 are bonded using a bonding agent having the same refractive index. Is preferred. Alternatively, it is also preferable that the optical path conversion surface 125 is not formed as a separate component from the first optical waveguide 12, but both are integrally formed of the same material. here,
The optical path conversion surface 125 corresponds to a specific example of “a second optical path conversion unit” in the present invention.

The optical transceiver 1 according to the present embodiment
In 0D, the cladding layer 63 is used as the second optical waveguide 13.
A buried optical waveguide buried in is used. However, the exit surface 132 and the optical path conversion surface of the second optical waveguide 13 are exposed.

Next, the operation of the optical transmission / reception device 10D thus configured will be described.

First, the first optical signal L 1 propagating in the optical transmission line 1 is condensed by the condensing section 70, and the first optical signal 1
2 incident surface 121. Further, the first optical signal L
Reference numeral 1 denotes an output surface 12 which propagates inside the first optical waveguide 12 and
2 is emitted. Further, the first optical signal L1 is incident on the incident surface 125A of the optical path conversion surface 125, propagates through the inside, and the propagation direction is changed by the optical path conversion surface 125B to the substrate 1.
The light is converted to a direction toward the surface of No. 1, emitted from the emission surface 125 </ b> C, and guided to the light receiving unit 141. The light receiving unit 141
The first light signal L1 is received, and a signal corresponding to the received light intensity is output.

On the other hand, the second optical signal L 2 emitted from the light emitting section 15 is incident on the incident surface 131 of the second optical waveguide 13. This second optical signal L2 propagates inside the second optical waveguide 13, is optically path-converted in the direction of the optical transmission line 1 by the optical path conversion surface 13B, and further reaches the emission surface 132 of the second optical waveguide 13. I do. Then, the second optical signal L <b> 2 is emitted from the emission surface 132, is collected through the light collecting unit 70, and is guided to the optical transmission path 1. Second optical signal L2
Propagates through the optical transmission line 1 and reaches the other party, where it is received. At this time, the light emitting state of the light emitting unit 15 (the transmission state of the second optical signal L2) is monitored by the light emitting monitoring light receiving unit 16.

According to the optical transmitting and receiving apparatus 10D according to the present embodiment, the optical path conversion surface 125 for converting the traveling direction of the first optical signal L1 emitted from the first optical waveguide 12 to the direction of the substrate 11 is arranged. As a result, the light receiving section 141 can be formed in the substrate 11. For this reason, the arrangement of the light receiving unit is easier than in the above embodiments in which the light receiving unit 14 is fixed to the emission surface 122 of the first optical waveguide 12, and the entire manufacturing process can be simplified. It is. Further, according to the present embodiment, similarly to the optical transceiver 10A according to the first embodiment, it is possible to realize optical bidirectional communication with a simple configuration using only one optical transmission line 1. And a reduction in the thickness of the entire device and a reduction in the size of the entire device can be realized.

Also, in the present embodiment, since the light condensing section 70 is provided, the light receiving section 14 having a small light receiving area can be used as in the case of FIG. Since the amount of light received by the unit 14 can be ensured, it is possible to prevent a decrease in reception sensitivity.

In the present embodiment, the light collecting section 70 is provided. However, if the diameter of the transmission path 1 is sufficiently smaller than the size of the light receiving section 141, for example, FIG.
As shown in (1), the light collector 70 may be omitted. In the optical transmitting and receiving apparatus 10E of this modification, the first optical signal L1 from the transmission line 1 is not very much transmitted through the second optical waveguide 13 even without the condensing unit 70 because the diameter of the transmission line 1 is small. It does not spread. For this reason, the first optical signal L1 reaches the light receiving unit 141 of the small specification relatively efficiently, and it is possible to simultaneously achieve the high-speed receiving operation and the prevention of the decrease in the receiving sensitivity.

As a modification of the present embodiment, for example, as shown in FIG. 30, the substrate 111 may be provided with a heat radiation function. Optical transmitting / receiving device 10 of the present modified example
F denotes a first optical waveguide 12 and a second optical waveguide 13 on a substrate 111 having a through hole 111a,
The unit including the optical path conversion surface 125B, the light emitting unit 15, and the light emitting monitor light receiving unit 16 is mounted on the electric circuit board 4.
1. The through hole 111 a of the substrate 111 is provided at a position corresponding to the emission surface 125 C of the optical path conversion surface 125. In the through hole 111a and on the electric circuit board 41, the first optical signal L
A light receiving unit 142 that receives light 1 is disposed. The first optical signal L1 emitted from the optical transmission line 1 propagates through each of the condensing unit 70, the first optical waveguide 12, and the optical path conversion surface 125, reaches the light receiving unit 142 through the through hole 111a, and is received. You.

According to the optical transceiver 10F, the substrate 1
Light receiving portion 14 as a semiconductor component formed separately from 11
2 is arranged on the electric circuit board 41, the substrate 111 does not need to be a silicon semiconductor, a gallium arsenide semiconductor or the like on which a circuit can be formed. Therefore, a heat dissipation substrate having a higher heat transfer coefficient than a silicon semiconductor or a gallium arsenide semiconductor can be used as the substrate 11. As such a heat dissipation substrate, a ceramic substrate such as barium titanate, aluminum oxide, lead zirconate-lead titanate (PZT), or a silicon carbide substrate can be used. Here, the substrate 11 as a heat dissipation substrate
Corresponds to a specific example of the “heat dissipation board” in the present invention.
By providing the substrate 11 with a heat dissipation function, the optical transceiver 10F can efficiently release the heat generated by the operation of the light emitting unit 15 to the electric circuit board 41 side.

When an electric circuit board is used, as in the case of the application example of the first embodiment (FIG. 10), for example, as shown in FIG. 31, a semiconductor is placed on the electric circuit board 41B. The bidirectional optical transmission module 40B can be configured by mounting the elements 42A to 42D. Note that FIG.
In FIG. 1, the same components as those shown in FIG. 10 are denoted by the same reference numerals, and description thereof will be omitted.

[Fifth Embodiment] Next, a fifth embodiment of the present invention will be described with reference to FIGS.

FIG. 33 is a plan view of an optical transceiver 10E according to a fifth embodiment of the present invention, and FIG. 32 is a sectional view taken along the line XXXII-XXXII in FIG. FIG. 34 (B) is an enlarged side view of the optical waveguide portion of the optical transceiver 10G, and FIG. 34 (A) is the XX in FIG. 34 (B).
It is arrow sectional drawing cut | disconnected by XIV-XXXIV cutting line. As shown in these figures, the optical transceiver 10 according to the present embodiment
In G, the second optical waveguide 13 is provided between the emission surface 122 of the first optical waveguide 12 and the optical path conversion surface 125. More specifically, the second optical waveguide 13 is attached to the emission surface 122 of the first optical waveguide 12. Note that FIG.
In FIG. 2 and FIG. 33, the second optical waveguide 13 and the optical path conversion surface 125 are drawn so as to be in contact with each other, but they may be separated from each other. The second optical waveguide 13 is a ridge-type optical waveguide having the same structure as the second optical waveguide of the second embodiment. Other configurations are the same as those in the fourth embodiment (FIGS. 27 and 28).

According to the optical transmission / reception device 10G of this embodiment, as in each of the above embodiments, it is possible to realize optical bidirectional communication with a simple configuration using only one optical transmission line 1. At the same time, it is possible to reduce the thickness of the entire device and the size of the entire device. Further, similarly to the optical transmission / reception device 10D according to the fourth embodiment, since the light receiving section 141 can be disposed on the substrate 11, the arranging process can be simplified. Further, as in the third embodiment, the light-collecting operation of the light-collecting unit 70 enables a high-speed receiving operation, and at the same time, improves the receiving sensitivity.

Further, in the present embodiment, although the second optical waveguide 12 is attached to the emission surface 122 of the first optical waveguide 12 for the first optical signal L1, the second optical waveguide 1
Since the optical path conversion surface 125 is interposed between the light receiving portion 3 and the light receiving portion 141, the second optical waveguide 12 and the light receiving portion 141 can be separated from each other with the optical path conversion surface 125 interposed therebetween. Therefore, the crosstalk caused by the light receiving section 141 picking up the second optical signal L2 as noise can be reduced, and the receiving sensitivity of the optical transceiver 10G can be further improved.

(First Modification) FIG. 35 (B) is an enlarged side view of an optical waveguide portion of an optical transceiver according to a first modification of the present embodiment, and FIG. FIG. 35 is an enlarged cross-sectional view of the optical transmission / reception device taken along the line XXXVA-XXXVA at 35 (B). In the present modification, the second optical waveguide 13 of the optical transmitting and receiving device is connected to the emission surface 122 of the first optical waveguide 12.
The second optical waveguide 13 is a ridge-type optical waveguide.

(Second Modification) FIG. 36B is an enlarged side view of an optical waveguide portion of an optical transceiver according to a second modification of the present embodiment, and FIG. FIG. 36 is an enlarged cross-sectional view of the optical transmitting and receiving device taken along a cutting line XXXVI A-XXXVIA shown in FIG. In this modification, the second optical waveguide 13 is directly attached to the emission surface 122 of the first optical waveguide 12, and the portion other than the emission surface 132 is covered by the upper cladding layer 63. Wave path 1
Reference numeral 3 denotes a buried optical waveguide. An opening 64 is formed in a portion of the cladding layer 63 corresponding to the emission surface 132. The opening 64 is formed by, for example, a photolithography process.

(Third Modification) FIG. 37 (B) is an enlarged side view of an optical waveguide part of an optical transceiver according to a third modification of the present embodiment, and FIG. 37 (A) is FIG. XX shown in B)
FIG. 7 is an enlarged cross-sectional view of the optical transmitting / receiving device taken along a cutting line XVII-XXXVII. In this modification, the second optical waveguide 13 is attached to the emission surface 122 of the first optical waveguide 12 via the lower cladding layer 60, and a portion excluding the emission surface 132 is covered with the upper cladding layer 63. And the second optical waveguide 13 is a buried optical waveguide.

(Fourth Modification) FIG. 38 (B) is an enlarged side view of an optical waveguide part of an optical transceiver according to a fourth modification of the present embodiment, and FIG. 38 (A) is FIG. FIG. 8B is an enlarged cross-sectional view of the optical transmitting and receiving device taken along the line XXXVIIIA-XXXXVIIIA shown in FIG. In this modification, the inclined surface of the optical path conversion surface 13B of the second optical waveguide 13 and the lower clad layer 6
0 and the end surface of the upper cladding layer 63 are formed so as to form a common slope. Such a structure
For example, after sequentially stacking the lower cladding layer 60, the second optical waveguide 13, and the upper cladding layer 63, patterning is performed by a photolithography process to form a rough shape, and further, using a dicing blade (not shown). It can be formed by removing unnecessary portions in a lump.

Although the present invention has been described with reference to some embodiments, the present invention is not limited to the above-described embodiments, and can be variously modified as follows.

For example, in each of the embodiments described above, the incident end face of the second optical waveguide 13 has been described as being flat.
The present invention is not limited to this, and as shown in FIG.
May be formed as a curved surface. Here, FIG. 39A is a side view of an optical waveguide portion of an optical transmitting and receiving apparatus 10H according to this modification, and FIG.
(B) is a plan view thereof. As shown in these drawings, the second optical waveguide 113 includes an incident surface 133 having a light collecting function for collecting the second optical signal L2. When a semiconductor laser is used for the light emitting unit 15, the emission spread angle of the second optical signal L2 emitted from the semiconductor laser is increased in the lateral direction (direction parallel to the substrate 11) shown in FIG. For the angle θh (= about 8 to 10 degrees), FIG.
The spread angle θv (= about 30 degrees) in the vertical direction (direction perpendicular to the substrate 1) shown in FIG. For this reason, by forming the incident surface 113a of the second optical waveguide 113 with a curved surface that condenses at least the spread in the vertical direction, the second surface
Can be condensed and incident on the second optical waveguide 13. In particular, this is effective for the second optical waveguide 13 in which the NA (numerical aperture) of the incident surface 113a is small.
Note that the incident surface 113a of the second optical waveguide 113 may be formed as a curved surface that also collects light in the lateral direction.

In the third to fifth embodiments,
The optical path conversion surface 125B of the optical path conversion surface 125 has been described as being a flat surface, or the light path conversion surface 125B may be provided as a convex curved surface instead of a flat surface to have a light condensing function. In this structure, a light-collecting function can be easily realized by attaching an optical member having a convex curved surface, which is separately manufactured, to an inclined surface (flat surface) that is the optical path conversion surface 125B.

Further, the optical switch device and the optical transmission / reception device of the present invention may be configured by combining at least two or more of the first to fifth embodiments. It is possible.

[0117]

As described above, the optical switch device according to any one of claims 1 to 9 or the optical transmission / reception device according to any one of claims 9 to 15 can be provided. According to this, the first optical waveguide that guides the first light incident from the first surface so as to be emitted in a predetermined direction, has entered the first surface from the direction different from the first light on the first surface. Second
The second waveguide is provided to guide the light in a direction opposite to the incident direction of the first light. Therefore, the optical switch for the light propagating in both directions is provided with a simple and small configuration. This has the effect that the function can be realized. In particular, according to the optical transmission / reception device according to any one of claims 9 to 15, such an optical switch function and the function of the light emitting unit and the light receiving unit allow the use of a single optical transmission line. This has the effect of enabling optical transmission in one direction.

Further, according to the optical switching device of the sixth aspect, since the first light condensing means is provided, the transmission speed can be increased without lowering the receiving sensitivity. Play.

Further, according to the optical transmission / reception device of the present invention, since a plurality of first optical waveguides and a plurality of second optical waveguides are provided, an optical transmission / reception device having a multi-channel structure is realized. It has the effect that it can be done.

According to the method for manufacturing an optical switching device according to claim 16 or the method for manufacturing an optical transmitting / receiving device according to claim 18, the first method of manufacturing a transparent substrate used as a first optical waveguide. After forming the optical waveguide forming layer on the surface or the second surface, the other portion is removed except for a part of the optical waveguide forming layer, and the remaining optical waveguide forming layer is used as a second optical waveguide. Therefore, the number of steps for mounting the second optical waveguide on the first optical waveguide can be reduced, and the number of manufacturing steps can be reduced.

According to the method for manufacturing an optical switching device according to claim 17 or the optical transmitting and receiving device according to claim 19, after forming the second optical waveguide on the dummy substrate, the second optical waveguide is formed. Since the optical waveguide is transferred to the first surface or the second surface of the transparent substrate used as the first optical waveguide, for example, the transparent substrate is directly transferred onto the transparent substrate due to a material or other factors. Even when it is not preferable to form the second optical waveguide, it is possible to manufacture the optical switching device of the present invention.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating a configuration of an optical transmitting and receiving apparatus according to a first embodiment of the present invention (a cross-sectional view taken along a line II in FIG. 2).

FIG. 2 is a plan view illustrating a configuration of the optical transceiver according to the first embodiment of the present invention.

FIG. 3A is a cross-sectional view of a main part of the optical transceiver according to the first embodiment of the present invention (III-A in FIG. 3B).
A is a cross-sectional view taken along section line A, and (B) is a side view thereof.

FIG. 4 is a perspective view for explaining one manufacturing process of the optical transceiver according to the first embodiment of the present invention.

FIG. 5 is a perspective view for explaining a manufacturing step following FIG. 4;

FIG. 6 is a perspective view for explaining a manufacturing step following FIG. 5;

FIG. 7 is a perspective view for explaining a manufacturing step following FIG. 6;

FIG. 8 is a characteristic diagram showing a relationship between a light transmittance and a light wavelength of the epoxy resin according to the first embodiment of the present invention.

FIG. 9 is a perspective view showing an opening pattern shape of a light shielding film in the photomask according to the first embodiment of the present invention.

FIG. 10 is a sectional view illustrating a configuration of a bidirectional optical transmission module that is a first application example according to the first embodiment of the present invention.

FIG. 11 is a plan view illustrating a configuration of an optical transceiver having a multi-channel structure, which is a second applied example according to the first embodiment of the present invention.

FIG. 12A is a cross-sectional view of a main part of an optical transceiver according to a first modification of the first embodiment of the present invention (a cross-sectional view taken along the line XIIIA-XXIIA in FIG. 12B); And
(B) is a side view thereof.

FIG. 13A is a cross-sectional view of a main part of an optical transceiver according to a second modification of the first embodiment of the present invention (a cross-sectional view taken along line XIIIA-XIIIA in FIG. 13B); And
(B) is a side view thereof.

FIG. 14A is a cross-sectional view of a main part of an optical transceiver according to a third modification of the first embodiment of the present invention, which is a cross-section taken along line XIV A-XIV A in FIG. Figure)
(B) is a side view thereof.

FIG. 15 is a cross-sectional view (a cross-sectional view taken along the line XV-XV in FIG. 16) illustrating the configuration of the optical transceiver according to the second embodiment of the present invention.

FIG. 16 is a plan view illustrating a configuration of an optical transceiver according to a second embodiment of the present invention.

17A is a cross-sectional view (a cross-sectional view taken along a cutting line XVIIA-XVIIA in FIG. 16B) of a main part of the optical transceiver illustrated in FIG. 16, and FIG. 17B is a side view thereof. .

FIG. 18 is a cross-sectional view for explaining one manufacturing step of the optical transceiver according to the second embodiment of the present invention.

FIG. 19 is a cross-sectional view for explaining a manufacturing step following FIG. 18;

FIG. 20 is a cross-sectional view for explaining a manufacturing step following FIG. 19;

FIG. 21 is a cross-sectional view for explaining a manufacturing step following FIG. 20;

FIG. 22 is a cross-sectional view for explaining a manufacturing step following FIG. 21;

FIG. 23A is a cross-sectional view of a main part of an optical transceiver according to a first modification of the second embodiment of the present invention, which is taken along line XXIII A-XXIII A in FIG. (B) is a side view thereof.

FIG. 24A is a cross-sectional view of a main part of an optical transceiver according to a second modification of the second embodiment of the present invention (a cross-sectional view taken along line XXIVA-XXIVA in FIG. 24B); And
(B) is a side view thereof.

FIG. 25A is a sectional view of a waist of an optical transceiver according to a third modified example of the second embodiment of the present invention (a sectional view taken along line XXV A-XXV A in FIG. 25B); )
(B) is a side view thereof.

FIG. 26 is a plan view illustrating a configuration of an optical transceiver according to a third embodiment of the present invention.

FIG. 27 is a sectional view (XXVII-XXVII in FIG. 28) showing the configuration of the optical transceiver according to the fourth embodiment of the present invention.
It is an arrow sectional view cut by the cutting line).

FIG. 28 is a plan view illustrating a configuration of an optical transceiver according to a fourth embodiment of the present invention.

FIG. 29 is a cross-sectional view illustrating a configuration of an optical transceiver according to a modification of the fourth embodiment of the present invention.

FIG. 30 is a cross-sectional view illustrating a configuration of an optical transceiver according to another modification of the fourth embodiment of the present invention.

FIG. 31 is a cross-sectional view illustrating a configuration of a bidirectional optical transmission module of an application example according to the fourth embodiment of the present invention.

FIG. 32 is a sectional view (XXXII-XXXII in FIG. 33) showing the configuration of the optical transceiver according to the fifth embodiment of the present invention;
It is an arrow sectional view cut by the cutting line).

FIG. 33 is a plan view illustrating a configuration of an optical transceiver according to a fifth embodiment of the present invention.

34A is a cross-sectional view (a cross-sectional view taken along the line XXXIV-XXXIV in FIG. 33B) of a main part of the optical transceiver shown in FIG. 33, and FIG. 34B is a side view thereof. .

FIG. 35A is a cross-sectional view of a main part of an optical transceiver according to a first modified example of the fifth embodiment of the present invention, cut along a line XXXVA-XXXVA in FIG. Yes,
(B) is a side view thereof.

FIG. 36A is a cross-sectional view of a main part of an optical transceiver according to a second modification of the fifth embodiment of the present invention, taken along line XXXVI A-XXXVI A in FIG. (B) is a side view thereof.

FIG. 37A is a cross-sectional view of a main part of an optical transceiver according to a third modification of the fifth embodiment of the present invention, which is taken along the line XXXVII-XXXVII shown in FIG. )
(B) is a side view thereof.

FIG. 38A is a cross-sectional view of a main part of an optical transceiver of a fourth modified example according to the fifth embodiment of the present invention. FIG. 38B is a cross-sectional view taken along line XXXVIII A-XXXVIII A in FIG. (B) is a side view thereof.

FIG. 39 (A) is a side view of a main part of an optical transceiver according to a modification of each embodiment of the present invention, and FIG. 39 (B) is a plan view thereof.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Optical transmission line, 10A-10H, 11 ... Substrate, 12 ... 1st optical waveguide, 13 ... 2nd optical waveguide, 13B, 125
... Optical path conversion surface, 14, 141, 142.
Light-emitting part, 16: light-receiving part for light emission monitoring, 17: semiconductor element for light transmission, 20: bump electrode, 37: photomask, 4
0A, 40B ... bidirectional optical transmission module, 41A, 41
B: electric circuit board, 42A to 42D: semiconductor element, 50
... Optical transmitter / receiver having a multi-channel structure, 60 and 61... Cladding layer, 70.
Transparent substrate, 121, 131, 125A, 133 ... entrance surface, 122, 132, 125C ... exit surface, 125B ... optical path conversion surface, 130 ... optical waveguide forming layer, L1 first optical signal, L2 ... second light signal.

Continued on the front page (72) Inventor Takahiko Kosemura 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Inside Sony Corporation (72) Inventor Yuji Nishitani 6-7-35 Kita-Shinagawa, Shinagawa-ku, Tokyo Sony F term (reference) 2H037 AA01 BA03 BA12 CA38 DA03 DA04 DA05 DA06 DA16 5K002 AA05 AA07 BA13 BA21 BA31 DA04 FA01

Claims (19)

[Claims] 1. A first optical waveguide having a first surface on which a first light is incident and a second surface on which the first light incident from the first surface is emitted; Attached to one of the first surface and the second surface of the optical waveguide of the first type, and makes the second light incident from a different direction from the first light with respect to the incident direction of the first light. A second optical waveguide for guiding light to be emitted in a reverse direction. 2. The optical switching device according to claim 1, wherein the second optical waveguide is attached to the first surface of the first optical waveguide. 3. The optical switching device according to claim 1, wherein the second optical waveguide is attached to the second surface of the first optical waveguide. 4. The optical switch according to claim 1, wherein the first optical waveguide is formed of a rectangular parallelepiped. 5. The first optical path for converting the traveling direction of the second light propagating therethrough after incidence into a direction opposite to the incidence direction of the first light. 2. The apparatus according to claim 1, further comprising a conversion unit.
An optical switching device according to claim 1. 6. The first optical waveguide, wherein the first optical waveguide is incident on the first surface of the first optical waveguide.
The light switching device according to claim 1, further comprising a first light condensing means for condensing the light. 7. A second optical path changing means for changing a traveling direction of the first light emitted from the second surface of the first optical waveguide into a direction different from the traveling direction of the first light. The optical switch device according to claim 1, wherein: 8. The light path according to claim 1, further comprising a second light condensing means for converging the second light incident on the second optical waveguide. Rut device. 9. A first optical waveguide having a first surface on which first light is incident, and a second surface on which the first light incident from the first surface is emitted; A light receiving unit that receives the first light emitted from the optical waveguide; a light emitting unit that emits the second light in a direction different from the direction of the first light; and a light emitting unit that emits the second light in the first optical waveguide. It is attached to one of the first surface and the second surface, and guides the second light emitted from the light emitting unit and incident so as to be emitted in a direction opposite to the incident direction of the first light. An optical transmitting and receiving device comprising: a second optical waveguide. 10. The optical transmitting and receiving device according to claim 9, wherein the light receiving section is disposed so as to face the second surface of the first optical waveguide. 11. The light according to claim 9, further comprising a support substrate that supports the first optical waveguide and the light emitting unit in common, wherein the light receiving unit is formed on the support substrate. Transceiver. 12. The apparatus according to claim 12, further comprising: a second optical path converting unit configured to convert a traveling direction of the first light emitted from the second surface of the first optical waveguide into a different direction. The optical transceiver according to claim 11, wherein the first light whose traveling direction has been changed by the second optical path changing unit is received by the light receiving unit. 13. A support substrate for commonly supporting the first optical waveguide and the light emitting portion, an electric wiring substrate on which the support substrate and various electric components are mounted, and on which an electric wiring pattern is formed. The optical transmission / reception device according to claim 9, wherein the light receiving unit is disposed inside a through hole provided in the support substrate in a region on the electric wiring board. 14. The optical transceiver according to claim 13, wherein said support substrate has a heat radiation function. 15. A plurality of first optical waveguides for guiding a plurality of first lights incident in parallel so as to be emitted in predetermined directions, respectively, and a first light emitted from the plurality of first optical waveguides. A plurality of light receiving units for respectively receiving light; a plurality of light emitting units for respectively emitting second light in a direction different from the direction of the first light; and the first surface of the first optical waveguide Or a plurality of second light guides attached to one of the second surfaces for guiding the second light emitted and emitted from each of the light emitting units in a direction opposite to the incident direction of the first light. An optical transceiver having a multi-channel structure, comprising: two optical waveguides. 16. A first optical waveguide having a first surface on which first light is incident, a second surface on which the first light incident from the first surface is emitted, and the first optical waveguide. The second light, which is attached to one of the first surface and the second surface of the optical waveguide and is incident from a different direction from the first light, is retrograde to the incident direction of the first light. A second optical waveguide for guiding light to be emitted in a direction in which the light is emitted, wherein the first surface or the second surface of the transparent substrate used as the first optical waveguide is provided. Forming a second optical waveguide composed of the predetermined portion by selectively removing a portion of the optical waveguide formation layer other than a predetermined portion. A method for manufacturing an optical switching device, comprising: 17. A first optical waveguide having a first surface on which first light is incident and a second surface on which the first light incident from the first surface is emitted; The second light, which is attached to one of the first surface and the second surface of the optical waveguide and is incident from a different direction from the first light, is retrograde to the incident direction of the first light. A method for manufacturing an optical switching device comprising: a second optical waveguide for guiding light to be emitted in a direction in which light is emitted in a direction in which the optical waveguide is formed. Forming a second optical waveguide composed of the predetermined portion by selectively removing a portion excluding the predetermined portion, and a second optical waveguide formed on the dummy substrate, 1
Transferring to the first surface or the second surface of the transparent substrate used as the optical waveguide of (1). 18. A first optical waveguide having a first surface on which a first light is incident and a second surface on which the first light incident from the first surface is emitted; A light receiving unit that receives the first light emitted from the optical waveguide, a light emitting unit that emits the second light in a direction different from the direction of the first light, and a light emitting unit that emits the second light. The first surface or the second
And a second optical waveguide that is attached to one of the surfaces and guides the second light emitted from the light emitting unit and incident in a direction opposite to the incident direction of the first light. A method of manufacturing an optical transceiver including: a step of forming an optical waveguide forming layer on the first surface or the second surface of a transparent substrate used as a first optical waveguide; Forming a second optical waveguide composed of the predetermined portion by selectively removing portions other than the predetermined portion, and a surface of the second optical waveguide on which the second light is incident. Arranging the light-emitting unit so as to face the light-emitting unit, and arranging the light-receiving unit at a position facing the second surface of the transparent substrate used as a first optical waveguide or at a position near the same. A method for manufacturing an optical transmitting / receiving device, comprising: 19. A first optical waveguide having a first surface on which a first light is incident and a second surface on which the first light incident from the first surface is emitted; A light receiving unit that receives the first light emitted from the optical waveguide, a light emitting unit that emits the second light in a direction different from the direction of the first light, and a light emitting unit that emits the second light. The first surface or the second
And a second optical waveguide that is attached to one of the surfaces and guides the second light emitted from the light emitting unit and incident in a direction opposite to the incident direction of the first light. A method of forming an optical waveguide forming layer on a predetermined dummy substrate, and selectively removing portions of the optical waveguide forming layer except for a predetermined portion. Forming a second optical waveguide composed of the predetermined portion; and forming the second optical waveguide formed on the dummy substrate into a first optical waveguide.
Transferring to the first surface or the second surface of a transparent substrate used as an optical waveguide, and emitting the light so as to face the surface of the second optical waveguide on which the second light is incident. Arranging a light-receiving section at a position facing the second surface of the transparent substrate used as a first optical waveguide or at a position near the second light-receiving section. Device manufacturing method.