JP2001102723A - Device for forming resist layer on conductive substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To dispense with the cleaning of a clamping. SOLUTION: A device for forming resist layer on conductive substrate is provided with a controller, having a function of controlling a transporter so as to transport a conductive substrate in one direction, and thereafter in the opposite direction between an application roll and its counter member and another function of controlling opening/closing operation between the application roll and counter member, so that the portions of the substrate having preset lengths from the upper and lower end sections of the substrate is not coated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for forming a resist layer on a conductive substrate having a through hole and / or a non-through hole.

[0002]

2. Description of the Related Art Conventionally, when manufacturing a printed circuit board having a through-hole portion and / or a non-through-hole portion (hereinafter sometimes simply referred to as a "through-hole portion"),
The liquid resist is applied by a spray coating method, a silk screen method or a roll coating method. When a liquid resist is directly applied to a substrate using these coating methods, a sufficient resist film is not formed inside the through-hole portion, and the inside of the through-hole portion is partially dissolved by an etchant in an etching process, resulting in disconnection. There is a problem that such a problem occurs.

[0003] In order to solve this problem, the present inventors first apply a liquid resist in the forward rotation by a roll coating method, and then apply a reverse rotation before the liquid resist is dried, thereby removing the liquid resist. At the same time as pushing into the inside of the through hole, a smooth coating surface can be obtained,
Further, when a solder resist or an interlayer insulating material for a build-up substrate is applied to a conductive circuit pattern and a conductive substrate having a through hole portion and / or a non-through hole, the resist is filled into the through hole and the non-through hole and a space between the fine line patterns is formed. We have proposed an apparatus that can easily form a reliable solder resist and interlayer insulating film because the resist is completely filled.

However, when coating with a roll coater, the entire object to be coated is coated, and it is necessary to hold the upper end and the lower end of the object by a jig in order to transport the object into the dryer. Therefore, there has been a problem that the jig must be cleaned frequently.

[0005]

Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, completed the present invention.

Thus, according to the present invention, there is provided an apparatus for forming a resist layer on a conductive substrate having a through-hole and / or a non-through hole, comprising a transfer device for transferring a conductive substrate having a through-hole. An application roll that rotates in one rotation direction, for applying a liquid resist to the conductive substrate transported by the transport device,
An opposing member that opposes the application roll, with the conductive substrate conveyed by the conveyance device interposed therebetween,
Between the application roll and the opposing member, transport the conductive substrate in one transport direction, and then
A function of controlling the transfer device so as to transfer in the transfer direction opposite to the one transfer direction, and the application so as not to paint a preset length from the upper end and the lower end of the conductive substrate. An apparatus for forming a resist layer on a conductive substrate, comprising: a control device having a function of controlling opening and closing operations between a roll and an opposing member.

Further, according to the present invention, there is provided an apparatus for forming a resist layer on a conductive substrate having a through-hole portion and / or a non-through hole portion, comprising a transfer device for transferring a conductive substrate having a through-hole portion. An application roll rotating in one rotation direction for applying a liquid resist to the conductive substrate transported by the transport device, and the application roll sandwiched by the conductive substrate transported by the transport device. An opposing member, between the application roll and the opposing member, transports the conductive substrate in one transport direction, and paints a predetermined length from the upper end and the lower end of the conductive substrate. A control device having a function of controlling an opening / closing operation between the application roll and the opposing member so that the application roll does not move. Apparatus is provided for forming a resist layer on a substrate.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Examples of a conductive substrate having a through hole to which the apparatus of the present invention is applied include a substrate having a conductive film formed on the surface and the inner surface of the through hole. As an example, for example, by bonding a metal foil such as copper or aluminum to a substrate surface such as a plastic film such as an electrically insulating glass-epoxy plate, or a metal such as copper or indium oxide-tin on the substrate surface. By forming a conductive film of a compound such as a conductive oxide represented by (ITO) by a method such as vacuum evaporation, a through-hole portion is provided in a base material having a conductive surface. A substrate having a conductive film formed on the inner surface thereof by, for example, copper plating; a substrate having a conductive circuit pattern formed on the substrate by a photographic method or the like; or a metal On a substrate on which a conductor pattern is formed, an insulating resin layer is provided, a non-through hole is formed in the resin layer by laser processing or a photographic method, and then the inner surface of the non-through hole portion is formed by a method such as copper plating. A substrate having a conductive film formed on the surface of an insulating resin layer; a substrate having a conductive circuit pattern formed on the substrate by a photographic method or the like;

The liquid resist to be coated on the substrate having the above-mentioned through-hole portion by using the apparatus of the present invention may be any liquid resist which can be used for forming a printed board, and includes a negative photoresist, a positive photoresist, a solder Any of a resist, an interlayer insulating material and the like can be used.

When the liquid resist is applied using the apparatus of the present invention, when the liquid resist is applied by the forward rotation roll, the liquid resist is once pushed into the through holes or between the fine wire circuit patterns. Due to the rotation, it is lifted again and comes out of the through hole.
However, since the liquid resist is applied again by the counter-rotating roll, the rotation of the roll is in the direction of pushing the liquid resist into the inside of the through-hole or between the fine wire circuit patterns, so the liquid resist is applied to the inside of the through-hole or the like. It is pushed between the fine wire circuit patterns. As the roll coater, a conventionally known roll coater in which two application rolls are arranged facing each other can be used, and both sides can be simultaneously coated. Thus, a resist layer can be formed on a substrate having a through hole.

In the case where the liquid resist is satisfactorily applied only by forward rotation roll coating, the control device in the apparatus of the present invention may have only a function of controlling the opening / closing operation between the application roll and the opposing member.

In order to manufacture a printed wiring board, a resist pattern formed by exposing and developing a resist layer formed on a substrate having a through hole using the apparatus of the present invention is formed. Etching and removal of the remaining resist layer are performed.

In the formation of the interlayer insulating layer for a build-up substrate, the insulating material may be photo-curable or thermo-curable. In the latter case, a non-through hole is formed by a laser processing machine or the like. can do.

[0014]

Next, an apparatus for forming a resist layer on a conductive substrate according to an embodiment of the present invention will be described with reference to FIG.

This device has a conductive substrate having a through-hole portion (hereinafter sometimes simply referred to as a “conductive substrate”).
And a roll coater 14 for applying a liquid resist to the conductive substrate 10
And a control device 16 for controlling the operation of the transport device 12, and an opening and closing device (FIG. 4) for opening and closing the first and second application rolls 30 and 32.

The transport device 12 is coupled to a drive motor device 20 having a chain gear 18, an idle wheel 22, a chain 24 connected to the chain gear 18 and the idle wheel 22 of the drive motor device 20, and a chain 24. And a hanger 26.

The drive motor unit 20 is rotated in the forward and reverse directions by the control unit 16 as described below, whereby the chain gear 18 is rotated in the forward and reverse directions, and the chain 24 is rotated in the forward and reverse directions. And the hanger 26 moves up and down.

The hanger 26 has a holding portion 28 for holding the conductive substrate 10.

The roll coater device 14 includes first and second application rolls 30 and 32 for sandwiching the conductive substrate 10 therebetween and applying a liquid resist on both surfaces of the conductive substrate 10, and first and second application rolls 30. And 32, respectively, for supplying a liquid resist to
First and second doctor rolls 38 and 40 for adjusting the amount of liquid resist in pickup rolls 34 and 36 and first and second application rolls 30 and 32
And The first and second pickup rolls 34 and 36 are removed, and the first and second application rolls 30 and 32 and the first and second doctor rolls 38 and 40 are removed.
A liquid resist may be supplied between the steps.

In this embodiment, the second application role 32 acts as a counterpart to the first application role 30 and the first application role 30
Acts as an opposing member of the second application roll 32, and simultaneously applies a liquid resist to both surfaces of the conductive substrate 10. Instead, a backup roll to which the liquid resist is not applied is disposed as a counter member of the first application roll 30. First, the liquid resist is applied to one surface of the conductive substrate 10, and then, the conductive substrate 10 May be reversed so that a liquid resist is applied to the other surface of the conductive substrate 10.

The control unit 16 includes sensors 42 and 44,
50 and 51, 52 and 53, and a controller 46 are provided. For example, one of the sensors 42 and 44 is a light emitting element and the other is a light receiving element, and when the conductive substrate 10 is lowered, the lower end of the conductive substrate 10 comes between the sensors 42 and 44. Is detected, and the detection signal is sent to the controller 46. When the detection signal is sent to the controller 46, the controller 46 reverses the rotation direction of the drive motor device 20.

For example, one of the sensors 50 and 51 is a light emitting element and the other is a light receiving element. When the conductive substrate 10 descends, the lower end of the conductive substrate 10 It detects that it has come in time and sends the detection signal to the controller 46. When the detection signal is sent to the controller 46, the controller 46 calculates the moving distance of the conductive substrate 10, and the lower end of the object 10 passes between the first and second application rolls 30 and 32 that are open. Immediately after closing, the paint is applied from a portion excluding a portion of a preset length from the lower end. Further, when the conductive substrate 10 descends and detects that the upper end of the conductive substrate 10 has come between these sensors 50 and 51, the detection signal is sent to the controller 46.
Send to When the detection signal is sent to the controller 46,
The controller 46 calculates the moving distance of the conductive substrate 10, opens the upper end of the conductive substrate 10 between the closed first and second application rolls 30 and 32 just before passing, and presets the upper end from the upper end. The application of the paint is completed at the portion of the length.

For example, one of the sensors 52 and 53 is a light emitting element and the other is a light receiving element, and when the conductive substrate 10 rises, the upper end of the conductive substrate 10 It detects that it has come in time and sends the detection signal to the controller 46. When the detection signal is sent to the controller 43, the controller 46 calculates the moving distance of the conductive substrate 10, and immediately after the upper end of the conductive substrate 10 passes between the opened first and second application rolls 30 and 32. And paint is applied from a portion excluding a portion of a preset length from the upper end. Further, the conductive substrate 10 rises, and the conductive substrate 1
It detects that the lower end of 0 has come between these sensors 52 and 53 and sends a detection signal to the controller 46. When the detection signal is sent to the controller 46, the controller 43 calculates the moving distance of the conductive substrate 10 and determines whether the first and second application rolls 3 are closed.
The lower end of the conductive substrate 10 is opened just before passing between 0 and 32, and the application of the paint is completed at a predetermined length from the lower end.

Since this resist layer forming apparatus is configured as described above, it operates as follows.

First, the conductive substrate 10 is manually or automatically gripped by the gripper 28 of the hanger 26.

The lower end of the conductive substrate 10 is disposed above the first and second application rolls 30 and 32,
The conductive substrate 10 is lowered by the transfer device 12,
At this time, when the conductive substrate 10 descends, the sensors 50 and 51 detect that the lower end of the conductive substrate 10 has come between these sensors 50 and 51, and transmit the detection signal to the controller 46. Send to When the detection signal is sent to the controller 46, the controller 46 calculates the moving distance of the conductive substrate 10 and moves the conductive substrate 10 between the open first and second application rolls 30 and 32.
Is closed immediately after passing, the conductive substrate 10 is sandwiched therebetween, and a portion excluding a portion of a predetermined length from the lower end is painted. As shown in FIG. 2, the moving directions of the surfaces of the first and second application rolls 30 and 32 that are in contact with the conductive substrate and the moving direction of the conductive substrate 10 are the same, whereby the forward rotation coating is performed. .

Further, when the conductive substrate 10 is lowered and it is detected that the upper end of the conductive substrate 10 has come between these sensors 50 and 51, the detection signal is sent to the controller 46.
Send to When the detection signal is sent to the controller 46,
The controller 46 calculates the moving distance of the conductive substrate 10, opens between the first and second application rolls 30 and 32 that are closed just before the upper end of the conductive substrate 10 passes, and sets in advance from the upper end. The application of the paint is completed except for the length of the specified length.

Further, when the conductive substrate 10 further descends,
The sensors 42 and 44 have a conductive substrate 10 between them, and the lower end of the conductive substrate 10 is
4 and a detection signal is sent to the controller 46, and the controller 46
The rotation direction of the rotation direction 20 of the conductive substrate 1 can be reversed.
0 starts to rise. The rotation directions of the first and second application rolls 30 and 32 are maintained in the same direction.

The sensors 52 and 53 detect that the upper end of the conductive substrate 10 has come between these sensors 52 and 53 when the conductive substrate 10 moves up, and send the detection signal to the controller. Send to 46. When the detection signal is sent to the controller 46, the controller 46 calculates the moving distance of the conductive substrate 10, and immediately after the upper end of the conductive substrate 10 passes between the open first and second application rolls 30 and 32. After being closed, the conductive substrate 10 is sandwiched, and the coating is applied except for a portion of a predetermined length from the upper end. As shown in FIG. 3, the direction of movement of the surfaces of the first and second application rolls 30 and 32 that are in contact with the conductive substrate 10 and the direction of movement of the conductive substrate 10 are reversed. Will be

Further, when the conductive substrate 10 descends and detects that the lower end of the conductive substrate 10 has come between these sensors 52 and 53, the detection signal is sent to the controller 46.
Send to When the detection signal is sent to the controller 46, the controller 64 calculates the moving distance of the conductive substrate 10 and determines whether the first and second application rolls 3 are closed.
The lower end of the conductive substrate 10 is opened just before passing between 0 and 32, and the coating of the paint is completed at a predetermined length from the upper end.

When forming a resist layer by the above method,
The opening and closing operations of the first and second application rolls 30 and 32 are repeated, but the opening distance is 1 to 1 from the conductive substrate.
00 mm, preferably 5 to 30 mm.

The opening and closing device shown in FIG. 4 for opening and closing the first and second application rolls 30 and 32 includes a first support frame 60 and a second support frame 6.
1 and a drive mechanism having a drive gear 62. The first support frame 60 supports the first application roll 30, the first pickup roll 34, and the first doctor roll 38. The second support frame 61 is
It supports the application roll 32, the second pickup roll 36, and the second doctor roll 40. The drive gear 62 is driven by a control mechanism and a drive motor (not shown).
It is driven to rotate. When the drive carrier 62 is rotated in the direction indicated by the arrow in the drawing, the first support frame 60 and the second support frame 61 are opened, and when rotated in the opposite direction, they are closed. The rotation angle of the drive gear 62 is controlled by the control mechanism, whereby the first support frame 6
The opening and closing positions of the 0 and the second support frames 61 are controlled.

The present invention has the following preferred or modified embodiments in addition to the above-described embodiment.

In the above embodiment, the transport device 12 includes the drive motor device 20, the chain 24, and the hanger 26. Alternatively, a device having a ball screw or a device having a linear motor may be used. it can. In addition, the conductive substrate can be moved up and down by an apparatus including an air cylinder or a hydraulic cylinder and a driving rod driven by the cylinder. In addition, the conductive substrate can be raised and lowered using an electric hoist.

Further, the fixing of the conductive substrate to the transfer device is performed as follows.
A hole may be formed in the conductive substrate and fixed to the hanger with a bolt. Alternatively, a hole may be formed in the conductive substrate and the hole may be fixed to a protrusion provided on the hanger. In this device, a force is applied to the conductive substrate only in one direction, so that the conductive substrate can be fixed by being hooked on a projection provided on a hanger. Also, the conductive plate can be sandwiched between the support plate and the hanger by connecting the support plate to the hanger with bolts and tightening the bolts.

If the application roll is thick, the portion of the conductive substrate that cannot be coated increases, so that the diameter of the application roll is preferably as thin as possible, preferably 200 mm or less, and more preferably 150 m.
m or less. However, since bending occurs during painting, when the application roll is formed of a rubber-wound roller, the diameter is preferably 20 mm or more.

When the application roll is formed by a rubber roll, a rubber material that does not dissolve in a solvent can be used. However, in consideration of penetration into a hole, it is preferable that the hardness is as soft as possible. However, if it is too soft, there is a problem in durability.
00, preferably 8 to 70, more preferably 10 to 50
It is about. The type of rubber used is butyl rubber,
EPT, EPDM, and the like.

The speed at which the conductive substrate moves up and down in the roll coater is determined by the size of the conductive substrate and is, for example, about 0.5 to 20 m / min.

The speed of the surface of the application roll is:
It is preferable that the speed is 0 to 10%, preferably 0 to 5% faster than the transport speed of the conductive substrate.

The pressure between the application rolls in a state where the conductive substrate is sandwiched between the application rolls is adjusted according to the resist film thickness to be obtained. ^{About 2} .

[0041]

According to the apparatus of the present invention, a liquid resist is coated on a conductive substrate having a through-hole in a forward rotation, and then a reverse rotation is applied. A resist film having a thickness can be formed. In particular, by performing the coating again by the reverse rotation coating, the liquid resist can be completely pushed into the through holes and between the fine wire circuit patterns, so that a good resist film can be formed.

Further, in the present invention, unpainted portions can be provided at the upper and lower ends of the conductive substrate, which could not be conventionally performed, so that cleaning of the holding hanger can be made unnecessary.

As a result, a cleaning device is not required, and not only the equipment cost can be greatly reduced, but also the wastewater treatment after cleaning becomes unnecessary, which contributes to environmental conservation.

[Brief description of the drawings]

FIG. 1 is a simplified diagram of an apparatus for forming a resist layer on a conductive substrate according to one embodiment of the present invention.

FIG. 2 is a diagram showing an embodiment in which normal rotation coating is performed by the apparatus shown in FIG. 1;

FIG. 3 is a view showing an embodiment in which reverse rotation coating is performed by the apparatus shown in FIG. 1;

FIG. 4 is a diagram showing a switching device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 10 conductive substrate 12 transfer device 14 roll coater device 16 control device 18 chain gear 20 drive motor device 22 idle wheel 24 chain 26 hanger 28 gripping portion 30 first application roll 32 second application roll 34 first pickup roll 36 second pickup Roll 38 First doctor roll 40 Second doctor roll 42 Sensor 44 Sensor 46 Controller 50 Sensor 51 Sensor 52 Sensor 53 Sensor 60 First support frame 61 Second support frame 62 Drive gear

Claims (3)

[Claims] 1. An apparatus for forming a resist layer on a conductive substrate having a through hole and / or a non-through hole, comprising: a transfer device for transferring a conductive substrate having a through hole; An application roll that rotates in one rotation direction for applying a liquid resist to the conductive substrate to be applied, and an opposing member that opposes the application roll with the conductive substrate conveyed by the conveyance device interposed therebetween. Between the application roll and the opposing member, transport the conductive substrate in one transport direction, and then
A function of controlling the transfer device so as to transfer in the transfer direction opposite to the one transfer direction, and the application so as not to paint a preset length from the upper end and the lower end of the conductive substrate. An apparatus for forming a resist layer on a conductive substrate, comprising: a control device having a function of controlling an opening and closing operation between a roll and an opposing member. 2. An apparatus for forming a resist layer on a conductive substrate having a through hole and / or a non-through hole, comprising: a transfer device for transferring a conductive substrate having a through hole; An application roll that rotates in one rotation direction for applying a liquid resist to the conductive substrate to be applied, and an opposing member that opposes the application roll with the conductive substrate conveyed by the conveyance device interposed therebetween. The application roll is transported between the application roll and the counter member in one transport direction, and the predetermined length of the application roll is not coated from the upper end and the lower end of the conductive roll. And a control device having a function of controlling an opening and closing operation between the opposing members, wherein a resist is formed on the conductive substrate. Apparatus for forming a. 3. The apparatus of claim 2, comprising a pair of application rolls, one of which acts as a counterpart of the other.