JP2000150613A - Object transfer device - Google Patents

Object transfer device

Info

Publication number
JP2000150613A
JP2000150613A JP32677398A JP32677398A JP2000150613A JP 2000150613 A JP2000150613 A JP 2000150613A JP 32677398 A JP32677398 A JP 32677398A JP 32677398 A JP32677398 A JP 32677398A JP 2000150613 A JP2000150613 A JP 2000150613A
Authority
JP
Japan
Prior art keywords
lid
opening
closed container
chamber
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32677398A
Other languages
Japanese (ja)
Inventor
Keiichi Matsushima
圭一 松島
Hiroaki Saeki
弘明 佐伯
Teruo Asakawa
輝雄 浅川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP32677398A priority Critical patent/JP2000150613A/en
Publication of JP2000150613A publication Critical patent/JP2000150613A/en
Pending legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

(57)【要約】 【課題】蓋体を開放した時にゴミが密閉容器の内部に侵
入するのを防止できる被処理体の搬送装置を提供するこ
とにある。 【解決手段】前面の開口部14に着脱可能な蓋体15を
有し、内部にウェーハWを収容する密閉容器11と、こ
の密閉容器11と隔離された移載室6前記密閉容器11
内のウェーハWを搬出して処理室に搬入する搬送機構を
備えた被処理体の搬送装置において、前記密閉容器11
の開口部14に対向する移載室6に、該移載室6と密閉
容器11との圧力差を低減する隔離室17を設け、この
隔離室17内に前記密閉容器11の蓋体15を開閉する
蓋開閉機構30を設けたことを特徴とする。
(57) [Summary] An object of the present invention is to provide an apparatus for transporting an object to be processed, which can prevent dust from entering a closed container when a lid is opened. A closed container (11) having a detachable lid (15) in a front opening (14) and containing a wafer (W) therein, and a transfer chamber (6) isolated from the closed container (11).
In the transfer apparatus for the object to be processed provided with a transfer mechanism for unloading the wafer W from the inside and loading it into the processing chamber,
An isolation chamber 17 for reducing the pressure difference between the transfer chamber 6 and the airtight container 11 is provided in the transfer chamber 6 facing the opening 14 of the container, and the lid 15 of the airtight container 11 is placed in the isolation chamber 17. A lid opening and closing mechanism 30 for opening and closing is provided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、主に半導体ウェ
ーハやLCD基板等の被処理体を処理する複数の真空処
理室を備えたマルチチャンバ処理システムにおける被処
理体の搬送装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for transporting an object in a multi-chamber processing system having a plurality of vacuum processing chambers for processing an object such as a semiconductor wafer or an LCD substrate.

【0002】[0002]

【従来の技術】近年、例えば半導体デバイスの微細化・
高集積化に伴い、半導体製造プロセスについても種々の
工夫がなされ、例えば半導体ウェーハの真空処理システ
ムにおいては、各種のプロセスの改革・変更に容易に対
処でき、且つ一貫処理により工程の短縮化を図るよう
に、複数の真空処理室を周配する状態に備えたクラスタ
ツールなどと呼ばれているマルチチャンバ処理システム
の開発がなされている。
2. Description of the Related Art In recent years, for example, miniaturization of semiconductor devices
With the increase in the degree of integration, various measures have been taken for the semiconductor manufacturing process. For example, in a vacuum processing system for semiconductor wafers, various processes can be easily reformed or changed, and the process can be shortened by integrated processing. As described above, a multi-chamber processing system called a cluster tool provided in a state where a plurality of vacuum processing chambers are arranged around has been developed.

【0003】この種の従来のマルチチャンバ処理システ
ムとしては、各種半導体製造プロセスに応じた所要個数
(想定では例えば最小3個乃至最大6個)の真空処理室
(プロセスチャンバ)を備えると共に、これら各真空処
理室に被処理体を搬入出する搬送系として、一個或いは
2個のローダ室と、各真空処理室及びローダ室が周配す
る状態でそれぞれゲートバルブを介し気密に連通する複
数の接続口を周壁に有した多角形の移載室(トランスフ
ァチャンバ)と、この移載室内に設置された旋回並びに
伸縮動可能な搬送アーム(移載ロボット)とを備えてな
る構成のものが知られている。
A conventional multi-chamber processing system of this kind includes a required number (for example, a minimum of three to a maximum of six) of vacuum processing chambers (process chambers) corresponding to various semiconductor manufacturing processes, and each of these vacuum processing chambers (process chambers). One or two loader chambers and a plurality of connection ports that are air-tightly communicated via gate valves in a state in which each vacuum processing chamber and the loader chambers are arranged as a transfer system for loading and unloading an object to be processed into and out of the vacuum processing chamber. Is known which has a polygonal transfer chamber (transfer chamber) having a peripheral wall and a transfer arm (transfer robot) installed in the transfer chamber and capable of turning and extending and retracting. I have.

【0004】このようなマルチチャンバ処理システムで
は、被処理体として例えば半導体ウェーハ(以下単にウ
ェーハという)を収容したFOUP、つまり前面に開口
部を有し、この開口部に着脱可能な蓋体を有した密閉容
器(以下、単に密閉容器という)単位で外部搬送装置に
より前記ローダ室内に運び込み、そこでローダ室内を真
空引き或いは不活性ガスとの置換などして外部と隔離し
てから、そのローダ室の移載室側のゲートバルブを開
き、搬送アームにより該ローダ室内の密閉容器からウェ
ーハを一枚ずつ移載室内に取り込んで前記所要の真空処
理室内へ順次搬入し、そこで例えば成膜やエッチング等
の所定の処理を行い、その処理済みウェーハは搬送アー
ムにより移載室内に取り出してローダ室内の密閉容器に
戻す。
In such a multi-chamber processing system, a FOUP accommodating, for example, a semiconductor wafer (hereinafter simply referred to as a wafer) as an object to be processed, that is, having an opening in the front surface, and having a detachable lid in this opening. The sealed container (hereinafter, simply referred to as a sealed container) is carried into the loader chamber by an external transport device, and the loader chamber is isolated therefrom by evacuation or replacement with an inert gas. Open the gate valve on the transfer chamber side, take in the wafers one by one from the closed container in the loader chamber into the transfer chamber by the transfer arm, and sequentially carry them into the required vacuum processing chamber, where, for example, film formation, etching, etc. After performing a predetermined process, the processed wafer is taken out into the transfer chamber by the transfer arm and returned to the closed container in the loader room.

【0005】こうしたマルチチャンバ処理システムであ
れば、搬送系であるローダ室と移載室と搬送アームと
が、周配する複数個の真空処理室に対し共用できるの
で、各真空処理室に対し個々にそれぞれ搬送系を備える
旧来の処理装置に比し、構成の簡素化並びに設置スペー
スの縮小化や搬送効率のアップ、局所クリーン化による
低コスト化などが図れて非常に有利となる。
In such a multi-chamber processing system, the loader chamber, the transfer chamber, and the transfer arm, which are transfer systems, can be shared by a plurality of vacuum processing chambers arranged around the transfer chamber. As compared with the conventional processing apparatuses each having a transport system, simplification of the configuration, reduction of the installation space, improvement of the transport efficiency, and cost reduction by local cleaning are extremely advantageous.

【0006】[0006]

【発明が解決しようとする課題】ところで、ウェーハが
収容された密閉容器が搬送される外部搬送装置は大気圧
であるのに対し、ローダ室は大気圧より若干高い圧力に
設定され、両者間は隔壁によって区画されている。隔壁
の一部には連通口が設けられ、この連通口に対向するロ
ーダ室内に密閉容器の蓋体を開閉する蓋開閉機構が設け
られている。
By the way, while the external transfer device for transferring the sealed container containing the wafers is at atmospheric pressure, the loader chamber is set at a slightly higher pressure than the atmospheric pressure. Partitioned by partitions. A communication port is provided in a part of the partition wall, and a lid opening / closing mechanism for opening and closing the lid of the closed container is provided in the loader room facing the communication port.

【0007】そして、ウェーハの搬送時には蓋開閉機構
によって密閉容器の蓋体を開放し、ローダ室から延びる
搬送アームによって密閉容器内のウェーハを把持してロ
ーダ室に搬送しているため、大気圧の状態でウェーハの
搬送を行っているが、密閉容器の内部の圧力は大気圧よ
り高い圧力に設定されているか、低い圧力に設定されて
いるか分からない。したがって、密閉容器が大気圧より
低い場合には蓋体を開放したとき、周囲の空気が密閉容
器に侵入して気流の乱れが生じ、ゴミが舞い上がってウ
ェーハに付着してそのウェーハが不良品となってしまう
という問題がある。また、逆に密閉容器が大気圧より高
い場合には蓋体を開放したとき、密閉容器内の空気が外
部に放出され、このときの密閉容器内の気流の乱れによ
ってウェーハが密閉容器内の棚と摺動して傷が付き、同
様に不良品となってしまうという問題がある。
When the wafer is transferred, the lid of the closed container is opened by the lid opening / closing mechanism, and the wafer in the closed container is gripped by the transfer arm extending from the loader chamber and transferred to the loader chamber. Although the wafer is transferred in the state, it is not known whether the pressure inside the closed container is set to a pressure higher than the atmospheric pressure or a pressure set to a lower pressure. Therefore, when the lid is opened when the airtight container is lower than the atmospheric pressure, when the lid is opened, the surrounding air enters the airtight container and turbulence of the airflow occurs, dust is soaked up and adheres to the wafer, and the wafer is regarded as a defective product. There is a problem that it becomes. Conversely, if the airtight container is higher than the atmospheric pressure, the air in the airtight container is released to the outside when the lid is opened. , There is a problem that a scratch is made and the product is similarly defective.

【0008】この発明は、前記事情に着目してなされた
もので、その目的とするところは、密閉容器とその周囲
の部屋との圧力差を低減し、密閉容器の蓋体を開放した
ときの気流の乱れを防止し、被処理体としてのウェーハ
にゴミが付着したり、傷が付くのを防止できる被処理体
の搬送装置を提供することにある。
The present invention has been made in view of the above circumstances, and has as its object to reduce the pressure difference between a closed container and a room around the closed container, and to reduce the pressure difference when the lid of the closed container is opened. An object of the present invention is to provide a device for transporting an object to be processed, which can prevent turbulence of an air flow and prevent dust from being attached to or scratched on a wafer as the object to be processed.

【0009】[0009]

【課題を解決するための手段】この発明は、前記目的を
達成するために、請求項1は、前面の開口部に着脱可能
な蓋体を有し、内部に被処理体を収容する密閉容器と、
この密閉容器と隔離された部屋に前記密閉容器内の被処
理体を搬出して処理室に搬入する搬送機構を備えた被処
理体の搬送装置において、前記密閉容器の開口部に対向
する部屋に、該部屋と密閉容器との圧力差を低減する隔
離室を設け、この隔離室内に前記密閉容器の蓋体を開閉
する蓋開閉機構を設けたことを特徴とする。
According to the present invention, in order to achieve the above object, a closed container having a detachable lid at an opening on a front surface and accommodating an object to be processed therein is provided. When,
In a device for transporting an object to be processed provided with a transport mechanism for carrying out the object to be processed in the closed container to a room separated from the closed container and carrying the processed object into the processing chamber, a room opposed to an opening of the closed container is provided. An isolation chamber for reducing a pressure difference between the chamber and the closed container is provided, and a lid opening / closing mechanism for opening and closing the lid of the closed container is provided in the isolated chamber.

【0010】請求項2は、請求項1の前記隔離室は、被
処理体の搬送時に蓋開閉機構とともに密閉容器の開口部
から退避可能であることを特徴とする。
According to a second aspect of the present invention, the isolation chamber of the first aspect is capable of being retracted from the opening of the closed container together with the lid opening / closing mechanism when the object is transported.

【0011】請求項3は、前面の開口部に着脱可能な蓋
体を有し、内部に被処理体を収容する密閉容器と、この
密閉容器と隔離された部屋に前記密閉容器内の被処理体
を搬出して処理室に搬入する搬送機構を備えた被処理体
の搬送装置において、前記密閉容器の開口部に対向する
部屋に、前記密閉容器の蓋体を開閉する蓋開閉機構を設
け、この蓋開閉機構に前記部屋と密閉容器との圧力差を
低減する隔離室を形成する覆い部材を設けたことを特徴
とする。
According to a third aspect of the present invention, there is provided an airtight container having a detachable lid at an opening on the front surface, for accommodating an object to be processed therein, and a room separated from the airtight container in the closed container. In a transfer apparatus for a target object provided with a transfer mechanism that unloads the body and loads the processing chamber, a lid opening / closing mechanism that opens and closes the lid of the closed container is provided in a room facing the opening of the closed container, The lid opening / closing mechanism is provided with a cover member forming an isolation chamber for reducing a pressure difference between the room and the closed container.

【0012】請求項4は、請求項3の前記覆い部材は、
被処理体の搬送時に蓋開閉機構とともに密閉容器の開口
部から退避可能であることを特徴とする。
In a fourth aspect, the covering member of the third aspect is
It is characterized in that it can be retracted from the opening of the sealed container together with the lid opening / closing mechanism when the object is transported.

【0013】請求項5は、請求項1または3の前記隔離
室は、その内部の圧力を密閉容器及び部屋の圧力に合わ
せる圧力調整手段を備えていることを特徴とする。
A fifth aspect of the present invention is characterized in that the isolation chamber according to the first or third aspect is provided with a pressure adjusting means for adjusting the internal pressure thereof to the pressure of the closed container and the room.

【0014】請求項6は、請求項1または3の前記蓋開
閉機構は、密閉容器の開口部に対向して進退可能な蓋ロ
ック部材を有し、蓋ロック部材の前進操作によって開口
部を蓋体を閉塞し、後退操作によって開口部を開放する
ことを特徴とする。
According to a sixth aspect of the present invention, the lid opening / closing mechanism according to the first or third aspect has a lid locking member that can move forward and backward in opposition to the opening of the closed container, and the opening is closed by the forward operation of the lid locking member. It is characterized in that the body is closed and the opening is opened by a retreat operation.

【0015】請求項7は、請求項1または3の前記蓋ロ
ック部材は、蓋体の係合受け部に対して係脱可能な係合
部材が設けられ、蓋ロック部材と密閉容器との相対的な
接離移動により蓋ロック部材と蓋体が係脱することを特
徴とする。
According to a seventh aspect of the present invention, in the lid locking member of the first or third aspect, an engaging member is provided which can be disengaged from an engagement receiving portion of the lid, and the relative position between the lid locking member and the closed container is increased. The lid locking member and the lid are disengaged by a specific contact and separation movement.

【0016】請求項8は、請求項1または3の前記蓋開
閉機構は、密閉容器の開口部に対向して進退可能な蓋ロ
ック部材を有し、蓋ロック部材の前進操作によって開口
部を蓋体を閉塞し、後退操作によって開口部を開放する
ことを特徴とする。
According to an eighth aspect of the present invention, the lid opening / closing mechanism according to the first or third aspect has a lid locking member which can move forward and backward facing the opening of the closed container, and the opening is closed by an advance operation of the lid locking member. It is characterized in that the body is closed and the opening is opened by a retreat operation.

【0017】請求項9は、請求項1または3の前記蓋ロ
ック部材は、蓋体の係合受け部に対して係脱可能な係合
部材が設けられ、蓋ロック部材と密閉容器との相対的な
接離移動により蓋ロック部材と蓋体が係脱することを特
徴とする。
According to a ninth aspect of the present invention, in the lid locking member of the first or third aspect, an engaging member is provided which can be disengaged from an engaging receiving portion of the lid. The lid locking member and the lid are disengaged by a specific contact and separation movement.

【0018】前記構成によれば、隔離室の内圧を密閉容
器の内圧に合わせた後、密閉容器の蓋体を蓋開閉機構に
よって開放することにより、密閉容器の開口部を開放し
た時に密閉容器の内部に気流の乱れがなく、密閉容器の
内部にゴミの侵入を防止できる。
According to the above configuration, after adjusting the internal pressure of the isolation chamber to the internal pressure of the closed container, the lid of the closed container is opened by the lid opening / closing mechanism, so that when the opening of the closed container is opened, the closed container is opened. There is no turbulence in the air flow inside, and it is possible to prevent dust from entering the inside of the closed container.

【0019】[0019]

【発明の実施の形態】以下、この発明の実施の形態を図
面に基づいて説明する。
Embodiments of the present invention will be described below with reference to the drawings.

【0020】図1〜図7は第1の実施形態を示し、図1
は3個の真空処理室を周配したマルチチャンバ処理シス
テムにおける搬送装置の水平断面図、図2は同側面図、
図3は蓋開閉機構の正面図、図4及び図5は同縦断側面
図、図6は図3の一部を拡大した正面図、図7は作用説
明図である。
1 to 7 show a first embodiment, and FIG.
Is a horizontal cross-sectional view of a transfer device in a multi-chamber processing system in which three vacuum processing chambers are arranged, FIG.
3 is a front view of the lid opening / closing mechanism, FIGS. 4 and 5 are longitudinal side views of the same, FIG. 6 is a front view in which a part of FIG. 3 is enlarged, and FIG.

【0021】図1及び図2は、被処理体としてウェーハ
Wに処理を施す3個の真空処理室1a,1b,1cを一
つの搬送系に周配したマルチチャンバ処理システム及び
搬送装置を示し、それら真空処理室1a,1b,1c
は、それぞれ所定の高さの架台2上に搭載されたプロセ
スチャンバなどと称される立方体状の気密処理容器であ
る。
FIGS. 1 and 2 show a multi-chamber processing system and a transfer apparatus in which three vacuum processing chambers 1a, 1b and 1c for processing a wafer W as an object to be processed are arranged in a single transfer system. These vacuum processing chambers 1a, 1b, 1c
Are cubic hermetic processing containers called process chambers and the like mounted on the gantry 2 having a predetermined height.

【0022】この3個のうち、2つの真空処理室1a,
1bは、ウェーハWに対する所要の処理機能、例えばス
パッタリング、CVD、エッチング、アッシング、酸
化、拡散等のなかからいずれか選択された処理機能を備
えたものであり、残り一つの真空処理室1cはウェーハ
Wの例えば加熱・冷却等の前後処理を行う予備真空処置
室である。その処理目的のために、各々図示しないが真
空吸引機構やプロセスガス注入機構や加熱・冷却機構等
が装備されている。
Of the three, two vacuum processing chambers 1a,
1b has a required processing function for the wafer W, for example, a processing function selected from among sputtering, CVD, etching, ashing, oxidation, diffusion, and the like, and the other vacuum processing chamber 1c has a wafer processing function. This is a preliminary vacuum treatment chamber for performing pre- and post-processing such as heating and cooling of W. Although not shown, a vacuum suction mechanism, a process gas injection mechanism, a heating / cooling mechanism, and the like are provided for the processing purpose.

【0023】通常、この種のマルチチャンバ処理システ
ムでは、真空処理室の周配個数として、前記3個の真空
処理室1a,1b,1cを備えるパターンが最小単位と
想定される。この最小パターンのマルチチャンバ処理シ
ステム用の搬送装置は、3個の真空処理室1a,1b,
1cが三方から囲む周配状態でそれぞれ接続される多角
形のロードロック室3と、このロードロック室3の前端
側部に接続された2個のローダ室4と、前記ロードロッ
ク室3内にて前記ローダ室4内からウェーハWを取り込
んで前記真空処理室1a,1b,1c内へ搬入し且つそ
れら真空処理室内の処理済みウェーハWを取り出してロ
ーダ室4内へ戻す旋回並びに伸縮動可能な搬送アーム5
と、2個のローダ室4と連通する移載室6及び移載室6
内に設けられた搬送機構としての搬送アーム7が設けら
れている。
Usually, in this type of multi-chamber processing system, the pattern including the three vacuum processing chambers 1a, 1b, and 1c is assumed to be the minimum unit as the number of vacuum processing chambers arranged around. The transfer device for the multi-chamber processing system having the minimum pattern includes three vacuum processing chambers 1a, 1b,
A polygonal load lock chamber 3 is connected to each other in a circumferential arrangement surrounding three sides 1 c, two loader chambers 4 connected to the front end of the load lock chamber 3, and a load lock chamber 3 inside the load lock chamber 3. The wafer W can be taken in from the loader chamber 4 and carried into the vacuum processing chambers 1a, 1b, 1c, and the processed wafer W in the vacuum processing chamber can be taken out and returned to the loader chamber 4 to be swivelable and extendable. Transfer arm 5
And a transfer chamber 6 communicating with the two loader chambers 4 and a transfer chamber 6
A transfer arm 7 is provided as a transfer mechanism provided therein.

【0024】なお、8は搬送アーム7からウェーハWを
一旦受取って位置合わせを行うアライメント機構であ
る。さらに、移載室6の外側には架台9を介して後述す
る密閉容器11を載置するテーブル10が設けられてい
る。
Reference numeral 8 denotes an alignment mechanism for once receiving the wafer W from the transfer arm 7 and performing alignment. Further, a table 10 on which a sealed container 11 to be described later is mounted is provided outside the transfer chamber 6 via a gantry 9.

【0025】前記移載室6と密閉容器11を載置するテ
ーブル10は、図3〜図5に示すように隔壁12によっ
て区画され、密閉容器11を載置するテーブル10は大
気圧状態にあり、移載室6は大気圧より若干高い圧力に
設定され、両者間に圧力差がある。隔壁12には両者を
連通する矩形状の連通口13が設けられ、密閉容器11
は連通口13と対向し、テーブル10はシリンダまたは
モータ(図示しない)によって前進後退するようになっ
ている。
The transfer chamber 6 and the table 10 on which the closed container 11 is placed are partitioned by partitions 12 as shown in FIGS. 3 to 5, and the table 10 on which the closed container 11 is placed is under atmospheric pressure. The transfer chamber 6 is set at a pressure slightly higher than the atmospheric pressure, and there is a pressure difference between the two. The partition 12 is provided with a rectangular communication port 13 for communicating the two with each other.
Is opposed to the communication port 13, and the table 10 is moved forward and backward by a cylinder or a motor (not shown).

【0026】密閉容器11は、FOUP、つまり前面に
開口部14を有し、この開口部14に着脱可能な蓋体1
5を有した無塵の密閉カセットで、内部には複数枚のウ
ェーハWが多段式に収納されている。蓋体15の前面2
ヵ所には係合受け部としての鍵穴16が設けられてい
る。なお、密閉容器11の内部はウェーハWの状況によ
って大気の場合と酸化を防止するN2 ガスを封入してい
る場合とがあり、また内部圧力を設定している場合とが
ある。
The closed container 11 has a FOUP, that is, an opening 14 on the front surface thereof.
5 is a dust-free hermetic cassette in which a plurality of wafers W are stored in a multi-stage manner. Front 2 of lid 15
A keyhole 16 is provided at each location as an engagement receiving portion. The interior of the sealed container 11 may be in the air, may be filled with N2 gas for preventing oxidation, or may be set to an internal pressure depending on the condition of the wafer W.

【0027】また、移載室6の内部には連通口13に対
向し、これを閉塞するとともに、内部に隔離室17を形
成する隔離ユニット18が設けられている。この隔離ユ
ニット18は前壁18aとこの前壁18aの周辺部に設
けられた周壁18bとからなり、周壁18bの開口縁に
装着されたパッキン18cが連通口13の開口縁に対向
して連通口13を閉塞できる大きさに構成されている。
An isolation unit 18 is provided inside the transfer chamber 6 to face and open the communication port 13 and to form an isolation chamber 17 inside. The isolation unit 18 includes a front wall 18a and a peripheral wall 18b provided around the front wall 18a. A packing 18c mounted on an opening edge of the peripheral wall 18b faces the opening edge of the communication port 13 so as to face the communication port. 13 can be closed.

【0028】さらに、移載室6側に位置し、かつ連通口
13の下方には縦長ボックス19が設けられ、この縦長
ボックス19の内部には上下方向にリニアガイド20が
設けられている。このリニアガイド20にはZ軸エアシ
リンダ21によって昇降自在な昇降台22が設けられて
いる。この昇降台22の上部にはローラ23を介して隔
壁12に対して進退自在な移動台24が設けられ、この
移動台24には前記隔離ユニット18が搭載されてい
る。
Further, a vertically long box 19 is provided below the communication port 13 and located on the transfer chamber 6 side, and a linear guide 20 is provided inside the vertically long box 19 in a vertical direction. The linear guide 20 is provided with an elevating table 22 that can be moved up and down by a Z-axis air cylinder 21. A movable table 24 is provided above the elevating table 22 via a roller 23 so as to be able to advance and retreat with respect to the partition wall 12. The separating unit 18 is mounted on the movable table 24.

【0029】移動台24にはカム溝25を有するカム板
26が取付けられ、カム溝25には移動台24に固定さ
れたX軸シリンダ27によって進退自在なカムローラ2
8が係合している。そして、X軸シリンダ27によって
カムローラ28が前進すると移動台24とともに隔離ユ
ニット18が隔壁12から後退し、カムローラ28が後
退すると移動台24とともに隔離ユニット18が隔壁1
2に向かって前進してパッキン18cが隔壁12に接触
して隔離室17が密閉されるようになっている。
A cam plate 26 having a cam groove 25 is mounted on the moving table 24, and the cam roller 2 is movable in the cam groove 25 by an X-axis cylinder 27 fixed to the moving table 24.
8 are engaged. When the cam roller 28 moves forward by the X-axis cylinder 27, the isolation unit 18 moves back together with the moving table 24 from the partition 12, and when the cam roller 28 moves backward, the separating unit 18 moves together with the moving table 24 into the partition 1
2, the packing 18c comes into contact with the partition wall 12, and the isolation chamber 17 is sealed.

【0030】また、昇降台22には蓋開閉機構30が設
けられている。すなわち、昇降台22の上部には隔壁1
2に対して直角方向にガイドレール31が設けられ、こ
のガイドレール31には支持部材32が移動自在に支持
されている。支持部材32には矩形状で、連通口13を
閉塞可能な蓋ロック部材33が取付けられている。この
蓋ロック部材33の前面には蓋体15の鍵穴16に対応
して係合部材としてのラッチ34が設けられ、このラッ
チ34は蓋ロック部材33の背面に設けられたラッチ駆
動機構35によって回動されるようになっている。
The lifting platform 22 is provided with a lid opening / closing mechanism 30. That is, the partition 1 is located above the elevator 22.
A guide rail 31 is provided in a direction perpendicular to the direction 2, and a support member 32 is movably supported on the guide rail 31. A lid lock member 33 that is rectangular and that can close the communication port 13 is attached to the support member 32. A latch 34 as an engagement member is provided on the front surface of the lid lock member 33 corresponding to the keyhole 16 of the lid 15, and the latch 34 is turned by a latch drive mechanism 35 provided on the back surface of the lid lock member 33. It is being moved.

【0031】さらに、昇降台22には蓋開閉用のエアシ
リンダ36が回動自在に支持され、このエアシリンダ3
6は屈伸リンク機構37を介して支持部材32に連結さ
れている。そして、エアシリンダ36によって作動する
屈伸リンク機構37の屈伸運動によって支持部材32を
介して蓋ロック部材33が連通口13に対して進退する
ようになっている。
Further, an air cylinder 36 for opening and closing the lid is rotatably supported on the lift 22.
Reference numeral 6 is connected to the support member 32 via a bending / extending link mechanism 37. The cover lock member 33 advances and retreats from the communication port 13 via the support member 32 by the bending and stretching movement of the bending and stretching link mechanism 37 operated by the air cylinder 36.

【0032】また、前記隔離ユニット18の下部には圧
力調整手段としてのパージポート38と排気ボート39
が設けられ、隔離室17の内部の圧力を調整できるよう
になっており、支持部材24には隔離ユニット18の移
動に際しても圧力が変動しないようにラビリンスシール
40が設けられている。
A purge port 38 as a pressure adjusting means and an exhaust boat 39 are provided below the isolation unit 18.
The support member 24 is provided with a labyrinth seal 40 so that the pressure does not fluctuate even when the isolation unit 18 moves.

【0033】次に、第1の実施形態の作用について説明
する。
Next, the operation of the first embodiment will be described.

【0034】図7(a)に示すように、テーブル10に
載置された密閉容器11が隔壁12の連通口13に対向
する位置にあり、テーブル10が前進してドックして同
図(b)に示すように、密閉容器11の開口部14が連
通口13に対向し、蓋体15が蓋開閉機構30の蓋ロッ
ク機構33と接合するとともに、ラッチ34が鍵穴16
に嵌合する。そこで、ラッチ駆動機構35が駆動してラ
ッチ34が略90゜回動すると、ラッチ34が鍵穴16
に係合して蓋体15と蓋ロック部材33とが結合され
る。ここで、一次隔離室18を隔壁12に密着させ、パ
ージポート38及び排気ポート39からパージまたは排
気することにより隔離室17の内部圧力を密閉容器11
内の圧力に合わせる。
As shown in FIG. 7 (a), the closed container 11 placed on the table 10 is located at a position facing the communication port 13 of the partition 12, and the table 10 advances and docks as shown in FIG. ), The opening 14 of the closed container 11 faces the communication port 13, the lid 15 is joined to the lid lock mechanism 33 of the lid opening / closing mechanism 30, and the latch 34 is
Fits. Then, when the latch drive mechanism 35 is driven to rotate the latch 34 approximately 90 °, the latch 34
And the lid 15 and the lid lock member 33 are coupled. Here, the primary isolation chamber 18 is brought into close contact with the partition wall 12, and the internal pressure of the isolation chamber 17 is reduced by purging or exhausting the gas through the purge port 38 and the exhaust port 39.
Adjust to internal pressure.

【0035】次に、隔離室17と密閉容器11の圧力が
略同じ状態になった時点でエアシリンダ36を駆動して
屈伸リンク機構37を回動すると、ガイドレール31に
支持された支持部材32が隔壁12から後退し、同図
(c)に示すように、蓋ロック部材33に結合された蓋
体15が隔離室17の内部に引き込まれ、密閉容器11
の開口部14が開放される。このとき、密閉容器11内
と隔離室17には圧力差が殆ど無いため密閉容器11の
内部に気流の乱れが生じることがなく、密閉容器11の
内部にゴミが侵入する心配はなく、ウェーハWの移動も
なく、傷を付ける心配はない。次に、隔離室17の圧力
が移載室6の圧力と略同じになるようにパージポート3
8及び排気ポート39からパージまたは排気する。
Next, when the pressure in the isolation chamber 17 and the pressure in the closed container 11 become substantially the same, when the air cylinder 36 is driven to rotate the bending / extending link mechanism 37, the support member 32 supported by the guide rail 31 is rotated. Retreats from the partition 12, and the lid 15 connected to the lid lock member 33 is drawn into the isolation chamber 17 as shown in FIG.
Opening 14 is opened. At this time, since there is almost no pressure difference between the inside of the sealed container 11 and the isolation chamber 17, there is no turbulence of the air flow inside the sealed container 11, and there is no fear that dust enters the inside of the sealed container 11, and the wafer W There is no movement and there is no worry about scratching. Next, the purge port 3 is set so that the pressure in the isolation chamber 17 becomes substantially the same as the pressure in the transfer chamber 6.
8 and exhaust or exhaust from the exhaust port 39.

【0036】隔離室17と移載室6の圧力が略同じ状態
になった時点でX軸シリンダ27が作動してカムローラ
28が前進すると、カムローラ38と係合するカム溝2
5の傾斜により移動台24を介して隔離ユニット18が
隔壁12から後退し、同図(d)に示すように、隔離ユ
ニット18の周壁18bと隔壁12との間に隙間gがで
きる。
When the X-axis cylinder 27 operates and the cam roller 28 moves forward when the pressures in the isolation chamber 17 and the transfer chamber 6 become substantially the same, the cam groove 2 engaged with the cam roller 38
Due to the inclination of 5, the isolation unit 18 retreats from the partition 12 via the moving table 24, and a gap g is formed between the peripheral wall 18b of the isolation unit 18 and the partition 12 as shown in FIG.

【0037】次に、Z軸シリンダ21が駆動してシリン
ダロッド21aを引き込むと、昇降台22がリニアガイ
ド20に案内されて下降し、同図(e)に示すように、
昇降台22に搭載された隔離ユニット17及び蓋開閉機
構30の全体が縦長ボックス19の内部に格納され、連
通口13から隔離ユニット17及び蓋開閉機構30が退
避される。
Next, when the Z-axis cylinder 21 is driven to retract the cylinder rod 21a, the lifting platform 22 is guided by the linear guide 20 and descends, as shown in FIG.
The entirety of the isolation unit 17 and the lid opening / closing mechanism 30 mounted on the elevating table 22 is stored inside the vertically long box 19, and the isolation unit 17 and the lid opening / closing mechanism 30 are retracted from the communication port 13.

【0038】次に、移載室6の内部に設けられた搬送ア
ーム7が延びて連通口13から密閉容器11の内部のウ
ェーハWを把持して移載室6の内部にウェーハWを搬送
し、所定の工程を経てマルチチャンバ処理システムに搬
入される。密閉容器11内の全てのウェーハWの処理が
完了すると、密閉容器11の開口部14は蓋体15によ
って閉塞されるが、蓋体15を閉じる動作は前述と逆の
順序で行う。
Next, the transfer arm 7 provided inside the transfer chamber 6 extends to grip the wafer W inside the sealed container 11 from the communication port 13 and transfer the wafer W into the transfer chamber 6. After a predetermined process, the wafer is carried into the multi-chamber processing system. When the processing of all the wafers W in the closed container 11 is completed, the opening 14 of the closed container 11 is closed by the lid 15, but the operation of closing the lid 15 is performed in the reverse order to the above.

【0039】なお、前記第1の実施形態においては、隔
離ユニット18及び蓋開閉機構30を連通口13から下
方に退避するように構成したが、横方向あるいは上方に
退避するようにしてもよい。
In the first embodiment, the isolation unit 18 and the lid opening / closing mechanism 30 are configured to retreat downward from the communication port 13, but they may be retracted laterally or upward.

【0040】図8は第2の実施形態を示し、第1の実施
形態と同一構成部分は同一番号を付して説明および図面
を省略する。
FIG. 8 shows the second embodiment. The same components as those in the first embodiment are denoted by the same reference numerals, and the description and drawings are omitted.

【0041】移載室6の内部には連通口13の開口縁に
対向する枠状の隔離ユニット50が設けられ、この隔離
ユニット50の隔壁12側には隔壁12とシールするた
めのパッキン51が設けられている。この隔離ユニット
50の外周部と蓋開閉機構30の蓋ロック部材33の外
周部との間は覆い部材としての角筒状のベローズ52に
よって連結され、内部に隔離室17を形成している。し
たがって、ベローズ52の伸縮により蓋ロック部材33
に対して隔離ユニット50が接離するようになってい
る。
A frame-shaped isolation unit 50 facing the opening edge of the communication port 13 is provided inside the transfer chamber 6, and a packing 51 for sealing with the partition 12 is provided on the partition 12 side of the isolation unit 50. Is provided. The outer peripheral portion of the isolation unit 50 and the outer peripheral portion of the lid lock member 33 of the lid opening / closing mechanism 30 are connected by a rectangular tubular bellows 52 as a covering member, and the isolation chamber 17 is formed inside. Therefore, the extension and contraction of the bellows 52 causes the lid locking member 33 to move.
The separation unit 50 comes in contact with and separates from the main body.

【0042】次に、第2の実施形態の作用について説明
する。
Next, the operation of the second embodiment will be described.

【0043】図8(a)に示すように、テーブル10に
載置された密閉容器11が隔壁12の連通口13に対向
する位置し、テーブル10が前進してドックして同図
(b)に示すように、密閉容器11の開口部14が連通
口13に対向し、蓋体15が蓋開閉機構30の蓋ロック
機構33と接合するとともに、ラッチ34が鍵穴16に
嵌合する。そこで、ラッチ駆動機構35が駆動してラッ
チ34が略90゜回動すると、ラッチ34が鍵穴16に
係合して蓋体15と蓋ロック部材33とが結合される。
ここで、隔離ユニット50を隔壁12に密着させ、パー
ジポート38及び排気ポート39からパージまたは排気
することにより隔離室17の内部圧力を密閉容器11内
の圧力に合わせる。
As shown in FIG. 8 (a), the closed container 11 placed on the table 10 is positioned to face the communication port 13 of the partition 12, and the table 10 advances and docks as shown in FIG. 8 (b). As shown in (2), the opening 14 of the closed container 11 faces the communication port 13, the lid 15 is joined to the lid lock mechanism 33 of the lid opening / closing mechanism 30, and the latch 34 is fitted into the keyhole 16. Then, when the latch drive mechanism 35 is driven to rotate the latch 34 by approximately 90 °, the latch 34 is engaged with the keyhole 16 and the lid 15 and the lid lock member 33 are connected.
Here, the isolation unit 50 is brought into close contact with the partition wall 12 and purged or evacuated from the purge port 38 and the exhaust port 39 to adjust the internal pressure of the isolation chamber 17 to the pressure in the closed vessel 11.

【0044】次に、隔離室17と密閉容器11の圧力が
略同じ状態になった時点でエアシリンダ36を駆動して
屈伸リンク機構37を回動すると、ガイドレール31に
支持された支持部材32が隔壁12から後退し、同図
(c)に示すように、蓋ロック部材33に結合された蓋
体15が密閉容器11の開口部14から外れて開放され
る。このとき、隔離ユニット50はパッキン51を介し
て隔壁12に接合された状態にあり、ベローズ52が伸
長して隔離室17の内部に蓋体15が収納された状態と
なる。また、密閉容器11内と隔離室17には圧力差が
殆ど無いため密閉容器11の内部に気流の乱れが生じる
ことがなく、密閉容器11の内部にゴミが侵入する心配
はなく、ウェーハWの移動もなく、傷を付ける心配はな
い。次に、隔離室17の圧力が移載室6の圧力と略同じ
になるようにパージポート38及び排気ポート39から
パージまたは排気する。
Next, when the pressure of the isolation chamber 17 and the pressure of the closed container 11 become substantially the same, when the air cylinder 36 is driven to rotate the bending / extension link mechanism 37, the support member 32 supported by the guide rail 31 is rotated. Is retracted from the partition wall 12, and the lid 15 connected to the lid lock member 33 is disengaged from the opening 14 of the closed casing 11 and is opened as shown in FIG. At this time, the isolation unit 50 is in a state of being joined to the partition wall 12 via the packing 51, and the bellows 52 is extended so that the lid 15 is housed inside the isolation chamber 17. Further, since there is almost no pressure difference between the inside of the sealed container 11 and the isolation chamber 17, there is no turbulence of the air flow inside the sealed container 11, and there is no fear that dust enters the inside of the sealed container 11, and the wafer W No movement, no worries about scratching. Next, purge or exhaust is performed from the purge port 38 and the exhaust port 39 so that the pressure in the isolation chamber 17 becomes substantially the same as the pressure in the transfer chamber 6.

【0045】隔離室17と移載室6の圧力が略同じ状態
になった時点でX軸シリンダ27が作動してカムローラ
28が前進すると、カムローラ38と係合するカム溝2
5の傾斜により移動台24を介して隔離ユニット50が
隔壁12から後退し、同図(d)に示すように、隔離ユ
ニット50のパッキン51と隔壁12との間に隙間gが
できる。
When the X-axis cylinder 27 is operated and the cam roller 28 moves forward when the pressures in the isolation chamber 17 and the transfer chamber 6 become substantially the same, the cam groove 2 engaged with the cam roller 38
Due to the inclination of 5, the isolation unit 50 retreats from the partition 12 via the moving table 24, and a gap g is formed between the packing 51 of the isolation unit 50 and the partition 12 as shown in FIG.

【0046】次に、Z軸シリンダ21が駆動してシリン
ダロッド21aを引き込むと、昇降台22がリニアガイ
ド20に案内されて下降し、同図(e)に示すように、
昇降台22に搭載された隔離ユニット50及び蓋開閉機
構30の全体が縦長ボックス19の内部に格納され、連
通口13から隔離ユニット50及び蓋開閉機構30が退
避される。
Next, when the Z-axis cylinder 21 is driven and the cylinder rod 21a is retracted, the lifting table 22 is guided by the linear guide 20 and descends, as shown in FIG.
The entirety of the isolation unit 50 and the lid opening / closing mechanism 30 mounted on the elevator 22 is stored inside the vertically long box 19, and the isolation unit 50 and the lid opening / closing mechanism 30 are retracted from the communication port 13.

【0047】次に、移載室6の内部に設けられた搬送ア
ーム7が延びて連通口13から密閉容器11の内部のウ
ェーハWを把持して移載室6の内部にウェーハWを搬送
し、所定の工程を経てマルチチャンバ処理システムに搬
入される。密閉容器11内の全てのウェーハWの処理が
完了すると、密閉容器11の開口部14は蓋体15によ
って閉塞されるが、蓋体15を閉じる動作は前述と逆の
順序で行う。
Next, the transfer arm 7 provided inside the transfer chamber 6 extends to grip the wafer W inside the sealed container 11 from the communication port 13 and transfer the wafer W into the transfer chamber 6. After a predetermined process, the wafer is carried into the multi-chamber processing system. When the processing of all the wafers W in the closed container 11 is completed, the opening 14 of the closed container 11 is closed by the lid 15, but the operation of closing the lid 15 is performed in the reverse order to the above.

【0048】なお、前記実施形態においては、半導体ウ
ェーハを収容した密閉容器からウェーハを取り出して搬
送する搬送装置について説明したが、LCD基板等の被
処理体の搬送装置にも適用できる。
In the above-described embodiment, the transfer device for taking out a wafer from a sealed container accommodating a semiconductor wafer and transferring the same is described. However, the present invention is also applicable to a transfer device for an object to be processed such as an LCD substrate.

【0049】[0049]

【発明の効果】以上説明したように、この発明によれ
ば、被処理体を収容する密閉容器の蓋体を開放する前に
隔離室の内部の圧力を密閉容器の内部圧力に合わせ、両
者の圧力差を低減することにより、蓋体を開放した時に
外部に空気が密閉容器の内部に侵入したり、または密閉
容器の内部の空気またはガスが放出されることはなく、
気流の乱れを防止できる。したがって、密閉容器内にゴ
ミが侵入した被処理体に付着したり、被処理体が摺動し
て傷が付くことを防止できる。
As described above, according to the present invention, the internal pressure of the isolation chamber is adjusted to the internal pressure of the closed container before opening the lid of the closed container accommodating the object to be processed. By reducing the pressure difference, when the lid is opened, air does not penetrate outside into the closed container, or air or gas inside the closed container is not released,
Airflow turbulence can be prevented. Therefore, it is possible to prevent dust from adhering to the object to be processed that has entered the closed container, or to prevent the object from sliding and being damaged.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の第1の実施形態を示す3個の真空処
理室を周配したマルチチャンバ処理システムにおける搬
送装置の水平断面図。
FIG. 1 is a horizontal cross-sectional view of a transfer apparatus in a multi-chamber processing system having three vacuum processing chambers arranged therearound according to a first embodiment of the present invention.

【図2】同実施形態の側面図。FIG. 2 is a side view of the embodiment.

【図3】同実施形態の蓋開閉機構の正面図。FIG. 3 is a front view of the lid opening / closing mechanism of the embodiment.

【図4】同実施形態の蓋開閉機構の縦断側面図。FIG. 4 is a vertical sectional side view of the lid opening and closing mechanism of the embodiment.

【図5】同実施形態の蓋開閉機構の縦断側面図。FIG. 5 is a vertical sectional side view of the lid opening and closing mechanism of the embodiment.

【図6】図3の一部を拡大した正面図。FIG. 6 is an enlarged front view of a part of FIG. 3;

【図7】同実施形態の作用説明図。FIG. 7 is an operation explanatory view of the embodiment.

【図8】この発明の第2の実施形態を示す作用説明図。FIG. 8 is an operation explanatory view showing a second embodiment of the present invention.

【符号の説明】[Explanation of symbols]

6…移載室(部屋) 11…密閉容器 12…隔壁 13…連通口 14…開口部 15…蓋体 17…隔離室 30…蓋開閉機構 6 transfer chamber (room) 11 closed container 12 partition 13 communication opening 14 opening 15 lid 17 isolation chamber 30 lid opening / closing mechanism

───────────────────────────────────────────────────── フロントページの続き (72)発明者 浅川 輝雄 山梨県韮崎市藤井町北下条2381番地の1 東京エレクトロン山梨株式会社内 Fターム(参考) 5F031 CA02 CA05 DA08 DA17 EA12 EA14 FA01 FA11 FA12 GA43 GA47 NA10 NA17 NA18 5F045 BB14 DQ17 EB08 EN01 EN04 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Inventor Teruo Asakawa 2381, Kita-Shimojo, Fujii-machi, Nirasaki-shi, Yamanashi Prefecture F-term in Tokyo Electron Yamanashi Co., Ltd. 5F031 CA02 CA05 DA08 DA17 EA12 EA14 FA01 FA11 FA12 GA43 GA47 NA10 NA17 NA18 5F045 BB14 DQ17 EB08 EN01 EN04

Claims (9)

【特許請求の範囲】[Claims] 【請求項1】 前面の開口部に着脱可能な蓋体を有し、
内部に被処理体を収容する密閉容器と、この密閉容器と
隔離された部屋に前記密閉容器内の被処理体を搬出して
処理室に搬入する搬送機構を備えた被処理体の搬送装置
において、 前記密閉容器の開口部に対向する部屋に、該部屋と密閉
容器との圧力差を低減する隔離室を設け、この隔離室内
に前記密閉容器の蓋体を開閉する蓋開閉機構を設けたこ
とを特徴とする被処理体の搬送装置。
An opening on a front surface has a detachable lid,
A sealed container accommodating the object to be processed therein, and a transfer device for the object to be processed including a transfer mechanism for unloading the object to be processed from the sealed container into a room separated from the sealed container and loading the object into the processing chamber. A room facing the opening of the closed container is provided with an isolation chamber for reducing a pressure difference between the room and the closed container, and a lid opening / closing mechanism for opening and closing the lid of the closed container is provided in the isolated room. An apparatus for transporting an object to be processed.
【請求項2】 前記隔離室は、被処理体の搬送時に蓋開
閉機構とともに密閉容器の開口部から退避可能であるこ
とを特徴とする請求項1記載の被処理体の搬送装置。
2. The apparatus for transporting an object to be processed according to claim 1, wherein the isolation chamber can be retracted from an opening of the closed container together with a lid opening / closing mechanism when the object to be processed is transported.
【請求項3】 前面の開口部に着脱可能な蓋体を有し、
内部に被処理体を収容する密閉容器と、この密閉容器と
隔離された部屋に前記密閉容器内の被処理体を搬出して
処理室に搬入する搬送機構を備えた被処理体の搬送装置
において、 前記密閉容器の開口部に対向する部屋に、前記密閉容器
の蓋体を開閉する蓋開閉機構を設け、この蓋開閉機構に
前記部屋と密閉容器との圧力差を低減する隔離室を形成
する覆い部材を設けたことを特徴とする被処理体の搬送
装置。
3. A detachable lid is provided at an opening on the front surface,
A sealed container accommodating the object to be processed therein, and a transfer device for the object to be processed including a transfer mechanism for unloading the object to be processed from the sealed container into a room separated from the sealed container and loading the object into the processing chamber. A lid opening / closing mechanism for opening and closing the lid of the closed container in a room facing the opening of the closed container, and forming an isolation chamber for reducing a pressure difference between the room and the closed container in the lid opening / closing mechanism; A device for transporting an object to be processed, comprising a covering member.
【請求項4】 前記覆い部材は、被処理体の搬送時に蓋
開閉機構とともに密閉容器の開口部から退避可能である
ことを特徴とする請求項3記載の被処理体の搬送装置。
4. The apparatus for transporting an object to be processed according to claim 3, wherein the cover member can be retracted from the opening of the closed container together with the lid opening / closing mechanism when the object to be processed is transported.
【請求項5】 前記隔離室は、その内部の圧力を密閉容
器及び部屋の圧力に合わせる圧力調整手段を備えている
ことを特徴とする請求項1または3記載の被処理体の搬
送装置。
5. The apparatus according to claim 1, wherein the isolation chamber includes pressure adjusting means for adjusting the pressure inside the isolation chamber to the pressure in the closed container and the room.
【請求項6】 前記蓋開閉機構は、密閉容器の開口部に
対向して進退可能な蓋ロック部材を有し、蓋ロック部材
の前進操作によって開口部を蓋体を閉塞し、後退操作に
よって開口部を開放することを特徴とする請求項1また
は3記載の被処理体の搬送装置。
6. The lid opening / closing mechanism has a lid lock member which can move forward and backward in opposition to an opening of the closed container, and closes the opening by a forward operation of the lid lock member, and opens by a retreat operation. The apparatus according to claim 1 or 3, wherein the part is opened.
【請求項7】 前記蓋ロック部材は、蓋体の係合受け部
に対して係脱可能な係合部材が設けられ、蓋ロック部材
と密閉容器との相対的な接離移動により蓋ロック部材と
蓋体が係脱することを特徴とする請求項1または3記載
の被処理体の搬送装置。
7. The lid lock member is provided with an engagement member capable of being disengaged from an engagement receiving portion of the lid body, and the lid lock member is moved relative to and away from the closed container. 4. The apparatus according to claim 1, wherein the lid and the lid are disengaged.
【請求項8】 前記蓋開閉機構は、密閉容器の開口部に
対向して進退可能な蓋ロック部材を有し、蓋ロック部材
の前進操作によって開口部を蓋体を閉塞し、後退操作に
よって開口部を開放することを特徴とする請求項1また
は3記載の被処理体の搬送装置。
8. The lid opening / closing mechanism has a lid lock member which can move forward and backward in opposition to the opening of the closed container. The opening is closed by a forward operation of the lid lock member, and the lid is opened by a retreat operation. The apparatus according to claim 1 or 3, wherein the part is opened.
【請求項9】 前記蓋ロック部材は、蓋体の係合受け部
に対して係脱可能な係合部材が設けられ、蓋ロック部材
と密閉容器との相対的な接離移動により蓋ロック部材と
蓋体が係脱することを特徴とする請求項1または3記載
の被処理体の搬送装置。
9. The lid lock member is provided with an engagement member that can be disengaged from an engagement receiving portion of the lid, and the lid lock member is moved relative to and away from the lid. 4. The apparatus according to claim 1, wherein the lid and the lid are disengaged.
JP32677398A 1998-11-17 1998-11-17 Object transfer device Pending JP2000150613A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32677398A JP2000150613A (en) 1998-11-17 1998-11-17 Object transfer device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32677398A JP2000150613A (en) 1998-11-17 1998-11-17 Object transfer device

Publications (1)

Publication Number Publication Date
JP2000150613A true JP2000150613A (en) 2000-05-30

Family

ID=18191544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32677398A Pending JP2000150613A (en) 1998-11-17 1998-11-17 Object transfer device

Country Status (1)

Country Link
JP (1) JP2000150613A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303869A (en) * 2002-04-05 2003-10-24 Sankyo Seiki Mfg Co Ltd Lid member close/open device in substrate conveying apparatus
WO2005004228A1 (en) * 2003-07-03 2005-01-13 Tokyo Electron Limited Treating device
WO2005124853A1 (en) * 2004-06-21 2005-12-29 Right Mfg,Co.,Ltd. Load port
JP2013120760A (en) * 2011-12-06 2013-06-17 Hitachi High-Tech Control Systems Corp Wafer processing apparatus
JP2013247322A (en) * 2012-05-29 2013-12-09 Tdk Corp Load port device
JP2013247319A (en) * 2012-05-29 2013-12-09 Tdk Corp Load port device
JP2014053417A (en) * 2012-09-06 2014-03-20 Tokyo Electron Ltd Lid opening/closing device and thermal treatment apparatus using the same, and lid opening/closing method
US9010384B2 (en) 2004-06-21 2015-04-21 Right Mfg. Co. Ltd. Load port
JP2016527732A (en) * 2013-08-12 2016-09-08 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Substrate processing system, apparatus and method with factory interface environmental control
JP2016164929A (en) * 2015-03-06 2016-09-08 シンフォニアテクノロジー株式会社 Door opening / closing device, transfer device, sorter device, and opening method of storage container
JP2017538291A (en) * 2014-11-25 2017-12-21 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Substrate processing system, apparatus and method with environmental control of substrate carrier and purge chamber
JP6274379B1 (en) * 2016-08-08 2018-02-07 信越半導体株式会社 Load port and wafer transfer method
WO2018029915A1 (en) * 2016-08-08 2018-02-15 信越半導体株式会社 Load port and wafer transfer method

Cited By (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003303869A (en) * 2002-04-05 2003-10-24 Sankyo Seiki Mfg Co Ltd Lid member close/open device in substrate conveying apparatus
WO2005004228A1 (en) * 2003-07-03 2005-01-13 Tokyo Electron Limited Treating device
JP2005026513A (en) * 2003-07-03 2005-01-27 Tokyo Electron Ltd Processing apparatus
KR100850815B1 (en) * 2003-07-03 2008-08-06 도쿄엘렉트론가부시키가이샤 Treating device
US9010384B2 (en) 2004-06-21 2015-04-21 Right Mfg. Co. Ltd. Load port
WO2005124853A1 (en) * 2004-06-21 2005-12-29 Right Mfg,Co.,Ltd. Load port
JPWO2005124853A1 (en) * 2004-06-21 2008-04-17 株式会社ライト製作所 Load port
JP2013120760A (en) * 2011-12-06 2013-06-17 Hitachi High-Tech Control Systems Corp Wafer processing apparatus
JP2013247322A (en) * 2012-05-29 2013-12-09 Tdk Corp Load port device
JP2013247319A (en) * 2012-05-29 2013-12-09 Tdk Corp Load port device
KR101761445B1 (en) * 2012-09-06 2017-07-25 도쿄엘렉트론가부시키가이샤 Apparatus for opening and closing cover, thermal processing apparatus using the same, and method for opening and closing cover
JP2014053417A (en) * 2012-09-06 2014-03-20 Tokyo Electron Ltd Lid opening/closing device and thermal treatment apparatus using the same, and lid opening/closing method
US9406537B2 (en) 2012-09-06 2016-08-02 Tokyo Electron Limited Cover opening/closing apparatus, thermal processing apparatus using the same, and cover opening/closing method
US10192765B2 (en) 2013-08-12 2019-01-29 Applied Materials, Inc. Substrate processing systems, apparatus, and methods with factory interface environmental controls
JP2016527732A (en) * 2013-08-12 2016-09-08 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Substrate processing system, apparatus and method with factory interface environmental control
US11450539B2 (en) 2013-08-12 2022-09-20 Applied Materials, Inc. Substrate processing systems, apparatus, and methods with factory interface environmental controls
US11282724B2 (en) 2013-08-12 2022-03-22 Applied Materials, Inc. Substrate processing systems, apparatus, and methods with factory interface environmental controls
JP2019016798A (en) * 2013-08-12 2019-01-31 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Substrate processing system, apparatus and method with factory interface environmental control
JP2017538291A (en) * 2014-11-25 2017-12-21 アプライド マテリアルズ インコーポレイテッドApplied Materials,Incorporated Substrate processing system, apparatus and method with environmental control of substrate carrier and purge chamber
US10359743B2 (en) 2014-11-25 2019-07-23 Applied Materials, Inc. Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls
US11003149B2 (en) 2014-11-25 2021-05-11 Applied Materials, Inc. Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls
US11782404B2 (en) 2014-11-25 2023-10-10 Applied Materials, Inc. Substrate processing systems, apparatus, and methods with substrate carrier and purge chamber environmental controls
JP2016164929A (en) * 2015-03-06 2016-09-08 シンフォニアテクノロジー株式会社 Door opening / closing device, transfer device, sorter device, and opening method of storage container
WO2018029915A1 (en) * 2016-08-08 2018-02-15 信越半導体株式会社 Load port and wafer transfer method
CN109564887A (en) * 2016-08-08 2019-04-02 信越半导体株式会社 Load port and wafer transport method
EP3499555A4 (en) * 2016-08-08 2020-04-08 Shin-Etsu Handotai Co., Ltd. LOADING PORT AND WAFER TRANSFER METHOD
US10872799B2 (en) 2016-08-08 2020-12-22 Shin-Etsu Handotai Co., Ltd. Load port and method for carrying wafers
TWI722176B (en) * 2016-08-08 2021-03-21 日商信越半導體股份有限公司 Loading port and wafer transport method
JP6274379B1 (en) * 2016-08-08 2018-02-07 信越半導体株式会社 Load port and wafer transfer method

Similar Documents

Publication Publication Date Title
JP7263639B2 (en) Substrate transfer section
TWI723122B (en) Connection mechanism and connection method of substrate storage container
JP3286240B2 (en) Load lock device and method for semiconductor processing
US9543180B2 (en) Apparatus and method for transporting wafers between wafer carrier and process tool under vacuum
CN101447406B (en) Loadlock designs and methods for using same
KR100785871B1 (en) Substrate transfer device and method for substrate transfer
CN108695207B (en) Substrate processing device
US20030053893A1 (en) Substrate processing apparatus and a method for fabricating a semiconductor device by using same
US20150024671A1 (en) Efem and load port
US20040062627A1 (en) System for the improved handling of wafers within a process tool
KR20190122161A (en) Exhaust nozzle unit, load port, and efem
WO2004007318A2 (en) Loadport apparatus and method for use thereof
JPH053240A (en) Clean transfer method and device
JP2000150613A (en) Object transfer device
JP7801508B2 (en) Wafer processing apparatus, system, and control method applied to wafer processing apparatus
JP4642619B2 (en) Substrate processing system and method
JPH06104326A (en) Processing system
KR100850815B1 (en) Treating device
CN104051295A (en) Vacuum processing apparatus and operating method thereof
US11527426B2 (en) Substrate processing device
CN1985350A (en) System for handling of wafers within a process tool
JP3350107B2 (en) Single wafer type vacuum processing equipment
JP2004087781A (en) Vacuum processing method and apparatus
JP3355697B2 (en) Portable closed container and gas purge station
JP6191853B2 (en) Load lock chamber