JP2000131037A - Object shape inspection device - Google Patents

Abstract

(57) [Summary] (with correction) [PROBLEMS] To provide an inexpensive object shape inspection apparatus capable of inspecting the shape of a minute object, adhesion of foreign matter, and the like. A moving stage is provided, an object to be inspected is sequentially set at a predetermined position, and a video signal obtained by imaging the object to be inspected is subjected to image processing, thereby determining the object to be inspected and inspecting the shape of the object to be inspected. In the object shape inspection device, a plurality of illumination means for illuminating an inspection object whose shape is to be inspected, arranged so that the irradiation angles with respect to the inspection object are respectively different, and switched and lit according to the inspection item, and illumination means. Imaging means for imaging the illuminated inspection object and outputting a video signal; data obtained by digitizing a video signal input from the imaging means; and illumination at each illumination angle of the illumination means relating to the inspection object stored in advance. An image that is compared with the corresponding reference data, processed and determined for each required inspection item stored in advance, and outputs inspection result data and required control data. And a management decision means.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shape of an object, for example, a silicon wafer, a BGA (ball grid array), or a CSP as a base material for manufacturing an LSI which is a semiconductor device.
(Chip size package), the external size, height, position, presence, absence,
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an object shape inspection apparatus that is most suitable for inspecting the presence or absence of an irregular shape or foreign matter.

[0002]

2. Description of the Related Art A plurality of bumps formed on a silicon wafer, BGA, CSP or the like as a base material for manufacturing a minute object, for example, an LSI, are formed of a silicon wafer, BGA,
It is formed on the side where a semiconductor chip such as a CSP is connected. In general, the shape of the bump is spherical or rectangular parallelepiped, and the material of the bump is solder in the spherical shape and gold in the rectangular shape. You are using The spherical bump made of a solder material has a mirror-like surface, and the rectangular parallelepiped bump made of a gold material has a rough upper surface (an uneven surface having a depth of several μm). Conventional techniques for inspecting the shape of such bumps include three-dimensional inspection using a confocal method, inspection of height and outline using a light-section method, inspection of height and outline using a laser scanning method, and the like ( None of them are shown).

[0003] As a simple method of inspecting the shape of a bump, a television camera is used to take an image of a bump from above or at an oblique direction, and to inspect an image signal output from the television camera by image processing. There is a way to do. However, in the case of the inspection method using the television camera, the inspection content of the shape of the bump is influenced by the illumination method such as from which direction and how to illuminate the bump. For example, in a coaxial epi-illumination method generally used as an illumination method, when the shape of a bump made of a gold material is to be inspected, an image in which the upper surface of the bump is dark and the background is bright can be obtained. Inspection of the position and size (excluding height) of the bump is performed. Also,
For example, in the oblique ring illumination method, the illumination light is specularly reflected on the surface of the bump, and when captured by a television camera, a bright image is obtained in a ring shape. Inspection is performed. As another inspection method, when inspecting the height of the bump, the image of the bump is imaged from above and obliquely, and the height of the bump is measured by comparing the image photographed from above with the image photographed from obliquely. Inspection stereo image processing methods have also been developed.

[0004]

As described above, various methods have been developed for inspecting the shape of a minute object, for example, the shape of a bump, according to the prior art. There is such a problem. In other words, the confocal method, the light cutting method, the laser scanning method using a laser displacement meter, etc. focus on the inspection of the height of the bump, so that the external size of the bump, the irregular shape, inspection of foreign matter adhesion, etc. cannot be performed. Alternatively, there is a problem that a large amount of time is required for the inspection and the cost of the detection unit is high. In addition, in the inspection method by image processing using a television camera, the inspection content is determined by the illumination method of the bump, and in the coaxial incident illumination method, the position of the bump and the outer size of the bump are inspected in the case of a gold material bump. It is possible, but there is a problem that inspection of bump height, irregular shape, adhesion of foreign matter, etc. is not possible.In the case of spherical bump, bright image can be obtained only at the top of spherical bump, so other than bump position There is a problem that cannot be inspected. In addition, with the oblique ring illumination method, it is difficult to inspect gold material bumps,
Even for spherical bumps made of solder material, there is only information on the ring-shaped bright parts due to specular reflection. Therefore, inspection of the bump position, approximate size (excluding height), bump irregularities existing in the bright parts, There is a problem that the inspection is limited to the inspection of only foreign matter adhesion. In addition, the stereo image processing method can inspect the outer size, height, and position of the bump, but has a problem in that it cannot inspect irregular shapes and foreign matter adhesion.

The present invention solves these problems and provides all inspection items necessary for inspecting the shape of a minute object, for example, the shape of a bump, for example, the outer size, height, position, presence / absence, irregular shapes (projections, dents, It is an object of the present invention to provide an inexpensive object shape inspection apparatus capable of performing inspections such as chipping and crushing) and adhesion of foreign matter.

[0006]

In order to solve the above-mentioned problems, an object shape inspection apparatus according to the present invention has a moving stage, sequentially sets an object to be inspected at a predetermined position, and picks up an image of the object to be inspected. In an object shape inspection apparatus for performing shape determination of the inspected object by performing image processing on a video signal to determine the inspected object, illuminating the inspected object whose shape is to be inspected, for each inspection object A plurality of illuminating means arranged so as to have different irradiation angles and switched and lit according to a required inspection item; an imaging means for imaging an object to be inspected illuminated by the illuminating means and outputting a video signal; Data corresponding to digitized data of the video signal input from the John camera, and corresponding to the illumination at each illumination angle of the illumination means with respect to the inspection object stored in advance. Compared to semi data, processing for each predetermined test item stored in advance, the judgment, and outputs the inspection result data, and has an image processing determination unit that outputs a required control data.

More specifically, in the object shape inspection apparatus of the present invention, the plurality of illuminating means arranged so that the irradiating angles are different from each other, the irradiating angle of the illuminating means having the smallest irradiating angle is set to 10 degrees or less. Lighting means. Further, the plurality of illuminating units of the object shape inspection apparatus of the present invention arranged so that the illuminating angles are different are the illuminating units in which the illuminating angle of the illuminating unit having the largest illuminating angle is set to 90 degrees. Further, the plurality of illuminating units of the object shape inspection apparatus of the present invention arranged so that the irradiating angles are different from each other include an illuminating unit in which the smallest irradiating angle is set to 10 degrees or less and a irradiating unit in which the largest irradiating angle is 90 degrees It has lighting means set and lighting means set to at least one or more intermediate irradiation angles. Further, the illumination means of the object shape inspection apparatus of the present invention, the irradiation angle of which is set to 90 degrees is provided on a side surface of an imaging lens provided in the imaging means, and is reflected by a half mirror provided inside the imaging lens, This is illumination means for illuminating an object whose shape is to be inspected with coaxial incident light.

Further, the object shape inspection apparatus of the present invention has a moving stage, sequentially sets a wafer having a bump at a predetermined position, and performs image processing of a video signal obtained by imaging a bump on the wafer. In the object shape inspection apparatus that performs the determination of the shape of the bumps, the illumination is performed on the bumps whose shape is to be inspected. A multi-stage lighting device having a plurality of light sources, a television camera that captures an image of a bump illuminated by the multi-stage lighting device, and outputs a video signal, and digitizes the video signal input from the television camera. Data and the shape of the bump corresponding to the illumination at each illumination angle of the illumination device with respect to the bump stored in advance An image processing device that compares the image data with the reference data representing the feature and outputs image data of the comparison result; and processes and determines the image data input from the image processing device for each required inspection item stored in advance. A computer that outputs the result data and the required control data.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of an object shape inspection apparatus according to the present invention will be described. FIG. 1 shows an embodiment of the object shape inspection apparatus according to the present invention. FIG. 4 shows an example of a minute object.
2 shows an example of an inspection image of a minute object for inspecting a bump.
In FIG. 1, reference numeral 24 denotes an inspection object for inspecting a shape;
Is a θ rotation stage capable of correcting the alignment of the placed inspection object 24 in the rotation direction, and 17 is provided with a θ rotation stage 18 on the upper part. An X-Y movement stage that can be moved in the X and Y directions, 12 is an imaging lens for taking an optical image of the inspection object 24 placed on the θ rotation stage 18 into a television camera, and 11 is an imaging lens 12 The television camera 19, which photoelectrically converts an optical image of the inspection object 24 taken in at step 4 into a video signal and outputs a predetermined video signal obtained by signal processing, has a television camera 11 equipped with an imaging lens 12 attached thereto. A Z-direction moving stage 21 capable of moving the camera 11 in the Z-axis direction is provided with a plurality of light sources for illuminating the inspection object 24 in a ring shape. That the multi-stage lighting device and a ring-shaped illumination device called, 1-3, the required irradiation angle (e.g. 1 10 degrees in a ring illuminating device 21, 2 45 °, 3 70
A plurality of light sources, for example, LEDs (light emitting diodes) 22 arranged in a ring shape with the optical axis of (degree) are provided inside the imaging lens 12 and are half mirrors for reflecting light from a lighting device provided on a side surface. , 23 are attached to the side surface of the imaging lens 12, and are reflected by a half mirror 22 provided inside the imaging lens 12, and illuminate the inspection object 24 with coaxial incident light of 90 degrees. A light source, for example, an LED 13 arranged at a required optical axis in the epi-illumination device 23 performs image processing on a video signal input from the television camera 11, stores the image signal, and stores the stored image data in a computer, a video monitor, or the like. 5 to 8, an illumination power supply for supplying power to the plurality of light sources 1 to 4, and 14 based on image data input from the image processing apparatus 13. The computer 15 performs inspection processing, outputs inspection results to a display, a printer, and the like, and controls the entire inspection apparatus. The computer 15 is controlled by control data input from the computer 14 to turn on the plurality of illumination power supply devices 5 to 8, respectively. , OFF control DIO (digita
l input output) An interface device 16 is a D / A conversion device that is controlled by control data input from the computer 14 and controls the illumination intensity (light amount) of each of the plurality of illumination power supply devices 5 to 8. X-Y direction moving stage 17, θ rotating stage 18, Z direction moving stage 1 controlled by control data input from
A stage driver 25 for controlling and driving the movement of the camera 9, a video monitor device 25 for displaying an image input from the image processing device 13, and a display device 26 for displaying data input from the computer 14.

The operation for inspecting the shape of a minute object will be described. First, a minute object whose shape is to be inspected, for example, FIG.
(A) A micro object as shown in (b), for example, a silicon wafer, BGA, or C
The inspection object 24 having the plurality of bumps 9 formed on the SP or the like 10 (hereinafter, referred to as the inspection object 24 when the base 10 and the plurality of bumps 9 are described as one) is moved in the X direction. -Place on the θ-rotation stage 18 attached to the Y-direction moving stage 17. Next, the X-Y movement stage 17 and the Z-direction movement stage 19 are moved and adjusted, and the plurality of bumps 9 of the inspection object 24 are moved by the ring-shaped illumination devices 21 and 23, the imaging lens 12, and the television camera 11. Positioning in the X-axis, Y-axis, and Z-axis directions is performed so that the imaging system to be configured can individually capture images over the entire range. At this time, the optical axis of the imaging lens 12 and the optical axes of the plurality of light sources 1, 2, and 3 of the ring-shaped illumination device 21 are set so as to match on the inspection object 24, for example, on the bump mounting surface of the base material 10. Further, the optical axis of the light source 4 of the coaxial epi-illumination device 23 provided on the imaging lens 12 is also set so that it is reflected by the half mirror 22 and coincides with the other optical axes described above on the bump mounting surface of the inspection object 24. Have been. The irradiation angle between the light sources 1 to 4 and the bump mounting surface on the base material 10 depends on the light source 1
Is less than 10 degrees, the light source 4 is reflected by the half mirror 22 and is 90 degrees by coaxial reflection, and the intermediate light sources 2 and 3 are, for example, 4 light sources.
5 degrees and the light source 3 is 70 degrees.

After positioning in the X-axis, Y-axis, and Z-axis directions, a plurality of alignment marks provided on the substrate 10 of the inspection object 24 or specific bumps 9 on the substrate 10 are provided with the imaging lens 12. An image is taken by the television camera 11, and an alignment mark or a video signal of a specific bump 9 is output to the image processing device 13. The image processing apparatus 13 processes in advance a video signal obtained by imaging the inspection object 24 as a reference, and stores various reference data for inspection of the base material 10 and the bump 9. The input image signal of the alignment mark or the specific bump 9 is processed, and the data of the displacement amount calculated by comparing with the reference data stored in advance is output to the computer 14. A video signal captured by the television camera 11 is transmitted to the image processing device 13.
Is output to the video monitor 24 and can be viewed as an image. The computer 14 includes the image processing device 1
The control data is output to the stage driver 20 on the basis of the data of the displacement amount input from the control unit 3. The stage driver 20 generates a drive signal based on the control data input from the computer 14, drives the X-direction / Y-direction movement stage 17 and the θ rotation stage 18, and
The alignment correction is performed for the position 4. The illumination of the inspection object 24 at the time of performing the alignment correction is performed by selectively (individually or in combination) from among the light sources 1 to 4, a target alignment mark or a light source in which the image contrast of a specific bump 9 is remarkable. )
use.

Next, the X-direction / Y-direction moving stage 17
Is moved based on the inspection coordinate information registered in the computer 14 in advance, and the mounted inspection object 2 is moved.
For each of the plurality of bumps 9 of 4, the inspection is performed while sequentially repeating the operations of imaging, image processing, and determination for all inspection items registered in the computer 14 with respect to the bump shape inspection. That is, after positioning the X-Y direction moving stage 17 so that the bump 9 to be inspected of the inspection object 24 placed on the inspection object 24 is located at a predetermined position to be inspected, first, illumination of the coaxial incident 90 ° from above is performed. Only the light source 4 of the coaxial epi-illumination device 23 is turned on, the bump 9 to be inspected is imaged by the television camera 11, and a video signal is output to the image processing device 13. Image processing device 13
Processes and stores the video signal of the bump 9 to be inspected, which is imaged by the illumination with the coaxial incident angle of 90 degrees. Next, only the light source 1 of the illuminating device 24 for illuminating with an irradiation angle of 10 degrees or less from the bottom is turned on, the bump 9 to be inspected is imaged by the television camera 11, and a video signal is output to the image processing device 13. Then, after the processing, it is stored in the image processing device 13. In addition, a lighting device 2 that illuminates at an intermediate irradiation angle of 45 degrees and 70 degrees
The light sources 2 and 3 of No. 4 are also turned on in the same manner, an image is taken by the television camera 11, the respective video signals are output to the image processing device 13, and after processing, the image processing device 13
To memorize. In this manner, the plurality of bumps 9 of the inspection object 24 are illuminated by the light sources 1 to 4, and the television camera 1
A video signal when a predetermined portion of the plurality of bumps 9 is imaged in 1 is stored in the image processing device 13.

As described above, after recording a video signal of a predetermined portion of the bump 9 to be inspected on the inspection object 24 by the illumination of each of the light sources 1 to 4, the image signal is recorded in the image processing device 13, and then the X-direction -Y
The direction moving stage 17 is moved to the next inspection position, and a video signal when a predetermined portion of the next bump 9 to be inspected is illuminated by each of the light sources 1 to 4 is stored in the image processing device 13. Such movement to the next inspection position and the next light source 1
During imaging of the bump 9 when illuminated by the light sources 1 to 4 and processing and storage of the video signal, the video signal when illuminated by each of the light sources 1 to 4 previously stored in the image processing device 13 is output to the image processing device 13. And the computer 14 sequentially process and judge according to the inspection items stored in the computer 14, and perform inspection for all inspection items stored for all bumps 9 of the imaged inspection object 24. The illumination and imaging by the light sources 1 to 4 need not always be performed, and the inspection object 24 can be inspected by selecting a light source necessary for an inspection item stored in advance, illuminating and imaging. .

FIG. 2 shows the state of various shapes of the spherical solder material bumps shown in FIG. 4A and an example of an image obtained by the television camera 11 when an image is taken by switching the illumination of each of the light sources 1 to 4. Show. In the image shown in FIG. 2, a hatched portion indicates a dark portion of the image, and an image other than the hatched portion indicates a bright portion. It can be seen that the background is dark in the illumination 1 to 3 images by oblique illumination from the light sources 1 to 3 at the required irradiation angles, and the background is bright in the illumination 4 image by the coaxial incident illumination from the light source 4. When an image of a good bump shape is seen in these images, as the irradiation angle increases in the illumination of the light sources 1 to 3, the diameter of the ring-shaped bright portion decreases, and in the coaxial epi-illumination of the light source 4, It can be seen that only the vertex is bright. From these pieces of information, the outer diameter of the bump can be determined from one image of illumination by illumination from the light source 1 or four images of illumination by illumination from the light source 4. It can be determined from the image. In addition, the ring diameters of the bright parts of the illuminations 1-4 images by the illuminations from the light sources 1-4 and the light sources 1-4
The curvature of the upper surface of the bump can be calculated from the relationship with the irradiation angle, and the height of the bump can be obtained from the curvature.

On the other hand, bump-shaped irregularities (projections, dents,
Chipping), as for the adhesion of foreign matter, as shown in FIG.
The information on the defect appears in an added form, and the defect content of the bump shape can be determined. In addition, it is possible to determine the collapse of the bump shape based on features such as a wide ring width obtained from the illumination 1 image obtained by the illumination from the light source 1 and a large bright portion at the vertex of the illumination 4 image obtained by the illumination from the light source 4. It is. In addition, regarding the presence or absence of bumps, illumination 1 to 3 images by illumination from light sources 1 to 3,
Since a ring-shaped image does not appear, it can be determined.

FIG. 3 shows examples of various states of rectangular parallelepiped gold bumps shown in FIG. 4B and examples of images obtained when the television camera 11 picks up an image by switching the illumination by the light sources 1 and 4. Show. The light sources 2 and 3 are not used because it is difficult to obtain a characteristic image. In FIG.
The hatched portion indicates a very dark (black) portion, the hatched portion indicates an intermediate brightness (gray) portion, and the others indicate a very bright (white) portion. It can be seen that the background is very bright in the illumination 4 image by coaxial epi-illumination from the light source 4, and the brightness is intermediate on the bump upper surface. When an image with a good bump shape is seen in these images, only the edge portion of the bump is very bright in the illumination 1 image by the illumination from the light source 1, and in the illumination 4 image by the illumination from the light source 4, the bump top surface is It can be seen that only the part has an intermediate brightness gray.

From these information, the outer size of the bump can be determined by one image of illumination from the light source 1 or four images of illumination by the illumination from the light source 4, and the position of the bump is determined by the illumination from the light source 4. Can be determined from four images of the illumination. In addition, the outer shape defect of the bump can be determined because the outer shape is bulged or dented compared to a good bump in the illumination 4 image by the illumination from the light source 4. Further, in the case where there is no bump, it is possible to make a determination since there is no middle gray portion between the bump upper surface portion in the illumination 1 image by the illumination from the light source 1. Further, the determination of the bump-shaped projections and foreign substances attached can be made because the projections or attached foreign substance portions become bright (white) images in the illumination 1 image obtained by illumination from the light source 1. Regarding the bump-shaped dent, the edge portion of the dent becomes a bright (white) image in the illumination 1 image illuminated by the light source 1, and the dent portion becomes bright (white) in the illumination 4 image illuminated by the light source 4. Since it is an image, it can be determined. In addition, the lack of the bump shape can be determined because the edge portion of the lack is a bright (white) image in the illumination 1 image by the illumination from the light source 1.

In the present embodiment, the spherical solder material bump and the rectangular parallelepiped gold material bump have been described as examples. However, the shape or material of the target bump is not limited. Needless to say, in the case of (1), the determination can be made in the same way as the rectangular parallelepiped-shaped gold material bump. Needless to say, it can be used for shape inspection of minute objects other than bumps. In this embodiment, the LED is used as the light source. However, the present invention is not limited to this. For example, an optical fiber and a halogen lamp light source, a xenon lamp, a strobe lamp, or the like may be used. Also,
In the present embodiment, the light source of the illumination device is four steps, that is, illumination from four irradiation angles, but is not limited thereto.
An illumination device having an illumination angle of 10 degrees or less, an illumination device having an illumination angle of 90 degrees, and an intermediate illumination device.
The number of stages may be six or six. In this embodiment, the imaging lens 12 has been described as a fixed lens.
Depending on the target bump size or defect size, a fixed lens switching type or a continuous magnification changing means such as a zoom lens may be used. As described above, according to the object shape inspection apparatus of the present invention, a relatively simple and inexpensive configuration using a plurality of stages of illumination with different irradiation angles, a television camera, and an image signal processing circuit, All the inspections required for the inspection can be realized.

[0019]

According to the present invention, all inspection items necessary for inspecting the shape of a minute object, for example, the shape of a bump, for example, the outer size, height, position, presence / absence, irregular shape (projection, dent,
Inspection of foreign matter adhesion (chipping, crushing, etc.) can be performed, and an inexpensive object shape inspection apparatus can be provided.

[Brief description of the drawings]

FIG. 1 is an overall configuration diagram showing an example of an object shape inspection apparatus according to the present invention.

FIG. 2 shows an example of an image obtained by imaging a bump illuminated by each light source when inspecting a spherical solder material bump using the object shape inspection apparatus according to the present invention.

FIG. 3 is an example of an image obtained by imaging a bump illuminated by each light source when inspecting a rectangular parallelepiped gold material bump using the object shape inspection apparatus according to the present invention.

FIG. 4 is an example of a minute object inspected using the object shape inspection apparatus according to the present invention.

[Explanation of symbols]

1-3: ring-shaped illumination device light source, 4: coaxial epi-illumination illumination device light source, 5-8: illumination device power source, 9: bump, 10: base material on which bump is mounted, 11: television camera,
12 imaging lens, 13 image processing device, 14 computer, 15 DIO interface device, 16 DA
Conversion device, 17 ... X-Y direction moving stage, 18 ...
θ rotation stage, 19: Z-direction moving stage, 20: stage driver, 21: ring-shaped illumination device, 22: half mirror, 23: coaxial incident illumination device, 24: inspection object,
25: video monitor device, 26: display device.

Continued on front page F-term (reference) 2F065 AA03 AA14 AA24 AA25 AA26 AA49 AA56 BB02 CC19 FF01 FF04 GG07 HH04 HH12 JJ03 JJ19 JJ26 LL04 LL12 PP12 QQ21 QQ24 QQ32 SS02 SS13 4M106 AA01 DB09 DJ01 DJ01 BA15 BA19 DA03 DB02 DC09 DC33

Claims (6)

[Claims] An object to be inspected is determined by sequentially setting an object to be inspected at a predetermined position and performing image processing on a video signal obtained by imaging the object to be inspected; In an object shape inspection device for performing a shape inspection, a plurality of light sources, which illuminate the object to be inspected whose shape is to be inspected, are arranged so as to have different irradiation angles with respect to the inspection object, and are switched and lit according to a required inspection item. Illuminating means, imaging means for imaging an object to be inspected illuminated by the illuminating means, and outputting a video signal; data obtained by digitizing the video signal input from the imaging means; The object is compared with reference data corresponding to the illumination at each illumination angle of the illumination means with respect to the object, and processed and determined for each required inspection item stored in advance. Output the result data,
An object shape inspection apparatus comprising: an image processing determination unit that outputs required control data. 2. The object shape inspection apparatus according to claim 1, wherein the plurality of illuminating units arranged so that the illuminating angles are different from each other, wherein the illuminating unit having the smallest illuminating angle has an illuminating angle of:
An object shape inspection apparatus, characterized in that the illumination means is set to 10 degrees or less. 3. The object shape inspection apparatus according to claim 1, wherein the plurality of illuminating units arranged so that the irradiating angles are different from each other, wherein the irradiating angle of the illuminating unit having the largest irradiating angle is:
An object shape inspection apparatus characterized in that the illumination means is set at 90 degrees. 4. The object shape inspection apparatus according to claim 1, wherein the plurality of illuminating units arranged so that the irradiating angles are different from each other include: an illuminating unit having the smallest irradiating angle set to 10 degrees or less; An object shape inspection apparatus comprising: an illuminating unit having an irradiation angle set to 90 degrees; and an illuminating unit having at least one intermediate irradiation angle. 5. The object shape inspection apparatus according to claim 1, wherein the illuminating means whose irradiation angle is set to 90 degrees is provided on a side surface of an imaging lens provided in the imaging means, and is provided inside the imaging lens. An object shape inspection apparatus characterized in that the object shape inspection device is an illuminating means for illuminating the object whose shape is to be inspected by being reflected by a half mirror provided in the light source. 6. A bump shape is determined by sequentially setting a wafer having bumps at predetermined positions, having a moving stage, and performing image processing on a video signal obtained by imaging the bumps on the wafer. A multi-stage lighting device having a plurality of light sources that illuminate the bumps whose shape is to be inspected, are arranged so as to have different irradiation angles with respect to the bumps, and are switched on and off according to required inspection items. A television camera that images a bump to be illuminated by the multi-stage lighting device and outputs a video signal; data obtained by digitizing the video signal input from the television camera; and the bump stored in advance. Comparison with reference data representing the characteristics of the shape of the bump corresponding to the illumination of each illumination angle of the illumination device, An image processing apparatus that outputs image data of a comparison result, and processes and determines the image data input from the image processing apparatus for each required inspection item stored in advance, and outputs inspection result data, An object shape inspection device, comprising: a computer that outputs control data.