GB2360008A - Material processing applications of lasers using optical breakdown - Google Patents

Material processing applications of lasers using optical breakdown

Info

Publication number
GB2360008A
GB2360008A GB0113167A GB0113167A GB2360008A GB 2360008 A GB2360008 A GB 2360008A GB 0113167 A GB0113167 A GB 0113167A GB 0113167 A GB0113167 A GB 0113167A GB 2360008 A GB2360008 A GB 2360008A
Authority
GB
United Kingdom
Prior art keywords
ultra
optical breakdown
fine
material processing
lasers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB0113167A
Other versions
GB0113167D0 (en
Inventor
Vladimir Dmitriev
Nikolay Guletsky
Sergey Oshemkov
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
UNIVERSAL CRYSTAL Ltd
Original Assignee
UNIVERSAL CRYSTAL Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by UNIVERSAL CRYSTAL Ltd filed Critical UNIVERSAL CRYSTAL Ltd
Publication of GB0113167D0 publication Critical patent/GB0113167D0/en
Publication of GB2360008A publication Critical patent/GB2360008A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1 ns or less
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/30—Organic materials
    • B23K2103/42—Plastics other than composite materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

New methods for laser material processing in optically transparent materials are described using the volume optical breakdown phenomenon. This occurs when ultra-short pulses of the order of tens of picoseconds or less, are focused into the volume of the material by means of a high quality focusing objective lens. A focal spot close to the diffraction limit for the laser wavelength is obtained within the material. A number of processing techniques are described which are impossible to perform with hitherto available methods, including ultra-fine hole drilling, ultra-fine cutting processes, ultra-fine resolution marking or image formation applied to the interior of a sample, including diamonds, and the formation of deep black images in plastic materials.
GB0113167A 1998-12-03 1999-12-02 Material processing applications of lasers using optical breakdown Withdrawn GB2360008A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
IL12738898A IL127388A0 (en) 1998-12-03 1998-12-03 Material processing applications of lasers using optical breakdown
PCT/IL1999/000655 WO2000032349A1 (en) 1998-12-03 1999-12-02 Material processing applications of lasers using optical breakdown

Publications (2)

Publication Number Publication Date
GB0113167D0 GB0113167D0 (en) 2001-07-25
GB2360008A true GB2360008A (en) 2001-09-12

Family

ID=11072219

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0113167A Withdrawn GB2360008A (en) 1998-12-03 1999-12-02 Material processing applications of lasers using optical breakdown

Country Status (6)

Country Link
AU (1) AU1408000A (en)
CA (1) CA2352868A1 (en)
DE (1) DE19983782T1 (en)
GB (1) GB2360008A (en)
IL (1) IL127388A0 (en)
WO (1) WO2000032349A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (en) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 Laser processing method and semiconductor chip manufacturing method
DE10122335C1 (en) * 2001-05-08 2002-07-25 Schott Glas Process for marking glass comprises selecting the marking position along a drawing process having a glass transition temperature above the transformation temperature
DE10140578A1 (en) * 2001-08-18 2003-02-27 Munser Norbert Method for cutting complex profiled shapes from transparent materials uses focussed laser radiation to reduce the amount of waste material
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
CN101335235B (en) 2002-03-12 2010-10-13 浜松光子学株式会社 Method for dicing substrate
TWI520269B (en) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
EP1654111B1 (en) * 2003-05-30 2020-02-12 Siemens Medical Solutions USA, Inc. Method for fabrication of a detector component using laser technology
US20060000814A1 (en) 2004-06-30 2006-01-05 Bo Gu Laser-based method and system for processing targeted surface material and article produced thereby
US7284396B2 (en) * 2005-03-01 2007-10-23 International Gemstone Registry Inc. Method and system for laser marking in the volume of gemstones such as diamonds
US20110073563A1 (en) * 2009-09-25 2011-03-31 Industrial Technology Research Institute Patterning Method for Carbon-Based Substrate
DE102010037273A1 (en) 2010-09-02 2012-03-08 Schott Ag Method and device for marking glass
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206496A (en) * 1990-08-15 1993-04-27 United Distillers, Plc Sub-surface marking
US5575936A (en) * 1992-12-18 1996-11-19 Firebird Traders Ltd. Process and apparatus for etching an image within a solid article
US5582752A (en) * 1993-12-17 1996-12-10 Laser Industries, Ltd. Method and apparatus for applying laser beams to a working surface, particularly for ablating tissue
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5786560A (en) * 1995-03-31 1998-07-28 Panasonic Technologies, Inc. 3-dimensional micromachining with femtosecond laser pulses

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5206496A (en) * 1990-08-15 1993-04-27 United Distillers, Plc Sub-surface marking
US5575936A (en) * 1992-12-18 1996-11-19 Firebird Traders Ltd. Process and apparatus for etching an image within a solid article
US5582752A (en) * 1993-12-17 1996-12-10 Laser Industries, Ltd. Method and apparatus for applying laser beams to a working surface, particularly for ablating tissue
US5656186A (en) * 1994-04-08 1997-08-12 The Regents Of The University Of Michigan Method for controlling configuration of laser induced breakdown and ablation
US5786560A (en) * 1995-03-31 1998-07-28 Panasonic Technologies, Inc. 3-dimensional micromachining with femtosecond laser pulses

Also Published As

Publication number Publication date
AU1408000A (en) 2000-06-19
DE19983782T1 (en) 2001-10-18
GB0113167D0 (en) 2001-07-25
CA2352868A1 (en) 2000-06-08
IL127388A0 (en) 1999-10-28
WO2000032349A1 (en) 2000-06-08

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)