EP3673513A4 - DIGITAL ALLOY-BASED REAR BARRIER FOR P-CHANNEL NITRIDE TRANSISTORS - Google Patents

DIGITAL ALLOY-BASED REAR BARRIER FOR P-CHANNEL NITRIDE TRANSISTORS Download PDF

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Publication number
EP3673513A4
EP3673513A4 EP17922088.4A EP17922088A EP3673513A4 EP 3673513 A4 EP3673513 A4 EP 3673513A4 EP 17922088 A EP17922088 A EP 17922088A EP 3673513 A4 EP3673513 A4 EP 3673513A4
Authority
EP
European Patent Office
Prior art keywords
rear barrier
nitride transistors
digital alloy
based rear
channel nitride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17922088.4A
Other languages
German (de)
French (fr)
Other versions
EP3673513A1 (en
Inventor
Rongming Chu
Yu Cao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HRL Laboratories LLC
Original Assignee
HRL Laboratories LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HRL Laboratories LLC filed Critical HRL Laboratories LLC
Publication of EP3673513A1 publication Critical patent/EP3673513A1/en
Publication of EP3673513A4 publication Critical patent/EP3673513A4/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/85Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being Group III-V materials, e.g. GaAs
    • H10D62/8503Nitride Group III-V materials, e.g. AlN or GaN
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/40FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels
    • H10D30/47FETs having zero-dimensional [0D], one-dimensional [1D] or two-dimensional [2D] charge carrier gas channels having two-dimensional [2D] charge carrier gas channels, e.g. nanoribbon FETs or high electron mobility transistors [HEMT]
    • H10D30/471High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT]
    • H10D30/472High electron mobility transistors [HEMT] or high hole mobility transistors [HHMT] having lower bandgap active layer formed on top of wider bandgap layer, e.g. inverted HEMT
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/81Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation
    • H10D62/815Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW]
    • H10D62/8161Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices
    • H10D62/8162Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation
    • H10D62/8164Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials of structures exhibiting quantum-confinement effects, e.g. single quantum wells; of structures having periodic or quasi-periodic potential variation of structures having periodic or quasi-periodic potential variation, e.g. superlattices or multiple quantum wells [MQW] potential variation due to variations in composition or crystallinity, e.g. heterojunction superlattices having quantum effects only in the vertical direction, i.e. layered structures having quantum effects solely resulting from vertical potential variation comprising only semiconductor materials 
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00Electrodes of devices having potential barriers
    • H10D64/20Electrodes characterised by their shapes, relative sizes or dispositions 
    • H10D64/27Electrodes not carrying the current to be rectified, amplified, oscillated or switched, e.g. gates
    • H10D64/311Gate electrodes for field-effect devices
    • H10D64/411Gate electrodes for field-effect devices for FETs
    • H10D64/511Gate electrodes for field-effect devices for FETs for IGFETs
    • H10D64/512Disposition of the gate electrodes, e.g. buried gates
    • H10D64/513Disposition of the gate electrodes, e.g. buried gates within recesses in the substrate, e.g. trench gates, groove gates or buried gates
EP17922088.4A 2017-08-25 2017-08-25 DIGITAL ALLOY-BASED REAR BARRIER FOR P-CHANNEL NITRIDE TRANSISTORS Pending EP3673513A4 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2017/048753 WO2019040083A1 (en) 2017-08-25 2017-08-25 Digital alloy based back barrier for p-channel nitride transistors

Publications (2)

Publication Number Publication Date
EP3673513A1 EP3673513A1 (en) 2020-07-01
EP3673513A4 true EP3673513A4 (en) 2021-04-07

Family

ID=65439473

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17922088.4A Pending EP3673513A4 (en) 2017-08-25 2017-08-25 DIGITAL ALLOY-BASED REAR BARRIER FOR P-CHANNEL NITRIDE TRANSISTORS

Country Status (3)

Country Link
EP (1) EP3673513A4 (en)
CN (1) CN111033750B (en)
WO (1) WO2019040083A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115458406B (en) * 2022-03-18 2025-11-25 西安电子科技大学 Polarization-tunable HEMTs based on ScAlN digital alloys and their preparation methods
CN114937688B (en) * 2022-05-17 2025-06-03 江苏镓宏半导体有限公司 A gallium nitride epitaxial structure and semiconductor device and preparation method thereof
CN118676199A (en) * 2024-08-21 2024-09-20 深圳平湖实验室 Semiconductor device, manufacturing method thereof, chip and electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100276732A1 (en) * 2007-12-26 2010-11-04 Yuji Ando Semiconductor device
US20140264379A1 (en) * 2013-03-15 2014-09-18 The Government Of The United States Of America, As Represented By The Secretary Of The Navy III-Nitride P-Channel Field Effect Transistor with Hole Carriers in the Channel
US20150303290A1 (en) * 2014-04-21 2015-10-22 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device and method of manufacturing the semiconductor device

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US6942150B2 (en) * 1993-11-24 2005-09-13 Metrologic Instruments, Inc. Web-based mobile information access terminal
US7030428B2 (en) * 2001-12-03 2006-04-18 Cree, Inc. Strain balanced nitride heterojunction transistors
US7612390B2 (en) * 2004-02-05 2009-11-03 Cree, Inc. Heterojunction transistors including energy barriers
US7709859B2 (en) * 2004-11-23 2010-05-04 Cree, Inc. Cap layers including aluminum nitride for nitride-based transistors
US7615774B2 (en) * 2005-04-29 2009-11-10 Cree.Inc. Aluminum free group III-nitride based high electron mobility transistors
US9711633B2 (en) * 2008-05-09 2017-07-18 Cree, Inc. Methods of forming group III-nitride semiconductor devices including implanting ions directly into source and drain regions and annealing to activate the implanted ions
WO2010077984A2 (en) * 2008-12-16 2010-07-08 California Institute Of Technology Digital alloy absorber for photodetectors
US8217480B2 (en) * 2010-10-22 2012-07-10 California Institute Of Technology Barrier infrared detector
US8617927B1 (en) * 2011-11-29 2013-12-31 Hrl Laboratories, Llc Method of mounting electronic chips
WO2013155108A1 (en) * 2012-04-09 2013-10-17 Transphorm Inc. N-polar iii-nitride transistors
US8860091B2 (en) * 2012-04-16 2014-10-14 Hrl Laboratories, Llc Group III-N HFET with a graded barrier layer
EP2768027B1 (en) * 2013-02-15 2019-10-30 AZUR SPACE Solar Power GmbH Layer structure for a group-III-nitride normally-off transistor
US9202905B1 (en) * 2014-09-08 2015-12-01 Triquint Semiconductor, Inc. Digital alloy layer in a III-nitrade based heterojunction field effect transistor
US10347722B2 (en) * 2015-03-04 2019-07-09 Lehigh University Artificially engineered III-nitride digital alloy

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100276732A1 (en) * 2007-12-26 2010-11-04 Yuji Ando Semiconductor device
US20140264379A1 (en) * 2013-03-15 2014-09-18 The Government Of The United States Of America, As Represented By The Secretary Of The Navy III-Nitride P-Channel Field Effect Transistor with Hole Carriers in the Channel
US20150303290A1 (en) * 2014-04-21 2015-10-22 Panasonic Intellectual Property Management Co., Ltd. Semiconductor device and method of manufacturing the semiconductor device

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019040083A1 *

Also Published As

Publication number Publication date
CN111033750B (en) 2023-09-01
WO2019040083A1 (en) 2019-02-28
CN111033750A (en) 2020-04-17
EP3673513A1 (en) 2020-07-01

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