DE3466136D1 - Rectifier device - Google Patents
Rectifier deviceInfo
- Publication number
- DE3466136D1 DE3466136D1 DE8484300146T DE3466136T DE3466136D1 DE 3466136 D1 DE3466136 D1 DE 3466136D1 DE 8484300146 T DE8484300146 T DE 8484300146T DE 3466136 T DE3466136 T DE 3466136T DE 3466136 D1 DE3466136 D1 DE 3466136D1
- Authority
- DE
- Germany
- Prior art keywords
- rectifier device
- rectifier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/136—Containers comprising a conductive base serving as an interconnection having other interconnections perpendicular to the conductive base
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
- H10W76/10—Containers or parts thereof
- H10W76/12—Containers or parts thereof characterised by their shape
- H10W76/13—Containers comprising a conductive base serving as an interconnection
- H10W76/138—Containers comprising a conductive base serving as an interconnection having another interconnection being formed by a cover plate parallel to the conductive base, e.g. sandwich type
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58013388A JPS59138357A (ja) | 1983-01-28 | 1983-01-28 | 整流装置 |
| JP58013387A JPS59138356A (ja) | 1983-01-28 | 1983-01-28 | 整流装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE3466136D1 true DE3466136D1 (de) | 1987-10-15 |
Family
ID=26349171
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE8484300146T Expired DE3466136D1 (de) | 1983-01-28 | 1984-01-10 | Rectifier device |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4646131A (de) |
| EP (1) | EP0115386B1 (de) |
| DE (1) | DE3466136D1 (de) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE34696E (en) * | 1985-11-29 | 1994-08-16 | Mitsubishi Denki Kabushiki | Semiconductor device housing with electrodes in press contact with the opposite sides of chip |
| US4829364A (en) * | 1985-11-29 | 1989-05-09 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor device |
| DE3718598A1 (de) * | 1986-06-04 | 1987-12-10 | Mitsubishi Electric Corp | Halbleiteranordnung |
| US4987476A (en) * | 1988-02-01 | 1991-01-22 | General Instrument Corporation | Brazed glass pre-passivated chip rectifier |
| US4994890A (en) * | 1989-11-27 | 1991-02-19 | Snap-On Tools Corporation | Rectifier structure with individual links |
| JP3458531B2 (ja) * | 1995-06-02 | 2003-10-20 | 株式会社デンソー | 交流発電機 |
| DE19530264A1 (de) * | 1995-08-17 | 1997-02-20 | Abb Management Ag | Leistungshalbleitermodul |
| US6107711A (en) * | 1998-08-21 | 2000-08-22 | Emerson Electric Co. | Brushless exciter for a rotating electromagnetic machine |
| HRP990234A2 (en) * | 1999-07-23 | 2001-04-30 | Končar - Elektronika I Informatika D.D. Zagreb | Arrangement of bilaterally cooled energetic semiconductor valves protected from negative environmental effects |
| EP1263045A1 (de) * | 2001-06-01 | 2002-12-04 | ABB Schweiz AG | Leistungshalbleitermodul |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2751528A (en) * | 1954-12-01 | 1956-06-19 | Gen Electric | Rectifier cell mounting |
| SE321741B (de) * | 1966-02-23 | 1970-03-16 | Asea Ab | |
| CA869745A (en) * | 1967-09-11 | 1971-04-27 | R. Petersen Sigrud | Spring mounted pressure diodes |
| JPS5030428B1 (de) * | 1969-03-31 | 1975-10-01 | ||
| US3654528A (en) * | 1970-08-03 | 1972-04-04 | Gen Electric | Cooling scheme for a high-current semiconductor device employing electromagnetically-pumped liquid metal for heat and current transfer |
| DE2300935A1 (de) * | 1972-03-06 | |||
| US3852628A (en) * | 1972-09-11 | 1974-12-03 | Westinghouse Electric Corp | Rectifier assembly for brushless excitation systems |
| JPS5318266Y2 (de) * | 1973-01-25 | 1978-05-16 | ||
| US3872335A (en) * | 1974-03-07 | 1975-03-18 | Westinghouse Electric Corp | Rotating rectifier assembly for brushless exciters |
| US4021839A (en) * | 1975-10-16 | 1977-05-03 | Rca Corporation | Diode package |
| DE2556749A1 (de) * | 1975-12-17 | 1977-06-23 | Bbc Brown Boveri & Cie | Leistungshalbleiterbauelement in scheibenzellenbauweise |
| JPS5354971A (en) * | 1976-10-28 | 1978-05-18 | Mitsubishi Electric Corp | Semiconductor device |
| US4274106A (en) * | 1977-11-07 | 1981-06-16 | Mitsubishi Denki Kabushiki Kaisha | Explosion proof vibration resistant flat package semiconductor device |
| JPS5471572A (en) * | 1977-11-18 | 1979-06-08 | Fujitsu Ltd | Semiconductor device |
| DE2841370A1 (de) * | 1978-09-22 | 1980-03-27 | Siemens Ag | Vorrichtung zum einspannen eines scheibenfoermigen halbleiterbauelements |
| US4313128A (en) * | 1979-05-08 | 1982-01-26 | Westinghouse Electric Corp. | Compression bonded electronic device comprising a plurality of discrete semiconductor devices |
| EP0054597A1 (de) * | 1980-12-18 | 1982-06-30 | International Business Machines Corporation | Kühlanordnung für Modul-Steckerstifte |
-
1983
- 1983-11-18 US US06/553,395 patent/US4646131A/en not_active Expired - Lifetime
-
1984
- 1984-01-10 EP EP84300146A patent/EP0115386B1/de not_active Expired
- 1984-01-10 DE DE8484300146T patent/DE3466136D1/de not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| EP0115386B1 (de) | 1987-09-09 |
| EP0115386A1 (de) | 1984-08-08 |
| US4646131A (en) | 1987-02-24 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8339 | Ceased/non-payment of the annual fee |