DE102019207714B4 - Arrangement with an SMD component and method for producing a connection - Google Patents

Abstract

Arrangement with an SMD component (1) with:- at least one electronic component (2),- at least one insulating base (3a; 3b; 3c), wherein:- the SMD component (1) has at least one contact (10a to 10f),- the at least one contact (10a to 10f) has a metallic contact surface (100) for electrically contacting at least one conductor track (40) of a circuit board (4),- the at least one insulating base (3a; 3b; 3c) has a mounting side (30) which faces the circuit board (4) in the mounted state of the SMD component (1),- the metallic contact surface (100) of the at least one contact (10a to 10f) in the mounted state of the SMD component (1) is arranged at least in sections between the conductor track (40) of the circuit board (4) and the mounting side (30) of the insulating base (3a; 3b; 3c) is, wherein the at least one contact (10a to 10f) is designed at a free end (E) as at least one wedge (101), at least one projection (102) and/or at least one step, wherein a side of the at least one wedge (101), the at least one projection (102) and/or the at least one step facing the conductor track (40) of the circuit board (4) in the assembled state is arranged parallel and flush with the mounting side (30) or parallel and closer to the conductor track (40) of the circuit board (4) than the mounting side (30), with a material connection between the at least one contact (10a to 10f) of the SMD component (1) and the conductor track (40) of the circuit board (4), wherein a metallic contact surface (100) of the at least one contact (10a to 10f) is at least partially arranged between the conductor track (40) of the circuit board (4) and the mounting side (30) of the insulating Base (3a; 3b; 3c) of the SMD component (1), characterized in that in addition to the material connection between an electrically conductive connecting material (5) and the free end (E) of the at least one contact (10a to 10f), a positive connection is also formed at least between the at least one wedge (101), the at least one projection (102) and/or the at least one step and the electrically conductive connecting material (5).

Description

The invention relates to an arrangement with an SMD component with at least one electronic component and at least one insulating base, wherein the SMD component has at least one contact, wherein the at least one contact has a metallic contact surface for electrically contacting at least one conductor track of a circuit board, wherein the at least one insulating base has a mounting side which faces the circuit board when the SMD component is mounted, and wherein the metallic contact surface of the at least one contact is arranged at least in sections between the conductor track of the circuit board and the mounting side of the insulating base when the SMD component is mounted. The invention further relates to a method for producing a connection of an SMD component to a conductor track of a circuit board.

From the German disclosure document DE 10 2007 036 841 A1 A semiconductor component with a semiconductor chip and a connecting bracket is known, which connects contacts on the top of the semiconductor chip to external contacts. The connecting bracket has an insulating base part and a coating, wherein the coating is arranged on an underside of the connecting bracket. The coating has contact surfaces that are arranged on the semiconductor chip and contact surfaces that are arranged on external contacts. As a result, the semiconductor chip is electrically connected to the external contacts. In addition, the connecting bracket has a step with a shoulder in order to overcome a height difference between the semiconductor chip and the external contacts.

From the US disclosure document US 2008/0 049 430 A1 A light-emitting chip is known which is arranged on a base. The base has a conductor structure which is connected on the one hand to the chip and on the other hand to a plurality of connections.

From the US disclosure document US 2010 / 0 078 668 A1 is, see there 2 , a lighting device with a base body and a light-emitting diode is known. The base body is surrounded by an insulating layer, with electrode layers and metal layers arranged on the insulating layer. The metal layers are electrically connected to the light-emitting diode via wires. A projection is arranged on each side of the base body. Each projection has a side that slopes towards a mounting side and rises away from the base body. This side is neither parallel nor flush with a mounting side of the lighting device.

From the US disclosure document US 2015 / 0 021 646 A1 , 9 to 14 , a lighting device with a lighting element and a base body is known. The base body has metal layers on its surface. The base body is provided with a projection on opposite sides, each of the projections having surfaces that rise outwards at an angle away from the base body. These surfaces are neither parallel nor flush with a mounting side of the lighting device.

From the US disclosure document US 2004 / 0 188 700 A1 A lighting device with a light-emitting diode is known, see 16 to 20 The light-emitting diode is surrounded by an optical element that has an optical function and a sealing function. The element can be hemispherical or rectangular in sections. The element extends to the outer edges of a base body of the lighting device. A lower section of the lighting device is always cuboid-shaped due to the interaction of the element and the base body.

TASK AND SOLUTION

The invention is based on the object of improving a mechanical connection and an electrical contact between an SMD component and a conductor track of a printed circuit board.

To achieve the object, according to the invention, an arrangement with an SMD component with the features of claim 1 and a method for producing a connection of the SMD component with the at least one conductor track of the circuit board with the features of claim 12 are provided. Advantageous further developments of the invention emerge from the subclaims.

According to the invention, an arrangement is provided with an SMD component with at least one electronic component and at least one insulating base, wherein the SMD component has at least one contact, wherein the at least one contact has a metallic contact surface for electrically contacting at least one conductor track of a circuit board, wherein the at least one insulating base has a mounting side which faces the circuit board in the mounted state of the SMD component, wherein the metallic contact surface of the at least one contact is arranged at least in sections between the conductor track of the circuit board and the mounting side of the insulating base in the mounted state of the SMD component, wherein the at least one contact is designed at a free end at least as a wedge, at least as a projection and/or at least is designed as a step, wherein a side of the at least one wedge, the at least one projection and/or the at least one step facing the conductor track of the circuit board in the mounted state is arranged substantially parallel and substantially flush with the mounting side or substantially parallel and closer to the conductor track of the circuit board than the mounting side.

According to the invention, the SMD component should relate to any SMD component provided with at least one contact, in particular several connection contacts. SMD means "surface-mount device" and thus surface-mounted component. SMD components are connected to the conductor track of the circuit board by means of solderable connection surfaces, by means of the at least one contact and by means of an electrically conductive connecting material, in particular solder, in particular soldered onto the conductor track of the circuit board.

An electronic component can be understood as a single electronic component or as several electronic components, whereby a capacitor or a coil, for example, can also be considered an electronic component. However, it can also be understood as any electrical or electronic component, also called a component, that is generally considered for electrical circuits, including passive and active electronic components.

In a preferred embodiment, several contacts are provided which enable contacting of the SMD component with the conductor track of the circuit board. At least each individual SMD component has at least one contact, in particular two contacts, in particular more than two contacts. These contacts are preferably provided for electrical contacting, while further contacts can be provided which, for example, enable better heat dissipation and/or better mechanical fastening of the SMD component on the circuit board. The at least one contact is thus preferably at least partially made of metal.

The insulating base serves to electrically insulate the SMD component and thus to prevent short circuits or electrical connections that cause interference. The insulating base also serves as a static support element, carrier element and/or housing for, for example, at least one electronic component.

The mounting side of the insulating base of the SMD component can have different shapes. For example, the mounting side can have a distance to the circuit board in certain areas or run completely parallel to the circuit board. Furthermore, there can also be a contact between the SMD component and the circuit board in order to increase heat dissipation directly to the circuit board. In this case, at least one contact, in particular two contacts, in particular more than two contacts, is provided for electrical contact and at least one further contact for heat dissipation between the SMD component and the circuit board. In a preferred embodiment, the mounting side is designed to be flat and parallel to the circuit board at least in sections at points of contact with the circuit board. Because the mounting side is designed to be flat and parallel at least in sections at points of contact with the circuit board, a secure support and thus both a secure mechanical fastening and a secure electrical contact between the SMD component and the circuit board can be achieved.

The free end of the at least one contact is an end, in particular an end region, which is to be connected to the conductor track of the circuit board when the SMD component is mounted. The free end, in particular the end region, is thus facing away from the electronic component. In one embodiment, the free end of the insulating base is arranged facing away, so that in a configuration with two opposing contacts, the insulating base is located, for example, essentially between the contacts.

An extension of the metallic contact surface of the contact is particularly advantageously achieved by designing the free end at least as a wedge, at least as a projection and/or at least as a step. This also results in a particularly stable fixation of the SMD component on the circuit board. The particularly stable fixation is achieved by at least partially enclosing and contacting the at least one wedge, the at least one projection and/or the at least one step of the free end of the contact of the SMD component by means of an electrically conductive connecting material, in particular by means of solder. The electrically conductive connecting material, in particular the solder, also establishes a connection to the conductor track of the circuit board. Because the side of the at least one wedge, the at least one projection and/or the at least one step facing the conductor track of the circuit board in the assembled state is arranged essentially parallel and essentially flush with the mounting side or essentially parallel and closer to the conductor track of the circuit board than the mounting side, bubble formation when enclosing the at least one wedge, the at least one projection jump and/or the at least one step with the electrically conductive connecting material can be avoided. The connection between the contact and the conductor track is therefore a particularly stable connection and the contact has a particularly large contact area.

In one embodiment, the free end of the at least one contact is designed as the at least one wedge. Designed as a wedge means that the free end tapers at least in sections towards the mounting side and extends essentially parallel and essentially flush with the mounting side or essentially parallel and closer to the conductor track of the circuit board than the mounting side. In other words, the wedge tapers towards the conductor track of the circuit board in the mounted state.

Particularly advantageously, designing the free end as at least one wedge results in a larger contact surface and thus a reduced contact resistance. Creating an undercut and thus creating a positive connection between the wedge and the electrically conductive connecting material, in particular solder, is also advantageous and leads to a secure fixation of the SMD component on the circuit board.

In one embodiment, the free end of the at least one contact is designed as at least one projection. Designed as a projection means that a cuboid-shaped element is provided at least as part of the free end, which has a lower height perpendicular to the mounting side than a remaining part of the at least one contact from which the projection extends. The height of the projection can be the same, almost the same, or only slightly smaller in sections than the height of the remaining part of the at least one contact from which the projection extends. Preferably, however, the height of the projection is at least in sections significantly lower than the height of the remaining part of the at least one contact from which the projection extends. For example, the height of the projection is only half as high to one sixth as high as the height of the remaining part of the at least one contact from which the projection extends.

A large difference in height between the projection and the remaining part of the at least one contact from which the projection extends, perpendicular to the mounting side, advantageously results in a flat projection. The flat projection can thus be better covered by a conductive connecting material. This leads to a secure fixation of the SMD component on the circuit board and an advantageous electrical contacting of the SMD component.

Designed as a step means that both regular steps, i.e. steps with the same step height and the same step depth, and irregular steps, i.e. steps with different step heights and different step depths, can be provided. The steps are preferably designed regularly at least within a production-dependent tolerance range. Preferably, at least one step has a lower height than the remaining part of the at least one contact from which the at least one step extends.

A particularly advantageous feature is that the free end is designed as a step, which increases the contact area between the electrically conductive connecting material and the contact area of the contact. This results in a contact resistance that decreases as the contact area increases. The design of the free end as a step also leads to a secure fixation of the SMD component on the circuit board.

In a further development of the invention, it is provided that the SMD component has a ceramic substrate as an insulating base, on and/or in which the electronic component is arranged and that the at least one contact is formed as part of the ceramic substrate.

In one embodiment, the SMD component has the ceramic substrate and the electronic component, which can be arranged on or in the ceramic substrate. The electronic component can thus also be surrounded by the ceramic substrate, at least in sections. In one embodiment, the electronic component is designed as a coil or a capacitor and embedded in the ceramic substrate. Any electrically non-conductive material that is suitable for being brought into a desired shape and serving as a carrier material for the electronic component can be provided as the ceramic substrate. Ceramic materials are preferably provided as the ceramic substrate. Ceramic materials or technical ceramics include any inorganic, non-metallic and polycrystalline materials. The ceramic materials can be brought into desired shapes and have electrically insulating properties. By shaping the ceramic substrate as desired, a wide variety of basic shapes can be realized, for example, such as a shape of at least one wedge, a shape of at least one projection, a crenellated shape or a shape of at least one step, especially in the end region of the at least one contact.

In a further development of the invention, it is provided that the metallic contact surface is formed at least in sections as a coating of the ceramic substrate.

In a preferred embodiment, the ceramic substrate is coated at least in sections in the form of a metallic contact surface for electrically contacting the conductor track of the circuit board, so that the ceramic substrate forms the at least one contact in metallized form and in the area of the metallic contact surface. Metallized means that the electrically non-conductive ceramic substrate has a metallic, electrically conductive and heat-resistant coating or is provided with at least one metallic coating. It is preferably provided that the ceramic substrate is metallized in such a way that the electronic component is contacted by conductor tracks of the ceramic substrate and the free end of the at least one contact from the ceramic substrate is formed by the metallic contact surface. Preferably, at least two contacts are provided which are made from the electrically non-conductive ceramic substrate and metallized in order to enable an electrically conductive connection of the at least one contact to the at least one conductor track of the circuit board for electrical contacting.

In a further development of the invention, it is provided that the SMD component has a connection frame on which the electronic component is arranged and that the at least one contact is formed as part of the connection frame.

In a further development of the invention, it is provided that the connection frame is electrically conductive.

In one embodiment, the SMD component has the connection frame, also called a lead frame, and the electronic component on or at the connection frame. Any electrically conductive materials or electrically conductive coated materials that are suitable for being shaped into a desired form and serving as a carrier material for an electronic component can be provided as the connection frame. Metallic materials, for example copper, are preferably provided for the connection frame. The metallic materials are electrically conductive. By giving the connection frame the desired shape, a wide variety of basic shapes, such as a shape of at least one wedge, a shape of at least one projection, a crenellated shape or a shape of at least one step, can be realized at the free end, in particular in the end region, of the at least one contact. The desired shape can be achieved, for example, by bending the connection frame or by means of embossing, lasering or another suitable method.

In one embodiment, the at least one wedge, the at least one projection and/or the at least one step extends out of the electrically conductive connection frame at the free end, in particular in the end region, of the at least one contact. The connection frame is made of electrically conductive solid material.

In a further development of the invention, it is provided that the metallic contact surface is formed at least in sections as a coating of the connection frame.

The connection frame is preferably metallized or coated at least in sections for electrically contacting the conductor track of the circuit board, so that the metallized connection frame forms the at least one contact. Metallized means that a carrier material, in particular metallic materials, for example copper, has at least one metallic, electrically conductive and heat-resistant coating. It is provided that the connection frame is metallized in such a way that the electronic component is contacted and the at least one contact is thereby electrically connected to the electronic component. This can be achieved, for example, by means of a so-called bonding wire. Preferably, at least two contacts in the form of at least one wedge, at least one projection and/or at least one step are formed from the connection frame, which extend from the connection frame and are metallized in order to enable an electrically conductive connection of the at least one contact to the at least one conductor track of the circuit board for electrical contact between the SMD component and the circuit board.

In a further development of the invention, it is provided that the SMD component has a housing as an insulating base, wherein the connection frame is at least partially surrounded by the insulating base and the insulating base supports the connection frame.

The housing is preferably made of plastic, but can also be made of other materials. The plastic housing is advantageously manufactured in a manufacturing process in such a way that the connection frame is overmolded at least in sections. The housing thus stabilizes the connection frame. The housing can have an opening on one side so that the electronic component is exposed through this opening and cooling can take place. For example The opening can be arranged on a top side facing away from the circuit board or on one side of the SMD component. The housing can also completely surround the electronic component and thus have no opening for cooling. Furthermore, in an advantageous embodiment, at least a part of the at least one contact, namely the free end of the at least one contact, is led out of the housing in order to be able to electrically contact a conductor track of the circuit board.

In a further development of the invention, it is provided that the at least one wedge has a wedge surface, wherein the wedge surface is flat or curved.

The wedge surface is an inclined surface facing away from the mounting side. The wedge surface forms a wedge angle of less than 90°, in particular less than 60°, in particular less than 35°, with the mounting side. Preferably, the wedge surface forms a wedge angle of at least 2°, in particular 35°, in particular between 2° and 60°, with the mounting side.

If the wedge surface is flat, the wedge angle is constant. If the wedge surface is curved, this means that the wedge surface is bulbous in a direction away from the mounting side or in a direction towards the mounting side.

In a further development of the invention, it is provided that the wedge surface is concavely curved.

Concave means that the wedge surface is bulging in the direction of the mounting side. A concave design of the wedge surface creates a particularly large metallic contact surface. The contact resistance is thereby reduced. Furthermore, the creation of a more pronounced undercut between the at least one wedge, the at least one projection and/or the at least one step and the electrically conductive connecting material, in particular solder, is possible due to the concave design of the wedge surface, compared to the flat wedge surface.

In a further development of the invention, it is provided that a plurality of wedges, projections and/or steps are provided, each of which is arranged with a side facing the conductor track of the circuit board in the assembled state substantially parallel to the mounting side.

In one embodiment, the at least one wedge, the at least one projection and/or the at least one step can extend substantially parallel to the mounting side in any free direction.

In a further development of the invention, it is provided that the plurality of wedges, projections and/or steps are arranged one above the other perpendicular to the mounting side.

In one embodiment, a combination of wedge, projection and/or step can be arranged one above the other. Preferably, several identically designed wedges, projections and/or steps can be provided one above the other perpendicular to the mounting side, along the height of the remaining part of the at least one contact from which the respective wedge, projection and/or step extends. Furthermore, several different contacts can also be provided on the SMD component, which are designed differently as a wedge, projection and/or step. However, the contacts on the SMD component can also be designed identically as a wedge, projection or step.

Multiple wedges, projections and/or steps can improve the contact properties. The metallic contact area between the electrically conductive connecting material and the multiple wedges, projections and/or steps of the contact increases, resulting in a contact resistance that decreases as the metallic contact area increases. In addition, the creation of multiple undercuts between the electrically conductive connecting material and the multiple wedges, projections and/or steps is positive for stable fixation of the SMD component on the circuit board.

• - Aufsetzen zumindest eines Kontakts des SMD-Bauelements auf die zumindest eine Leiterbahn der Leiterplatte;
• - Herstellen der Verbindung des zumindest einen Kontakts mit der Leiterbahn der Leiterplatte, wobei die Verbindung eine stoffschlüssige Verbindung, insbesondere eine Lötverbindung, zwischen einem elektrisch leitfähigen Verbindungsmaterial, dem zumindest einen Kontakt und der zumindest einen Leiterbahn der Leiterplatte ist und wobei das elektrisch leitfähige Verbindungsmaterial das zumindest als ein Keil, zumindest als ein Vorsprung und/oder zumindest als eine Stufe ausgebildete freie Ende des zumindest einen Kontakts zumindest abschnittsweise umgibt und dadurch eine formschlüssige Verbindung ausbildet.

According to the invention, a method for producing a connection of an SMD component to at least one conductor track of a printed circuit board is provided, comprising the steps:

• - placing at least one contact of the SMD component on the at least one conductor track of the circuit board;
• - Establishing the connection of the at least one contact to the conductor track of the circuit board, wherein the connection is a material connection, in particular a soldered connection, between an electrically conductive connecting material, the at least one contact and the at least one conductor track of the circuit board and wherein the electrically conductive connecting material at least partially surrounds the free end of the at least one contact, which is designed at least as a wedge, at least as a projection and/or at least as a step, and thereby forms a positive connection.

The conductor track of the circuit board is intended for connecting electrical components, such as SMD components, on the circuit board and is used for current and voltage supply, for signal transmission and also for temperature dissipation.

In a preferred embodiment, solder is provided as an electrically conductive connecting material. Solder refers to an alloy that consists of a specific mixture of metals depending on the intended use. In this case, the solder can be used to solder suitable metals and alloys by the solder bonding itself as a melt to the surface of the suitable metals and alloys, in particular bonding it with a material bond, and solidifying after cooling. The solder preferably serves as an electrically conductive connecting material for connecting the at least one contact of the SMD component to the conductor track of the circuit board.

A bonded connection is a connection in which the connecting partners are held together by atomic or molecular forces. At the same time, the bonded connection is also a connection that cannot be separated without destruction.

A positive connection is a connection in which at least two connection partners, designed to be complementary to one another, engage one another and thereby prevent or block movement in at least one direction of movement. In particular, the connection partners engage one another and can transfer a force to one another. In a preferred embodiment, the positive connection is formed between the at least one wedge, the at least one projection and/or the at least one step of the at least one contact of the SMD component and the electrically conductive connection material. The positive connection exists in particular in a direction running perpendicular to the mounting side.

Solidification of the solder results in a complementary shape of the solder to the at least one wedge, the at least one projection and/or the at least one step and thus of the electrically conductive connecting material to the at least one wedge, the at least one projection and/or the at least one step. This results in the form-fitting connection.

The material-locking connection is particularly advantageous when it is supplemented by the form-fitting connection, thus enabling the SMD component to be fixed particularly securely to the circuit board. The particularly stable fixation is relevant, for example, to protect against vibrations when the SMD components are used in vehicles or portable devices.

According to the invention, an arrangement is provided with an SMD component, at least one conductor track of a circuit board and a material-locking connection between at least one contact of the SMD component and the conductor track of the circuit board, wherein a metallic contact surface of the at least one contact is arranged at least in sections between the conductor track of the circuit board and a mounting side of an insulating base of the SMD component, wherein a free end of the at least one contact is designed at least as a wedge, at least as a projection and/or at least as a step and that in addition to the material-locking connection between an electrically conductive connecting material and the free end of the contact, a positive connection is also formed at least between the at least one wedge, the at least one projection and/or the at least one step and the electrically conductive connecting material.

The positive connection is advantageous in a direction perpendicular to the mounting side and parallel to the mounting side. Parallel to the mounting side, since two opposing contacts are preferably provided, each of which is surrounded by the electrically conductive connecting material, in particular solder, on a side facing away from the SMD component. This ensures a particularly stable mechanical fixation of the SMD component on the circuit board.

BRIEF DESCRIPTION OF THE DRAWINGS

• 1 eine isometrische Ansicht eines SMD-Bauelements mit einem Keramiksubstrat und zwei Kontakten gemäß einer ersten und einer zweiten Ausführungsform der Erfindung;
• 2 einen ersten Abschnitt einer Seitenansicht des SMD-Bauelements der 1 gemäß der ersten Ausführungsform der Erfindung;
• 3 einen zweiten Abschnitt einer Seitenansicht des SMD-Bauelements der 1 gemäß der zweiten Ausführungsform der Erfindung;
• 4 einen Abschnitt einer Seitenansicht des SMD-Bauelements mit einem Keramiksubstrat gemäß einer dritten Ausführungsform der Erfindung;
• 5 einen Abschnitt einer Seitenansicht des SMD-Bauelements mit einem Keramiksubstrat gemäß einer vierten Ausführungsform der Erfindung;
• 6 eine isometrische Ansicht des SMD-Bauelements mit dem Keramiksubstrat, einer nicht sichtbaren Spule in dem Keramiksubstrat und zwei Kontakten gemäß der zweiten Ausführungsform der Erfindung;
• 7 eine isometrische Ansicht des in 6 dargestellten SMD-Bauelements ohne das Keramiksubstrat;
• 8 eine isometrische Ansicht des SMD-Bauelements mit einem Keramiksubstrat, einem nicht sichtbaren Kondensator in dem Keramiksubstrat und zwei Kontakten gemäß der zweiten Ausführungsform der Erfindung;
• 9 eine isometrische Ansicht des in 8 dargestellten SMD-Bauelements ohne das Keramiksubstrat;
• 10 eine isometrische Ansicht eines SMD-Bauelements mit einem Anschlussrahmen und zwei Kontakten gemäß einer fünften und einer sechsten Ausführungsform der Erfindung;
• 11 eine isometrische Ansicht des in 10 dargestellten SMD-Bauelements ohne ein Gehäuse;
• 12 einen ersten Abschnitt einer Schnittansicht des SMD-Bauelements der 10 gemäß der fünften Ausführungsform der Erfindung;
• 12a einen Ausschnitt einer Schnittansicht eines in der 12 dargestellten Kontakts gemäß der fünften Ausführungsform;
• 13 einen ersten Abschnitt einer Schnittansicht des SMD-Bauelements der 10 gemäß der sechsten Ausführungsform der Erfindung; und
• 13a einen Ausschnitt einer Schnittansicht eines in der 13 dargestellten Kontakts gemäß der der sechsten Ausführungsform.

Further advantages and features of the invention emerge from the claims and from the following description of preferred embodiments of the invention, which are explained with reference to the figures. Individual features shown or described in the drawings can be combined in any way without exceeding the scope of the invention. This also applies to the combination of individual features without further individual features with which they are described in connection. Shown are:

• 1 an isometric view of an SMD component with a ceramic substrate and two contacts according to a first and a second embodiment of the invention;
• 2 a first section of a side view of the SMD component of the 1 according to the first embodiment of the invention;
• 3 a second section of a side view of the SMD component of the 1 according to the second embodiment of the invention;
• 4 a section of a side view of the SMD component with a ceramic substrate according to a third embodiment of the invention;
• 5 a portion of a side view of the SMD component with a ceramic substrate according to a fourth embodiment of the invention;
• 6 an isometric view of the SMD component with the ceramic substrate, a non-visible coil in the ceramic substrate and two contacts according to the second embodiment of the invention;
• 7 an isometric view of the 6 SMD component shown without the ceramic substrate;
• 8 an isometric view of the SMD component with a ceramic substrate, a non-visible capacitor in the ceramic substrate and two contacts according to the second embodiment of the invention;
• 9 an isometric view of the 8 SMD component shown without the ceramic substrate;
• 10 an isometric view of an SMD component with a lead frame and two contacts according to a fifth and a sixth embodiment of the invention;
• 11 an isometric view of the 10 SMD component shown without a housing;
• 12 a first section of a sectional view of the SMD component of the 10 according to the fifth embodiment of the invention;
• 12a a section of a sectional view of a 12 illustrated contact according to the fifth embodiment;
• 13 a first section of a sectional view of the SMD component of the 10 according to the sixth embodiment of the invention; and
• 13a a section of a sectional view of a 13 illustrated contact according to the sixth embodiment.

DETAILED DESCRIPTION OF THE EMBODIMENTS

1 shows an isometric view of an SMD component 1 with an insulating base 3a formed as a ceramic substrate and two contacts 10a and 10b, according to a first and a second embodiment of the invention. 1 further shows an electronic component 2 arranged on the insulating base 3a, a circuit board 4 and an electrically conductive connecting material 5. The insulating base 3a has the contacts 10a and 10b and a metallic contact surface 100, wherein the contacts 10a and 10b are formed from the insulating base 3a and the metallic contact surface 100. The metallic contact surface 100 is produced by coating. The circuit board 4 has at least one conductor track 40. The electrically conductive connecting material 5, in particular a solder, establishes a connection between the conductor track 40 of the circuit board 4 and the metallic contact surface 100 of the insulating base 3a. The metallic contact surface 100 is further designed to contact the electronic component 2.

2 shows a first section of a side view of the SMD component 1 of the 1 with the contact 10a according to the first embodiment of the invention. The 2 The insulating base 3a, not fully shown, has the contact 10a and a mounting side 30 which is parallel to an upper side of the circuit board 4.

A free end E of the contact 10a of the insulating base 3a forms a wedge 101. The wedge 101 has a wedge surface 1010 which is arranged on a side facing away from the mounting side 30. The wedge surface 1010 runs towards the mounting side 30 and tapers. A side of the wedge 101 facing the circuit board 4 runs parallel and flush with the mounting side 30 of the insulating base 3a. The metallic contact surface 100 surrounds the wedge 101.

The electrically conductive connecting material 5 forms a material-locking connection between the metallic contact surface 100 and the conductor track 40 of the circuit board 4. For this purpose, the material-locking connection exists on the one hand between the metallic contact surface 100 and the electrically conductive connecting material 5 and on the other hand between the electrically conductive connecting material 5 and the conductor track 40. The material-locking connection between the metallic contact surface 100 and the electrically conductive connecting material 5 extends completely in an area between the metallic contact surface 100 and the circuit board 4, while the material-locking connection is only formed over a part of the wedge surface 1010 and does not reach an upper side of the insulating base 3a facing away from the mounting side 30. The material-locking connection between the metallic contact surface 100 and the conductor track 40 extends completely in an area, in which the electrically conductive connecting material 5 contacts the conductor track 40.

Furthermore, the electrically conductive connecting material 5 encloses the wedge 101 at least in sections. By enclosing the wedge 101 at least in sections, the electrically conductive connecting material 5 forms a positive connection in addition to the material connection. The positive connection exists at least in a direction perpendicular to the mounting side 30 of the insulating base 3a and enables a particularly stable fixation and large-area electrical contacting of the SMD component 1 on the circuit board 4. The positive connection is according to 2 also formed in a direction parallel to the mounting side 30 of the insulating base 3a, since the contact 10b, as in 1 visible, opposite the contact 10a.

The result is a particularly stable fixation and a large-area contact of the SMD component 1 on the circuit board 4. This is a great advantage for mobile applications in vehicles or portable devices, for example.

3 shows a second section of a side view of the SMD component 1 of the 1 with the contact 10b according to the second embodiment of the invention. The 3 The section shown essentially shows the 2 In the following, reference is made only to the features that are 3 illustrated embodiment from that in 2 illustrated embodiment.

In the second embodiment, the wedge 101 is formed with a concave wedge surface 1012. The concave wedge surface 1012 has in the 3 Due to its curvature, the second embodiment shown has a larger surface area than the wedge surface in the 2 illustrated first embodiment. The larger wedge surface 1012 means that the material connection and the positive connection of the contact 10b and the conductor track 40 by the electrically conductive connecting material 5, in particular the solder, enable an even more stable fixation and an even better electrical contact with lower contact resistance.

The electrically conductive connecting material 5 encloses the wedge 101 in the region of the concave wedge surface 1012 in a larger area than in the first embodiment of 2 and forms an undercut. The result is a particularly stable fixation of the SMD component 1 on the circuit board 4 with lower contact resistance.

4 shows a section of a side view of the SMD component 1 with the insulating base 3a and at least one contact 10c according to a third embodiment of the invention. The 4 The section shown essentially shows the 2 and 3 The following refers only to the features that are 4 illustrated embodiment of the 2 and 3 illustrated embodiments.

In the third embodiment, the free end E of the contact 10c is designed as a cuboid-shaped projection 102. The projection 102 has a height perpendicular to the mounting side 30 which corresponds to approximately one fifth of a height of the remaining part of the insulating base 3a perpendicular to the mounting side 30. The projection 102 is expediently lower in height than the remaining part of the insulating base 3a but is nevertheless designed to be stable.

The electrically conductive connecting material 5 completely encloses the projection 102 and even more pronouncedly than in the first and second embodiments of 2 and 3 , since the undercut of the electrically conductive connecting material 5 to the projection 102 is even stronger. The result is a particularly stable fixation of the SMD component 1 on the circuit board 4 with low contact resistance.

5 shows a section of a side view of the SMD component 1 with the insulating base 3a and at least one contact 10d according to a fourth embodiment of the invention. The 5 The section shown essentially shows the 2 , 3 and 4 The following refers only to the features that are 5 illustrated embodiment from that in 2 , 3 and 4 illustrated embodiments.

In the fourth embodiment, a plurality of projections 102a, 102b and 102c are shown, which are arranged one above the other along the direction perpendicular to the mounting side 30 and parallel to the mounting side 30. In other words, a plurality of projections 102a, 102b and 102c are shown based on the third embodiment. 4 already described projections 102a, 102b and 102c are provided. The plurality of projections 102a, 102b and 102c extend parallel to the mounting side 30 from the insulating base 3a. The plurality of projections 102a, 102b and 102c, a total of three projections, are each cuboid-shaped with the same dimensions. The first projection 102a is flush and aligned with the mounting side 30. side 30, while the third projection 102c is aligned flush and aligned with the upper side of the insulating base 3a facing away from the mounting side 30. The second projection 102b is arranged centrally between the projections 102a and 102c along the height of the insulating base 3a. The plurality of projections 102a, 102b and 102c are thus arranged evenly spaced from one another in the direction perpendicular to the mounting side 30.

The electrically conductive connecting material 5, in particular the solder, completely encloses the projections 102a and 102b and thereby fixes the SMD component 1 even more stably than in the first, second and third embodiments of 2 , 3 and 4 on the circuit board 4. Although the projection 102c is not positively connected to the electrically conductive connecting material 5, the material-locking connection between the electrically conductive connecting material 5 and the metallic contact surface 100 is pronounced on an underside of the projection 102c.

The advantages of the projection 102 of the third embodiment of 4 by creating the undercut between the electrically conductive connecting material 5 and the projection 102, in the fourth embodiment the undercuts have been reinforced by arranging the multiple projections 102a, 102b and 102c and thus creating multiple projections with multiple undercuts. The result is a particularly stable fixation of the SMD component 1 on the circuit board 4 with a particularly large metallic contact surface 100 and a particularly low contact resistance.

6 shows an isometric view of the SMD component 1 with an insulating base 3b designed as a ceramic substrate, a non-visible coil 20a as an electronic component 2 in the insulating base 3b, see 7 , and two contacts 10b according to the second embodiment of the invention. The 6 The section shown essentially shows the 1 to 5 In the following, reference is made only to the features that make the embodiment of the 6 from the embodiments of the 1 to 5 differentiate.

7 shows an isometric view of the 6 SMD component 1 shown without the insulating base 3b designed as a ceramic substrate, wherein the insulating base 3b in 7 is hidden. The coil 20a as electronic component 2 is visible here and is provided with a first coil contact 202a and a second coil contact 204a, which are each connected to one of the two contacts 10b. In one embodiment, the coil contacts 202a and 204a and the contacts 10b can also be formed in one piece.

8 shows an isometric view of the SMD component 1 with the insulating base 3b designed as a ceramic substrate, a non-visible capacitor 22 as an electronic component 2 in the insulating base 3b, see 9 and a contact 10a and 10b, as already described with reference to the first and second embodiments of the invention. The 8 The section shown essentially shows the 1 to 7 The characteristics shown are different from the 6 and 7 Instead of the coil 20a, the invisible capacitor 22 is provided as electronic component 2, see 9 .

9 shows an isometric view of the 8 SMD component 1 shown without the insulating base 3b designed as a ceramic substrate, wherein the insulating base 3b in 9 The capacitor 22 as electronic component 2 is visible here and with at least one first capacitor contact 222, whereby as in 9 several capacitor contacts 222 can be provided, and with a second capacitor contact 224, wherein as in 9 several capacitor contacts 224 can also be provided. The capacitor contacts 222 and 224 are each connected to one of the contacts 10a and 10b. In one embodiment, the capacitor contacts 222 and 224 and the contacts 10a and 10b can also be formed in one piece.

10 shows an isometric view of an SMD component 1 with two contacts 10e and 10f, according to the fifth and sixth embodiments of the invention. 10 shows a connection frame 6, the arranged on the connection frame 6 and in 10 not visible, designed as a coil 20b, electronic component 2 and an insulating base 3c in the form of a housing. The circuit board 4 and the electrically conductive connecting material 5 are also shown. The connection frame 6 has the contacts 10e and 10f, wherein the contacts 10e and 10f are formed by means of the connection frame 6 and are connected to the insulating base 3c. The insulating base 3c supports the connection frame 6 and surrounds the electronic component 2 designed as a coil 20b. The electronic component 2 is protected from external influences by the insulating base 3c. The circuit board 4 has at least one conductor track 40. The electrically conductive connecting material 5, in particular solder, then creates a material-locking and positive connection between the conductor track 40 of the circuit board 4 and the contacts 10e and 10f of the connection frame 6. The connection frame 6 is further designed to to contact the electronic component 2 designed as coil 20b.

11 shows an isometric view of the 10 SMD component 1 shown without the housing in the form of the insulating base 3c, which in 11 is hidden. The 11 essentially shows the 10 The following refers only to the features described in 10 are not recognizable.

The connection frame 6 is designed to contact the electronic component 2 and thus the coil 20b. This is done by directly contacting the electronic component 2 through the connection frame 6. For this purpose, the coil 20b has a first coil contact 202b and a second coil contact 204b in the form of its winding ends, which are directly connected to the connection frame 6 in an electrically conductive manner. In one embodiment, the coil contacts 202b and 204b and the connection frame 6 can also be formed in one piece.

12 shows a first section of a sectional view of the SMD component of the 10 and 11 according to the fifth embodiment of the invention. The 7 The section shown essentially shows the 10 and 11 The following will therefore only refer to the characteristics shown 10 and 11 unrecognizable features are addressed.

Furthermore, the 12a which shows a section of a sectional view of a 12 illustrated contact according to the fifth embodiment.

A formation of a free end E of the contact 10e is in 12 and 12a by the electrically conductive connection frame 6. The connection frame 6 is shaped or, in other words, bent in such a way that it forms the contact 10e with its projection 102 and also surrounds and penetrates the insulating base 3c in the form of the housing at least in sections. The connection frame 6 is bent in such a way that the projection 102 is arranged in sections parallel and essentially flush with the mounting side 30. The bent connection frame 6 thus forms the projection 102 at the free end E of the contact 10e. In the fifth embodiment, the projection 102 is designed as a projection with a U-shaped cross section. The projection 102 has a height perpendicular to the mounting side 30 that is approximately between one twentieth and one thirtieth of a total height of the connection frame 6 perpendicular to the mounting side 30. The projection 102 is expediently lower in height than the connection frame 6 but is nevertheless designed to be stable.

The electrically conductive connecting material 5 completely surrounds the projection 102 on its outside and still rests against the vertical section of the connection frame 6. The electrically conductive connecting material 5 surrounds the projection 102 even more pronouncedly than in the first and second embodiments of 1 , 2 and 3 , since the undercut of the electrically conductive connecting material 5 to the projection 102 is very strong. The result is a particularly stable fixation of the SMD component 1 on the circuit board 4 with low contact resistance.

13 shows a first section of a sectional view of the SMD component 1 of the 10 and 11 according to the sixth embodiment of the invention. The 13 The section shown essentially shows the 10 and 11 The following will therefore only refer to the characteristics shown 10 , 11 and 12 unrecognizable features are discussed. Furthermore, the 13a which shows a section of a sectional view of a 13 illustrated contact according to the sixth embodiment.

In the sixth embodiment, the free end E of the contact 10f is designed in the form of a plurality of projections 102a, 102b and 102c, wherein the plurality of projections 102a, 102b and 102c are arranged one above the other and parallel to the mounting side 30 along the direction perpendicular to the mounting side 30. The plurality of projections 102a, 102b and 102c extend parallel to the mounting side 30 from the connection frame 6. The plurality of projections 102a and 102b, a total of two projections, are each cuboid-shaped with the same dimensions, while the projection 102c has a greater height perpendicular to the mounting side 30. The projection 102a is aligned with its underside facing the circuit board 4 essentially flush and essentially aligned with the mounting side 30. The plurality of projections 102a, 102b and 102c are formed from the connection frame 6 at equal distances from one another in the height direction. The projections 102a, 102b and 102c can be formed, for example, by embossing, lasering or other suitable methods.

The electrically conductive connecting material 5, in particular the solder, completely encloses the projections 102a and 102b and thereby fixes the SMD component 1 in a materially and form-fitting manner on the circuit board 4. The projection 102c, on the other hand, is not surrounded by the electrically conductive connecting material 5. connecting material 5. The projection 102c is thus only firmly connected to the connecting material 5, since it is not completely enclosed by the connecting material 5.

The advantages of the cuboid-shaped projection 102 of the embodiment of 4 by creating the undercut between the electrically conductive connecting material 5 and the projection 102, have been reinforced in the sixth embodiment by arranging the multiple projections 102a, 102b and 102c and thus creating multiple undercuts. The result is a particularly stable fixation of the SMD component 1 on the circuit board 4 with a particularly large metallic contact surface 100 and particularly low contact resistance.

Claims (12)

Arrangement with an SMD component (1) with: - at least one electronic component (2), - at least one insulating base (3a; 3b; 3c), wherein: - the SMD component (1) has at least one contact (10a to 10f), - the at least one contact (10a to 10f) has a metallic contact surface (100) for electrically contacting at least one conductor track (40) of a circuit board (4), - the at least one insulating base (3a; 3b; 3c) has a mounting side (30) which faces the circuit board (4) in the mounted state of the SMD component (1), - the metallic contact surface (100) of the at least one contact (10a to 10f) in the mounted state of the SMD component (1) is arranged at least in sections between the conductor track (40) of the circuit board (4) and the mounting side (30) of the insulating base (3a; 3b; 3c) wherein the at least one contact (10a to 10f) is designed at a free end (E) as at least one wedge (101), at least one projection (102) and/or at least one step, wherein a side of the at least one wedge (101), the at least one projection (102) and/or the at least one step facing the conductor track (40) of the circuit board (4) in the assembled state is arranged parallel and flush with the mounting side (30) or parallel and closer to the conductor track (40) of the circuit board (4) than the mounting side (30), with a material connection between the at least one contact (10a to 10f) of the SMD component (1) and the conductor track (40) of the circuit board (4), wherein a metallic contact surface (100) of the at least one contact (10a to 10f) is at least partially arranged between the conductor track (40) of the circuit board (4) and the mounting side (30) of the insulating base (3a; 3b; 3c) of the SMD component (1), characterized in that in addition to the material connection between an electrically conductive connecting material (5) and the free end (E) of the at least one contact (10a to 10f), a positive connection is also formed at least between the at least one wedge (101), the at least one projection (102) and/or the at least one step and the electrically conductive connecting material (5). arrangement according to claim 1 , characterized in that the SMD component (1) has a ceramic substrate as the insulating base (3a; 3b), on and/or in which the electronic component (2) is arranged and that the at least one contact (10a to 10d) is formed as part of the ceramic substrate. arrangement according to claim 2 , characterized in that the metallic contact surface (100) is formed at least in sections as a coating of the ceramic substrate. arrangement according to claim 1 , characterized in that the SMD component (1) has a connection frame (6) on which the electronic component (2) is arranged and that the at least one contact (10e, 10f) is formed as part of the connection frame (6). arrangement according to claim 4 , characterized in that the connection frame (6) is electrically conductive. arrangement according to claim 4 or 5 , characterized in that the metallic contact surface (100) is formed at least in sections as a coating of the connection frame (6). arrangement according to claim 4 , 5 or 6 , characterized in that the SMD component (1) has a housing as the insulating base (3b), wherein the connection frame (6) is at least partially surrounded by the insulating base (3b) and the insulating base (3b) supports the connection frame (6). Arrangement according to at least one of the preceding claims, characterized in that the at least one wedge (101) has a wedge surface (1010; 1012), wherein the wedge surface (1010; 1012) is flat or curved. arrangement according to claim 8 , characterized in that the wedge surface (1012) is concavely curved. Arrangement according to at least one of the preceding claims, characterized in that a plurality of wedges (101), projections (102a, 102b, 102c, 102d, 102e, 102f) and/or steps are provided, each of which is arranged parallel to the mounting side (30) with a side facing the conductor track (40) of the circuit board (4) in the mounted state. arrangement according to claim 10 , characterized in that the plurality of wedges (101), projections (102a, 102b, 102c, 102d, 102e, 102f) and/or steps are arranged one above the other perpendicular to the mounting side (30). Method for producing a connection of an SMD component (1) with at least one conductor track (40) of a printed circuit board (4) and an arrangement according to at least one of the Claims 1 until 11 with the steps: - placing the at least one contact (10a to 10f) of the SMD component (1) on the at least one conductor track (40) of the circuit board (4); - establishing the connection of the at least one contact (10a to 10f) to the conductor track (40) of the circuit board (4), wherein the connection is a material connection, in particular a soldered connection, between the electrically conductive connecting material (5), the at least one contact (10a to 10f) and the at least one conductor track (40) of the circuit board (4), and wherein the electrically conductive connecting material (5) at least partially surrounds the free end (E) of the at least one contact (10a to 10f), which is designed at least as the wedge (101), at least as the projection (102) and/or at least as the step, and thereby forms a positive connection.

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