DE102017117051B4 - Organic light-emitting component and light-emitting device - Google Patents

Abstract

Organic light-emitting device (100) with:
- an active area (200) and a peripheral area (201) surrounding the active area (200) in a lateral direction,
- a transparent substrate (101) with a first main surface (1011) and a second main surface (1012),
where
- in the active area (200) on the first main surface (1011) a transparent first electrode (102), an organic functional layer stack (103) and a second electrode (104) are applied,
- in the edge region (201) on the first main surface (1011) of the substrate (101) a metallization layer (105) is applied, which completely and without interruption surrounds the active region (200) in the lateral direction and which is electrically insulated from all layers in the active region (200),
- in the edge area (201) on the metallization layer (105) in a connection area an electrically insulating layer (107) is arranged, and
- on the electrically insulating layer (107) in the connection area at least one connection contact (108) is arranged which electrically contacts at least one of the first and second electrodes (102, 104).

Description

An organic light-emitting component and a light-emitting device are specified.

The printed matter DE 10 2011 110 159 A1 is directed towards a method for the internal treatment of a hollow body with a liquid.

The printed matter WO 2016 / 188 924 A1 This concerns a process for manufacturing an organic light-emitting diode.

The printed matter WO 2015 / 183 561 A1 This concerns the reduction of electrostatic discharges in display devices.

The printed matter DE 10 2012 109 218 A1 teaches a method for manufacturing an optoelectronic assembly and an optoelectronic assembly.

The aesthetics of organic light-emitting diodes (OLEDs), even when switched off, are highly valued in lighting and automotive applications, for example. However, OLEDs are typically connected using separate metal contacts arranged side-by-side directly on the OLED substrate. These contacts connect the OLED electrodes and, during operation, expose them to different electrical potentials. The gaps between the metal contacts are visible from the viewing side—the side from which light is emitted during operation—and detract from the design. Furthermore, the shapes of the metal contacts and the gaps, as well as the linear arrangement of the metal contacts, are dictated by parameters of the connection and the contacting technology used for the electrical connection. Such parameters can include, for example, the shape of the flexible PCB (flex PCB) serving as the electrical connection, the shape of the bonding thermomode used to connect the flex PCB to the OLED contacts, the required contact pad size, and alignment marks.

Furthermore, adjustments to the OLED's outer edge often need to be made to accommodate the contacts. For example, even with a round OLED design and standard contact methods, a straight outer edge is necessary in the contact area. Typically, areas of an OLED that don't fit the design are covered or masked. However, this prevents a completely exposed outer edge of the OLED and limits design freedom.

At least one objective of certain embodiments is to specify an organic light-emitting component. At least another objective of certain embodiments is to specify a light-emitting device with an organic light-emitting component.

These problems are solved by the objects according to the independent claims. Advantageous embodiments and further developments of the objects are characterized in the dependent claims and are further described in the following description and drawings.

According to at least one embodiment, an organic light-emitting component comprises a transparent substrate. The substrate can have a first main surface, a second main surface, and at least one or more side surfaces connecting the first and second main surfaces. The main surfaces are particularly preferably parallel to each other. In particular, the substrate can be plate-shaped, with the two main surfaces having extensions greater than the distance between the first and second main surfaces. The distance between the main surfaces can also be referred to as the thickness of the substrate. If the substrate thickness is sufficiently small, it can also be formed as a film. Directions parallel to the first main surface are referred to here and in the following as the lateral direction. A direction perpendicular to the first main surface is referred to here and in the following as the vertical direction.

According to a further embodiment, at least one transparent first electrode, an organic functional layer stack, and at least one second electrode are applied to the first main surface of the transparent substrate. The fact that a first layer is applied "on" or "over" a second layer can, here and in the following, particularly mean that the first and second layers are arranged vertically one above the other and that the first layer is further away from the substrate than the second layer, i.e., that the second layer is arranged between the substrate and the first layer. In particular, the transparent first electrode can be arranged between the substrate and the organic functional layer stack, while the organic functional layer stack can be arranged between the first electrode and the second electrode.

The organic functional layer stack can contain at least one organic light-emitting layer. The organic light-emitting device (OLED) has a layer designed and configured to generate light during operation. The light can be emitted at least through the substrate, such that the second main surface of the substrate, facing away from the organic functional layer stack, forms a light-emitting surface for the OLED, through which light generated in the organic functional layer stack during operation is emitted. If the second main surface of the OLED is free of further layers or materials, the second main surface can, in particular, serve as the light-emitting surface. Specifically, the OLED can be configured as an organic light-emitting diode (OLED) that, during operation, can emit visible light through at least the transparent first electrode and the transparent substrate.

The term "transparent" here and in the following refers to a layer that is permeable to at least visible light. The transparent layer can be clearly translucent or at least partially light-scattering and/or partially light-absorbing, so that a layer described as transparent can, for example, also be diffusely or milkily translucent. Particularly preferably, a layer described here as transparent is designed to be as permeable to visible light as possible, such that the absorption of light generated in the organically light-emitting component is minimized.

According to a further embodiment, the organic light-emitting device has an active region and a peripheral region surrounding the active region laterally. In other words, when viewed vertically from above, the active region is completely enclosed by the peripheral region. The first electrode, the second electrode, and the organic functional layer stack are deposited on the substrate in the active region, so that the organic light-emitting device can generate light in the active region by means of the first and second electrodes and the organic functional layer stack during operation. This light can then be emitted directly from the active region through the light-emitting surface. In contrast, the device cannot generate light in the peripheral region during operation. Preferably, the peripheral region can be free of the organic functional layer stack, so that in this case no organic material is present in the peripheral region for light generation. Alternatively, at least a part of the organic functional layer stack may be present in at least a sub-area of the boundary region, but in this case, this part is electrically isolated from at least one of the electrodes, i.e., from the first or the second electrode or from both electrodes, so that no electrical excitation of organic material in the boundary region is possible during operation of the device.

The fact that the organic light-emitting device has an active region containing the first and second electrodes and the organic functional layer stack can also mean that at least one further first electrode is laterally adjacent to the at least one first electrode and/or at least one further second electrode is adjacent to the at least one second electrode in the active region. Multiple first and/or second electrodes can form several luminescent regions within the active region, which can be operated independently of one another.

The second electrode can be transparent, like the first electrode. However, it is also preferably possible for the second electrode to be non-transparent. In the latter case, the second electrode can preferably be reflective, so that light generated during operation in the organic functional layer stack and emitted towards the second electrode can be reflected towards the transparent first electrodes, allowing it to exit the organic light-emitting device through them and the substrate.

According to a further embodiment, a metallization layer is applied to the edge region of the first main surface of the substrate. The metallization layer can particularly preferably surround the active area laterally. More preferably, the metallization layer can completely and uninterruptedly surround the active area. When viewed vertically from the first or second main surface of the substrate, the metallization layer in this case forms a frame completely surrounding the active area. Since the substrate is transparent, the metallization layer can be seen through the substrate when viewed from the light-emitting surface. In particular, a frame preferably formed by the metallization layer and completely surrounding the active area can be seen when viewed from the light-emitting surface. The frame can particularly preferably have a uniform width and be unstructured.

The metallization layer can consist of one or more metals. It can also be a stack of layers with multiple layers, either composed of or consisting of, under The metallization layer can be composed of various metals. In particular, the metallization layer can be thick enough to be opaque, forming a non-transparent frame around the active area. This allows the metallization layer to obscure layers behind it. The metallization layer can, for example, consist of one or more materials selected from Al, Ag, Cr, and Mo. It can also be a stack of layers containing multiple materials, such as Mo/Al/Mo, Cr/Al, Cr/Al/Cr, or Cr/Ag/Cr.

The metallization layer can be electrically insulated from at least one or both of the first and second electrodes. Furthermore, the metallization layer can be electrically insulated from all electrodes in the active region or from all layers in the active region. In the latter case, a separating zone, which is electrically insulating, can exist laterally between the active region and the metallization layer at the edge of the substrate on the first main surface. Simply put, this separating zone can form the boundary between the active region and the edge of the substrate. For example, the separating zone can be formed by a region of the substrate on which no material is directly applied, or which is partially or completely covered with electrically insulating material. Considering the preferred configuration of the metallization layer as a frame completely surrounding the active region laterally, the separating zone can also completely surround the active region laterally and, in turn, be completely surrounded laterally by the metallization layer.

According to a further embodiment, an electrically insulating layer is arranged in a connection area on the metallization layer at the edge of the substrate. At least one connection contact is arranged on the electrically insulating layer in this connection area, electrically contacting at least one of the first and second electrodes. For this purpose, the connection contact can project from the edge into the active area. Alternatively, the electrode contacted by the connection contact can project from the active area into the edge. In the connection area, the at least one connection contact can be designed and configured as a contact pad, for example, for a connection by soldering, bonding, or gluing. The electrode electrically contacted by this connection contact can be connected to an external energy source, such as a power and/or voltage supply. In particular, several connection contacts can also be arranged in the connection area, and thus in the edge region, on the electrically insulating layer. The multiple connection contacts allow several electrodes, for example, at least one first electrode and at least one second electrode, and/or several first electrodes and/or several second electrodes, to be electrically contacted in the active area, so that the multiple electrodes can be connected to an external power source via the connection contacts. Each connection contact of the organic light-emitting device can have the features described above and below for at least one or for several connection contacts.

For example, at least one terminal contact can electrically contact the second electrode. The second electrode and the at least one terminal contact can be made of the same material. This can mean, in particular, that the second electrode and the at least one terminal contact are identical in terms of material. If there are multiple terminal contacts in the connection area, one, several, or all of the terminal contacts of the component can be made of the same material as the second electrode. Furthermore, the second electrode and the at least one terminal contact can be formed as a single unit. Alternatively, the at least one terminal contact can be made of a different material than the electrodes in the active area. For example, the metallization layer and the at least one terminal contact can be made of the same material. This can also mean, in particular, that the at least one terminal contact and the metallization layer are identical in terms of material. If there are multiple terminal contacts on the electrically insulating layer in the connection area, one, several, or all of these terminal contacts of the component can be made of the same material as the metallization layer.

Furthermore, in addition to the connection contact that electrically connects the second electrode, another connection contact can be arranged on the electrically insulating layer in the connection area, as described above, which electrically connects the at least one first electrode. The connection contacts for connecting the first and second electrodes can, in particular, be identical and arranged laterally next to each other in the same plane. For example, if at least one further transparent first electrode is arranged laterally adjacent to the at least one transparent first electrode in the active area, These are electrically contacted by means of another connection contact on the electrically insulating layer in the connection area.

Furthermore, it is also possible that the at least one first electrode can be electrically contacted via the metallization layer. This can mean that a portion of the metallization layer in the connection area is free of the electrically insulating layer, and that a portion of the metallization layer forms a connection contact from which electrically conductive material extends to and contacts the at least one first electrode. In this case, the separation zone described above is preferably interrupted only at the point where the electrically conductive material extends from the metallization layer to the at least one first electrode. The electrically conductive material can be the same material as that from which the first electrode and/or the metallization layer is formed.

The connection area of the organic light-emitting component is preferably designed to meet the requirements associated with contacting this area. In particular, it must be ensured that the connection area can withstand the stresses that the contacting process can exert on the component, and especially on the connection area itself. For example, if soldering or thermal bonding is used to connect an electrical connection element to the at least one terminal contact, it must be ensured that the connection area, and especially the electrically insulating layer, can withstand the resulting temperatures and, if applicable, the pressure used. By arranging the connection area at the edge and thus outside the active area, it can be ensured that the organic material located in the active area is not damaged by the conditions used during contacting processes such as bonding or soldering, such as temperature and pressure.

The electrically insulating layer can consist of one or more organic and/or inorganic materials. For example, the electrically insulating layer can consist of a resist, such as a photoresist, which can be applied using wet chemical processes, such as dispensing, spray coating, or stencil printing. Suitable materials for this purpose include one or more resins. For example, the electrically insulating layer can consist of a material selected from polyimide, acrylate, and silicone. Furthermore, the electrically insulating layer can consist of an inorganic material applied using a PVD process (physical vapor deposition). For example, the electrically insulating layer can consist of one or more oxides, such as aluminum oxide ( _Al₂O₃ ), titanium dioxide ( _TiO₂ ), silicon dioxide ( _SiO₂ ) _, and tantalum _pentoxide ( _Ta₂O₅ ). It can be advantageous to apply the electrically insulating layer in the terminal area to the metallization layer before applying the material of the organic functional layer stack in the active area, particularly if temperatures are used during the application of the electrically insulating layer that could damage the organic material in the active area. Furthermore, the electrically insulating layer can be limited to the terminal area. In other words, the metallization layer can be free of the electrically insulating layer except at the terminal area.

As described above, the material for at least one terminal contact can be, for example, a material that is also used in the second electrode or that forms the second electrode itself, such as a metal like aluminum. If the material of the second electrode is less suitable for contacting the at least one terminal contact to a connection element, for example by bonding or soldering, another material can be used additionally or alternatively, as described above. This could be one or more of the materials mentioned in connection with the metallization layer, or a layer stack such as Cr/Al/Cr. The material of the at least one terminal contact can be applied, for example, using a PVD process, such as vapor deposition. Alternatively or additionally, a conductive paste such as silver or copper paste can be applied as the material for the at least one terminal contact. Wet chemical processes such as dispensing, spray coating, or stencil printing are suitable for this purpose.

According to a further embodiment, a transparent, electrically conductive layer is arranged in the edge region on the first main surface of the substrate. The transparent, electrically conductive layer can particularly preferably be applied directly to the substrate. The metallization layer can be arranged on the transparent, electrically conductive layer, particularly preferably directly on it. Furthermore, the transparent, electrically conductive layer and the metallization layer can be viewed from above. The component must be congruent in the vertical direction and also have the same shape. The transparent, electrically conductive layer can be made of the same material as the at least one first electrode. Particularly preferably, the at least one first electrode and the transparent, electrically conductive layer can be identical with respect to material.

According to a further embodiment, an insulating layer is arranged in the active area, which electrically isolates a region of the at least one first electrode and a region of the at least one second electrode from each other. The insulating layer can, in particular, comprise the same material as the electrically insulating layer in the connection area.

According to a further embodiment, a metallic material is arranged in the active area on at least a portion of the first electrode. The metallic material, which may preferably be arranged directly on the first electrode, may, for example, form a current distribution structure, such as conductor tracks, so-called busbars, and/or a frame. The metallic material and the metallization layer may be of the same material. It is particularly preferred that the metallization layer and the metallic material on the first electrode be identical with respect to the material.

According to a further embodiment, an encapsulation is applied over the first and second electrodes and the organic functional layer stack. The encapsulation can cover the active region. Furthermore, the encapsulation can also cover at least part of the edge region. In this case, the encapsulation can extend laterally beyond the active region, so that it can encapsulate the organic functional layer stack from the side, i.e., from a lateral direction. The encapsulation can particularly preferably be a so-called thin-film encapsulation or be formed by one comprising at least one or more thin layers applied to the electrodes and the organic functional layer stack by a deposition process, preferably by a chemical vapor deposition process and/or an atomic layer deposition process. Furthermore, the encapsulation can additionally or alternatively have a lid, for example in the form of a metal or glass lid, which covers the layers in the active region.

According to at least one further embodiment, a light-emitting device comprises an organic light-emitting component. Furthermore, the light-emitting device may have a holder for mechanically securing the organic light-emitting component. In addition, the light-emitting device may have an electrical connection element for electrically connecting the electrical connection area of the organic light-emitting component to an external energy source. The electrical connection element may, in particular, be connected to at least one terminal contact of the component, or to several or all terminal contacts of the component. This can be a mechanical and/or an electrically conductive connection, which is made, for example, by soldering or thermal bonding. The electrical connection element may, in particular, be flexible and have or have one or more electrical leads, for example, in the form of leads. For example, the electrical connection element may be a flexible PCB.

In the component described here, at least one connection contact is located in the connection area on the electrically insulating layer, which in turn is located on the metallization layer. The at least one connection contact is thus situated in a plane that, viewed from the substrate, lies above the metallization layer and is therefore vertically spaced from the first main surface of the substrate. When viewing the organic light-emitting component from the side of the light-extraction surface, the electrically insulating layer and the at least one connection contact can be concealed by the metallization layer, so that the external appearance of the component when viewed from the light-extraction surface is independent of the design of the component's connection area. From the light-extraction surface, and thus from the usual viewing side, the connection area with the electrically insulating layer and the at least one connection contact is positioned to the rear, so that the front metallization formed by the metallization layer can be designed arbitrarily, in particular as a continuous frame, and is independent of contact-related requirements. This also means that the outer edge of the organic light-emitting device does not need to be adapted to the contacting technology, and that an electrical connection element, which is connected to the contact area for electrical contacting the device, does not need to protrude beyond the outer edge, but can be positioned completely behind the device from the viewing side. This avoids the optically noticeable comb structure necessary in conventional OLEDs when viewed from the side of the light-emitting surface. The rear-mounted electrode can also be omitted, since it is no longer necessary to connect from the rear electrode in a rear plane to the front metallization in the front plane.

Further advantages, advantageous embodiments and further developments result from the exemplary embodiments and examples described below in conjunction with the figures.

• 1A bis 1D schematische Darstellungen eines organischen Licht emittierenden Bauelements gemäß einem Ausführungsbeispiel,
• 2A bis 2C schematische Darstellungen eines organischen Licht emittierenden Bauelements gemäß einem weiteren Ausführungsbeispiel,
• 3A und 3B schematische Darstellungen eines organischen Licht emittierenden Bauelements gemäß einem Beispiel,
• 4A und 4B schematische Darstellungen eines organischen Licht emittierenden Bauelements gemäß einem weiteren Ausführungsbeispiel, und
• 5 eine schematische Darstellung einer Licht emittierenden Vorrichtung gemäß einem weiteren Ausführungsbeispiel.

They show:

• 1A to 1D Schematic representations of an organic light-emitting component according to an exemplary embodiment,
• 2A to 2C Schematic representations of an organic light-emitting component according to a further embodiment,
• 3A and 3B Schematic representations of an organic light-emitting component according to an example,
• 4A and 4B Schematic representations of an organic light-emitting component according to a further embodiment, and
• 5 a schematic representation of a light-emitting device according to a further embodiment.

In the exemplary embodiments, examples, and figures, identical, similar, or similarly functioning elements may be designated with the same reference numerals. The depicted elements and their relative sizes are not to be considered to scale; rather, individual elements, such as layers, components, building elements, and areas, may be exaggerated for clarity and/or better understanding.

In the 1A to 1D Figure 1 shows an embodiment of an organic light-emitting device 100. The device 100 is specifically designed as an organic light-emitting diode (OLED). 1A A top view of the side of the organic light-emitting component 100 facing away from the light-emitting surface is shown, while in the 1B and 1C Cross-sectional views of the organic light-emitting component 100 along the in 1A The section planes AA and BB are shown. 1D Figure 1 shows a top view of the light-emitting surface of the organic light-emitting device 100, whereby the layers and elements located behind the first electrodes 102 in the view shown are not shown for the sake of clarity. The following description applies equally to the 1A to 1D .

The organic light-emitting component 100 has a substrate 101 on which, as is particularly evident in a review of the 1A to 1C It can be seen that an organic functional layer stack 103 is arranged on a first main surface 1011 between first electrodes 102 and a second electrode 104. The organic functional layer stack 103 has at least one organic light-emitting layer, so that the device 100 can generate and emit light during operation.

The region of the organic light-emitting device 100 in which the organic functional layer stack 103 is formed constitutes an active region 200 of the device 100. The active region 200 is surrounded laterally by a boundary region 201, which, in the illustrated embodiment, is free of the organic functional layer stack 103. Alternatively, it is also possible that organic material of the organic layer stack is arranged at least in a part of the boundary region, but is electrically insulated from at least one of the electrodes 102, 104, so that this organic material has no luminescent function and is not made to emit light during operation of the organic light-emitting device 100.

By way of example, the organic light-emitting device 100 shown has two adjacent, separate first electrodes 102 in the active region 200. This gives the organic light-emitting device 100 two independently operable illumination regions in the active region 200. Alternatively, for example, there may be only a single first electrode 102 or more than two first electrodes 102. Likewise, in addition to the second electrode 104, which in the illustrated embodiment is designed as a common electrode for both illumination regions, one or more separate, independently operable second electrodes may be applied to the organic functional layer stack 103. The following description, which refers to the two first electrodes 102 and the single second electrode 104 shown, therefore applies equally to other electrode configurations.

The first electrodes 102, like the substrate 101, are transparent, so that light generated in the organic functional layer stack 103 during operation of the organic light-emitting device 100 can be emitted through the transparent first electrodes 102 and the substrate 101. On the side facing away from the first main surface 1011, the substrate 101 has a second main surface 1012, which The first main surface 1011, 1012 is designed as the light-emitting surface of the organic light-emitting component 100. Furthermore, the component 100 can have at least one additional layer on its second main surface 1012, the outer surface of which, facing the environment, then forms the light-emitting surface. Depending on the shape of the substrate 101, the first and second main surfaces 1011, 1012 are connected to each other via one or more side surfaces 1013.

The transparent substrate 101 can, for example, be in the form of a glass plate or glass layer. Alternatively, the substrate 101 can also be, for example, a transparent plastic or a glass-plastic laminate. The transparent first electrodes 102 applied to the substrate 101 can particularly preferably be identical and can, for example, each comprise a transparent conductive oxide. Transparent conductive oxides (TCOs) are transparent, conductive materials, generally metal oxides such as zinc oxide, tin oxide, aluminum tin oxide, cadmium oxide, titanium oxide, indium oxide, and indium tin oxide (ITO). Besides binary metal-oxygen compounds, such as ZnO, _{SnO₂ ,} or _{In₂O₃ ,} ternary metal-oxygen compounds, such as _Zn₂SnO₄ , _CdSnO₃ , _ZnSnO₃ , _MgIn₂O₄ , _GaInO₃ , _{Zn₂In₂O₅ ,} or _{In₄Sn₃O₁₂ ,} or mixtures of different transparent conductive oxides, also belong to the group of TCOs. Furthermore _, TCOs do not necessarily have a stoichiometric composition and can also be p- or n-doped. Additionally _, the first electrodes 102 can, for example, also be a transparent metal, i.e. _, a metal with a sufficiently small thickness in the range of a few tens of nanometers or less. Suitable metals are described below in connection with the second electrode 104. Furthermore, metallic network structures or conductive networks, for example with or made of silver, and/or graphene or carbon-containing layers or a combination of the aforementioned transparent materials are also possible.

The second electrode 104 on the organic functional layer stack 103 can be reflective and comprise a metal selected from aluminum, barium, indium, silver, gold, magnesium, calcium, copper, and lithium, as well as compounds, combinations, and alloys thereof. In particular, the second electrode 104 can comprise Ag, Al, Cu, or alloys or layer stacks containing these, for example, Ag/Mg, Ag/Ca, Mg/Al, or Mo/Al/Mo or Cr/Al/Cr. Alternatively or additionally, the second electrode 104 can also comprise a TCO material mentioned above or a layer stack containing at least one TCO and at least one metal. The second electrode 104 can also be transparent.

The first electrodes 102 can, for example, be configured as anodes, while the second electrode 104 can be configured as a cathode. However, with appropriate material selection and conductivity type selection of the layers of the organic functional layer stack 103, a structure with reversed polarity is also possible.

The organic functional layer stack 103 can, in addition to at least one organic light-emitting layer, comprise further organic layers, for example, one or more layers selected from hole injection layers, hole transport layers, electron blocking layers, hole-blocking layers, electron transport layers, electron injection layers, and charge generation layers (CGLs) suitable for directing holes or electrons to the organic light-emitting layer or blocking the respective transport. Furthermore, multiple light-emitting layers may be present. The layers of the organic functional layer stack 103 can comprise organic polymers, organic oligomers, organic monomers, organic small non-polymeric molecules, or combinations thereof. In particular, it may be advantageous for the organic functional layer stack 103 to include a functional layer configured as a hole transport layer to enable effective hole injection into the at least one organic light-emitting layer. Suitable materials for a hole transport layer include, for example, tertiary amines, carbazole derivatives, conductive polyaniline, or polyethylene dioxythiophene. Electroluminescent materials that exhibit radiation emission due to fluorescence or phosphorescence are suitable for the light-emitting layer; examples include polyfluorene, polythiophene, or polyphenylene, or derivatives, compounds, mixtures, or copolymers thereof.

The electrodes 102, 104 are preferably designed with a large area; accordingly, the other elements of the organic light-emitting component 100 can also be designed with a large area, so that the organic light-emitting component 100 can be configured as a planar light source, preferably with an area of the active region 200 greater than or equal to a few square millimeters, more preferably greater than or equal to one square centimeter, and particularly preferably greater than or equal to one square decimeter. The shape of the active region 200, which is defined in particular by the The shape of the organic functional layer stack 103 and the shape of the electrodes 102, 104 may be determined according to the desired luminescence pattern and may differ from the shape shown.

As in the 1B and 1C As can be seen, insulating layers 124 may also be present, for example made of or with polyimide, which can electrically insulate areas of the electrodes 102, 104 from each other. Depending on the design of the individual layers of the organic light-emitting device 100, insulating layers 124 may not be absolutely necessary and may not be present, for example in the case of corresponding masking processes for applying the layers.

The organic light-emitting device 100 is designed as a so-called bottom emitter due to the transparent substrate 101 and the transparent first electrodes 102 and, as described above, emits light during operation through the transparent electrode 102 and the transparent substrate 101 via the light-emitting surface on the side of the second main surface 1012. Furthermore, the second electrode 104, which is arranged facing away from the substrate 101, can also be transparent, as mentioned above, in order to emit the light generated during operation in the organic functional layer stack 103 through the second electrode 104 in a direction away from the substrate 101.

In the peripheral region 201, a metallization layer 105 is applied to the first main surface 1011 of the substrate. In the illustrated embodiment, the metallization layer 105 completely and continuously surrounds the active region 200 laterally, thus forming a continuous, closed frame around the active region 200. The metallization layer 105 is separated from the layers in the active region 200 by a separation zone in the form of a circumferential groove, so that in the illustrated embodiment, the metallization layer 105 is electrically isolated from all layers in the active region 200. In the illustrated embodiment, the metallization layer 105 is further applied to a transparent, electrically conductive layer 106, which in turn is applied directly to the substrate 101. The transparent electrically conductive layer 106, which alternatively cannot be present in this or the following embodiments, has the same material as the first electrodes 102 in the embodiment shown and is identical to the metallization layer 105.

The metallization layer 105 comprises at least one metal. The thickness of the metallization layer 105 is chosen such that the metallization layer is not transparent and thus forms an opaque frame around the active region 200. The metallization layer 105 can, for example, comprise one or more materials selected from Al, Ag, Cr, and Mo. The metallization layer 105 can also comprise a layer stack with multiple materials, for example, Mo/Al/Mo, Cr/Al, Cr/Al/Cr, or Cr/Ag/Cr.

Since the substrate 101 and the transparent, electrically conductive layer 106 are translucent, the metallization layer 105 is visible when looking down at the light-emitting surface, as shown in 1D As shown. An observer of the light output surface thus recognizes a frame formed by the metallization layer 105, which surrounds the active area 200 without interruption and which, in the illustrated embodiment, has a uniform width.

For electrical contacting of the electrodes 102 and 104, a connection area is formed on the metallization layer 105, viewed from the substrate 101, via which the organic light-emitting device 100 can be connected to an external energy source. In the connection area, the organic light-emitting device 100 has an electrically insulating layer 107 on which at least one connection contact 108 is applied. In the illustrated embodiment, the connection area on the electrically insulating layer 107 has three connection contacts 108 for contacting each of the electrodes 102 and 104. The connection contacts 108 project from the edge region 201 into the active region 200 and are provided and configured in the connection area as a contact pad, for example for a connection by soldering, bonding, or gluing.

The electrically insulating layer 107 can comprise or consist of an organic or inorganic electrically insulating material. For example, the electrically insulating layer 107 can comprise or consist of a resist, which can be applied, for example, by wet chemical means, such as dispensing, spray coating, or stencil printing. Furthermore, the electrically insulating layer 107 can, for example, comprise or consist of an oxide applied by a PVD process, such as aluminum oxide, titanium dioxide, silicon dioxide, and/or tantalum pentoxide. The electrically insulating layer 107 is particularly preferably applied to the metallization layer 105 in the connection area before the organic functional material is applied in the active area 200, especially if the application process is carried out by a PVD process. Temperatures are used near the electrically insulating layer 107 that could damage the organic material in the active area 200. Furthermore, the insulating layers 124 described above and the electrically insulating layer 107 can consist of the same material, so that they can be produced in a common application process.

As in 1A As can be seen, the middle of the connection contacts 108 is provided, purely by way of example, for contacting the second electrode 104, while the two outer connection contacts 108 are used to contact the first electrodes 102. In the illustrated embodiment, the connection contacts are identical and, in particular, are made of the same material as the second electrode 104. This makes it possible to apply the connection contacts 108 together with the second electrode 104 in a suitable application process. The connection contacts 108 are thus made of a material that was described above in connection with the second electrode 104. For contacting the first electrode 102, the connection contacts 108 provided for this purpose can extend across the electrically insulating layer 107 into the active area 200 and directly contact the respective first electrode 102 there. As shown in 1B As can be seen, a metallic material 109 can also be arranged in the active area on the first electrodes 102, in particular directly thereon, via which the first electrodes 102 are connected to the terminal contacts 108. The metallic material 109 can, for example, form a current distribution structure, such as in the form of busbars and/or in the form of a frame, and particularly preferably has the same material as the metallization layer 105, so that the metallization layer 105 and the metallic material 109 can preferably be applied in a common deposition process.

An encapsulation, not shown for clarity, can be arranged over the organic functional layer stack 103 and the electrodes 102, 104 to protect the organic functional layer stack 103 and the electrodes 102, 104. The encapsulation can particularly preferably be designed as a thin-film encapsulation. In the present context, a thin-film encapsulation is understood to be a device suitable for forming a barrier against atmospheric substances, in particular against moisture and oxygen, and/or against other damaging substances such as corrosive gases, for example, hydrogen sulfide. In other words, the thin-film encapsulation is designed such that it can be penetrated by atmospheric substances only to a very small extent. This barrier effect in the thin-film encapsulation is essentially generated by one or more barrier layers and/or passivation layers designed as thin films, which are part of the encapsulation. The encapsulation layers typically have a thickness of less than or equal to 5 µm and are applied to the substrate 101 and the previously described additional layers. The encapsulation 107 is therefore not formed by a self-supporting element, but is created through the application process.

In particular, the thin-film encapsulation can have or consist of one or more thin layers responsible for the barrier effect of the encapsulation. These thin layers can be deposited, for example, by atomic layer deposition (ALD) or molecular layer deposition (MLD). Suitable materials for the layers of the encapsulation arrangement include, for example, aluminum oxide, zinc oxide, zirconium oxide, titanium oxide, hafnium oxide, lanthanum oxide, tantalum oxide, and the aforementioned TCOs, such as aluminum tin oxide. Preferably, the encapsulation comprises a sequence of layers with a plurality of thin layers, each with a thickness between one atomic layer and several hundred nm.

Alternatively or additionally to thin films produced by ALD or MLD, the encapsulation can comprise at least one or more further layers, in particular barrier layers and/or passivation layers, which are deposited by thermal evaporation or by means of a plasma-enhanced process, such as sputtering, chemical vapor deposition (CVD), or plasma-enhanced chemical vapor deposition (PECVD). Suitable materials for this purpose can be the aforementioned materials as well as silicon nitride, silicon oxide, silicon oxynitride, silicon carbide, indium tin oxide, indium zinc oxide, aluminum zinc oxide, aluminum oxide, and mixtures and alloys of the aforementioned materials. The one or more further layers can, for example, each have a thickness between 1 nm and 5 µm, and preferably between 100 nm and 1000 nm, including the limits of this range.

The encapsulation can, in particular, cover the active region 200 and the edge region 201 in such a way that, together with the substrate 101, the most comprehensive possible protection, especially of the organic functional layer stack 103, can be achieved. In particular, the encapsulation can cover the first main surface 1011 of the substrate 101. cover except for the electrical connection area with the connection contacts 108.

With regard to further features of the organic light-emitting device 100, for example with regard to the structure, the layer composition and the materials of the organic functional layer stack, the electrodes and the encapsulation, reference is made to the publication WO 2010 / 066 245 A1 reference was made to the structure of an organic light-emitting component and also with regard to modifications and variations of the one described in the 1A to 1D The organic light-emitting component shown is hereby expressly incorporated by reference.

Since the frame formed by the metallization layer 105 is perceptible from the side of the light-emitting surface, it conceals the connection area and thus the previously described layers for an observer, so that, as described in the general section, the connection area can be designed according to the requirements of the contacting technology without disturbing the appearance of the organic light-emitting component 100 on the light-emitting surface, as shown in 1D can be seen.

The following figures show further embodiments that represent modifications and variations of the embodiment described above. The subsequent description therefore focuses primarily on the differences in features. 2A to 2C Figures 3A and 3B show further embodiments of an organic light-emitting component 100, in which, in particular, the connection area is modified compared to the previous embodiment. The components shown in the 2A to 2C The views shown correspond to those of the 1A to 1C The views of 3A and 3B correspond to those of 1A and 1B Since the connection area is concealed by the metallization layer 105 from the side of the light-emitting surface, the organic light-emitting component 100 of the embodiments of the 2A to 2C as well as 3A and 3B, each essentially the ones in 1D the form shown.

In the exemplary embodiment of the 2A to 2C The terminal contacts 108 are made of a different material than the second electrode 104. This can be particularly advantageous if the material of the second electrode 104 is less suitable for contacting the terminal contacts, for example by bonding or soldering. The terminal contacts 108 can, in particular, be made of a material previously described in connection with the metallization layer 105. Accordingly, the terminal contacts 108 can also have a layer stack such as Cr/Al/Cr. Alternatively or additionally, a conductive paste such as silver or copper paste can be applied to the terminal contacts 108.

In the example of the 3A and 3B One of the first electrodes 102 can be electrically contacted by means of the metallization layer 105. For this purpose, a part of the metallization layer 105 in the connection area is free of the electrically insulating layer 107, so that, as shown by the dashed line in 3A As indicated, part of the metallization layer 105 forms a connection contact 108, from which electrically conductive material extends to and contacts one of the first electrodes 102. This first electrode 102 can therefore be directly bonded or soldered onto the metallization layer 105. As shown in 3A As can be further seen, in this case the separation zone described above between the active region 200 and the edge region 201 is interrupted exclusively at the point where the electrical connection between the metallization layer 105 and the first electrode 102 is located. As in 3B As can be seen, the metallization layer 105 can transition into the metallic material 109 at this point. Alternatively, the electrical connection between the metallization layer 105 and one of the first electrodes 102 can also be made exclusively via the transparent, electrically conductive layer 106.

In the 4A and 4B Another embodiment of an organic light-emitting component 100 is shown, which, in comparison to the previous embodiments, is round and has only a single first electrode 102. The view of the 4A corresponds to the in 1A The view shown is of the side facing away from the light output surface, while in 4B The view is shown from the side of the light-emitting surface. As in the previous embodiments and examples, the organic light-emitting component 100 of this embodiment has a connection area with connection contacts 108 on an electrically insulating layer 107. The connection area is shown purely by way of example, as in connection with the embodiment of the 1A to 1D As described, the following are also possible: Alternatively, the variants of the exemplary embodiments of the 2A to 2C possible. Due to the connection area being located behind the metallization layer 105 from the perspective of the light extraction surface, the outer edge of the organic light-emitting component 100 does not need to be adapted to the contacting technology, so that the construction element 100 must not deviate from the desired shape, even in the connection area.

In 5 Figure 1 shows an embodiment of a light-emitting device 1000 with an organic light-emitting component 100 according to one of the previous embodiments. The light-emitting device 1000 further comprises a holder 1001 for mechanically securing the organic light-emitting component 100. For electrical connection of the component 100 to an external power source, the device 1000 also comprises an electrical connection element 1002, which is connected to the connection contacts of the organic light-emitting component 100, for example, by thermal bonding or soldering. The electrical connection element 1002 can be flexible and may have one or more electrical leads, for example, in the form of leads. For example, the electrical connection element 1002 may be a flexible PCB. Due to the connection area being located to the rear from the light-emitting surface, the electrical connection element 1002 must be positioned as shown in Figure 1. 5 As shown, the light source does not protrude beyond the outer edge of the organic light-emitting component 100, but can be positioned completely behind the component 100 from the viewing side, i.e., the light-emitting surface, and can be routed centrally. Therefore, no cladding of the outer edge of the component 100 is necessary to conceal the connection element 1002.

The embodiments shown in conjunction with the figures can also be combined with one another according to further embodiments, even if not all such combinations are explicitly described in conjunction with the figures. Furthermore, the embodiments shown in the figures may additionally or alternatively have features according to the general description.

Reference symbol list

100

organic light-emitting component

101

substrate

102

electrode

103

organic functional layer stack

104

electrode

105

Metallization layer

106

transparent electrically conductive layer

107

electrically insulating layer

108

Connection contact

109

metallic material

124

insulating layer

200

active area

201

Edge area

1000

light-emitting device

1001

bracket

1002

electrical connection element

1011

first main surface

1012

second main surface

1013

side surface

Claims (17)

Organic light-emitting device (100) comprising: - an active region (200) and a boundary region (201) surrounding the active region (200) laterally, - a transparent substrate (101) with a first main surface (1011) and a second main surface (1012), whereby - in the active region (200) on the first main surface (1011) a transparent first electrode (102), an organic functional layer stack (103) and a second electrode (104) are deposited, - in the boundary region (201) on the first main surface (1011) of the substrate (101) a metallization layer (105) is deposited, which completely and without interruption surrounds the active region (200) laterally and is electrically insulated from all layers in the active region (200), - in the boundary region (201) on the metallization layer (105) an electrically insulating layer (107) is arranged in a connection area, and - at least one connection contact (108) is arranged on the electrically insulating layer (107) in the connection area, which electrically contacts at least one of the first and second electrodes (102, 104). Component (100) according to Claim 1 , wherein the connecting contact (108) extends from the edge area (201) into the active area (200). Component (100) according to one of the preceding claims, wherein the at least one connecting contact (108) electrically contacts the second electrode (104). Component (100) according to the preceding claim, wherein at least one [element] is provided on the electrically insulating layer (107) in the connection area. a further connecting contact (108) is arranged, which electrically contacts the first electrode (102). Component (100) according to one of the preceding claims, wherein the metallization layer (105) is electrically insulated from at least one of the electrodes (102, 104). Component (100) according to one of the preceding claims, wherein at least one further transparent first electrode (102) is arranged laterally adjacent to the first electrode (102) in the active area (200), which can be electrically contacted by means of a connection contact (108) on the electrically insulating layer (107) in the connection area. Component (100) according to one of the preceding claims, wherein the at least one terminal contact (108) and the second electrode (104) are made of the same material. Component (100) according to the preceding claim, wherein the at least one terminal contact (108) and the second electrode (104) are formed in one piece. Component (100) according to one of the preceding claims, wherein a plurality of connection contacts (108) are present in the edge region (201) and the second electrode (104) and all connection contacts (108) in the edge region (201) are made of the same material. Component (100) according to one of the Claims 1 until 8 , wherein at least one terminal contact (108) and the metallization layer (105) are made of the same material. Component (100) according to the previous claim, wherein a plurality of connection contacts (108) are present in the edge region (201) and the metallization layer (105) and all connection contacts (108) in the edge region (201) are of the same material Component (100) according to one of the preceding claims, wherein a transparent electrically conductive layer (106) is arranged in the edge region (201) on the first main surface (1011) of the substrate (101) and the metallization layer (105) is arranged on the transparent electrically conductive layer (106). Component (100) according to the preceding claim, wherein the transparent electrically conductive layer (106) and the first electrode (102) are of the same material. Component (100) according to one of the preceding claims, wherein an insulating layer (124) is arranged in the active area (200) which electrically insulates an area of the first electrode (102) and an area of the second electrode (104) from each other and which has the same material as the electrically insulating layer (107) in the connection area. Component (100) according to one of the preceding claims, wherein a metallic material (109) is arranged in the active area (200) on at least a partial area of the first electrode (102). Component (100) according to the preceding claim, wherein the metallic material (109) and the metallization layer (105) are of the same material. Light-emitting device (1000), comprising - an organic light-emitting component (100) according to one of the Claims 1 until 16 , - a holder (1001) for mechanically fastening the organic light-emitting component (100) and - an electrical connection element (1002) for electrically connecting the electrical connection area of the organic light-emitting component (100) to an external energy source, wherein the electrical connection element (1002) is connected to the at least one connection contact (108) of the component (100).