DE102016224870A1 - A method of making a patterned pattern on a metal-coated substrate and device - Google Patents

Abstract

The invention relates to a method for producing a patterned circuit pattern on a metal-coated substrate, wherein the metal is removed at isolation regions of the patterned conductor structure by applying a metal-etching substance to the isolation regions by means of a jet-printing method. Furthermore, the invention relates to a component produced by the method.

Description

State of the art

The invention relates to a method for producing a patterned circuit pattern on a metal-coated substrate and a component produced by the method.

From the DE 10 2014 201 121 A1 For example, an electronic functional component and a production method for an electronic functional component are known. The electronic functional component comprises an electronic component which is embedded in a functional element on a base element by means of a three-dimensional printing process. On the upper side of the base element electrically conductive structures are provided. The electrically conductive structures are printed parallel to the pressure of the base body.

Disclosure of the invention

Advantages of the invention

The inventive method for producing a patterned conductor structure with the features of the independent claim has the advantage that both very fine and thin pattern structures as well as highly conductive, in particular thick, pattern structures can be produced.

It is particularly advantageous that an inkjet method and / or an aerosol-jet method are used as the jet printing method, since these methods contribute to producing fine conductor pattern structures.

It is also advantageous that the metal is copper and / or tin and / or silver and / or gold, since these metals are electrically conductive and can also be applied to a substrate by a plasma deposition process. Furthermore, a flat application by means of a galvanic process with metallizable plastics, for example acrylonitrile-butadiene-styrene (ABS), is advantageous.

It is particularly advantageous that the substrate is a plastic substrate and / or a mineral substrate and / or an organic substrate and / or a metallic substrate, since these substrates are electrically insulated and thus present after the etching process as electrically insulating isolation regions.

A further advantage is that the substrate is a spatially injection-molded circuit carrier, since such a circuit carrier in many applications, such as in transmission controls, sensors or high-performance electronics, new design options and thus the possibility of miniaturization. Other possible applications of the manufacturing process are the contacting of embedded components, as well as the production of pressure sensors.

It is also particularly advantageous that the printed circuit traces of the patterned pattern structure produced by the method have a width between 5 .mu.m and 10 .mu.m and / or that the distances between the produced printed conductors of the patterned pattern structure are between 10 .mu.m and 20 .mu.m, since this is the production of very fine and closely spaced interconnects allows so that very compact designs are obtained.

A further advantage is that the metal has a layer thickness of greater than 50 .mu.m, preferably greater than 100 .mu.m, more preferably greater than 200 microns on the substrate, as this conductor tracks can be created, which are densely packed on the one hand by the small distances, but at the same time high Can transfer services. Further advantages will become apparent from the following description of embodiments with reference to the figures and from the dependent claims.

list of figures

Embodiments of the invention are illustrated in the drawings with reference to several figures and explained in more detail in the following description.

• 1 ein Ablaufdiagramm des Verfahrens zur Herstellung einer Leiterbildstruktur auf einem mit Metall beschichteten Substrat.

It shows:

• 1 a flow chart of the method for producing a patterned circuit pattern on a metal-coated substrate.

Description of exemplary embodiments

Hereinafter, a method of manufacturing a patterned pattern on a metal-coated substrate will be described, wherein the metal is removed at isolation areas of the patterned pattern by applying a metal etchant to the isolation areas by a jet printing method. Furthermore, a component produced by the method will be described.

1 shows a flow diagram of the method for producing a conductive pattern on a metal 12 coated substrate 10 , In a first step 30 becomes a substrate 10 made available. In a second step 32 is determined by means of a plasma deposition method, for example the plasma dust method and / or the Flamecon method and / or the PlasmaPlus method and / or the Digital Direct Metallization (DDM), the uncoated substrate 10 metal 12, in particular copper and / or tin and / or silver and / or gold and / or copper alloy and / or tin alloy and / or silver alloy and / or gold alloy. Plasmadust is a plasma deposition method in which metallic layers are deposited from a cold-active atmospheric pressure plasma, wherein the gas plasma is preferably generated by a gas discharge. The Flamecon process is a plasma deposition process in which metal particles are melted in a high temperature chamber and passed to the substrate surface via a carrier stream. In the preferred embodiment, a copper-coated plastic substrate is used. In a variant of the preferred embodiment is used as a substrate 10 a mineral substrate and / or an organic substrate and / or a metallic substrate used. In the preferred embodiment, the metal 12 as a single layer on the substrate 10 applied. In a variant of the preferred embodiment, multiple layers are applied by the plasma deposition method so as to obtain the larger layer thickness of the metal layer. In the preferred embodiment, the substrate is 10 formed in three dimensions. In one variant, the substrate is formed like a foil in two dimensions. In a further variant of the preferred embodiment, the first step 30 and the second step 32 not executed. Instead, one becomes metal 12 coated substrate 10 provided as a semi-finished product. The metal coating takes place by means of sputtering, film coating and / or a galvanic process. The semi-finished product is in the third step 34 further edited. In the third step 34 is by means of a jet printing process at the later isolation areas 20 a metal-etching substance 14 applied. In the preferred embodiment, the aerosol jet method is used as the jet printing method. The aerosol-jet process is characterized in that the coating material, here the metal-etching substance 14, is present as a liquid material in an atomizer, where, for example, an aerosol is generated by means of ultrasound, wherein the aerosol then by means of a nozzle 16 on the substrate 10 is applied. In a variant of the preferred embodiment, the jet printing method used is an inkjet method in which the metal-etching substance is applied to the substrate as individual droplets. In a further variant, the metal-etching substance is applied by means of microdispensers. The nozzle 16 is in at least two directions of movement in both jet printing processes 18 movable. In the preferred embodiment, the metal etchant is 14 an acid. In a variant of the preferred embodiment, the metal-etching substance 14 a base and / or a reducing salt in aqueous solution, especially ferric chloride. By applying the metal-etching substance 14 will be in the fourth step 36 the metal 12 subtractive at the isolation areas 20 the pattern structure 22 removed, so that finally by insulating isolation areas 20 separate tracks 24 which remain the pattern structure 22 form. The substrate is particularly preferably 14 around a spatially injection-molded circuit carrier, so that after the manufacturing process, an injection-molded circuit carrier is obtained with an integrated on this circuit pattern structure (Molded Interconnect Device, MID).

The generated tracks 24 the pattern structure 22 have a width between 5 .mu.m and 10 .mu.m, preferably of 5 .mu.m. The distances between the generated tracks 24 the pattern structure 22 passing through the isolation areas 20 are separated, amount to between 5 .mu.m and 10 .mu.m. The metal 12 on the substrate 10 has a layer thickness of greater than 50 microns, preferably greater than 100 microns, more preferably greater than 200 microns, on. In a variant of the preferred embodiment, the metal coatings on the surface of the substrate 10 produced as a layer composites, which consist of at least two metal layers. In a further variant of the preferred embodiment are on a substrate 10 apply at least two coatings with different layer thicknesses, so that the printed conductors produced 24 can transfer different services.

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102014201121 A1 [0002]

Claims (12)

A method of making a patterned conductive pattern (22) on a metal (12) coated substrate (10), characterized in that the metal (12) is removed at isolation regions (20) of the patterned conductive pattern (22) by means of a jet printing process Insulation regions (20) a metal-etching substance (14) is applied. Method according to Claim 1 , characterized in that as the jet printing method, an inkjet method and / or an aerosol jet method and / or a microdosing be used. Method according to one of the preceding claims, characterized in that the metal (12) is copper and / or tin and / or silver and / or gold. Method according to one of the preceding claims, characterized in that the substrate (10) is a plastic substrate and / or a mineral substrate and / or an organic substrate and / or a metallic substrate. Method according to one of the preceding claims, characterized in that the metal-etching substance (14) is an acid or an alkali or a reducing salt, in particular ferric chloride. Method according to one of the preceding claims, characterized in that the substrate (10) is formed at least two-dimensional, preferably three-dimensional. Method according to one of the preceding claims, characterized in that the substrate (10) is a spatially injection-molded circuit carrier. Method according to one of the preceding claims, characterized in that the generated printed conductors (24) of the printed pattern structure (22) have a width between 5μm and 10μm and / or that the distances between the generated printed conductors (24) of the printed circuit pattern (22) between 10μm and 20μm amount. Method according to one of the preceding claims, characterized in that the substrate (10) in a preceding manufacturing step by means of a plasma coating process and / or a galvanic process with the metal (12) is coated. Method according to one of the preceding claims, characterized in that the metal (12) on the substrate (10) has a layer thickness of greater than 50 microns, preferably greater than 100 microns, more preferably greater than 200 microns. Component produced by a method according to one of the preceding claims. Component after Claim 11 , characterized in that the component is a spatially injection-molded circuit carrier having a conductor pattern structure (22).

Images