DE102012013741A1 - Arrangement for cooling electrical device e.g. converter for electrical supply to e.g. asynchronous motor, has heat sink that is provided with air guide unit for guiding cooling medium stream through cooling channels - Google Patents

Abstract

The arrangement has a printed circuit board (3) on which heat generating components are mounted. The heat-generating components are thermally conductive bonded with a heat sink (1). The heat sink is provided with an air guide unit for guiding cooling medium stream through the cooling channels so as to dissipation heat from heat-generating components to the surroundings. The cooling fins of heat sink are made to face away from printed circuit board. An independent claim is included for electrical device.

Description

The invention relates to an arrangement for cooling, an electrical appliance and a use of an arrangement for cooling.

In the case of electrical appliances, it is known that a heat-generating component for cooling is connected to a heat sink in a heat-conducting manner. Furthermore, it is known to conduct a cooling medium flow for cooling a heat-generating component along the component.

The DE 195 38 642 A1 shows a cooling and mounting arrangement for a number of semiconductor devices.

In the DE 37 10 198 A1 a coolable arrangement of electronic components or assemblies is shown.

From the US Pat. No. 5,940,272 is known electronic device with heat radiating fins.

The DE 10 2007 058 706 A1 shows a cooling structure for an electronic device.

In the US Pat. No. 6,411,514 B1 An inverter with a heat dissipating device is described.

From the US 2005 0146851 A1 An electronic component with a printed circuit board and a heat sink is known.

The JP 2007 311697 A shows a cooling unit for a circuit.

In the US 5 740 013 A For example, a housing for an electronic device with electromagnetic shielding and heat dissipating properties is shown.

From the DE 39 03 615 A1 is an electrical circuit board with electrical / electronic components known.

In the DE 43 25 499 C2 is an attached device described.

The invention is therefore the object of developing an arrangement for cooling, wherein the cooling is to be performed more effectively, whereby environmental protection is improved.

According to the invention the object is achieved in the arrangement according to the features specified in claim 1 or 2, wherein the electrical appliance according to the features specified in claim 16 and when using a heat sink according to the features indicated in claim 17.

Important features of the invention in the arrangement for cooling of heat-generating components, that the arrangement comprises a printed circuit board on which a first and a second heat-generating component are arranged, and a heat sink with Luftleitmitteln, which delimit one or more cooling channels, at least partially the heat sink is thermally conductively connected to the first heat-generating component, wherein the second heat-generating component projects at least partially into a subregion of the cooling channel or into a respective subregion of the plurality or all cooling channels, and wherein the air conduction means are arranged on the side of the heat sink facing away from the printed circuit board ,

The advantage here is that various types of heat-generating components, although they are equipped on a circuit board, can be cooled in different ways, which are selected according to the properties of the respective heat-generating component. For components with irregular, in particular fissured, surface, for example a choke, the cooling over the cooling medium flow guided along this component is advantageous since it reaches and cools all surface regions of the component. In contrast, the cooling via a direct heat-conducting connection with the heat sink is particularly advantageous for flat components having a large planar surface, which can be brought into heat-conducting contact with a surface of the heat sink, such as the inverter in a converter. In this case, the inverter is manufactured as a compact, substantially parallelepiped-shaped unit, solder-connected to conductor tracks of the printed circuit board and has pulse-width modulated controllable power semiconductor switches arranged in half-bridges. In this case, the air guiding means act as cooling fins, so that the heat of the heat sink is radiated more effectively to the cooling medium flow compared to a cooling plate with a smaller surface area.

Important features of the invention in the arrangement, in particular cooling arrangement, for cooling of heat-generating components are that the arrangement a printed circuit board, on which a first heat-generating component and a second heat-generating component are arranged, in particular which is equipped with a first and a second heat-generating component , and a heat sink with air guiding means for guiding a cooling medium flow,
wherein the heat sink is thermally conductively connected to the first heat-generating component
wherein the air guiding means are arranged, the cooling medium flow at the second heat-generating To conduct along component, for dissipating the heat generated by the second heat-generating component to the environment.

In this case, the heat sink is arranged between the cooling medium flow and the printed circuit board, in particular wherein the printed circuit board is arranged on that side of the heat sink, which faces away from the cooling medium flow side facing the heat sink, and / or wherein the first heat generating component on the side remote from the cooling medium flow side of the heat sink is arranged, in particular wherein the cooling medium flow is separated from the circuit board by means of the heat sink, and / or wherein the air guide means are arranged on the side remote from the circuit board of the heat sink.

The advantage here is that various heat-generating components, although they are mounted on a circuit board, can be cooled in different ways, which are selected according to the characteristics of the respective heat-generating component. In this case, the cooling via a direct heat-conducting connection with the heat sink is particularly advantageous for flat components which have a large planar surface, which can be brought into heat-conducting contact with a surface of the heat sink, such as the inverter in a converter. In this case, the inverter is manufactured as a compact, substantially parallelepiped-shaped unit, solder-connected to conductor tracks of the printed circuit board and has pulse-width modulated controllable power semiconductor switches arranged in half-bridges. For components with irregular, in particular fissured, surface, for example, a throttle, however, the cooling over the cooling medium flow guided along this component is advantageous because it reaches and cools all surface regions of the component.

In particular, the arrangement has at least one first and one second heat-generating component, wherein the first component is cooled directly and effectively by means of a thermally conductive contacting connection with the heat sink and the second component is cooled by a cooling medium flow conducted along it and having such a high flow velocity , so that the heat is removed from the cooling air flow and only a negligible proportion of the heat sink flows.

In an advantageous embodiment, the arrangement, in particular the heat sink of the arrangement, one or more cooling channels, which are at least partially limited by means of air guiding means of the heat sink, wherein one or more or all cooling channels are arranged and / or arranged such that the cooling medium flow in the Cooling channel or the cooling channels, in particular during the Entlangströmens in the cooling channel, heat dissipates heat from the first heat-generating component and at least in portions dissipates heat from the second heat-generating component. The advantage here is that a single cooling medium flow, which is guided along the cooling channels, the first and the second heat-generating component cools. Thus, a uniform heat distribution in the arrangement is possible, whereby overheating of individual components is prevented. Furthermore, a temperature sensor is sufficient to determine the temperature of all components. So it is a high reliability achieved with low component costs.

In an advantageous embodiment, the arrangement, in particular the heat sink of the arrangement, one or more cooling channels, which are at least partially limited by means of Luftleitmitteln the heat sink, wherein the second heat-generating component in a portion of the cooling channel or in a respective portion of the multiple or all cooling channels protrudes. The advantage here is that both flat components such as the inverter and further out of the plane of the circuit board protruding components such as the inductance can be cooled by means of a heat sink by flat components are connected to the heat sink and protruding components protrude into the heat sink. Here are flat and protruding components on a temperature level bring bar.

In an advantageous embodiment of the cooling medium flow is separated from the circuit board by means of the heat sink. The advantage here is that the cooling medium flow and in particular the impurities contained in the cooling medium flow, such as dust, are kept away from the circuit board and thus prevents malfunction of the circuit board or at least reduced. As a result, therefore, the reliability of the electronic components is increased on the circuit board.

In a further advantageous embodiment, the cooling body is arranged between the cooling medium flow and the printed circuit board. The advantage here is that the cooling medium flow and the circuit board, in particular the sensitive electrical components that are mounted on the circuit board, are protected by the optionally loaded with dirt particles cooling medium flow, whereby the reliability is improved.

In a further advantageous embodiment, the first heat-generating component is thermally conductively connected on the side facing away from the cooling medium flow side of the heat sink to the heat sink and / or wherein the first heat-generating Component between the printed circuit board ( 12 ) and the heat sink ( 1 ) is arranged, in particular wherein thermal paste is interposed between the heat sink and the first heat-generating component. The advantage here is that the heat sink on the side facing away from the cooling medium flow side without air guide is executable, in particular just executable, so that this side of the heat sink in a simple manner thermally conductively connected to the first component. By applying thermal compound between the heat sink and the component, a reduction of the heat transfer resistance between the component and the heat sink can be achieved.

In a further advantageous embodiment, the second heat-generating component protrudes through a first recess of the heat sink into the cooling medium flow, in particular wherein the second heat-generating component is designed as an inductor, in particular as a choke, wherein the heat sink has a first recess for receiving the second heat-generating component, in particular for receiving the inductance. The advantage here is that the second heat-generating component is mounted on the same circuit board as the first heat-generating component, in particular on the same side of the circuit board is mounted. This allows a simple and inexpensive installation.

In a further advantageous embodiment, the heat sink is arranged at a distance from the second heat-generating component. The advantage here is that the second component of the heat sink is electrically isolated by interposed air as insulating. Thus, voltage flashovers between the device and the heat sink can be avoided. In this case, the spacing between the heat sink and the second heat-generating component is advantageously made so large that there is no direct contact between the heat sink and the second heat-generating component, whereby voltage flashovers can be avoided. Furthermore, the spacing between the heat sink and the second heat-generating component is made so small that the cooling medium flow is passed directly from the heat sink to the second heat-generating component by means of the air conduction.

In a further advantageous embodiment, the heat sink on a base plate, are pronounced on the cooling fins as Luftleitmittel, in particular in one piece or two pieces. The advantage here is that the heat sink with the cooling fins is easy to manufacture in a single step.

In a further advantageous refinement, the heat sink has cooling fingers, in particular those which function as surface-enlarging structures. The advantage here is that cold fingers have a larger surface area than cooling fins, whereby the heat radiation to the ambient air can be improved. In addition, an isotropic cooling is achievable, so independent of the installation position Entwärmungsleistung.

In a further advantageous embodiment, the heat sink is metallic, in particular made of aluminum, in particular made of anodized aluminum. The advantage here is that metallic materials have good thermal conductivity compared to, for example, ceramic materials and are easy to work with. In particular, anodized aluminum has a particularly good heat radiation.

In a further advantageous embodiment, the first recess extends through the base plate and also into a first cooling fin, wherein a second cooling fin is spaced from the first recess. The advantage here is that through the recess, the second heat-generating component is projecting executable into the cooling medium flow, wherein the cooling medium flow through the remaining cooling fins is conductive, in particular separable from the circuit board.

In a further advantageous embodiment, the first recess is a round hole made in the heat sink, in particular a milled or drilled round hole. The advantage here is that a round hole in particular by milling or drilling is easy and inexpensive manufacturable.

In a further advantageous embodiment, the heat sink is designed as a continuous casting profile. The advantage here is that the heat sink with the air directing means is simple and inexpensive manufacturable in a single step.

In a further advantageous embodiment, the first recess is a circular hole introduced into the continuous casting profile transversely to the continuous casting direction, in particular a milled or drilled round bore. The advantage here is that only a single further step for the production of the recess is required.

In a further advantageous embodiment, the heat sink has a plate-like, extending in the continuous casting rear wall, in particular which is executed perpendicular to the base plate. The advantage here is that the heat sink can be executed completed by the rear wall to the outside, in particular by means of this rear wall to a suspension can be fastened.

In a further advantageous embodiment, the rear wall is thermally connected to a cooling plate, in particular to a cooling plate arranged in a control cabinet, in particular wherein the cooling plate has cooling channels through which a further cooling medium, in particular water, compressed air or oil, can be guided. The advantage here is that the heat of the heat sink by means of the cooling plate is more effectively dissipated than by means of pure convection.

In a further advantageous embodiment, the arrangement has a printed circuit board, in particular a single printed circuit board, wherein the printed circuit board has a low voltage region and a high voltage region. The advantage here is that the entire electronics of the device comprising the arrangement is simple and inexpensive to install on a single circuit board.

In a further advantageous embodiment, the heat sink is arranged in the high voltage region. It is advantageous in this context that components of the high-voltage region which for the most part generate more heat than components of the low-voltage region are preferably cooled. The cooling of the low voltage range via the housing of the device comprising the device.

In a further advantageous embodiment, an insulating means is arranged between the heat sink and printed circuit board, which has at least two recesses through which the first and the second heat-generating component protrude, in particular wherein the insulating acts electrically insulating, in particular has a higher electrical insulation strength and / or dielectric strength as air, in particular wherein each recess of the insulating means can be brought into coincidence with the respective recess of the heat sink, wherein the insulating means has a poorer thermal conductivity than air, in particular thus improves the heat dissipation of the circuit board towards the environment, in particular via a housing of the arrangement. The advantage here is that the heat sink and the first and second heat-generating component are thermally insulated against other components on the circuit board. In this case, the heat generated by these other components via other Wärmeleitpfade can be derived. A further advantage is that by means of the thermal insulation of the further components of the first and second heat-generating component, the radiated heat to the other components is reduced. Thus, the heat dissipation of the circuit board is improved to the environment.

In a further advantageous embodiment, a frame connects the heat sink mechanically, in particular mechanically rigid, to the circuit board, in particular wherein the frame is designed as a housing part and / or wherein the frame is at least partially housing-forming, wherein the frame is mechanically connected to the circuit board, in particular mechanically rigidly connected. The advantage here is that heat sink, frame and circuit board form a compact unit and thus are easy to use in a housing.

In a further advantageous embodiment, a cooling medium flow driven by a fan flows past a surface region of the heat sink for dissipating heat to the ambient air. The advantage here is that the heat of the heat sink is dissipated to the ambient air.

In another advantageous embodiment, the cooling medium flow conducted by the heat sink is convectively driven and directed vertically, in particular wherein the cooling fins extend vertically. The advantage here is that the air circulation is improved by convection.

In a further advantageous embodiment, the heat sink and circuit board of a housing part, in particular a housing part of electrically non-conductive material, at least partially surrounded, in particular wherein the housing part circulation means, in particular ventilation slots and / or flow channels, and / or mounting means for a device for increasing the Heat transfer to the surrounding medium, in particular fan has. The advantage here is that the arrangement is protected by the housing from environmental influences, such as dust and / or water. Nevertheless, the heat output by means of the circulation devices and / or the fan is only slightly limited.

In a further advantageous refinement, the heat of a component arranged in the low-voltage region can be dissipated to the environment by means of the air located in the interior of the housing part, which is exchangeable by the circulation means through the housing part with the surrounding medium. The advantage here is that the low-voltage region and the components arranged thereon can be cooled independently of the heat sink. In this case, a heat transfer from the heat sink to the arranged in the low-voltage area components can be reduced, so that the components are protected against overheating.

In a further advantageous embodiment, a temperature sensor is connected to the heat sink in a heat-conducting manner. The advantage here is that the temperature of the heat sink is measurable and controllable.

In a further advantageous embodiment, the temperature sensor is arranged on the printed circuit board, in particular wherein the printed circuit board has a first and a second printed circuit board section, in particular wherein the first printed circuit board section is connected to the second printed circuit board section over such a small connecting region that it can be deflected elastically thereto, is in particular elastically deflected, wherein the temperature sensor is mounted on the first circuit board portion. The advantage here is that a good thermal connection of a sensor is made possible at the same time cost-effective installation of the sensor. Due to the elastic deflection mechanical tolerances can be compensated, which may arise in particular by thermal expansion or as manufacturing tolerances. Characterized in that the sensor is arranged on an elastically deflectable portion which is held by the holding device to the heat sink at a distance defined by the holding device, a fixing of the circuit board on a housing part, which is fixedly connected to the heat sink allows. Tolerances and / or thermally induced expansions of the housing part, the printed circuit board and / or the heat sink therefore only lead to a corresponding elastic deflection of the sensor-receiving printed circuit board section. Furthermore, a sufficient electrical insulation distance between the temperature sensor and further electrical components can be achieved by separating the first from the second printed circuit board section. In a simple way, this can be achieved by an interposed recess and a correspondingly executed connection section.

In a further advantageous embodiment, a holding device is arranged between the heat sink and the first printed circuit board section. The advantage here is that the heat of the heat sink is passed through the holding device to the sensor and the temperature of the heat sink can be determined. In this way, the risk of overheating is reduced, that is, the safety is increased.

In a further advantageous embodiment, the connecting region and a second recess space the first and second printed circuit board sections, in particular wherein the recess is designed as a cutout in the printed circuit board. The advantage here is that a recess as a cutout is easy to manufacture.

In a further advantageous refinement, the recess with the connection region encloses or frames the second printed circuit board section at least partially, in particular, wherein the recess is arranged completely in the printed circuit board. The advantage here is that the second circuit board portion is elastically deflectable in this case, but by embedding the risk of breakage is less than when the recess opens into the edge of the circuit board.

In a further advantageous embodiment, the recess is executed from the edge of the circuit board forth or opens into the edge of the circuit board. The advantage here is that the recess from the edge is easy and inexpensive to manufacture.

In a further advantageous embodiment, the recess extends deeper into the printed circuit board than the width of the first printed circuit board section. The advantage here is that a particularly elastic deflection of the first circuit board portion is made possible, so a deflection with less force and thus lower voltages in the circuit board is reached.

In a further advantageous refinement, the heat transfer resistance from the heat sink via the holding device to the sensor is lower than via any other existing heat conduction paths between the heat sink and the sensor, in particular via air arranged between the heat sink and the first printed circuit board section, in particular where the heat sink and / or the holding device are metallic, in particular of aluminum, is or are. The advantage here is that due to the good thermal connection an accurate determination of the temperature of the heat sink is made possible by the low heat conduction losses.

In a further advantageous embodiment, the circuit board is designed in multiple layers, in particular designed as a multilayer printed circuit board and / or has inner layers. The advantage here is that vias are possible that connect the individual layers. Through-hole is understood here that the inside of the recess, for example, hole, is completely metallized. In this way, electrically and / or thermally advantageous conditions can be achieved, in particular a lower heat transfer resistance from the heat sink to the sensor.

In a further advantageous embodiment, the circuit board is equipped in SMD technology and / or by means of push-through mounting, in particular, the temperature sensor is equipped in SMD technology. The advantage here is that mass production is possible.

In a further advantageous embodiment, metallic regions, in particular layers, are arranged in the first printed circuit board section, in particular on the upper side and / or lower side and / or the inner layers of the printed circuit board. The advantage here is that the metallic areas the Improve heat transfer along the circuit board, so in particular thus a lower heat transfer resistance from the heat sink to the sensor can be produced.

In a further advantageous embodiment, the metallic regions are designed as conductor tracks of the printed circuit board, in particular conductor tracks made of copper-containing material, in particular tinned copper conductor tracks. The advantage here is that high electrical and thermal conductivity can be realized by a single material.

In a further advantageous embodiment, the holding device touches one of the metallic areas. The advantage here is that an accurate determination of the temperature of the heat sink is made possible by low heat conduction losses on the fixture and the metallic region.

In a further advantageous embodiment, a recess in the first printed circuit board section is provided, in particular a through-hole, through which the holding device is guided or passed, in particular a metallic plated-through hole, in particular of copper-containing material, in particular tinned copper. The advantage here is that the via perpendicular to the tracks, so in the normal direction to the track plane and / or circuit board level allows heat transfer through the circuit board.

In a further advantageous embodiment, a metallic region of the printed circuit board is connected to the wall of the plated-through hole. The advantage here is that the feedthrough connects metallic areas of the circuit board electrically and thermally conductive and allows a good thermal connection of the heat sink on the fixture.

In a further advantageous embodiment, the holding device touches the wall of the feedthrough. The advantage here is that the via connects the holding device electrically and thermally conductive to the circuit board.

In a further advantageous embodiment, the connection of the holding device with the first circuit board portion is detachable, in particular screw-connected, in particular a threaded hole in the holding device is providable, which receives a fastening screw, in particular the screw head touches a metallic region of the circuit board. The advantage here is that the heat sink with the holding device is easily mounted on the circuit board.

In a further advantageous embodiment, the holding device is firmly connected to the heat sink and / or materially connected, in particular via a rivet. The advantage here is that the connection of the holding device with the heat sink is compact and does not disturb the flow of cooling air between the cooling fins of the heat sink.

In a further advantageous embodiment, the holding device is detachably connected to the heat sink via a screw-toothed part. The advantage here is that the holding device is easily mounted on the heat sink.

In a further advantageous embodiment, a frame connects the heat sink mechanically, in particular mechanically rigid, with the circuit board. The advantage here is that the electrical components are protected on the surface of the circuit board against mechanical damage.

In a further advantageous embodiment, the frame and heat sink are detachably connected, in particular wherein the frame is designed as a housing part and / or wherein the frame is at least partially housing-forming, wherein the frame is mechanically connected to the circuit board in the region of the second circuit board portion, in particular mechanically rigidly connected is. The advantage here is that heat sink, frame and circuit board form a compact unit and are easy to use in a housing.

In a further advantageous embodiment, the temperature sensor is arranged on the heat sink facing surface of the circuit board. The advantage here is that the sensor is protected by the heat sink from mechanical damage, especially when the first circuit board portion is elastically deflected.

In a further advantageous embodiment, the temperature sensor is connected to the circuit board via solder joints. The advantage here is that the contact and attachment of the sensor in a manufacturing step and with a single material is executable.

In a further advantageous embodiment, the sensor has connection surfaces for electrical contacting and a temperature detection surface, wherein the temperature detection surface of the sensor is solder-bonded to a metallic region on the circuit board, which extends into the wall of the plated-through hole. The advantage here is that the electrical contact can be made simply and inexpensively by soldering and temperature sensing surface of the sensor by soldering heat-conducting over the metallic area with the Through connection is connected and is thus connected via the holding device to the heat sink.

In a further advantageous embodiment, the holding device is designed as a bolt. The advantage here is that a bolt is easy to install.

In a further advantageous embodiment, a spacer sleeve and / or a metallic washer are arranged between the heat sink and the first printed circuit board section. The advantage here is that a defined distance between the heat sink and the first circuit board portion is adjustable and mechanical stress on the circuit board can be reduced.

Important features of the invention in the electrical appliance, in particular a converter for supplying an electric motor, in particular asynchronous motor and / or synchronous motor, are that the electrical appliance has an aforementioned arrangement for cooling.

The advantage here is that the heat-generating components of a printed circuit board can be cooled by means of a heat-conducting connection with the heat sink or a cooling medium flow conducted along the component, the cooling medium flow being conducted along only one selected component; all other components are separated from the cooling medium flow, in particular kept away from impurities contained in the cooling medium flow.

Important features of the invention in the use of a heat sink for guiding a cooling medium flow, that the cooling medium flow is passed along Luftleitmitteln the heat sink, wherein a thermally conductively connected to the heat sink first heat-generating component is cooled, wherein at least in sections directed the cooling medium flow along a second heat-generating component is, wherein the first and the second heat-generating component are arranged on a circuit board, in particular wherein between the circuit board and the cooling medium flow of the heat sink is arranged.

The advantage here is that the heat sink is used both for cooling of the heat-conducting connected to the heat sink first heat-generating component and for cooling of the standing in the cooling medium flow second heat-generating component, wherein the cooling medium flow is passed along only one selected component, all other components separated from the cooling medium flow, in particular separated by impurities contained in the cooling medium flow.

Further advantages emerge from the subclaims. The invention is not limited to the combination of features of the claims. For the skilled person, further meaningful combination options of claims and / or individual claim features and / or features of the description and / or figures, in particular from the task and / or the task posing by comparison with the prior art arise.

The invention will now be explained in more detail with reference to figures:

In the 1 an arrangement for detecting the temperature of a heat sink with temperature sensor in sectional view is schematically sketched.

In the 2 For this purpose, a circuit board portion having the arrangement for detecting the temperature of a heat sink, schematically outlined in plan view.

3 shows an enlarged section of a cross section of the arrangement for detecting the temperature of a heat sink.

4 shows the front side of a printed circuit board and an associated with this heat sink of an electrical appliance according to the invention in an oblique view, wherein the housing of the arrangement is not shown.

5 shows the back of the PCB in an oblique view.

In the 6 the front of the circuit board is drawn with the associated heat sink and an associated frame in plan view.

In the 7 is the front of the circuit board without heat sink drawn in plan view.

8th shows the interconnect structure, in particular layout, the circuit board in plan view.

1 shows an arrangement for detecting the temperature of a heat sink 1 , The arrangement has a holding device 2 on top of the heatsink 1 thermally and / or electrically with a first circuit board portion 3 combines. The holding device 2 is designed for example as a bolt or pin. The heat transfer between the heat sink 1 and holding device 2 has a low heat transfer resistance. The heat sink 1 and the holding device 2 are metallic, preferably made of aluminum. The holding device 2 is with the heat sink 1 riveted. The connection of the holding device 2 with the first Printed circuit board section 3 is designed to be detachable, in particular via a screw 4 whose screw thread into a threaded hole in the holding device 2 is screwed in. On the first circuit board section 3 is a sensor, preferably a temperature sensor 5 , in close proximity to the holding device 2 arranged.

Connected by heat conduction is understood here to mean that two objects have a lower heat transfer resistance to one another via this connection than via all other heat conduction paths between the objects.

The circuit board 12 is a multilayer printed circuit board, especially with inner layers. The circuit board 12 is therefore also denominated as a multilayer printed circuit board. Preferably, copper-containing material or copper is used as the material for the conductor tracks 13 used: Tinned copper is advantageous for outer layers. The electrical components, in particular the temperature sensor 5 , are with the circuit board 12 soldered. The components are preferably in SMD technology and / or by push-through mounting on the printed circuit board 12 equipped, preferably equipped on both sides or one-sided equipped on the heat sink 1 facing side of the circuit board 12 , In particular, the temperature sensor 5 on the heat sink 1 , in particular the connection point between the holding device and the heat sink facing side of the first circuit board portion 3 arranged.

2 shows the first circuit board section 3 on which the temperature sensor 5 and a third recess of the printed circuit board section 3 are arranged. In particular, the third recess is as a via 14 executed. By plated-through is understood here that the inner wall of the third recess is completely metallized, in particular copper, or tinned copper, is used for the metallization. A metallic contact surface 11 , ie conductor track section, closes on the wall of the feedthrough 14 at. In particular, the metallic contact surface encloses 11 in the plane of the conductor track section, the third recess through which the holding device 2 one and / or is passed radially. Preferably, in each case one or more conductor track sections, such a metallic contact surface 11 executed. The holding device touches 2 the wall of the via 14 and / or the metallic contact surface 11 For example, with the screw head of the screw 4 ,

The first circuit board section 3 is thermally, mechanically and electrically by a further second recess 10 and a small connection area of the remaining circuit board 12 separated. This is the first circuit board section 3 elastically deflectable to the remaining circuit board 12 , In particular, the first printed circuit board section 3 by production-related and / or thermally induced length tolerances of the holding device 2 compared to the rigid connection of the remaining PCB 12 with the heat sink 1 elastically deflected.

The second recess 10 that the first circuit board section 3 from the rest of the circuit board 12 is preferably completely within the circuit board 12 arranged.

The small connection area is designed such that the second recess 10 the first circuit board section 3 at least 75%. In particular, the contact region of the connection region is with the first printed circuit board section 3 smaller than the length of the connecting portion, so that the first printed circuit board portion 3 to the remaining circuit board 12 is elastically deflectable.

The metallic contact surface 11 extends to the second recess 10 approach and is as a conductor track 13 on the top and / or bottom and / or the inner layers of the first circuit board section 3 executed. The temperature sensor 5 is on the heatsink 1 facing side of the first circuit board portion 3 and is electrically and / or thermally with the holding device 2 connected. In particular, the temperature sensor 5 Connecting surfaces for electrical contacting and a temperature sensing surface, which with the metallic contact surface 11 connected is.

The heat sink 1 is mechanical over a frame 42 with the circuit board 12 connected. In particular, this compound is mechanically rigid. Preferably, the connection is made detachable, for example by means of respective screw connection.

In further embodiments of the invention, the second recess 10 from the edge of the circuit board 12 executed, wherein the second recess 10 deeper into the PCB 12 extends as the first circuit board portion 3 is wide.

In further embodiments of the invention, a spacer sleeve between the heat sink 1 and the first circuit board section 3 arranged. By pressing the first circuit board section 3 with the in the holding device 2 , in particular spacer sleeve, screwed screw 4 to the sleeve is a defined distance between the heat sink 1 and circuit board 3 set.

In further embodiments of the invention, the connection of the holder 2 with the circuit board 3 firmly, for example via a rivet.

In further embodiments of the invention, the mechanical connection of the holding device takes place 2 with the heat sink 1 detachable, preferably by means of screw connection.

In further embodiments of the invention is a washer between the screw head and the first circuit board section 3 and / or between the spacer sleeve and the first printed circuit board section 3 arranged around the first circuit board section 3 mechanically relieve. Preferably, the washer is made of metallic material, whereby the heat transfer resistance between the holding device 2 and the metallic contact surface 11 is reduced.

In 4 is an inventive electrical device, in particular a converter, with a heat sink 1 , that over the top, so front, the circuit board 12 is arranged, shown with the housing removed. The electrical appliance is via a first connector part 27 connectable to the electrical supply network. About a second connector part 31 the electrical connection to the consumer, in particular a motor, preferably asynchronous motor and / or synchronous motor.

The circuit board 12 is divided into two areas: a low-voltage area with a signal electronics, the z. B. a microcontroller 20 contains, as well as a first connection device 32 for an adapter for secure hold, a second connection device 33 as a signal connection, a third connection device 36 for connection to field distribution systems and a fourth connection device 37 for an external control panel.

• – ein Wechselrichter 61 als erstes wärmeerzeugendes Bauelement,
• – ein erster Netzfilter 22 mit einer Induktivität 28 als zweites wärmeerzeugendes Bauelement zur Entstörung des Eingangssignals,
• – ein zweiter Netzfilter 52 zur Entstörung des Ausgangssignals,
• – ein galvanisch getrennter Widerstand 50 und
• – Shuntwiderstände 51.

The second area is a high voltage area with power electronics. In the field of power electronics are arranged

• - an inverter 61 as the first heat-generating component,
• - a first line filter 22 with an inductance 28 as a second heat-generating component for interference suppression of the input signal,
• - a second line filter 52 for interference suppression of the output signal,
• - a galvanically isolated resistor 50 and
• - Shunt Resistors 51 ,

The inverter 61 has half-bridges arranged power semiconductor switch, preferably IGBT or MOSFET switch on. In the area between inverter and control electronics is a first capacitor 21 an intermediate circuit and a second capacitor 29 as an auxiliary capacitor. In particular, this arrangement provides a large spatial distance between inverters 61 and control electronics achieved.

The signal transmission between the control electronics and power electronics takes place by means of galvanically isolating the first optocoupler 34 for control signals and galvanically isolating second optocoupler 35 for measuring signals. In particular, the circuit board 12 in the area between control electronics and power electronics in all levels, free of conductor tracks, ie metallic layers. The optocouplers 34 and 35 are over parallel lines 60 with the inverter 61 connected. The processing of the switching network is carried out by means of a transformer 30 ,

The heat sink 1 is in the field of power electronics, it covers the line filters 22 and 52 as well as the resistance 50 and the shunts 51 and the inverter 61 , The heat sink 1 extends over the entire length of the circuit board 12 from the first connector part 27 to the second connector part 31 ,

Here is the heat sink 1 reduced vibration with the circuit board 12 on which the connector parts 27 and 31 are arranged, connected. This is in particular the connection of the heat sink 1 with the first circuit board section 3 advantageous because vibrations by means of the tongue-like design of the first circuit board section 3 be compensated. By means of the vibration-reduced connection of the heat sink 1 with the circuit board is also the reliability of the connector parts 27 and 31 improved, since these are less strongly vibrated during operation occurring vibrations of the electrical appliance, whereby the risk of loss of contact is reduced.

In addition, the circuit board 12 Made of flexible, sound-absorbing material, allowing the over the heat sink 1 In particular, the structure-borne noise coupled with the fan is damped and thus the connectors with the connector parts 27 and 31 vibrationally relieved. As described above, the temperature sensor is also 5 Vibration decoupled from the sound-carrying part, so the vibration-inducing heat sink 1 with rigidly connected fan. In this way, therefore, the electrical contacting of the supply lines and motor leads and the sensors is vibration technology decoupled from the sound source, in particular vibration source.

The prototype of the heat sink 1 is produced by continuous casting and from it the heat sink 1 generated by further processing. In particular, the heat sink is manufactured in one piece. The continuous casting profile has a base plate on which extending in the continuous casting direction of air conduction, which as cooling fins 26 act, and a plate-like, extending in a continuous casting back wall, so back plate 25 , are integrally formed. Preferably, the back plate 25 formed perpendicular to the base plate.

The heat sink 1 has one or more cooling channels, which at least partially by means of the cooling fins 26 are limited. The cooling channels conduct a cooling medium flow, for example a cooling air flow driven by a fan. Preferably, two substantially parallel sides of a cooling passage by means of the cooling fins 26 limited. A base plate of the heat sink 1 delimits a third side of the cooling channel. A fourth side of the cooling channel is open and / or limited by means of a housing part.

In the field of inductance 28 is a first recess 40 in the heat sink 1 executed. This first recess 40 , preferably a round bore introduced into the continuous casting profile transversely to the continuous casting direction, divides the base plate of the cooling body 1 in two areas: a first base plate section 24 and a second base plate section 41 , Here is the first recess 40 not only in the base plate, but also in medium cooling fins 26 brought in. In particular, it protrudes on the circuit board 12 arranged inductance 28 in the first recess 40 of the heat sink 1 into it. In particular, the first recess 40 after the continuous casting of the heat sink 1 executed, preferably drilled and / or milled.

The heat sink 1 thus has a first recess 40 on to absorb the inductance 28 on.

While the cooling medium flow is flowing along the heat sink 1 or on at least one cooling channel thus a volume element of the cooling medium flow cools the inverter 61 by means of heat conduction via the heat sink 1 and at least for a period of time, the inductance 28 in which the volume element of the cooling medium flow is directly at the inductance 28 or the part of the inductance 28 in the heat sink 1 protrudes, flows along.

Laterally, the heat sink 1 through a first cooling fin 23 and a back plate 25 completed the electrical appliance. About the back plate 25 the electrical appliance is thermally connected to a control cabinet, not shown in the figures and can be cooled by means of a cooling plate, not shown in the figures, in particular cold plate. This cooling plate has, for example, channels through which a cooling medium can be guided, wherein as a cooling medium, for example, water, compressed air or oil is used.

The cooling fins 26 are preferably on the circuit board 12 opposite side of the heat sink 1 arranged. Thus, the base plate of the heat sink 1 between the cooling fins 26 and the circuit board 12 arranged. So it's the heat sink 1 between the cooling medium flow, which by means of the cooling fins 26 is passed as an air guide, and arranged the circuit board.

In further embodiments of the invention, the cooling plate on the side facing away from the electrical device surface surface enlarging structures, for example, cooling fins and / or cold fingers, which are cooled by convection.

In further embodiments of the invention, the heat sink is electrically connected to a grounded element of the cabinet.

In further embodiments of the invention, instead of the production of the heat sink 1 as a continuous casting of the heat sink 1 manufactured as a casting, wherein the first recess 40 is provided during casting. Thus, the heat sink 1 made in one piece and no reworking necessary. Preferably, a die casting method is used for casting. In particular, therefore, in a simple manner, the heat sink 1 with cold fingers as Oberflächenvergrößernde structures executable.

In further embodiments of the invention is between the heat sink 1 and the first heat-generating component, in particular the inverter 61 , An insulating arranged, wherein the insulating means on the one hand, the electrical components electrically insulated from the heat sink 1 and on the other hand, a lower heat transfer resistance from the electrical components to the heat sink 1 has as all other Wärmeleitpfade between the electrical components and the heat sink 1 , For example, thermal pads or thermal grease can be used as electrical insulation.

In further embodiments according to the invention, a further electrical insulating means, which has a higher heat transfer resistance from the electrical components to the heat sink 1 has as all other Wärmeleitpfade between the electrical components and the heat sink 1 , a recess on, that of the first recess 40 in the heat sink 1 equivalent. Thus, the first and second heat-generating component, in particular an inductance 28 and / or an inverter 61 , by the insulating agent feasible. By this insulating the underlying components of the heat sink 1 Insulated, so that they are not affected by the heat of the heat sink 1 are heated. Such an insulating means is in particular integrally executable. In addition, the insulating material is electrically insulating executable, whereby voltage flashovers of the electrical components on the heat sink 1 are preventable.

In further embodiments of the invention, the heat sink 1 made of anodized aluminum, reducing the heat emission of the heat sink 1 is increased.

In further embodiments of the invention, the circuit board 12 and the heat sink 1 by means of a frame part 42 are connected, arranged in a housing. This housing has a housing wall, which is preferably made of electrically non-conductive material, in particular plastic.

In further embodiments of the invention, the housing has circulation means such as ventilation slots and flow channels to increase the heat transfer to the surrounding medium.

By means of these ventilation slots, the components arranged in the low voltage range can also be cooled. In this case, the heat of the components arranged in the low-voltage region is radiated to the air located in the interior of the housing. This air is convectionally replaced by the ventilation slots with the cooler outside air. The invention thus teaches a cooling concept which encompasses the entire electrical appliance and which is the cooling of the inverter 61 and the inductance 28 by means of the heat sink and the cooling of the microcontroller 20 by means of convection through the ventilation slots.

In further embodiments of the invention, the electrical device is air cooled by a fan. For this purpose, the ventilation current of the fan on the cooling fins 26 and thereby dissipates the heat to the ambient air.

In further embodiments of the invention, the electrical appliance is mounted vertically, in particular mounted such that the cooling fins extend in the vertical direction, so that the air circulation through the cooling fins is improved by a chimney effect. By vertical is meant here that the direction of the cooling medium flow is substantially parallel to the gravitational field vector. The deviation from the parallelism is less than 20 °, in particular less than 10 °, preferably less than 5 °.

LIST OF REFERENCE NUMBERS

1

heatsink

2

holder

3

first printed circuit board section

4

screw

5

temperature sensor

10

second recess

11

contact area

12

circuit board

13

conductor tracks

14

via

20

microcontroller

21

first capacitor

22

first line filter

23

first cooling fin

24

first base plate section

25

backplate

26

cooling fins

27

first connector part

28

inductance

29

second capacitor

30

transformer

31

second connector part

32

first connection device

33

second connection device

34

first optocoupler

35

second optocoupler

36

third connection device

37

fourth connection device

40

first recess

41

second base plate section

42

frame part

50

resistance

51

shunt resistor

52

second mains filter

60

cables

61

inverter

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 19538642 A1 [0003]
• DE 3710198 A1 [0004]
• US 5940272 A [0005]
• DE 102007058706 A1 [0006]
• US 6411514 B1 [0007]
• US 20050146851 A1 [0008]
• JP 2007311697 A [0009]
• US 5740013A [0010]
• DE 3903615 A1 [0011]
• DE 4325499 C2 [0012]

Claims (17)

Arrangement, in particular cooling arrangement, for cooling heat-generating components, comprising - a printed circuit board ( 12 ), on which a first and a second heat-generating component are arranged, and - a heat sink ( 1 ) with air guiding means which at least partially delimit one or more cooling channels, wherein the heat sink ( 1 ) is thermally conductively connected to the first heat-generating component, wherein the second heat-generating component projects at least partially into a partial region of the cooling channel or into a respective sub-region of the plurality or all of the cooling channels, wherein the air-conducting means on the surface of the printed circuit board ( 12 ) facing away from the heat sink ( 1 ) are arranged. Arrangement, in particular cooling arrangement, for cooling heat-generating components, comprising - a printed circuit board ( 12 ), on which a first heat-generating component and a second heat-generating component are arranged, in particular which is equipped with a first and a second heat-generating component, and - a heat sink ( 1 ) with air guiding means for guiding a cooling medium flow, wherein the heat sink ( 1 ) is thermally conductively connected to the first heat-generating component, wherein the air guiding means are adapted to guide the cooling medium flow along the second heat-generating component, for discharging the heat generated by the second heat-generating component to the environment, - between the cooling medium flow and the circuit board ( 12 ) the heat sink ( 1 ) is arranged, in particular wherein the circuit board ( 12 ) on the side of the heat sink ( 1 ) is arranged, which from the cooling medium flow side facing the heat sink ( 1 ) is remote, - and / or wherein the first heat-generating component on the side facing away from the cooling medium flow side of the heat sink ( 1 ), in particular wherein the cooling medium flow from the circuit board ( 12 ) by means of the heat sink ( 1 ) is separated, - and / or wherein the air conduction on the of the circuit board ( 12 ) facing away from the heat sink ( 1 ) are arranged. Arrangement according to claim 2, characterized in that the arrangement, in particular the heat sink ( 1 ) of the arrangement, one or more cooling channels, which are at least partially limited by means of air guiding means of the heat sink ( 1 ), wherein one or more or all of the cooling channels are arranged and / or arranged such that the cooling medium flow in the cooling channel or the cooling channels, in particular during the Entlangströmens in the cooling channel, heat dissipates heat from the first heat-generating component and at least partially derived heat from the second heat-generating component. Arrangement according to claim 2, characterized in that the arrangement, in particular the heat sink ( 1 ) of the arrangement, one or more cooling channels, which are at least partially limited by means of air guiding means of the heat sink ( 1 ), wherein the second heat-generating component projects into a partial region of the cooling channel or into a respective partial region of the plurality or all of the cooling channels. Arrangement according to one of the preceding claims, characterized in that the first heat-generating component on the side facing away from the cooling medium flow side of the heat sink ( 1 ) with the heat sink ( 1 ) is thermally conductively connected, and / or wherein the first heat-generating component between the circuit board ( 12 ) and the heat sink ( 1 ) is arranged, in particular wherein thermal compound is interposed between the heat sink ( 1 ) and the first heat-generating component. Arrangement according to one of the preceding claims, characterized in that the second heat-generating component by a first recess ( 40 ) of the heat sink ( 1 ) protrudes into the cooling medium flow, in particular wherein the second heat-generating component as inductance ( 28 ) is executed, in particular as a throttle and / or that the heat sink ( 1 ) is spaced from the second heat generating component, and / or that the heat sink ( 1 ) a first recess ( 40 ) has for receiving the second heat-generating component, in particular for receiving the inductance ( 28 ). Arrangement according to one of the preceding claims, characterized in that the heat sink ( 1 ) has a base plate, on the cooling fins ( 26 ) are pronounced as an air guide, in particular in one piece or two pieces, and / or that the heat sink ( 1 ) Has cooling fingers, in particular act as Oberflächenvergrößernde structures, and / or that the heat sink ( 1 ) is made of metal, in particular of aluminum, in particular of anodized aluminum. Arrangement according to one of the preceding claims, characterized in that the first recess ( 40 ) through the base plate and into a first cooling fin ( 23 ), wherein a second cooling fin of the first recess ( 40 ), in particular wherein the first recess ( 40 ) into the heat sink ( 1 ) introduced round hole, in particular a milled or drilled round hole. Arrangement according to one of the preceding claims, characterized in that the heat sink ( 1 ) is designed as a continuous casting profile, in particular wherein the first recess ( 40 ) is introduced into the continuous casting profile transversely to the continuous casting direction round hole, in particular a milled or drilled round hole. Arrangement according to one of the preceding claims, characterized in that the heat sink ( 1 ) a plate-like, in a continuous casting extending back plate ( 25 ), in particular which is executed perpendicular to the base plate, in particular wherein the back plate ( 25 ) is thermally connected to a cooling plate, in particular with a cooling plate arranged in a control cabinet, in particular wherein the cooling plate has cooling channels, through which a further cooling medium, in particular water, compressed air or oil, can be guided. Arrangement according to one of the preceding claims, characterized in that the arrangement comprises a printed circuit board ( 12 ), in particular a single printed circuit board ( 12 ), wherein the printed circuit board ( 12 ) has a low voltage region and a high voltage region, wherein the heat sink ( 1 ) is arranged in the high voltage region. Arrangement according to one of the preceding claims, characterized in that between heat sink ( 1 ) and printed circuit board ( 12 ) is arranged, which has at least two recesses through which the first and the second heat generating component protrude through, in particular wherein the insulating agent acts electrically insulating, in particular a higher electrical insulation strength and / or dielectric strength than air, in particular wherein each recess of the Insulating means with the respective recess of the heat sink ( 1 ), wherein the insulating means has a lower thermal conductivity than air, in particular therefore the heat dissipation of the printed circuit board ( 12 ) Improves towards the environment, in particular a housing of the arrangement. Arrangement according to one of the preceding claims, characterized in that a frame the heat sink ( 1 ) mechanically, in particular mechanically rigid, with the printed circuit board ( 12 ), in particular wherein the frame is formed as a housing part and / or wherein the frame is at least partially housing-forming, wherein the frame with the circuit board ( 12 ) is mechanically connected, in particular mechanically rigidly connected, and / or that a cooling medium flow driven by a fan at a surface region of the heat sink ( 1 ) flows past the heat sink to the ambient air, and / or that of the heat sink ( 1 ) directed cooling medium flow is convectively driven and directed vertically, in particular wherein the cooling fins ( 26 ) extend vertically, and / or that heat sink ( 1 ) and printed circuit board ( 12 ) are at least partially surrounded by a housing part, in particular a housing part of electrically non-conductive material, in particular wherein the housing part circulation means, in particular ventilation slots and / or flow channels, and / or mounting means for a device for increasing the heat transfer to the surrounding medium, in particular Fan, in particular wherein the heat of a component arranged in the low-voltage component by means of the air in the interior of the housing part, which is exchangeable by the circulation means in the housing part with the surrounding medium, to the environment is derived. Arrangement according to one of the preceding claims, characterized in that a temperature sensor ( 5 ) with the heat sink ( 1 ) is thermally conductively connected, and / or that the temperature sensor ( 5 ) on the circuit board ( 12 ) is arranged, and / or that the circuit board ( 12 ) a first ( 3 ) and a second printed circuit board section, in particular wherein the first printed circuit board section ( 3 ) is connected to the second printed circuit board section via such a small connection region that it can be deflected elastically to it, in particular is deflected, and / or that the temperature sensor ( 5 ) on the first circuit board section ( 3 ), and / or that between the heat sink ( 1 ) and the first circuit board section ( 3 ) a holding device ( 2 ) is arranged, and / or that the connection area and a second recess ( 10 ) the first ( 3 ) and second printed circuit board section, in particular wherein the second recess ( 10 ) as a cutout in the printed circuit board ( 12 ) is executed, and / or that the second recess ( 10 ) with the connection area the first circuit board section ( 3 ) at least partially surrounds and / or framed, in particular wherein the second recess ( 10 ) completely in the printed circuit board ( 12 ) is arranged and / or the second recess ( 10 ) from the edge of the printed circuit board ( 12 ) is executed and / or the second recess ( 10 ) in the edge of the printed circuit board ( 12 ) and / or the second recess ( 10 ) deeper into the PCB ( 12 ) extends as the width of the first circuit board portion, and / or that the heat sink ( 1 ) and the holding device ( 2 ) are thermally conductively connected, in particular wherein the holding device ( 2 ) is made of metal, preferably of aluminum. Arrangement according to one of the preceding claims, characterized in that the printed circuit board ( 12 ) is executed in several layers, in particular designed as a multilayer printed circuit board and / or has inner layers, in particular wherein the printed circuit board ( 12 ) is equipped in SMD technology and / or by means of push-through mounting, and / or the temperature sensor ( 5 ) is equipped in SMD technology, and / or that metallic areas, in particular layers, in the first circuit board section ( 3 ) are arranged, in particular on the top and / or bottom and / or the inner layers of the printed circuit board ( 12 ), in particular wherein the metallic regions are used as interconnects ( 13 ) of the printed circuit board ( 12 ) are executed, in particular conductor tracks ( 13 ) made of copper-containing material, in particular tinned copper conductor tracks, wherein the holding device ( 2 ) contacts one of the metallic regions, and / or that a third recess in the first printed circuit board section (FIG. 3 ) is provided, in particular a metallic plated through hole, in particular made of copper-containing material, in particular tinned copper, in particular wherein a metallic region of the printed circuit board ( 12 ) is connected to the wall of the via, in particular wherein the holding device ( 2 ) touches the wall of the via, and / or that the temperature sensor ( 5 ) on the heat sink ( 1 ) facing side of the circuit board ( 12 ), wherein the temperature sensor ( 5 ) with the printed circuit board ( 12 ) is connected via solder joints, and / or that the temperature sensor ( 5 ) Has pads for electrical contacting and a temperature sensing surface, in particular wherein the temperature sensing surface of the temperature sensor ( 5 ) soldered to a metallic area on the circuit board ( 12 ), which extends into the wall of the via, and / or that the connection of the holding device ( 2 ) with the first circuit board section ( 3 ) is detachable, in particular screw-connected, in particular a threaded bore in the holding device ( 2 ) is provided, which receives a fastening screw, in particular its screw head a metallic region of the printed circuit board ( 12 ), and / or that the holding device ( 2 ) with the heat sink ( 1 ) is firmly connected and / or materially connected, in particular via a rivet, or that the holding device ( 2 ) with the heat sink ( 1 ) is releasably connected via a screw-toothed part, and / or that the holding device ( 2 ) is designed as a bolt and / or a spacer sleeve and / or a metallic washer between the heat sink ( 1 ) and the first circuit board section ( 3 ) is arranged or are. Electric appliance, in particular a converter for supplying an electric motor, in particular an asynchronous motor and / or synchronous motor, comprising an arrangement according to one of the preceding claims. Using a heat sink ( 1 ) for guiding a cooling medium flow in an electrical appliance, wherein the cooling medium flow along air guiding means of the heat sink ( 1 ), one with the heat sink ( 1 ) is cooled thermally conductively connected first heat-generating component, wherein the cooling medium flow is conducted along a second heat-generating component at least in sections, the first and the second heat-generating component being mounted on a printed circuit board ( 12 ) are arranged, in particular between the printed circuit board ( 12 ) and the cooling medium flow of the heat sink ( 1 ), in particular wherein the heat sink ( 1 ) is used for an arrangement according to one of claims 1 to 15.

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