DE102010038684A1 - Power supply device for motor car, has cooling arrangement comprising cooling passages in heat guidance profile, where arrangement is pressed by spring assembly that is placed between bottom portion of housing and cooling arrangement - Google Patents

Abstract

The device (1) has an energy storage module (10) i.e. battery, comprising a set of prismatic memory cells (12) that are stacked one behind the other and electrically interconnected with one another. A bottom portion (14) of the cells is in thermal contact with a cooling arrangement (30). The arrangement comprises a set of cooling passages (32, 33, 34, 35) in a heat guidance profile (31), where the arrangement is pressed by a spring assembly (40) that is placed between a bottom portion (50) of a housing and the arrangement. The bottom portion is fixed relative to the storage module. The memory cells are electrochemical cells.

Description

The invention relates to a device for power supply, in particular of a motor vehicle, with at least one energy storage module, which is formed of a plurality of prismatic memory cells, stacked at least in a row, arranged one behind the other and electrically interconnected, wherein the memory cells of the at least one energy storage module bottom side in thermal contact with a cooling arrangement.

In a device usually referred to as a battery for supplying power to a motor vehicle, a plurality of energy storage modules are usually used to drive vehicles, for example electric vehicles or hybrid vehicles. A respective energy storage module typically consists of several stacked prismatic storage cells. The individual memory cells contain electrochemical cells of the battery. The stack of individual memory cells is usually clamped to the energy storage module via a mechanical end plate and tie rods. The end plates and tie rods serve in addition to the mechanical fixation of the modules to each other in particular to counteract deformation by gas pressure changes, which occur during operation in the arranged inside the modules electrochemical cells. Such energy storage modules usually required cooling to ensure the required operating temperature.

From the DE 10 2006 010 063 A1 a cooling device for a vehicle battery is known, in which a bottom-side liquid cooling of a plurality of individual approximately rod-shaped battery cells is provided. The liquid cooling is realized by a base housing having a sealed and liquid-tight coolant space with an inlet and an outlet for a cooling liquid, for. As cooling water, and is pressure-tight and explosion-proof. An advantage of this approach is that the battery or a completed energy storage module can be manufactured with a small number of components. However, the base housing is expensive and expensive to manufacture due to its complex shape.

A bottom-side cooling of memory cells of an energy storage module is further from the EP 2 068 390 A1 known. In the embodiments proposed therein, the cooling arrangement is fixed to a memory cell stack consisting of prismatic memory cells. A disadvantage of this approach is that the energy storage module and the cooling arrangement must be prefabricated to a semi-finished before further processing can take place.

It is therefore an object of the present invention to provide a device for power supply, in particular of a motor vehicle, which allows a simplified handling and thus lower manufacturing costs with efficient cooling of the memory cells of the device.

This object is achieved by a device for power supply according to the features of claim 1. Advantageous embodiments will be apparent from the dependent claims.

The invention provides a device for supplying voltage, in particular of a motor vehicle, with at least one energy storage module, which is formed from a plurality of prismatic memory cells which, at least stacked in a row, arranged one behind the other and electrically interconnected, wherein the memory cells of the at least one energy storage module on the bottom side in thermal contact with a cooling arrangement.

According to the invention, the cooling arrangement has a number of round tubes which are arranged in a heat conduction profile and conductively connected to this heat. Furthermore, the cooling arrangement is pressed by a spring arrangement substantially flat against the bottom of the memory cells, wherein the spring arrangement is arranged between a housing bottom of the device and the cooling arrangement and is supported on the housing bottom of the device, and wherein the housing bottom is fixed relative to the at least one energy storage module is.

Due to the simple tension and the planar structure of the cooling arrangement, the mounting of the cooling arrangement in the device for power supply is simple and reliable. Compared with other variants in which the cooling arrangement has to be connected, for example via a tensioning device or other holding means, to the at least one energy storage module, the device according to the invention has a weight advantage. The use of a spring arrangement represents a cost-effective solution both from the use of materials and from the production costs of the cooler. The spring arrangement ensures that the cooling arrangement, which has particularly simple and cost-effective round tubes, is pressed flat against the bottom of the storage cells. This ensures a uniform cooling of the memory cells of the at least one energy storage module.

According to an expedient embodiment, the spring arrangement comprises a number of spring elements, which presses the cooling arrangement on the bottom of the memory cells of the at least one energy storage module in the area between in each case two cooling channels. By the number of spring elements can be determined to which and how many sections the cooling arrangement is pressed to the bottom of the memory cells. The number of spring elements can be selected, for example, depending on the required biasing force and / or the size of the cooling arrangement in order to achieve a good thermal contact between the cooling arrangement and the energy storage module (s). The choice of the number of spring elements can also be done from the standpoint of the cost of each spring element and the introduced by each additional spring element additional weight. The "correct" choice of the number of spring elements can be found by a calculation or a simple test.

According to a further embodiment, it is provided that the spring elements have in a section transversely to the longitudinal direction resilient legs or wings, which are supported on the housing bottom and generate a deformation acting in the direction of the memory cell force. In order to obtain elastic and pressure-generating properties, it is advantageous if the spring elements made of plastic or a metal, for. As steel, are made. The geometry of the legs or wings, in particular their length and / or their cross section, the elastic properties can be determined in a manner known to those skilled in the elastic properties.

To facilitate handling during assembly of the device according to the invention, it is expedient if the spring arrangement is prefixed to the cooling arrangement. For example, the individual spring elements may be fastened to the cooling arrangement via a clip connection. Corresponding projections or noses can be formed in the production of the cooling arrangement at this.

According to a further expedient embodiment, the cooling arrangement with the energy storage module and / or with the housing bottom over the application of force by the spring arrangement also has no further mechanical connection. This means that no prefabrication of a semifinished product, consisting of energy storage module and cooling arrangement or cooling arrangement and housing and the like, must be provided. All individual components can be provided when introducing the device for power supply in a vehicle and then installed there. As a result, the assembly is much easier.

According to a further expedient embodiment, the heat conduction profile comprises a plate which is pressed by the spring arrangement to the bottom of the memory cells, wherein the round tubes are in thermal contact with the plate. The round tubes can be materially connected to the plate, for example by soldering or welding. Likewise, the round tubes could be connected via a thermally conductive adhesive to the plate in order to obtain a mechanical and thermal connection. About the plate provided by the round tubes cooling power can be introduced over a large area evenly into the bottom of the memory cell. The plate preferably has an area adapted to the surface of the bottom of the at least one energy storage module. Alternatively, a plurality of juxtaposed plates could be thermally connected to the bottom of the at least one energy storage module. The plurality of plates may optionally be mechanically and / or thermally interconnected. The plate is preferably made of a metal, e.g. As aluminum or steel or their alloys, formed, but also any other good heat conductive material or material composition in question.

In an advantageous development, the plate has flags on the main surface facing away from the memory cells, wherein a respective round tube is assigned at least one flag, wherein a respective round tube is in thermal contact with the at least one flag as well as with the plate. In particular, between each two flags a round tube is arranged, which is in thermal contact both with the two flags and with the plate. As a result, the thermal connection of a respective round tube to the plate can be improved.

In the original state, d. H. before the finished assembly to the device, the plate has a flat, in particular flat or cambered, and the memory cell facing surface. A flat, the memory cell facing surface of the plate provides inherently good thermal contact with the bottom of the memory cells. Alternatively, it may be provided that the surface of the cooling arrangement facing the storage cells is cambered, ie H. bulging, execute. When assembling the individual components, the cooling arrangement is acted upon by the spring arrangement with a force, so that this crowning is depressed and leveled. This results in an optimized thermal transition between the cooling arrangement and the at least one energy storage module.

To provide a weight-optimized cooling arrangement, the cooling arrangement has in a further embodiment in the region between two adjacent extending cooling channels at least one recess.

To further improve the thermal transition between the energy storage module and the cooling arrangement, an elastic and / or heat-conducting coating is provided between the bottom of the storage cells of the at least one energy storage module and the cooling arrangement. The coating may be formed for example in the form of a film or an adhesive. The elasticity of the coating compensates for unevenness or surface roughness of the adjacent components, thereby providing a uniform thermal transition over the entire surface.

According to a further expedient embodiment, the energy storage module with the housing bottom of the device non-positively and / or positively connected to each other. In this way, the cooling arrangement can be "clamped" together with the spring arrangement between the at least one energy storage module and the housing bottom, so that the desired surface contact between the cooling arrangement and the bottom of the storage cells results. Preferably, a releasable connection, in the form of screws, is used to allow easy replacement of respective components in the event of a defect.

In a further advantageous embodiment, the cooling channels are formed in the cooling arrangement such that under each of the memory cells of the at least one energy storage module, an equal number of leading to a cooling medium forward and return lines is provided. As a cooling medium, a coolant (single-phase liquids, such as water-glycol mixture) or refrigerants, such. R134a, R1234yF or R744. Refrigerants include those media that change their state of aggregation during the heat exchange process.

An equal number of cooling medium leading return lines allows a symmetrical arrangement of the cooling medium leading channels. This ensures a uniform heat dissipation from the memory cells. In particular, this can fulfill a requirement according to which all memory cells of an energy storage module may have a maximum temperature difference of 5 Kelvin between one another.

The invention will be explained in more detail below with reference to an embodiment in the drawing. Show it:

1 a schematic representation of a device according to the invention for power supply in a cross-sectional view,

2 a schematic representation of an energy storage module and a cooling arrangement prior to assembly, and

3 a schematic representation of the inventive device for power supply according to 1 from underneath.

In 1 is a single prismatic memory cell 12 a in its entirety a plurality of at least one stacked in a row, arranged one behind the other and electrically interconnected memory cells having energy storage module 10 to recognize in a side view. The memory cell 12 typically consists of one or more individual electrochemical cells, which in the representation chosen here inside the memory cell 12 lie in secret. For example, on a front page 20 indicates the memory cell 12 Connection terminals first and second polarity on. The connection terminals are not shown in the figure. On the with the reference number 14 marked back of the memory cell 12 which is a bottom of the memory cell 12 represents, no connection terminals are provided. One of the connection terminals, typically the positive pole of the memory cell, may be electrically connected to a housing of the memory cell 12 be connected. The housing of the memory cell 12 is preferably made of a good heat conducting material, usually aluminum.

The energy storage module 10 consists, as already explained, of a plurality of memory cells, which are stacked at least in a row, arranged one behind the other and electrically interconnected so that a predetermined voltage is reached. A power supply device according to the invention comprises at least one such energy storage module.

The memory cells (of which in 1 only one is recognizable) of the energy storage module 10 are on the bottom side in thermal contact with a cooling arrangement 30 , In principle, exactly one energy storage module can be assigned to the cooling arrangement. Likewise, a plurality of energy storage modules may be in thermal contact with the cooling arrangement.

The cooling arrangement 30 includes a heat conduction profile 31 and exemplarily four cooling medium-conducting round tubes 32 . 33 . 34 . 35 , The heat conduction profile 31 includes a plate 38 , on the flags running in pairs parallel to each other 39 are arranged. The plate 38 and the flags 39 can be one piece be educated. For example, such a heat conduction profile can be created by an extrusion process. Likewise, the flags can 39 by a cohesive manufacturing process, such. As soldering or welding, with the plate 31 be connected. The plate 31 and the flag 39 consist of a thermally good heat conductive material such. B. a metal. In particular, steel or aluminum come into consideration.

Between each two of the flags 39 is a round tube 32 . 33 . 34 . 35 intended. A respective round tube 32 . 33 . 34 . 35 stands with both the plate 38 as well as with the flags assigned to him 39 in thermal contact. As a result, the thermal connection of a respective round tube, in which the cooling medium is guided, optimized to the Wärmeleitprofil.

In an alternative embodiment, each round tube could also be assigned only a single flag.

In a further, not shown alternative, the cooling arrangement could also only from the plate 31 and the thermally connected with this round tubes 32 . 33 . 34 . 35 be formed.

The round tubes can cohesively with the plate and / or the flags 39 be connected. For example, the round tubes 32 . 33 . 34 . 35 be soldered or welded with these components. Likewise, the round tubes 32 . 33 . 34 . 35 via a thermal adhesive with the plate and / or the flags 39 be connected to the mechanical and thermal connection to the Wärmeleitprofil 31 to obtain. Likewise, the round tubes could 32 . 33 . 34 . 35 and the plate and the optional flags are integrally made of the same material by an extrusion process.

The round tubes 32 . 33 . 34 . 35 may be in the presence of the flags extending away from the memory cells 39 also be pressed only in the between the flags arranged in pairs. For this purpose, the distance between two adjacent flags 39 and the outer diameter of the round tubes in a manner known to those skilled adapt to each other.

About the plate is the of the round tubes 32 . 33 . 34 . 35 provided cooling power area provided for cooling the memory cells via the bottom thereof. The plate 31 preferably has one to the surface of the bottom of the number of memory cells 12 or the at least one energy storage module 10 on. This is exemplary in the cross-sectional representation of 1 illustrated.

Alternatively, a plurality of plates arranged next to one another can be thermally connected to the bottom of the at least one energy storage module. Several plates can be mechanically and / or thermally connected to each other.

In the embodiment (see. 3 ) run the four cooling channels 32 . 33 . 34 . 35 parallel to each other. The cooling channels can in principle run in any desired manner to one another. They also need not be straight formed in sections, but may also extend in curves, wavy, etc.

Through the cooling channels 32 . 33 . 34 . 35 is used to cool the memory cells 12 passed a cooling medium. Coolant or refrigerant can be considered as cooling medium. Coolants are single-phase liquids, such as. As a water-glycol mixture. As a refrigerant, for example, R134a, R1234yF or R744 can be used. Generally, refrigerants are media that change their state of aggregation during a heat exchange process.

The cooling arrangement 30 is by a spring arrangement 40 flat to the ground 14 the memory cells 12 of the energy storage module 10 pressed. Here is the spring arrangement 40 between a housing bottom 50 and the cooling arrangement 30 arranged. The caseback 50 serves to accommodate a device for power supply 1 which typically includes a plurality of energy storage modules described herein 10 includes. The spring arrangement 40 is supported on the caseback 50 from, with the case back 50 relative to the energy storage module 10 is fixed.

The fixation of caseback 50 and energy storage module 10 via flanges 16 . 18 , which at the lateral end edges of the memory cells 12 are formed. The flanges 16 . 18 may be part of the housing of the memory cells. The flanges 16 . 18 However, as a separate components form and / or non-positively with the memory cells 12 be connected. The mechanical fixation or connection of energy storage module 10 and caseback 50 takes place, for example, not shown in the figure screws, which through the flanges 16 . 18 through into corresponding supports of the housing bottom 50 be screwed. This creates a defined distance between the housing bottom 50 and the floor 14 the memory cells 12 of the energy storage module 10 , The spring arrangement 40 in the exemplary embodiment of example three spring elements 41 or spring rails, is when connecting energy storage module 10 and caseback 50 against the cooling arrangement 30 pressed so that they are in surface contact with the ground 14 the memory cells 12 device. The result is a good heat transfer between the memory cells of the energy storage module and the cooling arrangement.

The spring elements or rails 41 have in a section transverse to the longitudinal extent (ie perpendicular to the leaf level) resilient legs or wings 42 on, which is on the case back 50 support. In order to contact the cooling arrangement to the bottom of the storage cells as extensively as possible 12 to be able to ensure the individual spring elements or spring rails 41 Furthermore, a support section 43 on which the force acting through the tension over a large area in the formed between two cooling channels surface portions of the Wärmeleitprofils 31 initiates. Deformation of the legs or wings due to the mechanical connection and the distance of the energy storage module 10 and caseback 50 becomes one in the direction of the memory cells 12 (ie perpendicular to their bottom 14 ) produces acting force. The spring elements or spring rails 41 can be made of plastic or metal, z. As steel, be formed.

In principle, it can be provided to provide a spring element or a spring rail between each two adjacent cooling channels. Likewise, as in the embodiment of the 1 is shown, between only some pairs of adjacent cooling channels, a spring element or a spring rail 41 be arranged. The number of spring rails is measured essentially according to the force required to press the Wärmeleitprofils 31 to the bottom of the storage cells 12 , The less of the spring elements or spring rails 41 used to generate the contact pressure, the easier the overall arrangement.

In the embodiment of the cooling arrangement according to the invention, the spring elements or spring rails 41 each provided between two adjacent extending round tubes. A pressing in the region of the cooling channels could under certain circumstances mean that they would be deformed due to the pressure generated by the tension and the cooling medium can no longer flow as intended through the cooling channels.

Except the fixation of the cooling arrangement generated by the tension 30 to the memory cells or the energy storage module there is no further mechanical connection of the two components to one another. This means that the cooling arrangement points with the energy storage module 10 and / or with the housing bottom 50 via the application of force by the spring arrangement 40 There is no further mechanical connection. This allows the device 1 in a simple way.

As part of the production, the heat conduction profile is first 31 with the round tubes attached 32 . 33 . 34 . 35 provided. Preferably, the spring elements or spring rails required for pressurizing are 41 on the Wärmeleitprofil 31 , more precisely their plate 38 , prefixed. Subsequently, the semi-finished product is in the size of the cooling arrangement 30 adapted housing bottom 50 inserted. Finally, a connection of the energy storage module takes place 10 with the case back 50 , whereby the necessary for a good thermal transition force for surface conditioning of cooling arrangement and energy storage module 10 is produced.

Due to the bottom-side cooling of the individual memory cells 12 by means of the cooling medium in the cooling channels 32 . 34 . 35 takes place at the bottom of the memory cells 12 a particularly strong cooling. Because the memory cells 12 with respect to the housing shell of a good thermal conductivity material such. B. aluminum, there is a good temperature compensation, whereby a cooling in the areas above the ground 14 is ensured. In this way, a uniform cooling of the memory cells 12 be ensured. In particular, it is ensured that all memory cells have a maximum temperature difference of 5 Kelvin among each other.

To the contact between the Wärmeleitprofil 31 and the floor 14 of the energy storage module 10 to optimize, the plate can 38 the Wärmeleitprofils 31 cambered, ie bulging, executed. This is exemplary in 2 shown. The plate leans 38 initially centrally and selectively in the longitudinal direction on the ground 14 the memory cells 12 of the energy storage module 10 at. At the two outer, opposite side edges of the plate 38 There is a distance between 1 mm and 3 mm to the bottom of the memory cells 12 , wherein the distance depends on the width of the memory cell. The width is here between the flanges 16 and 18 formed length. By the described tension of the Wärmeleitprofils or the plate via the energy storage module 10 and the case back 50 the crown is depressed and leveled. This results in an optimized thermal connection of the Wärmeleitprofils to the memory cells 12 ,

Optionally, to the heat transfer of heat transfer profile 31 to the bottom of the memory cells 12 To optimize and compensate for material tolerances, an elastic, warm conductive coating can be provided. This will be between the plate 38 and the floor 14 the memory cells 12 arranged. The coating may be formed as a film or adhesive layer.

For weight loss, the plate can 38 in the area between each two adjacent cooling channels 32 . 33 . 34 . 35 have one or more recesses. The number, size and arrangement of the recesses is selected depending on a necessary heat conduction of the Wärmeleitprofils in this area.

To get the best possible temperature compensation on the ground 14 the memory cells 12 To ensure it is advantageous, the cooling medium leading cooling channels symmetrically under the storage cells 12 to arrange the energy storage module. Under each memory cell thus the same number of return and return lines for the cooling medium are arranged. This is exemplary in 3 represented an energy storage module 10 from below, in the exemplary six in a row successively arranged memory cells 12 are shown. It can be seen that exemplarily four parallel round tubes 32 . 33 . 34 . 35 are provided. The round tubes 32 and 34 put a forward, the round tubes 33 . 35 a return conductor for the cooling medium. The round tubes 32 . 33 are over a diversion 36 , the round tubes 34 . 35 over a diversion 37 connected with each other. The diversion 36 . 37 takes place outside the bottom of the memory cells 12 , The cooling medium flow is shown by the arrows.

In the exemplary embodiments described in the figures, the energy storage module is composed of a total of six storage cells arranged one behind the other 12 educated. In practice, for. B. a total of twelve memory cells formed in two rows of six memory cells arranged one behind the other. The number of rows and the number of successively arranged memory cells are determined by the total voltage to be reached in an energy storage module. It is obvious to a person skilled in the art that deviating numbers and arrangements could also be chosen.

LIST OF REFERENCE NUMBERS

1

Device for power supply

10

Energy storage module

12

memory cell

14

Bottom of the storage cell

16

flange

18

flange

20

front

30

cooling arrangement

31

heat-conducting profile

32

round tube

33

round tube

34

round tube

35

round tube

36

Deflection for round tube

37

Deflection for round tube

38

plate

39

Banner, flag

40

spring assembly

41

Bungee / spring rail

42

Leg / wing of the spring element

43

bearing section

50

caseback

QUOTES INCLUDE IN THE DESCRIPTION

This list of the documents listed by the applicant has been generated automatically and is included solely for the better information of the reader. The list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions.

Cited patent literature

• DE 102006010063 A1 [0003]
• EP 2068390 A1 [0004]

Claims (11)

Contraption ( 1 ) to the power supply, in particular of a motor vehicle, with at least one energy storage module ( 10 ) consisting of several prismatic memory cells ( 12 ), which are stacked to at least one row, arranged one behind the other and electrically interconnected, wherein the memory cells ( 12 ) of the at least one energy storage module ( 10 ) on the bottom side in thermal contact with a cooling arrangement ( 30 ), characterized in that - the cooling arrangement ( 30 ) a number of round tubes ( 32 . 33 . 34 . 35 ), which in a Wärmeleitprofil ( 31 ) are arranged and conductively connected to this heat, and - the cooling arrangement ( 30 ) by a spring arrangement ( 40 ) substantially flat to the ground ( 14 ) of the memory cells ( 12 ) is pressed, wherein the spring arrangement ( 40 ) between a housing bottom ( 50 ) of the device and the cooling arrangement ( 30 ) is arranged and at the housing bottom ( 50 ) of the device is supported, and wherein the housing bottom ( 50 ) relative to the at least one energy storage module ( 10 ) is fixed. Device according to claim 1, characterized in that the spring arrangement ( 40 ) a number of spring elements ( 41 ), which in the area between each two round tubes ( 32 . 33 . 34 . 35 ) of the heat conduction profile ( 31 ) to the ground ( 14 ) of the memory cells ( 12 ) of the at least one energy storage module ( 10 ) presses. Device according to claim 2, characterized in that the spring elements ( 41 ) in a section transverse to the longitudinal direction resilient legs / wings, which on the housing bottom ( 50 ) and when deformed one in the direction of the memory cells ( 12 ) generate acting force. Device according to one of the preceding claims, characterized in that the spring arrangement ( 40 ) on the cooling arrangement ( 30 ) is prefixed. Device according to one of the preceding claims, characterized in that the cooling arrangement ( 30 ) with the energy storage module ( 10 ) and / or with the housing bottom ( 50 ) via the application of force by the spring arrangement ( 40 ) has no further mechanical connection. Device according to one of the preceding claims, characterized in that the Wärmeleitprofil ( 30 ) a plate ( 31 ), which is pressed by the spring assembly to the bottom of the memory cells, wherein the round tubes ( 32 . 33 . 34 . 35 ) with the plate ( 31 ) are in thermal contact. Apparatus according to claim 6, characterized in that the plate on the of the memory cells ( 12 ) facing away from the main surface flags ( 39 ), wherein a respective round tube is associated with at least one flag, wherein a respective round tube ( 32 . 33 . 34 . 35 ) with both the at least one flag ( 39 ) as well as with the plate ( 31 ) is in thermal contact. Device according to one of the preceding claims, characterized in that the cooling arrangement ( 30 ) in the region between two adjacent cooling channels ( 32 . 33 . 34 . 35 ) the cooling arrangement ( 30 ) has at least one recess. Device according to one of the preceding claims, characterized in that an elastic and / or heat-conductive coating between the ground ( 14 ) of the memory cells ( 12 ) of the at least one energy storage module ( 10 ) and the cooling arrangement ( 30 ) is provided. Device according to one of the preceding claims, characterized in that the energy storage module ( 10 ) with the housing bottom ( 50 ) Of the device non-positively and / or positively connected with each other. Device according to one of the preceding claims, characterized in that the cooling channels ( 32 . 33 . 34 . 35 ) in the cooling arrangement ( 30 ) are formed such that under each of the memory cells ( 12 ) An equal number of leading to a cooling medium forward and return lines is provided.

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