CN223260571U - A semiconductor wafer loading and alignment mechanism - Google Patents

Abstract

The utility model discloses a feeding and aligning mechanism for a semiconductor wafer, and relates to the technical field of wafer processing. This a material loading alignment mechanism for semiconductor wafer is including setting up the alignment unit on the material loading support, and the material loading support includes bottom plate, standing board and loading board constitution, and standing board is located between bottom plate and the loading board, and the alignment unit is including fixed connection at the first guide rail pole between two sets of standing boards and the pushing away platform of sliding connection on first guide rail pole, is equipped with the push rod on pushing away the platform, is equipped with buffer unit between pushing away platform and the push rod. This a material loading alignment mechanism for semiconductor wafer sets up alignment unit on the material loading support, realizes that the arm is placing the semiconductor wafer back on the material loading platform, automatic location alignment, alignment unit overall structure is simple, convenient operation guarantees that semiconductor wafer position is stable to make follow-up processing detection effect good.

Description

Material loading and aligning mechanism for semiconductor wafer

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a material loading and aligning mechanism for a semiconductor wafer.

Background

In the wafer production process, each processing step needs to be carried out with a unified reference so as to ensure the processing precision. Alignment ensures that all wafers have the same reference during processing, thereby avoiding processing errors.

At present, in the process of aligning semiconductor wafers, a mechanical arm or a clamping device is generally adopted to accurately grasp the wafers and place the wafers on a preset platform, the platform is generally provided with a sucker for adsorption, after long-time use, the positioning process of the mechanical arm may have deviation, so that a wafer placed on the platform has tiny position deviation, thereby reducing the processing detection effect of the wafer.

Disclosure of utility model

Aiming at the defects of the prior art, the utility model provides a loading and aligning mechanism for a semiconductor wafer, an aligning unit is arranged on a loading bracket to realize automatic positioning and aligning of a mechanical arm after the semiconductor wafer is placed on a loading platform, the whole structure of the aligning unit is simple, the operation is convenient, meanwhile, the aligning unit adopts the design of a buffer component, so that elastic buffer is provided when a push rod pushes the wafer to move and align, the wafer is prevented from being damaged due to overlarge stress, the stability is good, the position of the semiconductor wafer is ensured to be stable, and the subsequent processing detection effect is good.

The utility model is realized by the following technical scheme that the aligning mechanism for the semiconductor wafer comprises an aligning unit arranged on a feeding bracket, wherein the feeding bracket comprises a bottom plate, a standing plate and a bearing plate, the standing plate is positioned between the bottom plate and the bearing plate, and the aligning unit comprises a first guide rail rod fixedly connected between two groups of standing plates and a pushing table slidingly connected on the first guide rail rod;

The driving motor is fixedly connected to the standing board, a double-thread screw rod is arranged at the output end of the driving motor, and the double-thread screw rod is in threaded connection with the pushing table;

the pushing table is provided with a pushing rod, and a buffer assembly is arranged between the pushing table and the pushing rod.

Preferably, the mounting groove has been seted up at the top of pushing away the platform, buffer assembly includes the inside buffer seat of sliding connection at the mounting groove and fixed connection is at the spring between buffer seat and the mounting groove, push rod fixed connection is on the buffer seat.

Preferably, the second guide rail rod is fixedly connected to the inside of the mounting groove, and the buffer seat is slidably connected to the second guide rail rod.

Preferably, a rubber sleeve is arranged on the push rod.

Preferably, the bearing plate is provided with a bearing table, and the bearing table is provided with a plurality of groups of vacuum suction cups.

Preferably, the bearing plate is provided with a chute corresponding to the position of the push rod.

The utility model discloses a feeding and aligning mechanism for a semiconductor wafer, which has the following beneficial effects:

This a material loading alignment mechanism for semiconductor wafer sets up the alignment unit on the material loading support, realizes that the arm is placing the semiconductor wafer on the material loading platform after, aligns the unit overall structure of alignment is simple, convenient operation, simultaneously, adopts buffer unit's design in the alignment unit, can make when the push rod promotes the wafer motion and aligns, provides elastic buffer, avoids the too big and impaired of wafer atress, and stability is good, guarantees that the semiconductor wafer position is stable to make follow-up processing detection effect good.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of a structure of a carrying platform according to the present utility model;

FIG. 3 is a schematic view of a carrier plate according to the present utility model;

FIG. 4 is a schematic view of a buffer assembly according to the present utility model.

In the figure, 1, a feeding bracket, 101, a bottom plate, 102, a standing plate, 103, a bearing plate, 1031, a chute, 2, an alignment unit, 201, a first guide rail rod, 202, a pushing table, 2021, a mounting groove, 203, a driving motor, 204, a double-thread screw rod, 3, a push rod, 301, a rubber sleeve, 4, a bearing table, 401, a vacuum chuck, 5, a buffer component, 501, a second guide rail rod, 502, a buffer seat, 503 and a spring.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions in the embodiments of the present utility model are clearly and completely described, and it is obvious that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The embodiment of the application solves the problems that in the prior art, in the process of aligning the semiconductor wafer, a mechanical arm or a clamping device is usually adopted to accurately grasp the wafer and put the wafer on the preset platform, the platform is usually provided with a sucker for adsorption, and after long-time use, the mechanical arm is possibly biased in the positioning process, so that the wafer put on the platform has tiny position deviation, and the processing detection effect of the wafer is reduced.

In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.

The embodiment of the utility model discloses a loading and aligning mechanism for a semiconductor wafer, which is shown in figures 1-4 and comprises an aligning unit 2 arranged on a loading bracket 1, wherein the loading bracket 1 comprises a bottom plate 101, a standing plate 102 and a bearing plate 103, the standing plate 102 is positioned between the bottom plate 101 and the bearing plate 103, a bearing table 4 is arranged on the bearing plate 103, and a plurality of groups of vacuum suckers 401 are arranged on the bearing table 4;

When the semiconductor wafer loading processing detection is needed, the semiconductor wafer is placed on the bearing table 4, and after the alignment unit 2 is used for rapid alignment and positioning, the vacuum chuck 401 is used for adsorption and positioning, so that the position stability of the semiconductor wafer is ensured, and the subsequent processing detection effect is good.

The alignment unit 2 includes a first rail bar 201 fixedly connected between two sets of standing boards 102, and a push table 202 slidably connected to the first rail bar 201;

According to the feeding and aligning mechanism for the semiconductor wafer, through the design of the aligning unit 2, when the semiconductor wafer is placed above the bearing plate 103, the semiconductor wafer is conveniently and rapidly positioned and aligned, so that the position of the semiconductor wafer is ensured to be accurate, and the subsequent processing is convenient;

The driving motor 203 is fixedly connected to the standing plate 102, a double-thread screw rod 204 is arranged at the output end of the driving motor 203, the double-thread screw rod 204 is in threaded connection with the pushing table 202, the pushing table 202 is provided with a push rod 3, and a buffer assembly 5 is arranged between the pushing table 202 and the push rod 3;

The whole structure of the alignment unit 2 is simple, a driving motor 203 is adopted to provide power, when the driving motor 203 works, the double-thread screw rod 204 is driven to rotate, the double-thread screw rod 204 drives two groups of pushing tables 202 to move oppositely, the pushing tables 202 drive pushing rods 3 to move, and the groups of pushing rods 3 limit the semiconductor wafer, so that the semiconductor wafer is pushed onto a bearing table 4 to perform position alignment, and the position alignment of the semiconductor wafer is ensured;

The top of the pushing table 202 is provided with a mounting groove 2021, the buffer assembly 5 comprises a buffer seat 502 which is connected inside the mounting groove 2021 in a sliding way and a spring 503 which is fixedly connected between the buffer seat 502 and the mounting groove 2021, and the push rod 3 is fixedly connected to the buffer seat 502;

The buffer component 5 is adopted in the alignment unit 2, so that when the push rod 3 pushes the wafer to move and align, elastic buffer is provided, and the wafer is prevented from being damaged due to overlarge stress;

The inside fixedly connected with second guide rail pole 501 of mounting groove 2021, buffer seat 502 sliding connection is on second guide rail pole 501, and when push rod 3 to the wafer extrusion alignment spacing, push rod 3 atress back can drive buffer seat 502 and slide along second guide rail pole 501 and extrude spring 503, reduces the pressure that the wafer receives, provides the buffering, and protection wafer can not be impaired.

The push rod 3 is provided with a rubber sleeve 301, and the rubber sleeve 301 is arranged to provide protection for the contact position of the wafer and provide secondary buffering.

The bearing plate 103 is provided with a sliding groove 1031 corresponding to the position of the push rod 3, when the push rod 3 moves, the sliding groove 1031 moves along, and the sliding groove 1031 enables the push rod 3 to be limited.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (6)

1. The utility model provides a be used for semiconductor wafer to go up alignment mechanism, includes setting up alignment unit (2) on material loading support (1), material loading support (1) include bottom plate (101), stand board (102) and loading board (103) are constituteed, stand board (102) are located between bottom plate (101) and loading board (103), characterized in that, alignment unit (2) include fixed connection between two sets of stand boards (102) first guide rail pole (201) and sliding connection push away platform (202) on first guide rail pole (201);

A driving motor (203) is fixedly connected to the standing plate (102), a double-thread screw rod (204) is arranged at the output end of the driving motor (203), and the double-thread screw rod (204) is in threaded connection with the pushing table (202);

The pushing table (202) is provided with a pushing rod (3), and a buffer assembly (5) is arranged between the pushing table (202) and the pushing rod (3).

2. The mechanism of claim 1, wherein the top of the pushing table (202) is provided with a mounting groove (2021), the buffer assembly (5) comprises a buffer seat (502) slidably connected inside the mounting groove (2021) and a spring (503) fixedly connected between the buffer seat (502) and the mounting groove (2021), and the pushing rod (3) is fixedly connected to the buffer seat (502).

3. The mechanism for aligning semiconductor wafers according to claim 2, wherein the second rail rod (501) is fixedly connected to the inside of the mounting groove (2021), and the buffer base (502) is slidably connected to the second rail rod (501).

4. A loading and aligning mechanism for semiconductor wafers according to claim 1, characterized in that the push rod (3) is provided with a rubber sleeve (301).

5. The mechanism for aligning semiconductor wafers according to claim 1, wherein the carrier plate (103) is provided with a carrier table (4), and the carrier table (4) is provided with a plurality of groups of vacuum chucks (401).

6. The mechanism for aligning semiconductor wafers according to claim 1, wherein the carrier plate (103) is provided with a chute (1031) corresponding to the position of the push rod (3).