CN216491497U - Electronic device - Google Patents

Abstract

The application provides an electronic device, including casing subassembly, circuit board subassembly, electronic component and antenna module. The circuit board assembly is arranged in the shell assembly, the electronic assembly and the circuit board assembly are arranged adjacently, the electronic assembly is provided with a conductive piece, the conductive piece is used for electrically connecting a reference ground, and the conductive piece is opposite to the preset inner wall of the shell assembly; the antenna assembly is arranged between the conductive piece and the preset inner wall of the shell assembly, coupled with the conductive piece and electrically connected with the circuit board assembly. The electronic equipment provided by the application can be compatible with antenna performance and size miniaturization.

Description

Electronic equipment

technical field

The present application relates to the technical field of electronic communication, and in particular, to an electronic device.

Background technique

With the development trend of thin, portable and multi-functional intelligent portable electronic products, the internal components of terminal products are also more compact. As a key component of product signal transmission and reception, antennas are also constantly developing. At present, the built-in antennas of most portable and thin products usually use the ground of the motherboard as a part of the radiator, and the antenna wiring and clearance are arranged next to the motherboard, which will increase the size of the product. It contradicts the requirement to reduce the size of the product itself. Therefore, how to design an electronic device compatible with antenna performance and miniaturization has become a technical problem to be solved.

Utility model content

The present application provides an electronic device compatible with antenna performance and miniaturization in size.

An electronic device provided by this application includes:

shell assembly;

a circuit board assembly, the circuit board assembly is arranged in the housing assembly;

An electronic assembly, the electronic assembly is provided in the housing assembly, the electronic assembly is disposed adjacent to the circuit board assembly, the electronic assembly has a conductive member, and the conductive member is used for electrical connection to the reference ground, so the conductive member is opposite to the predetermined inner wall of the housing assembly; and

An antenna assembly, the antenna assembly includes a radiator, the radiator is arranged between the conductive member and the predetermined inner wall of the housing assembly, the radiator is coupled with the conductive member, and the radiator is electrically Connect the circuit board assembly.

In the electronic device provided by the present application, by designing the radiator of the antenna assembly to be located between the electronic assembly and the preset inner wall of the housing assembly, the conductive member of the electronic assembly is electrically connected to the reference ground, and the radiator is coupled to the conductive member of the electronic assembly; In terms of location design, by arranging the radiator in the gap between the electronic component and the housing component, the radiator does not need to occupy the space beside the circuit board component, so that the housing component can be placed close to the circuit board component, so as to facilitate the overall Miniaturization; in functional design, by using the conductive parts of the electronic component itself as the reference ground of the antenna component, the multiplexing of the conductive components of the electronic component itself is realized, which is conducive to the realization of the function of the antenna, and is compatible with the miniaturization of antenna performance and size.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present application more clearly, the following briefly introduces the accompanying drawings used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can also be obtained from these drawings without any creative effort.

1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application;

2 is a partial schematic diagram of a first circuit board assembly, an electronic assembly, and an antenna assembly in an electronic device provided in an embodiment of the present application;

3 is a block diagram of the electrical connection of the circuit board assembly, the electronic assembly and the antenna assembly in FIG. 2;

FIG. 4 is a schematic structural diagram in which the electronic component in FIG. 2 is a battery component;

FIG. 5 is a schematic cross-sectional view along the Y-axis direction in FIG. 4;

6 is a partial schematic diagram of a first electronic component and an antenna component in an electronic device provided by an embodiment of the present application;

7 is a partial schematic diagram of a second electronic component and an antenna component in the electronic device provided by the embodiment of the present application;

FIG. 8 is a partial schematic diagram of a third electronic component and an antenna component in an electronic device provided by an embodiment of the present application;

9 is a partial schematic diagram of a fourth electronic component and an antenna component in the electronic device provided by the embodiment of the present application;

10 is a partial schematic diagram of a fifth electronic component and an antenna component in an electronic device provided by an embodiment of the present application;

11 is a partial schematic diagram of a sixth electronic component and an antenna component in an electronic device provided by an embodiment of the present application;

12 is a partial schematic diagram of a seventh electronic component and an antenna component in the electronic device provided by the embodiment of the present application;

13 is a schematic diagram of a battery assembly and an antenna assembly in an electronic device provided by an embodiment of the present application in the Y-Z plane;

FIG. 14 is a detailed partial schematic view of the electronic components and the antenna components in the electronic device of FIG. 10;

15 is a partial schematic diagram of a first circuit board assembly and an antenna assembly in an electronic device provided by an embodiment of the present application;

16 is a partial schematic diagram of a second type of circuit board assembly and an antenna assembly in an electronic device provided by an embodiment of the present application;

17 is a partial schematic diagram of a third circuit board assembly and an antenna assembly in the electronic device provided by the embodiment of the present application;

FIG. 18 is a schematic structural diagram of the antenna assembly of the electronic device provided in FIG. 15;

FIG. 19 is a schematic structural diagram of the antenna assembly and the circuit board assembly of the electronic device provided in FIG. 15;

FIG. 20 is a S11 graph of the antenna system of the electronic device provided in FIG. 15;

FIG. 21a is a far-field pattern of an XY cross-section at 2.4 GHz of the antenna system of FIG. 15 providing the electronic device;

Figure 21b is a far-field pattern of the XZ cross-section of the antenna system of the electronic device provided in Figure 15 at 2.4 GHz;

Figure 21c is a far-field pattern of the ZY cross-section of the antenna system of the electronic device provided in Figure 15 at 2.4 GHz;

Figure 21d is a pattern of the antenna system of the electronic device provided in Figure 15 at 2.4 GHz;

Figure 22a is a far-field pattern of an XY cross-section at 2.45 GHz of the antenna system of the electronic device provided in Figure 15;

Figure 22b is a far-field pattern of the XZ cross-section at 2.45 GHz of the antenna system of the electronic device provided in Figure 15;

Figure 22c is a far-field pattern of the ZY cross-section of the antenna system of the electronic device provided in Figure 15 at 2.45 GHz;

FIG. 22d is a pattern of the antenna system of the electronic device provided in FIG. 15 at 2.45 GHz;

Figure 23a is a far-field pattern of an XY cross-section at 2.5 GHz of the antenna system of the electronic device provided in Figure 15;

Figure 23b is a far-field pattern of the XZ cross-section of the antenna system of the electronic device provided in Figure 15 at 2.5 GHz;

Figure 23c is a far-field pattern of the ZY cross-section of the antenna system of the electronic device provided in Figure 15 at 2.5 GHz;

FIG. 23d is a directional diagram of the antenna system of the electronic device provided in FIG. 15 at 2.5 GHz;

FIG. 24 is an efficiency diagram of the antenna system of the electronic device provided in FIG. 15 .

Description of reference numbers:

Electronic device 1000; housing assembly 100; receiving slot 100a; preset inner wall 101; first inner wall 110; second inner wall 120; third inner wall 130; fourth inner wall 140; circuit board assembly 200; first bearing surface 201; Two bearing surfaces 202; first peripheral side 203; motherboard 210; second electrical connector 220; second ground pin 221; reference ground layer 222; The arc surface 311; the middle side surface 312; the second arc surface 313; the antenna assembly 400; the insulating gap 400a; the radiator 410; Reinforcing plate 440; battery assembly 500; preset side 501; battery 510; first electrical connector 520; first ground pin 521; metal body 530;

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Furthermore, reference in this application to an "embodiment" or an "implementation" means that a particular feature, structure, or characteristic described in connection with the example or implementation can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor a separate or alternative embodiment that is mutually exclusive of other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application may be combined with other embodiments.

Please refer to FIG. 1 , which is a schematic structural diagram of an electronic device 1000 according to an embodiment of the present application. The electronic device 1000 includes an antenna system 800 . The antenna system 800 is used for sending and receiving electromagnetic wave signals, so as to realize the communication function of the electronic device 1000 . The present application does not specifically limit the position of the antenna system 800 on the electronic device 1000, and FIG. 1 is just an example.

The electronic device 1000 includes, but is not limited to, smart wearable devices such as smart glasses, smart earphones, and smart watches, mobile phones, telephones, TVs, tablet computers, cameras, notebook computers, in-vehicle devices, base stations, in-vehicle radars, customer pre-installed devices ( Customer Premise Equipment, CPE) and other equipment that can send and receive electromagnetic wave signals. In this application, the electronic device 1000 is taken as an example of a smart wearable device, such as smart glasses. The smart glasses are close to traditional glasses in form, but have an independent operating system as a smart terminal, which integrates a large number of micro sensors and communication modules, and can support access to voice Assistant, Bluetooth connectivity, notification display, calls, navigation, photo taking, teleprompter, real-time translation of images and voice, and more. For other devices, refer to the specific descriptions in this application.

Referring to FIG. 2 , an electronic device 1000 provided by an embodiment of the present application at least includes a housing component 100 , a circuit board component 200 , an electronic component 300 , and an antenna component 400 .

The housing assembly 100 includes, but is not limited to, a housing of the electronic device 1000 . The material of at least part of the casing of the electronic device 1000 is a non-conductive material or a material that has little effect on the transmission efficiency of electromagnetic waves.

The housing assembly 100 has a housing cavity for accommodating the circuit board assembly 200 , the electronic assembly 300 , the antenna assembly 400 , the camera assembly, the speaker assembly, the microphone assembly, the touch panel assembly, the display screen assembly, and the like.

The circuit board assembly 200 is disposed in the casing assembly 100 , that is, in the casing cavity of the casing assembly 100 . Optionally, the circuit board assembly 200 is a motherboard or the circuit board assembly 200 includes a motherboard. The motherboard may also be referred to as a motherboard, a system board, a logic board, or the like, and a processor or the like is provided on the motherboard. Optionally, the main board is a multi-layer PCB, including multiple dielectric layers and a metal conductive layer (eg, a copper foil layer) disposed between the dielectric layers. The dielectric layer is used to maintain the insulation between the circuit and each layer, commonly known as the substrate. Lines on two or more levels are connected to each other through conductive vias. At least one of the metal conductive layers serves as a reference ground layer of the circuit board assembly 200 . In this embodiment, the circuit board assembly 200 is a rigid circuit board, and is provided with a radio frequency chip, a board-to-board electrical connector, and the like.

Referring to FIG. 2 , the electronic component 300 is disposed in the casing assembly 100 , that is, disposed in the casing cavity of the casing assembly 100 . The electronic assembly 300 is disposed adjacent to the circuit board assembly 200 . The electronic component 300 has a conductive member 310 . The conductive member 310 is used for electrical connection to the reference ground. The reference ground to which the conductive member 310 is electrically connected includes, but is not limited to, the reference ground layer in the circuit board assembly 200 or other reference grounds inside the electronic device 1000 , for example, an aluminum alloy middle frame and reference grounds of other electronic devices Wait. Specific electrical connection methods include, but are not limited to, electrical connection through board-to-board electrical connection, welding, conductive elastic sheets, and the like. Optionally, the electronic assembly 300 includes, but is not limited to, at least one of a battery assembly, a camera assembly, a speaker assembly, a microphone assembly, a touch panel assembly, a display screen assembly, and the like.

The present application does not specifically limit the form of the conductive member 310 . The form of the conductive member 310 includes, but is not limited to, an embedded thin layer, a conductive coating on the surface, a support plate made of conductive material, a conductive shield, and the like. The application does not limit the function of the conductive member 310 in the electronic assembly 300. Optionally, the conductive member 310 includes but is not limited to blocking water, oxygen, and shading; or, supporting; or, anti-static; or, heat dissipation, etc. .

For example, when the electronic component 300 is a battery component, the conductive member 310 of the electronic component 300 is a part of the aluminum layer in the aluminum-plastic film of the battery component, or a part of the aluminum shell for blocking water, oxygen, Shading, etc. When the electronic component 300 is a camera component and the like is provided with a support cover made of conductive material, the conductive member 310 of the electronic component 300 is a part of the support cover made of conductive material on the peripheral side of the camera component. The support cover has a certain rigidity to prevent External impact force or drop stress is transmitted to the camera assembly, affecting the precision components inside the camera assembly.

In this application, for the convenience of description, the width direction of the circuit board assembly 200 of the electronic device 1000 is defined as the X-axis direction, and the length direction of the circuit board assembly 200 of the electronic device 1000 is defined as the Y-axis direction. The thickness direction of the circuit board assembly 200 is defined as the Z-axis direction. Among them, the X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other. The direction indicated by the arrow is the forward direction, and the direction opposite to the arrow is the reverse direction.

Optionally, the electronic assembly 300 and the circuit board assembly 200 are arranged along the Y-axis direction. Of course, in other embodiments, the electronic components 300 and the circuit board components 200 are arranged along the Y-axis direction. The housing assembly 100 surrounds the peripheral sides of the circuit board assembly 200 and the electronic assembly 300 on the X-Y plane, and the housing assembly 100 is also disposed opposite the circuit board assembly 200 and the electronic assembly 300 in the Z-axis direction.

Referring to FIG. 2 , the conductive member 310 is opposite to and spaced apart from the predetermined inner wall 101 of the housing assembly 100 . Optionally, the predetermined inner wall 101 of the housing assembly 100 is an inner wall facing the inner cavity of the housing along the positive X-axis. In other words, the surface of the electronic component 300 opposite to the X axis is opposite to and spaced apart from the predetermined inner wall 101 of the housing component 100 .

The antenna assembly 400 includes a radiator 410 . The radiator 410 is disposed between the conductive member 310 and the predetermined inner wall 101 of the housing assembly 100 . In other words, part of the antenna assembly 400 is at least partially accommodated between the surface of the electronic assembly 300 opposite to the X-axis and the predetermined inner wall 101 of the housing assembly 100 . That is, the electronic component 300 , a part of the antenna component 400 , and the predetermined inner wall 101 of the housing component 100 are sequentially arranged along the X-axis direction. In this way, the antenna assembly 400 is not disposed beside the circuit board assembly 200 , but is disposed in the gap between the electronic assembly 300 and the housing assembly 100 .

Optionally, the material of the predetermined inner wall 101 of the housing component 100 is a non-conductive material, so as to reduce the influence on the electromagnetic wave signal transmitted and received by the antenna component 400 . Of course, optionally, the entire housing assembly 100 may be made of a non-conductive material, or a part corresponding to the radiator 410 may be made of a non-conductive material, and the other parts may be made of a metal material or the like. The non-conductive materials include plastic materials, ceramic materials, glass materials, and the like. In this embodiment, the material of the predetermined inner wall 101 of the housing assembly 100 is taken as an example of a plastic material.

Referring to FIG. 3 , the radiator 410 is coupled with the conductive member 310 . Since the conductive member 310 is electrically connected to the reference ground, the conductive member 310 can serve as the floor of the antenna assembly 400 , that is, the antenna ground. The radiator 410 is electrically connected to the feed source, and the electromagnetic coupling between the radiator 410 and the conductive member 310 forms an antenna loop.

Referring to FIG. 3 , the radiator 410 is electrically connected to the circuit board assembly 200 . Optionally, a radio frequency chip (not numbered) is provided on the circuit board assembly 200 . The radio frequency chip is electrically connected to the feeding unit of the antenna assembly 400 (which will be described in detail later). In other words, the radio frequency chip, the antenna assembly 400 , the conductive member 310 of the electronic assembly 300 , and the reference ground layer on the circuit board assembly 200 described in this application form the antenna system 800 . The radiator 410 transmits and receives electromagnetic wave signals under the excitation signal of the radio frequency chip. Optionally, the working frequency band of the antenna system 800 includes 2.4GHz-2.5GHz. Signal types supported by the antenna system 800 include, but are not limited to, Wi-Fi signals, Bluetooth signals, and the like.

In the electronic device 1000 provided by the present application, by designing the radiator 410 of the antenna assembly 400 to be located between the electronic assembly 300 and the preset inner wall 101 of the housing assembly 100 , the conductive member 310 of the electronic assembly 300 is electrically connected to the reference ground and the radiator The radiator 410 is coupled with the conductive member 310 of the electronic component 300; in terms of position design, by arranging the radiator 410 in the gap between the electronic component 300 and the housing component 100, the radiator 410 does not need to occupy the space next to the circuit board component 200, In this way, the housing assembly 100 can be placed close to the circuit board assembly 200 to facilitate the overall miniaturization; in functional design, by using the conductive member 310 of the electronic assembly 300 itself as the antenna ground of the antenna assembly 400, the electronic assembly 300 is realized. The multiplexing of the conductive members 310 is beneficial to realize the function of the antenna, so as to be compatible with the performance and miniaturization of the antenna.

For the wearable electronic device 1000 such as smart glasses, the circuit board assembly 200 and the electronic assembly 300 are generally installed on the temples of the smart glasses at a position close to the lens. The extension direction of the temple is the Y-axis direction. The cross-sectional space of the temple is extremely limited. After the circuit board assembly 200 is installed on the temple, since the circuit board assembly 200 needs to be provided with some chips, etc., the circuit board assembly 200 itself is relatively large. In order to reduce the local cross-sectional size of the temple, The housing assembly 100 at the temple is disposed in close contact with the peripheral side of the circuit board assembly 200 , so there is no extra space on the peripheral side of the circuit board assembly 200 for the antenna assembly 400 to be disposed.

In this application, by disposing the radiator 410 of the antenna assembly 400 between the electronic assembly 300 and the inner wall of the housing assembly 100 , the radiator 410 does not need to occupy the space on the peripheral side of the circuit board assembly 200 , so that the cross-sectional dimensions of the temples are opposite to each other. At the same time, the antenna assembly 400 also reuses the conductive member 310 of the electronic assembly 300 itself as a reference ground to ensure that the antenna assembly 400 can form an antenna loop even if it is far away from the reference ground layer of the circuit board assembly 200 to effectively transmit and receive antenna signals.

Optionally, referring to FIG. 4 , the electronic assembly 300 includes a battery assembly 500 . The housing of the battery assembly 500 includes a metal body 530 . The metal body 530 located on the predetermined side surface 501 of the battery assembly 500 forms the conductive member 310 . The metal body 530 can be a part of the aluminum layer in the aluminum-plastic film of the battery assembly 500, or a part of the aluminum shell, and is used for blocking water, oxygen, light shielding, and the like. The metal body 530 is electrically connected to the reference ground layer of the circuit board assembly 200 .

By arranging the radiator 410 of the antenna assembly 400 between the battery assembly 500 and the inner wall of the casing assembly 100 , the radiator 410 of the antenna assembly 400 does not need to occupy the space on the peripheral side of the circuit board assembly 200 , and the casing assembly 100 can be tightly attached It is arranged on the circuit board assembly 200, so that the cross-sectional size of the casing assembly 100 in the X-Z plane is relatively small, and at the same time, the antenna assembly 400 also reuses the metal originally used to block water, oxygen, shading, etc. in the casing of the battery assembly 500. The body 530 is used as a reference ground to ensure that the antenna assembly 400 is multiplexed to the metal body 530 in the battery assembly 500, and an antenna loop can be formed even if it is far away from the reference ground layer of the circuit board assembly 200, and antenna signals can be transmitted and received effectively.

Of course, in other embodiments, the electronic assembly 300 may also be a camera assembly, a microphone assembly, a display screen assembly, etc., and the conductive member 310 may be a support cover of the camera assembly, or a reinforcing plate of the microphone assembly, or the back side of the display screen assembly support plate, etc. The above-mentioned supporting cover, reinforcing plate and supporting plate are all conductive materials, and are electrically connected to the reference ground layer of the circuit board assembly 200 to form the reference ground of the antenna assembly 400 in the present application. The above design can realize that the housing assembly 100 can be placed in close contact with the circuit board assembly 200, so that the cross-sectional size of the housing assembly 100 in the X-Z plane is relatively small, and at the same time, the antenna assembly 400 also reuses the camera assembly originally used for A support cover that resists external impact, or a reinforcing plate originally used to improve the support strength of the flexible circuit board by the multiplexed microphone assembly, or a support plate originally used to support other structures inside the display assembly on the backside of the multiplexed display assembly As a reference, it is ensured that the antenna assembly 400 is multiplexed with the conductive member 310 in the electronic assembly 300, so that an antenna loop can be formed even if it is far away from the reference ground layer of the circuit board assembly 200, and antenna signal transmission and reception can be effectively performed.

The electrical connection between the metal body 530 of the battery assembly 500 and the reference ground layer of the circuit board assembly 200 includes but is not limited to the following embodiments:

Referring to FIG. 5 , the battery assembly 500 includes a battery 510 and a first electrical connector 520 electrically connected to the battery 510 . The battery 510 includes a casing (ie, the casing of the battery assembly 500 described above), a protection circuit and a battery cell. The case is used to encapsulate the cell and the protection board. The tabs of the battery cells are electrically connected to the first electrical connector 520 through the protection circuit. The first electrical connector 520 is disposed outside the casing. The first electrical connector 520 is electrically connected to the metal body 530 in the casing of the battery 510 . That is, the first electrical connector 520 is electrically connected to the conductive member 310 . Optionally, the conductive member 310 is electrically connected to at least one pin of the first electrical connector 520 , which is defined as the first ground pin 521 in the present application.

The circuit board assembly 200 includes a main board 210 and a second electrical connector 220 disposed on the main board 210 . The second electrical connector 220 is electrically connected to the reference ground layer 222 . Optionally, at least one pin of the second electrical connector 220 is electrically connected to the reference ground layer 222 of the motherboard 210 through traces and conductive vias, and this pin is defined as the second ground pin 221 in this application. Optionally, the first electrical connector 520 and the second electrical connector 220 are board-to-board electrical connectors, so that the battery assembly 500 and the circuit board assembly 200 can be prepared separately and assembled detachably. Of course, in other embodiments, the first electrical connector 520 and the second electrical connector 220 may also be plug connectors and plug interfaces, respectively.

Referring to FIG. 5 , when the first electrical connector 520 is docked with the second electrical connector 220 , the first ground pin 521 is electrically connected to the second ground pin 221 . The conductive member 310 is electrically connected to the reference ground layer 222 through the first electrical connector 520 and the second electrical connector 220 . That is, the conductive member 310 and the reference ground layer 222 are electrically connected through the electrical connection between the first ground pin 521 and the second ground pin 221 . In other words, the conductive member 310 , the first ground pin 521 , the second ground pin 221 , and the reference ground layer 222 of the circuit board assembly 200 are electrically connected in sequence.

In this embodiment, by setting the metal body 530 in the casing of the battery 510 to be grounded, the electrochemical reaction inside the battery 510 can also be effectively prevented from being affected by external current, static electricity, etc., and the charging and discharging efficiency and stability of the battery 510 can be improved. sex.

Optionally, please refer to FIG. 2 , there is an insulating gap 400 a between the radiator 410 and the conductive member 310 . When the radiator 410 and the conductive member 310 are disposed opposite to each other along the X-axis direction, the dimension of the insulating gap 400a in the X-axis direction is greater than or equal to 1 mm. Optionally, the size of the insulating gap 400a in the X-axis direction is less than 1.5 mm, for example, the size of the insulating gap 400a in the X-axis direction is 1.06 mm, but not limited to this data. It can be understood that the insulating gap 400a can be used as the clearance space of the antenna assembly 400 to adjust the antenna assembly 400 to have a suitable capacitance to ground, reduce the radiation effect of the conductive member 310 of the battery assembly 500 on the antenna assembly 400, and improve the antenna system 800. antenna efficiency. The dimension of the insulating gap 400a in the X-axis direction is greater than or equal to 1 mm, and the antenna assembly 400 has relatively good radiation efficiency.

In the following, a specific example will be given to illustrate the forming method of the radiator 410 of the antenna assembly 400 with reference to the accompanying drawings.

Optionally, please refer to FIG. 6 , where the radiator 410 faces the predetermined inner wall 101 of the housing assembly 100 . Optionally, the surface where the radiator 410 is located is substantially parallel or parallel to the predetermined inner wall 101 of the housing assembly 100 .

For example, the material of the radiator 410 is a metal material. The surface where the radiator 410 is located faces the predetermined inner wall 101 of the housing assembly 100 .

The present application does not specifically limit the specific shape of the radiator 410 . The shape of the radiator 410 includes, but is not limited to, a straight line, a bent line, a curved line, a local widening, and the like. For example, the radiator 410 is linear, and the length direction of the radiator 410 is the Y-axis direction. The length dimension of the radiator 410 is close to 1/4 of the working wavelength, and the working wavelength is the medium wavelength corresponding to the working frequency band. When the operating frequency band of the antenna assembly 400 is 2.4GHz-2.5GHz, the length dimension of the radiator 410 is close to 23.4mm. The present application does not specifically limit the width of the radiator 410 (the width direction of the radiator 410 is the Z-axis direction). In theory, the wider the width of the radiator 410 is, the stronger the capacitive matching of the radiator 410 is to balance the inductive matching of the radiator 410. Therefore, within the range allowed by the electronic device 1000, the width of the radiator 410 is relatively large. , for example, 2.74mm, but not limited to this data.

In the first method of forming the radiator 410 of the antenna assembly 400 , please refer to FIG. 6 , the antenna assembly 400 further includes a flexible carrier board 420 . The radiator 410 is formed on the flexible carrier board 420 . Optionally, the flexible carrier board 420 is provided with multiple flexible dielectric layers, and the radiator 410 is a conductive layer between the multiple flexible dielectric layers, such as a copper foil layer. The flexible carrier board 420 and the radiator 410 form a flexible printed circuit (FPC) antenna. Optionally, the thickness of the flexible printed circuit (FPC) antenna is 0.13mm, but not limited to this data.

In the second molding method of the radiator 410 of the antenna assembly 400, please refer to FIG. 7, the radiator 410 is formed by laser direct molding process, printing direct molding process, flexographic printing technology, gravure printing, spin coating and dip coating, etc. The process is formed on the predetermined inner wall 101 of the housing assembly 100 or other support surfaces. Integrating the radiator 410 directly on the predetermined inner wall 101 of the housing assembly 100 or other support surfaces through the above process can not only reduce the space required for the antenna, but also keep the overall product size small, and also Fits three-dimensional structures with profiled zigzag profiles.

In the third molding method of the radiator 410 of the antenna assembly 400, please refer to FIG. 8, the radiator 410 itself has a certain rigidity, for example, the radiator 410 is a metal sheet, that is, a metal sheet antenna. The radiator 410 provided in this embodiment does not need to be provided with a carrier plate, can be mass-produced, and is easy to install.

Hereinafter, specific examples are given for the setting position and setting manner of the radiator 410 of the antenna assembly 400 with reference to the accompanying drawings.

Optionally, the radiator 410 of the antenna assembly 400 is disposed on or attached to the predetermined inner wall 101 of the housing assembly 100 , and conforms to the predetermined inner wall 101 of the housing assembly 100 .

Optionally, the radiator 410 of the antenna assembly 400 may be provided on the predetermined inner wall 101 of the housing assembly 100 by means of bonding, direct molding, or the like. Wherein, the radiator 410 of the antenna assembly 400 includes, but is not limited to, a flexible printed circuit (FPC) antenna, or an antenna formed by a laser direct molding process, a printing direct molding process, a flexographic printing technology, gravure printing, spin coating, dip coating, etc. Antennas, sheet metal antennas, etc.

The radiator 410 of the antenna assembly 400 is conformal to the predetermined inner wall 101 of the housing assembly 100 , which means that the radiator 410 of the antenna assembly 400 is an extremely thin substrate, wherein the radiator 410 of the antenna assembly 400 will follow the casing. The shape of the predetermined inner wall 101 of the body assembly 100 changes, so that the space occupied by the radiator 410 of the antenna assembly 400 is small, and the extremely narrow space of the housing assembly 100 can be utilized to promote the miniaturization of the electronic device 1000 .

The present application does not specifically limit the shape of the predetermined inner wall 101 of the housing assembly 100 . Optionally, the shape of the predetermined inner wall 101 of the housing assembly 100 includes, but is not limited to, a plane shape, a curved surface shape, a curved surface shape, and the like.

By arranging or attaching the radiator 410 of the antenna assembly 400 on the predetermined inner wall 101 of the housing assembly 100, in this way, the insulation gap 400a between the radiator 410 of the antenna assembly 400 and the battery assembly 500 can be maximized , the clearance space required by the antenna system 800 can be satisfied, and the distance between the preset side surface 501 of the battery assembly 500 and the preset inner wall 101 of the housing assembly 100 can be relatively small, thereby realizing the miniaturization of the electronic device 1000 .

Of course, in other embodiments, the radiator 410 of the antenna assembly 400 may also be disposed in the space between the predetermined inner wall 101 of the housing assembly 100 and the predetermined inner wall 101 of the battery assembly 500 . For example, a first insulating gap is formed between the radiator 410 of the antenna assembly 400 and the preset side surface 501 of the battery assembly 500 , and a second insulating gap is formed between the radiator 410 of the antenna assembly 400 and the preset inner wall 101 of the housing assembly 100 . The first insulating gap forms a clear space for the antenna system 800 , and the second insulating gap is used for accommodating other devices, or forming an air gap on the radiation path of electromagnetic waves to improve the radiation performance of the antenna system 800 .

Optionally, please refer to FIG. 9 , the electronic device 1000 further includes a medium support 700 . The medium support 700 is fixed to the housing assembly 100 . The dielectric support 700 is disposed in the insulating gap 400 a and supported by the radiator 410 . The dielectric constant of the dielectric support 700 is small and stable, for example, 2-3; the dielectric loss of the dielectric support 700 is small, for example, about 0.002, so as to reduce the signal loss of the antenna signal during transmission.

The present application does not specifically limit the shape of the medium support 700 . Optionally, the shape of the media support 700 includes, but is not limited to, a solid plate shape, a grid shape, a plurality of legs, and the like.

Optionally, the medium support 700 is fixedly connected to the housing assembly 100 in the Z-axis direction, and the fixed connection methods include, but are not limited to, integral molding, welding, screwing, gluing, and the like.

The side of the dielectric support 700 facing the predetermined inner wall 101 of the housing assembly 100 is supported on the radiator 410 . Optionally, the radiator 410 may be provided on the dielectric support 700 by means of bonding, direct molding, or the like. The radiator 410 includes, but is not limited to, a flexible printed circuit (FPC) antenna, or an antenna formed by a laser direct molding process, a printing direct molding process, a flexible printing technology, gravure printing, spin coating, dip coating and other processes, and a metal sheet antenna. Wait.

In this embodiment, the radiator 410 and the predetermined inner wall 101 of the housing assembly 100 may have a gap or be closely attached.

Optionally, the medium support 700 and the predetermined side surface 501 of the battery assembly 500 may be closely fitted or arranged at intervals.

In this embodiment, the dielectric support 700 is provided, the radiator 410 is disposed on the dielectric support 700 by bonding, direct molding, etc., and then the dielectric support 700 is fixed on the housing assembly 100, so that the installation efficiency of the radiator 410 can be improved. , and prevent the radiator 410 from being damaged when installed in a narrow gap; in addition, by selecting the dielectric support 700 with smaller dielectric constant and dielectric loss, the influence on the radiation efficiency of the antenna system 800 is reduced.

Optionally, please refer to FIG. 10 , the medium support 700 is integrally formed with the predetermined inner wall 101 of the housing assembly 100 .

Specifically, when processing the case assembly 100 , through injection molding, the inner wall thickness of the case assembly 100 corresponding to the battery assembly 500 is greater than that of the case assembly 100 corresponding to the circuit board assembly 200 . Then, a receiving groove 100a is formed along the Y-axis direction at the inner wall of the case assembly 100 corresponding to the battery assembly 500 through a CNC process, and at least one opening of the receiving groove 100a faces the positive direction of the Z-axis. The positive side of the X-axis of the receiving groove 100 a is the medium support 700 , and the positive side of the X-axis of the receiving groove 100 a is the predetermined inner wall 101 of the housing assembly 100 . The receiving groove 100a may or may not penetrate along the Y-axis direction.

The radiator 410 of the antenna assembly 400 may be a flexible printed circuit (FPC) antenna, one end of the flexible printed circuit (FPC) antenna is electrically connected to the circuit board assembly 200, and one end of the flexible printed circuit (FPC) antenna is accommodated in the receiving slot 100a Inside.

When the housing assembly 100 is prepared, the accommodating groove 100 a is formed so as to form the installation position for accommodating the radiator 410 of the antenna assembly 400 , so as to facilitate the installation of the radiator 410 of the antenna assembly 400 on the predetermined inner wall of the housing assembly 100 101 and the preset side surface 501 of the battery assembly 500 .

In other embodiments, the media holder 700 may be formed separately from the predetermined inner wall 101 of the housing assembly 100 . For example, the dielectric support 700 is fixedly connected to the housing assembly 100 by welding, screwing, gluing, or the like. The radiator 410 is fixed on the dielectric support 700 to be installed in the housing assembly 100 along with the dielectric support 700 .

Further, please refer to FIG. 11 , the medium support 700 is fixedly connected to the housing assembly 100 . The side of the dielectric support 700 facing away from the radiator 410 abuts against the predetermined side surface 501 of the battery assembly 500 . In other words, the medium support 700 may serve as a positioning wall on the side where the predetermined side surface 501 of the battery assembly 500 is located. In this way, the dielectric support 700 can simultaneously position the battery assembly 500 and the radiator 410 , thereby improving the installation stability of the battery assembly 500 , the dielectric support 700 , and the radiator 410 in the inner cavity of the housing.

Referring to FIG. 12 , the electronic device 1000 further includes a compressible buffer 600 . The compressible buffer 600 is disposed between the predetermined side surface 501 of the battery assembly 500 and the medium support 700 . The compressible buffer 600 is used to provide a certain movable space for the installation of the battery assembly 500 . Optionally, the compressible buffer member 600 includes, but is not limited to, elastic silicone, foam, and the like. When the battery assembly 500 is installed on the side where the media support 700 faces the positive X direction, the compressible buffer member 600 is compressed, and the compressible buffer member 600 also has a certain compressibility margin.

Optionally, please refer to FIG. 13 , the conductive member 310 includes a first arc-shaped surface 311 , a middle side surface 312 and a second arc-shaped surface 313 connected in sequence along the thickness direction (Z-axis direction) of the battery assembly 500 . The middle side surface 312 is parallel or substantially parallel to the predetermined inner wall 101 of the housing assembly 100 . The radiator 410 is disposed opposite to the conductive member 310 , including but not limited to the following embodiments: In the first embodiment, the radiator 410 is disposed opposite to the middle side surface 312 . Optionally, the middle side surface 312 is a middle flat side surface, and the radiator 410 is disposed opposite to the middle flat side surface of the battery assembly 500 . Alternatively, in the second embodiment, at least part of the radiator 410 is disposed opposite to the first arc-shaped surface 311 ; or, in the third embodiment, at least part of the radiator 410 is opposite to the first arc surface 311 ; The two arc-shaped surfaces 313 are opposite to each other. The radiator 410 can also be moved up to face the first arc-shaped surface 311 , or moved down to face the second arc-shaped face 313 , so as to not increase the preset side surface 501 of the battery assembly 500 and the preset inner wall 101 of the housing assembly 100 The distance between them increases the headroom of the antenna assembly 400 , thereby increasing the antenna performance of the antenna system 800 .

For example, the thickness of the battery assembly 500 along the Z-axis direction is 6.7 mm, and the thickness of the middle side surface 312 along the Z-axis direction is 2.7 mm. The thickness of the radiator 410 in the Z-axis direction is 2.7 mm. Therefore, the radiator 410 can be set to be parallel to the middle side surface 312 and face each other, or the radiator 410 can be set to be staggered from the middle side surface 312 along the Z-axis direction, and a part of the radiator 410 is facing the middle side surface 312. Another part of the body 410 is facing the first arc surface 311 of the battery assembly 500 , or, a part of the radiator 410 is facing the middle side surface 312 , and another part of the radiator 410 is facing the second arc surface of the battery assembly 500 313.

The arrangement relationship of the circuit board assembly 200 , the battery assembly 500 , and the antenna assembly 400 provided by the embodiments of the present application will be described below with reference to the accompanying drawings.

Referring to FIG. 14 , the circuit board assembly 200 and the battery assembly 500 are arranged along a first direction. The battery assembly 500 and the radiator 410 of the antenna assembly 400 are arranged along the second direction. The second direction is perpendicular to the first direction. Wherein, the first direction is the Y-axis direction. The second direction is the X-axis direction.

Further, please refer to FIG. 14 , in the X-Y plane, the housing assembly 100 includes a first inner wall 110 and a second inner wall 120 which are disposed opposite to each other. The first inner wall 110 and the second inner wall 120 both extend along the Y-axis direction. A portion of the first inner wall 110 and a portion of the second inner wall 120 are respectively disposed on opposite sides of the circuit board assembly 200 . Another part of the first inner wall 110 and another part of the second inner wall 120 are respectively disposed on opposite sides of the battery assembly 500 . The third side of the battery assembly 500 is disposed adjacent to the third side of the circuit board assembly 200 . Another part of the first inner wall 110 is the above-mentioned predetermined inner wall 101 . The radiator 410 of the antenna assembly 400 is disposed between another part of the first inner wall 110 and the circuit board assembly 200 .

Optionally, please refer to FIG. 14 , the housing assembly 100 further includes a third inner wall 130 and a fourth inner wall 140 connected between the first inner wall 110 and the second inner wall 120 , the third inner wall 130 and the fourth inner wall 140 The inner walls 140 all extend along the X-axis direction. The third inner wall 130 is disposed on the fourth side of the circuit board assembly 200 . The fourth inner wall 140 is disposed on the fourth side of the battery assembly 500 . Of course, in other embodiments, the fourth side of the circuit board assembly 200 and the fourth side of the battery assembly 500 are adjacent to other devices respectively, so they are not on the fourth side of the circuit board assembly 200 . . The fourth side of the battery assembly 500 is provided with a third inner wall 130 and a fourth inner wall 140 .

In this embodiment, the circuit board assembly 200 and the battery assembly 500 are designed to be disposed along the Y-axis direction, and the radiator 410 of the antenna assembly 400 is disposed on one side of the circuit board assembly 200 along the X-axis direction. In this way, the radiator 410 of the antenna assembly 400 Instead of occupying the space on the 200X axis side of the circuit board assembly, the space on the 500X axis side of the battery assembly is used. In this way, the first inner wall 110 and the second inner wall 120 of the casing assembly 100 can be placed in close contact with the circuit board assembly 200, thereby realizing a casing The cross-sectional dimension of the body assembly 100 in the X-Z plane is relatively small, facilitating miniaturization of the electronic device 1000 .

Hereinafter, the connection manner of the radiator 410 of the antenna assembly 400 and the circuit board assembly 200 will be illustrated by taking the radiator 410 of the antenna assembly 400 as an example of a flexible printed circuit (FPC) antenna.

Optionally, please refer to FIG. 15 to FIG. 17 , the flexible carrying board 420 includes a connecting portion 423 and a carrying portion 421 which are connected to each other. The connecting portion 423 extends along the second direction. The connecting portion 423 is used to carry the feeding unit 430 electrically connected to the circuit board assembly 200 . The bearing portion 421 extends along the first direction. The carrying portion 421 is used to carry the radiator 410 . The bearing portion 421 is disposed opposite to the predetermined inner wall 101 of the housing assembly 100 .

The first direction is the Y-axis direction. The second direction is the X-axis direction. In other words, the extending directions of the connecting portion 423 and the bearing portion 421 are different. Optionally, the flexible bearing board 420 may be a linear flexible board, and the linear flexible board is sequentially bent to form a connecting portion 423 extending along the X-axis direction and a bearing portion 421 extending along the Y-axis direction. Alternatively, the flexible bearing board 420 may be in an L-shape, wherein the portion of the L-shaped flexible bearing board 420 extending along the Y-axis direction is the bearing portion 421 , and the portion of the L-shaped flexible bearing board 420 extending along the X-axis direction is the bearing portion 421 . Connection part 423 .

Optionally, please refer to FIG. 15 , the circuit board assembly 200 includes a first bearing surface 201 and a second bearing surface 202 arranged opposite to each other (the second bearing surface 202 is located on the back of the first bearing surface 201 , indicated by a dotted line) , and the first peripheral side surface 203 connected to the first bearing surface 201 and the second bearing surface 202 , the first bearing surface 201 faces the positive direction of the Z axis, and the second bearing surface 202 faces the reverse direction of the Z axis. The first circumferential side surface 203 is opposite to the Y axis, that is, toward the side where the battery assembly 500 is located. Both the first carrying surface 201 and the second carrying surface 202 are used for carrying electronic devices.

Wherein, the connection portion 423 is disposed opposite to the circuit board assembly 200 including but not limited to the following embodiments:

In the first embodiment, please refer to FIG. 15 , the connecting portion 423 is disposed opposite to the second bearing surface 202 . Specifically, the second bearing surface 202 is provided with a radio frequency port that is electrically connected to the radio frequency chip 240 , and the power feeding unit 430 on the connection portion 423 is electrically connected to the radio frequency port. The bearing portion 421 is disposed opposite to the predetermined inner wall 101 of the housing assembly 100 . The carrying portion 421 of the flexible carrying board 420 and the radiator 410 are disposed in the receiving groove 100a. The flexible carrier board 420 is L-shaped. The connecting portion 423 protrudes from the opening of the receiving groove 100a toward the positive direction of the Z-axis, bends 180°, then extends in the reverse direction of the Z-axis, and then bends 90° to extend toward the positive direction of the X-axis, and is connected with the second bearing. The surfaces 202 are disposed opposite to each other, so that the power feeding unit 430 is electrically connected to the radio frequency port on the circuit board assembly 200 and the space occupied by the antenna assembly 400 is small.

In the second embodiment, please refer to FIG. 16 , the connecting portion 423 is disposed opposite to the first bearing surface 201 . Specifically, the first bearing surface 201 is provided with a radio frequency port that is electrically connected to the radio frequency chip 240 , and the power feeding unit 430 on the connecting portion 423 is electrically connected to the radio frequency port. The bearing portion 421 is disposed opposite to the predetermined inner wall 101 of the housing assembly 100 . The carrying portion 421 of the flexible carrying board 420 and the radiator 410 are disposed in the receiving groove 100a. The flexible carrier board 420 is L-shaped. The connecting portion 423 protrudes from the opening of the receiving slot 100a toward the positive direction of the Z-axis, is bent at 90°, and is positioned opposite to the first bearing surface 201, so that the power feeding unit 430 is electrically connected to the RF port on the circuit board assembly 200. The connection and antenna assembly 400 takes up little space.

In the third embodiment, please refer to FIG. 17 , the connecting portion 423 is disposed opposite to the first peripheral side surface 203 . Specifically, the first peripheral side surface 203 is provided with a radio frequency port electrically connected to the radio frequency chip 240 , and the power feeding unit 430 on the connecting portion 423 is electrically connected to the radio frequency port. The carrying portion 421 is disposed opposite to the predetermined inner wall 101 of the housing assembly 100 , and the receiving slot 100 a may be provided with an opening facing the positive direction of the Y-axis. In this way, the carrying portion 421 and the radiator of the flexible carrying board 420 are realized. 410 is disposed in the receiving groove 100a. The flexible carrier plate 420 is straight. The connecting portion 423 protrudes from the opening of the receiving slot 100a toward the positive direction of the Y-axis, is bent at 90°, and is positioned opposite to the first peripheral side surface 203, so that the power feeding unit 430 can be electrically connected to the RF port on the circuit board assembly 200. The connection and antenna assembly 400 takes up little space.

The circuit board assembly 200 includes a main board 210 and electronic devices such as a radio frequency chip 240 and a radio frequency port disposed on the main board 210 . Therefore, the first bearing surface 201 , the second bearing surface 202 , and the first peripheral side surface 203 of the circuit board assembly 200 are also the first bearing surface 201 , the second bearing surface 202 , and the first peripheral side surface 203 of the motherboard 210 .

In this embodiment, please refer to FIG. 15 and FIG. 16 , the connecting portion 423 and the main board 210 are disposed opposite to each other along the thickness direction. In other words, the connecting portion 423 is disposed opposite to the first bearing surface 201 or the second bearing surface 202 of the motherboard 210 .

Further, please refer to FIG. 18 and FIG. 19 , the connecting portion 423 is disposed opposite to the second bearing surface 202 . The bearing portion 421 is installed between the predetermined inner wall 101 of the housing assembly 100 and the predetermined side surface 501 of the battery assembly 500 from the facing direction of the first bearing surface 201 . That is, the opening direction of the receiving groove 100 a is the same as the direction of the first bearing surface 201 . The bearing portion 421 is disposed opposite to the predetermined inner wall 101 of the housing assembly 100 . The carrying portion 421 of the flexible carrying board 420 and the radiator 410 are disposed in the receiving groove 100a. The flexible carrier board 420 is L-shaped. The flexible carrying board 420 further includes a bending portion 422 connected between the connecting portion 423 and the carrying portion 421 . The bent portion 422 protrudes from the opening of the receiving groove 100a toward the positive direction of the Z-axis, bends 180°, then extends in the reverse direction of the Z-axis, and then bends 90° until the connecting portion 423 extends toward the positive direction of the X-axis , is disposed opposite to the second bearing surface 202 , so that the power feeding unit 430 is electrically connected to the radio frequency port on the circuit board assembly 200 and the space occupied by the antenna assembly 400 is small.

When a medium support 700 for supporting the carrying portion 421 is provided between the predetermined inner wall 101 of the housing assembly 100 and the predetermined side surface 501 of the battery assembly 500 , the bent portion 422 is formed along the main board. The gap between the side surface of 210 and the media support 700 bypasses the media support 700 and is connected to the bearing portion 421 .

Referring to FIG. 15 and FIG. 16 , the antenna assembly 400 further includes at least one feeding unit 430 . The at least one feeding unit 430 is provided on the connecting portion 423 . The feeding unit 430 is electrically connected to the radiator 410 and the radio frequency port on the mainboard 210 ; and/or the feeding unit 430 is electrically connected to the radiator 410 and the reference ground layer 222 of the mainboard 210 .

In other words, the antenna assembly 400 in the present application may be a single feed point scheme or a dual feed point scheme. The radiation performance of the single feed point scheme is slightly better than that of the double feed point scheme by about 0.5dB.

Optionally, when the number of feeding units 430 is one, the feeding unit 430 is electrically connected to the radiator 410 and the radio frequency port on the main board 210 .

When the number of feed units 430 is two, one of the feed units 430 is electrically connected to the radiator 410 and the radio frequency port on the motherboard 210 , and the other of the feed units 430 is electrically connected to the radiator 410 and the reference ground 222 of the motherboard 210 .

Referring to FIG. 19 , the circuit board assembly 200 further includes at least one conductive elastic piece 230 . The number of the conductive elastic pieces 230 is the same as the number of the feeding units 430 . When the number of conductive elastic sheets 230 is one, one end of the conductive elastic sheet 230 elastically abuts against and is electrically connected to the feeding unit 430, and the other end of the conductive elastic sheet 230 is fixed to the main board 210 and electrically connected to the main board RF port on 210. The antenna feeding is realized by crimping the feeding unit 430 with the conductive elastic sheet 230 on the main board 210 .

When the number of conductive elastic sheets 230 is two, one end of one conductive elastic sheet 230 elastically abuts and electrically connects to one of the feeding units 430, and the other end of one conductive elastic sheet 230 is fixed to the main board 210 and electrically connected Connect to the radio frequency port on the motherboard 210 . One end of the other conductive elastic sheet 230 elastically contacts and is electrically connected to the other feeding unit 430 , and the other end of the other conductive elastic sheet 230 is fixed to the main board 210 and is electrically connected to the reference ground layer of the main board 210 . 222. The antenna feeding is realized by crimping the feeding unit 430 with the conductive elastic sheet 230 on the main board 210 .

Referring to FIG. 19 , the antenna assembly 400 further includes a reinforcing plate 440 . The reinforcing plate 440 is disposed on the connecting portion 423 and is located on a side away from the power feeding unit 430 . Optionally, the material of the reinforcing plate 440 is PI material, and the thickness of the reinforcing plate 440 is about 0.3 mm. The reinforcing plate 440 provides a certain rigidity for the connecting portion 423 to ensure the reliability of the connection between the feeding unit 430 and the conductive elastic sheet 230 .

Table 1 below is the test data of the Over The Air (OTA) technology test for the antenna assembly 400 to transmit and receive the Wi-Fi frequency band. The OTA test is a test of the radiation performance of the whole machine. In Table 1, the conducted power of the test item 802.11B is about 15dBm, and the sensitivity is about -85dBm. The full name of TRP is Total Radiated Power, that is, the total radiated power. It is the integral value of the radio frequency radiation power of the electronic device 1000 on the three-dimensional spherical surface in space, and reflects the emission characteristics of the electronic device 1000 in all directions. TIS (Total Isotropic Sensitivity): reflects the condition of the receiving sensitivity index of the entire radiating spherical electronic device 1000 . It reflects the receiving sensitivity of the electronic device 1000 as a whole, and is related to the conduction sensitivity of the electronic device 1000 and the radiation performance of the antenna.

From Table 1, the radiated power of channel 1, channel 7, and channel 11 are 11dBm, 11.2dBm, and 12.0dBm, respectively. It can be seen that the antenna efficiency of the whole machine is greater than or equal to -4dB. The antenna efficiency performance of the 4G frequency band is about -5dB on average, so the antenna efficiency of the present application is greater than or equal to -4dB, which reflects better antenna performance than conventional ones. where the antenna efficiency is the difference between the radiated power and the conducted power. It can be seen from the sensitivity results of the 7 channels that the omnidirectional receiving sensitivity is close to -85dBm, indicating that the omnidirectional receiving sensitivity of the electronic device 1000 provided by the present application is relatively high. In addition, when the electronic device 1000 is a product with a display screen, the electronic device 1000 can maintain a relatively high omnidirectional receiving sensitivity in both on-screen and off-screen conditions.

Table 1

Please refer to FIG. 20. FIG. 20 is an S11 graph of the antenna system 800 in the electronic device 1000 provided by the present application. It can be seen from the graph that the antenna system 800 in the electronic device 1000 provided by the present application can better cover the frequency band of 2.4GHz-2.5GHz.

Please refer to FIGS. 21 a to 21 d . FIGS. 21 a to 21 c are far-field patterns of the antenna system 800 in the XY plane, the XZ plane and the ZY plane respectively at 2.4 GHz in the electronic device 1000 provided by the present application. It can be seen from each result graph that the antenna system 800 has good signal coverage in the XY plane and the ZY plane at 2.4 GHz. 21d is a directional diagram of the antenna system 800 at 2.4 GHz in the electronic device 1000 provided by the present application. It can be seen from the directional diagram that the antenna system 800 has a higher gain in the XZ plane at 2.4 GHz.

Please refer to FIGS. 22 a to 22 d . FIGS. 22 a to 22 c are far-field patterns of the antenna system 800 in the XY plane, the XZ plane and the ZY plane respectively at 2.45 GHz in the electronic device 1000 provided by the present application. It can be seen from each result graph that the antenna system 800 has good signal coverage in the XY plane and the ZY plane at 2.45 GHz. FIG. 22d is a directional diagram of the antenna system 800 at 2.45 GHz in the electronic device 1000 provided by the present application. It can be seen from the directional diagram that the antenna system 800 has a higher gain in the XZ plane at 2.45 GHz.

Please refer to FIGS. 23 a to 23 d . FIGS. 23 a to 23 c are far-field patterns of the antenna system 800 in the XY plane, the XZ plane and the ZY plane respectively at 2.5 GHz in the electronic device 1000 provided by the present application. It can be seen from each result graph that the antenna system 800 has good signal coverage in the XY plane and the ZY plane at 2.5 GHz. 23d is a directional diagram of the antenna system 800 at 2.5 GHz in the electronic device 1000 provided by the present application. It can be seen from the directional diagram that the antenna system 800 has a higher gain in the XZ plane at 2.5 GHz.

Please refer to FIG. 24 , which is an efficiency diagram of the antenna system 800 in the electronic device 1000 provided by the present application. It can be seen from the efficiency diagram that the efficiency of the antenna system 800 at 2.4GHz to 2.5GHz is about -4dB. Compared with the conventional wearable built-in antenna, the antenna efficiency performance in the Wi-Fi 2.4G frequency band is about -5dB on average. The antenna efficiency of the present application is greater than or equal to -4dB, which reflects better antenna performance compared to conventional.

Under the same appearance and size constraints, the small conformal antenna solution provided by the present application does not occupy the surrounding space of the main board 210, reuses the space between the battery assembly 500 and the housing assembly 100 in the electronic device 1000, and does not change the device. The appearance size of itself can save space, help the main board 210 to layout more abundant functional circuits, and the layout of the main board 210 can be optimized; reuse and the metal body 530 in the battery assembly 500 as a reference ground, realize the reuse of components, While saving the space around the main board 210, better antenna performance can be achieved.

The above are some embodiments of the present application. It should be pointed out that for those skilled in the art, without departing from the principles of the present application, several improvements and modifications can also be made, and these improvements and modifications may also be regarded as The protection scope of this application.

Claims (22)

1. An electronic device, comprising:

a housing assembly;

the circuit board assembly is arranged in the shell assembly;

the electronic assembly is arranged in the shell assembly, is adjacent to the circuit board assembly and is provided with a conductive piece, the conductive piece is used for electrically connecting a reference ground, and the conductive piece is opposite to the preset inner wall of the shell assembly; and

the antenna module, the antenna module includes the irradiator, the irradiator is located electrically conductive piece with between the predetermined inner wall of casing subassembly, the irradiator with electrically conductive coupling, the irradiator electricity is connected circuit board assembly.

2. The electronic device according to claim 1, wherein the electronic component includes a battery component, a case of the battery component includes a metal body, and the metal body on a predetermined side of the battery component forms the conductive member.

3. The electronic device of claim 2, wherein the radiator and the conductive member have an insulation gap therebetween, and a size of the insulation gap is greater than or equal to 1 mm.

4. The electronic device of claim 3, wherein an insulation gap between the radiator and the conductive member has a size of less than 1.5 mm.

5. The electronic device of claim 3, wherein the radiator is disposed on or attached to the predetermined inner wall of the housing assembly and conforms to the predetermined inner wall of the housing assembly.

6. The electronic device of claim 5, further comprising a dielectric support disposed within the insulating gap and supported by the radiator.

7. The electronic device of claim 6, wherein the media holder is integrally formed with a predetermined inner wall of the housing assembly; or, the medium support and the preset inner wall of the shell component are separately molded, and the radiator is fixed on the medium support.

8. The electronic device of claim 6, wherein the dielectric support is fixedly connected to the housing assembly, and a side of the dielectric support facing away from the radiator abuts a predetermined side of the battery assembly.

9. The electronic device of claim 8, further comprising a compressible buffer disposed between the predetermined side of the battery assembly and the media support.

10. The electronic device according to claim 2, wherein the conductive member includes a first arc-shaped surface, a middle side surface, and a second arc-shaped surface that are connected in this order in a thickness direction of the battery assembly; the radiator is arranged opposite to the middle side face; or at least part of the radiator is arranged opposite to the first arc-shaped surface; or at least part of the radiator is arranged opposite to the second arc-shaped surface.

11. The electronic device according to any one of claims 2 to 10, wherein the radiator is located on a surface facing a predetermined inner wall of the housing assembly.

12. The electronic device of claim 11, wherein the antenna assembly further comprises a flexible carrier board, the radiator being molded to the flexible carrier board.

13. The electronic device of claim 11, wherein the radiator is formed on the predetermined inner wall of the housing assembly through a laser direct structuring process or a printing direct structuring process.

14. The electronic device of claim 12, wherein the circuit board assembly and the battery assembly are aligned in a first direction, and the battery assembly and the antenna assembly are aligned in a second direction, the second direction being perpendicular to the first direction;

the flexible bearing board comprises a connecting portion and a bearing portion, the connecting portion is connected with the bearing portion, the connecting portion extends in the second direction, the bearing portion extends in the first direction, the connecting portion and the circuit board assembly are arranged oppositely, the bearing portion and the preset inner wall of the shell assembly are arranged oppositely, and the bearing portion is used for bearing the radiator.

15. The electronic device according to claim 14, wherein the circuit board assembly includes a main board, and the connecting portion is disposed opposite to the main board in a thickness direction.

16. The electronic device of claim 15, wherein the main board has a first supporting surface and a second supporting surface, the first supporting surface and the second supporting surface are disposed opposite to each other along a thickness direction of the main board, the connecting portion is disposed opposite to the second supporting surface, and the supporting portion is mounted between the predetermined inner wall of the housing assembly and the predetermined side surface of the battery assembly from a direction of the first supporting surface.

17. The electronic device according to claim 15, wherein when a dielectric support for supporting the carrying portion is disposed between the predetermined inner wall of the housing assembly and the predetermined side surface of the battery assembly, the flexible carrier board further includes a bending portion connected between the connecting portion and the carrying portion, and the bending portion bypasses the dielectric support along a gap between the side surface of the main board and the dielectric support and is connected to the carrying portion.

18. The electronic device of claim 15, wherein the antenna assembly further comprises at least one feed unit disposed at the connection portion, the feed unit electrically connecting the radiator to the radio frequency port on the board; and/or the feed unit is electrically connected with the radiator and the reference ground layer of the mainboard.

19. The electronic device of claim 18, wherein the circuit board assembly further comprises at least one conductive elastic sheet, one end of the conductive elastic sheet is elastically abutted and electrically connected with the feeding unit, and the other end of the conductive elastic sheet is fixed on the mainboard and electrically connected with the radio frequency port on the mainboard; and/or the other end of the conductive elastic sheet is fixed on the mainboard and is electrically connected with the reference stratum of the mainboard.

20. The electronic device according to claim 18, wherein the antenna assembly further comprises a reinforcing plate provided at the connecting portion and located on a side facing away from the feeding unit.

21. The electronic device of claim 15, wherein the battery assembly includes a battery and a first electrical connector electrically connected to the battery, the first electrical connector electrically connected to the conductive member;

the circuit board assembly further comprises a second electric connector arranged on the mainboard, the second electric connector is electrically connected with the reference stratum of the mainboard, and the conductive piece is electrically connected with the reference stratum through the first electric connector and the second electric connector.

22. The electronic device according to any one of claims 1 to 10, wherein the predetermined inner wall of the housing assembly is made of an insulating material; the preset inner wall of the shell component is a plane or a curved surface.

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