CN120023993B - Method and device for determining casting parameters of injection mold of connector busbar - Google Patents

Method and device for determining casting parameters of injection mold of connector busbar

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Publication number
CN120023993B
CN120023993B CN202510510495.0A CN202510510495A CN120023993B CN 120023993 B CN120023993 B CN 120023993B CN 202510510495 A CN202510510495 A CN 202510510495A CN 120023993 B CN120023993 B CN 120023993B
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parameters
optional
mold
array
evaluation index
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CN120023993A (en
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杨昌伍
章奇
彭银文
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Shenzhen Gvtong Electronic Technology Co ltd
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Shenzhen Gvtong Electronic Technology Co ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/76Measuring, controlling or regulating
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T17/00Three-dimensional [3D] modelling for computer graphics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29LINDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00Other particular articles
    • B29L2031/34Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/36Plugs, connectors, or parts thereof
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/14Force analysis or force optimisation, e.g. static or dynamic forces

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Geometry (AREA)
  • General Physics & Mathematics (AREA)
  • Software Systems (AREA)
  • Computer Graphics (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

本发明提供一种连接器汇流排的注塑模具浇头参数的确定方法及装置,所述确定方法包括:获取连接器汇流排的目标参数;根据所述连接器汇流排的目标参数,确定所述连接器汇流排的三维模型;获取与所述三维模型匹配的注塑模具的可选浇头参数;根据所述注塑模具的可选浇头参数,得到所述可选浇头参数对应的多个评估指标;根据所述多个评估指标,确定可选浇头参数的最优组合参数。本发明实施例能够精准规划浇头的位置与数量,显著提升连接器汇流排产品质量。

The present invention provides a method and device for determining the pouring parameters of the injection mold of a connector bus, the determination method comprising: obtaining the target parameters of the connector bus; determining the three-dimensional model of the connector bus according to the target parameters of the connector bus; obtaining the optional pouring parameters of the injection mold matching the three-dimensional model; obtaining multiple evaluation indicators corresponding to the optional pouring parameters according to the optional pouring parameters of the injection mold; and determining the optimal combination parameters of the optional pouring parameters according to the multiple evaluation indicators. The embodiment of the present invention can accurately plan the position and quantity of the pouring, and significantly improve the product quality of the connector bus.

Description

Method and device for determining casting parameters of injection mold of connector busbar
Technical Field
The embodiment of the invention relates to the technical field of plastic processing, in particular to a method and a device for determining casting parameters of an injection mold of a connector busbar.
Background
In the injection molding production of connector buses, the design and performance of the injection mold play a decisive role in product quality and production efficiency. In the flowing and cooling process of plastic in a die cavity, the plastic is greatly influenced by the positions and the quantity of the set toppings, and the defects of uneven temperature, poor cooling shaping, concentrated internal stress and the like of the die can be caused due to unreasonable settings of the positions and the quantity of the toppings.
Disclosure of Invention
The technical problem to be solved by the embodiment of the invention is to provide a method and a device for determining the parameters of the toppings of the injection mold of the connector busbar, which can accurately plan the positions and the number of the toppings and obviously improve the product quality of the connector busbar.
In order to solve the technical problems, the technical scheme of the embodiment of the invention is as follows:
a method of determining injection mold topping parameters of a connector buss, comprising:
acquiring target parameters of a connector bus;
Determining a three-dimensional model of the connector busbar according to the target parameters of the connector busbar;
Acquiring optional topping parameters of an injection mold matched with the three-dimensional model;
obtaining a plurality of evaluation indexes corresponding to selectable pouring parameters according to the selectable pouring parameters of the injection mold;
And determining optimal combination parameters of the selectable topping parameters according to the plurality of evaluation indexes.
Optionally, the acquiring the target parameter of the connector bus includes:
The geometry, dimensional accuracy and wall thickness distribution of the connector buss are obtained.
Optionally, the determining the three-dimensional model of the connector bus according to the target parameter of the connector bus includes:
acquiring physical performance parameters of injection molding materials of the connector bus;
and determining a three-dimensional model of the connector busbar according to the physical property parameters of the injection molding material and the target parameters of the connector busbar.
Optionally, obtaining optional topping parameters of the injection mold matching the three-dimensional model, comprising:
acquiring positions and the number of the toppings of the injection mold which can be set;
Determining an optional topping parameter from P (x) = { s|s ⊆ x }, the optional topping parameter being a combination of the location and number at which topping can be set,
Where x= (x 1,...,xn),x1,...,xn is the position where the topping can be set, n is the number of topping can be set, S is any subset of array x, and P (x) is the set of all subsets of array x.
Optionally, according to the selectable topping parameters of the injection mold, obtaining a plurality of evaluation indexes corresponding to the selectable topping parameters includes:
performing die flow analysis on the three-dimensional model of the connector busbar to obtain a die temperature distribution cloud chart, die cooling time data and a residual stress distribution cloud chart corresponding to the array x;
determining a mold temperature evaluation index corresponding to the array x according to the mold temperature distribution cloud picture;
determining a cooling time evaluation index corresponding to the array x according to the mold cooling time data;
and determining a cooling effect evaluation index corresponding to the array x according to the residual stress distribution cloud picture.
Optionally, determining, according to the mold temperature distribution cloud chart, a mold temperature evaluation index corresponding to the array x includes:
obtaining the total difference A i between the temperature value of each region of the die and the set temperature interval and the standard deviation B i of the specific temperature value of each region of the die according to the die temperature distribution cloud chart,
Wherein i is the index of array x, i=n (n+1)/2, n being the number of toppings that can be set;
And determining a die temperature evaluation index R i corresponding to the array x according to the total difference A i and the standard deviation B i.
Optionally, determining, according to the mold cooling time data, a cooling time evaluation index corresponding to the array x includes:
Determining a first difference C i between the overall cooling time and the set cooling time of the mold and a second difference D i between the maximum cooling time and the minimum cooling time of each region of the mold according to the mold cooling time data,
Wherein i is the index of array x, i=n (n+1)/2, n being the number of toppings that can be set;
And determining a cooling time evaluation index S i corresponding to the array x according to the first difference C i and the second difference D i.
Optionally, determining, according to the residual stress distribution cloud chart, a cooling effect evaluation index corresponding to the array x includes:
Determining the change rate E i of the temperature in unit distance of the whole die and the standard deviation F i of the residual stress of each region of the die according to the residual stress distribution cloud chart,
Where i is the index of all combinations of the positions and numbers where the topping can be set, i=n (n+1)/2, n being the number where the topping can be set;
And determining a cooling effect evaluation index T i corresponding to the array x according to the change rate E i and the standard deviation F i.
Optionally, determining an optimal combination of selectable topping parameters according to the plurality of evaluation indicators, including:
Determining the fitness value of the evaluation index corresponding to all the optional topping parameters according to Y i=rRi+sSi+tTi;
Wherein Y i is an optional evaluation index fitness value corresponding to a topping parameter, R i is a mold temperature evaluation index corresponding to an array x, S i is a cooling time evaluation index corresponding to an array x, T i is a cooling effect evaluation index corresponding to an array x, i=n (n+1)/2, n is the number of topping that can be set, R, S, T are weight coefficients, and r+s+t=1;
Determining minimum evaluation index fitness values corresponding to all optional topping parameters according to z=min (Y i);
wherein Z is the minimum value of the evaluation index fitness values corresponding to all optional topping parameters, and Y i is the evaluation index fitness value corresponding to the optional topping parameters;
Determining the positions and the number of the toppings corresponding to the minimum value of the evaluation index fitness values corresponding to all the selectable topping parameters;
And determining the position and the number of the topping settings corresponding to the minimum fitness value as the optimal parameters of the selectable topping parameters.
The embodiment of the invention also provides a device for determining the casting parameters of the injection mold of the connector busbar, which comprises the following steps:
The acquisition module is used for acquiring target parameters of the connector busbar and optional topping parameters of the injection mold matched with the three-dimensional model;
The processing module is used for determining a three-dimensional model of the connector busbar according to the target parameter of the connector busbar, obtaining a plurality of evaluation indexes corresponding to the optional topping parameters according to the optional topping parameters of the injection mold, and determining the optimal combination parameters of the optional topping parameters according to the plurality of evaluation indexes.
The scheme of the embodiment of the invention at least comprises the following beneficial effects:
According to the scheme provided by the embodiment of the invention, the three-dimensional model is constructed by acquiring the target parameters of the connector bus, and the optional topping parameters of the injection mold and the corresponding evaluation indexes thereof are determined based on the three-dimensional model, so that the optimal combination parameters are obtained. The process can accurately plan the positions and the quantity of the toppings, and effectively avoid the problem of uneven temperature of the die caused by unreasonable setting. When the plastic fills the mold cavity, the reasonably distributed pouring heads can enable the plastic to uniformly flow into all parts, and ensure that the temperatures of all parts of the mold tend to be consistent, so that product defects such as local deformation, surface flaws and the like caused by temperature difference are reduced, and the quality of the connector busbar is remarkably improved.
The determined optimal combination of topping parameters enables optimization of the cooling process of the plastic within the mold. The proper position and quantity of the pouring heads can enable the cooling medium to act on the die more uniformly, so that the cooling speed of the plastic is consistent, and the problems of inconsistent shrinkage, size deviation and the like of products caused by uneven cooling are avoided.
Unreasonable topping settings are often a significant cause of stress concentrations within the product. The method can effectively reduce the occurrence of the situation through a scientific parameter determination process. The optimized pouring parameters enable the internal stress distribution to be more uniform when the plastic is filled and cooled in the cavity, and the risks of cracking, warping and other defects of the product due to the concentration of the internal stress are reduced.
The method can remarkably improve the product quality and reduce the product defects caused by unreasonable parameters of the die topping, thereby greatly reducing the rejection rate. In the production process, the generation of waste products wastes raw materials and energy, and increases the production cost and the production time.
Drawings
Fig. 1 is a flow chart of a method for determining parameters of an injection mold topping of a connector busbar according to an embodiment of the present invention.
Fig. 2 is a schematic block diagram of an apparatus for determining parameters of an injection mold topping of a connector bus according to an embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
As shown in fig. 1, an embodiment of the present invention provides a method for determining a topping parameter of an injection mold of a connector busbar, including:
step 11, obtaining target parameters of the connector bus;
step 12, determining a three-dimensional model of the connector busbar according to the target parameters of the connector busbar;
Step 13, obtaining optional topping parameters of the injection mold matched with the three-dimensional model;
step 14, obtaining a plurality of evaluation indexes corresponding to the optional topping parameters according to the optional topping parameters of the injection mold;
and step 15, determining optimal combination parameters of the optional topping parameters according to the plurality of evaluation indexes.
In this example, a three-dimensional model is constructed by obtaining target parameters of the connector bus, and based thereon, optional topping parameters of the injection mold and their corresponding evaluation indices are determined, thereby obtaining optimal combination parameters. The process can accurately plan the positions and the quantity of the toppings, and effectively avoid the problem of uneven temperature of the die caused by unreasonable setting. When the plastic fills the mold cavity, the reasonably distributed pouring heads can enable the plastic to uniformly flow into all parts, and ensure that the temperatures of all parts of the mold tend to be consistent, so that product defects such as local deformation, surface flaws and the like caused by temperature difference are reduced, and the quality of the connector busbar is remarkably improved.
The determined optimal combination of topping parameters enables optimization of the cooling process of the plastic within the mold. The proper position and quantity of the pouring heads can enable the cooling medium to act on the die more uniformly, so that the cooling speed of the plastic is consistent, and the problems of inconsistent shrinkage, size deviation and the like of products caused by uneven cooling are avoided.
Unreasonable topping settings are often a significant cause of stress concentrations within the product. The method can effectively reduce the occurrence of the situation through a scientific parameter determination process. The optimized pouring parameters enable the internal stress distribution to be more uniform when the plastic is filled and cooled in the cavity, and the risks of cracking, warping and other defects of the product due to the concentration of the internal stress are reduced.
The method can remarkably improve the product quality and reduce the product defects caused by unreasonable parameters of the die topping, thereby greatly reducing the rejection rate. In the production process, the generation of waste products wastes raw materials and energy, and increases the production cost and the production time.
In an optional embodiment of the present invention, in step 11, the obtaining the target parameters of the connector bus includes:
step 111, the geometry, dimensional accuracy and wall thickness distribution of the connector buss are obtained.
In step 12, the determining the three-dimensional model of the connector bus according to the target parameters of the connector bus includes:
step 121, obtaining physical performance parameters of injection molding materials of the connector bus;
Step 122, determining a three-dimensional model of the connector bus according to the physical property parameters of the injection molding material and the target parameters of the connector bus.
In particular, the physical property parameters may include melt viscosity, thermal conductivity, specific heat capacity, shrinkage, and elastic modulus.
In this example, the target parameters such as geometry, dimensional accuracy, and wall thickness distribution of the connector bus are obtained through step 111, which provides accurate basic data for the subsequent construction of the three-dimensional model. These parameters are the core features of the connector bus, and accurately acquiring them enables the three-dimensional model to truly restore the actual form of the product, avoiding design deviations caused by the fact that the model does not conform to the actual product. When the three-dimensional model is constructed, the position and the size of each part can be accurately determined based on the accurate geometric shape and the dimensional precision, so that the model is highly consistent with the actual product in appearance and size.
Step 121 obtains physical properties such as melt viscosity, thermal conductivity, specific heat capacity, shrinkage, and elastic modulus of the injection molding material, and determines a three-dimensional model in step 122 by combining these parameters with the target parameters. In this way, the influence of the material characteristics on the product molding can be fully considered in the model construction process.
In an optional embodiment of the present invention, in step 13, obtaining optional topping parameters of the injection mold matched to the three-dimensional model includes:
step 131, acquiring the positions and the quantity of the toppings of the injection mold which can be set;
Step 132, determining an optional topping parameter, which is a combination of the location and number at which the topping can be set, from P (x) = { s|s ⊆ x },
Where x= (x 1,...,xn),x1,...,xn is the position where the topping can be set, n is the number of topping can be set, S is any subset of array x, and P (x) is the set of all subsets of array x.
In this example, by obtaining the locations and amounts at which the injection mold tips can be set in step 131, and then using P (x) = { s|s ⊆ x } in step 132 to determine the optional tip parameters, all possible combinations of tip locations and amounts can be listed comprehensively and systematically. This means that no one potential topping set-up scheme is missed, providing a rich choice space for subsequent evaluation and selection. When designing injection molds, different topping settings have an important impact on the flow path and filling effect of the plastic melt, and comprehensive scheme enumeration helps to find the topping setting mode most suitable for the three-dimensional model of the connector bus.
Analysis of all possible combinations of topping parameters provides insight into the behavior of each setting during plastic filling and cooling. By simulating the flow conditions of the plastic melt under different combinations and the influence on the quality of the final product, the advantages and disadvantages of various schemes can be more accurately evaluated. This comprehensive search helps to find some topping arrangements that may be overlooked, but have a significant effect on product quality and production efficiency.
The reasonable pouring head arrangement can optimize the flow path of the plastic melt in the die cavity, so that the melt can more uniformly fill the die cavity, and defects caused by unsmooth flow, such as short shot, trapped air and the like, are reduced. By evaluating a combination of various selectable topping parameters, an optimal solution for melt flow can be found, thereby improving the molding quality of the product. For the connector busbar with complex shape, proper pouring head arrangement can ensure that the melt can be smoothly filled into all corners, and the situation of partial insufficient filling is avoided.
Improper topping settings can cause stress concentrations within the product, affecting the mechanical properties and service life of the product. By comprehensively considering various optional topping parameter combinations, a scheme capable of enabling internal stress distribution to be more uniform can be selected, and risks of cracking, deformation and the like of products due to the internal stress problem are reduced. The reasonable arrangement of the pouring head can lead the plastic to shrink uniformly in the cooling process, and reduce the generation of internal stress.
In an optional embodiment of the present invention, in step 14, according to an optional topping parameter of the injection mold, obtaining a plurality of evaluation indexes corresponding to the optional topping parameter includes:
Step 141, performing die flow analysis on the three-dimensional model of the connector busbar to obtain a die temperature distribution cloud chart, die cooling time data and a residual stress distribution cloud chart corresponding to the array x;
step 142, determining a mold temperature evaluation index corresponding to the array x according to the mold temperature distribution cloud chart;
Step 143, determining a cooling time evaluation index corresponding to the array x according to the mold cooling time data;
And 144, determining a cooling effect evaluation index corresponding to the array x according to the residual stress distribution cloud chart.
In this example, the mold temperature distribution cloud image is obtained by performing the mold flow analysis in step 141, and then the mold temperature evaluation index is determined in step 142, so that the temperature distribution situation of the mold under different optional topping parameters can be precisely mastered. This helps to find areas of non-uniform temperature which may lead to product deformation, sink marks, etc. Based on the evaluation indexes, the parameters of the pouring head can be adjusted, so that the temperature distribution of the die is more uniform, the forming quality of the connector busbar is further improved, and the dimensional accuracy and the appearance quality of the product are ensured.
The cloud chart of the residual stress distribution obtained in the step 141 and the cooling effect evaluation index determined in the step 144 can clearly understand the residual stress condition inside the product. The excessive residual stress can reduce the mechanical property and reliability of the product, and the product is easy to crack in the use process. Through analysis and evaluation indexes and adjustment of the parameters of the toppings, the residual stress of the product can be effectively reduced, and the strength and durability of the product are improved.
The accurate evaluation index is helpful for determining the most suitable casting parameters, so that the injection molding process is more stable. The stable production process can reduce the quality problem and production failure of the product caused by parameter fluctuation, reduce the rejection rate and improve the production efficiency and the production continuity.
In an optional embodiment of the present invention, in step 142, determining, according to the mold temperature distribution cloud chart, a mold temperature evaluation index corresponding to the array x includes:
Step 1421, obtaining the total difference A i between the temperature value of each region of the die and the set temperature interval and the standard deviation B i of the specific temperature value of each region of the die according to the die temperature distribution cloud chart,
Wherein i is the index of array x, i=n (n+1)/2, n being the number of toppings that can be set;
Step 1422, determining a mold temperature evaluation index R i corresponding to the array x according to the total difference a i and the standard deviation B i.
Specifically, the temperature value of each region is compared with the upper limit and the lower limit of the set temperature interval, the difference value between the temperature value and the interval boundary is calculated,
Adding the differences of all the areas to obtain a total difference A i;
according to B i = Determining standard deviation of specific temperature values of each region of the mold,
Wherein m is the number of areas,K is the average temperature value of each region, j is the index of the temperature value of each region;
Determining a mold temperature evaluation index corresponding to the array x according to R i=aAi+bBi,
Wherein R i is a mold temperature evaluation index corresponding to the array x, a i is a total difference between a specific temperature value of each region of the mold and a set temperature interval, B i is a standard deviation of a specific temperature value of each region of the mold, a and B are weight coefficients, and a+b=1.
In step 143, determining a cooling time evaluation index corresponding to the array x according to the mold cooling time data, including:
Step 1431, determining a first difference value C i between the cooling time of the whole mold and the set cooling time, and a second difference value D i between the maximum cooling time and the minimum cooling time of each region of the mold according to the cooling time data of the mold,
Wherein i is the index of array x, i=n (n+1)/2, n being the number of toppings that can be set;
In step 1432, the cooling time evaluation index S i corresponding to the array x is determined according to the first difference C i and the second difference D i.
Specifically, comparing the overall cooling time data with the set cooling time, and calculating a difference C i;
comparing the maximum cooling time and the minimum cooling time of each region of the die, and calculating a difference D i;
Determining a cooling time evaluation index corresponding to the array x according to S i=cCi+dDi,
Wherein S i is a cooling time evaluation index corresponding to the group x, C i is a difference between the cooling time of the whole mold and the set cooling time, D i is a difference between the maximum cooling time and the minimum cooling time of each region of the mold, C, D are weight coefficients, and c+d=1.
In step 144, determining a cooling effect evaluation index corresponding to the array x according to the residual stress distribution cloud chart, including:
Step 1441, determining a rate of change E i of temperature in unit distance of the whole die and a standard deviation F i of residual stress of each region of the die according to the residual stress distribution cloud chart,
Where i is the index of all combinations of the positions and numbers where the topping can be set, i=n (n+1)/2, n being the number where the topping can be set;
Step 1442, determining a cooling effect evaluation index T i corresponding to the array x according to the change rate E i and the standard deviation F i.
Specifically, according to E i =Determining the rate of change of temperature per unit distance of the mold as a whole,
Wherein E i is the rate of change of temperature per unit distance of the whole die,Is the average value of the temperature variation in unit distance of each point of the whole die,The unit distance of each point of the whole die is;
according to F i = Determining standard deviation of specific temperature values of each region of the mold,
Wherein m is the number of areas,The temperature value of each region is represented by g, the average temperature value of each region is represented by l, and the index of the temperature value of each region is represented by l;
determining a cooling effect evaluation index corresponding to the array x according to T i=eEi+fFi,
Wherein T i is a cooling effect evaluation index corresponding to the array x, E i is a rate of change of temperature in a unit distance of the whole mold, F i is a standard deviation of residual stress of each region of the mold, E, F is a weight coefficient, and e+f=1.
In this example, the total difference a i between the area temperature value and the set temperature interval of each area of the die and the standard deviation B i of the specific temperature value are calculated in step 142, and the die temperature evaluation index R i is determined according to the total difference, so that the die temperature distribution can be accurately measured. The total difference reflects the deviation degree of the whole temperature and the set interval, and the standard deviation shows the discreteness of the temperature distribution. The method is favorable for finding out abnormal temperature areas, timely adjusting the parameters of the pouring heads, enabling the temperature of the die to be closer to a set interval and to be distributed more uniformly, avoiding defects of sink marks, deformation and the like of products caused by uneven temperature, and improving the quality of the connector busbar.
In step 143, a cooling time evaluation index S i is determined by calculating a first difference C i between the overall cooling time and the set cooling time of the mold and a second difference D i between the maximum cooling time and the minimum cooling time of each region of the mold. The first difference value can intuitively reflect whether the overall cooling time accords with the expectation or not, and the second difference value can embody the difference of the cooling time of each region. By selecting proper topping parameters based on the indexes, the overall cooling time can be shortened, the difference of cooling time of each area can be reduced, the production efficiency can be improved, and the injection molding cycle can be shortened.
In step 144, the rate of change E i of the temperature per unit distance of the entire mold and the standard deviation F i of the residual stress of each region of the mold are determined to obtain a cooling effect evaluation index T i. The temperature change rate reflects the uniformity of the cooling process, and the standard deviation of the residual stress is related to the distribution of the residual stress in the product. The reasonable cooling effect can reduce the residual stress in the product, reduce the cracking and deformation risks, ensure the mechanical property and the dimensional stability of the product and improve the quality of the product.
The optimization of each evaluation index to the casting parameters is integrated, so that the temperature control and cooling process in the injection molding process is more stable and efficient, the production interruption or adjustment caused by the temperature and cooling problem is reduced, the production flow is smoother, the production continuity is improved, and the overall production efficiency is improved.
And quantifying key factors such as the temperature, the cooling time, the cooling effect and the like of the die by using each evaluation index in a specific calculation mode. The quantitative evaluation mode provides clear and accurate basis for decision makers, so that the decision makers can more scientifically compare the advantages and disadvantages of different topping parameter combinations, thereby making a more reasonable decision, selecting the optimal topping parameter, and improving the accuracy and reliability of the decision.
The respective evaluation indexes evaluate the injection molding process from different angles, and are comprehensively considered through weight coefficients (such as a, b, c, d, e, f). The multi-factor comprehensive consideration mode reflects the influence of the casting parameters on the injection molding process and the product quality more comprehensively, avoids the limitation of single-factor decision making, and is helpful for finding the best scheme considering the product quality and the production efficiency.
In an optional embodiment of the present invention, in step 15, determining an optimal combination parameter of optional topping parameters according to the plurality of evaluation indexes includes:
step 151, determining the fitness value of the evaluation index corresponding to all the optional topping parameters according to Y i=rRi+sSi+tTi,
Wherein Y i is an optional evaluation index fitness value corresponding to a topping parameter, R i is a mold temperature evaluation index corresponding to an array x, S i is a cooling time evaluation index corresponding to an array x, T i is a cooling effect evaluation index corresponding to an array x, i=n (n+1)/2, n is the number of topping that can be set, R, S, T are weight coefficients, and r+s+t=1;
Step 152, determining minimum value of the evaluation index fitness value corresponding to all optional topping parameters according to z=min (Y i),
Wherein Z is the minimum value of the evaluation index fitness values corresponding to all optional topping parameters, and Y i is the evaluation index fitness value corresponding to the optional topping parameters;
step 153, determining the positions and the number of the toppings corresponding to the minimum value of the fitness value of the evaluation index corresponding to all the optional toppings parameters;
and 154, determining the position and the number of the topping settings corresponding to the minimum fitness value as the optimal parameters of the selectable topping parameters.
In this example, step 151 calculates the evaluation index fitness value by the formula Y i=rRi+sSi+tTi, and integrates the mold temperature evaluation index R i, the cooling time evaluation index S i, and the cooling effect evaluation index T i. The temperature, cooling time and cooling effect of the die can have important influence on the quality of the product, and the comprehensive consideration can comprehensively reflect the influence of the parameters of the topping on the quality of the product.
The minimum value Z of the evaluation index fitness value is found by step 152, and the corresponding topping setting position and number are determined as optimal parameters in steps 153 and 154. This enables precise selection of the combination of topping parameters that optimize product quality. For example, in injection molding a connector buss, optimal topping parameters ensure that the plastic fills the mold cavity uniformly, making the performance of the various parts of the product more consistent.
The different topping parameters have different effects on the mold temperature, cooling time and cooling effect. By comprehensively evaluating the index fitness value, a balance point can be found, and the production efficiency is optimized to the greatest extent on the premise of ensuring the product quality.
After the optimal topping parameters are determined, the number of adjustments due to unsuitable parameters can be reduced during the production process. The stable topping parameters are beneficial to maintaining the continuity and stability of production, avoiding frequent debugging and shutdown and improving the production efficiency.
Suitable topping parameters may optimize the mold temperature and cooling process, reducing the energy consumption required for heating and cooling.
By finding the minimum value of the fitness value of the evaluation index to determine the optimal topping parameters, the best solution can be accurately screened out of numerous alternative topping parameter combinations.
The method and the device accurately control the temperature of the die, discover and solve the problem of uneven temperature by calculating the related temperature index, avoid the defects of product deformation and the like, optimize the cooling process, reduce residual stress, improve mechanical properties, ensure the even flow of melt, prevent the conditions of short shot and the like, and ensure the filling effect of products with complex shapes.
The method has the advantages of shortening the cooling time, selecting proper casting parameters according to the cooling time evaluation index, shortening the molding period, stabilizing the production, reducing the product problems and faults caused by parameter fluctuation, reducing the rejection rate and avoiding frequent debugging and shutdown.
The method reduces the rejection rate, reduces the waste of raw materials and energy sources, saves energy sources, optimizes the temperature and cooling process and reduces the energy consumption of equipment.
The quantitative evaluation system is constructed to specifically calculate quantitative key factors to form indexes, then calculate fitness values comprehensively to provide scientific basis, and the influence of the parameters of the toppings is comprehensively reflected by the multi-factor comprehensive consideration by means of weight coefficients, so that one-sided decision is avoided, and an optimal scheme is found.
As shown in fig. 2, an embodiment of the present invention further provides a determining apparatus 20 for determining a topping parameter of an injection mold of a connector bus, including:
an acquisition module 21 for acquiring target parameters of the connector busbar and optional topping parameters of the injection mold matched with the three-dimensional model;
The processing module 22 is configured to determine a three-dimensional model of the connector busbar according to the target parameter of the connector busbar, obtain a plurality of evaluation indexes corresponding to the selectable topping parameters according to the selectable topping parameters of the injection mold, and determine an optimal combination parameter of the selectable topping parameters according to the plurality of evaluation indexes.
Optionally, the acquiring the target parameter of the connector bus includes:
The geometry, dimensional accuracy and wall thickness distribution of the connector buss are obtained.
Optionally, the determining the three-dimensional model of the connector bus according to the target parameter of the connector bus includes:
acquiring physical performance parameters of injection molding materials of the connector bus;
and determining a three-dimensional model of the connector busbar according to the physical property parameters of the injection molding material and the target parameters of the connector busbar.
Optionally, obtaining optional topping parameters of the injection mold matching the three-dimensional model, comprising:
acquiring positions and the number of the toppings of the injection mold which can be set;
Determining an optional topping parameter from P (x) = { s|s ⊆ x }, the optional topping parameter being a combination of the location and number at which topping can be set,
Where x= (x 1,...,xn),x1,...,xn is the position where the topping can be set, n is the number of topping can be set, S is any subset of array x, and P (x) is the set of all subsets of array x.
Optionally, according to the selectable topping parameters of the injection mold, obtaining a plurality of evaluation indexes corresponding to the selectable topping parameters includes:
performing die flow analysis on the three-dimensional model of the connector busbar to obtain a die temperature distribution cloud chart, die cooling time data and a residual stress distribution cloud chart corresponding to the array x;
determining a mold temperature evaluation index corresponding to the array x according to the mold temperature distribution cloud picture;
determining a cooling time evaluation index corresponding to the array x according to the mold cooling time data;
and determining a cooling effect evaluation index corresponding to the array x according to the residual stress distribution cloud picture.
Optionally, determining, according to the mold temperature distribution cloud chart, a mold temperature evaluation index corresponding to the array x includes:
obtaining the total difference A i between the temperature value of each region of the die and the set temperature interval and the standard deviation B i of the specific temperature value of each region of the die according to the die temperature distribution cloud chart,
Wherein i is the index of array x, i=n (n+1)/2, n being the number of toppings that can be set;
And determining a die temperature evaluation index R i corresponding to the array x according to the total difference A i and the standard deviation B i.
Optionally, determining, according to the mold cooling time data, a cooling time evaluation index corresponding to the array x includes:
Determining a first difference C i between the overall cooling time and the set cooling time of the mold and a second difference D i between the maximum cooling time and the minimum cooling time of each region of the mold according to the mold cooling time data,
Wherein i is the index of array x, i=n (n+1)/2, n being the number of toppings that can be set;
And determining a cooling time evaluation index S i corresponding to the array x according to the first difference C i and the second difference D i.
Optionally, determining, according to the residual stress distribution cloud chart, a cooling effect evaluation index corresponding to the array x includes:
Determining the change rate E i of the temperature in unit distance of the whole die and the standard deviation F i of the residual stress of each region of the die according to the residual stress distribution cloud chart,
Where i is the index of all combinations of the positions and numbers where the topping can be set, i=n (n+1)/2, n being the number where the topping can be set;
And determining a cooling effect evaluation index T i corresponding to the array x according to the change rate E i and the standard deviation F i.
Optionally, determining an optimal combination of selectable topping parameters according to the plurality of evaluation indicators, including:
Determining the fitness value of the evaluation index corresponding to all the optional topping parameters according to Y i=rRi+sSi+tTi;
Wherein Y i is an optional evaluation index fitness value corresponding to a topping parameter, R i is a mold temperature evaluation index corresponding to an array x, S i is a cooling time evaluation index corresponding to an array x, T i is a cooling effect evaluation index corresponding to an array x, i=n (n+1)/2, n is the number of topping that can be set, R, S, T are weight coefficients, and r+s+t=1;
Determining minimum evaluation index fitness values corresponding to all optional topping parameters according to z=min (Y i);
wherein Z is the minimum value of the evaluation index fitness values corresponding to all optional topping parameters, and Y i is the evaluation index fitness value corresponding to the optional topping parameters;
Determining the positions and the number of the toppings corresponding to the minimum value of the evaluation index fitness values corresponding to all the selectable topping parameters;
And determining the position and the number of the topping settings corresponding to the minimum fitness value as the optimal parameters of the selectable topping parameters.
It should be noted that the apparatus is an apparatus corresponding to the above method, and all implementation manners in the above method embodiment are applicable to this embodiment, so that the same technical effects can be achieved.
While the foregoing is directed to the preferred embodiments of the present invention, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present invention, and such modifications and adaptations are intended to be comprehended within the scope of the present invention.

Claims (7)

1.一种连接器汇流排的注塑模具浇头参数的确定方法,其特征在于,包括:1. A method for determining injection mold casting parameters of a connector bus, characterized by comprising: 获取连接器汇流排的目标参数;Get the target parameters of the connector bus; 根据所述连接器汇流排的目标参数,确定所述连接器汇流排的三维模型;Determining a three-dimensional model of the connector bus according to target parameters of the connector bus; 获取与所述三维模型匹配的注塑模具的可选浇头参数;Acquire optional pouring parameters of the injection mold matching the three-dimensional model; 根据所述注塑模具的可选浇头参数,得到所述可选浇头参数对应的多个评估指标;According to the optional pouring head parameters of the injection mold, a plurality of evaluation indicators corresponding to the optional pouring head parameters are obtained; 根据所述多个评估指标,确定可选浇头参数的最优组合参数;Determining the optimal combination parameters of the optional topping parameters according to the multiple evaluation indicators; 其中,获取与所述三维模型匹配的注塑模具的可选浇头参数,包括:Wherein, obtaining optional pouring head parameters of the injection mold matching the three-dimensional model includes: 获取所述注塑模具的浇头可被设置的位置以及数量;Obtaining the positions and quantities at which the pouring heads of the injection mold can be set; 根据Px)={S|Sx},确定可选浇头参数,所述可选浇头参数为浇头可被设置的位置以及数量的组合,According to P ( x ) = { S | Sx }, the optional topping parameters are determined, where the optional topping parameters are a combination of the position and quantity at which the topping can be set. 其中,x=(x 1,...,x n),x 1,...,x n为浇头可被设置的位置,n为浇头可被设置的数量,S为数组x的任一子集,Px)为数组x的所有子集的集合;Where, x = ( x1 , ... , xn ) , x1 , ..., xn are the positions where toppings can be set, n is the number of toppings that can be set, S is any subset of the array x , and P ( x ) is the set of all subsets of the array x ; 其中,根据所述注塑模具的可选浇头参数,得到所述可选浇头参数对应的多个评估指标,包括:Among them, according to the optional pouring head parameters of the injection mold, a plurality of evaluation indicators corresponding to the optional pouring head parameters are obtained, including: 对所述连接器汇流排的三维模型进行模流分析,得到数组x对应的模具温度分布云图、模具冷却时间数据和残余应力分布云图;Performing mold flow analysis on the three-dimensional model of the connector busbar to obtain a mold temperature distribution cloud map, mold cooling time data, and a residual stress distribution cloud map corresponding to the array x ; 根据所述模具温度分布云图,确定数组x对应的模具温度评估指标;Determine the mold temperature evaluation index corresponding to the array x according to the mold temperature distribution cloud map; 根据所述模具冷却时间数据,确定数组x对应的冷却时间评估指标;Determine the cooling time evaluation index corresponding to the array x according to the mold cooling time data; 根据所述残余应力分布云图,确定数组x对应的冷却效果评估指标;Determine the cooling effect evaluation index corresponding to the array x according to the residual stress distribution cloud map; 其中,根据所述多个评估指标,确定可选浇头参数的最优组合参数,包括:Wherein, according to the multiple evaluation indicators, the optimal combination parameters of the optional topping parameters are determined, including: 根据Y i=rR i+sS i+tT i确定所有可选的浇头参数对应的评估指标适应度值;Determine the fitness values of the evaluation indicators corresponding to all optional topping parameters according to Yi = rRi + sSi + tTi ; 其中,Y i为可选的浇头参数对应的评估指标适应度值,R i为数组x对应的模具温度评估指标,S i为数组x对应的冷却时间评估指标,T i为数组x对应的冷却效果评估指标,i=nn+1)/2,n为浇头可被设置的数量,r,s,t为权重系数,且r+s+t=1;Among them, Yi is the fitness value of the evaluation index corresponding to the optional pouring parameter , Ri is the mold temperature evaluation index corresponding to the array x , Si is the cooling time evaluation index corresponding to the array x , Ti is the cooling effect evaluation index corresponding to the array x, i=n ( n +1)/2 , n is the number of pourings that can be set, r, s, t are weight coefficients, and r+s+t =1; 根据Z=minY i)确定所有可选的浇头参数对应的评估指标适应度值最小值;According to Z = min ( Y i ), determine the minimum fitness value of the evaluation index corresponding to all optional topping parameters; 其中,Z为所有可选的浇头参数对应的评估指标适应度值最小值,Y i为可选的浇头参数对应的评估指标适应度值;Wherein, Z is the minimum fitness value of the evaluation index corresponding to all optional topping parameters, Yi is the fitness value of the evaluation index corresponding to the optional topping parameters; 确定所有可选的浇头参数对应的评估指标适应度值最小值对应的浇头设置的位置以及数量;Determine the location and quantity of toppings corresponding to the minimum fitness value of the evaluation index corresponding to all optional topping parameters; 将所述适应度值最小值对应的浇头设置的位置以及数量,确定为可选的浇头参数的最优参数。The position and quantity of the toppings corresponding to the minimum fitness value are determined as the optimal parameters of the optional topping parameters. 2.根据权利要求1所述的连接器汇流排的注塑模具浇头参数的确定方法,其特征在于,所述获取连接器汇流排的目标参数,包括:2. The method for determining injection mold casting parameters of a connector bus according to claim 1, wherein obtaining target parameters of the connector bus comprises: 获取连接器汇流排的几何形状、尺寸精度和壁厚分布。Capture the geometry, dimensional accuracy, and wall thickness distribution of connector busbars. 3.根据权利要求2所述的连接器汇流排的注塑模具浇头参数的确定方法,其特征在于,所述根据连接器汇流排的目标参数,确定所述连接器汇流排的三维模型,包括:3. The method for determining injection mold casting parameters of a connector bus according to claim 2, wherein determining the three-dimensional model of the connector bus according to the target parameters of the connector bus comprises: 获取连接器汇流排的注塑材料的物理性能参数;Obtaining physical property parameters of the injection molding material of the connector busbar; 根据所述注塑材料的物理性能参数以及所述连接器汇流排的目标参数,确定所述连接器汇流排的三维模型。A three-dimensional model of the connector bus is determined according to the physical property parameters of the injection molding material and the target parameters of the connector bus. 4.根据权利要求1所述的连接器汇流排的注塑模具浇头参数的确定方法,其特征在于,根据所述模具温度分布云图,确定数组x对应的模具温度评估指标,包括:4. The method for determining injection mold pouring parameters of a connector bus according to claim 1, characterized in that the mold temperature evaluation index corresponding to the array x is determined according to the mold temperature distribution cloud map, comprising: 根据所述模具温度分布云图,获取模具各区域的区域温度值与设定温度区间的总差值A i,以及模具各区域的具体温度值的标准差B iAccording to the mold temperature distribution cloud map, the total difference A i between the regional temperature value of each area of the mold and the set temperature range, as well as the standard deviation B i of the specific temperature value of each area of the mold, are obtained. 其中,i为数组x的索引指数,i=nn+1)/2,n为浇头可被设置的数量;Where i is the index of array x , i=n ( n +1)/2, and n is the number of toppings that can be set; 根据所述总差值A i和标准差B i,确定数组x对应的模具温度评估指标R iAccording to the total difference Ai and the standard deviation Bi , the mold temperature evaluation index Ri corresponding to the array x is determined. 5.根据权利要求1所述的连接器汇流排的注塑模具浇头参数的确定方法,其特征在于,根据所述模具冷却时间数据,确定数组x对应的冷却时间评估指标,包括:5. The method for determining injection mold casting parameters of a connector bus according to claim 1, characterized in that the cooling time evaluation index corresponding to the array x is determined according to the mold cooling time data, comprising: 根据所述模具冷却时间数据,确定模具整体冷却时间与设定冷却时间的第一差值C i,以及模具各区域的最大冷却时间与最小冷却时间的第二差值D iAccording to the mold cooling time data, a first difference Ci between the overall cooling time of the mold and the set cooling time, and a second difference Di between the maximum cooling time and the minimum cooling time of each area of the mold are determined. 其中,i为数组x的索引指数,i=nn+1)/2,n为浇头可被设置的数量;Where i is the index of array x , i=n ( n +1)/2, and n is the number of toppings that can be set; 根据所述第一差值C i与第二差值D i,确定数组x对应的冷却时间评估指标S iAccording to the first difference Ci and the second difference Di , a cooling time evaluation index Si corresponding to the array x is determined. 6.根据权利要求1所述的连接器汇流排的注塑模具浇头参数的确定方法,其特征在于,根据所述残余应力分布云图,确定数组x对应的冷却效果评估指标,包括:6. The method for determining injection mold pouring parameters of a connector busbar according to claim 1, characterized in that the cooling effect evaluation index corresponding to the array x is determined according to the residual stress distribution cloud map, comprising: 根据所述残余应力分布云图,确定模具整体的单位距离内温度的变化率E i,以及模具各区域的残余应力的标准差F iAccording to the residual stress distribution cloud map, the temperature change rate per unit distance of the entire mold E i and the standard deviation of the residual stress in each area of the mold F i are determined. 其中,i为浇头可被设置的位置以及数量的所有组合的索引指数,i=nn+1)/2,n为浇头可被设置的数量;Wherein, i is the index of all combinations of the positions and quantities of toppings that can be set, i=n ( n +1)/2, n is the number of toppings that can be set; 根据所述变化率E i和标准差F i,确定数组x对应的冷却效果评估指标T iAccording to the change rate E i and the standard deviation F i , the cooling effect evaluation index T i corresponding to the array x is determined. 7.一种连接器汇流排的注塑模具浇头参数的确定装置,其特征在于,包括:7. A device for determining injection mold casting parameters of a connector bus, characterized in that it includes: 获取模块,用于获取连接器汇流排的目标参数以及与三维模型匹配的注塑模具的可选浇头参数;An acquisition module for acquiring target parameters of the connector bus and optional gating parameters of the injection mold matched with the three-dimensional model; 其中,获取与所述三维模型匹配的注塑模具的可选浇头参数,包括:Wherein, obtaining optional pouring head parameters of the injection mold matching the three-dimensional model includes: 获取所述注塑模具的浇头可被设置的位置以及数量;Obtaining the positions and quantities at which the pouring heads of the injection mold can be set; 根据Px)={S|Sx},确定可选浇头参数,所述可选浇头参数为浇头可被设置的位置以及数量的组合,According to P ( x ) = { S | Sx }, the optional topping parameters are determined, where the optional topping parameters are a combination of the position and quantity at which the topping can be set. 其中,x=(x 1,...,x n),x 1,...,x n为浇头可被设置的位置,n为浇头可被设置的数量,S为数组x的任一子集,Px)为数组x的所有子集的集合;Where, x = ( x1 , ... , xn ) , x1 , ..., xn are the positions where toppings can be set, n is the number of toppings that can be set, S is any subset of the array x , and P ( x ) is the set of all subsets of the array x ; 处理模块,用于根据所述连接器汇流排的目标参数,确定所述连接器汇流排的三维模型;根据所述注塑模具的可选浇头参数,得到所述可选浇头参数对应的多个评估指标;根据所述多个评估指标,确定可选浇头参数的最优组合参数;A processing module, configured to determine a three-dimensional model of the connector bus according to target parameters of the connector bus; obtain a plurality of evaluation indicators corresponding to the optional pouring parameters according to optional pouring parameters of the injection mold; and determine an optimal combination parameter of the optional pouring parameters according to the plurality of evaluation indicators; 其中,根据所述注塑模具的可选浇头参数,得到所述可选浇头参数对应的多个评估指标,包括:Among them, according to the optional pouring head parameters of the injection mold, a plurality of evaluation indicators corresponding to the optional pouring head parameters are obtained, including: 对所述连接器汇流排的三维模型进行模流分析,得到数组x对应的模具温度分布云图、模具冷却时间数据和残余应力分布云图;Performing mold flow analysis on the three-dimensional model of the connector busbar to obtain a mold temperature distribution cloud map, mold cooling time data, and a residual stress distribution cloud map corresponding to the array x ; 根据所述模具温度分布云图,确定数组x对应的模具温度评估指标;Determine the mold temperature evaluation index corresponding to the array x according to the mold temperature distribution cloud map; 根据所述模具冷却时间数据,确定数组x对应的冷却时间评估指标;Determine the cooling time evaluation index corresponding to the array x according to the mold cooling time data; 根据所述残余应力分布云图,确定数组x对应的冷却效果评估指标;Determine the cooling effect evaluation index corresponding to the array x according to the residual stress distribution cloud map; 其中,根据所述多个评估指标,确定可选浇头参数的最优组合参数,包括:Wherein, according to the multiple evaluation indicators, the optimal combination parameters of the optional topping parameters are determined, including: 根据Y i=rR i+sS i+tT i确定所有可选的浇头参数对应的评估指标适应度值;Determine the fitness values of the evaluation indicators corresponding to all optional topping parameters according to Yi = rRi + sSi + tTi ; 其中,Y i为可选的浇头参数对应的评估指标适应度值,R i为数组x对应的模具温度评估指标,S i为数组x对应的冷却时间评估指标,T i为数组x对应的冷却效果评估指标,i=nn+1)/2,n为浇头可被设置的数量,r,s,t为权重系数,且r+s+t=1;Among them, Yi is the fitness value of the evaluation index corresponding to the optional pouring parameter , Ri is the mold temperature evaluation index corresponding to the array x , Si is the cooling time evaluation index corresponding to the array x , Ti is the cooling effect evaluation index corresponding to the array x, i=n ( n +1)/2 , n is the number of pourings that can be set, r, s, t are weight coefficients, and r+s+t =1; 根据Z=minY i)确定所有可选的浇头参数对应的评估指标适应度值最小值;According to Z = min ( Y i ), determine the minimum fitness value of the evaluation index corresponding to all optional topping parameters; 其中,Z为所有可选的浇头参数对应的评估指标适应度值最小值,Y i为可选的浇头参数对应的评估指标适应度值;Wherein, Z is the minimum fitness value of the evaluation index corresponding to all optional topping parameters, Yi is the fitness value of the evaluation index corresponding to the optional topping parameters; 确定所有可选的浇头参数对应的评估指标适应度值最小值对应的浇头设置的位置以及数量;Determine the location and quantity of toppings corresponding to the minimum fitness value of the evaluation index corresponding to all optional topping parameters; 将所述适应度值最小值对应的浇头设置的位置以及数量,确定为可选的浇头参数的最优参数。The position and quantity of the toppings corresponding to the minimum fitness value are determined as the optimal parameters of the optional topping parameters.
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