CN119109454A - A parameter calibration device, method, storage device and ultrasonic drive circuit - Google Patents
A parameter calibration device, method, storage device and ultrasonic drive circuit Download PDFInfo
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- H—ELECTRICITY
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- H03M1/1009—Calibration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03M—CODING; DECODING; CODE CONVERSION IN GENERAL
- H03M1/00—Analogue/digital conversion; Digital/analogue conversion
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Abstract
本发明公开了一种参数校准装置、方法、存储装置及超声波驱动电路，参数校准装置包括：依次连接的采样模块、交流转直流放大模块、滤波模块和ADC芯片，还包括标准电阻和示波器；其中，采样模块包括电压采样电容C1、分压电容C4、电压信号互感器T1、电流信号互感器T2、电阻R9；电压采样电容C1和分压电容C4串联，且在电压采样电容C1和分压电容C4串联支路的两端，设置有接线端子d1和接线端子d2；电压信号互感器T1与电压采样电容C1并联；电流信号互感器T2和电阻R9并联；以及电阻R9和接线端子d2连接；校准时，标准电阻的两端分别与接线端子d1和接线端子d2连接；校准电流时，示波器与待校准超声波换能器的线路连接。通过本发明，可以提高焊接质量。
The present invention discloses a parameter calibration device, method, storage device and ultrasonic drive circuit, wherein the parameter calibration device comprises: a sampling module, an AC-to-DC amplification module, a filtering module and an ADC chip connected in sequence, and also comprises a standard resistor and an oscilloscope; wherein the sampling module comprises a voltage sampling capacitor C1, a voltage dividing capacitor C4, a voltage signal mutual inductor T1, a current signal mutual inductor T2 and a resistor R9; the voltage sampling capacitor C1 and the voltage dividing capacitor C4 are connected in series, and a terminal d1 and a terminal d2 are provided at both ends of the series branch of the voltage sampling capacitor C1 and the voltage dividing capacitor C4; the voltage signal mutual inductor T1 is connected in parallel with the voltage sampling capacitor C1; the current signal mutual inductor T2 and the resistor R9 are connected in parallel; and the resistor R9 is connected with the terminal d2; during calibration, the two ends of the standard resistor are respectively connected with the terminal d1 and the terminal d2; when calibrating the current, the oscilloscope is connected with the circuit of the ultrasonic transducer to be calibrated. Through the present invention, the welding quality can be improved.
Description
Technical Field
The invention relates to the technical field of ultrasonic transducers, in particular to a parameter calibration device, a parameter calibration method, a storage device and an ultrasonic driving circuit.
Background
A bonding machine is an apparatus for semiconductor chip fabrication that works on the principle of soldering metal wires (typically aluminum or gold) to metal pins on the chip surface. These wires are used to connect different parts of the chip to form a circuit.
The bonding machine is provided with an ultrasonic transducer, the piezoelectric ultrasonic transducer is an energy converter which converts electric energy into mechanical energy by utilizing piezoelectric ceramics, an alternating electric signal can be converted into mechanical vibration with a certain frequency and amplitude, then the mechanical vibration is transmitted to a riving knife welding head through a set of amplitude-variable rod device capable of changing the amplitude, and the welding head transmits the received vibration energy to the joint part of a workpiece to be welded, so that ultrasonic welding is realized.
Errors exist in consistency of electronic components and welding quality, such as certain deviation exists between actual values and standard values of resistors and capacitors, and the deviation can lead to inconsistent results of voltage division, filtering and the like. Because the signal is subjected to multiple operational amplification, the accumulated error of each stage of operational amplifier can cause different final output results. Because of a certain difference in the driving circuit hardware of each ultrasonic transducer, the parameters such as voltage, current, impedance and the like measured by each ultrasonic driving plate are different. In the related art, uniform calibration of parameters of the ultrasonic driving board is not realized. Without calibration, the following effects are mainly caused:
1. under the same parameters, each circuit board has certain difference in output current value, and has an influence on welding effect;
2. the impedance measured by each circuit board has certain difference, which affects the evaluation of the temperature rise performance of the transducer;
3. If the voltage, current and impedance of each circuit board are different, the actual output voltage and current are also different under the modes of constant voltage, constant current and the like, and the welding firmness and the welding spot type under the preset parameters are affected.
The invention discloses a measurement and control circuit of a power distribution unit and a calibration method thereof, wherein the measurement and control circuit comprises a DSP chip, a memory chip, a voltage signal conditioning circuit and a current signal conditioning circuit, the voltage signal conditioning circuit comprises a voltage signal pickup circuit, a first direct current component generating circuit and an addition operation amplifying circuit which are sequentially connected, the voltage signal pickup circuit is used for converting output voltage of the power distribution unit into alternating current small signal voltage with peak-peak value ranging from 100mV to 100mV, the first direct current component generating circuit is used for lifting the peak-peak value of the alternating current small signal voltage to 250 mV-50 mV, the addition operation amplifying circuit is used for amplifying the lifted alternating current small signal voltage to peak-peak value ranging from 2.5V-0.5V, the current signal conditioning circuit comprises a second direct current component generating circuit, a current transformer, a first current limiting resistor and a first sampling resistor, the positive electrode of the current transformer, the first current limiting resistor, the first current resistor, the first direct current component generating circuit is sequentially connected with the first voltage dividing resistor, the first voltage dividing resistor is connected with the other end of the first voltage dividing resistor, and the voltage dividing resistor is connected with the other end of the first voltage dividing resistor. The application scene of the prior art is a power distribution unit, the power distribution unit is collected, the direct control cannot be realized, and the signal can only be collected after being converted.
Disclosure of Invention
The invention aims to solve the technical problem that unified calibration of parameters of an ultrasonic driving plate is not realized at present.
In order to solve the technical problems, the invention provides the following technical scheme:
The parameter calibration device comprises a sampling module (110), an alternating current-to-direct current amplifying module (120), a filtering module (130) and an ADC chip (140) which are sequentially connected, and further comprises a standard resistor and an oscilloscope;
the sampling module (110) comprises a voltage sampling capacitor C1, a voltage dividing capacitor C4, a voltage signal transformer T1, a current signal transformer T2 and a resistor R9;
The voltage sampling capacitor C1 and the voltage dividing capacitor C4 are connected in series, and a wiring terminal d1 and a wiring terminal d2 are arranged at two ends of a serial branch of the voltage sampling capacitor C1 and the voltage dividing capacitor C4;
during calibration, two ends of the standard resistor are respectively connected with the wiring terminal d1 and the wiring terminal d 2;
when the current is calibrated, the oscilloscope is connected with a circuit of the ultrasonic transducer to be calibrated.
In an embodiment of the present invention, the voltage signal transformer T1 inducts and outputs voltages at two ends of the voltage sampling capacitor C1, the output signal is v_back, the current signal transformer T2 inducts and outputs voltages at two ends of the resistor R9, the output signal is i_back, and the output signal v_back and the output signal i_back are both ac signals.
In one embodiment of the present invention, the output port of the voltage signal transformer T1 or the output port of the current signal transformer T2 is connected to the ac-dc amplifying module (120).
In one embodiment of the invention, the AC-DC amplifying module (120) comprises an operational amplifier U2A, an operational amplifier U2B, resistors R1, R2, R3, R5, R6, R7, R10, R11, capacitors C2, C3, C6, and diodes D1, D2;
The output port of the voltage signal transformer T1 or the output end of the current signal transformer T2 is connected with the inverting input end of the operational amplifier U2B after being connected in series with the resistor R6, the resistor R10 is connected with the non-inverting input end of the operational amplifier U2B and then grounded, the cathode of the diode D1 is connected with the inverting input end of the operational amplifier U2B, and the anode is connected with the output end of the operational amplifier U2A;
After being connected in parallel, one end of the resistor R5 is connected with the anode of the diode D2, and the other end of the resistor R7 is connected with the inverting input end of the operational amplifier U2B, the cathode of the diode D2 is connected with the anode of the diode D1, and one end of the resistor R3 is connected with the inverting input end of the operational amplifier U2B, and the other end of the resistor R3 is connected with the anode of the diode D2;
After the electricity R2 and the capacitor C2 are connected in parallel, two ends of the electricity R2 are respectively connected with an inverting input end and an output end of the operational amplifier U2A, and a non-inverting input end of the operational amplifier U2A is connected with the resistor R11 and then grounded;
one end of the resistor R1 is connected with an output port of the voltage signal transformer T1 or an output end of the current signal transformer T2, and the other end of the resistor R1 is connected with the resistor R2;
The power supply end of the operational amplifier U2A is connected with a power supply, the positive power supply end of the operational amplifier U2A is connected with a capacitor C3 and then grounded, and the negative power supply end of the operational amplifier U2B is connected with a capacitor C6 and then grounded.
The invention also provides a calibration method of the parameter calibration device, which comprises the following steps of:
setting a voltage calibration initial model: y1=k1x 1+b1;
an input port and an output port of an ultrasonic transducer (10) are respectively connected with a wiring terminal d1 and a wiring terminal d2, and are connected with an alternating current power supply in parallel;
Firstly, when the ultrasonic transducer (10) has no current, the output signal of the voltage signal transformer T1 is 0, the independent variable X1 in the voltage calibration initial model is 0, and the value measured by the ADC chip (140) is the value of a constant b1 in the voltage calibration initial model;
Then, the ultrasonic transducer (10) is disassembled, two ends of the standard resistor are respectively connected with the wiring terminal d1 and the wiring terminal d2, the effective voltage value of the output end of the voltage signal transformer T1 is obtained according to the resistance value of the standard resistor and the set output current value of the ultrasonic transducer (10), the output signal of the voltage signal transformer T1 is converted into direct current through the alternating current-direct current amplifying module (120) and amplified, and then the direct current is filtered through the filtering module (130), the actual voltage value is measured by the ADC chip (140), and the ratio of the actual voltage value to the effective voltage value is measured according to the ADC chip (140) to be used as the fixed conversion coefficient K1 of the voltage calibration initial model;
And finally, bringing the obtained fixed conversion coefficient K1 and constant b1 into a voltage calibration initial model to obtain an optimal voltage calibration model.
In one embodiment of the invention, the calibration current is included:
Setting a current calibration initial model: y2=k2x 2+b2;
an input port and an output port of an ultrasonic transducer (10) are respectively connected with a wiring terminal d1 and a wiring terminal d2, and are connected with an alternating current power supply in parallel;
Firstly, when the ultrasonic transducer (10) has no current, the output signal of the current signal transformer T2 is 0, the independent variable X2 in the current calibration initial model is 0, and the value measured by the ADC chip (140) is the value of a constant b2 in the current calibration initial model;
Then, the ultrasonic transducer (10) is disassembled, the two ends of the standard resistor are respectively connected with the wiring terminal d1 and the wiring terminal d2, the effective current value of the output end of the current signal transformer T2 is obtained according to the resistance value of the standard resistor and the set current value output by the ultrasonic transducer (10), the output signal of the current signal transformer T2 is converted into direct current through the alternating current-direct current amplifying module (120) and amplified, and then the direct current is filtered through the filtering module (130), the actual current value is measured by the ADC chip (140), and the fixed conversion coefficient K2 of the initial model is calibrated according to the ratio of the actual current value to the effective current value measured by the ADC chip (140);
and finally, bringing the obtained fixed conversion coefficient K2 and constant b2 into a current calibration initial model to obtain an optimal current calibration model.
In one embodiment of the invention, the calibration current is included:
the ultrasonic transducer (10) is connected with an alternating current power supply;
Clamping a current probe of the oscilloscope on a line of an ultrasonic transducer (10), setting a calibration current value, and outputting the calibration current value as an output current value of the ultrasonic transducer (10), wherein the oscilloscope measures the current at the moment and takes the current as an actual current value;
Applying a bonder system equipped with an ultrasonic transducer (10), inputting actual current values into a calibration system of the bonder system, and performing current calibration;
The calibration system sends the actual current value to the driving circuit board of the ultrasonic transducer (10), and the driving circuit board of the ultrasonic transducer (10) receives the data and then carries out 'multi-compensation' so as to lead the actual current value to be equal to the calibration current value.
In one embodiment of the invention, the method comprises the steps of calibrating impedance:
after the optimal voltage calibration model and the optimal current calibration model are obtained;
The method comprises the steps of connecting an ultrasonic transducer (10) with a wiring terminal d1 and a wiring terminal d2, driving the ultrasonic transducer (10) to output, and sequentially connecting an alternating current-to-direct current amplification module (120) with an output port of a voltage signal transformer T1 or an output end of a current signal transformer T2 respectively;
and obtaining calibration impedance according to the calibration voltage and the calibration current.
The invention further provides a storage device which comprises a memory storage chip U1, wherein parameter calibration data are written in the memory storage chip U1, and the parameter calibration data are obtained through the parameter calibration device.
The invention also provides an ultrasonic driving circuit which comprises the storage device.
Compared with the prior art, the invention has the beneficial effects that:
Parameter calibration:
The method realizes the calibration of current, the consistency of the current output by each circuit board is good, the welding effect is stable under a constant current mode, the welding spots are consistent, the calibration of voltage is realized, the consistency of the voltage output by each circuit board is good, the welding effect is stable under a constant voltage mode, the welding spots are consistent, the calibration of impedance is realized, and the consistency of the impedance measurement of the transducer is maintained.
The hardware complexity is low, the operation is simple and easy to operate, the required peripheral equipment is few, the current calibration can be completed by only needing an oscilloscope, and the voltage and the impedance can be calibrated by only needing a standard resistance of 10 ohms. The calibrated parameter value is fixed, and after being stored by the memory chip, the parameter value is only required to be calibrated once and can be used normally all the time.
Current settling time regulation circuit:
The control of the current rising time is realized, and the current rising time can be controlled through equipment setting. The control can be performed in a plurality of gears, and at least 8 gears can be set for the control. The corresponding output effect of the gear is stable, namely the value of the same gear is always stable, and the change along with the use does not occur, so that the consistency of welding spots is not affected. The hardware complexity is low, the function can be realized only by adding one multiplexer and several paths of capacitors, the occupied space is small, and the influence on other layouts of the ultrasonic driving circuit is small. The cost is low, the added cost of the single board is less than 1 yuan/PCS, and the single board is suitable for mass production. Different gears can be selected according to the type of welded materials, and a better ultrasonic welding effect is obtained. Compared with switching devices such as relays, the multiplexer circuit has the characteristics of multiplexing, easiness in control, low power consumption, quick response and the like.
Constant voltage constant current switching circuit:
The switching of the constant-current and constant-voltage welding output functions can be realized, and the constant-current frequency sweep and the constant-voltage frequency sweep can be realized. The hardware does not need a dial switch, a relay and other devices, the corresponding functions can be selected through software, the conventional software regulates and controls that delay exists, after waiting for feedback data to be collected, the software carries out parameter regulation, and then the feedback data is continuously collected and repeatedly started. The hardware complexity is low, the function can be realized only by adding one multiplexer and several paths of capacitors, the occupied space is small, and the influence on other layouts of the ultrasonic driving circuit is small. The cost is low, the added cost of the single board is less than 1 yuan/PCS, and the single board is suitable for mass production. The constant pressure or constant current function can be selected according to the type of welded material, so that a better ultrasonic welding effect is obtained. The analog switch is used for replacing the relay, so that signal jitter in the moment of switching of the relay can be avoided, meanwhile, the heating and unreliable hidden danger that the relay keeps on being attracted for a long time can be avoided, and meanwhile, the switching delay time is greatly reduced.
Drawings
Fig. 1 is a schematic diagram of a parameter calibration apparatus according to an embodiment of the invention.
Fig. 2 is a schematic diagram of a sampling module according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of an ac-dc amplifying module and a filtering module according to an embodiment of the present invention.
FIG. 4 is a schematic diagram of a bonder calibration system according to an embodiment of the invention.
FIG. 5 is a schematic diagram of a memory chip according to an embodiment of the invention.
Fig. 6 is a schematic diagram of the output current measured before calibration of an ultrasonic transducer according to an embodiment of the present invention.
Fig. 7 is a schematic diagram of the output current measured after calibration of an ultrasonic transducer according to an embodiment of the present invention.
Fig. 8 is a schematic diagram of an ultrasonic driving circuit according to an embodiment of the invention.
Fig. 9 is a schematic diagram of a current settling time adjustment module according to an embodiment of the invention.
Fig. 10 is a schematic circuit diagram of a current settling time adjustment module according to an embodiment of the invention.
Fig. 11 is a schematic diagram of an adjustment module for current settling time according to an embodiment of the invention.
Fig. 12 is a schematic diagram of a multiplexer according to an embodiment of the invention.
Fig. 13 is a schematic diagram of a portion of a control code of a multiplexer according to an embodiment of the present invention.
Fig. 14 is a schematic diagram of an ac-dc conversion module according to an embodiment of the invention.
Fig. 15 is a schematic diagram of an integrating circuit according to an embodiment of the invention.
Fig. 16 is a schematic diagram of an analog switch according to an embodiment of the present invention.
Fig. 17 is a schematic diagram of an analog single pole double throw switch according to an embodiment of the present invention.
Fig. 18 is a schematic diagram of an analog switch according to an embodiment of the present invention.
Fig. 19 is a schematic diagram of an analog two-way single pole double throw switch according to an embodiment of the present invention.
Fig. 20 is a schematic diagram of an analog switch according to another embodiment of the present invention.
Fig. 21 is a schematic diagram of the control connections of an analog single pole double throw switch according to an embodiment of the present invention.
Fig. 22 is a schematic diagram of a radio frequency amplifier module according to an embodiment of the invention.
Detailed Description
In order to facilitate the understanding of the technical scheme of the present invention by those skilled in the art, the technical scheme of the present invention will be further described with reference to the accompanying drawings.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
Example 1
Referring to fig. 1, the present invention provides a parameter calibration device, which includes a sampling module 110, an ac-dc amplifying module 120, a filtering module 130, an ADC chip 140, and a standard resistor connected in sequence.
Referring to fig. 1 and 2, in an embodiment of the invention, the sampling module 110 includes a voltage sampling capacitor C1, a voltage dividing capacitor C4, a voltage signal transformer T1, a current signal transformer T2, and a resistor R9.
In this embodiment, the voltage sampling capacitor C1 and the voltage dividing capacitor C4 are connected in series, and a connection terminal d1 and a connection terminal d2 are provided at two ends of a serial branch of the voltage sampling capacitor C1 and the voltage dividing capacitor C4. The voltage signal transformer T1 is connected with the voltage sampling capacitor C1 in parallel, the current signal transformer T2 is connected with the resistor R9 in parallel, and the resistor R9 is connected with the wiring terminal d2.
In this embodiment, the voltage signal transformer T1 senses and outputs the voltages at both ends of the voltage sampling capacitor C1, and the output signal is v_back. The current signal transformer T2 inducts and outputs the voltage at two ends of the resistor R9, the output signal is I_BACK, the transformer is a small transformer essentially, and is a voltage type device, and the voltage at two ends of the resistor R9 can be inducted and output according to a fixed proportion, such as 1:1. The resistance of the resistor R9 is known, for example, the resistor R9 takes 1 Ω, so that, for example, the induced voltage is 100mV, the current thereof is 100mA, and the voltage thereof is obtained in this way, so that the current is calculated. And, the output signal v_back and the output signal i_back are both ac signals.
In this embodiment, the voltage sampling capacitor C1 and the voltage dividing capacitor C4 form a voltage dividing circuit, so that all voltages are prevented from being applied to the voltage sampling capacitor C1, the voltage dividing capacitor C4 has a certain equivalent capacitance, and excessive current is prevented from flowing through the voltage signal transformer T1. The resistor R9 is a sampling resistor, has smaller resistance value and does not influence normal operation.
Referring to fig. 1 to 3, in an embodiment of the invention, the ac-dc amplifying module 120 includes an operational amplifier U2A, an operational amplifier U2B, resistors R1, R2, R3, R5, R6, R7, R10, R11, capacitors C2, C3, C6, and diodes D1, D2.
The output port of the voltage signal transformer T1 or the output end of the current signal transformer T2 is connected in series with the resistor R6, and then connected with the inverting input end of the operational amplifier U2B. The resistor R10 is connected with the non-inverting input end of the operational amplifier U2B and then grounded, the cathode of the diode D1 is connected with the inverting input end of the operational amplifier U2B, and the anode is connected with the output end of the operational amplifier U2A.
After the resistor R5 and the resistor R7 are connected in parallel, one end is connected with the anode of the diode D2, and the other end is connected with the inverting input end of the operational amplifier U2B. The cathode of the diode D2 is connected to the anode of the diode D1, and the resistor R3 has one end connected to the inverting input terminal of the operational amplifier U2B and the other end connected to the anode of the diode D2.
After the electricity R2 and the capacitor C2 are connected in parallel, two ends of the electricity R2 are respectively connected with an inverting input end and an output end of the operational amplifier U2A, and a non-inverting input end of the operational amplifier U2A is connected with the resistor R11 and then grounded.
One end of the resistor R1 is connected with an output port of the voltage signal transformer T1 or an output end of the current signal transformer T2, and the other end of the resistor R1 is connected with the resistor R2.
The power supply end of the operational amplifier U2A is connected with a power supply, and the positive power supply end of the operational amplifier U2A is connected with the capacitor C3 and then grounded. And the negative power end of the operational amplifier U2B is also connected with a capacitor C6 and then grounded.
In an embodiment of the present invention, the filtering module 130 includes a resistor R8 and a capacitor C7, one end of the resistor R8 is connected to the output terminal of the operational amplifier U2B, the other end is connected to the capacitor C3 and the ADC chip 140, and the capacitor C3 is further grounded.
In this embodiment, the data measured by the ADC chip 140 is sent to the MCU, so that the MCU knows the actual value of the current measured data, specifically MAX1600. And the ADC chip is specifically MAX1300.
Example 2
Referring to fig. 1 to 3, the present invention further provides a calibration method of the parameter calibration device, including a voltage calibration method, a current calibration method, and an impedance calibration method. After the signal output by the transformer passes through an alternating current-to-direct current circuit formed by operational amplifiers, high-frequency interference is filtered by an RC filter, the signal is output as direct current OUT_AVERAGE, and the following relation can be obtained by voltage acquisition of the ADC chip 140:
Y=kx+b, where x is an effective value output by the voltage signal transformer T1 and the current signal transformer T2, Y is an effective value of out_average, k is a fixed conversion coefficient, b is a fixed offset value, and b is a constant.
Specifically, the voltage calibration method includes:
setting a voltage calibration initial model: y1=k1x 1+b1.
The input port and the output port of the ultrasonic transducer 10 are connected to the connection terminal d1 and the connection terminal d2, respectively, and are connected to an ac power supply. Wherein the ultrasonic transducer 10 is an external output device, which is an ultrasonic source at the time of ultrasonic welding, and the ultrasonic transducer 10 is driven by alternating current.
First, when the ultrasonic transducer 10 has no current, the output signal of the voltage signal transformer T1 is 0. The argument X1 in the voltage calibration initial model is 0. The value measured by the ADC chip 140 is the value of the constant b1 in the voltage calibration initial model.
Subsequently, the ultrasonic transducer 10 is removed, and both ends of the standard resistor are connected to the connection terminal d1 and the connection terminal d2, respectively. And acquiring an effective voltage value of the output end of the voltage signal transformer T1 according to the resistance value of the standard resistor and the set output current value of the ultrasonic transducer 10. In this embodiment, for ease of calculation, the standard resistor has a resistance value of 1Ω, and the output current value of the ultrasonic transducer 10 is set to 100mA. Specifically, the output current value of the ultrasonic transducer 10 is set through a bonding machine, the ultrasonic transducer 10 is arranged in the bonding machine, the bonding machine performs ultrasonic bonding of the gold wire by means of vibration of the ultrasonic transducer 10 transducer, so that the output current of the bonding machine is set, and the output current of the ultrasonic transducer 10 is actually the output current of the output current.
The output signal of the voltage signal transformer T1 is converted into direct current through the alternating current-to-direct current amplifying module 120, amplified, filtered through the filtering module 130, the ADC chip 140 measures the actual voltage value, and the ratio of the actual voltage value to the effective voltage value is measured according to the ADC chip 140 to serve as a fixed conversion coefficient K1 of the voltage calibration initial model. In this embodiment, since the standard resistor has no equivalent capacitance or inductance, the voltage is equal to 10Ω×100deg.mA=1V, i.e. the effective value of V_BACK, and then the value of OUT_AVERAGE is measured, so as to obtain the fixed conversion coefficient K1.
And finally, bringing the obtained fixed conversion coefficient K1 and constant b1 into a voltage calibration initial model to obtain an optimal voltage calibration model.
Referring to fig. 1 to 3, in an embodiment of the invention, a method for calibrating current includes:
a current calibration initial model is set y2=k2x2+b2.
The input port and the output port of the ultrasonic transducer 10 are connected to the connection terminal d1 and the connection terminal d2, respectively, and are connected to an ac power supply.
First, when the ultrasonic transducer 10 has no current, the output signal of the current signal transformer T2 is 0. The argument X2 in the current calibration initial model is 0. The value measured by the ADC chip 140 is the value of the constant b2 in the current calibration initial model;
and then, the ultrasonic transducer 10 is removed, two ends of the standard resistor are respectively connected with the wiring terminal d1 and the wiring terminal d2, and the effective current value of the output end of the current signal transformer T2 is obtained according to the resistance value of the standard resistor and the set output current value of the ultrasonic transducer 10.
The output signal of the current signal transformer T2 converts the alternating current into direct current through the alternating current-to-direct current amplifying module 120, amplifies the direct current, filters the direct current through the filtering module 130, and the ADC chip 140 measures the actual current value
The ratio of the actual current value to the effective current value is measured according to the ADC chip 140 as a fixed conversion coefficient K2 of the current calibration initial model.
And finally, bringing the obtained fixed conversion coefficient K2 and constant b2 into a current calibration initial model to obtain an optimal current calibration model.
Referring to fig. 1 to 3, in an embodiment of the invention, after the calibration of the voltage and the current is completed, the ultrasonic transducer 10 is driven to output, and the acquired voltage value is divided by the current value to obtain the impedance of the ultrasonic transducer 10. Specifically, the method for calibrating impedance includes:
after the optimal voltage calibration model and the optimal current calibration model are obtained;
The ultrasonic transducer 10 is connected with the wiring terminal d1 and the wiring terminal d2, so as to drive the ultrasonic transducer 10 to output, and the alternating current-direct current amplification module 120 is sequentially connected with the output port of the voltage signal transformer T1 or the output end of the current signal transformer T2. And carrying the voltage value measured by the ADC chip 140 into an optimal voltage calibration model to obtain a calibration voltage. The current value measured by the ADC chip 140 is taken into the optimal current calibration model to obtain the calibration current.
And obtaining calibration impedance according to the calibration voltage and the calibration current.
Example 3
Referring to fig. 1 to 4, in embodiment 1, a set of sampling modules 110 is used to collect voltage and current at the same time, and then an ac-dc amplification module 120, a filtering module 130, an ADC chip 140 and a standard resistor are used to calibrate voltage, current and impedance. But is relatively inconvenient for the way the current is calibrated. In the above embodiment 1, it has been described that the ultrasonic transducer 10 is mounted in the bonder, and the calibration system is provided in the bonder system, as shown in fig. 4. Therefore, the invention also provides a method for calibrating the current by combining the oscilloscope, which is used for measuring the actual current by the oscilloscope, observing the actual value and then manually inputting the actual value into a calibration system for compensation. Specifically, the method for calibrating the current comprises the following steps:
the ultrasonic transducer 10 is connected with an alternating current power supply.
And clamping the current probe of the oscilloscope on a circuit of the ultrasonic transducer 10, setting a calibration current value, and outputting the calibration current value as an output current value of the ultrasonic transducer 10, wherein the oscilloscope measures the current at the moment and takes the current as an actual current value. At this time, a calibration current value is set by the bonder, and the calibration current value is specifically 60ma, which is a calibration-dedicated current magnitude.
The current calibration is performed by inputting the actual current value number into the calibration system of the bonder system using the bonder system equipped with the ultrasonic transducer 10.
The calibration system sends the actual current value to the driving circuit board of the ultrasonic transducer 10, and the driving circuit board of the ultrasonic transducer 10 receives the data and then carries out 'multi-step interpolation' to make the actual current value equal to the calibration current value. In this embodiment, the "multiple-offset" is to subtract some current if the current is greater than 60mA, and to increase the current by a small amount if the current is less than 60mA, so that the current value is close to 60mA.
Example 4
Referring to fig. 1 to 5, the present invention further provides a memory device, which includes a memory chip U1, and parameter calibration data written in the memory chip U1, wherein the parameter calibration data is obtained by the parameter calibration device described in embodiments 1 to 3.
In this embodiment, a memory chip U1 with a ferroelectric memory is used, and the memory chip U1 (FRAM 0 has the characteristic of not dropping data after power failure, the calibrated data can be written into the memory chip U1 through I2C communication, and read after power-on every time, so that only one calibration is needed to obtain the data, and no repeated calibration is needed later.
As the internal data of the memory chip is generally 0xFF when the memory chip leaves the factory, judgment can be carried out when the memory chip is read each time, the accuracy of the read value is ensured, and the misreading caused by the first use is avoided.
In the embodiment, the memory chip U1 is provided with resistors R4 and RS1 and a capacitor C5. The resistor R4 is connected with the SDA port of the memory storage chip U1, and the resistor RS1 is connected with the SCL port of the memory storage chip U1. And two ends of the capacitor C5 are respectively connected with the VCC port and the A0 port of the memory storage chip U1. And the singlechip MCU is respectively connected with an SDA port and an SCL port of the memory storage chip U1, and writes parameter calibration data into the memory storage chip U1 through I2C communication.
The MCU and the memory storage chip U1 are communicated through an I2C protocol, and the MCU can perform data writing, erasing, reading and other data operations on the memory storage chip U1. The resistors R4 and RS1 are pull-up resistors, so that the I2C communication line is ensured to maintain a high-level pull-up state when data are not transmitted. The capacitor C5 is a filter capacitor, stabilizes the power input of the memory chip U1 and reduces ripple interference.
Referring to fig. 1 to 5, the working principles of embodiments 1 to 4 are that the transformer principle of a transformer is utilized to induce the voltage and current of the ultrasonic transducer during operation, the induced signal is an ac signal, and the ac signal is required to be converted into a dc signal by an operational amplifier circuit, filtered by an RC filter and input to an ADC acquisition chip;
The voltage/current value of the ultrasonic transducer is in a fixed proportion to the value output by the transformer, the value output by the transformer is converted into the value of the direct current signal, and the proportion is also fixed, so that the voltage/current value of the actual transducer can be calculated according to the data from the ADC chip 140.
When the output is 0, the offset value of the initial model is measured, and an external 10 ohm standard resistor is used for replacing the transducer, so that the voltage and the current can reach a fixed value, such as 1V, and the fixed conversion coefficient is calculated in sequence.
And writing the acquired calibration data into the memory storage chip U1 through an I2C protocol, and reading the data after each power-on, so that 1 cannot be lost and recalibration is not needed.
Referring to fig. 6 and 7, the output current of the ultrasonic transducer 10 is set to 60mA. Fig. 6 shows the actual current measured before calibration as 59.13mA, and fig. 7 shows the actual current measured after calibration as 59.96mA.
The current value is an effective value (59.13 mA and 59.96 mA) of actual work done by the alternating current, the error between the actual value and the set value is generally required to be within 0.5mA, and thus, when each circuit board is provided with the same value, the actual output current is close in size and good in consistency.
If not calibrated, the same set value may be caused, some plates have large output values, and some plates have small output values, so that welding spots made by different machines have different sizes. Even two machines are arranged identically, one output is too small to be wire-bonded and falls off, and the other output is too large to be wire-bonded and flattened.
Example 5
Since the ultrasonic transducer has equivalent capacitance and inductance, a stable period of time is required when the current rises from 0mA to a set value when ultrasonic waves are output. In the related art, adjustment of the stabilization time of the ultrasonic output is not realized.
The stability time of the ultrasonic output is mainly influenced by the fact that the ultrasonic output cannot be adjusted:
1. When the output stability time is shorter, the current rises rapidly, huge overshoot is easy to form, the welding spot is over-welded when in contact, the deformation is serious, and the final forming of the welding surface is poor;
2. When the stabilizing time is longer, the current slowly rises, and for some scenes with shorter single welding time, such as when the welding material is thick aluminum wire, the stabilizing time occupies a considerable proportion of total duration, and the current in the stabilizing time is far smaller than the stabilizing current, so that the total welding power is insufficient and the welding spot is unstable.
And, when welding wires of different materials, it is often desirable to require different current rise rates, such as a longer settling time for the wire to smoothly reach the set point. And the aluminum wire needs a faster current rising speed, so that the output of higher power is realized quickly. In the related ultrasonic technology at present, adjustment of the current stabilization time is not realized.
The impedance can change along with the temperature when the ultrasonic transducer works, and two control modes of constant current and constant voltage are mainly adopted to ensure that each welding spot has better consistency.
Taking constant current as an example, the current in the output process is kept stable, the envelope is flat, and each welding spot keeps the same output current, so that better consistency is achieved. In some other scenarios, maintaining a steady voltage is more effective than a steady current, where a constant voltage control mode is required.
The prior art generally adopts software to adjust, adjusts after comparing through gathering present voltage current with the setting value, and this kind of regulation mode has several defects:
1. The software regulation has a certain delay, and when the welding load is changed drastically, the stability cannot be regulated in time;
2. The hardware circuit only supports one of constant voltage or constant current, and can only use one of constant voltage or constant current to sweep frequency during startup self-test, so that the hardware circuit cannot meet the use under multiple scenes. When the load impedance is large, the constant voltage frequency sweep can cause small current, and the frequency sweep precision is seriously affected;
3. the switching between the constant current and constant voltage modes cannot be performed.
In order to solve the above-mentioned problems, referring to fig. 8 to 22, the present invention further provides an ultrasonic driving circuit, which includes a memory device, a single-chip microcomputer MCU, a DDS module 410, a DAC module 420, a current stabilization time adjustment module 200, a radio frequency amplifier module 430, and a constant voltage and constant current switching module 300.
In an embodiment of the present invention, the single-chip microcomputer MCU is connected to the DDS module 410 and the DAC module 420, and the output end of the DAC module 420, the output end of the constant voltage and constant current switching module 300, and the input end of the current stabilizing time adjustment module 200 are connected. The output of the DDS module 410 and the output of the current settling time adjustment module 200 are connected to the input of the rf amplifier module 430. Wherein DAC module 420 is specifically SGM5348.
Referring to fig. 8 to 13, in an embodiment of the invention, the current settling time adjustment module 200 includes a multiplexing module 210 and an operational amplifier module 220. And, the multiplexing module 210 includes a multiplexer U3 and a plurality of capacitors, and the capacitance values of the plurality of capacitors are gradually increased.
In the present embodiment, the plurality of capacitances includes capacitances CS1, CS2, CS3, CS4, CS5, CS6, CS7, and capacitance CS8. One end of a capacitor CS1 is connected with a5 th pin of the multiplexer U3, one end of a capacitor CS2 is connected with a 4 th pin of the multiplexer U3, one end of the capacitor CS3 is connected with a2 nd pin of the multiplexer U3, one end of the capacitor CS4 is connected with a1 st pin of the multiplexer U3, one end of the capacitor CS5 is connected with a 15 th pin of the multiplexer U3, one end of the capacitor CS6 is connected with a 14 th pin of the multiplexer U3, one end of the capacitor CS7 is connected with a 13 th pin of the multiplexer U3, one end of the capacitor CS8 is connected with a 12 th pin of the multiplexer U3, and the other ends of the capacitors CS1, CS2, CS3, CS4, CS5, CS6, CS7 and CS8 are connected.
In an embodiment of the present invention, the multiplexing module 210 further includes a resistor RX1, where one end of the resistor RX1 is connected to the 16 pin of the multiplexer U3, and the other end is connected to a power supply. Resistor RX1 is used for limiting the power input to multiplexer U3.
In an embodiment of the present invention, the INH port, the VEE port and the VSS port of the multiplexer U3 are grounded, and the A, B, C ports of the multiplexer U3 are respectively connected to the PD4 port, the PD5 port and the PD6 port of the single-chip MCU. Specifically, the model of multiplexer U3 is CD4051BNM96.
In an embodiment of the present invention, the operational amplifier module 220 is configured to form an integral operational circuit to implement integral compensation in feedback control. Specifically, the operational amplifier module 220 includes an operational amplifier U5, resistors R15, R16, and capacitors C11 and C13.
In this embodiment, the inverting input terminal of the operational amplifier U5 is connected to the 3 rd pin of the multiplexer U3, and the output terminal of the operational amplifier U5 is connected to the 12 th pin of the multiplexer U3.
One end of the resistor R15 is connected to the inverting input terminal of the operational amplifier U5, and the other end is connected to the feedback port of the actual signal value output from the ultrasonic transducer 10. In this embodiment, the output terminal of the constant voltage and constant current switching module 200 is connected to the other terminal of the resistor R15. The switching ultrasonic transducer 10 is a constant current output or a constant voltage output, and after switching, the actual signal value output by the ultrasonic transducer 10, that is, the actual signal value is a current signal or a voltage signal, is output to the operational amplifier U5.
One end of the resistor R16 is connected with the non-inverting input end of the operational amplifier U5, and the other end is connected with a port for setting a signal value output by the ultrasonic transducer. In an embodiment, the DAC module 420 sets a set signal value of the ultrasonic transducer output. And, if the constant voltage and constant current switching module 200 switches the ultrasonic transducer 10 to the constant voltage output, the set signal value of the DAC module 420 is a voltage value, and if the constant voltage and constant current switching module 200 switches the ultrasonic transducer 10 to the constant current output, the set signal value of the DAC module 420 is a current value. For example, the DAC module 420 may convert the digital signal into a voltage signal, for example, a voltage of 200mV is currently desired, and the MCU sends a segment of digital signal to the DAC module 420, where the data includes 200mV data, and the DAC chip outputs 200mV after receiving the data.
The positive power supply of the operational amplifier U5 is connected with the capacitor C11 after being connected with the power supply, and the capacitor C11 is grounded. One end of the capacitor C13 is connected with the non-inverting input end of the operational amplifier U5, and the other end is grounded.
When the actual signal value output by the ultrasonic transducer is not equal to the set signal value output by the ultrasonic transducer, the integrating circuit adjusts the output voltage or current so that the ultrasonic transducer outputs current until the actual signal value output by the ultrasonic transducer is equal to the set signal value output by the ultrasonic transducer so as to achieve the effect of controlling the current value.
In one embodiment of the present invention, the principle of regulation is that the integral operation circuit plays a role in regulating the rate mainly by means of the capacitor C, as shown in FIG. 11. Different circuits may be gated through multiplexer U3 to select different capacitive access circuits, as shown in fig. 12.
Multiplexer U3 is a digitally controlled analog switch with low ON impedance and very low OFF leakage current, with A, B and C three binary inputs, and an INH control. Three binary signals select 1 of the 8 channels to be turned on and connect one of the 8 inputs to the output. An example of a portion of the program code is shown in fig. 13.
The code driving principle is briefly described that an upper computer, such as a singlechip MCU, transmits a communication signal, and the communication signal is divided into A, B, C three signals after being analyzed and then is output by 3 GPIO.
Referring to fig. 8 to 13, the adjustment method of the current stabilization time adjustment module 200 includes:
The level of A, B, C ports of the multiplexer U3 is controlled by the MCU, and 8 different paths can be opened correspondingly to form a multi-path analog switch.
And in the 8 paths, capacitors with different sizes are respectively connected, and the capacitors can be connected into the circuit by selecting the corresponding paths.
After the capacitor is connected into the circuit, an integral operation circuit is formed with the operational amplification module 220, and integral compensation control in current feedback is performed. When the connected capacitors are different in size, the integral compensation enables the actual signal value output by the ultrasonic transducer to be equal to the set signal value output by the ultrasonic transducer, and the required time is also different, so that the circuit output has different stabilizing time.
Referring to fig. 8, 14-22, in an embodiment of the invention, the constant current and constant voltage switching module 300 includes an analog switch 310, an ac-dc conversion module and an integral operation circuit module. According to different products of the analog switch 310, the connection relationship among the analog switch 310, the ac-dc conversion module and the integral operation circuit module is different, and the number of the ac-dc conversion module and the integral operation circuit module is also different.
In this embodiment, the ac-dc conversion module includes an operational amplifier U11B, resistors R21, R22, R23, R24, R25, R28, and diodes D5, D6.
One end of the resistor R24 is connected to the inverting input terminal of the operational amplifier U11B, the diodes D5, D6 are connected in series and then connected in parallel to the resistor R22, and the cathode of the diode D5 is connected to the inverting input terminal of the operational amplifier U11B. The resistors R23 and R24 are connected in parallel, one end of the resistor R23 and R24 connected in parallel is connected with the anode of the diode D6, the other end of the resistor R21 is connected with the other end of the resistor R24, one end of the resistor R28 is connected with the non-inverting input end of the operational amplifier U11B, and the other end of the resistor R28 is grounded.
In this embodiment, the integrating operation circuit module includes an operational amplifier U6, resistors R17, R18, and capacitors CS9, C15, C14.
The resistor R17 is connected with the inverting input end of the operational amplifier U6, the resistor R18 is connected with the non-inverting input end of the operational amplifier U6, two ends of the capacitor CS9 are respectively connected with the inverting input end and the output end of the operational amplifier U6, one end of the capacitor C15 is connected with the non-inverting input end of the operational amplifier U6, the other end of the capacitor C14 is grounded, and one end of the capacitor C14 is connected with the positive power supply terminal of the operational amplifier U6 and the other end of the capacitor C is grounded. As shown in fig. 15, in the present embodiment, the actual value fed back in the integrating operation circuit can be understood as the current signal value or the voltage value output from the ultrasonic transducer 10. The DAC output setting may be understood as the setting output by DAC module 420. And when the current signal value or the voltage value output by the electric ultrasonic transducer 10 is not equal to the set value output by the DAC module 420, the integral operation circuit adjusts the output voltage/current so that the electric ultrasonic transducer 10 outputs the voltage/current until the current signal value or the voltage value output by the electric ultrasonic transducer 10 is equal to the set value output by the DAC module 420, thereby achieving the function of controlling the voltage/current value. In this embodiment, the adjustment is performed by means of the capacitor CS9, but no gear. In another embodiment of the present invention, the control voltage/current value may be adjusted, and the current settling time adjusting module 200 may be applied to achieve the gear adjustment of the current settling time.
In one embodiment of the present invention, as shown in fig. 16, when the analog switch 310 is an analog single pole double throw switch, and the analog single pole double throw switch is located at the end of the switching circuit:
the ac-dc conversion module includes a first ac-dc conversion module 321 and a second ac-dc conversion module 322 with the same structure, which can be understood as two ac-dc conversion modules, and the first ac-dc conversion module 321 and the second ac-dc conversion module 322 are defined for convenience of description only. The integrating operation circuit module includes a first integrating operation circuit module 331 and a second integrating operation circuit module 332 with the same structure, and it can be understood that the two integrating operation circuit modules are only for convenience of description, and the first integrating operation circuit module 331 and the second integrating operation circuit module 332 are defined.
The current feedback output by the ultrasonic transducer is sequentially connected with the first alternating current-to-direct current module 321 and the first integral operation circuit module 331 to form a constant current branch.
The voltage feedback output by the ultrasonic transducer is sequentially connected with the second alternating current-to-direct current module 322 and the second integral operation circuit module 332 to form a constant voltage branch.
And the outputs of the constant voltage branch circuit and the constant current branch circuit are connected with an analog single-pole double-throw switch.
In an embodiment of the present invention, as shown in fig. 17, an A1 port of the analog single pole double throw switch is connected to the output end of the constant current branch, and an A2 port of the analog single pole double throw switch is connected to the output end of the constant voltage branch.
The ENB port of the analog single-pole double-throw switch and the GPIO port of the MCU are specifically PA1 ports, the B port of the analog single-pole double-throw switch outputs a selection signal, the MCU sends a control signal, and the A1 port or the A2 port of the analog single-pole double-throw switch is selected to be communicated with the B port of the analog single-pole double-throw switch. Namely, when the MCU control signal Choose is high-level logic 1, the current signal STATIC_I is selectively connected to the output of the pin B, so that constant current control is realized. When the MCU control signal Choose is low-level logic 0, the voltage signal STATIC_U is selectively connected to the output of the pin B, so that constant voltage control is realized.
Referring to fig. 18, in one embodiment of the present invention, when the analog switch 310 is an analog two-way single pole double throw switch:
The input end of the analog double-circuit single-pole double-throw switch is respectively connected with current feedback and voltage feedback output by the ultrasonic transducer. The output end of the analog double-circuit single-pole double-throw switch is sequentially connected with the alternating current-to-direct current module and the integral operation circuit module, and the output end of the integral operation circuit module is connected with the input end of the current stabilization time adjustment module 200.
As shown in fig. 19, output ends of voltage feedback output by the ultrasonic transducer are respectively connected with an NO1 port and an CN2 port of the analog double-path single-pole double-throw switch, and current feedback output ends of the ultrasonic transducer are respectively connected with an NC1 port and an NO2 port of the analog double-path single-pole double-throw switch.
And a COM2 port of the analog double-circuit single-pole double-throw switch is connected with the alternating current-to-direct current module, and a MCUGPIO port of the singlechip is connected with an IN1 port and an IN02 port of the analog double-circuit single-pole double-throw switch, specifically a PC1 port and a PC2 port respectively. The COM2 port of the analog double-circuit single-pole double-throw switch outputs a selection signal, and the MCU controls the voltage feedback or the current feedback to be communicated with the COM2 port of the analog double-circuit single-pole double-throw switch.
The analog single pole double throw switch is controlled internally by the IN1 port and the IN2 port to determine two states, namely, connecting the voltage feedback to the output, then constant voltage is performed. And connecting current feedback to the output, and performing constant current. And voltage feedback output by the ultrasonic transducer is induced by a voltage signal transformer T3, and current feedback output by the ultrasonic transducer is induced by a current signal transformer T4.
In an embodiment of the present invention, as shown in fig. 20 and 21, when the analog switch 310 is an analog single pole double throw switch, and the analog single pole double throw switch is located at the head end of the constant voltage constant current switching module 300:
The ac-dc conversion module includes a third ac-dc conversion module 323 and a fourth ac-dc conversion module 324 with the same structure.
The current feedback output by the ultrasonic transducer is connected with the input end of the analog single-pole double-throw switch after being connected with the third alternating-current-to-direct-current module 323.
The voltage feedback output by the ultrasonic transducer is connected to the input of the analog single pole double throw switch after being connected to the fourth ac to dc module 324.
The output end of the analog single pole double throw switch is connected with the integral operation circuit module, and the output end of the integral operation circuit module is connected with the input end of the current stabilization time adjustment module 200.
In the embodiment, an A1 port of the analog single-pole double-throw switch is connected with current feedback output by the ultrasonic transducer, and an A2 port of the analog single-pole double-throw switch is connected with voltage feedback output by the ultrasonic transducer. The MCU is connected with an ENB port of the analog single-pole double-throw switch, specifically a PA1 port, and a B port of the analog single-pole double-throw switch outputs a selection signal. The MCU sends out a control signal, and an A1 port or an A2 port of the analog single-pole double-throw switch is selected to be communicated with a B port of the analog single-pole double-throw switch.
In this embodiment, the single-chip microcomputer MCU selects a signal, selects a static_i or a static_u signal, connects to the integral operation circuit module, selects "static_i" to realize a constant current function, and selects "static_u" to realize a constant voltage function.
Referring to fig. 22, in an embodiment of the invention, the rf amplifier module 430 includes an rf amplifier U4, resistors R12, R13, R14, and capacitors C8, C9, C10, C12.
After the output end of the DDS module is connected with the resistor R12, the resistor R12 is connected with the 3 rd pin of the radio frequency amplifier U4. The output end of the current stabilization time adjustment module 200 is connected with the 1 st pin of the radio frequency amplifier U4. One end of the resistor R13 is connected with a power supply, and the other end of the resistor R is connected with the 2 nd pin of the radio frequency amplifier U4. One end of the resistor R14 is connected with the 2 nd pin of the radio frequency amplifier U4, and the other end is grounded. After the capacitors C8 and C9 are connected in parallel, one end of the capacitor is connected with the 8 th pin of the radio frequency amplifier U4, and the other end of the capacitor is grounded. After the capacitors C10 and C12 are connected in parallel, one end of the capacitor is connected with the 6 th pin of the radio frequency amplifier U4, and the other end of the capacitor is grounded. And the 5 th pin and the 7 th pin of the radio frequency amplifier U4 are connected and then output, and are connected with the ultrasonic transducer 10. Wherein. An operational amplifier and a power amplifier are sequentially disposed between the rf amplifier module 430 and the ultrasonic transducer 10, for example, the operational amplifier filters the output signal of the rf amplifier module 430, amplifies the current signal or the voltage signal, and then inputs the filtered signal or the amplified signal to the power amplifier, and the power amplifier does not change the voltage or the current and the frequency, but increases the driving capability and transmits the amplified signal to the ultrasonic transducer 10 for output.
In one embodiment of the present invention, the DDS module 410 generates a fixed frequency signal that communicates with the MCU via SPI. Specifically, the DDS module 410 is an AD9833 chip.
Referring to fig. 1 to 22, the present invention further provides a driving method of an ultrasonic driving circuit, including:
the singlechip MCU is electrified to run, reads parameter calibration data written in the memory storage chip U1, and calibrates the DDS module 410, the DAC module 420, the current stabilization time adjustment module 200, the radio frequency amplifier module 430 and the constant voltage and constant current switching module 300 according to the parameter calibration data.
After calibration is completed, the singlechip MCU sends instructions to the DDS module 410 and the DAC module 420, and after the DDS module 410 and the DAC module 420 receive signals, the DDS module 410 outputs alternating-current frequency signals and the DAC module 420 outputs setting signals.
When the constant voltage and constant current switching module 300 switches to output a voltage signal, the DAC module 420 outputs a setting signal as a dc voltage signal. When the constant voltage and constant current switching module 300 switches to output a current signal, the DAC module 420 outputs a setting signal as the current signal.
The stabilized voltage or current signal and the ac frequency signal are input to the rf amplifier module 430, and the rf amplifier module 430 outputs both a controlled frequency and a controlled voltage or current ac signal to the ultrasonic transducer.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein.
The above-described embodiments merely represent embodiments of the invention, the scope of the invention is not limited to the above-described embodiments, and it is obvious to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.
Claims (10)
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