CN118544475B - Processing method of helical tooth silicon boat and silicon boat - Google Patents

Processing method of helical tooth silicon boat and silicon boat

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Publication number
CN118544475B
CN118544475B CN202410321668.XA CN202410321668A CN118544475B CN 118544475 B CN118544475 B CN 118544475B CN 202410321668 A CN202410321668 A CN 202410321668A CN 118544475 B CN118544475 B CN 118544475B
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CN
China
Prior art keywords
angle
tooth
chamfering
tool
silicon
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CN202410321668.XA
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Chinese (zh)
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CN118544475A (en
Inventor
林霜
周波
丁纺纺
祝军
祝建敏
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Hangzhou Dunyuan Poly Core Semiconductor Technology Co ltd
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Hangzhou Dunyuan Poly Core Semiconductor Technology Co ltd
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Priority to CN202410321668.XA priority Critical patent/CN118544475B/en
Publication of CN118544475A publication Critical patent/CN118544475A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/13—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

A method for machining a helical tooth silicon boat at least comprises the following steps of machining a groove bar, blanking and machining A1, selecting a silicon bar with proper size to cut the groove bar, wherein the size of the silicon bar is basically the same as or slightly larger than the largest outline of the groove bar, grinding the outline of the silicon bar, B, slotting B1, preparing a slotting tool for straight slot machining, B2, swinging a cutter spindle by a certain angle for chute machining, C, chamfering C1, preparing a chamfering tool, C2, calculating the horizontal plane rotation angle of the chamfering tool according to the vertical plane rotation angle of the silicon bar from the slotting step to the chamfering step, rotating the cutter to the angle obtained in C3, programming the cutter to chamfer machining, C5, rotating the chamfering tool on the horizontal plane to the initial position of the C2, and replacing the chamfering tool to chamfer the fillet machining to be larger than the chamfering tool. And (3) processing the top plate and the flange, cutting, perforating and chamfering the silicon ingot to obtain the top plate and the flange, and assembling the top plate and the flange with the grooved bars to form the silicon boat.

Description

Processing method of helical tooth silicon boat and silicon boat
Technical Field
The invention belongs to the field of semiconductor material processing, and particularly relates to a processing method of a helical tooth silicon boat and the silicon boat.
Background
The silicon boat is a carrier which is used in the processes of heat treatment of silicon ingots and the like and is generally made of silicon materials, occupies an indispensable part in the production of silicon products, and generally consists of a top plate, a flange, a grooved bar, a bolt and the like, wherein the grooved bar is a main component for bearing the silicon ingots, and the processing of the grooved bar becomes a key for the processing of the silicon boat. The shapes of the groove teeth of the groove bar are changed according to different use requirements, and the groove teeth have the shapes of straight teeth, steps, inclined teeth and the like, and the processing modes comprise grooving, step hooking, chamfering and the like. The bevel gear is generally used for reducing the contact area of the silicon ingot and the grooved bars as much as possible, but the design of the contact area of the silicon ingots with different thicknesses is different, but if the bevel gear inclination angle is smaller, the edge of the bevel gear is sharp and can scratch the silicon ingot easily, so that the bevel gear inclined at a small angle generally needs chamfering, and the chamfering depth is larger and better.
The silicon material is generally required to be ground, and a disc-shaped diamond abrasive disc is required to be used for grinding due to the large machining amount, but the disc-shaped cutter can only be fed in a plane parallel to the cutter, and damage to a product, the cutter or a machine tool can be caused.
The core of the groove rod machining is chamfering, the chamfering accuracy determines the smoothness degree of the contact position of the groove rod and the silicon ingot, and if the machining mode is unreasonable, a large section can be generated so that the placed silicon ingot is scratched. As shown in fig. 1, 2 and 9, the silicon boat comprises a top plate 3, a flange 1 and a grooved bar 2, wherein the grooved bar 2 is provided with helical teeth 4, the head of the helical teeth 4 is provided with a straight tooth part 5 with supporting function, the straight tooth part 5 is contacted with a silicon ingot, and therefore chamfering is required, other positions of the helical teeth 4 can be contacted with the silicon ingot when heat treatment or other conditions vibrate, and chamfering is also performed, but two positions requiring chamfering cannot be combined into one processing plane, so that edges are produced by over-cutting or incomplete processing at other positions on the premise of meeting chamfering at one position, the silicon ingot can have jumping to scratch on the silicon ingot under the condition of high temperature, and therefore, if the situation of needing to avoid the chamfering at two times in total, the processing is complicated and complicated, various problems such as uneven chamfering, different sizes of upper chamfer and lower chamfer and the like can occur if the helical teeth are not accurately calculated or a reasonable method is adopted, and even the position of a cutter is required to be manually corrected to ensure normal processing. On the premise of utilizing the existing equipment, how to chamfer the bevel gear on the silicon boat quickly and efficiently is the technical problem to be solved by the invention.
Disclosure of Invention
Aiming at the prior art, the invention aims to provide a chamfering method of a helical tooth silicon boat, a processing method of the helical tooth silicon boat and the silicon boat produced by the method.
The technical scheme of the invention is realized in such a way that the processing method of the helical tooth silicon boat at least comprises the following steps:
Ditch stick processing
A. Blanking and shape processing
A1, selecting a silicon rod with proper size, wherein the silicon rod is cut into a groove rod, and the size of the rectangular silicon rod is basically the same as or slightly larger than the maximum outline size of the groove rod;
a2, grinding the profile of the silicon strip;
B. Slotting
B1, preparing a slotting jig for straight slot processing;
b2, tilting the cutter main shaft by a certain angle to process the chute;
C. Chamfering tool
C1, preparing a chamfering jig;
C2, calculating the horizontal plane rotation angle of the chamfering tool according to the vertical plane rotation angle of the silicon strip from the grooving step to the chamfering step, and rotating the chamfering tool;
C3, calculating a deflection angle of the cutter;
c4, rotating the cutter to the angle obtained in the step C3, and programming the cutter to perform chamfering processing;
And C5, rotating the chamfering tool on a horizontal plane to restore to the initial position of the step C2, and replacing the chamfering tool to carry out chamfering processing.
And (3) processing the top plate and the flange, cutting, perforating and chamfering the silicon ingot to obtain the top plate and the flange, and assembling the top plate and the flange with the grooved bars to form the silicon boat.
The silicon strip chamfering machine has the advantages that the same machine tool can be used for grooving and chamfering silicon strips by using different disc-shaped cutters, after the cutters are deflected by a certain angle, long-distance chamfering can be accurately processed even if the machine tool coordinate system changes, namely, the long-distance chamfering can not be deflected when the roots of the bevel teeth are processed, the problem that the silicon strip is scratched due to severe shaking of the silicon strip when the silicon strip cannot be subjected to deep chamfering under some special conditions and heat treatment is solved, the abrasion of the cutter for the fillet is reduced when the chamfer is processed firstly and then the fillet is processed, the fillet processing is more accurate, the cambered surface processed by the cutter for the fillet is smoother, the silicon strip placed on the bevel teeth of the silicon strip is not easy to scratch, the rejection rate of the silicon strip in the heat treatment and other processes can be reduced, and the aim of reducing the production cost is achieved.
Further, grinding the profile of the silicon strip in the step A2 to obtain a first reference surface and a second reference surface which are parallel to each other, machining a third reference surface, wherein the third reference surface and the second reference surface form an acute angle, machining a first side tooth surface and a second side tooth surface, the first side tooth surface and the first reference surface form an obtuse angle, the second side tooth surface and the second reference surface form an obtuse angle, the tooth top surface is perpendicular to the first reference surface and the second reference surface, the tooth top surface, the first reference surface and the second reference surface are perpendicular to the upper end surface, the tooth top surface, the first reference surface and the second reference surface are perpendicular to the lower end surface, rounded transition is adopted between the tooth top surface and the first side tooth surface and the second side tooth surface, rounded transition is also adopted between the first reference surface and the second reference surface, rounded transition is also adopted between the first reference surface and the third reference surface, the first side tooth surface and the second side tooth surface can be designed and positioned conveniently, and the first side tooth surface and the second side tooth surface can be designed symmetrically and processed conveniently.
Further, in the step B1, the slotting jig can enable the third datum plane of the silicon strip processed in the step A2 to be in a horizontal position, the slotting jig is at least provided with a first supporting surface and a second supporting surface, the included angle between the first supporting surface and the second supporting surface is the same as the included angle between the first side tooth surface and the second datum plane, the second supporting surface is parallel to the horizontal plane, the first side tooth surface can be adhered to the first supporting surface through adhesive materials such as adhesive wax, the third datum plane can be adhered to the second supporting surface through adhesive materials such as adhesive wax, the slotting jig is fixed to processing equipment, firstly, a straight tooth part is processed by tool setting, and a straight groove is cut on the silicon strip, so that the silicon strip is leaned on the slotting jig, the processing efficiency of the inclined tooth can be improved, uneven stress cracking or partial stress concentration surface collapse of the material during processing can be avoided, the processing time can be reduced through the adhesive wax, and the fixing effect and the buffering effect can be achieved.
Further, in the step B2, the cutter main shaft is inclined by a certain angle, a plurality of bevel gears are obtained by grinding, cutting and grooving for many times from the tooth top surface, and all the straight tooth parts are machined and then the bevel gears are machined, so that the risk of tooth breakage does not occur in the machining of the straight tooth parts, the feed speed can be slowed down in the earlier stage when the bevel gears are machined, and the feed speed is restored until the machining is completed after the straight tooth parts are machined.
Further, in the step C1, the chamfering tool is provided with at least a first limiting surface, a second limiting surface, a third limiting surface and a side limiting surface, the first limiting surface and the second limiting surface are perpendicular to the horizontal plane, the first reference surface can be stuck on the first limiting surface through adhesive materials such as adhesive wax, the second reference surface can be stuck on the second limiting surface through adhesive materials such as adhesive wax, the third reference surface can be stuck on the third limiting surface through adhesive materials such as adhesive wax, and the upper end surface or the lower end surface can be stuck on the side limiting surface through adhesive materials such as adhesive wax, so that the chamfering process can be performed on the fixed silicon strip which can be stabilized.
Further, the rotation angle of the horizontal plane of the jig is calculated in the step C2, and is obtained by means of computer aided design software, namely, a ditch bar model is made by using software, a line segment or a straight line perpendicular to the first reference surface or the second reference surface is made, the included angle between the line segment or the straight line and the inclined tooth surface is measured, the degree of the included angle, namely, the rotation angle of the horizontal plane of the jig is obtained, the line segment or the straight line is parallel to the horizontal plane in the step C chamfering, the calculated amount is greatly reduced by computer aided, calculation errors are not easy to occur, and products with different angles are developed more rapidly.
Further, in the step C3, calculating the deflection angle of the cutter by means of computer aided design software, firstly, making a ditch bar model through software, constructing a basic coordinate system X ' Y ' Z ' or an auxiliary surface, wherein the X ' axis of the basic coordinate system is perpendicular to the upper end surface, the Y ' axis is perpendicular to the first reference surface, the Z ' axis is perpendicular to the third reference surface, the auxiliary surface is parallel to the upper end surface, the basic coordinate system X ' Y ' Z ' or the auxiliary surface is not rotated after being determined, at the moment, the ditch bar rotates around an axis parallel to the X ' axis, the rotation angle is the same as the complementary angle of the included angle between the second reference surface and the third reference surface, and then rotates around an axis parallel to the Z ' axis, the rotation angle is the same as the horizontal plane of the chamfering tool calculated in the step C2, and finally, the included angle between the rotated skewed tooth 1 surface and the Y ' Z ' surface or the auxiliary surface is measured by using an angle measuring tool in the software, wherein the included angle is the required deflection angle of the cutter, the calculation error is greatly reduced through computer assistance, and the development of products with different angles is not easy to occur.
Further, in the step C4, a disc-shaped cutter with two chamfer faces is used, the upper tooth groove faces are chamfered firstly, the same cutter is adopted to chamfer the lower tooth groove faces of all the inclined teeth after the edge chamfering of the upper tooth groove faces is completed, the same cutter is adopted to chamfer the lower tooth groove faces of the next adjacent inclined teeth after the edge chamfering of one upper tooth groove face is completed, thus the machining is convenient and quick, the time waste of cutter replacement is avoided, the machining and positioning of the same cutter are only needed once, the machining efficiency is higher, and the double-face chamfering can play a better role in protecting a silicon ingot.
Further, in the step C5, the round corner cutter moves in a vertical plane relative to the groove bar, the movement track of the round corner cutter relative to the groove bar is U-shaped and at least comprises a first chamfer line, a first circular arc line, a tooth top chamfer line, a second circular arc line and a second chamfer line, the first chamfer line is parallel to the edge of the bevel on the first side tooth surface, the radius of the first circular arc line and the radius of the second circular arc line are equal to the sum of the radius of the cutter and the radius of the round corner, the tooth top chamfer line is parallel to the edge of the tooth top surface, the second chamfer line is parallel to the edge of the bevel on the second side tooth surface, and therefore a smooth curved surface can be machined, and a better protection effect is achieved on the silicon ingot.
The bevel gear silicon boat is formed by processing and assembling by the method, so that the processed bevel gear silicon boat has larger chamfering depth and higher chamfering precision, can ensure that the chamfering surface is smoother, and has better protection effect on silicon ingots.
Drawings
FIG. 1 is a schematic perspective view of a helical fluted rod;
FIG. 2 is a schematic perspective view of a helical fluted rod;
FIG. 3 is a schematic illustration of the present invention with a channel bar mounted on a slotted jig;
FIG. 4 is a schematic top side view of the present invention with the channel bar installed in a slotted jig;
FIG. 5 is a schematic side view of the inventive channel bar mounted on a chamfer fixture;
FIG. 6 is a schematic top view of the present invention with a grooved bar mounted on a chamfering tool;
FIG. 7 is a schematic top view of the present invention with the channel bar mounted for horizontal rotation on a chamfering tool;
FIG. 8 is a schematic perspective view of a chamfering tool of the present invention;
FIG. 9 is a perspective view of an assembly of a helical silicon boat;
FIG. 10 is a schematic view of the path of the radius tool according to the present invention.
Detailed Description
As required, detailed embodiments of the present invention are disclosed herein, but it is to be understood that the disclosed embodiments are merely exemplary of the invention that may be embodied in various and alternative forms. The figures are not necessarily to scale and certain features may be exaggerated or minimized to show details of particular components. Therefore, specific structural and functional details disclosed herein are not to be interpreted as limiting, but merely as a representative basis for teaching one skilled in the art to variously employ the present invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in fig. 1, 2,3, 4, 5,6, 7, 8, 9 and 10, a method for processing a helical silicon boat at least comprises the following steps:
Ditch stick processing
A. Blanking and shape processing
A1, selecting a silicon rod with proper size to cut a ditch rod 2, wherein the size of the rectangular silicon rod is basically the same as or slightly larger than the maximum outline size of the ditch rod 2;
A2, grinding the profile of the silicon strip to obtain a first reference surface 11 and a second reference surface 12 which are parallel to each other, machining a third reference surface 13, forming an acute angle between the third reference surface 13 and the second reference surface 12, machining a first side tooth surface 14 and a second side tooth surface 15, forming an obtuse angle between the first side tooth surface 14 and the first reference surface 11, forming an obtuse angle between the second side tooth surface 15 and the second reference surface 12, forming an obtuse angle between the tooth top 16 and the first reference surface 11 and the second reference surface 12, forming a vertical angle between the tooth top 16, the first reference surface 11 and the second reference surface 12 and a vertical angle between the tooth top 16 and the first side tooth surface 14 and the second side tooth surface 15, the first reference surface 11, the second reference surface 12, the first side tooth surface 14 and the second side tooth surface 15 also adopt fillet transition, the first reference surface 11, the second reference surface 12 and the third reference surface 13 also adopt fillet transition, the fillets can be of the same size or slightly different in the range of 2-6mm, the embodiment adopts fillet radius of 4mm for chamfering, the included angle between the second reference surface 12 and the third reference surface 13 can be about 20-90 degrees, the embodiment adopts 61 degrees, the included angle between the first side tooth surface 14 and the first reference surface 11 can be the same as the included angle between the second side tooth surface 15 and the second reference surface 12, and the embodiment adopts 4.5 degrees;
B. Slotting
B1, preparing a slotting jig for straight slot processing;
Preparing a slotting jig 19, wherein the slotting jig 19 can enable a third reference surface 13 of the silicon strip processed in the step A2 to be positioned at a horizontal position, the slotting jig 19 is provided with at least a first supporting surface 21 and a second supporting surface 20, an included angle between the first supporting surface 21 and the second supporting surface 20 is the same as an included angle between a first side tooth surface 14 and a second reference surface 12, the second supporting surface 20 is parallel to a horizontal plane, the first side tooth surface 14 can be adhered to the first supporting surface 21 through adhesive materials such as wax, the third reference surface 13 can be adhered to the second supporting surface 20 through adhesive materials such as wax, the wax is adhered to the wax, the jig is fixed to processing equipment, the straight tooth part 5 is processed firstly, a cutter spindle does not need to deflect, and straight slot processing can be started by directly aligning a cutter;
b2, tilting the cutter main shaft by a certain angle to process the chute;
After the straight tooth part 5 is machined, a plurality of inclined teeth 4 are obtained by grinding and cutting grooves for a plurality of times through the arrangement of a machine tool, the inclination angle of the cutter main shaft is the same as the angle required by the inclined teeth 4 on the ditch bar 2, the angle of the inclined teeth 4 is designed according to the requirements of the heat treatment process of the silicon ingot, different inclined teeth 4 are designed aiming at the silicon ingots with different thicknesses and sizes and different heat treatment processes, in order to ensure better machining precision and powerful support, the straight tooth part 5 is designed at the end part of the inclined teeth 4 to obtain more accurate supporting force, thus the advantage of the straight tooth can be obtained, and the advantage of the inclined tooth is provided, as shown in fig. 3, in the embodiment, the straight tooth part 5 is parallel to the Z axis of the Y axis and is perpendicular to the X axis, the inclined tooth 4 is parallel to the Y axis, the angle between the inclined tooth 4 and the X axis is 89 degrees, the angle between the inclined tooth 4 and the Z axis is 1 degree, the basic machining methods within the range of 0 degree to 20 degrees are all the same according to the requirements, the basic machining methods are all the same, the cutter main shaft rotates around the Y axis to form the inclined angle for 10 degrees, the cutter is programmed, the advantages of the straight tooth can be obtained, the vibration is not only buffered, and the vibration strip can be machined, and the vibration in the machining process is avoided;
the cutter main shaft rotates around the Y axis and inclines for 1 degree, a plurality of bevel gears are obtained by grinding, cutting and grooving for a plurality of times from the tooth top surface, and all the straight tooth parts are processed and then the bevel gears are processed.
C. Chamfering tool
C1, preparing a chamfering jig 23, wherein the chamfering jig 23 is at least provided with a first limiting surface 24, a second limiting surface 25, a third limiting surface 26 and a side limiting surface 27, the first limiting surface 24 and the second limiting surface 25 are perpendicular to the horizontal plane, the first datum surface 11 can be adhered to the first limiting surface 24 through adhesive materials such as adhesive wax, the second datum surface 12 can be adhered to the second limiting surface 25 through adhesive materials such as adhesive wax, the third datum surface 13 can be adhered to the third limiting surface 26 through adhesive materials such as adhesive wax, the upper end surface 17 or the lower end surface 18 can be adhered to the side limiting surface 27 through adhesive materials such as adhesive wax, the initial placement position of the chamfering jig 23 can ensure that the upper end surface 17 of a ditch bar and the upper end surface 17 of the grooving jig 19 can be processed by adopting the same equipment in parallel chamfering and grooving when the ditch bar is fixed, and only a cutter needs to be replaced;
Calculating the rotation angle of the horizontal plane of the chamfering tool 23, wherein in the B grooving step, the grooving surface forms a certain angle with the YZ plane of the coordinate axis of the machine tool, the angle is 1 degree in the embodiment, the silicon strip needs to rotate along the axis in the horizontal direction from the B grooving step to the C chamfering step, namely, the angle of 61 degrees is formed between the first reference surface 11 and the second reference surface 12 and the horizontal plane in the B grooving step, the angle is 90 degrees between the first reference surface 11 and the second reference surface 12 and the horizontal plane in the C chamfering step, the axis in the parallel X-axis direction needs to rotate by 29 degrees, the axis in the parallel Y-axis direction rotates to realize machining, the tool position can not be adjusted by rotating along the parallel direction of the X axis, in order to ensure that the bevel gear 4 surface is parallel to the tool processing plane, the tool must be rotated by a certain angle relative to the tool along the axis perpendicular to the horizontal plane, the calculation can be obtained through complex geometric calculation, or can be obtained by means of computer aided design software, namely, the software is used for making a model of the ditch stick 2, a line segment or a straight line perpendicular to the first reference surface 11 or the second reference surface 12 is made, the included angle between the line segment or the straight line and the bevel gear 4 surface is measured, and the degree of the included angle, namely, the rotation angle of the horizontal plane of the chamfering tool 23 is obtained, the line segment or the straight line segment is parallel to the horizontal plane in the C chamfering step, and the measured degree is 0.485 degree in the embodiment.
C3, calculating the deflection angle of the cutter, wherein the calculation is troublesome by using a geometric method, a plurality of auxiliary lines are needed to be drawn to help the calculation, time and labor are wasted, such as the calculation is realized by means of computer-aided design software, such as CAXA entity design software, UG or Solidworks, the angle measurement function is realized, the auxiliary surface is needed to help the measurement, firstly, a model of the ditch stick 2 is made through the software, a basic coordinate system X ' Y ' Z ' or an auxiliary surface is constructed, the X ' axis of the basic coordinate system is perpendicular to the upper end surface 17, the Y ' axis is perpendicular to the first reference surface 11, the Z ' axis is perpendicular to the third reference surface 13, the auxiliary surface is parallel to the upper end surface 17, the basic coordinate system X ' Y ' Z ' or the auxiliary surface is not rotated after being determined, and the ditch stick rotates around an axis parallel to the X ' axis at this moment, the rotation angle is the same as the complementary angle of the included angle between the second reference surface 12 and the third reference surface 13, 29 degrees in the embodiment, and then the chamfering tool is rotated around the axis parallel to the Z ' axis, the rotation angle is the same as the rotation angle of the horizontal plane of the chamfering tool 23 calculated in the step C2, 0.485 degrees in the embodiment, finally, the included angle between the rotated bevel 4 surface and the Y ' Z ' surface or the auxiliary surface is measured by using an angle measuring tool in software, the included angle is the required deflection angle of the cutter, the measured angle is 0.875 degrees in the embodiment, and the angle can also be measured by the machine tool for surface beating, but the precision of the machine tool can only be precisely two decimal places, so that part of silicon boats with higher requirements on the round angle may not be smooth enough due to the influence of machining precision, and the possibility of scraping silicon wafers under special environments.
And C4, rotating the cutter to the angle obtained in C3, namely 0.875 degree, programming the cutter to chamfer 7, chamfering the upper tooth groove surface 8 by using a disc cutter with two chamfer surfaces, generally chamfering the upper tooth groove surface 8 by adopting 45 degrees, chamfering the lower tooth groove surfaces 9 of all the helical teeth 4 by adopting the same cutter after the edge chamfering of the upper tooth groove surface 8 is completed, or chamfering the lower tooth groove surfaces 9 of the next adjacent helical teeth 4 by adopting the same cutter directly after the edge chamfering of one upper tooth groove surface 8 is completed, and positioning or replacing the cutter for a plurality of times is not needed.
And C5, the chamfering tool 23 rotates on the horizontal plane to restore to the initial position of the step C2, namely, the rotation is reversed by 0.875 degrees, as shown in the drawing of a U-shaped point line track in fig. 10, the cutter is moved to a cutter position of a chamfering cutter 66, in the step, the cutter 66 is replaced to process a round angle 6, the cutter 66 moves in a vertical plane relative to the grooved bar 2, the movement track of the cutter 66 relative to the grooved bar 2 is U-shaped and at least comprises a first chamfering line 61, a first circular arc 63, a tooth top chamfering line 65, a second circular arc 64 and a second chamfering line 62, the first chamfering line 61 is parallel to the edge of the bevel 4 on the first side tooth surface 14, the radius of the first circular arc 63 and the second circular arc 64 is equal to the sum of the radius of the cutter 66 and the radius of the round angle, the tooth top chamfering line 65 is parallel to the edge of the tooth top 16, and the second chamfering line 62 is parallel to the edge of the bevel 4 on the second side tooth surface 15, so that the main contact position can realize the round angle transition, and a good protection effect on the silicon ingot. Generally, the fillet 6 needs to cover the chamfer 7 entirely at the edge of the tooth top 16, so that the transition is smoother, and generally the radius of the fillet 6 is twice or more as large as the chamfer 7, for example, 0.5mm is taken by the chamfer 7, and the fillet 6 can be 1mm-1.5mm.
The top plate 3 and the flange 1 are processed, the top plate 3 and the flange 1 are obtained by cutting, perforating and chamfering a silicon ingot, and the top plate and the flange 1 are assembled together with the ditch bar 2 to form a silicon boat.
As shown in fig. 9, the helical tooth silicon boat comprises a top plate 3, a flange 1 and a ditch bar 2, and is manufactured and assembled by the method.

Claims (6)

1.一种斜齿硅舟的加工方法，其特征在于：至少包括以下步骤：1. A method for processing a helical gear silicon boat, characterized in that it comprises at least the following steps: 沟棒加工Groove rod processing A、下料及外形加工A. Cutting and shape processing A1、选取大小适合的硅棒切割出沟棒（2）需要矩形硅条的大小，硅条尺寸与沟棒（2）最大外形尺寸相同或略大；A1. Select a silicon rod of suitable size and cut out a rectangular silicon strip of the size required for the groove rod (2). The size of the silicon strip should be the same as or slightly larger than the maximum outer dimension of the groove rod (2); A2、对硅条外形进行磨削加工；A2. Grinding the silicon strip shape; B、开槽B. Slotting B1、准备开槽冶具（19）进行直槽加工；B1. Prepare a slotting jig (19) for straight slot processing; B2、刀具主轴偏摆一定角度进行斜槽加工；B2. The tool spindle tilts to a certain angle to process the inclined groove; C、倒角C. Chamfer C1、准备倒角冶具（23）；C1. Prepare chamfering jig (23); C2、根据硅条从开槽步骤到倒角步骤竖直面转动角度计算倒角冶具（23）水平面转动角度并转动倒角冶具（23）；C2. Calculating the horizontal rotation angle of the chamfering jig (23) according to the vertical rotation angle of the silicon strip from the slotting step to the chamfering step and rotating the chamfering jig (23); C3、计算刀具偏摆角度；C3. Calculate the tool deflection angle; C4、转动刀具到C3中获得的角度，编程对刀进行倒角加工；C4, rotate the tool to the angle obtained in C3, and program the tool to perform chamfering; C5、倒角冶具（23）在水平面上转动恢复到C2步骤的初始位置，更换圆角刀具（66）进行圆角加工；C5, the chamfering jig (23) is rotated on the horizontal plane to return to the initial position of step C2, and the fillet tool (66) is replaced to perform fillet processing; 进行天板（3）和法兰（1）加工，从硅锭上切割、开孔和倒角获得天板（3）和法兰（1），并与沟棒（2）组装到一起形成硅舟；Processing the top plate (3) and the flange (1) involves cutting, drilling, and chamfering the silicon ingot to obtain the top plate (3) and the flange (1), and assembling them together with the groove rod (2) to form a silicon boat; 在A2步骤中对硅条外形进行磨削加工获得相互平行的第一基准面（11）和第二基准面（12），加工第三基准面（13），所述第三基准面（13）与所述第二基准面（12）成锐角，加工第一侧齿面（14）和第二侧齿面（15），所述第一侧齿面（14）与所述第一基准面（11）成钝角，所述第二侧齿面（15）与所述第二基准面（12）成钝角，齿顶面（16）与所述第一基准面（11）和所述第二基准面（12）垂直，所述齿顶面（16）、所述第一基准面（11）和所述第二基准面（12）与上端面（17）垂直，所述齿顶面（16）、所述第一基准面（11）和所述第二基准面（12）与下端面（18）垂直，所述齿顶面（16）与所述第一侧齿面（14）和所述第二侧齿面（15）之间采用圆角过渡，所述第一基准面（11）和所述第二基准面（12）与所述第一侧齿面（14）和所述第二侧齿面（15）之间也采用圆角过渡，所述第一基准面（11）和所述第二基准面（12）与所述第三基准面（13）之间也采用圆角过渡；In step A2, the outer shape of the silicon strip is ground to obtain a first reference plane (11) and a second reference plane (12) that are parallel to each other, a third reference plane (13) is processed, and the third reference plane (13) forms an acute angle with the second reference plane (12), a first side tooth surface (14) and a second side tooth surface (15) are processed, and the first side tooth surface (14) forms an obtuse angle with the first reference plane (11), and the second side tooth surface (15) forms an obtuse angle with the second reference plane (12), and the tooth top surface (16) is perpendicular to the first reference plane (11) and the second reference plane (12), and the tooth top surface (16), the first reference plane (11) and the second reference plane (12) are perpendicular to each other. 1) and the second reference surface (12) are perpendicular to the upper end surface (17), the tooth top surface (16), the first reference surface (11) and the second reference surface (12) are perpendicular to the lower end surface (18), a fillet transition is adopted between the tooth top surface (16) and the first side tooth surface (14) and the second side tooth surface (15), a fillet transition is also adopted between the first reference surface (11) and the second reference surface (12) and the first side tooth surface (14) and the second side tooth surface (15), and a fillet transition is also adopted between the first reference surface (11) and the second reference surface (12) and the third reference surface (13); 在B2步骤中刀具主轴倾斜一定角度多次磨削切割开槽获得多个斜齿（4）；In step B2, the tool spindle is tilted at a certain angle to grind, cut and groove multiple times to obtain multiple helical teeth (4); 在C2步骤中计算所述倒角冶具（23）水平面转动角度，通过借助计算机辅助设计软件来获得，即使用软件作出沟棒（2）模型，作一条与所述第一基准面（11）或所述第二基准面（12）垂直的线段或直线，测量该线段或直线与所述斜齿（4）面的夹角，获得该夹角的度数即所述倒角冶具（23）水平面转动角度，该直线或线段在C倒角步骤中与水平面平行；In step C2, the horizontal rotation angle of the chamfering jig (23) is calculated by using computer-aided design software, that is, a groove rod (2) model is made using the software, a line segment or a straight line perpendicular to the first reference plane (11) or the second reference plane (12) is made, and the angle between the line segment or the straight line and the bevel tooth (4) surface is measured to obtain the degree of the angle, which is the horizontal rotation angle of the chamfering jig (23). The straight line or line segment is parallel to the horizontal plane in step C; 在C3步骤中计算刀具偏摆角度借助计算机辅助设计软件，首先通过软件画出所述沟棒（2）模型，构建基本坐标系X’Y’Z’或辅助面，基本坐标系的X’轴与所述上端面（17）垂直，Y’轴与所述第一基准面（11）垂直，Z’轴与所述第三基准面（13）垂直，辅助面与所述上端面（17）平行，基本坐标系X’Y’Z’或辅助面确定以后不再转动，此时沟棒（2）先绕平行于X’轴的轴线转动，转动角度与所述第二基准面（12）与所述第三基准面（13）之间的夹角的余角相同，再绕平行于Z’轴的轴线转动，转动角度与C2步骤中计算的倒角冶具23水平面转动角度相同，最后使用软件中的角度测量工具测量旋转后斜齿4面与Y’Z’面或辅助面的夹角，该夹角即为刀具需要的偏摆角。In step C3, the tool deflection angle is calculated with the help of computer-aided design software. First, the groove rod (2) model is drawn through the software, and the basic coordinate system X’Y’Z’ or auxiliary surface is constructed. The X’ axis of the basic coordinate system is perpendicular to the upper end surface (17), the Y’ axis is perpendicular to the first reference surface (11), the Z’ axis is perpendicular to the third reference surface (13), and the auxiliary surface is parallel to the upper end surface (17). After the basic coordinate system X’Y’Z’ or auxiliary surface is determined, it will no longer rotate. At this time, the groove rod (2) first rotates around an axis parallel to the X’ axis, and the rotation angle is the same as the complementary angle of the angle between the second reference surface (12) and the third reference surface (13). Then, it rotates around an axis parallel to the Z’ axis, and the rotation angle is the same as the rotation angle of the horizontal plane of the chamfering jig 23 calculated in step C2. Finally, the angle measurement tool in the software is used to measure the angle between the helical tooth 4 surface and the Y’Z’ surface or auxiliary surface after rotation. This angle is the required deflection angle of the tool. 2.根据权利要求1所述的斜齿硅舟的加工方法，其特征在于：在B1步骤中，所述开槽冶具（19）使得A2步骤加工完成的硅条的所述第三基准面（13）处于水平位置，所述开槽冶具（19）至少设置第一支撑面（21）和第二支撑面（20），所述第一支撑面（21）和所述第二支撑面（20）之间的夹角与所述第一侧齿面（14）和所述第二基准面（12）之间的夹角相同，所述第二支撑面（20）与水平面平行，所述第一侧齿面（14）通过黏蜡等黏性材料黏贴所述第一支撑面（21）上，所述第三基准面（13）通过黏蜡等黏性材料黏贴所述第二支撑面（20）上，对刀加工直齿部（5）。2. The method for processing a helical-tooth silicon boat according to claim 1, characterized in that: in step B1, the slotting jig (19) makes the third reference surface (13) of the silicon strip processed in step A2 be in a horizontal position, and the slotting jig (19) is provided with at least a first supporting surface (21) and a second supporting surface (20), the angle between the first supporting surface (21) and the second supporting surface (20) is the same as the angle between the first side tooth surface (14) and the second reference surface (12), the second supporting surface (20) is parallel to the horizontal plane, the first side tooth surface (14) is adhered to the first supporting surface (21) by a sticky material such as sticky wax, and the third reference surface (13) is adhered to the second supporting surface (20) by a sticky material such as sticky wax, and the straight tooth portion (5) is processed by tool setting. 3.根据权利要求2所述的斜齿硅舟的加工方法，其特征在于：在C1步骤中，所述倒角冶具（23）至少设有第一限位面（24）、第二限位面（25）、第三限位面（26）和侧限位面（27），所述侧限位面（27）、所述第一限位面（24）和所述第二限位面（25）与水平面垂直，所述第一基准面（11）通过黏蜡等黏性材料黏贴所述第一限位面（24）上，所述第二基准面（12）通过黏蜡等黏性材料黏贴所述第二限位面（25）上，所述第三基准面（13）通过黏蜡等黏性材料黏贴所述第三限位面（26）上，所述上端面（17）或所述下端面（18）通过黏蜡等黏性材料黏贴所述侧限位面（27）上。3. The processing method of the helical gear silicon boat according to claim 2 is characterized in that: in step C1, the chamfering jig (23) is provided with at least a first limiting surface (24), a second limiting surface (25), a third limiting surface (26) and a side limiting surface (27), the side limiting surface (27), the first limiting surface (24) and the second limiting surface (25) are perpendicular to the horizontal plane, the first reference surface (11) is adhered to the first limiting surface (24) by a sticky material such as sticky wax, the second reference surface (12) is adhered to the second limiting surface (25) by a sticky material such as sticky wax, the third reference surface (13) is adhered to the third limiting surface (26) by a sticky material such as sticky wax, and the upper end surface (17) or the lower end surface (18) is adhered to the side limiting surface (27) by a sticky material such as sticky wax. 4.根据权利要求3所述的斜齿硅舟的加工方法，其特征在于：在C4步骤中，转动刀具到C3中获得的角度，编程对刀进行倒角（7）加工，使用具有两个倒角面的盘形刀具，先对上齿沟面（8）进行倒角，之后采用同一刀具对斜齿（4）的下齿沟面（9）进行倒角。4. The method for processing a bevel gear silicon boat according to claim 3 is characterized in that: in step C4, the tool is rotated to the angle obtained in C3, and the tool is programmed to perform chamfering (7), using a disc-shaped tool with two chamfering surfaces to first chamfer the upper tooth groove surface (8), and then the same tool is used to chamfer the lower tooth groove surface (9) of the bevel gear (4). 5.根据权利要求4所述的斜齿硅舟的加工方法，其特征在于：在C5步骤中，所述倒角冶具（23）在水平面上转动恢复到C2步骤的初始位置，更换圆角刀具（66）进行圆角（6）加工，所述圆角刀具（66）相对所述沟棒（2）在竖直平面内移动，所述圆角刀具（66）相对所述沟棒（2）移动轨迹成U形至少包括第一倒角线（61）、第一圆弧线（63）、齿顶倒角线（65）、第二圆弧线（64）和第二倒角线（62），所述第一倒角线（61）平行于所述第一侧齿面（14）上所述斜齿（4）的棱边，所述第一圆弧线（63）和所述第二圆弧线（64）的半径等于所述圆角刀具（66）半径和圆角半径之和，所述齿顶倒角线（65）与所述齿顶面（16）棱边平行，所述第二倒角线（62）平行于所述第二侧齿面（15）上所述斜齿（4）的棱边。5. The method for processing a helical gear silicon boat according to claim 4, characterized in that: in step C5, the chamfering jig (23) is rotated on a horizontal plane to return to the initial position of step C2, and a fillet tool (66) is replaced to perform fillet (6) processing, and the fillet tool (66) moves in a vertical plane relative to the groove rod (2), and the movement trajectory of the fillet tool (66) relative to the groove rod (2) is U-shaped and at least includes a first chamfer line (61), a first arc line (63), a tooth top chamfer line (6 5), a second circular arc line (64) and a second chamfer line (62), wherein the first chamfer line (61) is parallel to the edge of the bevel tooth (4) on the first side tooth surface (14), the radius of the first circular arc line (63) and the second circular arc line (64) is equal to the sum of the radius of the fillet tool (66) and the fillet radius, the tooth top chamfer line (65) is parallel to the edge of the tooth top surface (16), and the second chamfer line (62) is parallel to the edge of the bevel tooth (4) on the second side tooth surface (15). 6.一种斜齿硅舟，其特征在于：包括天板（3）、法兰（1）和沟棒（2），所述沟棒采用权利要求1-5中任意一种方法进行加工。6. A helical-tooth silicon boat, characterized in that it comprises a top plate (3), a flange (1) and a groove rod (2), wherein the groove rod is processed by any one of the methods of claims 1-5.
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