CN117835524A

CN117835524A - A circuit board module, line card and computing device

Info

Publication number: CN117835524A
Application number: CN202211200218.2A
Authority: CN
Inventors: 杨成建
Original assignee: XFusion Digital Technologies Co Ltd
Current assignee: XFusion Digital Technologies Co Ltd
Priority date: 2022-09-29
Filing date: 2022-09-29
Publication date: 2024-04-05

Abstract

The embodiment of the present application discloses a circuit board module, a line card and a computing device. The circuit board module includes: a chip, a circuit board and a cable assembly. A ground wall is set around the signal via of the circuit board to shield interference, and a conductive medium is set in the ground wall to effectively reduce the hole-hole crosstalk. The signal transmitted in the signal via is led out through the first lead of the cable assembly to avoid the line-hole crosstalk.

Description

Circuit board module, line card and computing device

Technical Field

The embodiment of the application relates to the field of circuit board design, in particular to a circuit board module, a line card and a computing device.

Background

As the computational demands on computing devices become higher, the signal rate of high-speed systems evolves from 56G gradually to 112G, and may continue to evolve to 224G in the future.

As the signal rate is continuously increased, the pin arrangement of a package area on a circuit board, such as a Ball Grid Array (BGA) or a Land Grid Array (LGA), needs to be denser, and the crosstalk between the wires Kong Chuanrao (cross talk) and the holes in the BGA or LGA area caused by the dense arrangement of the pins is also increased.

Therefore, how to reduce the line crosstalk and the hole crosstalk in the circuit board is a current urgent problem to be solved.

Disclosure of Invention

The embodiment of the application provides a circuit board module, a line card and a computing device. Through set up the earth wall shielding interference around the signal via hole of circuit board, set up conductive medium in this earth wall, effectively reduce hole crosstalk. The signal transmitted in the signal via is routed through the first lead of the cable assembly, bypassing the line Kong Chuanrao.

A first aspect of the present embodiments provides a circuit board module, including: chip, circuit board and cable assembly; the chip is arranged on the first surface of the circuit board; the chip comprises a signal pin and a grounding pin; the circuit board comprises signal through holes, grounding through holes and grounding walls, wherein the signal through holes are connected with the signal pins, the grounding through holes are connected with the grounding pins, at least two of the grounding through holes are connected through the grounding walls, conductive media are arranged in the grounding walls, the grounding walls surround at least one group of the signal through holes, and conductive media are arranged in the grounding walls; the cable component is arranged on the second surface of the circuit board; the cable assembly includes a first lead, wherein the first lead is connected with the signal via.

Further, the circuit board in the embodiment of the present application may be a multi-layer board, and the signal via may extend to a certain layer in the circuit board, without being limited herein.

Similarly, in the embodiment of the present application, the ground via may extend through the entire circuit board, or may not extend through the entire circuit board, but may extend to a layer in the circuit board, which is not specifically limited herein.

Pads may also be provided on the surface of the circuit board with exposed signal vias and/or exposed ground vias. The signal via and/or the ground via are electrically connected to the pad.

In this embodiment of the present application, the annular ground wall surrounds at least one group of signal vias (and signal pins in the signal vias), and the ground wall can shield crosstalk of other signals, so that crosstalk suffered by signal pins in the ground wall is reduced. And the signal transmitted in the signal via hole is led out from the second surface of the circuit board through the first lead of the cable assembly, so that the crosstalk of the wire hole and the crosstalk of the hole are avoided, and the signal to noise ratio of the signal is improved. Meanwhile, the problem of through-flow of the circuit board with large current is solved.

In a possible implementation manner of the first aspect, the cable assembly further includes a spring reed, and the first lead is connected to the signal via through the spring reed; the elastic reed is arranged on the second surface of the circuit board; one end of the elastic reed is abutted with the signal via hole; the other end of the elastic reed is connected with the first lead. And the implementation flexibility of the scheme is improved.

In a possible implementation manner of the first aspect, the cable assembly further includes a pin, and the first lead is connected to the signal via through the pin; the pins are arranged on the second surface of the circuit board; one end of the pin is connected with the signal via hole; the other end of the pin is connected with the first lead. The pin may be a separate component disposed at one end of the first lead, or may be a portion of the first lead, as embodiments of the present application are not limited in this respect. And the implementation flexibility of the scheme is improved.

In a possible implementation manner of the first aspect, the circuit board further includes a first pad, the first pad is disposed on the second face of the circuit board, and the first pad is connected with the signal via; the pins of the cable assembly are connected with the first bonding pads, and the pins are connected with the signal through holes through the first bonding pads. And the implementation flexibility of the scheme is improved.

In a possible implementation manner of the first aspect, the pins extend into the signal vias, and the pins are connected to the signal vias by welding. The impedance degradation caused by the exposure of the wire stripping is avoided, and the signal transmission quality is improved.

In a possible implementation manner of the first aspect, the cable assembly further includes a second lead, and the second lead is grounded; the second lead is connected with the grounding via hole.

In a possible implementation manner of the first aspect, the second lead is connected to the ground via by welding, or the second lead is connected to the ground via by the elastic reed. And the implementation flexibility of the scheme is improved.

In a possible implementation manner of the first aspect, the ground wall is a through hole slot and/or a blind hole slot, wherein the through hole slot penetrates the circuit board, and the blind hole slot does not penetrate the circuit board. And the implementation flexibility of the scheme is improved.

In a possible implementation manner of the first aspect, the grounding wall is provided with the conductive medium, and includes: the grounding wall is internally filled with the conductive medium, or the conductive medium is paved on the inner side wall of the grounding wall.

In a possible implementation manner of the first aspect, the grounding wall is filled with the conductive medium, including: the conductive medium is conductive resin, and the grounding wall is filled with the conductive resin. And the implementation flexibility of the scheme is improved.

In a possible implementation manner of the first aspect, the laying the conductive medium on the inner surface of the grounding wall includes: the conductive medium is a metal layer, and the metal layer is paved on the inner side wall of the grounding wall through electroplating. And the implementation flexibility of the scheme is improved.

In a possible implementation manner of the first aspect, when the ground wall includes at least one blind hole slot, the circuit board further includes a signal trace; the signal wiring is connected with the signal via hole surrounded by the grounding wall; the signal wiring is arranged on the circuit board which is not penetrated near the blind hole groove in the grounding wall; the signal wiring is used for transmitting signals of the signal via holes surrounded by the grounding wall. For example: a grounding wall is arranged in the Z-axis direction of the circuit board, and comprises at least one blind hole groove. The circuit board is not penetrated in the-Z axis direction of the blind hole groove, and therefore, signal wiring can be provided in the circuit board in the-Z axis direction of the blind hole groove. The signal wire is connected with the signal via hole surrounded by the grounding wall, and the signal wire is used for transmitting the signal of the signal via hole. By the method, the manufacturing cost of the circuit board module can be reduced on the premise of reducing crosstalk.

In a possible implementation manner of the first aspect, when the ground wall surrounds a first signal via group and a second signal via group, the first signal via group includes at least two signal vias, and the signal vias included in the first signal via group are arranged in a first direction; the second signal via group comprises at least two signal vias, the signal vias comprised by the first signal via group are arranged in a second direction, and the first direction is perpendicular to the second direction.

Specifically, in order to reduce crosstalk between the signal vias of each group that are completely surrounded by the ground wall, when the ground wall surrounds two signal vias (the first signal via group and the second signal via group), the two signal vias may be vertically and symmetrically distributed. For example: the signal vias of the first signal via group are arranged in a first direction, the signal vias of the second signal via group are arranged in a second direction, and the first direction is perpendicular to the second direction. Thereby reducing signal crosstalk.

In yet another possible implementation, when the ground wall encloses three sets of signal vias, the three sets of signal vias may be symmetrically distributed in an i-shape, thereby reducing signal crosstalk. It should be noted that, in the embodiments of the present application, the arrangement of the signal vias in the circuit board is not limited.

In a possible implementation manner of the first aspect, the circuit board module further includes a fixing board, and the fixing board is disposed on the second face of the circuit board; the cable assembly is arranged on the fixing plate and is arranged on the second face of the circuit board through the fixing plate. Through setting up the fixed plate at the second face of circuit board, promote the structural strength of circuit board.

In a possible implementation manner of the first aspect, the circuit board further includes a second pad, the second pad being disposed on the first face of the circuit board, the second pad being disposed on the signal via; the chip further comprises a solder ball, and the signal pin is connected with the second bonding pad through the solder ball.

In a possible implementation manner of the first aspect, two adjacent signal vias form a set of high-speed signal vias, and the ground wall is surrounding the set of high-speed signal vias. It should be noted that, the high-speed signal in the embodiment of the present application is also referred to as a high-speed signal, and the low-speed signal is also referred to as a low-speed signal. In one example, the 10G signal is a low speed signal and the 40G signal is a high speed signal. In yet another example, the 2.5G signal is a low speed signal and the 10G signal is a high speed signal.

In a possible implementation manner of the first aspect, the circuit board further includes a signal trace; the signal via includes: a first signal via for transmitting a high-speed signal and a second signal via for transmitting a low-speed signal; the first signal via is connected with the signal via, the first signal via is connected with the first lead through the signal via, and the first signal via transmits the high-speed signal through the first lead; the second signal via is connected with the signal wiring, and the second signal via transmits the low-speed signal through the signal wiring. By the method, the signal-to-noise ratio (signal noise rate, SNR) of the high-speed signal is improved, and meanwhile, the manufacturing cost of the circuit board module is reduced.

In a possible implementation manner of the first aspect, a pitch between a plurality of vias included in the circuit board is less than 0.9mm, and the plurality of vias include the signal via and/or the ground via. The pitch between the vias is also referred to as Ball pitch (Ball pitch). The circuit board is a circuit board supporting a high density BGA. It should be noted that, the interval between the via holes in the circuit board in the embodiment of the application is not limited, and may be less than 0.8mm or less than 1.5mm.

In a second aspect, an embodiment of the present application proposes a line card, where the line card is configured to receive or generate a signal, and the line card includes the circuit board module set according to any one of the foregoing first aspects.

In a third aspect, embodiments of the present application provide a computing device including the line card described in the foregoing second aspect.

In a possible implementation manner of the third aspect, the computing device further includes a back plane, and the line card is disposed on the back plane.

In a possible implementation manner of the third aspect, the computing device further includes a switch card, where the switch card is configured to cross-schedule the signals.

In a possible implementation manner of the third aspect, the computing device includes: any one of an optical communication device, a router, a switch, or a server.

From the above technical solutions, the embodiments of the present application have the following advantages:

the embodiment of the application provides a circuit board module, which comprises a chip, a circuit board and a cable assembly. The signal transmitted by the signal pin is reduced from crosstalk from other signal pins by arranging the grounding wall around the signal via hole of the circuit board to shield interference and arranging the conductive medium in the grounding wall. The signal transmitted in the signal via hole is led out through the first lead wire of the cable component, the signal transmitted by the signal via hole does not pass through the signal wiring of the circuit board, and crosstalk caused by other signal wiring and signal via holes in the circuit board when the signal wiring transmits the signal is avoided. Effectively evading line Kong Chuanrao.

Drawings

FIG. 1 is a schematic diagram of a circuit board;

fig. 2 is a schematic structural diagram of a circuit board module 100 according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a circuit board module 100 according to an embodiment of the present disclosure;

fig. 4 is a schematic structural diagram of a circuit board module 100 according to an embodiment of the present disclosure;

FIG. 5 is a schematic view of a lead in an embodiment of the present application;

fig. 6 is a schematic diagram illustrating connection between the cable assembly 130 and the circuit board 120 according to an embodiment of the present disclosure;

fig. 7 is a schematic diagram illustrating connection between the cable assembly 130 and the circuit board 120 according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram illustrating connection between the cable assembly 130 and the circuit board 120 according to an embodiment of the present disclosure;

fig. 9 is a schematic diagram illustrating connection between the cable assembly 130 and the circuit board 120 according to an embodiment of the present disclosure;

fig. 10 is a schematic diagram illustrating connection between a cable assembly 130 and a circuit board 120 according to an embodiment of the present disclosure;

fig. 11 is a schematic diagram illustrating connection between the cable assembly 130 and the circuit board 120 according to another embodiment of the present disclosure;

fig. 12 is a schematic structural diagram of a circuit board 120 according to an embodiment of the present application;

fig. 13 is a schematic structural diagram of a circuit board 120 according to an embodiment of the present application;

FIG. 14 is a schematic view of the structure of the through-hole and blind-hole slots;

fig. 15 is a schematic structural diagram of a circuit board 120 according to an embodiment of the present application;

FIG. 16 is a schematic diagram of a computing device according to an embodiment of the present application;

FIG. 17 is a schematic diagram of a computing device according to an embodiment of the present application;

fig. 18 is a schematic structural diagram of another circuit board 120 in the own embodiment.

Detailed Description

The embodiment of the application provides a circuit board module, which comprises a chip, a circuit board and a cable assembly. Through set up the earth wall shielding interference around the signal via hole of circuit board, set up conductive medium in this earth wall, effectively reduce hole crosstalk. The signal transmitted in the signal via is routed through the first lead of the cable assembly, bypassing the line Kong Chuanrao.

Embodiments of the present application will now be described with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some, but not all embodiments of the present application. As one of ordinary skill in the art can appreciate, with the development of technology and the appearance of new scenes, the technical solutions provided in the embodiments of the present application are applicable to similar technical problems.

The terms first, second and the like in the description and in the claims of the present application and in the above-described figures, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments described herein may be implemented in other sequences than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

First, some technical concepts related to the embodiments of the present application are described.

Printed circuit board (Printed Circuit Board, PCB): the printed circuit board is an important electronic component in electronic equipment, and is an electrical connection carrier for electronic components.

Pad (Pad): the bonding pads are arranged on the circuit board and can comprise pin bonding pads, surface-mounted bonding pads and the like, and are used for welding electric elements to achieve the functions of electric connection and mechanical fixation.

Via (Via): the via hole is arranged on the circuit board and comprises a through hole, a blind hole, a buried hole and the like, and is used for connecting wires between different layers on the circuit board.

Pitch: the center span of two pads on a circuit board can be considered the diameter of the pad plus the pitch of the two pads.

Ball Grid Array (BGA): is a surface packaging technology applied to an integrated circuit, in a BGA package, pins at the bottom of the package are replaced by solder balls, and each solder ball is fixed by a small solder ball. Compared with other packaging technologies, BGA can accommodate more pins, and has the advantages of high density, lower thermal impedance and low inductance pins.

Land Grid Array (LGA): the metal contact type packaging technology is similar to BGA packaging in principle, except that BGA utilizes tin to solder the chip and the circuit board, and LGA can be released at any time to replace the chip.

Electroplating filling process (Plate Over Fill Via, POFV): the special hole plugging process is performed on a Via In Pad (VIP), resin and other materials are needed to be plugged into the via, and then copper deposition electroplating is performed to form a bonding Pad, so that the layout density and the electrical performance of the PCB can be improved.

As the computational demands on computing devices become higher, the signal rate of high-speed systems evolves from 56G gradually to 112G, and may continue to evolve to 224G in the future. As signal rates continue to increase, the pin arrangements of package areas on a circuit board, such as Ball Grid Array (BGA) or Land Grid Array (LGA), need to be denser. In the current BGA technology of a circuit board, a printed circuit board (Printed Circuit Board, PCB) fan-out mode is often adopted in a BGA area of the circuit board, and as the density of the BGA area becomes higher, the fan-out hole pitch between high-speed signals of a high-density BGA becomes smaller, and crosstalk suffered by the high-speed signals also becomes larger. For ease of understanding, referring to fig. 1, fig. 1 is a schematic diagram of a circuit board. Current circuit boards include signal vias, ground vias, and signal traces thereon. Taking fig. 1 as an example, the signal vias of the dashed box are used to transmit high-speed signals. Signal vias that transmit high-speed signals are subject to two aspects of interference: on the one hand, the signal via is interfered and coupled by other surrounding signal via transmission signals, which is called hole-hole crosstalk; on the other hand, when a signal via (for transmitting a high-speed signal) transmits a signal through a signal trace, the signal trace is coupled by interference of other surrounding signal via transmission signals, which is called a line Kong Chuanrao.

In order to solve the above technical problems, an embodiment of the present application provides a circuit board module, including a chip, a circuit board and a cable assembly. Through set up the earth wall shielding interference around the signal via hole of circuit board, set up conductive medium in this earth wall, effectively reduce hole crosstalk. The signal transmitted in the signal via is routed through the first lead of the cable assembly, bypassing the line Kong Chuanrao.

The circuit board module 100 according to the embodiment of the present application is specifically described below. Referring to fig. 2, fig. 2 is a schematic structural diagram of a circuit board module 100 according to an embodiment of the disclosure. The circuit board module 100 provided in the embodiment of the present application includes: chip 110, circuit board 120, and cable assembly 130.

Specifically, let the +z-axis direction of the circuit board 120 be the first surface of the circuit board 120, let the-Z-axis direction of the circuit board 120 be the second surface of the circuit board 120, and the first surface is inconsistent with the second surface. The chip 110 is disposed on a first surface of the circuit board 120, and the cable assembly 130 is disposed on a second surface of the circuit board 120.

Regarding the chip 110:

the chip 110 includes a signal pin 111 and a ground pin 112, wherein the signal pin 111 is connected to a signal via 121 of the circuit board 120, and the ground pin 112 is connected to the ground pin 112 of the circuit board 120.

In one possible implementation, as shown in fig. 2: on the first side of the circuit board 120, the signal vias 121 and the ground vias 122 are provided with pads. For convenience of distinction, the pads provided on the first side of the circuit board 120 are referred to as second pads 123. Solder balls 113 are provided on the signal pins 111 of the chip 110 and the ground pins 112 of the chip 110. The signal pin 111 and the ground pin 112 of the chip 110 are connected to the second pad 123 through the solder ball 113, so that the connection between the signal pin 111 and the signal via 121 is realized, and the connection between the ground pin 112 and the ground via 122 is realized. Specifically, each signal via 121 is provided with a second pad 123, and each ground via 122 is provided with a second pad 123.

In yet another possible implementation, the signal pins 134 and the ground pins 134 of the chip 110 may also be connected to the signal vias 121 and the ground vias 122 of the circuit board 120 through a socket pin (socket) structure. It should be noted that, in the embodiment of the present application, the connection manner between the chip 110 and the circuit board 120 is not limited.

In a possible example, the circuit board 120 includes a plurality of vias having a pitch of less than 0.9mm, the plurality of vias including the signal via 121 and/or the ground via 122. The pitch between the vias is also referred to as Ball pitch 113 pitch (Ball pitch), or the pitch of the pins (signal pins 134 and/or ground pins 134) in the chip 110. The circuit board 120 is a circuit board 120 supporting a high density BGA. It should be noted that, the interval between the vias in the circuit board 120 in the embodiment of the present application is not limited, and may be less than 0.8mm, or may be less than 1.5mm.

In a possible example, pins of the chip 110 according to the embodiment of the present application are arranged in a staggered (trigger) manner, and the corresponding circuit board 120 is arranged in a staggered (trigger) manner. As illustrated in fig. 11 and 12.

In yet another possible example, the present embodiment proposes that the pins of the chip 110 be arranged in a box (box) form. The corresponding circuit boards 120 are arranged in the form of boxes (boxes). As shown in fig. 15, fig. 15 is a schematic structural diagram of a circuit board 120 according to an embodiment of the present application.

Regarding the cable assembly 130:

the cable assembly 130 is disposed on a second side of the circuit board 120, the second side being inconsistent with the first side. The cable assembly 130 includes a first lead 131, wherein the first lead 131 is connected to the signal via 121. Optionally, the cable assembly 130 may further include a second lead 132, the second lead 132 being grounded, the second lead 132 being connected to the ground via 122.

Further, the circuit board module 100 further includes a fixing board 140, where the fixing board 140 is disposed on the second surface of the circuit board 120; the cable assembly 130 is disposed on the fixing plate 140, and the cable assembly 130 is disposed on the second surface of the circuit board 120 through the fixing plate 140. As shown in fig. 3, fig. 3 is a schematic diagram illustrating another structure of the circuit board module 100 according to the embodiment of the present application. The fixing plate 140 includes one or more through slots therein for receiving the leads (the first leads 131 and/or the second leads 132). By providing the fixing plate 140 on the second surface of the circuit board 120, the structural strength of the circuit board 120 is improved.

In one possible implementation, the leads (including the first leads 131 and/or the second leads 132) of the cable assembly 130 are connected to the circuit board 120 by spring fingers 133. Such as illustrated in fig. 2 or fig. 4. Fig. 4 is a schematic diagram of another structure of the circuit board module 100 according to the embodiment of the present application. One end of the spring reed 133 is connected to the lead, and the other end of the spring reed 133 abuts against the signal via 121 and/or the ground via 122 of the circuit board 120. The signal transmitted by the signal pin 111 of the chip 110 is transmitted through the elastic reed 133 and the first lead 131, avoiding the line Kong Chuanrao.

Hereinafter, how the leads are connected to the circuit board 120 will be described in detail with reference to the accompanying drawings.

A. The leads are connected to the circuit board 120 through the elastic reed 133.

For example, referring to fig. 6, fig. 6 is a schematic diagram illustrating a connection between a cable assembly 130 and a circuit board 120 according to an embodiment of the present application. One end of the spring reed 133 is connected to the first lead 131, and the other end of the spring reed 133 is connected to the signal via 121 in the circuit board 120. Specifically, the spring reed 133 is connected to the opening of the signal via 121 on the second surface of the circuit board 120.

In still another example, referring to fig. 7, fig. 7 is a schematic diagram illustrating a connection between a cable assembly 130 and a circuit board 120 according to an embodiment of the present application. When the cable assembly 130 further includes a second lead 132, one end of the spring reed 133 is connected to the second lead 132, and the other end of the spring reed 133 is connected to the ground via 122 in the circuit board 120. Specifically, the spring reed 133 is connected to the opening of the ground via 122 on the second surface of the circuit board 120.

B. The leads are connected to the circuit board 120 through pads.

In another possible implementation, the signal vias 121 and the ground vias 122 are provided with pads on the second side of the circuit board 120. For convenience of distinction, the pads provided on the second side of the circuit board 120 are referred to as first pads 124. The cable assembly 130 further includes a pin 134, and the first lead 131 is connected to the signal via 121 through the pin 134. For example, referring to fig. 5, fig. 5 is a schematic structural diagram of a lead according to an embodiment of the present application. The exposed end of the lead is provided with a stitch 134. The pins 134 may be connected to the first pads 124 by soldering. In the Z-axis direction, the first pad 124, the via (signal via 121 or ground via 122), and the second pad 123 are on the same axis.

Hereinafter, how the leads are connected to the circuit board 120 through the pins 134 will be described in detail with reference to the accompanying drawings.

For example, referring to fig. 8, fig. 8 is a schematic diagram illustrating a connection between a cable assembly 130 and a circuit board 120 according to an embodiment of the present application. On the second side of the circuit board 120, a first pad 124 is provided. Specifically, the first pads 124 are disposed on the openings of the signal vias 121 on the second side of the circuit board 120. The pin 134 of the first lead 131 is soldered to the first pad 124, and the first lead 131 is connected to the signal via 121 through the pin 134 and the first pad 124.

In still another example, referring to fig. 9, fig. 9 is a schematic diagram illustrating a connection between a cable assembly 130 and a circuit board 120 according to an embodiment of the present application. Specifically, the first pads 124 are disposed on the openings of the signal vias 121 and the ground vias 122 on the second side of the circuit board 120. When the cable assembly 130 further includes a second lead 132, the first pad 124 is connected to a pin 134 of the second lead 132, and the second lead 132 is connected to the ground via 122 through the pin 134 and the first pad 124.

C. The leads are connected to the circuit board 120 by probes that extend into the signal vias 121.

In another possible implementation, the pins 134 extend into the signal vias 121, and the pins 134 are connected to the signal vias 121 by soldering. Specifically, the pins 134 extend into the signal vias 121, and then the pins 134 and the signal vias 121 are fixed by soldering. The impedance degradation caused by the exposure of the wire stripping is avoided, and the signal transmission quality is improved.

Referring to fig. 10, fig. 10 is a schematic diagram illustrating a connection between a cable assembly 130 and a circuit board 120 according to an embodiment of the present application. The pins 134 of the first lead 131 extend into the signal vias 121, and then the pins 134 of the first lead 131 are fixed in the signal vias 121 by soldering. The signal via 121 is connected to the first lead 131 by a pin 134.

In combination with the foregoing embodiment, in yet another possible implementation manner, the signal via 121 is divided into: a first signal via for transmitting a high speed signal and a first signal via for transmitting a low speed signal. In other words, when the signal pin 111 (chip 110) connected to the signal via 121 transmits a high-speed signal, the signal via 121 belongs to the first signal via; when the signal pin 111 (chip 110) connected to the signal via 121 transmits a low-speed signal, the signal via 121 belongs to the first signal via.

It should be noted that, the high-speed signal in the embodiment of the present application is also referred to as a high-speed signal, and the low-speed signal is also referred to as a low-speed signal. In one example, the 10G signal is a low speed signal and the 40G signal is a high speed signal. In yet another example, the 2.5G signal is a low speed signal and the 10G signal is a high speed signal.

The circuit board 120 further includes signal traces 126, the signal traces 126 extending within the wiring layer of the circuit board 120, the signal traces 126 for transmitting signals.

For ease of understanding, referring to fig. 11, fig. 11 is a schematic diagram illustrating connection between the cable assembly 130 and the circuit board 120 according to another embodiment of the present application. The first signal via is connected with the signal via 121, the first signal via is connected with the first lead 131 through the signal via 121, and the first signal via transmits the high-speed signal through the first lead 131; the first signal via is connected to the signal trace 126, and the first signal via transmits the low-speed signal through the signal trace 126. By this method, the manufacturing cost of the circuit board module 100 is reduced while improving the signal-to-noise ratio (signal noise rate, SNR) of the high-speed signal.

Regarding the circuit board 120:

referring to fig. 12 and 13, fig. 12 is a schematic structural diagram of a circuit board 120 according to an embodiment of the present application, and fig. 13 is a schematic structural diagram of the circuit board 120 according to an embodiment of the present application. The circuit board 120 includes a signal via 121, a ground via 122, and a ground wall 125, where the signal via 121 is connected to the signal pin 111, the ground via 122 is connected to the ground pin 112, a plurality of ground vias 122 are disposed around the signal via 121, the ground wall 125 is connected to at least two ground vias 122, and a conductive medium is disposed in the ground wall 125.

Specifically, two adjacent signal vias 121 form a group of high-speed signal vias 121, and the ground wall 125 is enclosed around the group of high-speed signal vias 121. By providing the ground wall 125 around the signal via 121 (i.e., the high-speed signal via 121) that transmits the high-speed signal, crosstalk is reduced.

Specifically, the grounding wall 125 is a through hole slot and/or a blind hole slot, wherein the through hole slot penetrates through the circuit board 120, and the blind hole slot does not penetrate through the circuit board 120. For ease of understanding, referring to fig. 14, fig. 14 is a schematic view of the structure of the through hole groove and the blind hole groove. Taking two layers of PCBs as an example, the blind via is a type of via that does not penetrate the PCBs, for example, the blind via illustrated in fig. 14 penetrates only one layer of PCBs. The through-hole slot illustrated in fig. 14 penetrates through the two-layer PCB board.

In one possible implementation, the ground wall 125 is formed by a through-hole slot. Specifically, in the process of punching the ground wall 125, one or more through-hole slots are drilled between two adjacent ground vias 122, so that the two ground vias 122 are connected through the ground wall 125. Optionally, a plurality of ground vias 122 surrounding the signal via 121, at least two ground vias 122 are left without a ground wall 125 therebetween, so as to ensure structural strength of the circuit board 120.

In another possible implementation, the ground wall 125 is formed by a blind hole slot. Specifically, in the process of punching the ground wall 125, one or more blind hole grooves are drilled between two adjacent ground vias 122, so that the two ground vias 122 are connected through the ground wall 125.

In another possible implementation, the ground wall 125 is formed by a blind hole slot and a through hole slot to ensure structural strength of the circuit board 120. The embodiments of the present application are not limited in this regard.

In one example, when the ground wall 125 includes at least one of the blind via slots, the circuit board 120 further includes a signal trace 126; the signal trace 126 is connected to the signal via 121 surrounded by the ground wall 125; the signal trace 126 is disposed on the circuit board 120 that is not penetrated near the blind hole slot in the ground wall 125, and the signal trace 126 is used for transmitting signals of the signal via 121 surrounded by the ground wall 125.

Specifically, when the ground wall 125 includes at least one blind via slot, since the blind via slot does not penetrate the circuit board 120, a signal trace 126 may be disposed near the blind via slot (e.g., directly below the blind via slot in the-Z axis direction), and the signal trace 126 is used to transmit signals of the signal via 121 surrounded by the ground wall 125. For ease of understanding, please refer to fig. 18. The ground wall 125 illustrated in fig. 18 includes 3 blind via slots in which signal traces 126 are laid in the circuit board 120 in the-Z axis direction.

First, the ground vias 122 around the signal vias 121 are selected, and then a ground wall 125 is formed by drilling between two adjacent ground vias 122. The ground wall 125 communicates with at least two ground vias 122. After the ground wall 125 is formed by drilling, a conductive medium is disposed in the ground wall 125.

In one possible implementation, the ground wall 125 is filled with the conductive medium. The conductive medium may be a conductive resin.

In yet another possible implementation, the conductive medium is laid on the inner surface of the ground wall 125. Specifically, the conductive medium is a metal layer, and the metal layer is laid on the inner side wall of the grounding wall 125 by electroplating. For example: a metal layer is disposed in the ground wall 125 through a POFV process.

It should be noted that the embodiment of the present application does not limit the conductive medium, including but not limited to: metal materials such as gold, silver, or copper, and conductive resins (or conductive polymer materials) such as polypyrrole, polyphenylene sulfide, polymalocyanine compounds, polyaniline, or polythiophene.

In this embodiment of the present application, the ground wall 125 is disposed around the signal via 121 of the circuit board 120 to shield interference, and the conductive medium is disposed in the ground wall 125, so as to effectively reduce hole-hole crosstalk. The signals transmitted in the signal via holes 121 are led out from the second surface of the circuit board 120 through the first lead 131 of the cable assembly 130, so that the crosstalk of the wire holes and the crosstalk of the holes are avoided, and the signal to noise ratio of the signals is improved.

In combination with the foregoing embodiments, the embodiments of the present application further provide a line card. The line card is configured to receive or generate a signal, and the line card includes the circuit board module of any one of the foregoing embodiments.

In combination with the foregoing embodiments, the embodiments of the present application further provide a computing device, where the computing device includes the line card according to any one of the foregoing embodiments.

In a possible implementation manner, the computing device further includes a back plate, and the line card is disposed on the back plate.

In a possible implementation manner, the computing device further includes a switch card, where the switch card is used to perform cross-scheduling on the signals.

In one possible implementation, the computing device includes: any one of an optical communication device, a router, a switch, or a server. For example: the computing device may also be deployed in a server cluster.

For example, referring to fig. 16, fig. 16 is a schematic structural diagram of a computing device according to an embodiment of the present application. The computing device comprises a main control board, a line card, an exchange card and a back plate, wherein the main control board, the line card and the exchange card are arranged on the same surface of the back plate. The main control board is used for controlling the work of the line card and the exchange card.

In yet another example, referring to fig. 17, fig. 17 is a schematic structural diagram of a computing device according to an embodiment of the present application. The computing device comprises a main control board, a line card, an exchange card and a back plate, wherein the main control board and the line card are arranged on the same surface of the back plate, and the exchange card is arranged on the other surface of the back plate.

In the several embodiments provided in this application, it should be understood that the disclosed apparatus and units may be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

Claims

1. A circuit board module, the circuit board module comprising: chip, circuit board and cable assembly;

the chip is arranged on the first surface of the circuit board;

the chip comprises a signal pin and a grounding pin;

the circuit board comprises a signal via hole, a grounding via hole and a grounding wall, wherein,

the signal via is connected with the signal pin, the grounding via is connected with the grounding pin,

at least two of the grounding through holes are connected through a grounding wall,

the isolation groove is communicated with at least two grounding through holes, and the grounding wall surrounds at least one group of signal through holes;

the cable component is arranged on the second surface of the circuit board;

the cable assembly includes a first lead, wherein the first lead is connected with the signal via.

2. The circuit board module of claim 1, wherein the cable assembly further comprises a spring reed, the first lead being connected to the signal via through the spring reed;

the elastic reed is arranged on the second surface of the circuit board;

one end of the elastic reed is abutted with the signal via hole;

the other end of the elastic reed is connected with the first lead.

3. The circuit board module of claim 1, wherein the cable assembly further comprises a pin through which the first lead is connected to the signal via;

the pins are arranged on the second surface of the circuit board;

one end of the pin is connected with the signal via hole;

the other end of the pin is connected with the first lead.

4. The circuit board module of claim 3, wherein the circuit board further comprises a first pad disposed on the second side of the circuit board, the first pad being connected to the signal via;

the pins of the cable assembly are connected with the first bonding pads, and the pins are connected with the signal through holes through the first bonding pads.

5. A circuit board module according to claim 3, wherein the pins extend into the signal vias, the pins being connected to the signal vias by soldering.

6. The circuit board module of any one of claims 1-5, wherein the cable assembly further comprises a second lead, the second lead being grounded;

the second lead is connected with the grounding via hole.

7. The circuit board module according to any of claims 1-6, wherein the ground wall is a through hole slot and/or a blind hole slot, wherein the through hole slot penetrates the circuit board and the blind hole slot does not penetrate the circuit board.

8. The circuit board module of claim 7, wherein when the ground wall includes at least one of the blind via slots, the circuit board further includes signal traces;

the signal wiring is connected with the signal via hole surrounded by the grounding wall;

the signal wiring is arranged on the circuit board which is not penetrated near the blind hole groove in the grounding wall;

the signal wiring is used for transmitting signals of the signal via holes surrounded by the grounding wall.

9. The circuit board module of any one of claims 1-8, wherein two adjacent signal vias form a set of high-speed signal vias, the isolation groove surrounding the set of high-speed signal vias.

10. The circuit board module of any of claims 1-9, wherein when the ground wall encloses the first set of signal vias and the second set of signal vias,

the first signal via group comprises at least two signal vias, and the signal vias included in the first signal via group are arranged in a first direction;

the second signal via group comprises at least two signal vias, the signal vias comprised by the first signal via group are arranged in a second direction, and the first direction is perpendicular to the second direction.

11. The circuit board module of any of claims 1-10, wherein the circuit board comprises a conductive medium, the ground wall is configured to provide the conductive medium, comprising:

the grounding wall is internally filled with the conductive medium, or the conductive medium is paved on the inner side wall of the grounding wall.

12. The circuit board module according to any one of claims 1 to 11, wherein,

the circuit board module further comprises a fixing plate, wherein the fixing plate is arranged on the second surface of the circuit board;

the cable assembly is arranged on the fixing plate and is arranged on the second face of the circuit board through the fixing plate.

13. A line card for receiving or generating a signal, the line card comprising the circuit board module of any one of claims 1-12.

14. A computing device comprising the line card of claim 13.

15. The computing device of claim 14, wherein the computing device comprises: any one of an optical communication device, a router, a switch, or a server.