CN117797413A

CN117797413A - Shoulder and neck physiotherapy instrument

Info

Publication number: CN117797413A
Application number: CN202410038633.5A
Authority: CN
Inventors: 周莹; 李兵
Original assignee: Shenzhen Yuyi Electronic Technology Co Ltd
Current assignee: Dongguan Pinshan Electronic Technology Co ltd
Priority date: 2023-04-17
Filing date: 2024-01-10
Publication date: 2024-04-02
Also published as: JP7642125B2; KR20250178269A; CN116999716A; JP2026512497A; WO2024217082A1; CN221579477U; JP2024153566A; CN116919580B; CN121242718A; WO2024217125A1; CN221431194U; CN116919580A

Abstract

The shoulder and neck physiotherapy instrument comprises a shell, a light source assembly and a front end assembly, wherein the light source assembly is arranged in the shell, an irradiation window is arranged on the shell, the front end assembly has light transmittance and is arranged at the corresponding position of the irradiation window of the shell, and emergent light of the light source assembly is emitted from the irradiation window through the front end assembly. The application can carry out contact or non-contact irradiation treatment on the shoulder and neck, can contact the skin through the front end component, and obtains the required irradiation temperature or contact temperature, so that the application can realize non-contact irradiation treatment and contact massage treatment effects.

Description

Shoulder and neck physiotherapy equipment

[ field of technology ]

The application relates to the field of massage instruments, in particular to a shoulder and neck physiotherapy instrument.

[ background Art ]

Due to busy work and living pressure in modern society, a fixed posture is often required to be maintained in the working process, so that muscles are tensed, blood flow is not smooth, and pain and discomfort occur, and particularly, the shoulder and neck are more common and obvious. Some people usually achieve the effects of promoting metabolism and relieving muscle stiffness and ache through exercise, but busy life sometimes is difficult to evacuate exercise, so that massage is gradually a busy work and can achieve the modes of promoting blood circulation and metabolism and properly eliminating the ache of the shoulder and neck. Aiming at the requirements of modern life and consumer markets, a plurality of massage devices aiming at different positions, such as sole massage devices, foot massage devices, back massage chairs and the like, are developed, and a special shoulder and neck massage instrument is arranged for massaging the shoulder and neck positions.

The existing instruments or tools for relieving shoulder/neck fatigue in the market adopt an EMS or mechanical massage mode, the prior art adopts a contact type relieving treatment mode, and the EMS mode adopts microorganism current to simulate muscle movement signals, so that the muscle movement in the shoulder/neck achieves the effect of massage and relief, and the EMS mode mainly acts on muscle layers; on the one hand, the mechanical kneading or mechanical vibration mode has large limitation on kneading part area, and the vibration has poor body feeling on the head.

[ invention ]

The purpose of the application is to provide a shoulder and neck physiotherapy instrument with an irradiation treatment function.

In order to achieve the purposes of the application, the following technical scheme is provided:

the application provides a shoulder neck physiotherapy equipment, it includes casing, light source subassembly, front end subassembly, the light source subassembly set up in the casing, be equipped with the irradiation window on the casing, the front end subassembly has the light transmissivity, and it is installed the irradiation window of casing corresponds the position, the emergent light of light source subassembly is via the front end subassembly is followed the irradiation window jets out.

In some embodiments, the front-end module may be provided with optical sheets such as corresponding condensing/diffusing filters, and the light-emitting form and energy may be adjusted as required. The front end assembly may also be provided with a protective light transmitting sheet. In some embodiments, the front end assembly includes a refrigeration member.

The front end component is arranged, and the optical sheet with certain filtering is arranged to isolate the energy of the light source part or the selective excellent specific wavelength optical fiber; or the refrigerating element obtains heating or refrigerating or constant temperature effect, can contact the skin through the front end component, and obtains the required irradiation temperature or contact temperature.

In some embodiments, the irradiation window is disposed at the front side of the housing, that is, at a side close to the human body when the user wears the shoulder and neck physiotherapy instrument; the number of the irradiation windows can be one or two or more, when one irradiation window is formed, a window with larger transverse span can be formed along the front side wall of the shell, and the design can obtain larger contact area and irradiation area; when two or more irradiation windows are arranged, the irradiation windows which are orderly arranged can be arranged along the front side wall of the shell, and the design can be corresponding to the targeted light emitting and contact treatment of the physiotherapy part.

In some embodiments, the light source assembly includes a light source member that may be provided with a dual light source or a single light source. Specifically, the light source piece can adopt any one or two light sources of an IPL, a tungsten filament lamp and a carbon filament lamp. Specifically, two or more than two lamps can be installed on the double light sources, and any two light sources of IPL, tungsten filament lamp and carbon filament lamp can be adopted; the single light source can be provided with one or more than one lamp tube, and any one of IPL, tungsten filament lamp and carbon filament lamp can be adopted. The tungsten filament lamp, the carbon lamp or the IPL lamp is used as a single or mixed infrared light source to irradiate the treatment area, so that the desired irradiation wavelength can be obtained, and the ideal treatment effect can be obtained.

In some embodiments, the light source assembly further includes a light reflecting member disposed at a rear of the light source member to reflect light emitted to the rear to the irradiation window. The rear of the light source piece is the side opposite to the irradiation window, and the reflecting piece can reduce energy loss and strengthen emergent light energy.

In some embodiments, the front end assembly profile and physics may be matched to the number and shape of the illumination window designs. Specifically, the shape and size of the front end component can be just embedded in the irradiation window, if one irradiation window is opened, the front end component corresponds to one front end component, and if two or more irradiation windows are opened, the front end component corresponds to two or more front end components. The front end components do not correspond to the designed number of the irradiation windows, if one irradiation window is arranged, two or more front end components can be arranged orderly and correspond to the irradiation windows, the whole light emitting area of the front end components arranged orderly is consistent with the irradiation windows, and the front end components arranged orderly can be organically installed together by adopting a light transmission piece and fixed at the position of the front shell corresponding to the irradiation windows; if two or more than two irradiation windows are arranged, a single front end component can be arranged, and the front end component is embedded in the shell and is partially exposed out of the irradiation windows.

In some embodiments, the front end component is in a cambered surface form or a curved surface form or a plane form.

Generally, when a front end component with a large single area is adopted, the shape of the shell can be better matched by adopting a cambered surface shape or a curved surface shape, and the front end component can be well attached to the neck of a user; when two or more front end components are adopted, the front end components in a plane shape can be reasonably and orderly arranged, so that the whole front end components are very fit with the shape and radian of the shell. When a single front-end module with a large area is used, the irradiation area becomes large in a noncontact manner, and the treatment area becomes wide.

In some embodiments, the front end assembly includes a refrigeration member. Specifically, the refrigeration piece is electrically connected with the electric control assembly. The refrigerating element may in a specific embodiment be an NTC semiconductor refrigerating element. The semiconductor heating and refrigerating technology is a technology for realizing heating and refrigerating by utilizing the characteristics of semiconductor materials, and realizes energy conversion by the thermoelectric effect and the electrothermal effect of the semiconductor materials, thereby realizing the heating and refrigerating functions. The semiconductor refrigerating piece can be used for preheating when the shoulder and neck physiotherapy instrument is used in winter, so that the skin can increase the body feeling; when the refrigerating effect is used, the composition can also be used for freezing point analgesia; the semiconductor refrigerating piece can also obtain a constant temperature effect, and when the shoulder and neck physiotherapy instrument is used for contact physiotherapy, the temperature of a treatment area is kept constant in a certain interval by utilizing the constant temperature effect of the semiconductor refrigerating piece, so that the temperature is more comfortable. The refrigerating piece comprises a cold surface layer and a hot surface layer, and a semiconductor electric coupling layer is arranged between the cold surface layer and the hot surface layer.

In some embodiments, the refrigeration member is provided with a temperature sensor, and the temperature sensor is connected to the electronic control assembly. The temperature sensor is used for detecting the temperature of the hot surface layer or the cold surface layer and transmitting temperature data to the electric control assembly so that the electric control assembly controls the power supply of the refrigerating piece according to the received temperature data.

In some embodiments, the temperature sensor comprises positive and negative electrodes, the refrigerating piece comprises positive and negative electrodes, and the positive and negative electrodes of the refrigerating piece are connected with an electric control assembly or a control circuit board provided with the electric control assembly through an H bridge drive; the temperature sensor is electrically or communicatively connected with the electronic control assembly or a control circuit board provided with the electronic control assembly to transmit temperature data.

In some embodiments, the temperature sensor is disposed at a semiconductor electrical coupling layer; in other embodiments, the temperature sensor is disposed on the hot surface layer or the cold surface layer, and in particular, the temperature sensor may be disposed on an inner side surface of the hot surface layer or the cold surface layer, or may be directly embedded in a substrate of the hot surface layer or the cold surface layer.

In some embodiments, the shapes of the cold surface layer and the hot surface layer are matched, p-type and n-type semiconductor particles of the semiconductor electric couple layer are tiled on the inner side surfaces of the cold surface layer and the hot surface layer, and the whole cold surface layer of the semiconductor refrigeration piece forms whole-surface refrigeration or the whole hot surface layer forms whole-surface heating. In some embodiments, the semiconductor electrical coupling layer and the temperature sensor are located between the cold and hot face layers.

In some embodiments, a through hole penetrating through the cold surface layer and the hot surface layer is formed in a local area of the semiconductor refrigeration piece, a light emitting area is formed corresponding to the through hole, and the semiconductor electric coupling layer can avoid the light emitting area to arrange semiconductor electric coupling particles, namely, semiconductor electric coupling particles are correspondingly arranged in other areas outside the light emitting area; or the cold surface layer and/or the hot surface layer of the semiconductor refrigeration piece are/is transparent substrates, p-type and n-type semiconductor couple particles of the semiconductor electric coupling layer are arranged in a local area of the semiconductor refrigeration piece, p-type and n-type semiconductor couple particles are not arranged in other areas of the semiconductor refrigeration piece to form a vacant area, and the cold surface layer and the hot surface layer are/is transparent substrates, so that a light emitting area is formed corresponding to the vacant area; or forming a through hole by using one of the cold surface layer and the hot surface layer as a local area of the other transparent substrate, wherein the p-type semiconductor couple particles and the n-type semiconductor couple particles of the semiconductor couple layer are arranged in the areas corresponding to the areas where the through holes are not formed, and the cold surface layer and the hot surface layer are mutually matched at the positions corresponding to the through holes to form a light emitting area.

In some embodiments, the p-type and n-type semiconductor galvanic particulates of the semiconductor galvanic layer are arranged as an annular band, the p-type and n-type semiconductor galvanic particulates not being disposed within the central interior region forming a void region; the cold surface layer and/or the hot surface layer are/is provided with through holes corresponding to the central inner area of the semiconductor electric coupling layer; or, one of the cold surface layer and/or the hot surface layer is a through hole correspondingly formed on the other transparent substrate, and the cold surface layer and the hot surface layer are mutually matched to form a light emitting area.

The overall appearance shape of the semiconductor refrigeration piece can be in an adaptive specific shape according to actual needs and the shape of a specific element matched with the semiconductor refrigeration piece when the semiconductor refrigeration piece is applied to a specific product, and can be made of materials according to actual needs, for example, the cold surface layer and/or the hot surface layer can be made of metal materials or transparent substrates and the like. The through holes or the vacant areas can be in an adaptive specific shape according to actual needs and the shape of the specific elements when the through holes or the vacant areas are matched with the specific elements applied to specific products, and the specific shape, the size and the position of the through holes or the vacant areas can be defined according to the actual needs. In some embodiments, the cold and hot face layers are substrates of thermally conductive material; the heat conducting material substrate is a ceramic material substrate, an aluminum substrate, a copper substrate or a transparent crystal substrate.

The semiconductor refrigerating piece is characterized in that a temperature sensor is arranged in the semiconductor refrigerating piece, and the temperature sensor is arranged on a semiconductor electric couple layer or a hot surface layer or a cold surface layer and is attached to the hot surface layer or the cold surface layer of the semiconductor refrigerating piece and used for detecting the temperature of the cold surface layer or the hot surface layer; the error and time of the intermediate temperature conducting piece are reduced, the temperature change of the refrigerating piece is accurately monitored in the first time, the temperature sensor is electrically connected with the main control unit or the control circuit board, and the main control unit or the control circuit board controls the power supply of the semiconductor refrigerating piece through the received temperature data, so that the temperature is always kept in an expected temperature interval. And the semiconductor refrigerating piece has simpler and more compact structure and is not easy to damage the temperature sensor.

In some embodiments, the shoulder and neck physiotherapy instrument further comprises a heat dissipating device disposed at the rear side of the light source. In a specific embodiment, the heat dissipation device may use a fan. The fan may be disposed at a rear side of the light source.

In some embodiments, the shoulder and neck physiotherapy apparatus further includes an air inlet hole and a heat dissipation hole disposed on the housing, where the heat dissipation hole may be disposed at a position of the housing corresponding to the fan, so that hot air may be discharged through the heat dissipation hole; the air inlet hole can be arranged on the shell and at a position which forms effective convection with the radiating hole. For example, the fan is arranged in the cooling cavity with the rear shell protruding outwards, the cooling hole is arranged on the wall of the cooling cavity and is communicated with the fan air channel, the air inlet hole is arranged on the wall of the shell and the wall of the cooling hole at a certain distance and is distributed on two sides of the light source assembly, so that air flow entering the shell can pass through the light source assembly to take away heat therein, and then the heat is discharged through the cooling hole, thereby realizing effective cooling. The air inlet and the heat dissipation holes are provided with a plurality of air inlets and a plurality of heat dissipation holes.

In some embodiments, the housing includes a front shell and a rear shell, the irradiation window is disposed on a front side wall of the front shell, and a cavity for accommodating the light source assembly is disposed in the housing.

Specifically, a cavity for accommodating the power supply assembly, the light source assembly, the heat dissipation device and the electric control assembly is arranged in the shell.

In some embodiments, the shoulder and neck physiotherapy instrument further comprises a power supply assembly and an electric control assembly, wherein the power supply assembly comprises a battery, and the power supply assembly and the light source assembly are electrically connected with the electric control assembly.

The battery can be a rechargeable battery or a disposable battery.

The electric control assembly comprises a circuit board/PCBA, an electric interface is arranged on the circuit board and used for charging or plugging, and a corresponding socket is arranged on the shell and communicated with the electric interface.

The shoulder and neck physiotherapy instrument further comprises an air pump, and the air pump can be used for adsorbing skin to enable the skin irradiation surface to be attached to the instrument more. The air pump may be arranged behind the illumination window.

Compared with the prior art, the application has the following advantages:

the application can adopt the infrared ray in the light wave of the light source piece to carry out contact or non-contact type irradiation treatment to the shoulder neck, and the shoulder neck physiotherapy instrument is provided with a front end assembly, can contact the skin through the front end assembly to obtain required irradiation temperature or contact temperature, thereby the application can realize non-contact type irradiation treatment and contact type massage treatment effect. Through set up the refrigeration piece in front end subassembly, can utilize the constant temperature effect of semiconductor refrigeration piece when contact use, make the treatment district temperature invariable in a certain interval, make its temperature sense more comfortable, the efficiency effect of semiconductor refrigeration piece can preheat the epidermis in winter and increase the body sense, can realize freezing point analgesia, can realize constant temperature treatment. The application adopts tungsten filament lamp or carbon lamp or IPL lamp as single or mixed infrared light source to irradiate the treatment area, so that the desired irradiation wavelength can be obtained, and the ideal treatment effect can be obtained. The refrigerating piece in this application is built-in inside the refrigerating piece with temperature sensor, can accurately detect cold face layer or hot face layer temperature, reduce the error and the time of intermediate temperature conducting piece, reach the temperature variation of the accurate monitoring refrigerating piece of first time, be connected through temperature sensor and main control unit or control circuit board electricity and by main control unit or control circuit board through the power supply of the temperature data control semiconductor refrigerating piece of receiving, make the temperature remain at expected temperature interval throughout, and refrigerating piece structure is simpler compact, not fragile temperature sensor.

[ description of the drawings ]

FIG. 1 is a perspective view of a shoulder and neck physiotherapy apparatus according to one embodiment of the present application;

FIG. 2 is a second perspective view of an embodiment of the shoulder and neck physiotherapy apparatus of the present application;

FIG. 3 is an exploded view of an embodiment of the shoulder and neck physiotherapy apparatus of the present application;

FIG. 4 is a cross-sectional view of an embodiment of a shoulder and neck physiotherapy instrument according to the present application;

FIG. 5 is a schematic view of different forms of the front end assembly of the shoulder and neck physiotherapy instrument according to the present application;

FIG. 6 is a schematic cross-sectional view of a shoulder and neck physiotherapy apparatus according to one embodiment of the present application;

FIG. 7 is a second schematic cross-sectional view of a first embodiment of a shoulder and neck physiotherapy apparatus according to the present application;

FIG. 8 is an exploded view of a light source conversion embodiment of a first embodiment of the shoulder and neck physiotherapy apparatus of the present application;

FIG. 9 is a second perspective view of an embodiment of a shoulder and neck physiotherapy apparatus according to the present application;

FIG. 10 is a exploded view of an embodiment of a shoulder and neck physiotherapy apparatus according to the present application;

FIG. 11 is an exploded view of a light source conversion embodiment in a second embodiment of the shoulder and neck physiotherapy apparatus of the present application;

FIG. 12 is an exploded view of one embodiment of a cooling element in a shoulder and neck physiotherapy instrument according to the present application;

FIG. 13 is a side view of one embodiment of a cooling element in a shoulder and neck physiotherapy instrument according to the present application;

FIG. 14 is an exploded view of a second embodiment of a cooling element of the shoulder and neck physiotherapy apparatus of the present application;

FIG. 15 is a side view of a second embodiment of a cooling member of the shoulder and neck physiotherapy instrument of the present application;

FIG. 16 is an exploded view of a third embodiment of a cooling element in a shoulder and neck physiotherapy apparatus according to the present application;

FIG. 17 is a side view of a third embodiment of a cooling member of the shoulder and neck physiotherapy apparatus of the present application;

fig. 18 is a control circuit diagram of one embodiment of a cooling element in a shoulder and neck physiotherapy instrument according to the present application.

[ detailed description ] of the invention

Exemplary embodiments of the present application will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is to be understood that the terminology used herein is for the purpose of describing particular example embodiments only, and is not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," "includes," "including," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein are not to be construed as necessarily requiring their performance in the particular order described or illustrated, unless an order of performance is explicitly stated. It should also be appreciated that additional or alternative steps may be used.

Although the terms first, second, third, etc. may be used herein to describe various elements, components, regions, layers and/or sections, these elements, components, regions, layers and/or sections should not be limited by these terms. These terms may be only used to distinguish one element, component, region, layer or section from another region, layer or section. Terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed below could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.

For ease of description, spatially relative terms, such as "inner," "outer," "lower," "below," "upper," "above," "front," "back," and the like, may be used herein to describe one element's or feature's relationship to another element's or feature as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "below" or "beneath" other elements or features would then be oriented "above" or "over" the other elements or features. Thus, the example term "below … …" may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative relationship descriptors used herein interpreted accordingly.

Referring to fig. 1 to 8, the shoulder and neck physiotherapy apparatus according to the embodiments of the present application includes a housing 100, a light source assembly, a front end assembly 210, a heat dissipating device, a power supply assembly and an electrical control assembly, wherein the light source assembly is disposed in the housing 100, an irradiation window 310 is disposed on the housing 100, the front end assembly 210 has light transmittance, and is mounted at a position corresponding to the irradiation window 310 of the housing 100, and the emitted light of the light source assembly is emitted from the irradiation window 310 via the front end assembly 210. The light source component and the heat radiating device are connected with the power supply component and the electric control component.

The housing 100 is provided with a cavity for accommodating the light source assembly, the heat dissipation device, the power supply assembly and the electric control assembly. The housing 100 includes a front case 110 and a rear case 120, which together form a C-shaped body including a treatment area and two arms extending from both sides of the body to fit around the neck of a user. The irradiation window 310 is provided at a front sidewall of the main body portion of the front case 110, that is, at a side close to the back of the neck of the human body when the user wears the shoulder and neck physiotherapy instrument; the light source assembly and the heat dissipation device are sequentially arranged at the rear side of the irradiation window 310; the power supply assembly and the electronic control assembly are respectively arranged in the cavities of the two arms of the shell 100.

The front end assembly 210 includes a refrigeration member (not shown) that is electrically connected to the electronic control assembly. The refrigerating element may be an NTC semiconductor refrigerating element. The semiconductor heating and refrigerating technology is a technology for realizing heating and refrigerating by utilizing the characteristics of semiconductor materials, and realizes energy conversion by the thermoelectric effect and the electrothermal effect of the semiconductor materials, thereby realizing the heating and refrigerating functions. The semiconductor refrigerating piece can be used for preheating when the shoulder and neck physiotherapy instrument is used in winter, so that the skin can increase the body feeling; when the refrigerating effect is used, the composition can also be used for freezing point analgesia; the semiconductor refrigerating piece can also obtain a constant temperature effect, and when the shoulder and neck physiotherapy instrument is used for contact physiotherapy, the temperature of a treatment area is kept constant in a certain interval by utilizing the constant temperature effect of the semiconductor refrigerating piece, so that the temperature is more comfortable. The front-end module 210 may also be provided with optical sheets such as corresponding condensing/dispersing filters, and the light-emitting form and energy may be adjusted as required. The front end assembly 210 may also be provided with a light transmitting sheet for protection.

The semiconductor refrigerating piece is formed by using p & n type semiconductor with uniqueness, alternating p type and n type semiconductor particles are placed in thermal parallel with each other and electrically connected in series to form a semiconductor electric coupling layer, one side of the semiconductor electric coupling layer is connected with a cooling substrate to form a cold surface layer, and the other side of the semiconductor electric coupling layer is connected with a heat conducting substrate to form a hot surface layer. When a direct current flows through the junction of the semiconductor, resulting in a temperature difference, the cold face layer absorbs heat and then transfers the heat to the hot face layer through the semiconductor galvanic particles.

The number of the irradiation windows 310 may be one, two or more, the shape and the mathematical shape of the front end component 210 may be matched with the number and the shape of the irradiation windows 310, and in particular, the shape and the size of the front end component 210 may be just embedded in the irradiation windows 310.

Referring to fig. 1 to 8, in the first embodiment, two irradiation windows 310 are formed along the front side wall of the housing 100, and the shape of the two irradiation windows is adapted to the radian of the housing 100, and the design can be corresponding to the specific light emitting and contact treatment of the physiotherapy part. Two front-end modules 210 are respectively and correspondingly arranged, and the outline of each front-end module 210 is matched with the irradiation window 310. The front end module 210 is in a cambered surface shape or a curved surface shape or a plane shape, and is applied to the front end module 210 in a cambered surface shape according to the first embodiment, and the front end module 201 in a plane shape according to other embodiments as shown in fig. 5. When two or more front end components 210 are adopted, the front end components 210 in a planar form can be reasonably and orderly arranged to be completely attached to the shape and radian of the shell 100, and the front end components 210 in a cambered form or a curved form can improve comfort during contact therapy.

Referring to fig. 9 to 11, in the second embodiment, an irradiation window 320 is formed along the front side wall of the housing 100 in the lateral direction, the lateral span of the irradiation window 320 is larger, the shape is adapted to the radian of the housing 100, and the design can obtain a larger contact area and irradiation area. The front end assembly 220 is correspondingly arranged, and generally, when the front end assembly 220 with a large single area is adopted, the shape of the shell 100 can be better matched with that of the shell by adopting a cambered surface shape or a curved surface shape, and the front end assembly can be well attached to the neck of a user.

The number of the front end components does not correspond to the number of the irradiation windows, if one irradiation window is formed, two or more front end components can be arranged orderly and correspond to the irradiation windows, the whole light emitting area of the front end components arranged orderly is consistent with that of the irradiation windows, and the front end components arranged orderly can be organically installed together by adopting a light transmission piece and fixed at the position of the front shell 110 corresponding to the irradiation windows; if two or more irradiation windows are provided, a single front end component may be provided, and the front end component is embedded in the housing 100 and partially exposed to the irradiation windows.

The light source component comprises a light source piece, and the light source piece can be provided with a double light source or a single light source. The light source piece can adopt any one or two light sources of IPL, tungsten filament lamp and carbon filament lamp.

Because the frequency of the infrared light wave is known as a 'life light wave' in the prior art, the infrared light wave is the radiation closest to the frequency of human tissues, any good radiator is necessarily a good absorber according to kirchhoff radiation law, the human body emits infrared rays at all times, a large amount of infrared light rich in the light wave also permeates into the human body and resonates with atoms and molecules of the human body cellular tissues, and an internal heat effect is formed by the resonance of the infrared light wave, so that the temperature of the subcutaneous deep layer is increased, the micro-blood vessels are expanded, the blood circulation is accelerated, the blood fat concentration is reduced, the metabolic capacity and cellular oxygen content of the human body are improved, ferment generation is promoted, and the effects of tranquilizing and allaying excitement, relieving fatigue and protecting the body from fatigue and injury are achieved; in addition, the research shows that the infrared light can irradiate local tissues, increase the formation of vascular endothelial cell gap connection, improve microcirculation, reduce blood viscosity, accelerate metabolism, relieve muscle fatigue and promote blood circulation. Animal experiments show that near infrared irradiation can significantly increase the blood flow velocity of rat skeletal muscle and improve the blood circulation disorder caused by ischemia reperfusion injury (ischemia-reperfusion injury).

As shown in fig. 3, 4, 6, and 7, in the first alternative form of the light source member 401 in the first embodiment, two dual light source light pipes corresponding to the front end assembly 210 and the exit window 310, which are respectively arranged transversely, may be any one or two light sources of IPL, tungsten filament lamp, and carbon filament lamp. As shown in fig. 8, in the second alternative of the light source 402 in the first embodiment, two light pipes are disposed behind each front end assembly 210 and are longitudinally arranged side by side, and any one or two of IPL, tungsten filament, and carbon filament may be used. In the first embodiment, the light source assembly further includes a light reflecting member 410, and the light reflecting member 410 is disposed at the rear of the light source member to reflect the light emitted to the rear to the irradiation window 310. The rear of the light source means the side opposite to the irradiation window, and the reflecting member 410 can reduce energy loss and enhance the energy of the emitted light. The reflector 410 is sized to fit the exit window and the front end assembly and cover the light emitting areas of the light source elements 401, 402.

As shown in fig. 10, in the first alternative of the light source 403 in the second embodiment, a single light pipe is disposed corresponding to the front end module 220 and behind the exit window 320, and any one of IPL, tungsten filament, and carbon filament may be used. As shown in fig. 11, in the second alternative of the light source 404 in the second embodiment, two dual light source light pipes longitudinally arranged and corresponding to the front end module 220 and the exit window 320 are adopted, and any one or two light sources of IPL, tungsten filament lamp and carbon filament lamp may be adopted. In the second embodiment, the light source assembly further includes a light reflecting member 410, and the light reflecting member 410 is disposed behind the light source member to reflect the light emitted to the rear to the irradiation window 310. The rear of the light source means the side opposite to the irradiation window, and the reflecting member 410 can reduce energy loss and enhance the energy of the emitted light. The reflector 420 is sized to fit the exit window and the front end assembly and cover the light emitting portions of the light source members 403, 404.

The heat dissipation device is arranged at the rear side of the light source. In a specific embodiment, the heat dissipating device may use a fan 510, where the fan 510 is disposed in the cooling chamber 130 protruding outward from the rear housing 120, the wall of the cooling chamber 130 is provided with a heat dissipating hole 102, and the heat dissipating hole 102 is in air channel communication with the fan 510, so that hot air can be exhausted through the heat dissipating hole 102. The shoulder and neck physiotherapy instrument further comprises an air inlet 101 arranged on the shell 100, the air inlet 101 is arranged on the wall of the shell 100, which is provided with two arms and is a certain distance away from the radiating holes 102, and is distributed on the two sides of the light source assembly and forms effective convection positions with the radiating holes 102, so that air flow entering the shell 100 can pass through the light source assembly to take away heat therein, and then is discharged through the radiating holes 102, thereby realizing effective cooling. The air inlet 101 and the heat dissipation holes 102 are provided with a plurality of air inlets.

The electric control assembly comprises a circuit board 610, an electric interface 601 is arranged on the circuit board 610 and used for charging or plugging, and a corresponding socket is arranged on the shell 100 and communicated with the electric interface 602. The power supply assembly may include a battery 620, such as a rechargeable battery or a disposable battery. The shoulder and neck physiotherapy instrument also comprises an air pump (not marked), and the air pump can be used for adsorbing skin to enable the irradiated surface of the skin to be more attached to the instrument.

Referring to fig. 6, the shoulder and neck physiotherapy apparatus of the present application is used for non-contact treatment, and is implemented by irradiating light emitted by a light source, and an irradiation area and an irradiation angle are adapted to a shoulder and neck of a user, the emitted light can be selected according to needs, and a filter sheet is disposed in a light source assembly or a filter film is coated on the light source assembly, or a filter sheet is disposed on a front assembly or a filter film is coated on the optical sheet of the front assembly.

Referring to fig. 7, the shoulder and neck physiotherapy apparatus of the present application may also be used for contact therapy, and in addition to implementing the phototherapy effect, the front assembly may also be configured to perform vibration massage by connecting the front assembly with a driving device for shoulder and neck contact of a user; the front-mounted component is provided with the refrigerating piece, so that the semiconductor refrigerating piece can be used for preheating when the shoulder and neck physiotherapy instrument is used in winter, and the epidermis is enabled to increase the body feeling; when the refrigerating effect is used, the composition can also be used for freezing point analgesia; the semiconductor refrigerating piece can also obtain a constant temperature effect, and when the shoulder and neck physiotherapy instrument is used for contact physiotherapy, the temperature of a treatment area is kept constant in a certain interval by utilizing the constant temperature effect of the semiconductor refrigerating piece, so that the temperature is more comfortable. Specifically, the refrigerating piece comprises a cold surface layer and a hot surface layer, and a semiconductor electric coupling layer is arranged between the cold surface layer and the hot surface layer.

In specific embodiments, the refrigerating element is provided with a temperature sensor, and the temperature sensor is connected with the electric control assembly. The temperature sensor is used for detecting the temperature of the hot surface layer or the cold surface layer and transmitting temperature data to the electric control assembly so that the electric control assembly controls the power supply of the refrigerating piece according to the received temperature data.

Referring to fig. 12-18, in the embodiment of the present application, a semiconductor refrigeration unit 700 is used, and in the embodiment of the present application, the semiconductor refrigeration unit 700 includes a middle semiconductor electric couple layer 710, and a hot surface layer 730 and a cold surface layer 720 on two sides, where the semiconductor electric couple layer 710 is sandwiched between the hot surface layer 730 and the cold surface layer 720. The semiconductor refrigeration member 700 incorporates a temperature sensor 740. The semiconductor electric couple layer 710 is formed by placing p-type and n-type semiconductor particles in thermal parallel with each other alternately and electrically connecting the p-type and n-type semiconductor particles in series, wherein both ends of the p & n-type semiconductor particles form cold ends and hot ends, the cold ends are connected with a cooling substrate to form a cold surface layer 720, the other sides are connected with a heat conducting substrate to form a hot surface layer 730, and the hot surface layer 730 and the cold surface layer 720 are heat conducting material substrates, for example, may be heat conducting materials such as ceramics/aluminum/copper/transparent crystals. The hot side layer 730 and the cold side layer 720 may be made of opaque or translucent or transparent substrate materials according to practical needs. The temperature sensor 740 may be an NTC sensor. In the embodiment of the present application, the temperature sensor 740 is built inside the semiconductor refrigeration member 700. In some embodiments, the temperature sensor 740 is located in the middle semiconductor electric coupling layer 710, and is attached to one of the hot side layer 730 and the cold side layer 720 of the refrigeration member 700, and directly detects the temperature of the cold side layer 720 and the hot side layer 730 of the refrigeration member. In other embodiments, the temperature sensor is disposed on the hot side layer 730 or the cold side layer 720, and may be disposed on the inner side surface of the hot side layer 730 or the cold side layer 720, or directly embedded in the substrate of the hot side layer 730 or the cold side layer 720.

The overall appearance shape of the semiconductor refrigeration piece can be in an adaptive specific shape according to actual needs and the shape of a specific element matched with the semiconductor refrigeration piece when the semiconductor refrigeration piece is applied to a specific product, and can be made of materials according to actual needs, for example, the cold surface layer and/or the hot surface layer can be made of metal materials or transparent substrates and the like. The through holes or the vacant areas can be in an adaptive specific shape according to actual needs and the shape of the specific elements when the through holes or the vacant areas are matched with the specific elements applied to specific products, and the specific shape, the size and the position of the through holes or the vacant areas can be defined according to the actual needs. The shape of the semiconductor cooling element 700 and the shape of the through hole or the hollow area in the embodiment shown in fig. 12 to 17 are merely simplified examples, and when the semiconductor cooling element 700 is applied to the front end module 201 of the first embodiment of the shoulder and neck physiotherapy instrument, the outline of the semiconductor cooling element 700 may be consistent with the outline of the front end module 201, and the shape and the curvature change of the semiconductor cooling element 700 may be consistent with the shape and the curvature change of the front end module 201. When the semiconductor refrigeration member 700 is applied to the front end assembly 202 of the second embodiment of the shoulder and neck physiotherapy apparatus, the outline of the semiconductor refrigeration member 700 may be identical to the outline of the front end assembly 202, and the shape and radian change of the semiconductor refrigeration member 700 may be identical to the shape and radian change of the front end assembly 202. The position, size and shape of the light-transmitting area of the semiconductor refrigeration member 700 can be set correspondingly according to the specific application requirements of the shoulder and neck physiotherapy instrument, and more than one light-transmitting area can be set.

Referring to fig. 12-13, one embodiment of a semiconductor refrigeration unit 700 includes a middle semiconductor electric couple layer 710, a hot side layer 730 and a cold side layer 720 at two ends of the middle semiconductor electric couple layer, and a temperature sensor 740 is built in the semiconductor refrigeration unit 700. In this embodiment, the whole cold surface layer 720 of the semiconductor refrigeration member 700 forms whole surface refrigeration or the whole hot surface layer 730 forms whole surface heating, the semiconductor couple particles are tiled or basically tiled on the inner side surfaces of the cold surface layer 720 and the hot surface layer 730, the shapes of the cold surface layer 720 and the hot surface layer 730 are matched, and the semiconductor couple layer 710 and the temperature sensor 740 are located between the cold surface layer and the hot surface layer. The temperature sensor 740 is attached to the hot face layer 730 or to the cold face layer 720. The positive and negative electrodes 741 of the temperature sensor 740 and the positive and negative electrodes 711 of the semiconductor electric coupling layer 710 protrude outside the semiconductor refrigerating member 700 to be electrically connected with a control circuit board or a main control unit.

Referring to fig. 14-15, a second embodiment of a semiconductor refrigeration unit 700 is shown, comprising a middle semiconductor electric couple layer 710, and a hot side layer 730 and a cold side layer 720 on both sides, wherein a temperature sensor 740 is embedded in the semiconductor refrigeration unit 700. In this embodiment, the through holes 751 are reserved in a local area of the semiconductor refrigeration unit 700, and the through holes 751 can be used as the light emitting area 751, for example, when the semiconductor refrigeration unit is applied to a photon beauty unit or a physiotherapy unit. The through holes 751 may be formed by extending the substrates of the cold surface layer 720 or the hot surface layer 730, or may be formed by opening local areas of the two substrates of the cold surface layer 720 and the hot surface layer 730 to form corresponding through holes 751. The p-type and n-type semiconductor couple particles of the semiconductor couple layer are arranged in the semiconductor refrigerating piece local area avoiding the through holes 751, and a vacant area is formed in the semiconductor refrigerating piece where the p-type and n-type semiconductor couple particles are not arranged. The cold face layer 720 and the hot face layer 730 are shaped to fit, and the semiconductor electrical coupling layer 710 and the temperature sensor 740 are positioned between the cold face layer and the hot face layer. In the figures, temperature sensor 740 is attached to hot face layer 730, as an example, and may be attached to cold face layer 720. The positive and negative electrodes 741 of the temperature sensor 740 and the positive and negative electrodes 711 of the semiconductor electric coupling layer 710 protrude outside the semiconductor refrigerating member 700 to be electrically connected with a control circuit board or a main control unit.

Referring to fig. 16-17, a third embodiment of a semiconductor refrigeration unit 700 includes a middle semiconductor electric couple layer 710, and a hot side layer 730 and a cold side layer 720 on both sides, and a temperature sensor 740 is built in the semiconductor refrigeration unit 700. In this embodiment, the p & n type semiconductor couple particles of the semiconductor couple layer 710 inside the semiconductor refrigeration member 700 are arranged in an annular band, and no p & n type semiconductor couple particles are provided in the middle inner region to form a vacant region. The cold face layer 720/hot face layer 730 includes an annular region 752 that corresponds to the semiconductor couple layer 710. The middle region of the cold face layer 720/the hot face layer 730 is a through hole; alternatively, one of the cold/hot surface layer substrates is correspondingly formed with a through hole, and the other substrate is a transparent substrate (e.g., transparent crystal); alternatively, as shown in fig. 17, the cold/hot surface layer substrates are transparent substrates (e.g., transparent crystals); therefore, the hot surface layer, the cold surface layer and the middle semiconductor electric couple layer in the annular region are formed on the semiconductor refrigeration piece 700, and the through hole, the through hole/the transparent substrate or the transparent substrate region is formed in the hollow region, so that the semiconductor refrigeration piece 700 can be used as the light emitting region 752, for example, when the semiconductor refrigeration piece 700 is applied to a photon beauty instrument or a physiotherapy instrument. The cold side layer corresponding to one side of the annular semiconductor couple layer 710 of the semiconductor refrigeration member 700 may form an overall refrigeration or the hot side layer 730 of one side may form an overall heating. The cold face layer 720 and the hot face layer 730 are shaped to fit, and the semiconductor electrical coupling layer 710 and the temperature sensor 740 are positioned between the cold face layer and the hot face layer. In the figures, temperature sensor 740 is attached to hot face layer 730, as an example, and may be attached to cold face layer 720. The positive and negative electrodes 741 of the temperature sensor 740 and the positive and negative electrodes 711 of the semiconductor electric coupling layer 710 protrude outside the semiconductor refrigerating member 700 to be electrically connected with a control circuit board or a main control unit.

The positive and negative electrodes 711 and 741 of the semiconductor refrigerating member 700 and the temperature sensor 740 are electrically connected with a control circuit board or a main control unit of the electric control assembly to supply power; a main control unit is arranged on the control circuit board; the temperature sensor 740 is electrically or communicatively connected to a control circuit board or a main control unit to transmit temperature data. Referring to fig. 18, the working principle of the semiconductor refrigeration unit 700 of the present application is: the semiconductor refrigeration member 700 with a built-in temperature sensor 740, wherein the temperature sensor 740 detects the temperature data of the cold surface layer 720 or the hot surface layer 730 and transmits the temperature data to a main control unit on a control circuit board; the main control unit controls and outputs a control signal of the semiconductor refrigeration piece through temperature data analysis and the requirement of a preset temperature interval, so that the power supply action of the semiconductor refrigeration piece 700 is controlled, the characteristics of forward power supply refrigeration and reverse power supply heating of the semiconductor refrigeration piece are utilized, the forward power supply or the reverse power supply is driven by an H bridge to the semiconductor refrigeration piece 700, the working state of the semiconductor refrigeration piece 700 is adjusted, and the temperature is accurately and constantly in the expected temperature interval. An independent control circuit board can be arranged to control the operation of the semiconductor refrigeration piece 700, and the independent control circuit board is electrically connected with the PCBA inside the electric appliance applying the semiconductor refrigeration piece 700; alternatively, the electronic control assembly is integrated onto a PCBA within the appliance in which the semiconductor refrigeration unit 700 is employed.

The number of the temperature sensors 740 may be one or more according to the area and shape of the semiconductor refrigeration member. The application physiotherapy equipment adopts the cold face layer 720 of the semiconductor refrigeration piece 700 of the embodiment to be used as the end face contacted with the skin or to refrigerate the end face, the semiconductor refrigeration piece 700 is installed in the front end assembly of the shoulder and neck physiotherapy equipment, the end face is contacted with the skin, the refrigeration cosmetic end face is provided through the semiconductor refrigeration piece, and the ice compress effect is provided for the contacted skin. The temperature of the cold surface layer or the hot surface layer of the semiconductor refrigeration piece can be detected by the built-in temperature sensor 740, the temperature sensor 740 is electrically connected with the control circuit board to feed back temperature data, and the control circuit board controls the power supply action of the positive electrode and the negative electrode 711 of the semiconductor refrigeration piece through the temperature data analysis and the requirement of a preset temperature interval, so that the temperature of the cold surface layer 720 or the beautifying end surface is always kept in the preset temperature interval.

In a specific embodiment, the cold surface layer 720 of the semiconductor refrigeration unit 700 is in contact with a light emitting panel (not identified) in the front end module, for example, disposed at the periphery of the light emitting panel; alternatively, the cold surface layer 720 of the semiconductor refrigeration member 700 and the light-emitting panel are connected to each other through a cold guide member (heat transfer member or heat conductive member). The cold guide piece is a heat transfer structural piece, and can quickly transfer the heat of the light emitting panel to the semiconductor refrigeration piece to realize the effect of refrigerating the working face, so that cold compress or precooling effect is formed on the surface of the skin contacted with the working face.

In the above embodiments, the temperature sensor is built in the semiconductor refrigeration unit 700 to detect the temperature of the cold surface layer 720 or the hot surface layer 730 of the semiconductor refrigeration unit, and the temperature data is transmitted to the control circuit board, and the main control unit on the control circuit board processes the temperature data to control the power supply of the positive and negative electrodes 711 of the semiconductor refrigeration unit, so as to adjust the working state of the semiconductor refrigeration unit, realize that the temperature is accurate and constant within the expected temperature range, and realize accurate temperature control. The physiotherapy instrument using the semiconductor refrigeration member 700 can achieve accurate control of the temperature of the working face or end face in contact with the skin.

The foregoing description is merely a preferred embodiment of the present application, and the scope of the present application is not limited thereto, but any equivalent transformation based on the technical solution of the present application falls within the scope of the present application.

Claims

1. The utility model provides a shoulder neck physiotherapy equipment, its characterized in that includes casing, light source subassembly, front end subassembly, the light source subassembly set up in the casing, be equipped with the irradiation window on the casing, the front end subassembly has the light transmissivity, and it is installed the irradiation window of casing corresponds the position, the emergent light of light source subassembly is through the front end subassembly is followed the irradiation window jets out.

2. The shoulder and neck physiotherapy apparatus according to claim 1, wherein the light source assembly comprises a light source member, wherein the light source member may be provided with a double light source or a single light source, and the light source member may be any one or two of IPL, tungsten filament lamp and carbon filament lamp.

3. The shoulder and neck physiotherapy instrument according to claim 2, wherein the light source assembly further comprises a light reflecting member disposed behind the light source member to reflect light emitted to the rear toward the irradiation window.

4. The shoulder and neck physiotherapy apparatus of claim 1, wherein the front end assembly is in a curved or planar configuration.

5. The shoulder and neck physiotherapy instrument of claim 1, further comprising an electrical control assembly, wherein the front end assembly comprises a refrigeration member, wherein the refrigeration member is coupled to the electrical control assembly.

6. The shoulder and neck physiotherapy apparatus according to claim 5, wherein the cooling member is provided with a temperature sensor, the temperature sensor is connected with the electric control assembly, the cooling member comprises a semiconductor electric coupling layer, a hot surface layer and a cold surface layer, and the temperature sensor is arranged on the semiconductor electric coupling layer, the hot surface layer or the cold surface layer.

7. The shoulder and neck physiotherapy instrument according to claim 5 or 6, wherein the refrigerating member comprises a semiconductor electric couple layer, a hot surface layer and a cold surface layer, a through hole penetrating through the cold surface layer and the hot surface layer is formed in a local area of the refrigerating member, a light emitting area is formed corresponding to the through hole, and semiconductor electric couple particles are arranged on the semiconductor electric couple layer avoiding the light emitting area; or the cold surface layer and/or the hot surface layer are/is transparent substrates, semiconductor couple particles of the semiconductor couple layer are arranged in a local area of the refrigerating piece, and a vacant area is formed in the area where the semiconductor couple particles are not arranged; or, one of the cold surface layer and the hot surface layer forms a through hole for a local area of the other transparent substrate, and the semiconductor couple particles of the semiconductor couple layer are arranged in the area corresponding to the area where the through hole is not formed.

8. The shoulder and neck physiotherapy instrument according to claim 6, wherein the temperature sensor comprises positive and negative electrodes, the refrigerating piece comprises positive and negative electrodes, and the positive and negative electrodes of the refrigerating piece are connected with an electric control assembly or a control circuit board provided with the electric control assembly through an H-bridge drive; the temperature sensor is electrically or communicatively connected with the electronic control assembly or a control circuit board provided with the electronic control assembly to transmit temperature data.

9. The shoulder and neck physiotherapy apparatus according to claim 1, further comprising a heat dissipating device, wherein the heat dissipating device is disposed at the rear side of the light source, a heat dissipating hole and an air inlet hole are disposed on the housing and are communicated with the air channel of the heat dissipating device, and the air inlet hole is disposed on a wall of the housing at a certain distance from the heat dissipating hole and is distributed on two sides of the light source assembly, and forms an effective convection position with the heat dissipating hole.

10. The shoulder and neck physiotherapy apparatus of claim 1, wherein the housing comprises a front shell and a rear shell, the irradiation window is disposed on a front side wall of the front shell, and a cavity for accommodating the light source assembly is disposed in the housing.