CN114985974A - A kind of thick plate 10,000-watt laser bright surface cutting method - Google Patents

Abstract

The invention relates to a thick plate myriawatt-level laser bright surface cutting method, which comprises the following steps: s1, placing the workpiece to be cut on a cutting platform and below the cutting nozzle; s2, keeping the cutting nozzle and the workpiece perpendicular to each other; s3, setting the laser power to be at least 12kW, the cutting speed to be 1.5 m/min-3 m/min, the height of a cutting nozzle to be 0.8 mm-1.0 mm, the cutting air pressure to be 0.6 MPa-1.2 MPa, the focusing diameter of a cutting beam to be 0.1 mm-0.3 mm and the diameter of a cutting double-layer nozzle to be 0.8 mm-1.0 mm; and S4, turning on the laser, starting the laser cutting system and performing cutting. The invention has the advantages that: the problems of oxidation of a cutting section, rough section, serious slag adhering, large taper and the like in the process of cutting thick plate carbon steel by the conventional laser cutting method are solved.

Description

A kind of thick plate 10,000-watt laser bright surface cutting method

technical field

The invention relates to the technical field of laser processing, in particular to a method for cutting a thick plate with a 10,000-watt laser bright surface.

Background technique

In recent years, with the development of high-power laser light sources, transmission fibers and beam combiners, green low-carbon 10,000-watt laser cutting technology has played an important role in the field of thick plate cutting. Plates with a thickness greater than 12mm are generally referred to as thick plates. How to obtain a smooth and bright cutting section and achieve bright cutting is the key to improving the efficiency and quality of laser cutting of medium and thick plates.

At present, there is only one known laser bright surface cutting method: a carbon steel plate fiber laser bright surface cutting device. The Chinese patent "A Device for Fiber Laser Bright Surface Cutting of Carbon Steel Plate", the announcement number is CN206105161 U, and the announcement date is April 19, 2017. The laser power used in this method is 4 kilowatts, and the thickness of the cutting plate is 8 mm. The above-mentioned laser bright surface cutting device has obvious advantages when cutting medium and thin plates, but when the laser power is increased to 10,000 watts and the thickness of the plate is increased to more than 12mm, the interaction between the laser and the material is more intense, and it is necessary to further develop suitable high-power Laser bright surface cutting method suitable for larger thickness plate cutting.

SUMMARY OF THE INVENTION

The invention solves the above-mentioned general technical problems of laser cutting efficiency and quality of medium and thick plates, and provides a 10,000-watt laser bright surface cutting method for thick plates suitable for high-power lasers and suitable for cutting larger thickness plates.

In order to solve the above-mentioned technical problems, the technical solution provided by the present invention is as follows: a 10,000-watt laser bright surface cutting method for a thick plate, comprising the following steps:

S1. Place the workpiece to be cut on the cutting platform and below the cutting nozzle;

S2. Keep the cutting nozzle and the workpiece perpendicular to each other;

S3. Set the laser power to be at least 12kW, the cutting speed to be 1.5m/min～3m/min, the height of the cutting nozzle to be 0.8mm～1.0mm, the cutting air pressure to be 0.6MPa～1.2MPa, and the focus diameter of the cutting beam to be 0.1mm～ 0.3mm, the diameter of the cutting double-layer nozzle is 0.8mm~1.0mm;

S4, turn on the laser, start the laser cutting system, and implement cutting.

Preferably, the used laser is one of CO ₂ laser, YAG laser, and fiber laser.

Preferably, the cutting gas is oxygen with a purity of at least 99.9%.

Optionally, in the step S3, for bright surface cutting of 12mm thick plate 10,000-watt fiber laser, the laser power is set to 12kW, the cutting speed is 2.5m/min, the nozzle height is 0.8mm, the cutting air pressure is 0.6MPa, The beam diameter is 0.1mm, and the nozzle diameter is 0.8mm.

Optionally, in the step S3, for bright surface cutting of 25mm thick plate 10,000-watt fiber laser, the laser power is set to 20kW, the cutting speed is 2.2m/min, the nozzle height is 0.9mm, the cutting air pressure is 0.8MPa, The beam diameter is 0.2mm, and the nozzle diameter is 0.9mm.

Optionally, in the step S3, 50mm thick plate 10,000-watt fiber laser bright surface cutting, then set the laser power to 30kW, the cutting speed to be 2.0m/min, the nozzle height to be 1.0mm, the cutting air pressure to be 1.2MPa, The beam diameter is 0.3mm and the nozzle diameter is 1.0mm.

The present invention has the following advantages: the method of the present invention only involves a 4-kilowatt fiber laser light source, and aims to solve the problem of cutting 8mm thick plates. In the present invention, a thick plate material is used, and a laser light source of more than 10,000 watts is used. The laser type can also be a CO ₂ laser or a YAG laser, and the type of the laser is not limited. The thicker the plate, the higher the laser power, and the more intense the interaction between the two. It is more difficult to control the quality of the cutting fracture. It is necessary to strictly match many parameters such as laser power, cutting speed, nozzle height and beam diameter to achieve bright cutting. . Therefore, the present invention is not only an improvement of the method, when the laser is increased from 4 kilowatts to 10,000 watts and above, and the thickness of the material is increased to 12 mm, when the laser beam and oxygen interact with the material, the material is melted, vaporized, oxidized and released. Physicochemical processes such as heat are more complex, and interactions between photoplasma, laser beams and materials need to be controlled. The above-mentioned complex physical and chemical processes need to better match the relationship between laser energy input, oxygen flow rate and direction and material thickness, so as to avoid the phenomenon of surface oxidation and slag hanging on the section, and improve the cutting quality.

Description of drawings

FIG. 1 is a schematic flow chart of a method of the present invention for a 10,000-watt laser bright surface cutting method for a thick plate.

As shown in the picture: 1. Laser beam, 2. Cutting nozzle, 3. Workpiece to be cut.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings.

Example 1, 12mm thick plate 10,000-watt fiber laser bright surface cutting:

In conjunction with accompanying drawing 1, S1, the workpiece to be cut is placed on the cutting platform, and is located below the cutting nozzle;

S2. Keep the cutting nozzle and the workpiece perpendicular to each other;

S3. Set the laser power to 12kW, the cutting speed to 2.5m/min, the nozzle height to be 0.8mm, the cutting air pressure to be 0.6MPa, the beam diameter to be 0.1mm, and the nozzle diameter to be 0.8mm;

S4, turn on the laser, start the laser cutting system, and implement cutting.

Example 2, 25mm thick plate 10,000-watt fiber laser bright surface cutting:

In conjunction with accompanying drawing 1, S1, the workpiece to be cut is placed on the cutting platform, and is located below the cutting nozzle;

S2. Keep the cutting nozzle and the workpiece perpendicular to each other;

S3. Set the laser power to 20kW, the cutting speed to 2.2m/min, the nozzle height to be 0.9mm, the cutting air pressure to be 0.8MPa, the beam diameter to be 0.2mm, and the nozzle diameter to be 0.9mm;

S4, turn on the laser, start the laser cutting system, and implement cutting.

Example 3, 50mm thick plate 10,000-watt fiber laser bright surface cutting:

In conjunction with accompanying drawing 1, S1, the workpiece to be cut is placed on the cutting platform, and is located below the cutting nozzle;

S2 keeps the cutting nozzle and the workpiece perpendicular to each other;

S4. Set the laser power to 30kW, the cutting speed to 2.0m/min, the nozzle height to be 1.0mm, the cutting air pressure to be 1.2MPa, the beam diameter to be 0.3mm, and the nozzle diameter to be 1.0mm;

S4, turn on the laser, start the laser cutting system, and implement cutting.

In the specific implementation of the present invention, the difference between the implementation effect of the present invention and the Chinese patent "A Device for Fiber Laser Bright Surface Cutting of Carbon Steel Plates" is that the method only involves a 4-kilowatt fiber laser light source, which aims to solve the problem of 8mm thick plates. cutting problem. In the present invention, a thick plate material is used, and a laser light source of more than 10,000 watts is used. The laser type can also be a CO ₂ laser or a YAG laser, and the type of the laser is not limited. The thicker the plate, the higher the laser power, and the more intense the interaction between the two. It is more difficult to control the quality of the cutting fracture. It is necessary to strictly match many parameters such as laser power, cutting speed, nozzle height and beam diameter to achieve bright cutting. . Therefore, the present invention is not only an improvement of the method, when the laser is increased from 4 kilowatts to 10,000 watts and above, and the thickness of the material is increased to 12 mm, when the laser beam and oxygen interact with the material, the material is melted, vaporized, oxidized and released. Physicochemical processes such as heat are more complex, and interactions between photoplasma, laser beams and materials need to be controlled. The above-mentioned complex physical and chemical processes need to better match the relationship between laser energy input, oxygen flow rate and direction and material thickness, so as to avoid the phenomenon of surface oxidation and slag hanging on the section, and improve the cutting quality.

The present invention and its embodiments have been described above, and the description is not limiting, and the actual structure is not limited thereto. All in all, if those of ordinary skill in the art are inspired by it, and without departing from the purpose of the present invention, any structural modes and embodiments similar to this technical solution are designed without creativity, all should belong to the protection scope of the present invention.

Claims (6)

1. a thick plate 10,000-watt laser bright surface cutting method is characterized in that: comprise the following steps: S1. Place the workpiece to be cut on the cutting platform and below the cutting nozzle; S2. Keep the cutting nozzle and the workpiece perpendicular to each other; S3. Set the laser power to be at least 12kW, the cutting speed to be 1.5m/min～3m/min, the height of the cutting nozzle to be 0.8mm～1.0mm, the cutting air pressure to be 0.6MPa～1.2MPa, and the focus diameter of the cutting beam to be 0.1mm～ 0.3mm, the diameter of the cutting double-layer nozzle is 0.8mm~1.0mm; S4, turn on the laser, start the laser cutting system, and implement cutting. 2. a kind of thick plate 10,000-watt laser bright surface cutting method according to claim 1, is characterized in that: the laser that adopts is a kind of in CO ₂ laser, YAG laser, fiber laser. 3 . The method for laser bright surface cutting of a thick plate of 10,000 watts according to claim 2 , wherein the cutting gas is oxygen with a purity of at least 99.9%. 4 . 4. a kind of thick plate 10,000-watt laser bright surface cutting method according to claim 3, is characterized in that: in described step S3, 12mm thick plate 10,000-watt-class fiber laser bright surface cutting, then setting the laser power to be 12kW, cutting speed 2.5m/min, nozzle height 0.8mm, cutting air pressure 0.6MPa, beam diameter 0.1mm, nozzle diameter 0.8mm. 5. a kind of thick plate 10,000-watt laser bright surface cutting method according to claim 3, is characterized in that: in described step S3, 25mm thick plate 10,000-watt-class fiber laser bright surface cutting, then setting the laser power to be 20kW, cutting speed 2.2m/min, nozzle height 0.9mm, cutting air pressure 0.8MPa, beam diameter 0.2mm, nozzle diameter 0.9mm. 6. a kind of thick plate 10,000-watt laser bright surface cutting method according to claim 3, is characterized in that: in described step S3, 50mm thick plate 10,000-watt-class fiber laser bright surface cutting, then setting the laser power to be 30kW, cutting speed 2.0m/min, nozzle height 1.0mm, cutting air pressure 1.2MPa, beam diameter 0.3mm, nozzle diameter 1.0mm.

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