CN114679844B - Automatic pin-up method - Google Patents
Automatic pin-up method Download PDFInfo
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- CN114679844B CN114679844B CN202210275667.7A CN202210275667A CN114679844B CN 114679844 B CN114679844 B CN 114679844B CN 202210275667 A CN202210275667 A CN 202210275667A CN 114679844 B CN114679844 B CN 114679844B
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- pin
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- 238000000034 method Methods 0.000 title claims abstract description 44
- 238000005553 drilling Methods 0.000 claims abstract description 46
- 230000007246 mechanism Effects 0.000 claims description 79
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 31
- 229910052782 aluminium Inorganic materials 0.000 claims description 31
- 238000004080 punching Methods 0.000 claims description 18
- 238000005538 encapsulation Methods 0.000 claims description 10
- 238000004513 sizing Methods 0.000 claims description 7
- 238000010009 beating Methods 0.000 claims description 6
- 239000002023 wood Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical class [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
- H05K3/0047—Drilling of holes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The application discloses an automatic pin feeding method, and relates to the technical field of circuit board processing. An automatic pin feeding method is applied to an automatic pin feeding device and comprises the following steps: acquiring image information of a circuit board to be processed and judging whether geometric information exists in the image information; when geometric information exists in the image information, switching a preset processing mode into a multi-layer board mode, and carrying out pin-up on the circuit board in the multi-layer board mode; and when the geometric information does not exist in the image information, switching the processing mode into a double-layer board mode, and sequentially drilling and pin-up the circuit board in the double-layer board mode. The automatic pin-up method has high efficiency and low cost.
Description
Technical Field
The application relates to the technical field of circuit board processing, in particular to an automatic pin feeding method.
Background
In the related art, a circuit board is one of important components of electronic equipment, is a support body of electronic components, is a carrier for electrically connecting the electronic components, and is used for mobile phones, computers and various household appliances. In the processing technology of the circuit board, the circuit board is usually required to be subjected to pin feeding, which is to be understood as punching holes on the circuit board and inserting pin needles, so that the pin needles play a role in positioning and fixing in the subsequent processing technology. At present, a common pin-up method is to punch holes on a circuit board and perform pin-up, but in the pin-up process, the treatment process is different because the circuit board is a double-layer board or a multi-layer board (the circuit board above the double-layer board does not contain the double-layer board), the common treatment process generally adds a drilling machine to drill the double-layer board, and a single drilling machine is arranged to process the double-layer board, so that the cost of the production process is definitely increased to a great extent; in addition, after the drilling machine is added, because the multilayer board does not need to be drilled, a new control method is added, so that the double-layer board is prevented from being wrongly processed, the control mode becomes more complex, more time is needed to be consumed for processing, and the efficient production requirement cannot be met.
Disclosure of Invention
The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides an automatic pin feeding method which can automatically identify a multi-layer board or a double-layer board and switch working modes, thereby effectively improving the processing efficiency and reducing the production cost.
The automatic pin feeding method is applied to an automatic pin feeding device and comprises the following steps of:
acquiring image information of a circuit board to be processed and judging whether geometric information exists in the image information;
when geometric information exists in the image information, switching a preset processing mode into a multi-layer board mode, and carrying out pin-up on the circuit board in the multi-layer board mode;
And when no geometric information exists in the image information, switching the processing mode into a double-layer board mode, and sequentially drilling and pin-up the circuit board in the double-layer board mode.
The automatic pin-up method provided by the embodiment of the application has at least the following beneficial effects: firstly, acquiring a circuit board and judging whether the circuit board has geometric information or not; then, when the circuit board is a multilayer board with geometric information, switching a preset processing mode into a multilayer board mode, and carrying out pin-up on the multilayer board; when the circuit board is a double-layer board without geometric information, the processing mode is switched to a double-layer board mode, and the double-layer board is sequentially drilled and pined. Through switching the processing mode that the processing production line corresponds before processing to can ensure that all nodes can link up the cooperation in whole course of working, thereby realize more efficient processing, effectively improve machining efficiency, reduction in production cost.
According to some embodiments of the application, before the obtaining the image information of the circuit board to be processed, the method further includes:
And illuminating the circuit board to be processed by two groups of backlight light sources.
According to some embodiments of the present application, before the switching the preset processing mode to the multi-layer board mode when the geometric information exists in the image information and the pin is performed on the circuit board in the multi-layer board mode, the method includes the following steps:
Comparing the current image information with the image information of the circuit board to be processed;
and when the current image information is consistent with the image information of the circuit board to be processed, maintaining the current processing mode.
According to some embodiments of the application, the step of pin-up the circuit board in the multi-layer board mode includes the steps of:
Implanting an electronic device containing a pin needle into a pin beating mechanism through a pin counting mechanism;
and driving the electronic device with the pin needle into the circuit board through the pin punching mechanism.
According to some embodiments of the application, before the circuit board is pin-up in the multi-layer board mode, the method comprises the following steps:
driving conical pins of the pin mechanism to pass through pin holes of the circuit board for positioning correction;
drilling the sizing board through the second drilling module;
And superposing the circuit board subjected to positioning correction on the wood pad subjected to drilling so as to carry out pin feeding on the superposed circuit board in the multilayer board mode.
According to some embodiments of the present application, the drilling and pin-up are sequentially performed on the circuit board in the double-layer board mode, and the method includes the following steps:
Drilling the circuit board through a first drilling module;
Drilling the sizing block through a second drilling module;
Implanting an electronic device containing a pin needle into a pin beating mechanism through a pin counting mechanism;
and driving the electronic device with the pin needle into the circuit board through the pin punching mechanism.
According to some embodiments of the application, the automatic pin-up method further comprises the steps of:
And stacking an aluminum sheet on the circuit board to obtain an integrated board.
According to some embodiments of the application, the automatic pin-up method further comprises the steps of:
Punching the aluminum sheet through a punching module;
correspondingly, the stacking the aluminum sheet on the circuit board comprises:
And superposing the punched aluminum sheet on the top of the circuit board.
According to some embodiments of the application, the automatic pin-up method further comprises the steps of:
the integrated board is moved to an encapsulation station and encapsulated.
According to some embodiments of the application, the automatic pin-up method further comprises the steps of:
and marking the encapsulated integrated plate.
Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.
Drawings
The application is further described with reference to the accompanying drawings and examples, in which:
Fig. 1 is a flow chart of an automatic pin-up method according to an embodiment of the present application
Fig. 2 is a schematic structural diagram of an automatic pin-up device according to an embodiment of the present application.
Reference numerals:
A pin feeding mechanism 100; a CCD module 110; a first drilling module 120; a pin up module 130; a laminated timber board mechanism 140; an aluminum lamination module 150;
encapsulation mechanism 200;
A marking mechanism 300;
plate loading machine 400;
A six axis robot 500.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.
In the description of the present application, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.
In the description of the present application, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.
In the description of the present application, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present application can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
In the description of the present application, the descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
An automatic pin-up method according to an embodiment of the present application is described below with reference to fig. 1-2.
It will be appreciated that as shown in fig. 1, an automatic pin feeding method is provided, which is applied to an automatic pin feeding device, and includes the following steps:
step S100, obtaining image information of a circuit board to be processed and judging whether geometric information exists in the image information;
step S110, when geometric information exists in the image information, switching a preset processing mode into a multi-layer board mode, and carrying out pin-up on the circuit board in the multi-layer board mode;
And step S120, switching the processing mode to a double-layer board mode when no geometric information exists in the image information, and sequentially drilling and pin-up the circuit board in the double-layer board mode.
Firstly, acquiring a circuit board and judging whether the circuit board has geometric information or not; then, when the circuit board is a multilayer board with geometric information, switching a preset processing mode into a multilayer board mode, and carrying out pin-up on the multilayer board; when the circuit board is a double-layer board without geometric information, the processing mode is switched to a double-layer board mode, and the double-layer board is sequentially drilled and pined. Through switching the processing mode that the processing production line corresponds before processing to can ensure that all nodes can link up the cooperation in whole course of working, thereby realize more efficient processing, effectively improve machining efficiency, reduction in production cost.
The geometric information may be understood as a preset pin hole of a corresponding region in the image information, and whether the geometric information exists in the image information may be understood as whether the pin hole is provided in the corresponding region in the image information.
It can be appreciated that before acquiring the image information of the circuit board to be processed, the method further includes:
The circuit board to be processed is illuminated by two sets of backlight sources.
It can be understood that before the preset processing mode is switched to the multi-layer board mode when the geometric information exists in the image information and the circuit board is subjected to pin-up in the multi-layer board mode, the method comprises the following steps:
comparing the current image information with the image information of the circuit board to be processed;
And when the current image information is consistent with the image information of the circuit board to be processed, maintaining the current processing mode.
It will be appreciated that, as shown in fig. 2, the circuit board is pin-up in the multi-layer board mode, which includes the following steps:
Implanting an electronic device containing a pin needle into a pin beating mechanism through a pin counting mechanism;
and driving the electronic device with the pin needle into the circuit board through the pin-punching mechanism.
It will be appreciated that the method comprises the following steps before the circuit board is pin-up in the multi-layer board mode:
driving conical pins of the pin mechanism to pass through pin holes of the circuit board for positioning correction;
drilling the sizing board through the second drilling module;
and superposing the circuit board subjected to positioning correction on the drilled sizing board so as to carry out pin-up on the superposed circuit board in a multilayer board mode.
It will be appreciated that, as shown in fig. 2, the drilling and pin-up are sequentially performed on the circuit board in the double-layer board mode, including the following steps:
drilling the circuit board through the first drilling module 120;
drilling the sizing board through the second drilling module;
Implanting an electronic device containing a pin needle into a pin beating mechanism through a pin counting mechanism;
and driving the electronic device with the pin needle into the circuit board through the pin-punching mechanism.
It will be appreciated that the automatic pin-up method further comprises the steps of:
And stacking the aluminum sheet on the circuit board to obtain the integrated board.
It will be appreciated that the automatic pin-up method further comprises the steps of:
punching the aluminum sheet through a punching module;
correspondingly, fold the aluminum sheet on the circuit board, include:
And overlapping the punched aluminum sheet on the top of the circuit board.
It will be appreciated that the automatic pin-up method further comprises the steps of:
the integrated board is moved to an encapsulation station and the integrated board is encapsulated.
It will be appreciated that the automatic pin-up method further comprises the steps of:
And marking the encapsulated integrated plate.
It will be appreciated that the circuit board in the automatic pin-up method described above has been determined to be a double-layer board in the double-layer board mode; in the multiwall mode, it has been determined as multiwall.
An automatic pin-up device according to an embodiment of the present application is described below with reference to fig. 2.
It will be appreciated that as shown in fig. 2, the automatic pin-up device includes:
An automatic pin-up device according to an embodiment of the present application is described below with reference to fig. 2.
It will be appreciated that as shown in fig. 2, the automatic pin-up device includes:
The upper pin mechanism 100, the upper pin mechanism 100 comprises an aluminum sheet stacking module 150, and a CCD module 110, a first manipulator, a first drilling module 120, an upper pin module 130 and a laminated wood board mechanism 140 which are sequentially arranged, wherein the aluminum sheet stacking module 150 is arranged beside the laminated wood board mechanism 140; the CCD module 110 is used for identifying a double-layer board or a multi-layer board; the first drilling module 120 is used for drilling the double-layer plate; the stacked skid mechanism 140 is used for drilling the skid; the first manipulator is used for placing the multilayer board or the drilled double-layer board and the skid board on the pin-up module 130 and overlapping; the pin feeding module 130 is used for feeding pins to the laminated double-layer board or the multi-layer board; the aluminum sheet stacking module 150 is used for punching an aluminum sheet and stacking the aluminum sheet on the double-layer plate or the multi-layer plate after pin loading;
The encapsulation mechanism 200 is used for encapsulating the double-layer plate or the multi-layer plate after the aluminum sheets are stacked;
The marking mechanism 300 is used for marking the double-layer board or the multi-layer board by the marking mechanism 300;
a transmission line passing through the CCD module 110, the first manipulator, the first drilling module 120, and the pin feeding module 130 in sequence, the transmission line being used for transmitting the double-layer board or the multi-layer board;
The control mechanism is electrically connected with the conveying line, the pin feeding mechanism 100, the encapsulation mechanism 200 and the marking mechanism 300 respectively.
The automatic pin feeding device provided by the embodiment of the application has at least the following beneficial effects: firstly, by arranging the CCD module 110, the circuit board can be accurately identified as a double-layer board or a multi-layer board; then, the control mechanism controls the conveying line to convey the double-layer board to the first drilling module 120, after the double-layer board is drilled, the control mechanism controls the first manipulator to place the drilled double-layer board on the pin-up module 130, and the control mechanism also controls the first manipulator to skip the station where the first drilling module 120 is located and directly place the double-layer board on the pin-up module 130; finally, whether it is a double-layer board or a multi-layer board, the laminated board passes through the laminated board mechanism 140, the laminated aluminum sheet module 150, the encapsulation mechanism 200, and the marking mechanism 300 in order and is processed correspondingly. According to the automatic pin feeding device, through the arrangement of the control mechanism, the CCD module 110 and the first manipulator, the circuit board is not required to be processed by switching different processing equipment back and forth on the same station, and only the CCD module 110 is required to identify that the circuit board is a double-layer board or a multi-layer board, so that the production efficiency is effectively improved, in addition, the whole processing process does not need manual operation, and the cost caused by manual operation is reduced.
It will be appreciated that the first drilling module 120 comprises two drilling members, one on each side of the conveyor line. By providing two drilling members, the drilling efficiency is higher.
It may be appreciated that the CCD module 110 includes two CCD cameras, a first positioning mechanism, where the first positioning mechanism includes a first positioning main body, two first positioning claps and two first positioning pins, the first positioning main body is disposed at the bottom of the conveying line, the two first positioning claps are disposed at two sides of the conveying line and connected with the first positioning main body, the two CCD cameras are disposed at two sides of the conveying line, the two first positioning pins are disposed under the CCD module 210, and the two first positioning pins are used for jacking the multi-layer board to perform positioning correction on the multi-layer board; the conveying line comprises a first conveying belt and a second conveying belt which are arranged in parallel at intervals, so that an installation space of a first positioning mechanism is formed between the first conveying belt and the second conveying belt; the first positioning mechanism is arranged in the installation space and located below the conveying line, the CCD camera is used for identifying the double-layer board or the multi-layer board, the first positioning mechanism is used for positioning and correcting the multi-layer board, and the first manipulator is used for placing the positioned multi-layer board on the upper pin module 130.
It is to be appreciated that the stacking shoe mechanism 140 includes a second manipulator, a third manipulator, a shoe bin, a second drilling module, a second positioning mechanism, wherein the second manipulator and the third manipulator are all arranged above the conveying line, the second drilling module is arranged at one side of the conveying line, the second positioning mechanism includes a second positioning main body and two second positioning claps, the second positioning main body is arranged at the bottom of the conveying line, the two second positioning claps are respectively arranged at two sides of the conveying line and are connected with the second positioning main body, the second manipulator is used for placing the shoe placed in the shoe bin to the second positioning mechanism, the second positioning mechanism is used for positioning the shoe, and the third manipulator is used for placing the shoe on the second positioning mechanism to the second drilling module which is used for drilling the shoe.
It is to be understood that, the pin feeding module 130 includes a third positioning mechanism, a pin feeding mechanism, and a pin feeding platform, where the third positioning mechanism includes a third positioning main body and two third positioning pins, the third positioning mechanism is disposed between the first conveyor belt and the second conveyor belt, the two third positioning pins are disposed under the pin feeding mechanism, the two third positioning pins are used for lifting up the double-layer board or the multi-layer board, so as to perform positioning correction on the double-layer board or the multi-layer board, the pin feeding mechanism is used for implanting pins into the pin feeding mechanism, the pin feeding mechanism is used for driving pins corresponding to the pins into the pin holes of the multi-layer board or the double-layer board located on the pin feeding platform, and the first tray feeding mechanism is used for lifting up the multi-layer board or the double-layer board after pin feeding on the pin feeding platform and conveying the multi-layer board or the double-layer board after pin feeding to the stacked aluminum sheet module 150.
It may be appreciated that the aluminum stacking module 150 includes a fourth manipulator, a fifth manipulator, a fourth positioning mechanism, an aluminum sheet bin, a punching module, and an aluminum stacking platform, where the fourth positioning mechanism includes a fourth positioning main body and two fourth positioning claps, the fourth positioning main body is disposed at the bottom of the conveying line, the two fourth positioning claps are disposed at two sides of the conveying line, the fifth manipulator is used for placing an aluminum sheet placed in the aluminum sheet bin into the fourth positioning mechanism, the fourth positioning mechanism is used for positioning the aluminum sheet, the punching module is used for punching the positioned aluminum sheet, and the fourth manipulator is used for sequentially placing the positioned aluminum sheet onto the punching module, the multi-layer board or the double-layer board on the aluminum stacking platform; the automatic pin feeding device further comprises a second tray transfer mechanism, wherein the second tray transfer mechanism is used for jacking a multi-layer board or a double-layer board of the aluminum sheet stacking platform and sequentially conveying the multi-layer board or the double-layer board after aluminum sheet stacking to the rubber coating mechanism 200 and the marking mechanism 300.
It will be appreciated that the encapsulation mechanism 200 is provided with an encapsulation module, the second tray transfer mechanism is used for rotating the multiwall sheet or the bilayer sheet, the encapsulation module is used for encapsulating the multiwall sheet or the bilayer sheet, and the second tray transfer mechanism is also used for moving the encapsulated multiwall sheet or the bilayer sheet to the blanking mechanism.
It will be appreciated that the automatic pin feeding apparatus further comprises a board feeding machine 400, the board feeding machine 400 being arranged at one end of the conveyor line, the board feeding machine 400 being adapted to place a double or multi layer board on the conveyor line.
It can be understood that the blanking mechanism is a six-axis robot 500, the six-axis robot 500 is disposed beside the marking mechanism 300, and the six-axis robot 500 is used for blanking the double-layer board or the multi-layer board after marking.
It is understood that the control mechanism is a PLC control board, which is provided with an ethernet port for connecting with the MES system.
The embodiments of the present application have been described in detail with reference to the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present application. Furthermore, embodiments of the application and features of the embodiments may be combined with each other without conflict.
Claims (7)
1. An automatic pin feeding method is characterized by being applied to an automatic pin feeding device and comprising the following steps of:
acquiring image information of a circuit board to be processed and judging whether geometric information exists in the image information, wherein the geometric information is a preset pin hole of a corresponding area in the image information;
when geometric information exists in the image information, switching a preset processing mode into a multi-layer board mode, and carrying out pin-up on the circuit board in the multi-layer board mode;
When no geometric information exists in the image information, switching the processing mode into a double-layer board mode, and sequentially drilling and pin-up the circuit board in the double-layer board mode;
And switching a preset processing mode into a multi-layer board mode when geometric information exists in the image information, and before the circuit board is subjected to pin-up in the multi-layer board mode, comprising the following steps of:
Comparing the current image information with the image information of the circuit board to be processed;
when the current image information is consistent with the image information of the circuit board to be processed, the current processing mode is maintained;
Specifically, the step of carrying out pin-up on the circuit board in the multilayer board mode comprises the following steps:
Implanting an electronic device containing a pin needle into a pin beating mechanism through the pin implanting mechanism;
Driving an electronic device with pin needles into the circuit board through the pin punching mechanism;
Specifically, the drilling and pin-up are sequentially performed on the circuit board in the double-layer board mode, and the method comprises the following steps:
Drilling the circuit board through a first drilling module;
drilling the sizing board through the second drilling module;
Implanting an electronic device containing a pin needle into a pin beating mechanism through the pin implanting mechanism;
and driving the electronic device with the pin needle into the circuit board through the pin punching mechanism.
2. The automatic pin feeding method according to claim 1, wherein before the image information of the circuit board to be processed is acquired, the method further comprises:
And illuminating the circuit board to be processed by two groups of backlight light sources.
3. The automatic pin feeding method according to claim 1, characterized by comprising the following steps before the circuit board is pin fed in the multi-layer board mode:
driving conical pins of the pin mechanism to pass through pin holes of the circuit board for positioning correction;
drilling the sizing board through the second drilling module;
And superposing the circuit board subjected to positioning correction on the wood pad subjected to drilling so as to carry out pin feeding on the superposed circuit board in the multilayer board mode.
4. The automatic pin feeding method according to claim 1, further comprising the steps of:
And stacking an aluminum sheet on the circuit board to obtain an integrated board.
5. The automatic pin feeding method of claim 4, further comprising the steps of:
Punching the aluminum sheet through a punching module;
correspondingly, the stacking the aluminum sheet on the circuit board comprises:
And superposing the punched aluminum sheet on the top of the circuit board.
6. The automatic pin feeding method of claim 4, further comprising the steps of:
the integrated board is moved to an encapsulation station and encapsulated.
7. The automatic pin feeding method of claim 6, further comprising the steps of:
and marking the encapsulated integrated plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210275667.7A CN114679844B (en) | 2022-03-21 | 2022-03-21 | Automatic pin-up method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210275667.7A CN114679844B (en) | 2022-03-21 | 2022-03-21 | Automatic pin-up method |
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| CN114679844A CN114679844A (en) | 2022-06-28 |
| CN114679844B true CN114679844B (en) | 2024-07-02 |
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| CN202210275667.7A Active CN114679844B (en) | 2022-03-21 | 2022-03-21 | Automatic pin-up method |
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| KR20050116197A (en) * | 2004-06-07 | 2005-12-12 | 엘지전자 주식회사 | Apparatus and method for controlling photograph mode in monitoring camera |
| CN105499820A (en) * | 2016-01-12 | 2016-04-20 | 武汉华星光电技术有限公司 | Automatic welding system for flexible printed circuit board |
| CN106658969A (en) * | 2016-11-18 | 2017-05-10 | 深圳崇达多层线路板有限公司 | Device and method for automatically performing pin mounting and adhesive encapsulation on printed circuit board |
| CN208317124U (en) * | 2018-04-20 | 2019-01-01 | 深圳市动力飞扬自动化设备有限公司 | PIN is in the device of one on a kind of mono- doubling plate of PCB and multi-layer board |
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| CN114679844A (en) | 2022-06-28 |
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