CN114309544B - Pressure casting injection production process of temperature equalization plate and temperature equalization plate - Google Patents
Pressure casting injection production process of temperature equalization plate and temperature equalization plate Download PDFInfo
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- CN114309544B CN114309544B CN202111393727.7A CN202111393727A CN114309544B CN 114309544 B CN114309544 B CN 114309544B CN 202111393727 A CN202111393727 A CN 202111393727A CN 114309544 B CN114309544 B CN 114309544B
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- China
- Prior art keywords
- copper sheet
- heat dissipation
- zinc alloy
- die
- sheet
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 12
- 238000002347 injection Methods 0.000 title description 7
- 239000007924 injection Substances 0.000 title description 7
- 238000005266 casting Methods 0.000 title description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 59
- 229910052802 copper Inorganic materials 0.000 claims abstract description 59
- 239000010949 copper Substances 0.000 claims abstract description 59
- 229910001297 Zn alloy Inorganic materials 0.000 claims abstract description 42
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 29
- 238000003860 storage Methods 0.000 claims abstract description 20
- 238000004512 die casting Methods 0.000 claims abstract description 16
- 230000017525 heat dissipation Effects 0.000 claims description 55
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 20
- 239000007788 liquid Substances 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000001816 cooling Methods 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000000465 moulding Methods 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims 5
- 238000004891 communication Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 238000002360 preparation method Methods 0.000 abstract description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a temperature equalizing plate and a die-casting embedding production process thereof, wherein the temperature equalizing plate comprises a heat radiating copper sheet and a heat radiating zinc alloy sheet coated outside the heat radiating copper sheet, a heat radiating column is fixed at the top of the heat radiating zinc alloy sheet, a water storage cavity is arranged in the heat radiating copper sheet, a plurality of support columns for supporting the top surface and the bottom surface of the heat radiating copper sheet are arranged in the water storage cavity, and water is stored in the water storage cavity. The invention adopts the combined structure of the radiating copper sheet and the radiating zinc alloy sheet, thereby not only ensuring good radiating effect, but also greatly reducing cost, providing a corresponding preparation process and avoiding the expansion of the radiating copper sheet in the production process.
Description
Technical Field
The invention relates to a temperature equalizing plate and a die-casting injection production process of the temperature equalizing plate.
Background
The temperature equalizing plate is similar to a heat pipe in principle in technology, but is different in conduction mode, the heat pipe is in one-dimensional linear heat conduction, and heat in the temperature equalizing plate is conducted on a two-dimensional surface, so that the efficiency is higher.
The temperature equalizing plate is a device for radiating the heat of the heat-generating electronic element in the power supply, and is mostly made of aluminum alloy, brass or bronze into a plate shape, a sheet shape and a multi-sheet shape, and the temperature equalizing plate made of copper has the best radiating effect, but the copper price is more expensive, and the temperature equalizing plate made of all copper has high price, thus greatly increasing the cost of products.
Disclosure of Invention
Aiming at the problems, the invention provides a temperature equalizing plate which is composed of zinc alloy and copper, so that the heat dissipation efficiency is ensured, the cost is greatly reduced, and the problems pointed out in the background technology are effectively solved.
The technical scheme adopted by the invention is as follows:
the utility model provides a samming board, includes the heat dissipation copper sheet to and the cladding is at the outer heat dissipation zinc alloy piece of heat dissipation copper sheet, the top of heat dissipation zinc alloy piece is fixed with the heat dissipation post, the inside of heat dissipation copper sheet is equipped with the water storage chamber, the water storage intracavity is equipped with the support column of the top surface and the bottom surface of many support heat dissipation copper sheets, the water storage intracavity store water.
The heat dissipation copper sheet and the heat dissipation zinc alloy sheet are combined, so that good heat dissipation effect can be ensured, and meanwhile, the cost is greatly reduced.
The water storage cavity is formed in the heat dissipation copper sheet, when heat dissipation is carried out, water in the water storage cavity can absorb heat and evaporate and quickly transfer to each position of the copper sheet, so that heat can be quickly and evenly transferred to each position of the heat dissipation copper sheet, and the heat dissipation effect is greatly improved.
Preferably, a nickel plating layer is provided on the surface of the heat dissipation zinc alloy sheet.
The nickel plating on the surface of the heat dissipation zinc alloy sheet prevents oxidation of the heat dissipation zinc alloy sheet.
The invention also provides a die-casting and injection production process of the temperature equalization plate, which comprises the following steps:
step 1), fixing a radiating copper sheet on a die-casting die through a positioning lug, and closing the die;
step 2), flowing zinc alloy liquid into the die cavity to cover the heat dissipation copper sheet, and cooling to form a heat dissipation zinc alloy sheet;
step 3), opening the die to confirm whether the radiating copper sheet expands, if so, the radiating copper sheet is a non-conforming product, and if not, the radiating copper sheet is a conforming product, and performing post-treatment;
step 4), cutting off the positioning lug on the radiating copper sheet, filling water into a water storage cavity of the radiating copper sheet from the cutting-off position of the positioning lug, and sealing the cutting-off position of the positioning lug;
and 5) plating nickel on the surface of the heat dissipation zinc alloy sheet to form a nickel plating layer, thereby obtaining the finished product of the temperature equalizing plate.
Preferably, the step 2) includes the steps of: step a, zinc alloy liquid flows into a die cavity at a flow velocity V1, and the filling rate is 0%; and b, flowing zinc alloy liquid into the die cavity at a flow speed V2, wherein the filling rate is 99%, and the molding time is t.
Preferably, the temperature of the zinc alloy liquid is 280-500 ℃.
Preferably, V1 is 150-500cm/s and V2 is 1000-1500cm/s.
Preferably, t is 10 to 60 seconds.
The invention combines zinc alloy and copper, the zinc alloy has lower melting temperature, the expansion of the radiating copper sheet caused by overhigh temperature can be avoided when the die casting and injection are carried out, the production of products is realized, meanwhile, the zinc alloy is coated on the radiating copper sheet rapidly in a two-section feeding way when the die casting and injection are carried out, and the overhigh temperature of the radiating copper sheet is avoided for a long time.
The invention adopts the combined structure of the radiating copper sheet and the radiating zinc alloy sheet, thereby not only ensuring good radiating effect, but also greatly reducing cost, providing a corresponding preparation process and avoiding the expansion of the radiating copper sheet in the production process.
Drawings
FIG. 1 is a schematic structural view of a temperature equalization plate;
fig. 2 is a schematic cross-sectional view of a heat dissipating copper sheet.
Detailed Description
The invention will now be described in further detail with reference to the accompanying drawings by means of specific examples.
Example 1
As shown in fig. 1-2, a temperature equalization plate comprises a heat dissipation copper sheet 1 and a heat dissipation zinc alloy sheet 2 coated outside the heat dissipation copper sheet 1, wherein a heat dissipation column 3 is fixed at the top of the heat dissipation zinc alloy sheet 2, a water storage cavity 4 is arranged in the heat dissipation copper sheet 1, a plurality of support columns 5 for supporting the top surface and the bottom surface of the heat dissipation copper sheet 1 are arranged in the water storage cavity 4, water is stored in the water storage cavity 4, and a nickel plating layer is arranged on the surface of the heat dissipation zinc alloy sheet 2.
The temperature equalizing plate can be used for all positions needing heat dissipation, the bottom of the temperature equalizing plate is fixed at the heat dissipation position, and the working principle is as follows:
the temperature equalizing plate firstly absorbs heat by means of the bottom layer of the heat dissipation zinc alloy sheet 2 and transfers heat upwards to the heat dissipation copper sheet 1, when the temperature of a certain position of the heat dissipation copper sheet 1 exceeds 100 ℃, water in the water storage cavity 4 is evaporated to become gas, water vapor rapidly flows in the water storage cavity 4 and becomes liquid after being cooled at a lower temperature, so that the rapid and uniform distribution of the heat dissipation copper sheet 1 is realized, the overhigh temperature of the individual positions is avoided, the heat dissipation effect is improved, the heat on the heat dissipation copper sheet 1 is upwards transferred to the top layer of the heat dissipation zinc alloy sheet 2, and then the heat is transferred to the heat dissipation column 3 for heat dissipation, and the heat dissipation process is completed.
Example 2
A die-casting injection production process of a temperature equalization plate comprises the following steps:
step 1), fixing a radiating copper sheet 1 on a die casting die through a positioning lug 6, and closing the die;
step 2), zinc alloy liquid flows into the die cavity and is coated outside the heat dissipation copper sheet 1, and the heat dissipation zinc alloy sheet 2 is formed after cooling;
step 3), opening the mould to confirm whether the radiating copper sheet 1 expands, if so, the radiating copper sheet is a non-conforming product, and if not, the radiating copper sheet is a conforming product, and performing post-treatment;
step 4), cutting off the positioning lug 6 on the radiating copper sheet 1, filling water into the water storage cavity 4 of the radiating copper sheet 1 from the position where the positioning lug 6 is cut off, and sealing the cut-off position of the positioning lug 6;
and 5) plating nickel on the surface of the heat dissipation zinc alloy sheet 2 to form a nickel plating layer, thereby obtaining a finished product of the temperature equalizing plate.
The step 2) comprises the following steps: step a, zinc alloy liquid flows into a die cavity at a flow speed V1, wherein V1 is 150-500cm/s, and the filling rate is 0%; and b, flowing zinc alloy liquid into the die cavity at a flow speed V2, wherein V2 is 1000-1500cm/s, the filling rate is 99%, the molding time is t, t is 10-60 seconds, and the temperature of the zinc alloy liquid is 280-500 ℃.
The zinc alloy is an alloy formed by adding other elements based on zinc, and commonly added alloy elements include aluminum, copper, magnesium, cadmium, lead, titanium and the like, and the zinc alloy has low melting point, good fluidity, easy fusion welding, brazing and plastic processing and is corrosion-resistant in the atmosphere.
Finally, it should be noted that the above list is only specific embodiments of the present invention. Obviously, the invention is not limited to the above embodiments, but many variations are possible. All modifications directly derived or suggested to one skilled in the art from the present disclosure should be considered as being within the scope of the present invention.
Claims (6)
1. The die-casting package of samming board is penetrated production technology, a serial communication port, samming board include heat dissipation copper sheet (1) to and cladding is outside heat dissipation zinc alloy piece (2) of heat dissipation copper sheet (1), the top of heat dissipation zinc alloy piece (2) is fixed with heat dissipation post (3), the inside of heat dissipation copper sheet (1) is equipped with water storage chamber (4), be equipped with support column (5) of the top surface and the bottom surface of many support heat dissipation copper sheet (1) in water storage chamber (4), water storage chamber (4) in the storage have water, die-casting package penetrate production technology include the following steps:
step 1), fixing a radiating copper sheet (1) on a die casting die through a positioning lug (6) and then closing the die;
step 2), zinc alloy liquid flows into a die cavity to be coated outside the heat dissipation copper sheet (1), and the heat dissipation zinc alloy sheet (2) is formed after cooling;
step 3), opening a die to confirm whether the radiating copper sheet (1) expands, if so, the radiating copper sheet is a disqualified product, and if not, the radiating copper sheet is a qualified product, and performing post-treatment;
step 4), cutting off the positioning lug (6) on the radiating copper sheet (1), filling water into the water storage cavity (4) of the radiating copper sheet (1) from the cutting-off position of the positioning lug (6), and sealing the cutting-off position of the positioning lug (6);
and 5) plating nickel on the surface of the heat dissipation zinc alloy sheet (2) to form a nickel plating layer, thereby obtaining the finished product temperature-equalizing plate.
2. The die-casting and injection-molding production process of the temperature equalization plate according to claim 1, wherein a nickel plating layer is arranged on the surface of the heat dissipation zinc alloy sheet (2).
3. The process for die casting and injection molding a temperature equalization plate according to claim 1, wherein said step 2) comprises the steps of: step a, zinc alloy liquid is processed at a flow velocity V 1 Flowing into the die cavity, wherein the filling rate is 0%; step b, zinc alloy liquid is processed at a flow velocity V 2 Flows into the die cavity, the filling rate is 99 percent, and the molding time is t.
4. A die casting and injection molding process for a temperature equalizing plate according to claim 3, wherein the temperature of the zinc alloy liquid is 280-500 ℃.
5. A process for die casting and injection molding a temperature equalization plate according to claim 3, wherein said V 1 150-500cm/s, V 2 1000-1500cm/s.
6. A process for die casting and injection molding a temperature equalization plate according to claim 3, wherein t is 10-60 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111393727.7A CN114309544B (en) | 2021-11-23 | 2021-11-23 | Pressure casting injection production process of temperature equalization plate and temperature equalization plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111393727.7A CN114309544B (en) | 2021-11-23 | 2021-11-23 | Pressure casting injection production process of temperature equalization plate and temperature equalization plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114309544A CN114309544A (en) | 2022-04-12 |
| CN114309544B true CN114309544B (en) | 2023-09-19 |
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|---|---|---|---|
| CN202111393727.7A Active CN114309544B (en) | 2021-11-23 | 2021-11-23 | Pressure casting injection production process of temperature equalization plate and temperature equalization plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN114309544B (en) |
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|---|---|---|---|---|
| JPH1183360A (en) * | 1997-09-03 | 1999-03-26 | Fujikura Ltd | Heat pipe with fins and method of manufacturing the same |
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| CN212034657U (en) * | 2020-06-22 | 2020-11-27 | 深圳市鸿富诚屏蔽材料有限公司 | Integrated uniform temperature plate radiator |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6698500B2 (en) * | 2002-01-22 | 2004-03-02 | The Furukawa Electric Co., Ltd. | Heat sink with fins |
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2021
- 2021-11-23 CN CN202111393727.7A patent/CN114309544B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1183360A (en) * | 1997-09-03 | 1999-03-26 | Fujikura Ltd | Heat pipe with fins and method of manufacturing the same |
| JP2002270745A (en) * | 2001-03-12 | 2002-09-20 | Hitachi Cable Ltd | Heat dissipating material with fins and manufacturing method thereof |
| CN101014235A (en) * | 2007-02-09 | 2007-08-08 | 广州恩诺吉电子科技有限公司 | Apparatus of uniform heat transfer and method of manufacturing the same |
| CN101927426A (en) * | 2009-06-24 | 2010-12-29 | 富准精密工业(深圳)有限公司 | Vapor chamber and manufacturing method thereof |
| CN103846365A (en) * | 2012-11-30 | 2014-06-11 | 象水国际股份有限公司 | Vapor chamber and manufacturing method thereof |
| CN203202985U (en) * | 2013-05-06 | 2013-09-18 | 北京依米康散热技术有限公司 | High-power LED radiating device |
| CN104148617A (en) * | 2013-05-15 | 2014-11-19 | 苏州春兴精工股份有限公司 | Method for die casting of novel cooling fins |
| CN204217304U (en) * | 2014-11-07 | 2015-03-18 | 游本俊 | A kind of temperature-uniforming plate improving conduction of velocity |
| WO2018066413A1 (en) * | 2016-10-03 | 2018-04-12 | 株式会社神戸製鋼所 | Copper alloy plate for heat dissipation components, heat dissipation component, and method for producing heat dissipation component |
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| Publication number | Publication date |
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| CN114309544A (en) | 2022-04-12 |
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