CN113964170A

CN113964170A - Substrate structure capable of improving cutting yield

Info

Publication number: CN113964170A
Application number: CN202111388272.XA
Authority: CN
Inventors: 董浩; 陈宇怀; 徐洋; 林涛; 詹建成; 何燕坤
Original assignee: Fujian Huajiacai Co Ltd
Current assignee: Fujian Huajiacai Co Ltd
Priority date: 2021-11-22
Filing date: 2021-11-22
Publication date: 2022-01-21

Abstract

The invention discloses a substrate structure capable of improving the cutting yield, which comprises a CF substrate, wherein a BM cushion layer is arranged on one side end face of the CF substrate and is arranged at a cutting channel in the middle of a panel, Seal frame glue is pasted on the BM cushion layer, and an Array substrate is packaged on the Seal frame glue. According to the invention, the BM cushion layer is added in the seal gluing area, and the new structure and process of auxiliary cutting of the laser process are combined, so that the production efficiency and the production yield are greatly improved, and the scrappage quantity caused by cutting and automatic breaking is reduced; meanwhile, the automation degree of the cutting line is increased, the dependence on manual operation is reduced, and the labor cost is reduced. The BM cushion layer receives laser energy to fuse in the laser process, provides crack extension points in the sheet breaking process, and is beneficial to promoting the execution of an automatic sheet breaking process.

Description

Substrate structure capable of improving cutting yield

Technical Field

The invention relates to the technical field of display panels, in particular to a substrate structure capable of improving the cutting yield.

Background

In the display industry, LCD and AMOLED display panels are cut from large-sized substrates, and the mainstream production substrate generation sizes include G5.5, G6, G8.5, G10, G10.5, and the like. In the production process of LCD and AMOLED panels, an Array substrate and a CF substrate (a packaging cover plate) are subjected to plate combination through an intermediate adhesive Seal to produce a large-size semi-finished product, and then a cutting machine is used for cutting and splitting the large-size semi-finished product to obtain a panel finished product. Because the viscosity of the adhesive Seal is high during cutting, and the position of the CF/TFT crack cannot be completely coincided with the cutting position, the Seal adheres to the glass during slicing, so that the slice adhesion occurs during automatic slice taking, the yield loss is caused, and the slice breaking is required manually, so that the production efficiency is influenced. Therefore, a substrate structure capable of improving the yield of the dicing process is provided.

Disclosure of Invention

The present invention is directed to a substrate structure capable of improving the yield of the dicing process, so as to solve the problems mentioned in the background art.

In order to achieve the purpose, the invention provides the following technical scheme: a substrate structure capable of improving the cutting yield comprises a CF substrate, wherein a BM cushion layer is arranged on one side end face of the CF substrate and arranged at a cutting channel in the middle of a panel, Seal frame glue is pasted on the BM cushion layer, and an Array substrate is packaged on the Seal frame glue.

Taking the AMOLED panel as an example, a package cover plate (i.e., a CF substrate) of the panel is first fabricated; manufacturing a black light resistance BM (namely a BM cushion layer) on the CF substrate, wherein the BM cushion layer can be manufactured on the CF substrate by a coating, exposing and developing process or a direct evaporation method; coating a bonding agent Seal on the BM cushion layer to form Seal frame glue; and (5) combining the Array substrate to carry out plywood packaging to produce a substrate semi-finished product.

Seal frame glue is cracked from the Array substrate side to the CF substrate, and due to the fact that laser is carried out, the BM: after the Black Matrix is gasified, Seal frame glue is not adhered to the area of the CF substrate, so that the film can be taken smoothly.

The cutting path is designed with a BM cushion layer, the yield of a cutting section is more than 96%, the clearance of the BM cushion layer at the cutting path has great influence on the fracture, the yield of the section is more than 3%, and a special cutter wheel needs to be purchased, so that the cost of the cutter wheel is doubled.

Compared with the prior art, the invention has the beneficial effects that: according to the invention, a BM cushion layer is added in a Seal gluing area (namely Seal frame glue) to be combined with a new structure and process for assisting in cutting by a laser process, so that the production efficiency and the production yield are greatly improved, and the scrappage quantity caused by cutting and automatic sheet breaking is reduced; meanwhile, the automation degree of the cutting line is increased, the dependence on manual operation is reduced, and the labor cost is reduced. The BM cushion layer receives laser energy to fuse in the laser process, provides crack extension points in the sheet breaking process, and is beneficial to promoting the execution of an automatic sheet breaking process.

Drawings

FIG. 1 is a schematic diagram of a design structure of a cutting street without BM cushion layer and with Seal frame glue only;

FIG. 2 is an exploded view of a substrate structure capable of increasing the yield of the semiconductor device;

FIG. 3 is a schematic view of a CF substrate structure according to the present invention;

FIG. 4 is a schematic structural diagram of the BM cushion layer and the CF substrate according to the present invention;

FIG. 5 is a schematic structural diagram of the Seal frame glue, BM cushion layer and CF substrate of the present invention;

FIG. 6 is a schematic perspective view of a substrate structure capable of improving the yield of the dicing process according to the present invention;

FIG. 7 is a structural diagram illustrating a dicing effect of a substrate structure capable of increasing a dicing yield according to the present invention;

fig. 8 is a schematic view of the structure of the cutting effect of fig. 1.

In the figure: 1. an Array substrate; 2. seal frame glue; 3. BM cushion layer; 4. a CF substrate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 2, the present invention provides a technical solution: a substrate structure capable of improving the cutting yield comprises a CF substrate 4, wherein a BM cushion layer 3 is arranged on one side end face of the CF substrate 4, the BM cushion layer 3 is arranged at a cutting channel in the middle of a panel, Seal frame glue 2 is pasted on the BM cushion layer 3, and an Array substrate 1 is packaged on the Seal frame glue 2.

The BM cushion layer 3 is made of an organic photoresist material, and the BM cushion layer 3 is black. The width of the BM cushion layer 3 at the cutting path is 50-150um, and the width of the blank area is more than or equal to 50 um. And driving wires, signal wires, TFT devices, capacitors and electrodes are distributed on the Array substrate 1.

Specifically, the packaging process of the substrate structure capable of improving the dicing yield includes the following steps:

s1: taking the AMOLED panel as an example, a package cover plate (i.e., the CF substrate 4) of the panel is first fabricated; (as shown in FIG. 3);

s2: manufacturing a black photoresist BM (namely the BM cushion layer 3) on the CF substrate 4, wherein the process can be coating, exposing and developing or the BM cushion layer 3 is manufactured on the CF substrate 4 by a direct evaporation method; (as shown in FIG. 4);

s3: coating a bonding agent Seal on the BM cushion layer 3 to form Seal frame glue 2; (as shown in FIG. 5);

s4: and (5) combining the Array substrate 1 to carry out plywood packaging to produce a substrate semi-finished product. (as shown in fig. 6).

As shown in fig. 7, Seal frame glue 2 is cracked from the Array substrate 1 side to the CF substrate 4, and by laser, BM of the BM cushion layer 3: after the Black Matrix is gasified, the Seal frame glue 2 and the CF substrate 4 are not adhered, so that the film can be taken smoothly;

as shown in fig. 8, the Seal sealant 2 that is cracked from the Array substrate 1 side to the CF substrate 4 cannot completely coincide with the cutting position, so that the Seal sealant 2 sticks to the CF substrate 4 during slicing, which causes sticking during automatic slice taking;

the difference between the substrate structure capable of improving the cutting yield and the common substrate structure is that: adding a BM cushion layer 3 between the Seal frame glue 2 and the CF substrate 4, wherein the BM cushion layer 3 is positioned at a cutting path in the middle of the panel, and the Seal frame glue 2 is coked by using laser assistance, so that the yield and the production efficiency of the panel are improved;

according to the situation of the test process, the cutting path has no BM cushion layer 3 and only has the design of Seal frame glue 2 (as shown in figure 1), the breaking effect is worse than that of the design with the BM cushion layer 3, and the estimated appearance yield can affect 0.5%.

The cutting path is designed by a BM cushion layer 3, the yield of a cutting section is more than 96%, the clearance of the BM cushion layer 3 at the cutting path has great influence on the fracture, the yield of the section at the position of the cutting path is more than 3%, a special cutter wheel needs to be purchased, and the cost of the cutter wheel is doubled.

Specifically, when the device is used, in order to solve the problems of good loss and reduction of production efficiency caused by the fact that Seal sticks glass in the cutting process, a BM cushion layer 3 is added in a Seal gluing area (namely Seal frame glue 2) to be combined with a new structure and a new process for assisting cutting by a laser process, so that the production efficiency and the production yield are greatly improved, and the scrapping quantity of automatic breaking pieces due to cutting is reduced; meanwhile, the automation degree of the cutting line is increased, the dependence on manual operation is reduced, and the labor cost is reduced. The BM cushion layer 3 receives laser energy to fuse in the laser process, provides crack extension points in the sheet breaking process, and is beneficial to promoting the execution of an automatic sheet breaking process.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A substrate structure that can improve the yield of cutting, comprising a CF substrate (4), characterized in that: one end face of the CF substrate (4) is provided with a BM cushion layer (3), and the BM cushion layer ( 3) It is arranged at the cutting lane in the middle of the panel, the BM cushion layer (3) is pasted with the Seal sealant (2), and the Array substrate (1) is encapsulated on the Seal sealant (2).

2 . The substrate structure according to claim 1 , wherein the BM pad layer ( 3 ) is made of organic photoresist material, and the BM pad layer ( 3 ) is black. 3 . .

3 . The substrate structure according to claim 1 , wherein the width of the BM cushion layer ( 3 ) at the cutting line is 50-150 um, and the width of the blank area is ≥ 50 um. 4 .

4 . The substrate structure according to claim 1 , wherein the Array substrate ( 1 ) is distributed with driving traces, signal traces, TFT devices, capacitors, and electrodes. 5 .