CN113488838A - Cooling packaging device for gain medium of optically pumped thin-film laser - Google Patents
Cooling packaging device for gain medium of optically pumped thin-film laser Download PDFInfo
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- CN113488838A CN113488838A CN202110855444.3A CN202110855444A CN113488838A CN 113488838 A CN113488838 A CN 113488838A CN 202110855444 A CN202110855444 A CN 202110855444A CN 113488838 A CN113488838 A CN 113488838A
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- gain medium
- heat sink
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- laser
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/09—Processes or apparatus for excitation, e.g. pumping
- H01S3/091—Processes or apparatus for excitation, e.g. pumping using optical pumping
- H01S3/094—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light
- H01S3/0941—Processes or apparatus for excitation, e.g. pumping using optical pumping by coherent light of a laser diode
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/025—Constructional details of solid state lasers, e.g. housings or mountings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0401—Arrangements for thermal management of optical elements being part of laser resonator, e.g. windows, mirrors, lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/0405—Conductive cooling, e.g. by heat sinks or thermo-electric elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
- H01S3/042—Arrangements for thermal management for solid state lasers
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Semiconductor Lasers (AREA)
- Lasers (AREA)
Abstract
本发明公开了一种光泵浦薄片激光器增益介质的冷却封装装置，其包括热沉基板，热沉基板的一侧设置有壳体，壳体内设置有安装腔，安装腔内设置有半导体制冷片，半导体制冷片连接在热沉基板上，半导体制冷片上设置有增益介质热沉，安装腔内设置有激光二极管芯片热沉，激光二极管芯片热沉上设置有激光二极管芯片，激光二极管芯片后面设置有快轴准直镜，快轴准直镜是用胶固定于二极管芯片热沉上，快轴准直镜的一侧设置有增益介质，增益介质通过增益介质热沉连接在半导体制冷片上，快轴准直镜的一侧设置有窗口片。本发明可以解决光泵浦薄片激光器结构空间大不利于用于较低功率需求或者具有空间尺寸限制的光泵浦薄片激光器的问题。
The invention discloses a cooling and packaging device for optically pumped thin-film laser gain medium. , the semiconductor refrigeration chip is connected to the heat sink substrate, a gain medium heat sink is set on the semiconductor refrigeration chip, a laser diode chip heat sink is set in the installation cavity, a laser diode chip is set on the laser diode chip heat sink, and a laser diode chip is set behind the laser diode chip. Fast-axis collimating mirror, the fast-axis collimating mirror is fixed on the diode chip heat sink with glue, a gain medium is set on one side of the fast-axis collimating mirror, and the gain medium is connected to the semiconductor refrigeration chip through the gain medium heat sink. One side of the collimating mirror is provided with a window. The invention can solve the problem that the structure space of the optically pumped thin-film laser is large, which is unfavorable for the optically-pumped thin-film laser with lower power requirements or limited space size.
Description
Technical Field
The invention belongs to the technical field of optically pumped thin-film lasers, and particularly relates to a cooling packaging device for a gain medium of an optically pumped thin-film laser.
Background
Optically pumped thin-film laser systems are one of the most promising laser systems in recent years. The existing optically pumped thin-film laser mainly comprises a pumping light source, a thin-film gain medium and a laser resonant cavity. The limitation of its output power is mainly due to thermal effects. The laser gain medium temperature typically needs to be maintained between-20 c and 20 c depending on the mode of operation of the system. For temperature sensitive laser gain media, good cooling and sealing is necessary. At present, the cooling mode of the gain medium is to cool the whole surface of the thin gain medium, the cooling surface is plated with a high-reflection film of pump light and fundamental frequency light, and the pump light is pumped from the other surface of the thin gain medium. This approach can be pumped with a high power laser source and employ a multi-pass absorbing structure to achieve very high laser power output. However, such a construction requires a large amount of space, and for applications with lower power requirements or with space size limitations, a cooling device with a compact construction is required.
Disclosure of Invention
The invention aims to: the cooling packaging device for the gain medium of the optically pumped thin-plate laser is provided for solving the problem that the structural space of the optically pumped thin-plate laser is large and is not beneficial to being used for the optically pumped thin-plate laser with lower power requirement or space size limitation.
In order to achieve the above object, the present invention provides a cooling package device for gain medium of optically pumped thin-film laser, which comprises a heat sink base plate, a shell is arranged on one side of the heat sink base plate, an installation cavity is arranged in the shell, a semiconductor refrigerating sheet is arranged in the mounting cavity and connected to the heat sink substrate, the heat sink substrate is provided with a laser diode chip heat sink, the laser diode chip heat sink is provided with a laser diode chip, a fast axis collimating lens is arranged behind the laser diode chip and connected on the heat sink of the laser diode chip, one side of the fast axis collimating mirror is provided with a gain medium, the gain medium is connected with the semiconductor refrigerating sheet through a gain medium heat sink, one side of the fast axis collimating lens is provided with a window sheet which is fixedly connected on the shell.
As a further description of the above technical solution:
the gain medium is a solid flake gain medium or a semiconductor flake gain medium.
As a further description of the above technical solution:
the gain medium is provided with a light-transmitting area, and the areas of the two surfaces of the gain medium except the light-transmitting area are provided with first gold-plated layers.
As a further description of the above technical solution:
and the pumping light injection surface of the light transmission area is plated with a pumping light antireflection film and a fundamental frequency light high reflection film.
As a further description of the above technical solution:
the gain medium heat sink is welded on the gain medium heat sink.
As a further description of the above technical solution:
the surface of the semiconductor refrigeration piece is provided with a second gold-plated layer, the refrigeration surface of the semiconductor refrigeration piece is welded and fixed with the thin gain medium heat sink, and the heat dissipation surface of the semiconductor refrigeration piece is welded with the heat sink substrate heat sink.
As a further description of the above technical solution:
and one side of the heat sink substrate, which is opposite to the shell, is provided with a semiconductor refrigerating sheet electrode, a laser diode electrode and a temperature sensing resistor electrode.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that: the heat sink substrate is a substrate for packaging T0, a light beam in the fast axis direction of a laser diode emission chip is compressed through a fast axis collimating mirror and is fixed on the heat sink of the emission chip by glue, the emission light beam points to the center of a gain medium, two surfaces of a semiconductor refrigeration sheet with an annular through hole are plated with gold, a refrigeration surface is welded and fixed with the gain medium heat sink, a hot surface is welded with the heat sink substrate heat sink, a window sheet packaged by T0 is used for sealing an integrated structure, whether the window sheet is coated with a film or not and which film system is selected according to actual application, the laser diode chip packaged by T0 and the integrated structure of the gain medium can be combined with a fundamental frequency light to form a cavity mirror resonant cavity to realize fundamental frequency laser output outside, and can be combined with a frequency doubling light output cavity mirror to form a resonant cavity to realize frequency laser output. Therefore, the invention has the advantages of integration of the pump light and the gain medium, compact structure, low-temperature control and simple packaging structure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a cooling package device for gain medium of an optically pumped thin-film laser.
Fig. 2 is a front view of a cooling package for the gain medium of an optically pumped thin-film laser.
Illustration of the drawings:
1. a heat sink substrate; 2. a housing; 3. a mounting cavity; 4. a semiconductor refrigeration sheet; 5. heat sink of laser diode chip; 6. a laser diode chip; 7. a fast axis collimating mirror; 8. a gain medium; 9. a gain medium heat sink; 91. a first gain medium heat sink; 92. a first gain medium heat sink; 10. a window sheet; 11. a light-transmitting area; 12. semiconductor refrigeration chip electrodes; 13. a laser diode electrode; 14. a temperature sensing resistive electrode.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the embodiments of the present invention, it should be noted that the terms "upper", "inner", and the like refer to orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally arranged when the products of the present invention are used, and are used only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1 and 2, the present invention provides a cooling and packaging device for gain medium of an optical pumping thin-chip laser, including a heat sink substrate 1, a housing 2 is disposed on one side of the heat sink substrate 1, a mounting cavity 3 is disposed in the housing 2, a semiconductor refrigeration chip 4 is disposed in the mounting cavity 3, the semiconductor refrigeration chip 4 is connected to the heat sink substrate 1, a laser diode chip heat sink 5 is disposed on the heat sink substrate 1, a laser diode chip 6 is disposed on the laser diode chip heat sink 5, a fast axis collimating mirror 7 is disposed behind the laser diode chip 6, the fast axis collimating mirror 7 is connected to the laser diode chip heat sink 5, a gain medium 8 is disposed on one side of the fast axis collimating mirror 7, the gain medium 8 is connected to the semiconductor refrigeration chip 4 through a gain medium heat sink 9, one side of the fast axis collimating mirror 7 is provided with a window sheet 10, and the window sheet 10 is fixedly connected to the shell 2.
The gain medium 8 is a solid sheet gain medium or a semiconductor sheet gain medium. Specifically, the gain medium is a solid thin gain medium (Yb: YAG thin sheet, Nd: YAG thin sheet and other laser crystals), the pump light injection surface of the central light transmission area is plated with a pump light antireflection film and a base frequency light high reflection film, and whether or not to plate a film and what film system to plate the film are selected according to practical application. Gold plating is carried out on the two sides except the central light-passing area; the gain medium is a semiconductor thin-sheet gain medium, and two surfaces of the gain medium are jointed by a material (diamond, silicon carbide or gem thin sheet) with high heat conductivity coefficient. And a pump light antireflection film and a fundamental frequency light high-reflection film are plated on the pump light injection surface of the bonded central light transmission region, and whether or not to coat a film and which film system are selected according to actual application on the other surface. The regions of both sides except the central light-transmitting region are plated with gold. The power of the laser light can be amplified.
The gain medium 8 is provided with a light transmission region 11, and the regions of both surfaces of the gain medium 8 except the light transmission region 11 are provided with first gold plating layers. The heat conduction and dissipation efficiency can be improved.
And the pumping light injection surface of the light transmission region 11 is plated with a pumping light antireflection film and a fundamental frequency light high reflection film. The pumping light antireflection film is positioned between the fundamental frequency light high reflection film and the light transmission area, and the transmittance of light on the surface is increased by reducing reflected light.
The gain medium 8 heat sink is welded on the gain medium heat sink 9. Specifically, the gain medium heat sink includes a first gain medium heat sink 91 and a second gain medium heat sink 92, a gap is left between the first gain medium heat sink and the second gain medium heat sink, one surface of the gain medium is welded to the first gain medium heat sink, and the other surface of the gain medium is welded to the second gain medium heat sink, so that the heat dissipation effect can be improved, and the second gain medium heat sink 92 has an inclined surface, so that the light condensation effect can be improved.
The surface of the semiconductor refrigeration piece 4 is provided with a second gold-plated layer, the refrigeration surface of the semiconductor refrigeration piece 4 is fixedly welded with the thin gain medium heat sink 9, and the heat dissipation surface of the semiconductor refrigeration piece 4 is welded with the heat sink substrate 1 in a heat sink mode. The cooling effect can be improved.
And a semiconductor refrigerating sheet electrode 12, a laser diode electrode 13 and a temperature sensing resistance electrode 14 are arranged on one side of the heat sink substrate 1 opposite to the shell. Specifically, the semiconductor refrigeration piece electrode is electrically connected with the semiconductor refrigeration piece, the laser diode electrode is electrically connected with the laser diode chip, the temperature sensing resistance electrode is electrically connected with the temperature sensor, and the semiconductor refrigeration piece electrode, the laser diode electrode and the temperature sensing resistance electrode are arranged in parallel, so that the installation space can be saved.
The working principle is as follows: the heat sink substrate is a substrate for packaging T0, a light beam in the fast axis direction of a laser diode emission chip is compressed through a fast axis collimating mirror, the fast axis collimating mirror is fixed on a heat sink of the emission chip by glue, the emission light beam points to the center of a gain medium, two surfaces of a semiconductor refrigeration sheet with an annular through hole are plated with gold, a refrigeration surface is welded and fixed with the gain medium by heat sink, a hot surface is welded with the heat sink substrate by heat sink, a window sheet packaged by T0 is used for sealing an integrated structure, whether a film is coated or not and which film system is selected according to actual application, the structure integrated by the laser diode chip packaged by T0 and the gain medium can be combined with a base frequency cavity mirror to form a resonant cavity to realize fundamental frequency laser output outside, and can be combined with a frequency doubling cavity mirror to form a resonant cavity to realize frequency doubling laser output. Therefore, the invention has the advantages of integration of the pump light and the gain medium, compact structure, low-temperature control and simple packaging structure.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (7)
1. A cooling and packaging device for gain media of an optical pumping thin-sheet laser is characterized by comprising a heat sink substrate (1), wherein one side of the heat sink substrate (1) is provided with a shell (2), the shell (2) is internally provided with a mounting cavity (3), the mounting cavity (3) is internally provided with a semiconductor refrigerating sheet (4), the semiconductor refrigerating sheet (4) is connected on the heat sink substrate (1), the heat sink substrate (1) is provided with a laser diode chip heat sink (5), the laser diode chip heat sink (5) is provided with a laser diode chip (6), a fast axis collimating mirror (7) is arranged behind the laser diode chip (6), the fast axis collimating mirror (7) is connected on the laser diode chip heat sink (5), one side of the fast axis collimating mirror (7) is provided with a gain medium (8), the gain medium (8) is connected to the semiconductor refrigeration sheet (4) through a gain medium heat sink (9), a window sheet (10) is arranged on one side of the fast axis collimating mirror (7), and the window sheet (10) is fixedly connected to the shell (2).
2. The cooling package for the gain medium of an optically pumped thin-chip laser as claimed in claim 1, wherein the gain medium (8) is a solid-state thin-chip gain medium or a semiconductor thin-chip gain medium.
3. The cooling package device of the gain medium of the optically pumped thin-chip laser as claimed in claim 1 or 2, wherein the gain medium (8) is provided with a light-transmitting region (11), and both sides of the gain medium (8) except the light-transmitting region (11) are provided with a first gold-plating layer.
4. The cooling package device for the gain medium of optically pumped thin-film laser as claimed in claim 3, wherein the pump light injection surface of the light transmission region (11) is coated with a pump light antireflection film and a fundamental frequency light antireflection film.
5. The cooling package for the gain medium of an optically pumped thin-chip laser as claimed in claim 1, wherein the gain medium (8) heat sink is soldered to the gain medium heat sink (9).
6. The cooling and packaging device for the gain medium of the optically pumped thin-chip laser according to claim 1, wherein the surface of the semiconductor refrigeration chip (4) is provided with a second gold plating layer, the refrigeration surface of the semiconductor refrigeration chip (4) is welded and fixed with the thin-chip gain medium heat sink (9), and the heat dissipation surface of the semiconductor refrigeration chip (4) is welded with the heat sink substrate (1) through heat sink welding.
7. The cooling package device of the gain medium of the optically pumped thin-chip laser as claimed in claim 1, wherein the side of the heat sink substrate (1) opposite to the housing is provided with a semiconductor chilling plate electrode (12), a laser diode electrode (13) and a temperature sensing resistor electrode (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110855444.3A CN113488838A (en) | 2021-07-29 | 2021-07-29 | Cooling packaging device for gain medium of optically pumped thin-film laser |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110855444.3A CN113488838A (en) | 2021-07-29 | 2021-07-29 | Cooling packaging device for gain medium of optically pumped thin-film laser |
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| CN113488838A true CN113488838A (en) | 2021-10-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110855444.3A Pending CN113488838A (en) | 2021-07-29 | 2021-07-29 | Cooling packaging device for gain medium of optically pumped thin-film laser |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114566858A (en) * | 2022-01-20 | 2022-05-31 | 中国科学院空天信息创新研究院 | Special-shaped laser gain medium |
| CN119581991A (en) * | 2025-02-07 | 2025-03-07 | 中国科学院长春光学精密机械与物理研究所 | A semiconductor laser packaging structure |
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| CN215896958U (en) * | 2021-07-29 | 2022-02-22 | 维林光电(苏州)有限公司 | Cooling packaging device for gain medium of optically pumped thin-film laser |
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| CN1700538A (en) * | 2004-05-20 | 2005-11-23 | 中国科学院半导体研究所 | Heat sink with bevel structure for semiconductor optical amplifier package |
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| CN114566858A (en) * | 2022-01-20 | 2022-05-31 | 中国科学院空天信息创新研究院 | Special-shaped laser gain medium |
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