CN113453479B

CN113453479B - Mobile terminals and mid-frame components

Info

Publication number: CN113453479B
Application number: CN202010217496.3A
Authority: CN
Inventors: 孙永富; 杨杰; 施健
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2020-03-24
Filing date: 2020-03-24
Publication date: 2025-10-03
Anticipated expiration: 2040-03-24
Also published as: CN113453479A

Abstract

The present application provides a mobile terminal and a midframe assembly thereof. The midframe assembly is used to support electronic devices within the mobile terminal, the electronic devices including a heat source, and the midframe assembly includes a midframe, one or more heat pipes, and a first vapor chamber. The midframe includes a heat dissipation area corresponding to the heat source, the first vapor chamber is accommodated in the heat dissipation area, and the heat pipes are connected to the first vapor chamber for dissipating heat from the first vapor chamber. The present application improves the heat dissipation performance of the mobile terminal.

Description

Mobile terminal and middle frame assembly

Technical Field

The application relates to the technical field of terminals, in particular to a mobile terminal and a middle frame component thereof.

Background

The existing mobile terminal radiates heat independently through a single hot plate or a single heat pipe, but with the increasing degree of the intelligentization of the mobile terminal, the main frequency of the mobile terminal is upgraded to generate more heat, and if the excessive heat cannot be rapidly radiated, the service life of the mobile terminal is influenced, and the visual experience of consumers is also influenced.

Disclosure of Invention

The embodiment of the application provides a terminal and a middle frame assembly thereof, which improve the heat dissipation performance of a mobile terminal.

The application provides a middle frame assembly, which is used for bearing an electronic device in a mobile terminal and comprises a heat source, wherein the middle frame assembly comprises a middle frame, one or more heat pipes and a first vapor chamber, the middle frame comprises a heat dissipation area corresponding to the heat source, the first vapor chamber is accommodated in the heat dissipation area, the first vapor chamber can be fixedly connected with the middle frame through the heat dissipation area, the specific fixing modes are not limited to the modes of fixing the heat dissipation area to the middle frame through bottom welding, fixing the heat dissipation area to the middle frame through side welding, fixing the heat dissipation area to the middle frame through bottom bonding, fixing the heat dissipation area to the middle frame through a surrounding lap joint structure or fixing the heat dissipation area to the middle frame through bottom fixing and surrounding fixing, and each heat pipe is connected to the first vapor chamber (the connecting mode between the heat pipes is not limited to the lap joint welding, the connecting mode of welding sealing after the heat dissipation and the like) and is used for dissipating heat of the first vapor chamber. According to the application, one end of the heat pipe is connected with the first soaking plate, so that the comprehensive heat conduction effect of two-dimensional expansion heat conduction of the first soaking plate and one-dimensional linear heat conduction of the heat pipe can be utilized, the heat of the heat source can be rapidly dissipated, the service life of the heat source is prolonged, the service life of the mobile terminal is prolonged, and the use experience of consumers is improved.

In a possible implementation manner, at least one heat pipe of the one or more heat pipes is further connected to a portion of the middle frame having a temperature lower than the temperature of the first soaking plate. The portion of the center having a temperature lower than the temperature of the first soaking plate may be an area of the edge of the center, for example, both side edges of the center or the bottom edge of the center. Therefore, when the mobile terminal normally operates, heat can be transferred to the first soaking plate and the heat pipe due to the fact that the first soaking plate is fixed on the middle frame, the heat transferred to the heat pipe can be transferred to the whole middle frame, the heat of the heat source can be transferred to the whole middle frame, the heat is transferred out through the middle frame, the area of the middle frame is large, the heat dissipation efficiency is high, and the heat dissipation performance of the whole mobile terminal is improved.

In a possible implementation manner, at least one heat pipe of the one or more heat pipes is connected to the middle frame through a heat conducting medium. The heat conducting medium may be a heat conducting gel or a graphite material. The heat conductivity of the heat-conducting adhesive is more than 2 times of that of the common adhesive layer, and the heat-conducting adhesive has good heat-conducting property, can rapidly transfer the heat on the heat pipe to the whole middle frame, and has high heat-radiating efficiency.

In a possible implementation manner, an inner space of at least one heat pipe of the one or more heat pipes is communicated with an inner space of the first vapor chamber to form a heat conducting cavity. The heat pipe and the first soaking plate after the communication form a larger and complete heat conducting cavity inside, the path through which the working medium in the heat conducting cavity completes one-time heat conduction circulation is longer, the time is longer, the heat of the heat source can be transferred to a larger area of the middle frame, the heat is conducted in a more dispersed mode, and the heat dissipation efficiency is high.

In one possible implementation, at least one of the one or more heat pipes is inserted inside the first vapor chamber. The heat pipe of this mode overlaps with first vapor chamber in the inside of first vapor chamber. The heat pipe and the first vapor chamber have better communication performance.

In a possible implementation manner, the electronic device further includes a battery disposed at a distance from the heat source, the middle frame further includes a battery placement area corresponding to the battery, the battery placement includes a first edge and a second edge disposed opposite to each other, the heat dissipation area is adjacent to the first edge, and at least one of the one or more heat pipes extends from the heat dissipation area toward the second edge. Therefore, the heat pipe can be extended in a larger range of the middle frame, the heat of the heat source can be transferred to a longer distance, and the heat dissipation effect is good.

In one possible implementation, at least one of the one or more heat pipes is not in contact with the battery. Therefore, when the mobile terminal normally operates, the mobile terminal generates heat, the temperature of the part of the heat pipe connected with the middle frame is smaller than that of the first vapor chamber, when the heat pipe is not in contact with the battery, the heat on the heat pipe and the battery can not be mutually transmitted, the heat pipe and the battery can not be mutually interfered, the heat pipe bypasses the battery, the placement space of the heat pipe is not required to be arranged on the surface of the battery, and the thin design of the mobile terminal is facilitated.

In a possible embodiment, the one or more heat pipes include a first heat pipe and a second heat pipe disposed at intervals, the first heat pipe surrounding the battery placement area, the second heat pipe partially overlapping the battery placement area. In the embodiment, the heat pipes are distributed on the battery placing area and the periphery of the battery placing area, so that the heat dissipation performance is enhanced.

In a possible implementation manner, the middle frame includes a top, a bottom opposite to the top, and two side walls located at the top and the bottom, the heat dissipation area is located between the first edge of the battery placement area and the top, other component placement areas are arranged between the second edge of the battery placement area and the bottom, the middle frame further includes a second soaking plate, the second soaking plate is fixed in the other component placement areas, and at least one of the one or more heat pipes is further connected with the second soaking plate. When the heat source is fixedly arranged in the heat dissipation area, the heat of the heat source can be conducted to the first vapor chamber and the heat pipe when the other heat sources are fixedly arranged in the other element arrangement area, the heat of the heat source can be conducted to the second vapor chamber and the heat pipe, and then the heat of the heat source and the heat of the other heat sources can be rapidly dissipated through the comprehensive effect of the first vapor chamber, the second vapor chamber and the heat pipe, so that the service lives of the heat source and the other heat sources are prolonged, the service life of the mobile terminal is prolonged, and the use experience of consumers is improved. Meanwhile, as the first soaking plate and the second soaking plate are fixed on the middle frame, heat of the heat source and other heat sources can be conducted to the whole middle frame, the heat is conducted out through the middle frame, the heat dissipation performance of the whole middle frame is achieved, the area of the middle frame is large, the heat dissipation efficiency is high, and the heat dissipation performance of the whole mobile terminal is improved.

In a possible implementation manner, one end of at least one heat pipe of the one or more heat pipes is lapped on the first vapor chamber, and the other end of the at least one heat pipe of the one or more heat pipes is lapped on the second vapor chamber. The implementation test provides a connection mode of the heat pipe and the first vapor chamber and the second vapor chamber, and the lap joint refers to a region which is partially overlapped between the heat pipe and the first vapor chamber and between the heat pipe and the second vapor chamber in the direction perpendicular to the first vapor chamber and the second vapor chamber.

In one possible implementation, at least one of the one or more heat pipes extends along a periphery of the battery placement region, at least a portion of the heat pipe being located within a gap between the battery placement region and a side wall of the middle frame. The gap between the battery placement area and the side wall of the middle frame is an idle space, and part of the heat pipes are accommodated in the gap between the battery placement area and the side wall of the middle frame, namely, part of the heat pipes are accommodated in the idle space, so that the idle space is utilized, and a new space is not required to be arranged in the mobile terminal for accommodating the heat pipes, and therefore the volume of the mobile terminal is not increased.

In one possible implementation, at least one of the one or more heat pipes is also in contact with a surface of the battery. Therefore, heat on the battery can be transferred to the heat pipe, and then transferred to the whole middle frame, so that the heat dissipation of the middle frame to the battery is realized, the heat dissipation area is large, and the heat dissipation effect is good.

In a possible implementation manner, the one or more heat pipes include at least a first heat pipe and a second heat pipe that are disposed at intervals, and the first heat pipe and the second heat pipe are disposed around the battery placement area. When the first heat pipe and the second heat pipe are arranged around the battery placing area, the space between the battery placing area and the side wall is utilized, the two heat pipes are not overlapped with the battery placing area, the thickness of the middle frame is not affected, and when the battery is placed in the mobile terminal, the heat pipes are not overlapped with the battery, and the thickness of the mobile terminal is not affected.

In a possible implementation manner, at least one heat pipe of the one or more heat pipes includes at least a first heat pipe and a second heat pipe that are disposed at intervals, the first heat pipe surrounds the battery placement area, and the second heat pipe is lapped on the battery placement area. Therefore, the heat dissipation effect of the two heat pipes can be utilized, the heat dissipation area of the middle frame is larger, the heat dissipation effect is good, the heat of the heat source can be dissipated more quickly, the service life of the heat source is prolonged, the service life of the mobile terminal is prolonged, the use experience of consumers is improved, and the space between the battery placement area and the side wall of the middle frame and other spaces can be effectively utilized. Moreover, the mode that the second heat pipe is lapped on the battery placement area is convenient for the installation of the second heat pipe, and is convenient for operation, and the second heat pipe can be used for radiating the heat of the battery.

In a possible implementation manner, the middle frame is provided with a first cutting area and a third cutting area, the third cutting area is formed at the bottom of the first cutting area, the first soaking plate is embedded in the first cutting area, at least one heat pipe of the one or more heat pipes is partially embedded in the third cutting area, at least one heat pipe of the one or more heat pipes in the part of the third cutting area is laminated with the first soaking plate, the first cutting area is a groove or a hole, and the second cutting area is a groove or a hole. In this embodiment, a part of the heat pipe is located between the first soaking plate and the heat source, and in the case that the first and second cutout areas are in a groove structure, the openings of the first and second cutout areas face to one side of the middle frame facing away from the heat source, and the heat source, the heat pipe and the first soaking plate are separated by the middle frame, and the middle frame is used for supporting the heat source.

In a possible implementation manner, the middle frame is provided with a first cutting area, a second cutting area and a third cutting area, the first soaking plate is embedded in the first cutting area, the second soaking plate is embedded in the second cutting area, at least one heat pipe of the one or more heat pipes is embedded in the third cutting area, the first cutting area is a groove or a hole, the second cutting area is a groove or a hole, and the third cutting area is a groove or a hole. The mode that the vapor chamber and the heat pipe are embedded into the hollowed-out area ensures that the thickness of the middle frame is not increased by the first vapor chamber, the second vapor chamber and the heat pipe, and the mobile terminal can be thinner. It will be appreciated that the first, second and third cutout regions may be provided in one embodiment at the same time, or in other embodiments, one or two of these three cutout regions may be selected, depending on the particular structural configuration within the mobile terminal, e.g., where there is a gap between just the electronics, the heat pipe may be placed, thus eliminating the need for the third cutout region. The architecture is beneficial to the overall thin design of the mobile terminal and can reduce the weight of the mobile terminal.

In a possible implementation manner, at least one heat pipe of the one or more heat pipes is communicated with the first soaking plate, that is, the inner spaces of the heat pipes are mutually connected to form a larger heat conducting cavity. The heat pipe and the first soaking plate after the communication form a larger and complete heat conducting cavity inside, the path through which the working medium in the heat conducting cavity completes one-time heat conduction circulation is longer, the time is longer, the heat of the heat source can be transferred to a larger area of the middle frame, the heat is conducted in a more dispersed mode, and the heat dissipation efficiency is high. The heat pipe and the second vapor chamber can also be arranged as a communicated structure.

In a possible implementation manner, the thickness of the first vapor chamber is increased in a stepwise manner, and/or the thickness of the second vapor chamber is increased in a stepwise manner. This can be correspondingly adapted to electronic devices with a stepwise decreasing height.

In one possible implementation manner, the number of the heat pipes, the first vapor chamber and the second vapor chamber is not limited to one, and may be two or more, and the configuration may be performed according to specific heat dissipation requirements in the mobile terminal.

In a possible implementation manner, a heat conducting film is arranged on the outer surface of any one or more of at least one heat pipe of the one or more heat pipes, the first vapor chamber and the second vapor chamber. The heat conducting film is arranged to enable the heat conduction speed of the heat pipe and the heat soaking plate to be higher than that of the heat conduction speed of the heat pipe and the heat soaking plate to the outside.

In a possible implementation manner, the middle frame is provided with a groove, the first vapor chamber is accommodated in the groove, and the first vapor chamber and the groove bottom are fixed through heat-conducting glue. In a specific embodiment, the middle frame includes a first overlap edge extending into the slot, and the first soaking plate includes a third overlap edge, and the first overlap edge is overlapped and fixed with the third overlap edge.

It will be appreciated that the intermediate frame may also include a second overlap edge for securing a second vapor chamber. The first soaking plate comprises a third joint edge, the first joint edge is in lap joint with the third joint edge, so that the first soaking plate is fixed on the heat dissipation area, and the first joint edge and the third joint edge can be fixed through welding. Also, the second soaking plate may include a fourth overlap edge, and the second overlap edge overlaps the fourth overlap edge so that the second soaking plate is fixed on the other component placement area. The fixing mode is easy to realize and good in fixing effect.

Specifically, in an embodiment, in the scheme of fixedly connecting the first vapor chamber and the middle frame through the joint edge, the groove formed in the middle frame can be a hole, and when the groove is a hole, the middle frame has no part for bearing the first vapor chamber, but the connection between the first vapor chamber and the middle frame can be realized through the joint edge.

In other embodiments, the first groove formed on the middle frame may be blind hole, i.e. the first groove is not a hole, so that a part of the middle frame has a structure, which may be referred to as a bearing part, and may be used for bearing the first soaking plate, where the first soaking plate is fixed to the bearing part of the middle frame through heat-conducting glue. In this embodiment, the first vapor chamber and the middle frame are fixed by the heat conductive adhesive and the overlap structure.

In a possible implementation, at least one of the one or more heat pipes extends between the electronic devices and/or at least one of the one or more heat pipes extends between the electronic devices and a boundary of the middle frame. Therefore, the heat pipe can be accommodated by utilizing the gap between the electronic devices and the boundary of the middle frame, and a new space is not required to be added for accommodating the heat pipe, so that the thickness of the mobile terminal is not required to be increased.

The application provides a mobile terminal, which comprises a main board and the middle frame, wherein the main board comprises an electronic device, the main board is arranged in the middle frame, and the heat source of the main board is arranged in a heat dissipation area of the middle frame. The heat on the mobile terminal can be rapidly dissipated, the service life of the mobile terminal is prolonged, and the use experience of consumers is improved. Meanwhile, as the first soaking plate is fixed on the middle frame, heat of the heat source can be conducted to the whole middle frame, the heat is conducted out through the middle frame, the heat dissipation performance of the whole middle frame is achieved, the area of the middle frame is large, the heat dissipation efficiency is high, and the heat dissipation performance of the whole mobile terminal is improved.

In a possible implementation manner, the mobile terminal further comprises a screen, a main board, a battery and a battery cover, the middle frame further comprises a battery placement area corresponding to the battery, the battery placement area is arranged on one side of the heat dissipation area, the screen and the main board are respectively arranged on two opposite sides of the middle frame, the heat source of the main board is arranged in the heat dissipation area of the middle frame, the battery is electrically connected with the main board, the battery is arranged on one side, deviating from the middle frame, of the main board, and is arranged in the battery placement area, the battery cover is arranged on the middle frame, and the main board and the battery are fixed in the middle frame by the battery cover.

In a possible implementation manner, a wire slot is arranged on the outer surface of the heat pipe, the wire slot is used for fixing an inner wire of the mobile terminal, and the wire is used for electrically connecting electronic devices in the mobile terminal. For example, the wires are used to electrically connect the electronic devices in the heat dissipation area with the electronic devices in the other component placement area. The wire groove on the surface of the heat pipe can be used as a carrier of the wire, so that the wire can be fixed in the wire groove of the heat pipe, the position of the wire is fixed, the wire is prevented from being damaged due to shaking, and the service life of the mobile terminal is prolonged.

In a second aspect, the present application further provides a mobile terminal, including a main board and any one of the foregoing center assemblies, where the heat source is disposed on the main board, and the main board is mounted on the center.

In a third aspect, the present application further provides a heat dissipating assembly, which includes the first aspect and at least one vapor chamber and at least one heat pipe in various implementation manners of the first aspect, where a connection manner between the at least one vapor chamber and the at least one heat pipe may refer to the foregoing aspect and the implementation manner, and are not repeated herein. The heat dissipation assembly provided in this aspect may be matched with a middle frame in a mobile terminal as described in the foregoing aspect to achieve better heat dissipation, and in other implementations, may also be matched with other devices of other apparatuses to achieve better heat dissipation.

In summary, according to the application, one end of the heat pipe is connected with the first soaking plate, so that the comprehensive heat conduction effect of two-dimensional expansion heat conduction of the soaking plate and one-dimensional linear heat conduction of the heat pipe can be utilized, the heat of the heat source can be rapidly dissipated, the service life of the heat source is prolonged, the service life of the mobile terminal is prolonged, and the use experience of consumers is improved. Meanwhile, as the first soaking plate is fixed on the middle frame, heat of the heat source can be conducted to the whole middle frame, the heat is conducted out through the middle frame, the heat dissipation performance of the whole middle frame is achieved, the area of the middle frame is large, the heat dissipation efficiency is high, and the heat dissipation performance of the whole mobile terminal is improved.

Drawings

In order to more clearly describe the embodiments of the present application or the technical solutions in the background art, the following description will describe the drawings that are required to be used in the embodiments of the present application or the background art.

Fig. 1a is a schematic cross-sectional view of a mobile terminal according to an embodiment of the present invention;

fig. 1b is another schematic cross-sectional view of a mobile terminal according to an embodiment of the present invention;

FIG. 2 is a schematic top view of a center frame assembly according to an embodiment of the present invention;

FIG. 3 is a schematic top view of a first configuration of a center frame assembly according to an embodiment of the present invention;

FIG. 4 is a schematic top view of a second configuration of a center frame assembly according to an embodiment of the present invention;

FIG. 5 is a schematic cross-sectional view of a heat pipe overlapping a first vapor chamber;

FIG. 6 is a schematic cross-sectional view of a heat pipe in communication with a first vapor chamber;

FIG. 7 is a schematic sectional view of the first vapor chamber with a stepwise increasing thickness;

FIG. 8 is a schematic top view of a third structure of a middle frame according to an embodiment of the present invention;

FIG. 9 is a schematic cross-sectional view of a heat pipe overlapping a first vapor chamber and a second vapor chamber;

FIG. 10 is a schematic cross-sectional view of a heat pipe in communication with a first vapor chamber and a second vapor chamber;

FIG. 11 is a schematic top view of a fourth configuration of a center frame assembly according to an embodiment of the present invention;

FIG. 12 is a schematic top view of a fifth configuration of a center frame assembly according to an embodiment of the present invention;

fig. 13 is a schematic top view of a sixth structure of a middle frame assembly according to an embodiment of the present invention.

Detailed Description

Embodiments of the present application will be described below with reference to the accompanying drawings in the embodiments of the present application.

Referring to fig. 1a, fig. 1b and fig. 2, fig. 1a and fig. 1b are schematic cross-sectional views of two mobile terminals according to an embodiment of the present invention. Mobile terminals include, but are not limited to, tablet computers, cell phones, watches, electronic readers, remote controls, personal computers (Personal Computer, PCs), notebook computers, vehicle-mounted devices, web televisions, and wearable devices. The mobile terminal may include a main board 10, a screen 20, a battery 30, a middle frame assembly 40, and a battery cover 110.

Motherboard 10 may include a variety of electronic devices, some of which (e.g., various processors) generate relatively large amounts of heat during operation, and which typically require heat removal (e.g., mounting a number of heat sinks), which are referred to herein as heat sources.

As shown in fig. 1b, the middle frame assembly 40 may include a middle frame 401, a heat pipe 60, and a first Vapor Chamber (VC) 70. The middle frame 401 is an internal support of the device and can be used to carry the screen 20, the motherboard 10 and other electronic devices. The screen 20 and the main board 10 are respectively installed at two opposite sides of the middle frame 401, the battery 30 and the main board 10 are located at the same side of the middle frame 401, the battery 30 is electrically connected with the main board 10, the battery cover 110 and the middle frame 401 enclose a containing space, the main board 10, the battery 30 and other electronic devices are contained in the containing space, and the other electronic devices can be a camera, a key, a loudspeaker and the like. The material of the middle frame 401 may be a metal material with a certain hardness, such as an aluminum alloy.

The heat pipe 60 and the first soaking plate 70 are integrated on the middle frame 401 to form the middle frame assembly 40 so as to improve the heat dissipation performance of the mobile terminal. The vapor chamber and the heat pipe are both provided with vacuum heat conducting cavities, the inner walls of the heat conducting cavities are provided with capillary structures, working media are injected into the heat conducting cavities, and the working media can be pure water. The working principle of VC, heat pipe and other two-phase heat dissipating components is similar, including four main steps of conduction, evaporation, convection and solidification, and the vapor-liquid heat dissipating components are illustrated by taking a vapor-liquid heat dissipating board as an example, wherein heat generated by a heat source enters the vapor-liquid heat dissipating board through heat conduction, a working medium close to the heat source absorbs the heat and is quickly vaporized, a large amount of heat is taken away, the latent heat of the vapor is utilized, when the vapor in the board is diffused from a high-pressure area (namely a high-temperature area) to a low-pressure area (namely a low-temperature area), the vapor is quickly condensed into a liquid state and releases heat energy when the vapor contacts the inner wall with lower temperature, and the condensed working medium returns to the heat source through capillary force action of a microstructure, so that one-time heat conduction cycle is completed, and a two-way circulation system with vapor and liquid phases of the working medium is formed. The soaking area is larger than that of the heat pipe, so that two-dimensional expansion heat conduction can be realized, the width of the heat pipe is relatively narrow, and one-dimensional linear heat conduction can be realized, and particularly one-dimensional heat conduction is realized along the extending direction of the heat pipe. The heat pipe is usually made of metal, such as aluminum or copper. The material of the soaking plate is also usually metal, for example, copper can be selected.

In the present application, the physical parameters of the heat pipe 60 and the vapor chamber (such as the first vapor chamber 70) may be the same, or may be at least one physical parameter different, such as one or more of different combinations of shell materials, different internal working materials, different capillary structures (capillary layer cross-sectional areas), etc., working materials (i.e. the filling amount of the working materials), working materials types, pipes (which may be copper or aluminum) of the heat pipe 60, and thicknesses.

Referring now to fig. 2, fig. 2 is a schematic top view of a middle frame 401 according to an embodiment of the present application. The middle frame 401 includes a top 401a, a bottom 401b disposed opposite to the top 401a, and two opposite side walls 401c and 401d disposed between the top 401a and the bottom 401b, wherein the top 401a, the bottom 401b, and the two side walls 401c refer to four sides of the periphery of the middle frame (four sides in the schematic diagram shown in fig. 2, actually, the middle outer surface of the middle frame from a perspective view, which are the rim surfaces of the connection between the screen and the rear cover of the mobile terminal). In the mobile terminal, for example, the middle frame is approximately rectangular, and two side walls 401c are long sides of the middle frame. The middle frame 401 may include a heat dissipation area 402 corresponding to the heat source 101, a battery placement area 403 corresponding to the battery 30, and other component placement areas 404. The heat dissipation area 402 is located between the cell placement area 403 and the top 401a, and the other component placement area 404 is located between the cell placement area 403 and the bottom 401 b. In other embodiments, the heat dissipation area 402 may also be located between the battery placement area 403 and one of the sidewalls 403 a.

The heat dissipation area 402 is configured to provide a portion of the space for mounting one or more heat sinks (e.g., VC, or heat pipes, etc.) for dissipating heat from a heat source. For example, the heat dissipation area 402 may be a cutout area on the middle frame 401, that is, an area where a portion of the middle frame material is cutout, specifically, a "groove" may be formed by cutting out a portion of the middle frame material, or a "hole" may be formed by cutting out all of the middle frame material, or, in other embodiments, the material on the heat dissipation area 402 may not be cutout. For the thin design of the mobile terminal, holes may be dug in the middle frame 401, and the dug areas may be used to accommodate a heat source (such as a processor) on a motherboard, and then VC is installed on the heat source to dissipate heat from the heat source. The heat dissipation area 402 may be a solid area on the middle frame 401, and no hole is dug, but the heat source or VC may be accommodated by grooving (for example, VC and the heat source are accommodated by grooving both the front and the back, or VC or the heat source is accommodated by grooving only one side). In other embodiments, either neither the holes nor the slots may be drilled, or both the holes and the slots may be drilled (either the slots and the holes may be simultaneously provided in a single area or the slots and holes may be spaced apart). Likewise, the battery placement area 403 and the other component placement area 404 may be hollowed out areas or solid areas or a combination of the two areas on the middle frame 401. The "groove" in the present application refers to a recessed structure that does not penetrate the middle frame, and the shape is not limited (for example, the shape may be rectangular, square, circular, or various irregular shapes), and the "hole" (also referred to as "hole" or "opening") in the present application refers to a structure that penetrates the middle frame, and the shape is not limited.

The battery placement area 403 includes a first edge 403a, a second edge 403b, a third edge 403c, and a fourth edge 403 d. The heat dissipation area 402 is located between the first edge 403a of the cell placement area 403 and the top 401 a. Other component placement areas 404 are arranged between the second edge 403b of the battery placement area 403 and the bottom 401b, a gap 50 is arranged between the battery placement area 403 and the side wall 401c of the middle frame 401, and electronic devices are not arranged at the position between the battery placement area 403 and the side wall 401c of the middle frame 401 generally.

Specifically, a first gap 501 is provided between the third edge 403c and the first sidewall 401c, and a second gap 502 is provided between the fourth edge 403d and the second sidewall 401 d. The middle frame 401 at the positions of the first gap 501 and the second gap 502 may be provided with a groove or a hole, the hole is hollowed on the middle frame to form a through hole, the purpose of the groove and the hole may be to thin the design of the mobile terminal, or reduce the weight of the middle frame 401, but to ensure the rigidity of the middle frame 401, the groove or the hole may be provided at a proper position, and the thickness may be reserved at a proper position, so as to ensure the rigidity of the whole middle frame 401, so that the middle frame is not easy to deform, and the electronic device may be carried.

Referring to fig. 3, fig. 3 is a schematic top view of the middle frame assembly 40. The first vapor chamber 70 is accommodated in the heat dissipation area 402, specifically, the first vapor chamber 70 may be fixedly connected with the middle frame 401 at the heat dissipation area 402, and the specific fixing manner is not limited to the following manner, that is, the first vapor chamber may be fixed to the middle frame 401 by bottom welding, the first vapor chamber may be fixed to the middle frame 401 by side welding, the first vapor chamber may be fixed to the middle frame 401 by bottom bonding, or the first vapor chamber may be fixedly connected to the middle frame 401 by a surrounding lap joint structure, or the first vapor chamber may be connected to the middle frame 401 by bottom fixing and surrounding fixing. The heat pipe 60 is connected to the first vapor chamber 70, and is used for dissipating heat from the first vapor chamber 70, and the connection mode between the two is not limited to the modes of lap welding, welding and sealing after communication. The thickness of the first soaking plate 70 may be 0.8mm or less, the nominal pipe diameter of the heat pipe 60 may be 8mm or less, and the thickness of the heat pipe 60 may be 0.6mm or less in order to satisfy the mobile terminal that it may be thinner. The small-sized heat pipe 60 can extend between the electronic devices or between the electronic devices and the side wall of the middle frame 401, and utilizes the space between the electronic devices and the gap between the electronic devices and the side wall of the middle frame 401, thereby improving the heat dissipation performance and being beneficial to the miniaturization design of the mobile terminal. The thickness of the first vapor chamber 70 may be the same as or different from the thickness of the heat pipe 60. The heat pipe 60 can be made to be of different thickness, different width, bent, formed with a step, etc., as determined by the specific use scenario.

According to the application, one end of the heat pipe 60 is connected with the first vapor chamber 70, so that the comprehensive heat conduction effect of two-dimensional expansion heat conduction of the vapor chamber and one-dimensional linear heat conduction of the heat pipe 60 can be utilized, the heat of the heat source 101 can be rapidly dissipated, the service life of the heat source 101 is prolonged, the temperature of the heat source is reduced, the service life of the mobile terminal is prolonged, the temperature in the use process is reduced, and the use experience of consumers is improved. Meanwhile, the first vapor chamber 70 can be fixed on the middle frame 401, for example, the first vapor chamber 70 can be fixedly connected to the middle frame 401 in a welding mode, heat of the heat source 101 can be conducted to the whole middle frame 401 through the first vapor chamber 70, heat is conducted out through the middle frame 401, the area of the middle frame assembly 40 is large, heat dissipation efficiency is high, and heat dissipation performance of the whole mobile terminal is improved.

In the present application, the fixing manner of the first vapor chamber 70 in the heat dissipation area 402 includes, but is not limited to, the following two manners.

First, the heat dissipation area 402 is a hole, so that even if the thickness of the first vapor chamber 70 is thicker, the hole can accommodate the thicker first vapor chamber 70, and the first vapor chamber 70 does not increase the thickness of the middle frame assembly 40. Moreover, the provision of the holes may be made to a greater extent so that the first soaking plate 70 does not increase the thickness of the center frame assembly 40. Meanwhile, for better heat dissipation and fixation, the first soaking plate 70 may also be fixedly connected with the middle frame 401 through a lap joint structure. Specifically, the middle frame 401 includes a first overlap edge 401a, the first overlap edge 401a extends towards the hole, the first vapor chamber 70 includes a third overlap edge 70a, the third overlap edge 70a is protruding on the periphery of the first vapor chamber 70, the first overlap edge 401a overlaps with the third overlap edge 70a, and at the overlapping position of the first overlap edge 401a and the third overlap edge 70a, the first vapor chamber 70 is fixed by welding or by adhesive, so that the first vapor chamber 70 is fixed on the middle frame 401 (see fig. 1 b). The first vapor chamber is also used for being connected with a heat source and radiating heat, for example, by means of heat conduction adhesive.

The second type is that the heat dissipation area 402 is a groove, that is, the heat dissipation area 402 also retains a part of middle frame material with a certain thickness for carrying the first vapor chamber 70, the first vapor chamber 70 is embedded in the groove, the first vapor chamber 70 can be fixed and adhered to the bottom wall of the groove through heat conducting glue, that is, the first vapor chamber 70 and the middle frame 401 are fixed through the heat conducting glue, and the fixing structure needs thicker heat conducting glue. In another embodiment, the heat-conducting glue may be set to be a thinner layer, and meanwhile, by setting a lap structure on the middle frame 401 and setting a lap structure on the edge of the first vapor chamber 70, a lap fixing scheme is formed by matching the lap structure of the middle frame 401 (see the lap structure of the first fixing mode for specific reference) with the lap structure of the first vapor chamber, and the lap fixing scheme and the heat-conducting glue are used together to fix the first vapor chamber 70 to the middle frame 401. This way of embedding the first soaking plate 70 into the groove allows the first soaking plate 70 not to increase the thickness of the middle frame assembly 40, the middle frame assembly 40 can be thinner, and the mobile terminal can be thinner. It can be appreciated that the heat dissipation area 402 is further configured to be connected to a heat source to dissipate heat from the heat source, for example, by way of a heat conducting adhesive, and direct heat generated by the heat source to the heat dissipation area 402 in the middle frame, and then dissipate heat through a first soaking plate fixed on the heat dissipation area 402.

In the present application, the number of heat pipes 60 is at least one, and the number of first vapor chamber 70 is at least one. One or more of these may be selected based on actual engineering design requirements (e.g., internal space layout, heat dissipation requirements, etc.), etc. For example, in the implementation shown in fig. 3, the heat pipe 60 is one, and the vapor chamber is one (i.e., the first vapor chamber 70). It is understood that when the number of the heat pipes 60 is plural, or the number of the soaking plates is plural, the heat dissipation area of the middle frame assembly 40 can be increased, and the heat dissipation efficiency is high. In one embodiment, a heat pipe 60 and a vapor chamber (first vapor chamber 70) will be described.

The connection relationship of the heat pipe 60 and the first vapor chamber 70 will be described in detail as follows.

With continued reference to fig. 3, the middle frame assembly 40 shown in fig. 3 includes a middle frame 401, a heat pipe 60, and a soaking plate (first soaking plate 70). The heat pipe 60 includes a first section 60a and a second section 60b disposed opposite the first section 60a, the first section 60a and the second section 60b referring to a solid region of the heat pipe 60 extending from end to end in opposite directions. Specifically, in the embodiment shown in fig. 3, the heat pipe includes two ends, a first section 60a connected to a first soaking plate 70, and a second section 60b, which is a free end, may be connected in whole or in part to other relatively cool devices (e.g., a center, battery, or other electronic device) that are relatively cool with respect to the first soaking plate. In another embodiment, the heat pipe 60 may have multiple branches and thus multiple ends, and in this case, there may be more segments, some of which may be connected to the first soaking plate 70, and others to other devices that are cooler than the first soaking plate.

After the heat source 101 operates to generate heat, the heat may be transferred to the first vapor chamber 70 (assuming that the heat dissipation area 402 is a hole, the first vapor chamber 70 is connected to the heat source through the hole, or the first vapor chamber 70 is accommodated in the hole and connected to the heat source), the heat on the first vapor chamber 70 may be transferred to the second section 60b along the first section 60a of the heat pipe 60, the second section 60b is relatively far away from the heat source 101, the second section 60b may dissipate the heat relatively fast, and then the heat of the heat source 101 may be transferred to the whole heat pipe 60, so that the heat conduction cycle may be completed in the whole heat pipe 60, the heat dissipation area is large, the heat dissipation efficiency is high, and the heat dissipation performance of the whole mobile terminal is improved. It will be appreciated that when the heat generated by the heat source 101 is small, the heat may be transferred to a location between the first and second sections 60a, 60b, and a single heat transfer cycle may be completed. In addition, when the first vapor chamber 70 and the middle frame 401 are fixed by some heat conduction manner (such as welding or heat conducting glue bonding), the heat on the first vapor chamber 70 can also be transferred to the whole middle frame 401, and the heat is further dissipated through the middle frame 401.

In other embodiments, both the heat pipe 60 and the vapor chamber (e.g., the first vapor chamber 70) may be secured to the center 401 (as shown in fig. 1 b), and heat generated by operation of the heat source 101 may be transferred to the first section 60a of the heat pipe 60 first, the first section 60a of the heat pipe 60 transfers heat to the first vapor chamber 70, and the second section 60b of the heat pipe 60. In other embodiments, since the heat source 101 may include electronic devices with different heights, a higher electronic device may directly contact the first vapor chamber 70, a gap may be formed between a smaller electronic device and the first vapor chamber 70, and the heat pipe 60 may be disposed at the position of the gap. Both the first section 60a of the heat pipe 60 and the first soaking plate 70 may contact the heat source 101, so that heat generated by the operation of the heat source 101 may be transferred to both the first section 60a of the heat pipe and the first soaking plate 70. The heat pipes 60 can be arranged in a smaller space to transfer heat to a non-heating area of the mobile terminal, and the two-dimensional heat conduction of the first vapor chamber 70 can be utilized to achieve good heat conduction effect and transfer heat to a low-temperature area of the mobile terminal through the second section 60b of the heat pipes 60.

According to the application, the heat pipe 60 is combined with the first vapor chamber 70, and the second section 60b of the heat pipe is used for transferring heat to a region with lower temperature in the mobile terminal, so that efficient heat dissipation is realized. The heat pipe 60 extends from the heat dissipation area 402 toward the second edge 403 b. That is, the heat pipe 60 extends in a direction from the first edge 403a to the second edge 403b of the battery placement region 403, and the second section 60b of the heat pipe 60 may be located between the first edge 403a and the second edge 403b (shown in fig. 3). It is understood that the second section 60b of the heat pipe 60 may also be located beyond the second edge 403b and at the other component placement area 404 (as shown in fig. 4), and that the gap between the battery placement area 403 and the side wall 401c of the middle frame 401 and the other component placement area 404 may be considered as areas of lower temperature, both of which are lower temperature than the temperature at the heat dissipation area 402.

With continued reference to fig. 3, fig. 3 shows that the heat pipe 60 extends along the periphery of the battery placement area 403, and the periphery of the battery placement area 403 may be between the battery placement area 403 and the side wall of the middle frame 401, or may be an area between the battery placement area 403 and the heat dissipation area 403. When the heat pipe 60 extends along the periphery of the battery placement area 403, the heat pipe 60 will not overlap the battery placement area 403, will not affect the thickness of the middle frame assembly 40, and when the battery is placed in the mobile terminal, the heat pipe 60 will not contact the battery, and will not affect the thickness of the mobile terminal.

Specifically, the heat pipe 60 is connected to a portion of the middle frame 40 having a temperature lower than that of the first soaking plate 70, without being in contact with the battery. That is, when the mobile terminal is operating normally, the mobile terminal generates heat, the temperature of the portion of the heat pipe 60 connected to the middle frame 401 is less than that of the first soaking plate 70, the portion of the middle frame 401 less than that of the first soaking plate 70 may be the portion of the middle frame 401 away from the first soaking plate 401, that is, the heat pipe 60 is also connected to the side of the middle frame 401 away from the first soaking plate 401, the heat dissipation area of the middle frame 401 is large, the heat dissipation efficiency is high, and when the heat pipe 60 is not in contact with the battery, the heat on the heat pipe 60 and the battery will not be transferred to each other. The heat pipe 60 does not overlap the battery and does not affect the thickness of the mobile terminal. It will be appreciated that the first soaking plate 70 is used to radiate heat from the heat source 101, such as a CPU, and the portion of the middle frame assembly 40 having a temperature lower than that of the first soaking plate 70 may be located in a bottom area of the mobile terminal, or in areas near the boundary of the middle frame assembly 40, where antennas, keys, speakers, etc. may be located, where the temperature of the heat pipe 60 may be lower than that of the first soaking plate 70 during normal operation of the mobile terminal, or where elements connected to these areas may be connected to the heat pipe 60.

In one embodiment, the gap 50 between the battery placement area 403 and the side wall 401c of the middle frame 401 is a free space, and a portion of the heat pipe 60 can be accommodated in the gap 50 between the battery placement area 403 and the side wall 401c of the middle frame 401, that is, a portion of the heat pipe 60 is accommodated in the free space, which not only uses the free space, but also does not need to provide a new space in the mobile terminal for accommodating the heat pipe 60, so that the volume of the mobile terminal is not increased. In other embodiments, more gaps, such as gaps between electronic devices, are provided between the battery placement area 403 and the top 401a of the middle frame 401, and a portion of the heat pipe 60 may be accommodated in and extend in the gaps, where the gaps may be a side of the middle frame 40 corresponding to the motherboard 10.

Referring to fig. 5-6, fig. 5-6 show the connection relationship between the heat pipe 60 and the first vapor chamber 70. The connection relationship between the heat pipe 60 and the first vapor chamber 70 includes, but is not limited to, the following three types.

First, as shown in fig. 5, the heat pipe 60 is overlapped with the first soaking plate 70 in a direction perpendicular to the plate surface of the first soaking plate 70. Specifically, the first section 60a is overlapped to the first vapor chamber 70 in a direction perpendicular to the first vapor chamber 70, that is, the first section 60a is located outside the first vapor chamber 70 and overlapped with a part of the first vapor chamber 70, and the two sections can be connected by heat conducting glue to increase heat conducting property. The overlapping joint of the heat pipe 60 and the first vapor chamber 70 can transfer the heat of the heat source 101 transferred to the first vapor chamber 70 to the heat pipe 60 in a heat conduction mode, so that the heat can be quickly transferred, and the connection mode of the heat pipe 60 and the first vapor chamber 70 is simple and easy to operate. In a specific implementation, the heat pipe 60 and the first vapor chamber 70 may have the same working medium. Of course, different working mediums may be disposed in the heat pipe 60 and the first vapor chamber 70, for example, a first working medium may be disposed in the heat pipe 60, a second working medium may be disposed in the first vapor chamber 70, where the first working medium is different from the second working medium, for example, the first working medium may be methanol, R134A, acetone, etc., and the second working medium may be water, etc. The heat pipe 60 and the first soaking plate 70 may be connected by a heat conductive medium. The heat conducting medium can be heat conducting glue or graphite material. The heat conductivity of the heat-conducting adhesive can reach more than 1W/m.K, and the heat conductivity of the heat-conducting adhesive is more than 2 times of that of a common adhesive layer, so that the heat-conducting adhesive has good heat-conducting property.

Second, as shown in fig. 6, the heat pipe 60 communicates with the first soaking plate 70. Specifically, a first cavity 7 is arranged in the first vapor chamber 70, a second cavity 6 is arranged in the heat pipe 60, a first section 60a extends into the first vapor chamber 70, holes can be punched in the first vapor chamber 70, and the first section 60a of the heat pipe 60 extends into the holes and is fixed by welding and sealing. The first section 60a extends into the first vapor chamber 70, so that the inner space of the first vapor chamber 70 is communicated with the inner space of the vapor chamber 60 to form a complete larger heat conducting cavity. As shown in fig. 6, the heat pipe and the first vapor chamber after being communicated form a larger and complete heat conducting cavity inside, the capillary structure a in the first vapor chamber 70 is connected with the capillary structure b in the heat pipe 60, the working medium in the heat conducting cavity completes a heat conduction cycle to pass through a longer path, the time is longer, the heat of the heat source can be transferred to a larger area of the middle frame, the heat is conducted out in a more dispersed mode, and the heat dissipation efficiency is high. It can be understood that in the state where the first soaking plate 70 and the heat pipe 60 are communicated, the conducting path extending the heat conducting medium in the heat conducting cavity is equivalent, and the temperature can be uniformly maintained between the heat source concentration area and the area with lower temperature in the terminal, so that the structure has better temperature uniformity effect.

Third, the first section 60a is connected to the side edge of the first vapor chamber 70, and the first vapor chamber 70 and the first section 60a may be welded and fixed by other connectors, or the first section 60a may be fixedly connected to a lap joint edge disposed at the outer edge of the first vapor chamber 70.

In the present application, there may be a difference in the heights of the electronic devices in the mobile terminal, such as the difference in the heights of the devices forming the heat source 101, which makes the partial region of the center 40 thicker and the partial region thinner, and thus the thickness of the vapor chamber in the present application may also be uneven. For example, referring to fig. 7, the first vapor chamber 70 includes three portions with different thicknesses, the first chambers 7 in the first vapor chamber 70 are also distributed in a state of having different volumes, and the first chambers 7 are provided with capillary structures a in a stepwise manner. A plurality of support columns are also distributed in the first cavity 7 of the first vapor chamber 70 and are used for supporting the first cavity 7 so as to prevent the first vapor chamber 70 from deforming and reduce the inner space of the first cavity. In this embodiment, the thickness of the first vapor chamber 70 is increased in steps, so that the vapor chamber can be adapted to electronic devices with height decreasing in steps, and the volume of the vapor chamber inside the first vapor chamber 70 is gradually increased, the flowing range of the working medium is larger, and the heat dissipation effect is better. It is understood that the thickness of the first vapor chamber 70 may be uneven in other manners, such as the thickness of the first vapor chamber 70 exhibits uniform height staggering, or uneven height staggering, so as to correspond to electronic devices with different heights, and the thickness of the first vapor chamber 70 may also be linearly decreased or linearly increased. The thickness of the first soaking plate 70 of the present application is determined according to the height of the electronic device in a specific use environment.

The application can realize that two-phase components (the heat pipe 60 and the vapor chamber) with different thicknesses are adopted in different areas, and two-phase components (the heat pipe 60 and the vapor chamber) with different widths are adopted in different areas, so that the flexible layout of the two-phase components (the heat pipe 60 and the vapor chamber) on the mobile terminal middle frame 40 is realized.

Referring to fig. 8, fig. 8 is a schematic top view of a middle frame assembly 40, in which the middle frame assembly 40 includes a heat pipe 60 and two soaking plates (a first soaking plate 70 and a second soaking plate 80). The second vapor chamber 80 is fixed in the other component placement area 404, and the heat pipe 60 connects the first vapor chamber 70 and the second vapor chamber 80. In this embodiment, the first section 60a of the heat pipe 60 is fixedly connected with the first vapor chamber 70, the second section 60b of the heat pipe 60 is fixedly connected with the second vapor chamber 80, i.e. when the heat source is fixedly placed in the heat dissipation area 402 and other heat sources are fixedly placed in the other element placement area 404, the heat of the heat source can be conducted to the first vapor chamber 70 and conducted to the heat pipe 60, the heat of other heat sources can be conducted to the second vapor chamber 80 and conducted to the heat pipe 60, and then the heat of the heat source and the heat of other heat sources can be rapidly dissipated due to the combined action of the first vapor chamber 70, the second vapor chamber 80 and the heat pipe 60, so that the service life of the mobile terminal is prolonged, and the use experience of consumers is improved.

Referring to fig. 9, fig. 9 shows one way of connecting the heat pipe 60 to overlap the first vapor chamber 70 and the second vapor chamber 80. The first vapor chamber 70 includes a first top surface 701 and a first bottom surface 702 disposed opposite to the first top surface 701, and the second vapor chamber 80 includes a second top surface 801 and a second bottom surface 802 disposed opposite to the second top surface 801. The manner of connecting the heat pipe 60 to the first vapor chamber 70 and the second vapor chamber 80 includes, but is not limited to, four types of heat pipes 60 connecting the first top surface 701 and the second top surface 801, bending the heat pipe 60 to connect the first top surface 701 and the second bottom surface 802, bending the heat pipe 60 to connect the first bottom surface 702 and the second top surface 801 (fig. 9), and connecting the heat pipe 60 to the first bottom surface 702 and the second bottom surface 802. The above four ways of connecting the heat pipe 60 with the first vapor chamber 70 and the second vapor chamber 80 can achieve heat conduction from the heat source 101 and the other heat sources 102 to the first vapor chamber 70, the second vapor chamber 80, the heat pipe 60, and the entire middle frame 40. Which mode is specifically selected is determined according to actual use requirements. The working media in the heat pipe 60, the first vapor chamber 70 and the second vapor chamber 80 may be the same or different, for example, a first working medium is disposed in the heat pipe 60, a second working medium is disposed in the first vapor chamber 70, a third working medium is disposed in the second vapor chamber 80, at least one of the first working medium, the second working medium and the third working medium is different, and the first working medium, the second working medium and the third working medium may be one, two or three of methanol, R134A, acetone or water.

Referring to fig. 10, fig. 10 shows one way in which the heat pipe 60 communicates with the first vapor chamber 70 and with the second vapor chamber 80. The inner space of the heat pipe 60 and the inner space of the first vapor chamber 70 and the inner space of the second vapor chamber 80 together form a heat conducting cavity. Specifically, the heat pipe 60 may be in communication with one of the first vapor chamber 70 and the second vapor chamber 80, or the heat pipe 60 may be in communication with both the first vapor chamber 70 and the second vapor chamber 80. The communication manner is the same as that of the heat pipe 60 and the first vapor chamber 70, and the present application is not described herein. The heat pipe 60, the first vapor chamber 70 and the second vapor chamber 80 after being communicated form a larger and complete heat conducting cavity inside, the working medium in the heat conducting cavity is longer in path through which one heat conduction cycle is completed, the time is longer, the heat of the heat source can be transferred to a larger area of the middle frame 40, the heat is conducted out in a more dispersed mode, and the heat dissipation efficiency is high.

The fixing manner of the second vapor chamber 80 to the middle frame 401 at the other element placement region 404 may be the same as the fixing manner of the first vapor chamber to the middle frame 401 at the heat dissipation region 402. The middle frame 401 may be provided with a first groove, a second groove and a third groove, the first groove is provided with the heat dissipation area 402, the second groove is provided with the other element placing area 404, the first vapor chamber 70 is embedded in the first groove, the second vapor chamber 80 is embedded in the second groove, and the heat pipe 60 is provided in the third groove. This way of embedding the vapor chamber and the heat pipe into the groove makes the thickness of the middle frame 401 not increased by the first vapor chamber 70, the second vapor chamber 80 and the heat pipe 60, and the mobile terminal can be thinner. It will be appreciated that the first, second and third slots may be provided in one embodiment at the same time, or in other embodiments, one or two of these three slots may be selected, depending on the particular structural configuration within the mobile terminal, e.g., where there is just a gap between the electronics, the heat pipe may be placed, thus eliminating the need for the third slot.

Of course, it is understood that the middle frame 401 is provided with a first groove and a third groove, the third groove is formed at the bottom of the first groove, the first vapor chamber 70 is embedded in the first groove, the heat pipe 60 is partially embedded in the third groove, and part of the heat pipe 60 in the groove is stacked with the first vapor chamber 70. In this embodiment, a part of the heat pipe 60 is located between the first vapor chamber 70 and the heat source 101, the openings of the first groove and the third groove face to the side of the middle frame 401 facing away from the heat source 101, and the middle frame 401 is spaced between the heat source 101 and the heat pipe 60 and the first vapor chamber 70, and the middle frame 401 is used for supporting the heat source 101. In this way, the heat of the heat source 101 is first transferred to the middle frame 401 opposite to the heat source 101, and then transferred to the first vapor chamber 70, the heat pipe 60 and the rest of the middle frame 401, so that the heat of the mobile terminal can be rapidly dissipated.

In other embodiments, instead of one or more "slots", the first slot, the second slot, and the third slot may be in the form of "holes", and some of these three slots may be configured as slots and some as holes.

Referring to fig. 11, a wire groove 608 is formed on an outer surface of the heat pipe 60, and the wire groove 608 is used for fixing wires in the mobile terminal, and the wires are used for electrically connecting the electronic devices in the heat dissipation area 402 and the electronic devices in other component placement areas. Specifically, the heat source may be a plurality of high-power devices such as a CPU or a GPU, the other heat sources may be heat sources such as screen sounding and screen driving, and the heat sources and the other heat sources need to be connected by wires, and the wire groove 608 on the surface of the heat pipe 60 may be used as a carrier of the wires, so that the wires may be fixed in the wire groove 608 of the heat pipe 60, and further the positions of the wires are fixed, so that the wires are prevented from being damaged due to shaking, and the service life of the mobile terminal is prolonged. The specific manner of disposing the wire groove 608 on the surface of the heat pipe 60 may be a manner of forming a groove on the outer surface of the heat pipe 60 by machining, or welding a structure for fixing a wire on the outer surface of the heat pipe 60, for example, a hook similar to a wire harness, and the wire groove 608 may be formed in the hook.

In a specific embodiment, the heat pipe 60 and the soaking plates (the first soaking plate 70 and the second soaking plate 80) are provided with heat conducting films on the outer surfaces. The material of the heat conductive film may be graphene. The heat conducting film is arranged to enable the heat conduction speed of the heat pipe and the heat soaking plate to be higher than that of the heat conduction speed of the heat pipe and the heat soaking plate to the outside.

A specific embodiment of the midframe assembly 40 including two heat pipes 60 and a vapor chamber (first vapor chamber 70) will be described below.

Referring to fig. 12, fig. 12 is a schematic top view of a middle frame assembly 40. In this embodiment, the heat pipes 60 at least include a first heat pipe 603 and a second heat pipe 604 disposed at intervals, and the first heat pipe 603 and the second heat pipe 604 are disposed around the battery placement area 403. The heat pipes 60 have good heat dissipation effect, so that the heat of the heat source can be dissipated more quickly, the service life of the heat source is prolonged, the service life of the mobile terminal is prolonged, and the use experience of consumers is improved. When the first heat pipe 603 and the second heat pipe 604 are disposed around the battery placement area 403, the gaps between the battery placement area 403 and the third side wall 401c and the fourth side wall 401d are utilized, and the two heat pipes 60 do not overlap with the battery placement area 403, so that the thickness of the middle frame 40 is not affected, and when the battery is placed in the mobile terminal, the heat pipes 60 do not overlap with the battery, so that the thickness of the mobile terminal is not affected.

In one embodiment, the first section 60a of the first heat pipe 603 is received between the top 401a and the battery placement area 403 and is adjacent to the third edge 403c, the second section 60b of the first heat pipe 603 extends to a first gap 501 between the third edge 403c and the third sidewall 401c, the second heat pipe 604 is also partially received between the top 401a and the battery placement area 403 and is adjacent to the fourth edge 403d, and the second heat pipe 604 extends partially to a second gap 502 between the fourth edge 403d and the fourth sidewall 401.

Referring to fig. 13, fig. 13 shows another top view of the middle frame 40 assembly. The heat pipes 60 shown in this figure are still two. The second heat pipe 604 surrounds the cell placement area 403, and the first heat pipe 603 overlaps the cell placement area 403. When the space between the side walls 401c of the frame 401 in the battery placement area 403 is insufficient to accommodate the two heat pipes 60, one of the heat pipes 60 can be lapped on the battery placement area 403, so that the heat dissipation effect of the two heat pipes 60 can be utilized, the area of the middle frame 401 which can be used for heat dissipation is larger, the heat dissipation effect is good, the heat of a heat source can be dissipated more quickly, the service life of the heat source is prolonged, the service life of the mobile terminal is prolonged, the use experience of a consumer is improved, and the space between the battery placement area 403 and the third side wall 401c and the fourth side wall 401d of the middle frame 401 and other spaces can be effectively utilized. Moreover, this manner in which the first heat pipe 603 overlaps the battery placement area 403 facilitates the installation and operation of the first heat pipe 603, and the first heat pipe 603 can be used to dissipate heat from the battery.

Specifically, when the first heat pipe 603 is overlapped with the battery placement area 403, the first heat pipe 603 is connected with the surface of the battery, so that heat on the battery can be transferred to the first heat pipe 603, and then transferred to the whole middle frame 401, and the heat dissipation of the middle frame 401 to the battery is realized, and the heat dissipation area is large and the heat dissipation effect is good.

In another embodiment, the middle frame assembly 40 may include two heat pipes 60 and two vapor chamber, such as a first heat pipe 603, a second heat pipe 604, a first vapor chamber 70, and a second vapor chamber 80. The first vapor chamber 70 is fixed on the heat dissipation area 402, the second vapor chamber 80 is fixed on the other element placement area 404, the first heat pipe 603 and the second heat pipe 604 both surround the battery placement area 403, the first section 60a of the first heat pipe 603 is connected with the first vapor chamber 70, the second section 60b of the first heat pipe 603 is connected with the second vapor chamber 80, the first section 60a of the second heat pipe 604 is connected with the first vapor chamber 70, and the second section 60b of the second heat pipe 604 is connected with the second vapor chamber 80.

Of course, in other implementations, there may be more heat pipes 60 and vapor chamber, such as a third vapor chamber, etc., and the third heat pipe 60, etc., and more vapor chamber is connected to the heat pipe 60 to achieve larger area heat dissipation.

At least one heat pipe 60 of the one or more heat pipes 60 provided by the present application extends between the electronic devices and/or at least one heat pipe 60 of the one or more heat pipes extends between the electronic devices and the boundary of the middle frame 401. The electronic devices may be backlight modules, batteries, CPUs, cameras, keys, speakers, etc. in the terminal, as shown in fig. 13, where the first heat pipe 603 extends between the electronic devices, which may be understood as extending between the batteries and the backlight modules stacked with the batteries. The second heat pipe 604 extends between the electronics and the midframe boundary, which can be understood to extend between the battery and the midframe boundary. The middle frame assembly 40 and the mobile terminal realize the comprehensive heat conduction effect by using the heat pipe 60 and the soaking plate, enhance the heat dissipation effect and improve the use experience of consumers.

The foregoing disclosure is illustrative of the preferred embodiments of the present application, and is not to be construed as limiting the scope of the application, as it is understood by those skilled in the art that the present application may be practiced with all or part of these specific details and with all modifications that are within the scope of the application as defined by the appended claims.

Claims

1. The middle frame assembly is used for bearing an electronic device in the mobile terminal and comprises a heat source, and is characterized by comprising a middle frame, one or more heat pipes and a first soaking plate, wherein the first soaking plate has two-dimensional expansion heat conduction performance, and the heat pipes have one-dimensional linear heat conduction performance;

The middle frame comprises a heat dissipation area corresponding to the heat source, and the first vapor chamber is accommodated in the heat dissipation area and is used for dissipating heat of the heat source;

the one or more heat pipes are connected to the first soaking plate and used for radiating heat of the first soaking plate;

The inner space of the heat pipe and the inner space of the first vapor chamber are independent of each other, and the outer surface of the heat pipe and the outer surface of the first vapor chamber are mutually overlapped, or the inner space of the heat pipe and the inner space of the first vapor chamber are communicated, and one end of the heat pipe is inserted into the first vapor chamber;

and a wire slot is arranged on the outer surface of at least one heat pipe of the one or more heat pipes, the wire slot is used for fixing an inner wire of the mobile terminal, and the wire is used for electrically connecting an electronic device in the mobile terminal.

2. The mullion assembly of claim 1, wherein at least one of the one or more heat pipes is further coupled to a portion of the mullion that has a temperature that is lower than the temperature of the first vapor chamber.

3. The mullion assembly of claim 2, wherein at least one of the one or more heat pipes is connected to the mullion by a thermally conductive medium.

4. The mullion assembly of claim 1, wherein the one or more heat pipes are connected to the first vapor chamber by a thermally conductive medium.

5. The bezel assembly as recited in claim 1, wherein the electronic device further comprises a battery, the bezel further comprising a battery placement area corresponding to the battery, the battery placement area comprising oppositely disposed first and second edges, the heat dissipation area being adjacent the first edge, at least one of the one or more heat pipes extending from the heat dissipation area in a direction toward the second edge.

6. The mullion assembly of claim 5, wherein at least one of the one or more heat pipes is not in contact with the battery.

7. The center assembly of claim 6, wherein the center includes a top, a bottom disposed opposite the top, and two sidewalls at the top and the bottom, the battery placement area and the sidewalls forming a gap therebetween, at least one of the one or more heat pipes extending into the gap.

8. The mullion assembly of claim 6, wherein at least one of the one or more heat pipes is in contact with a surface of the battery.

9. The mullion assembly of claim 5, wherein the one or more heat pipes include a first heat pipe and a second heat pipe disposed in spaced relation, the first heat pipe surrounding the cell placement area, the second heat pipe partially overlapping the cell placement area.

10. The center assembly of claim 5, wherein the center includes a top, a bottom disposed opposite the top, and two sidewalls disposed at the top and the bottom, the heat dissipation area is disposed between the first edge of the cell placement area and the top, a further component placement area is disposed between the second edge of the cell placement area and the bottom, the center further includes a second soaking plate fixed at the further component placement area, and at least one of the one or more heat pipes is further connected to the second soaking plate.

11. The mullion assembly of claim 10, wherein the mullion is provided with a first cutout, a second cutout, and a third cutout, the first soaking plate is embedded within the first cutout, the second soaking plate is embedded within the second cutout, at least one of the one or more heat pipes is embedded within the third cutout, the first cutout is a slot or hole, the second cutout is a slot or hole, and the third cutout is a slot or hole.

12. The mullion assembly of claim 11, wherein one end of at least one of the one or more heat pipes is lapped over the first vapor chamber and the other end of at least one of the one or more heat pipes is lapped over the second vapor chamber.

13. The mullion assembly of any one of claims 1 to 10, wherein the mullion is provided with a hole, the mullion includes a first overlap edge extending toward an interior of the hole, the first soaking plate includes a third overlap edge, and the first overlap edge overlaps the third overlap edge to secure the first soaking plate to the mullion.

14. The mullion assembly of claim 13, wherein the first overlap edge and the third overlap edge are secured by welding.

15. The center assembly according to any one of claims 1-10, wherein the center is provided with a groove, the first soaking plate is accommodated in the groove, and the first soaking plate and the groove bottom are fixed through heat conducting glue.

16. The mullion assembly of claim 15, wherein the mullion includes a first overlap edge extending into the trough, the first vapor chamber includes a third overlap edge, and the first overlap edge is overlap-secured with the third overlap edge.

17. The center assembly of any of claims 1-10, wherein the center is provided with a first cutout and a third cutout, the third cutout is formed at a bottom of the first cutout, the first soaking plate is embedded in the first cutout, at least one of the one or more heat pipes is partially embedded in the third cutout, at least one of the one or more heat pipes is laminated with the first soaking plate in a portion of the third cutout, the first cutout is a slot or hole, and the third cutout is a slot or hole.

18. The mullion assembly of claim 1, wherein at least one of the one or more heat pipes extends between the electronic devices and/or at least one of the one or more heat pipes extends between the electronic devices and a boundary of the mullion.

19. A mobile terminal comprising a main board and a center assembly according to any one of claims 1 to 18, wherein the heat source is disposed on the main board, and wherein the main board is mounted to the center.