CN112992716A

CN112992716A - Liquid baffle structure and etching equipment and etching method prepared by same

Info

Publication number: CN112992716A
Application number: CN201911283149.4A
Authority: CN
Inventors: 邱显炜; 郑宇轩; 李宗荣
Original assignee: Manz Taiwan Ltd
Current assignee: Manz Taiwan Ltd
Priority date: 2019-12-13
Filing date: 2019-12-13
Publication date: 2021-06-18

Abstract

The invention relates to a liquid baffle structure, etching equipment prepared by the liquid baffle structure and an etching method, in particular to a liquid baffle structure which is suitable for a wet etching machine and has the liquid baffle and drainage functions and the air permeability of the liquid baffle structure is increased so as to reduce the product loss, the etching equipment prepared by the liquid baffle structure and the etching method; the invention mainly uses the design of the liquid baffle plate structure with a plurality of vent holes and the air knife device, effectively leads the air blown out by the air knife device to be vented through the vent holes, prevents abnormal phenomena of uneven substrate development and the like caused by the falling of water drops from the vent holes by utilizing the surface tension phenomenon of the water drops, really achieves the liquid baffle effect of keeping the original liquid baffle plate, and increases the air permeability to break the vacuum to reduce the main advantages of substrate scratching or fragment risks and the like caused by a vacuum suction plate.

Description

Liquid baffle structure and etching equipment and etching method prepared by same

Technical Field

The present invention relates to a liquid-blocking plate structure, an etching apparatus and an etching method, and more particularly, to a liquid-blocking plate structure suitable for a wet etching machine, which has a liquid-blocking and draining function and an increased air permeability to reduce product loss, an etching apparatus and an etching method.

Background

Please refer to fig. 1, which is a schematic diagram illustrating an overall arrangement of a conventional liquid baffle structure, wherein a liquid baffle structure a in a solid PVC plate form is disposed in a wet etching machine (not shown) for mainly preventing a non-uniform etching phenomenon caused by an etching solution (not shown) spraying on a substrate (not shown) disposed below the liquid baffle structure a, and in a wet etching process step, the substrate is disposed between two air knives B, and when the substrate is disposed in a conveying device (not shown) and is etched by the etching solution received from the left side of the liquid baffle structure a, the substrate moves to between the air knives B, and the air knives B spray a gas C onto a surface of the substrate to blow off the etching solution remaining on the surface of the substrate; however, in the state where the air knives B blow air, a minute vacuum space is easily formed below the liquid baffle structure a to form a vortex and cause a problem of a vacuum suction plate; therefore, how to effectively achieve the liquid-blocking effect of the original liquid-blocking plate and increase the air permeability to break the vacuum to reduce the substrate scratching or chipping risk caused by the vacuum chuck by means of the innovative hardware design is still a problem that the developers of the related industries such as wet etchers and related researchers need to continuously strive to overcome and solve.

Disclosure of Invention

The invention mainly aims to provide a liquid baffle structure, etching equipment prepared by the liquid baffle structure and an etching method, in particular to the liquid baffle structure which is suitable for a wet etching machine and has the liquid baffle and drainage functions and the air permeability which is increased so as to reduce the product loss, the etching equipment prepared by the liquid baffle structure and the etching method.

In order to achieve the above-mentioned objectives, the present invention provides a liquid-blocking plate structure suitable for a wet etching machine, the liquid-blocking plate structure includes a first blocking plate, a second blocking plate jointed with the first blocking plate, and a third blocking plate jointed with the second blocking plate, and the liquid-blocking plate structure is mainly characterized in that: the second baffle plate is provided with a plurality of ventilation holes which penetrate through the second baffle plate and are arranged in a staggered mode.

The liquid baffle structure as described above, wherein the first baffle and the second baffle are orthogonally disposed, and the second baffle and the third baffle are orthogonally disposed.

In the above liquid baffle structure, the first baffle, the second baffle and the third baffle are surrounded to form a groove.

The liquid baffle structure as described above, wherein the second baffle has a length of between 10 centimeters (cm) and 15 centimeters (cm).

A baffle structure as described above wherein the vent holes have a diameter of less than 3 millimeters (mm).

The liquid baffle structure as described above, wherein the drainage holes are arranged in one of a bird-like arrangement or a matrix arrangement.

The liquid baffle structure as described above, wherein the vent hole is one of a straight hole or an inclined cone hole or a mixture of both.

In the above liquid baffle structure, the releasing hole has a first wall surface and a second wall surface, and the second baffle has a lower surface, and when the releasing hole is in the form of an oblique-cone hole, a first included angle between the first wall surface and the lower surface is different from a second included angle between the second wall surface and the lower surface.

The liquid baffle structure as described above, wherein when the vent hole is in the form of an oblique taper hole, the upper aperture and the lower aperture of the vent hole are not equal.

The liquid baffle structure as described above, wherein when the vent hole is in the form of an oblique taper hole, the upper aperture of the vent hole is smaller than the lower aperture.

The liquid baffle structure as described above, wherein when the vent hole is in the form of an oblique tapered hole, the vent hole is tapered from the lower surface toward the upper surface of the second baffle.

In addition, in order to achieve the above-mentioned objective, the present invention further provides an etching apparatus disposed in a tank of a wet etching machine, the etching apparatus at least includes a liquid baffle structure, a substrate, a conveying device, and an air knife device; the base plate is arranged below the liquid baffle plate structure; the conveying device is arranged below the substrate and comprises at least one roller, wherein the roller is in contact with the substrate to move the substrate; the air knife device is arranged at one end part of the liquid baffle plate structure and comprises a first air knife arranged above the substrate and a second air knife arranged below the substrate, wherein the first air knife and the second air knife respectively blow a gas to the substrate.

The etching apparatus as described above, wherein the etching apparatus may further be provided with a spraying device, the spraying device being disposed at the other end of the liquid baffle structure opposite to one end of the air knife device.

The etching apparatus as described above, wherein the spraying device sprays a chemical solution onto the substrate.

The etching apparatus as described above, wherein the vertical distance between the liquid baffle structure and the substrate is between 8mm and 15 mm.

The etching apparatus as described above, wherein the roller rotates clockwise and drives the substrate to move from the lower end of the spraying device toward the lower end of the first air knife of the air knife device.

In the etching apparatus, a third included angle is formed between the direction of the gas away from the first air knife and the direction of the gas away from the second air knife and the normal direction of the substrate.

The etching apparatus as above, wherein the third included angle is between 20 degrees and 35 degrees.

Moreover, in order to achieve the above-mentioned objectives, the present invention further provides an etching method, which is performed in a tank of a wet etching machine; firstly, arranging a liquid baffle structure, wherein the liquid baffle structure is provided with a plurality of ventilation holes; then, a conveying device arranged below the liquid baffle plate structure is used for conveying a substrate, and liquid medicine is sprayed by a spraying device; then, using an air knife device arranged below the liquid baffle plate structure to blow a gas to the substrate so as to dry the substrate; finally, the gas is released through the release hole.

In the etching method, the conveying device drives the substrate to move from the lower end of the spraying device to the lower end of the first air knife of the air knife device by at least one roller rotating clockwise.

In the etching method, the air knife device blows the gas towards the upper surface and the lower surface of the substrate by a first air knife arranged at the upper end of the conveying device and a second air knife arranged at the lower end of the conveying device respectively.

Therefore, the liquid baffle structure, the etching equipment prepared by the liquid baffle structure and the etching method of the invention mainly use the liquid baffle structure with a plurality of vent holes and the hardware design of the air knife device, effectively lead the gas blown out by the air knife device to be vented through the vent holes, and utilize the surface tension phenomenon of water drops to prevent the abnormal phenomena of uneven etching of the substrate and the like caused by the falling of the water drops from the vent holes, thereby really achieving the main advantages of keeping the liquid baffle effect of the original liquid baffle, increasing the air permeability to break the vacuum to reduce the substrate scratching or fragment risk caused by the vacuum suction plate and the like.

Drawings

FIG. 1: the whole of traditional fender liquid structure sets up the sketch map.

FIG. 2: the present invention provides a liquid baffle structure, which is a schematic overall structure of a preferred embodiment thereof.

FIG. 3: the arrangement of the vent holes in a preferred embodiment of the liquid baffle structure of the invention is schematically illustrated.

FIG. 4: the present invention provides a structure of liquid baffle plate with two preferred embodiments of the arrangement of vent holes.

FIG. 5: the structure of the liquid baffle plate of the invention has a schematic arrangement diagram of the vent holes of the three preferred embodiments.

FIG. 6: the overall structure of a preferred embodiment of the etching apparatus of the present invention is schematically illustrated.

FIG. 7: the operation of the liquid baffle structure of the etching equipment of the invention in a preferred embodiment is partially enlarged.

FIG. 8: the liquid baffle structure of the etching equipment of the invention is combined with the schematic diagram of the air knife device in a preferred embodiment.

FIG. 9: the surface tension of the vent hole of a preferred embodiment of the etching apparatus of the present invention is enlarged partially.

FIG. 10: the liquid baffle structure of the etching equipment of the invention in two preferred embodiments is combined with a schematic diagram of an air knife device.

FIG. 11: the liquid baffle structure of the etching equipment of the invention in three preferred embodiments is combined with a schematic diagram of an air knife device.

FIG. 12: the surface tension of the venting holes of the two preferred embodiments of the liquid baffle structure of the invention is partially enlarged.

FIG. 13: the invention provides a flow chart of steps of an etching method.

Description of the figure numbers:

traditional liquid baffle structure

A liquid baffle structure

B air knife

C gas

The invention

1 etching apparatus

10 keep off liquid plate structure

11 first baffle

12 second baffle

121 vent hole

1211 first wall

1212 second wall surface

122 lower surface

123 upper surface

13 third baffle

20 base plate

30 conveying device

31 roller

40 air knife device

41 first air knife

42 second air knife

43 gas

50 spraying device

51 medicinal liquid

S1 step one

S2 step two

S3 step three

S4 step four

Length of H

Angle theta

Theta 1 first included angle

Theta 2 second angle

Theta 3 third angle

Theta 4 contact Angle

A0 pore diameter

A1 upper aperture

A2 lower aperture

W, W1, W2 distance.

Detailed Description

First, please refer to fig. 2 and fig. 3, which are a schematic diagram of an overall structure and an arrangement of venting holes of a liquid baffle structure according to a preferred embodiment of the present invention, wherein the liquid baffle structure 10 of the present invention is suitable for a wet etching machine (not shown), the liquid baffle structure 10 includes a first baffle 11, a second baffle 12 coupled to the first baffle 11, and a third baffle 13 coupled to the second baffle 12, and is characterized in that: the second baffle 12 has a plurality of ventilation holes 121 passing through the second baffle 12 and disposed in a staggered manner.

The first baffle 11 and the second baffle 12 are orthogonally disposed, and the second baffle 12 and the third baffle 13 are orthogonally disposed, so that the first baffle 11, the second baffle 12 and the third baffle 13 enclose a groove, in an embodiment, the first baffle 11, the second baffle 12 and the third baffle 13 can be integrally formed, wherein the length H of the second baffle 12 is between 10cm and 15cm, the vent holes 121 opened on the second baffle 12 can be arranged in one of a thousand bird arrangement or a matrix arrangement, and the vent holes 121 can be one of a straight hole, an oblique cone hole, or a mixture of both; in a preferred embodiment of the present invention, the opening holes 121 opened on the second baffle 12 are straight holes arranged in a bird's thousand row, and the opening holes 121 in the same row have the same distance (for example, W shown in fig. 3), wherein an aperture a0 of the opening holes 121 is preferably smaller than 3mm, so that a capillary phenomenon is generated in the holes of the opening holes 121, if there is a water drop on the upper surface 123 of the second baffle 12, the water drop will not fall to the lower surface through the opening holes 121, but still provide a duct for air to escape, so as to balance the pressure at the upper and lower ends of the second baffle 12 through the opening holes 121.

In addition, referring to fig. 4 and fig. 5 together, there are shown two preferred embodiments of the arrangement of the drainage holes of the liquid baffle structure of the present invention and three preferred embodiments of the arrangement of the drainage holes of the liquid baffle structure of the present invention, in the two preferred embodiments of the present invention, the drainage holes 121 opened on the second baffle 12 are also in the form of straight holes arranged in a thousand bird, and the drainage holes 121 located in the same row have the same distance therebetween, for example: w1 shown in fig. 4, wherein W1 is larger than W in fig. 3 or W2 in fig. 5, W2 is larger than W, and an aperture a0 of the vent hole 121 is also smaller than 3mm, so that a capillary phenomenon is generated in the hole of the vent hole 121, if water drops appear on the upper surface 123 of the second baffle plate 12, the water drops will not fall to the lower surface through the vent hole 121, but an air vent pipe can be provided to balance the pressure of the upper and lower ends of the second baffle plate 12 through the vent hole 121.

In addition, please refer to fig. 6 and fig. 7, which are schematic diagrams of an overall structure and a partial enlarged view of a liquid-blocking plate structure of an etching apparatus 1 according to a preferred embodiment of the present invention, wherein the etching apparatus 1 of the present invention is disposed in a tank (not shown) of a wet etching machine, the etching apparatus 1 includes the liquid-blocking plate structure 10, a conveying device 30, a substrate 20, and an air knife device 40, as described above, wherein the present invention mainly uses the liquid-blocking plate structure 10 having a plurality of vent holes 121 and the hardware design of the air knife device 40, so as to effectively allow the gas 43 blown out by the air knife device 40 to be vented through the plurality of vent holes 121, and to prevent abnormal phenomena such as uneven etching of the substrate 20 caused by the falling of water drops through the plurality of vent holes 121 by using the surface tension phenomenon of water drops, thereby achieving the liquid-blocking effect of the original liquid-blocking plate, and increasing the air permeability to break the vacuum to reduce the risk of scratching or breaking the substrate 20 due to the vacuum suction.

The etching apparatus 1 may further include a spraying device 50, the spraying device 50 is disposed at an end of the liquid-blocking plate structure 10, and the substrate 20 is disposed below the liquid-blocking plate structure 10 by about 8mm to 15mm, wherein the spraying device 50 is configured to spray a liquid 51 onto the substrate 20 to perform a wet etching process on the substrate 20; as described above, the liquid blocking plate structure 10 is provided to prevent the chemical liquid 51 of the spraying device 50 from continuing to perform the etching process on the substrate 20 that has been subjected to the etching process, so that a small amount of the chemical liquid 51 is still sprayed on the liquid blocking plate structure 10 to leave the water drops of the chemical liquid 51, and the water drops of the chemical liquid 51 cannot fall onto the substrate 20, so as to prevent the substrate 20 from being etched unevenly.

The conveying device 30 is disposed below the substrate 20, the conveying device 30 includes at least one roller 31, wherein the roller 31 contacts the substrate 20 to move the substrate 20; in a preferred embodiment of the present invention, the transporting device 30 is used to carry and transport at least one substrate 20 to operate in the wet etching machine and receive the process operation of the wet etching spraying device 50, so that the transporting device 30 has a driving mechanism (not shown) to drive the roller 31 to rotate, for example: rotate clockwise to drive the substrate 20 to move from the lower end of the spraying device 50 to the lower end of the first air knife 41 of the air knife device 40.

The air knife device 40 is disposed at an end of the liquid barrier structure 10, the air knife device 40 includes a first air knife 41 disposed above the substrate 20 and a second air knife 42 disposed below the substrate 20, wherein the first air knife 41 and the second air knife 42 respectively blow a gas 43 toward the substrate 20 to bring a liquid medicine 51 on the substrate 20 to a direction opposite to a traveling direction of the substrate 20, so as to reduce the liquid medicine 51 on the substrate 20, wherein directions of the gas 43 away from the first air knife 41 and the second air knife 42 respectively form a third included angle θ 3 with a normal direction of the substrate 20, and the third included angle θ 3 is between 20 degrees and 35 degrees.

In addition, please refer to fig. 8 and fig. 9 together, which are a schematic view of a liquid-blocking plate structure combined with an air knife device and a partial enlarged view of a surface tension of a vent hole according to a preferred embodiment of the etching apparatus of the present invention, wherein the vent hole 121 is a through hole, when the first air knife 41 and the second air knife 42 of the air knife device 40 blow the gas 43 in order to reduce the residual liquid medicine 51 on the substrate (not shown in the figure), the gas 43 hits the rear portion of the liquid-blocking plate structure 10 and flows toward the plurality of vent holes 121 and is vented out toward the upper surface 123 of the second baffle 12 (as shown in fig. 8), which not only keeps the original liquid-blocking plate to prevent the uneven etching caused by the splashing of the liquid medicine 51, but also can achieve the vacuum breaking principle to avoid the vacuum suction problem caused by the vortex formed by the gas 43 near the substrate 20; in addition, as mentioned above, the problem of uneven etching caused by the chemical liquid 51 sprayed by the spraying device 50 dripping onto the substrate 20 must be avoided, and therefore, the aperture a0 of the plurality of venting holes 121 must be small enough, for example: the aperture a0 is smaller than 3mm, that is, the included angle θ between the water drop and the hole of the vent hole 121 is equal to the contact angle θ 4 between the water drop and the upper surface 123 of the second barrier 12, so as to prevent the water drop of the liquid medicine 51 on the upper surface 123 of the second barrier 12 from dropping onto the substrate 20 through the vent holes 121 (as shown in fig. 9).

Furthermore, please refer to fig. 10 to 12, which are schematic diagrams of the liquid-blocking plate structure combined with the air knife device according to two preferred embodiments of the etching apparatus of the present invention, schematic diagrams of the liquid-blocking plate structure combined with the air knife device according to three preferred embodiments of the etching apparatus of the present invention, and a partially enlarged view of the surface tension of the vent hole, wherein the vent holes 121 are a mixture of straight holes and inclined tapered holes (as shown in FIG. 10), or are all inclined tapered holes (as shown in FIG. 11), wherein the vent hole 121 has a first wall 1211 and a second wall 1212, and the second baffle 12 has a lower surface 122, when the ventilation hole 121 is a tapered hole, a first angle θ 1 between the first wall 1211 and the lower surface 122 is different from a second angle θ 2 between the second wall 1212 and the lower surface 122, i.e. the first wall 1211 and the second wall 1212 may not be parallel to each other, but it should avoid the capillary phenomenon caused by the large difference between the first included angle theta 1 and the second included angle theta 2; in addition, when the vent hole 121 is in the form of an oblique cone, the upper aperture a1 and the lower aperture a2 of the vent hole 121 are also not equal, and the upper aperture a1 is smaller than the lower aperture a2, or the vent hole 121 is tapered from the lower surface 122 of the second baffle 12 toward the upper surface 123, so as to maintain the capillary phenomenon and avoid the problem of uneven etching caused by the dropping of the chemical 51 onto the substrate 20.

When the first air knife 41 and the second air knife 42 of the air knife device 40 blow the gas 43 to reduce the residual liquid medicine 51 on the substrate (not shown in the drawings), the gas 43 hits the rear portion of the liquid baffle structure 10, flows toward the plurality of venting holes 121, and vents toward the upper surface 123 of the second baffle 12 (as shown in fig. 10 and 11), which not only keeps the original liquid baffle plate to prevent the uneven development caused by the splashing of the liquid medicine 51, but also can avoid the problem of vacuum suction caused by the vortex formed by the gas 43 near the substrate 20; in order to avoid the problem of uneven etching caused by the chemical 51 sprayed by the spraying device 50 dripping onto the substrate 20, the aperture a0 of the plurality of venting holes 121 must be small enough, for example: the aperture a0 is smaller than 3mm, that is, the included angle θ between the water drop in the hole of the releasing hole 121 is equal to the contact angle θ 4 between the water drop and the upper surface 123 of the second barrier 12, so as to prevent the water drop of the liquid medicine 51 on the upper surface of the second barrier 12 from dropping onto the substrate 20 through the releasing holes 121 (as shown in fig. 12).

Referring to fig. 13, a flowchart of steps of the etching method of the present invention is shown, wherein the etching method of the present invention mainly comprises the following steps.

Step one S1: arranging a liquid baffle structure 10, wherein the liquid baffle structure 10 is provided with a plurality of vent holes 121; the liquid baffle structure 10 includes a first baffle 11, a second baffle 12 connected to the first baffle 11, and a third baffle 13 connected to the second baffle 12, wherein the second baffle 12 has a plurality of staggered drainage holes 121 penetrating through the second baffle 12, the plurality of drainage holes 121 are in a straight hole pattern of a bird-of-thousand arrangement, and the same distance is provided between the drainage holes 121 in the same row, wherein the aperture a0 of the drainage holes 121 is preferably smaller than 3mm, so that a capillary phenomenon is generated in the holes of the drainage holes 121, if there is a water droplet on the upper surface 123 of the second baffle 12, the water droplet will not fall to the lower surface 122 through the drainage holes 121, but still provide a duct for air drainage, so as to balance the pressure of the upper and lower ends of the second baffle 12 through the drainage holes 121.

Step two S2: using a conveying device 30 disposed below the liquid baffle structure 10 to convey a substrate 20 for spraying a liquid 51 through a spraying device 50; in a preferred embodiment of the present invention, the spraying device 50 is disposed at an end of the liquid-blocking plate structure 10, and the substrate 20 is disposed below the liquid-blocking plate structure 10 by about 8mm to 15mm, wherein the spraying device 50 is used for spraying a liquid medicine 51 onto the substrate 20 to perform a wet etching process on the substrate 20, and the liquid-blocking plate structure 10 is disposed to prevent the liquid medicine 51 of the spraying device 50 from continuing to perform an etching process on the substrate 20 that has already been subjected to the etching step, so that a small amount of the liquid medicine 51 is still sprayed onto the liquid-blocking plate structure 10 to leave water droplets of the liquid medicine 51, and the water droplets of the liquid medicine 51 cannot fall onto the substrate 20 to prevent the substrate 20 from being etched unevenly; in addition, the conveying device 30 is used for carrying and transporting at least one substrate 20 to operate in the wet etching machine and receiving the process operation of the spraying device 50 for wet etching, so the conveying device 30 has a driving mechanism to drive the roller 31 to rotate so as to drive the substrate 20 to move from the lower end of the spraying device 50 toward the lower end of the first air knife 41 of the air knife device 40.

Step three S3: blowing a gas 43 to the substrate 20 by using an air knife device 40 disposed below the liquid baffle structure 10 to dry the substrate 20; in a preferred embodiment of the present invention, the air knife device 40 is disposed at an end of the liquid-blocking plate structure 10, the air knife device 40 includes a first air knife 41 disposed above the substrate 20 and a second air knife 42 disposed below the substrate 20, wherein the first air knife 41 and the second air knife 42 respectively blow a gas 43 toward the substrate 20 to bring the liquid medicine 51 on the substrate 20 to a direction opposite to a traveling direction of the substrate 20, so as to reduce the residue of the liquid medicine 51 on the substrate 20, wherein directions of the gas 43 away from the first air knife 41 and the second air knife 42 respectively form a third included angle θ 3 with a normal direction of the substrate 20, and the third included angle θ 3 is between 20 degrees and 35 degrees.

Step four S4: the gas 43 is vented through the plurality of vent holes 121; in a preferred embodiment of the present invention, when the first air knife 41 and the second air knife 42 of the air knife device 40 blow the gas 43 to reduce the residual liquid medicine 51 on the substrate 20, the gas 43 hits the rear portion of the liquid baffle structure 10 and flows toward the plurality of venting holes 121 and vents toward the upper surface 123 of the second baffle 12, so as to not only preserve the original liquid baffle and prevent the uneven etching caused by the splashing of the liquid medicine 51, but also achieve the purpose of breaking the vacuum and prevent the gas 43 from forming a vortex near the substrate 20 to cause the vacuum suction problem; in addition, in order to avoid the problem of uneven etching caused by the chemical liquid 51 sprayed by the spraying device 50 dropping on the substrate 20, the aperture a0 of the plurality of venting holes 121 must be small enough, for example: the aperture a0 is smaller than 3mm, that is, the included angle θ between the water drop and the hole of the vent hole 121 is equal to the contact angle θ 4 between the water drop and the upper surface 123 of the second barrier 12, so as to prevent the water drop of the liquid medicine 51 on the upper surface 123 of the second barrier 12 from dropping onto the substrate 20 through the vent holes 121 due to the capillary effect.

As can be seen from the above description, the liquid baffle structure, the etching apparatus and the etching method manufactured thereby according to the present invention have the following advantages compared with the prior art.

The liquid baffle structure, the etching equipment prepared by the liquid baffle structure and the etching method of the invention mainly use the liquid baffle structure with a plurality of vent holes and the hardware design of the air knife device, effectively lead the gas blown out by the air knife device to be vented through the vent holes, and utilize the surface tension phenomenon of water drops to prevent the abnormal phenomena of uneven etching of the substrate caused by the falling of the water drops from the vent holes, thus really achieving the main advantages of keeping the liquid baffle effect of the original liquid baffle plate, increasing the air permeability to break the vacuum to reduce the substrate scratching or breaking risk caused by the vacuum suction plate, and the like.

Claims

1. A liquid baffle structure suitable for a wet etching machine, the liquid baffle structure (10) comprising a first baffle (11), a second baffle engaged with the first baffle (11) (12), and a third baffle plate (13) engaged with the second baffle plate (12), characterized in that the second baffle plate (12) has a plurality of through the second baffle plate (12) and Displaced vent holes (121).

2 . The liquid baffle structure according to claim 1 , wherein the first baffle ( 11 ) and the second baffle ( 12 ) are arranged orthogonally, and the second baffle ( 12 ) and the The third baffles (13) are arranged orthogonally.

3. The liquid baffle structure according to claim 1, wherein the first baffle (11), the second baffle (12) and the third baffle (13) are surrounded by a groove 's appearance.

4. The liquid baffle structure according to claim 1, wherein a length (H) of the second baffle plate (12) is between 10 cm and 15 cm.

5. The liquid baffle structure according to claim 1, wherein an aperture (A0) of the vent hole (121) is less than 3 mm.

6 . The liquid baffle structure according to claim 1 , wherein the vent hole ( 121 ) is one of a houndstooth arrangement or a matrix arrangement. 7 .

7 . The liquid baffle structure according to claim 5 , wherein the vent hole ( 121 ) is one of a straight through hole or an inclined tapered hole or a mixture of the two. 8 .

8 . The liquid baffle structure according to claim 7 , wherein the vent hole ( 121 ) has a first wall surface ( 1211 ) and a second wall surface ( 1212 ), and the second baffle plate ( 12 ). ) has a lower surface (122), when the vent hole (121) is in the form of an oblique tapered hole, a first included angle (θ1) between the first wall surface (1211) and the lower surface (122) is different from the first angle (θ1) A second included angle (θ2) between the two wall surfaces (1212) and the lower surface (122).

9 . The liquid baffle structure according to claim 7 , wherein when the vent hole ( 121 ) is in the form of an oblique tapered hole, an upper aperture (A1) and a lower aperture ( A2) are not equal.

10. The liquid baffle structure according to claim 7, characterized in that, when the vent hole (121) is in the form of an oblique tapered hole, an upper aperture (A1) of the vent hole (121) is smaller than a lower aperture ( A2).

11. The liquid baffle structure according to claim 8, wherein when the vent hole (121) is in the form of an oblique tapered hole, the vent hole (121) is formed by a lower portion of the second baffle plate (12). The surface (122) tapers towards an upper surface (123).

12. An etching device, arranged in a tank body of a wet etching machine, characterized in that the etching device (1) at least comprises:

1. The liquid baffle structure (10) according to any one of claims 1 to 11;

a base plate (20) disposed below the liquid baffle structure (10);

A conveying device (30) disposed below the substrate (20), the conveying device (30) comprising at least one roller (31), wherein the roller (31) contacts the substrate (20) to run the substrate ( 20); and

An air knife device (40), disposed at one end of the liquid baffle structure (10), the air knife device (40) includes a first air knife (41) disposed above the base plate (20), and a A second air knife (42) disposed under the base plate (20), wherein the first air knife (41) and the second air knife (42) respectively blow a gas (43) to the base plate (20).

13. The etching apparatus according to claim 12, characterized in that, the etching apparatus (1) is provided with a spraying device (50), and the spraying device (50) is arranged at the end of the air knife device (40) relative to the one end. The other end of the liquid baffle structure (10).

14. The etching apparatus according to claim 13, wherein the spraying device (50) sprays a chemical liquid (51) onto the substrate (20).

15. The etching apparatus according to claim 12, wherein the vertical distance between the liquid baffle structure (10) and the substrate (20) is between 8 mm and 15 mm.

16. The etching apparatus according to claim 13, wherein the roller (31) rotates clockwise, and drives the substrate (20) from the lower end of the spraying device (50) toward the air knife device (40) to move in the direction of the lower end of the first air knife (41).

17. The etching apparatus according to claim 12, wherein the direction of the gas (43) away from the first air knife (41) and the second air knife (42) is the same as the direction of the substrate (20), respectively. There is a third included angle (θ3) in the line direction.

18. The etching apparatus of claim 17, wherein the third included angle (θ3) is between 20 degrees and 35 degrees.

19. An etching method, operating in a tank of a wet etching machine, wherein the etching method comprises the following steps:

Step 1 (S1): a liquid baffle structure (10) is provided, wherein the liquid baffle structure (10) is provided with a plurality of vent holes (121);

Step 2 (S2): using a conveying device (30) disposed below the liquid baffle structure (10) to convey a substrate (20), to spray a medicinal liquid (51) through a spraying device (50);

Step 3 (S3): blowing out a gas (43) to the substrate (20) using an air knife device (40) disposed under the liquid baffle structure (10) to dry the substrate (20); and

Step 4 (S4): the gas (43) is vented through the plurality of vent holes (121).

20. The etching method according to claim 19, wherein the conveying device (30) drives the substrate (20) from the lower end of the spraying device (50) by at least one roller (31) rotating in a clockwise direction The air knife device (40) moves in the direction of the lower end portion of the first air knife (41) of the air knife device (40).

21. The etching method according to claim 19, characterized in that, the air knife device (40) uses a first air knife (41) disposed at the upper end of the conveying device (30) and a first air knife (41) disposed at the upper end of the conveying device (30). The second air knife (42) at the lower end of the conveying device (30) blows the gas (43) toward the upper surface (123) and the lower surface (122) of the substrate (20).